Wafer etching device and etching method for chip production

Abstract

The present application relates to the technical field of wafer processing devices and provides a wafer etching device for chip production, comprising an etching chassis, an etching pool provided on the etching chassis, the etching pool filled with etching liquid; a shielding window provided on the etching chassis and used to enclose the etching pool; a storage basket provided within the etching pool and used to place wafers; and an exhaust gas treatment assembly for treating exhaust gas generated within the etching pool. The exhaust gas treatment assembly includes an exhaust pipe, a water-absorbing pad, and a decontamination pipe, the exhaust pipe being connected to the etching pool and arranged vertically. The water-absorbing pad is used to absorb moisture carried by the exhaust gas. The decontamination pipe is filled with adsorbent particles for adsorbing impurities and pollutants in the exhaust gas. The decontamination pipe has air holes spaced apart on its surface for the exhaust gas to pass through. The present application has the effect of reducing pollution to the surrounding environment caused by wafer etching.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing devices, and in particular to a wafer etching device and etching method for chip production. Background Art

[0002] With the continuous development of semiconductor technology, wafer etching, a key step in chip manufacturing, has become increasingly important. Its precision and efficiency directly impact chip performance and production costs. Currently, most wafer etching devices on the market focus on improving etching accuracy, but still need to be improved in terms of processing efficiency, material utilization, and ease of operation.

[0003] Wafer processing generally involves processes such as resist coating, exposure, development, trench etching, and electrophoresis. The purpose of trench etching is to react silicon in specific areas of the wafer surface with an etching solution, thereby forming trenches. Existing wafer etching technologies typically use wet etching. While these methods can achieve high etching precision, they are often accompanied by issues such as material waste, long processing times, and complex operations.

[0004] Regarding the above-mentioned related technologies, the wafer etching device and method have high requirements on the operator's skills during operation, and the etching liquid is easy to volatilize and produce harmful gases during the etching process. Improper treatment of waste gas may cause pollution to the environment, so it needs to be improved. Summary of the Invention

[0005] In order to reduce the pollution of the surrounding environment caused by wafer etching, the present application provides a wafer etching device for chip production.

[0006] In a first aspect, the present application provides a wafer etching device for chip production using the following technical solutions:

[0007] A wafer etching device for chip production, comprising:

[0008] An etching machine box is provided with an etching pool, and the etching pool is filled with etching liquid;

[0009] A shielding window, which is provided on the etching machine chassis and is used to close the etching pool;

[0010] A storage basket is provided in the etching tank and is used for placing wafers, and a plurality of through holes are provided at the bottom of the storage basket;

[0011] An exhaust gas treatment component, the exhaust gas treatment component is used to treat the exhaust gas generated in the etching pool; the exhaust gas treatment component includes an exhaust pipe, a water absorbent pad and an impurity removal pipe, the exhaust pipe is connected to the etching pool and is vertically arranged, the water absorbent pad and the impurity removal pipe are arranged in sequence from bottom to top along the height direction of the exhaust pipe, the water absorbent pad is used to absorb moisture carried in the exhaust gas, the impurity removal pipe is filled with adsorption particles, the adsorption particles are used to adsorb impurities and pollutants in the exhaust gas, and the surface of the impurity removal pipe is spaced apart with air holes for the exhaust gas to pass through;

[0012] Among them, the impurity removal pipe is V-shaped, and the impurity removal pipe is rotatably connected to the inside of the exhaust pipe through a rotating motor, and the rotation axis of the impurity removal pipe is in the horizontal direction; when the adsorption particles in the impurity removal pipe need to be replaced, the rotating motor controls the impurity removal pipe to flip and take an inverted V shape.

[0013] By adopting the above technical solution, during production, a row of wafers to be etched is placed in a storage basket, which is then immersed in an etching tank. The etching tank is then sealed with a shielding window. After a period of time, etching is completed. The exhaust gas generated during the etching process enters the exhaust pipe, where it passes through a water-absorbing pad and a decontamination pipe. The water-absorbing pad dehumidifies the exhaust gas, and the adsorption particles in the decontamination pipe absorb the dehumidified exhaust gas, trapping organic compounds and other pollutants in the exhaust gas on the adsorption particles, effectively reducing environmental pollution.

