Substrate processing apparatus

Abstract

The invention relates to substrate processing equipment. The substrate processing equipment comprises a chamber, wherein the chamber is provided with a first space and a second space; the first transfer device is located in the first space and is configured to transfer the substrate between the first space and the second space; the cleaning device is located in the second space and is configured to be used for cleaning the substrate; the detection device is located in the second space and is configured to be used for detecting the particle number of the cleaned substrate; the airflow supply device is located above the first space and the second space and used for providing clean airflow from top to bottom. Wherein the first space comprises an upper space and a lower space which are communicated with each other, and the second space is located on one side of the first space and located above the lower space of the first space. According to the substrate processing equipment, the cleaned substrate can be transferred in the upper space of the first space with the high cleanliness, the situation that the cleaned substrate is polluted is greatly reduced, and the detection accuracy of the substrate is further improved.

Description

Technical Field

[0001] The present application relates to the technical field of substrate processing, and in particular to a substrate processing device. Background Art

[0002] During the processing of semiconductor substrates (eg wafers), the substrates are stored in a FOUP (Front Opening Unified Pod) for transfer between different processes.

[0003] The substrate cleaning process usually includes loading, cleaning, testing and unloading of substrates. The substrates are clamped by the transfer device and circulated in the substrate processing equipment to achieve loading, cleaning, testing and unloading of substrates. However, there are many particles in the environment of substrate transportation, which will not only contaminate the substrates during transportation, but also contaminate the structures in other processes in the processing equipment. Summary of the invention

[0004] In view of this, an embodiment of the present application provides a substrate processing device to solve at least one problem existing in the background technology.

[0005] In a first aspect, an embodiment of the present application provides a substrate processing device, the substrate processing device comprising:

[0006] The chamber has a first space and a second space;

[0007] a first transfer device, located in the first space and configured to transfer the substrate between the first space and the second space;

[0008] a cleaning device, located in the second space and configured to clean the substrate;

[0009] A detection device, located in the second space and configured to detect the substrate yield;

[0010] An airflow supply device is located above the first space and the second space and is used to provide a clean airflow from top to bottom;

[0011] The first space includes an upper space and a lower space which are interconnected, and the second space is located at one side of the first space and above the lower space of the first space.

[0012] In combination with the first aspect of the present application, in an optional implementation manner, the upper top surface and the lower bottom surface of the first space and the lower bottom surface of the second space are parallel to each other;

[0013] The distance from the lower bottom surface of the second space to the upper top surface of the first space is a first distance, the distance from the lower bottom surface of the first space to the upper top surface of the first space is a second distance, and the ratio of the first distance to the second distance is 0.4-0.6.

[0014] In combination with the first aspect of the present application, in an optional implementation, the first space is provided with a first preset pressure, the second space is provided with a second preset pressure, and the second preset pressure is greater than the first preset pressure.

[0015] In combination with the first aspect of the present application, in an optional implementation manner, the pressure difference between the first preset pressure and the second preset pressure ranges from 10 to 25 Pa.

[0016] In combination with the first aspect of the present application, in an optional implementation, the first transfer device places the substrate in the upper space of the first space during the transfer process between the first space and the second space.

[0017] In conjunction with the first aspect of the present application, in an optional implementation, the substrate processing equipment further includes a loading device disposed on one side of the first space;

[0018] The first transfer device includes a first clamping jaw assembly and a second clamping jaw assembly. The first clamping jaw assembly can transfer the substrate between the loading device and the cleaning device, and the second clamping jaw assembly can transfer the substrate between the cleaning device and the detection device.

[0019] In conjunction with the first aspect of the present application, in an optional implementation manner, the substrate processing device further includes:

[0020] The first unloading device is located above the lower space of the first space and is configured to unload the substrate with a qualified detection result.

[0021] In conjunction with the first aspect of the present application, in an optional implementation manner, the substrate processing device further includes:

[0022] The second unloading device is located at one side of the first space and is configured to unload the substrate that is determined to be unqualified.

[0023] In conjunction with the first aspect of the present application, in an optional implementation manner, the substrate processing device further includes:

[0024] The second transfer device is configured to transfer the substrate on the first transfer device to the detection device, and unload the substrate that has completed the detection.