[0014] Preferably, it also includes a gas spring and a baffle, the baffle being rotatably arranged at both ends of the impurity removal pipe and used for intercepting and adsorbing particles, the gas spring being connected to the baffle and used for controlling the rotation of the baffle; a feed port and a discharge port are provided on the side wall of the impurity removal pipe, the feed port is located above the discharge port, when the impurity removal pipe is in a V-shape, the two ends of the impurity removal pipe correspond to the feed port; when the impurity removal pipe is in an inverted V-shape, the two ends of the impurity removal pipe correspond to the discharge port.

[0015] By adopting the above technical solution, the adsorption particles need to be replaced after long-term use. When the old adsorption particles need to be replaced, the rotary motor is first used to control the impurity removal pipe to flip and form an inverted V shape, and then the air spring is used to control the baffle to open so that the old adsorption particles can fall from the impurity removal pipe to the discharge port.

[0016] After the dumping is completed, the impurity removal pipe is flipped again to make it V-shaped; then the air spring is used to control the baffle to open. At this time, new adsorbed particles can enter the impurity removal pipe from the feed port along the baffle. After the loading is completed, the baffle is controlled to cover both ends of the impurity removal pipe.

[0017] Preferably, the water-absorbing pad is detachably connected to the exhaust pipe.

[0018] By adopting the above technical solution, when the water absorption capacity of the absorbent pad becomes saturated, the absorbent pad can be replaced regularly to ensure the treatment effect of the exhaust gas.

[0019] Preferably, a storage plate is connected to the exhaust pipe, and two storage plates are arranged in parallel. A storage cavity is formed between the two storage plates, and the absorbent pad is placed in the storage cavity. A cover is connected to the exhaust pipe, and the cover is used to cover an opening at one end of the storage cavity.

[0020] By adopting the above technical solution, when replacing, first open the cover body, then pull out the old absorbent pad from between the two storage plates, then replace it with a new absorbent pad, and finally close the cover body.

[0021] Preferably, it further comprises a stirring assembly, which is arranged on the etching machine case and is used to stir the etching liquid in the etching pool.

[0022] By adopting the above technical solution, during the etching process, the etching liquid in the etching tank has relatively weak fluidity, which can easily lead to the etching ability of the etching liquid gradually weakening around the wafer. By adding a stirring component, the stirring component can stir the etching liquid, thereby increasing the fluidity of the etching liquid and improving the etching effect and quality.

[0023] Preferably, the stirring assembly includes a driving member and a stirring plate, the stirring plate is movably arranged in the etching pool and is used to stir the etching liquid; the driving member is connected to the stirring plate and is used to control the reciprocating motion of the stirring plate, and the driving member is a cylinder, an oil cylinder or an electric push rod.

[0024] By adopting the above technical solution, the driving member can control the reciprocating movement of the stirring plate, and the movement of the stirring plate can exert a thrust on the etching liquid to achieve stirring.

[0025] Preferably, it also includes a receiving plate and a support column, the receiving plate includes a first plate and a second plate, and the first plate and the second plate can be rotatably connected to the etching machine case; the receiving plates are arranged in two parallel pieces, and both of the receiving plates are used for placing the storage basket, and the support column is arranged between the two receiving plates, and the support column is used for temporarily placing the storage basket.

[0026] By adopting the above technical solution, when etching is completed, the staff first places the entire storage basket on the support column, and then controls the rotation of the first plate and the second plate so that the receiving plate changes from a straight state to a V shape, and then places the storage basket on the two receiving plates for draining, reducing the waste of etching liquid and facilitating the subsequent removal of wafers.

[0027] Preferably, the shielding window includes a first window and a second window, the first window is fixedly connected to the etching machine case, the second window is slidably connected to the first window, and transparent glass plates are provided on the first window and the second window.

[0028] By adopting the above technical solution, during the etching process, the staff can observe the situation in the etching pool through the transparent glass plate. After the etching is completed, the staff can push the second window to expose the etching pool, and then unload the wafer and proceed with the subsequent etching.

[0029] Preferably, it further comprises a control panel, which is arranged on the etching machine chassis.

[0030] By adopting the above technical solution, the staff can use the control panel to let the etching machine box execute the corresponding instructions so that the wafer etching process can be carried out.

[0031] In a second aspect, the present application also provides a wafer etching method for chip production, which adopts the following technical solution:

[0032] A wafer etching method for chip production comprises the following steps:

[0033] S1. First, place the wafer in the storage basket, then place the storage basket into the etching tank, and use the shielding window to close the etching tank;

[0034] S2. Start the etching control system to etch;

[0035] S3. During the etching process, the exhaust gas is automatically treated by the exhaust gas treatment component;

[0036] S4. After etching is completed, take out the etched wafer.

[0037] In summary, this application includes at least one of the following beneficial technical effects:

[0038] (1) By setting up the exhaust gas treatment component, the exhaust gas generated during the etching process will enter the exhaust gas pipe, and the exhaust gas will pass through the water absorbent pad and the impurity removal pipe in turn. The water absorbent pad dehumidifies the exhaust gas, and the adsorption particles in the impurity removal pipe adsorb the dehumidified exhaust gas, so that the organic compounds or other pollutants in the exhaust gas are intercepted on the adsorption particles, effectively reducing environmental pollution.

[0039] (2) By detachably connecting the absorbent pad to the exhaust pipe, when the absorbent pad's water absorption capacity becomes saturated, the absorbent pad can be replaced regularly to ensure the exhaust gas treatment effect.

[0040] (3) By setting up a stirring component, the stirring component can stir the etching liquid, thereby increasing the fluidity of the etching liquid and improving the wafer etching effect and etching quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 This is a schematic structural diagram of an etching device in an embodiment of the present application;

[0042] Figure 2 It is a structural diagram of an embodiment of the present application;

[0043] Figure 3 It is a structural diagram of an embodiment of the present application;

[0044] Figure 4 It is a structural diagram of an embodiment of the present application.

[0045] Figure numerals: 1. Etching chassis; 2. Shielding window; 21. First window; 22. Second window; 3. Storage basket; 4. Exhaust gas treatment component; 41. Exhaust gas pipe; 42. Water-absorbing pad; 43. De-impurity pipe; 5. Rotating motor; 6. Feed inlet; 7. Discharge outlet; 8. Storage plate; 9. Storage cavity; 10. Cover; 11. Stirring component; 111. Driving member; 112. Stirring plate; 12. Receiving plate; 121. First plate; 122. Second plate; 13. Support column; 14. Etching pool; 15. Control panel; 16. Transparent glass plate; 17. Bump; 18. Groove; 19. Gas spring; 20. Baffle. DETAILED DESCRIPTION

[0046] The following will describe the technical solution of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. The present application can be embodied in many different forms and is not limited to the embodiments described here.

[0047] Throughout the present application, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0049] In the description of the embodiments of this application, unless otherwise specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, integration, or mechanical connections. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this application based on specific circumstances.

[0050] Some embodiments of the present application are described in detail below with reference to the accompanying drawings. In the absence of conflict, those skilled in the art may combine and combine the different embodiments or examples and features of the different embodiments or examples shown in the present application.

[0051] The embodiment of the present application discloses a wafer etching device for chip production. Figure 1 and Figure 2 The etching device includes an etching chassis 1, a shielding window 2, a storage basket 3 and an exhaust gas treatment component 4. The etching chassis 1 is placed on the ground, and an etching pool 14 is provided on the etching chassis 1, and the etching pool 14 is used to accommodate the etching liquid. The shielding window 2 is installed on the etching chassis 1 and is used to close the etching pool 14. The storage basket 3 is placed in the etching pool 14. The storage basket 3 is rectangular and is used for placing wafers. A plurality of through holes are provided at the bottom of the storage basket 3, and each through hole is used for the etching liquid to pass through. Among them, a control panel 15 is also provided on the etching chassis 1, and the control panel 15 is used for the staff to operate the instructions. During production, the staff arranges a row of wafers to be etched in the storage basket 3, and then immerses the storage basket 3 in the etching pool 14, and then uses the shielding window 2 to close the etching pool 14. After a period of time, the etching is completed.

[0052] In this embodiment, the shielding window 2 includes a first window 21 and a second window 22. The first window 21 is arranged at an angle and fixedly connected to the etching machine housing 1. The second window 22 is slidably connected to the first window 21. Transparent glass plates 16 are provided on both the first window 21 and the second window 22. A protrusion 17 is integrally formed on the surface of the first window 21 facing the second window 22. A groove 18 is correspondingly formed on the side of the second window 22 facing the first window 21. When the protrusion 17 is engaged with the groove 18, the relative movement of the first window 21 and the second window 22 can be restricted.