[0025] In combination with the first aspect of the present application, in an optional embodiment, the airflow supply device includes a first airflow supply component and a second airflow supply component that independently control the airflow.

[0026] The substrate processing equipment provided in the embodiment of the present application configures the first transfer device in the first space, the cleaning device and the detection device are located in the second space, and the second space is located above the lower space of the first space, so that the particles in the first space can be deposited to the bottom of the lower space, ensuring the cleanliness of the upper space, so that the first transfer device is in a relatively clean environment when transferring the substrate; further, by arranging an airflow supply device above the first space and the second space, the particles in the first space are further pressed down into the lower space by the top-down clean airflow provided by the airflow supply device, which can not only ensure that the second space is not contaminated by the particles, but also ensure that the upper space has a high cleanliness, so that the substrate is not contaminated during the transfer process, thereby improving the accuracy of substrate detection.

[0027] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0029] Figure 1 A three-dimensional schematic diagram of the overall structure of a substrate processing device provided in an embodiment of the present application;

[0030] Figure 2 A front view of a substrate processing device provided in an embodiment of the present application;

[0031] Figure 3 for Figure 2 Cross-sectional view at AA in the middle;

[0032] Figure 4 A left side view of a substrate processing device provided in an embodiment of the present application;

[0033] Figure 5 A three-dimensional schematic diagram of the internal structure of a substrate processing device provided in an embodiment of the present application.

[0034] Reference numerals:

[0035] a. Wafer transfer box;

[0036] 100. Substrate processing equipment;

[0037] 10. Chamber; 11. First space; 111. Upper space; 112. Lower space; 12. Second space; 121. Cleaning chamber; 122. Transfer chamber; 123. Detection chamber; 124. Circulation chamber;

[0038] 21. a first transfer device; 22. a second transfer device;

[0039] 30. Cleaning device;

[0040] 40. Detection device;

[0041] 50. Airflow supply device; 51. First airflow supply assembly; 52. Second airflow supply assembly; 521. Cleaning chamber airflow supply subassembly; 522. Detection chamber airflow supply subassembly; 523. Circulation chamber airflow supply subassembly;

[0042] 60. Loading device;

[0043] 71. A first material discharging device; 72. A second material discharging device. DETAILED DESCRIPTION

[0044] In order to make the technical solutions and beneficial effects of the present invention more clearly understandable, the following is a detailed description by listing specific embodiments. The drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0045] In the description of the present invention, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of simplified description of the present invention, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation to the present invention.

[0046] In the present invention, the terms "first" and "second" are only used for the purpose of clear description and cannot be understood as the relative importance of the indicated features or the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly include at least one of the features. In the description of the present invention, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise clearly and specifically defined.

[0047] In the present invention, unless otherwise clearly defined, the terms "install", "connect", "connect", "fix", "set", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the present invention, unless otherwise clearly defined, a first feature being “on”, “above”, “above”, “below”, “below”, “below” or “below” a second feature may mean that the first feature is in direct contact with the second feature, or the first feature and the second feature are in indirect contact with each other through an intermediate medium. Moreover, a first feature being “on”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0049] Related technology, in the process of cleaning substrates (e.g., wafers), usually includes the steps of loading, cleaning, testing and unloading the substrates. Multiple substrates in a front-opening wafer transfer box a (hereinafter referred to as "wafer transfer box") are cleaned one by one, and the cleaned substrates are stored in another temporary storage wafer transfer box a1. After all substrates in the wafer transfer box a are cleaned, the wafers in the other temporary storage wafer transfer box a1 are sent to the detection unit one by one for detection. The process is complicated, the steps are numerous, and the working efficiency of the substrate processing equipment is low.