[0053] During the etching process, the staff can observe the situation in the etching pool 14 through the transparent glass plate 16 without opening the shielding window 2. After the etching is completed, the staff can push the second window 22 to expose the etching pool 14, and then unload the wafer and proceed with subsequent etching.

[0054] Combine Figure 3The exhaust gas treatment component 4 is installed on the top of the etching machine box 1 and is used to treat the exhaust gas generated in the etching pool 14. Specifically, the exhaust gas treatment component 4 includes an exhaust pipe 41, a water absorbent pad 42 and a debris removal pipe 43. The exhaust pipe 41 is connected to the etching pool 14 and is vertically arranged. The water absorbent pad 42 and the debris removal pipe 43 are arranged in sequence from bottom to top along the height direction of the exhaust pipe 41. The water absorbent pad 42 is used to absorb moisture carried in the exhaust gas. The debris removal pipe 43 is filled with adsorption particles, which are used to adsorb impurities and pollutants in the exhaust gas. The surface of the debris removal pipe 43 is spaced apart with air holes for the exhaust gas to pass through.

[0055] The waste gas generated during the etching process will enter the waste gas pipe 41, and the waste gas will pass through the water absorbent pad 42 and the impurity removal pipe 43 in turn. The water absorbent pad 42 dehumidifies the waste gas, and the adsorption particles in the impurity removal pipe 43 adsorb the dehumidified waste gas, so that the organic compounds or other pollutants in the waste gas are trapped on the adsorption particles, effectively reducing environmental pollution.

[0056] In this embodiment, the impurity removal pipe 43 is V-shaped and is rotatably connected to the interior of the exhaust pipe 41 via a rotating motor 5, with the rotation axis of the impurity removal pipe 43 being horizontal. When the adsorbed particles in the impurity removal pipe 43 need to be replaced, the rotating motor 5 controls the impurity removal pipe 43 to flip over and assume an inverted V shape. A gas spring 19 and a baffle 20 are also installed on the impurity removal pipe 43. The baffle 20 is rotatably connected to both ends of the impurity removal pipe 43 and is used to intercept adsorbed particles. The gas spring 19 is connected to the baffle 20 and is used to control the rotation of the baffle 20.

[0057] A feed port 6 and a discharge port 7 are provided on the side wall of the impurity removal pipe 43. The feed port 6 is located above the discharge port 7. When the impurity removal pipe 43 is in a V shape, the two ends of the impurity removal pipe 43 correspond to the feed port 6; when the impurity removal pipe 43 is in an inverted V shape, the two ends of the impurity removal pipe 43 correspond to the discharge port 7.

[0058] After long-term use, the adsorption particles will become inactivated and need to be replaced. When the old adsorption particles need to be replaced, the rotary motor 5 is first used to control the impurity removal pipe 43 to flip and form an inverted V shape, and then the gas spring 19 is used to control the baffle 20 to open, so that the old adsorption particles can be poured out of the impurity removal pipe 43 to the discharge port 7.

[0059] After the dumping is completed, the impurity removal pipe 43 is turned over again so that the impurity removal pipe 43 is V-shaped; then the gas spring 19 is used to control the baffle 20 to open. At this time, new adsorption particles can enter the impurity removal pipe 43 from the feed port 6 along the baffle 20. After the loading is completed, the baffle 20 is controlled to cover the two ends of the impurity removal pipe 43 to prevent the adsorption particles from falling out.

[0060] In some embodiments, the absorbent pad 42 is detachably connected to the exhaust pipe 41. When the water absorption capacity of the absorbent pad 42 becomes saturated, the absorbent pad 42 can be replaced regularly to ensure the treatment effect of the exhaust gas. A storage plate 8 is fixedly connected to the exhaust pipe 41. There are two storage plates 8 arranged in parallel. A storage cavity 9 is formed between the two storage plates 8. The absorbent pad 42 is clamped in the storage cavity 9. A cover body 10 is connected to the exhaust pipe 41. The cover body 10 can be installed on the exhaust pipe 41 by screwing. The cover body 10 is used to cover the opening at one end of the storage cavity 9. When replacing, first open the cover body 10, then pull out the old absorbent pad 42 from between the two storage plates 8, then replace it with a new absorbent pad 42, and finally close the cover body 10 again to seal it.