[0050] Based on this, the substrate processing equipment 100 provided in the embodiment of the present application uses the first transfer device 21 to transfer the substrates in the wafer transfer box a at the loading device 60 to the cleaning device 30 one by one for cleaning, and then uses the first transfer device 21 to transfer the substrates that have been cleaned in the cleaning device 30 to the detection device 40 one by one, and uses the detection device 40 to detect the substrates one by one. It can also be understood that for the same substrate, the first transfer device 21 first takes out the substrate from the wafer transfer box a, and then transfers it to the cleaning device 30 for cleaning in turn, and after cleaning, it is moved to the detection device 40 for detection by the first transfer device 21. Therefore, the setting of the temporary storage wafer transfer box a1 in the prior art can be cancelled, and the steps of transferring the first transfer device 21 from the cleaning device 30 to the temporary storage wafer transfer box a1 and the step of transferring the first transfer device 21 from the temporary storage wafer transfer box a1 to the detection device 40 are removed, thereby reducing the steps of multiple transfers of the substrate during the substrate processing process, simplifying the cleaning and detection processes, and improving the working efficiency of the substrate processing equipment 100.

[0051] Based on this, an embodiment of the present application provides a substrate processing equipment 100, in which a first transfer device 21 is configured in a first space 11, a cleaning device 30 and a detection device 40 are located in a second space 12, and the second space 12 is located above a lower space 112 of the first space 11. In this way, the cleaned substrate can be transferred in the upper space 111 of the first space 11 with higher cleanliness, thereby avoiding contamination of the cleaned substrate and further improving the detection accuracy of the substrate.

[0052] Specifically, Figures 1 to 5 As shown, the substrate processing equipment 100 provided in the embodiment of the present application includes a chamber 10 , a first transfer device 21 , a cleaning device 30 , a detection device 40 and an airflow supply device 50 .

[0053] The chamber 10 has a first space 11 and a second space 12 . The first space 11 includes an upper space 111 and a lower space 112 that are connected to each other. The second space 12 is located at one side of the first space 11 and above the lower space 112 of the first space 11 .

[0054] The first transfer device 21 is located in the first space 11 and is configured to transfer the substrate between the first space 11 and the second space 12. The cleaning device 30 is located in the second space 12 and is configured to clean the substrate. The detection device 40 is located in the second space 12 and is configured to detect the yield of the substrate after cleaning. It should be noted that the detection device 40 detects the substrate after cleaning, including substrate pattern detection, substrate particle number detection, metal ion detection, etc. In this embodiment, the detection device 40 takes the detection of the number of particles on the substrate after cleaning as an example, and in this embodiment, the detection device 40 preferably uses the laser diffraction principle for detection (the laser diffraction principle is a more mature particle detection method in the art, which will not be described in detail here), but of course it is not limited to this.

[0055] The airflow supply device 50 is located above the first space 11 and the second space 12 and is used to provide a clean airflow from top to bottom. In this embodiment, the airflow supply device 50 is a fan filter unit (FFU).

[0056] It can be understood that the first space 11 is set as an upper space 111 and a lower space 112 that are interconnected, and the second space 12 is set above the lower space 112 in the horizontal direction. The particles in the first space will be deposited in the lower space under the action of gravity, while the cleanliness of the upper space is relatively high, thereby preventing the second space, which is also located at a higher position, from being contaminated.

[0057] Furthermore, the airflow supply device 50 is used to provide a top-down clean airflow to the first space 11 and the second space 12, and the particles in the first space 11 are pressed down to the bottom area of ​​the lower space under the action of the clean airflow, thereby further ensuring the cleanliness of the second space 12 and the upper space 111 of the first space 11, so that they are in a relatively clean area. In the process of using the first transfer device 21 to move the substrate that has been cleaned in the cleaning device 30 to the detection device 40, it is possible to avoid the possibility of particles in the chamber 10 causing contamination to the substrate.

[0058] In an alternative embodiment, if Figure 1 and Figure 2 As shown, the upper top surface of the first space, the lower bottom surface of the first space and the lower bottom surface of the second space are parallel to each other. The distance from the lower bottom surface of the second space to the upper top surface of the first space is the first distance, that is, Figure 2 h1 shown in FIG. 1 , the distance from the lower bottom surface of the first space to the upper top surface of the first space is the second distance, that is, Figure 2 In h2 shown in FIG. 1 , the ratio of the first distance to the second distance is 0.4-0.6.

[0059] When the ratio of the first distance h1 to the second distance h2 is less than 0.4, the space of the cleaning device 30, the detection device 40, and the first transfer device 21 is small, which affects the cleaning and detection efficiency of the substrate, and because the second space is set higher, it is not convenient for maintenance. When the ratio of the first distance h1 to the second distance h2 is greater than 0.6, the cleaning device 30, the detection device 40, and the first transfer device 21 are close to the bottom area of ​​the first space 11, which is easily contaminated by particles, thereby affecting the detection accuracy of the substrate.

[0060] In an optional embodiment, the first space 11 is provided with a first preset pressure, and the second space 12 is provided with a second preset pressure, and the second preset pressure is greater than the first preset pressure.

[0061] It can be understood that when the second preset pressure is greater than the first preset pressure, the clean gas blown by the airflow supply device toward the second space 12 can flow to the first space 11, and the airflow supply device can also blow clean airflow toward the first space 11, so that the gas in the upper space 111 flows toward the lower space 112 of the first space 11. In this way, the second space 12 and the upper space 111 of the first space 11 can both maintain a high degree of cleanliness, thereby ensuring that the substrate cleaned by the cleaning device 30 can be transported in a space with fewer particles, that is, a space with higher cleanliness, and further preventing the substrate from being contaminated by particles and causing large detection errors.

[0062] Furthermore, the pressure difference range between the first preset pressure and the second preset pressure is 10-25Pa, which can ensure that the gas in the second space 12 flows to the first space 11, thereby greatly reducing the possibility of particles flowing to the second space 12 and the upper space 111 of the first space 11.

[0063] In an optional embodiment, the airflow supply device 50 includes a first airflow supply component 51 and a second airflow supply component 52 for controlling the airflow separately, and the first airflow supply component 51 and the second airflow supply component 52 correspond to the first space 11 and the second space 12 respectively, and the pressure values ​​in the first space 11 and the second space 12 can be adjusted by adjusting the first airflow supply component 51 and the second airflow supply component 52. It should be noted that the clean airflow blown out by the first airflow supply component can cover the entire first space, and similarly, the clean airflow blown out by the second airflow supply component can cover the entire second space, so as to ensure the cleanliness of the second space and the upper space in the first space.

[0064] Furthermore, the second airflow supply assembly 52 may include a plurality of independent second airflow supply subassemblies, each of which corresponds to the chamber where the cleaning device 30 is located, the chamber where the detection device 40 is located, and the circulation chamber 124 where the second transfer device 22 mentioned below is located. It can be understood that the cleaning device 30, the detection device 40 and the second transfer device 22 each correspond to an independent cleaning chamber 121, a detection chamber 123 and a circulation chamber 124, respectively, and when the substrate needs to be transferred, each independent chamber is opened. Similarly, the first transfer device 21 corresponds to an independent transfer chamber 122, and the internal space of the transfer chamber 122 is the first space 11.

[0065] Specifically, Figure 1 As shown, the second airflow supply assembly 52 includes a cleaning chamber airflow supply subassembly 521, a detection chamber airflow supply subassembly 522 and a circulation chamber airflow supply subassembly 523. The cleaning chamber airflow supply subassembly 521, the detection chamber airflow supply subassembly 522 and the circulation chamber airflow supply subassembly 523 are respectively located above the cleaning chamber 121, the detection chamber 123 and the circulation chamber 124.

[0066] In an optional embodiment, the first transfer device 21 transfers the substrate between the first space 11 and the second space 12 in the upper space 111 of the first space 11. The reason for this arrangement is that the cleanliness of the upper space is higher than that of the lower space, which further prevents the substrate from being contaminated during the transfer by the first transfer device.

[0067] In an optional embodiment, the substrate processing equipment 100 further includes a loading device 60 disposed at one side of the first space 11. Preferably, the loading device 60 is located at one side of the upper space 111 of the first space 11. The substrate in the loading device 60 is an uncleaned substrate with particles adhered thereto. The first transfer device 21 is used to transfer the substrate located at one side of the upper space 111 of the first space 11 to the cleaning device 30 through the upper space 111 of the first space 11 for cleaning.