[0061] Combine Figure 4 , the etching machine case 1 is also equipped with a stirring assembly 11, which is used to stir the etching liquid in the etching pool 14. During the etching process, since the etching liquid in the etching pool 14 has relatively weak fluidity, it is easy to cause the corrosive ability of the etching liquid around the wafer to gradually weaken. The stirring assembly 11 can stir the etching liquid, thereby increasing the fluidity of the etching liquid, improving the etching effect and etching quality. The stirring assembly 11 includes a driving member 111 and a stirring plate 112, which is movably arranged in the etching pool 14 and is used to stir the etching liquid. The driving member 111 is connected to the stirring plate 112 and is used to control the reciprocating motion of the stirring plate 112. The driving member 111 is an actuator such as a cylinder, an oil cylinder or an electric push rod. The driving member 111 controls the reciprocating motion of the stirring plate 112 so that the stirring plate 112 can play a thrust role on the etching liquid, thereby increasing the fluidity of the etching liquid.

[0062] In addition, the etching machine housing 1 is equipped with a receiving plate 12 and a support column 13, both of which are located above the etching pool 14. The receiving plate 12 includes a first plate 121 and a second plate 122, each of which is rotatably connected to the etching machine housing 1, and the first plate 121 and the second plate 122 can be rotated into a V shape. In this embodiment, two receiving plates 12 are arranged in parallel, and the two receiving plates 12 are used together to place the storage basket 3. The support column 13 is located between the two receiving plates 12 and is used to temporarily place the storage basket 3.

[0063] When etching is completed, the staff first places the entire storage basket 3 on the support column 13, and then controls the first plate 121 and the second plate 122 to rotate, so that the receiving plate 12 changes from a straight state to a V shape, and then places the storage basket 3 on the two receiving plates 12 for draining, reducing the waste of etching solution and facilitating the subsequent removal of wafers.

[0064] The implementation principle of a wafer etching device for chip production in the embodiment of the present application is as follows: During production, a row of wafers to be etched is first arranged in a storage basket 3, and then the storage basket 3 is immersed in an etching tank 14. The etching tank 14 is then sealed using a shielding window 2. After a period of time, etching is completed. The exhaust gas generated during the etching process will enter the exhaust pipe 41. The exhaust gas will pass through the water absorbent pad 42 and the impurity removal pipe 43 in sequence. The water absorbent pad 42 dehumidifies the exhaust gas, and the adsorption particles in the impurity removal pipe 43 adsorb the dehumidified exhaust gas, so that organic compounds or other pollutants in the exhaust gas are trapped on the adsorption particles, effectively reducing environmental pollution.

[0065] Based on the above embodiments, the present application also provides a wafer etching method for chip production, comprising the following steps:

[0066] S1. First, place the wafers neatly in the storage basket 3, then place the storage basket 3 into the etching pool 14, while controlling the second window 22 to slide so that the entire shielding window 2 closes the etching pool 14;

[0067] S2. Then start the etching control system to etch the wafer;

[0068] S3. The waste gas generated during the etching process enters the waste gas treatment component 4, which dehumidifies and removes impurities from the waste gas;

[0069] S4. After etching is completed, the staff wearing protective gloves takes out the storage basket 3 from the etching tank 14, and places it on the receiving plate 12 to drain, and finally takes out the etched wafer.

[0070] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A wafer etching device for chip production, characterized in that: include: An etching machine case (1), wherein an etching pool (14) is provided on the etching machine case (1), and an etching liquid is filled in the etching pool (14); A shielding window (2), the shielding window (2) being provided on the etching machine case (1) and being used to seal the etching pool (14); A storage basket (3), the storage basket (3) is arranged in the etching pool (14) and is used for placing wafers, and a plurality of through holes are provided at the bottom of the storage basket (3); An exhaust gas treatment component (4), the exhaust gas treatment component (4) is used to treat the exhaust gas generated in the etching pool (14); the exhaust gas treatment component (4) includes an exhaust pipe (41), a water absorption pad (42) and an impurity removal pipe (43); the exhaust pipe (41) is connected to the etching pool (14) and is vertically arranged; the water absorption pad (42) and the impurity removal pipe (43) are arranged in sequence from bottom to top along the height direction of the exhaust pipe (41); the water absorption pad (42) is used to absorb moisture carried in the exhaust gas; the impurity removal pipe (43) is filled with adsorption particles, the adsorption particles are used to adsorb impurities and pollutants in the exhaust gas; the surface of the impurity removal pipe (43) is spaced apart with air holes for the exhaust gas to pass through; The impurity removal pipe (43) is V-shaped and is rotatably connected to the inside of the exhaust pipe (41) via a rotating motor (5). The rotation axis of the impurity removal pipe (43) is in a horizontal direction. When the adsorbed particles in the impurity removal pipe (43) need to be replaced, the rotating motor (5) controls the impurity removal pipe (43) to flip over and assume an inverted V shape.

2. A wafer etching device for chip production according to claim 1, characterized in that: The utility model further comprises a gas spring (19) and a baffle (20), wherein the baffle (20) is rotatably arranged at both ends of the impurity removal pipe (43) and is used to intercept adsorbed particles, and the gas spring (19) is connected to the baffle (20) and is used to control the rotation of the baffle (20); a feed port (6) and a discharge port (7) are provided on the side wall of the impurity removal pipe (43), wherein the feed port (6) is located above the discharge port (7); when the impurity removal pipe (43) is in a V-shape, the two ends of the impurity removal pipe (43) correspond to the feed port (6); when the impurity removal pipe (43) is in an inverted V-shape, the two ends of the impurity removal pipe (43) correspond to the discharge port (7).

3. The wafer etching device for chip production according to claim 1, characterized in that: The water-absorbing pad (42) is detachably connected to the exhaust pipe (41).

4. A wafer etching device for chip production according to claim 3, characterized in that: A storage plate (8) is connected to the exhaust pipe (41), two storage plates (8) are arranged in parallel, a storage cavity (9) is formed between the two storage plates (8), the absorbent pad (42) is placed in the storage cavity (9), and a cover (10) is connected to the exhaust pipe (41), and the cover (10) is used to cover an opening at one end of the storage cavity (9).

5. The wafer etching device for chip production according to claim 1, characterized in that: It also includes a stirring component (11), which is arranged on the etching machine box (1) and is used to stir the etching liquid in the etching pool (14).

6. The wafer etching device for chip production according to claim 5, characterized in that: The stirring assembly (11) comprises a driving member (111) and a stirring plate (112); the stirring plate (112) is movably arranged in the etching pool (14) and is used to stir the etching liquid; the driving member (111) is connected to the stirring plate (112) and is used to control the reciprocating motion of the stirring plate (112); the driving member (111) is an air cylinder, an oil cylinder or an electric push rod.

7. The wafer etching device for chip production according to claim 1, characterized in that: It also includes a receiving plate (12) and a support column (13), wherein the receiving plate (12) includes a first plate (121) and a second plate (122), and the first plate (121) and the second plate (122) are both rotatably connected to the etching machine box (1); two receiving plates (12) are arranged in parallel, and both of the two receiving plates (12) are used for placing the storage basket (3); the support column (13) is arranged between the two receiving plates (12), and the support column (13) is used for temporarily placing the storage basket (3).

8. The wafer etching device for chip production according to claim 1, characterized in that: The shielding window (2) comprises a first window (21) and a second window (22), wherein the first window (21) is fixedly connected to the etching machine box (1), and the second window (22) is slidably connected to the first window (21), and transparent glass plates (16) are provided on both the first window (21) and the second window (22).

9. The wafer etching device for chip production according to claim 1, characterized in that: It also includes a control panel (15), which is arranged on the etching machine case (1).

10. A method for performing wafer etching using the wafer etching apparatus for chip production according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. First, place the wafer in the storage basket (3), then place the storage basket (3) in the etching pool (14), and at the same time use the shielding window (2) to close the etching pool (14); S2. Start the etching control system to etch; S3. During the etching process, the waste gas is automatically treated by the waste gas treatment component (4); the waste gas passes through the water absorption pad (42) and the impurity removal pipe (43) in sequence along the waste gas pipe (41); the water absorption pad (42) dehumidifies the waste gas, and the adsorption particles in the impurity removal pipe (43) adsorb the dehumidified waste gas, so that organic compounds or other pollutants in the waste gas are trapped on the adsorption particles; S4. After etching is completed, take out the etched wafer.

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