[0068] It can be understood that when the uncleaned substrates are transported, the uncleaned substrates are moved in the upper space 111 of the first space 11, thereby preventing particles in the lower space 112 of the first space 11 from adhering to the uncleaned substrates and increasing the difficulty of cleaning the substrates.

[0069] It should be noted that during the transportation of the uncleaned substrate in the upper space, a part of the particles adhered to the uncleaned substrate remain adhered and are transferred to the cleaning device for cleaning, while a small number of particles will be blown off by the top-down clean airflow provided by the airflow supply device and pressed down in the lower space under the action of the top-down airflow, which will not affect the cleanliness of the upper space and avoid contamination of the cleaned substrate.

[0070] In an optional embodiment, the first transfer device 21 includes a first clamping jaw assembly and a second clamping jaw assembly, wherein the first clamping jaw assembly is suitable for transferring the substrate between the loading device 60 and the cleaning device 30, that is, the first clamping jaw assembly can take out the uncleaned substrate in the loading device and transfer it to the cleaning device for cleaning. The second clamping jaw assembly can transfer the substrate between the cleaning device 30 and the detection device 40, that is, the second clamping jaw assembly can take out the cleaned substrate in the cleaning device and transfer it to the detection device for detection.

[0071] In this embodiment, the first clamping jaw assembly and the second clamping jaw assembly are arranged up and down and coaxially, and the first clamping jaw assembly and the second clamping jaw assembly share the same driving mechanism. When it is necessary to load the substrate, the driving mechanism drives the first clamping jaw assembly to rotate, so as to enter the loading device to take out the substrate and transfer it to the cleaning device for cleaning; when it is necessary to inspect the cleaned substrate, the driving mechanism drives the second clamping jaw assembly to rotate, so as to enter the cleaning device to take out the substrate and then send it to the detection device for inspection. In this embodiment, the first clamping jaw assembly and the second clamping jaw assembly are of the grasping type to ensure the stability of the substrate between the loading device and the cleaning device and the stability of the substrate between the cleaning device and the detection device.

[0072] The first clamping jaw assembly and the second clamping jaw assembly are used to clamp the uncleaned substrate and the cleaned substrate respectively, so that the second clamping jaw assembly has no contact with the uncleaned substrate, thereby avoiding the possibility of contamination of the cleaned substrate.

[0073] In an optional embodiment, the substrate processing equipment 100 further includes a first unloading device 71 , which is located above the lower space 112 of the first space 11 , and is configured to unload substrates with qualified inspection results.

[0074] The first unloading device 71 is located above the lower space 112 of the first space 11. It can be understood that the first unloading device 71 can be located on one side of the upper space 111 of the first space 11, or on one side of the second space 12. The substrates with qualified test results are directly unloaded from the upper space 111 of the first space 11 or the second space 12, which can avoid possible contamination of the substrates during the unloading process.

[0075] In an optional embodiment, the substrate processing equipment 100 further includes a second unloading device 72 , which is located at one side of the first space 11 , and is configured to unload substrates that are determined to be unqualified.

[0076] When the detection device 40 detects the substrate and determines that the substrate is an unqualified substrate, the first transfer device 21 is used to re-transfer the unqualified substrate to the cleaning device 30 for re-cleaning and re-testing. When the same substrate is still determined to be an unqualified substrate after being re-cleaned and tested for multiple times, the second unloading device 72 is used to unload the unqualified substrate. The number of repeated cleaning and testing can be set according to demand, for example: cleaning and testing are three times, four times, or five times.

[0077] The second unloading device 72 is used to unload the unqualified substrates separately, so that the unqualified substrates can be uniformly processed by other processes.

[0078] In an optional embodiment, the substrate processing equipment 100 further includes a second transfer device 22, which is configured to transfer the substrate on the first transfer device 21 to the detection device 40, and unload the substrate that has completed the detection.

[0079] Furthermore, the second space 12 is also provided with a circulation chamber 124, and the second transfer device 22 is located in the circulation chamber 124. The circulation chamber 124 is arranged adjacent to the detection chamber 123. The second transfer device 22 transfers the substrate that has completed cleaning on the first transfer device 21 to the detection device 40, and transfers the substrate that has completed detection and is confirmed to be qualified to the first unloading device 71, or transfers the completed substrate that is confirmed to be unqualified to the first transfer device 21.

[0080] The second transfer device 22 cooperates with the first transfer device 21 to improve the overall cleaning and detection effect of the substrate processing equipment 100, and can also greatly reduce the probability of contamination of qualified substrates during the unloading process.

[0081] In an optional embodiment, the first unloading device 71 is located on one side of the circulation chamber 124. It can be understood that after the substrate is inspected and qualified, the second transfer device 22 is used to directly transfer the qualified substrate to the first unloading device 71, thereby shortening the transfer distance of the qualified substrate after inspection, and further reducing the possibility of the qualified substrate being contaminated during the unloading process.

[0082] In an optional embodiment, the second transfer device 22 further includes a third clamping assembly, which can transfer the inspected substrate between the inspection device 40 and the first unloading device 71 , and between the inspection device 40 and the first transfer device 21 .

[0083] Furthermore, the third clamping jaw assembly is a fork.

[0084] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the claims. Various modifications and changes may be made on the basis of the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present application that may not be explicitly described. Therefore, the above embodiments only express several implementations of the present application and do not limit the scope of protection of the patent of this application.

Claims

1. A substrate processing device, characterized in that: The substrate processing device (100) comprises: The chamber (10) has a first space (11) and a second space (12); A first transfer device (21), located in the first space (11) and configured to transfer the substrate between the first space (11) and the second space (12); a cleaning device (30), located in the second space (12) and configured to clean the substrate; A detection device (40), located in the second space (12) and configured to detect the substrate yield; An airflow supply device (50) is located above the first space (11) and the second space (12) and is used to provide a clean airflow from top to bottom; The first space (11) comprises an upper space (111) and a lower space (112) which are interconnected, and the second space (12) is located on one side of the first space (11) and above the lower space (112) of the first space (11).

2. The substrate processing equipment according to claim 1, characterized in that: The upper top surface and the lower bottom surface of the first space and the lower bottom surface of the second space are parallel to each other; The distance from the lower bottom surface of the second space (12) to the upper top surface of the first space (11) is a first distance, and the distance from the lower bottom surface of the first space (11) to the upper top surface of the first space (11) is a second distance, and the ratio of the first distance to the second distance is 0.4-0.

6.

3. The substrate processing equipment according to claim 1, characterized in that: The first space (11) is provided with a first preset pressure, and the second space (12) is provided with a second preset pressure, wherein the second preset pressure is greater than the first preset pressure.

4. The substrate processing equipment according to claim 3, characterized in that: The pressure difference between the first preset pressure and the second preset pressure ranges from 10 to 25 Pa.

5. The substrate processing equipment according to claim 1, characterized in that: The first transfer device (21) keeps the substrate in the upper space (111) of the first space (11) during the transfer process between the first space (11) and the second space (12).

6. The substrate processing equipment according to claim 1, characterized in that: The substrate processing equipment (100) further comprises a loading device (60) arranged on one side of the first space (11); The first transfer device (21) comprises a first clamping jaw assembly and a second clamping jaw assembly, wherein the first clamping jaw assembly is capable of transferring the substrate between the loading device (60) and the cleaning device (30), and the second clamping jaw assembly is capable of transferring the substrate between the cleaning device (30) and the detection device (40).

7. The substrate processing equipment according to claim 1, characterized in that: The substrate processing device (100) further includes: The first unloading device (71) is located above the lower space (112) of the first space (11) and is configured to unload the substrate with a qualified detection result.

8. The substrate processing equipment according to claim 1, characterized in that: The substrate processing device (100) further includes: The second unloading device (72) is located at one side of the first space (11) and is configured to unload the substrate that is determined to be unqualified after inspection.

9. The substrate processing equipment according to claim 1, characterized in that: The substrate processing device (100) further includes: The second transfer device (22) is configured to transfer the substrate on the first transfer device (21) to the detection device (40) and unload the substrate that has completed the detection.

10. The substrate processing equipment according to claim 1, characterized in that: The airflow supply device (50) comprises a first airflow supply component (51) and a second airflow supply component (52) for independently controlling the airflow.

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