Adjusting method of wafer adjusting platform

Abstract

The application discloses a kind of adjusting method of wafer adjusting platform, the adjusting method of wafer adjusting platform includes the following steps: S1, the preparation of equipment in advance;S2, top pin lifting power device is driven to rise, top pin supports wafer and then falls, wafer falls on wafer placement platform;S3, negative pressure system carries out air extraction by negative pressure channel, wafer is adsorbed again on wafer placement platform;S4, by sensor lifting power device drive measure bottom sensor to rise, measure bottom sensor is resisted to the bottom of wafer placement platform, and whether the level of wafer placement is measured;S5, by the data measured by measure bottom sensor, lifting leveling device carries out horizontal adjustment and height adjustment to wafer placement platform;S6, turntable driving device drives wafer turntable to rotate, and wafer rotates to corresponding etching angle;The method can accurately adjust the horizontal state and height when wafer etching after wafer is placed on wafer placement platform, and can ensure that wafer can be accurately in suitable etching position.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection equipment, and more particularly to a method for adjusting a wafer adjustment stage. Background Technology

[0002] A wafer refers to a silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is circular in shape and needs to be placed on a wafer turntable. During photolithography, the wafer undergoes multiple etching processes. A bottom-feed sensor is required on the turntable to determine if the wafer is correctly positioned and to determine the subsequent processing height, ensuring accurate and stable processing. The bottom-feed sensor is installed inside the turntable, using the bottom of the turntable as a reference. Currently, the bottom-feed sensor consists of a sensor head and a cylinder that drives the sensor head to move up and down. The cylinder is connected to an airflow interface. The cylinder is then directly fixed to the bottom of the turntable. This installation and fixing process is quite cumbersome. Furthermore, when replacing the cylinder or sensor head, the airflow tubes on the airflow interface must be disconnected sequentially, making disassembly very tedious. Additionally, the bottom of the cylinder cannot be effectively flush with the surface, affecting the accuracy of the bottom-feed sensor. The wafer turntable also has a support plate. A wafer carrier is used to hold a wafer. The wafer carrier needs to ensure that its end face is horizontal to ensure that the wafer is in a horizontal state during etching. Therefore, the wafer carrier needs to be adjusted for horizontal level on the wafer turntable. Patent No. 202223067713.9 discloses a turntable adjustment mechanism and detection device. This turntable adjustment mechanism drives a lead screw to rotate through a drive component, thereby driving a moving block to move linearly. The moving block is connected to a rotating plate through a connecting component. The moving block moves linearly, and the rotating plate is equipped with guide rails, bearings and other components on the connecting component in order to rotate circumferentially. This increases the complexity of the structure when driving the rotation, and the lead screw and nut also require high precision, which also increases the complexity of the structure and the cost of use. At the same time, this wafer turntable cannot be adjusted horizontally, which affects the etching accuracy of the wafer. Summary of the Invention

[0003] The technical problem to be solved by the present invention is: a method for adjusting a wafer stage, which can accurately adjust the horizontal state and height of the wafer during etching after the wafer is placed on the wafer stage, and can ensure that the wafer is accurately in the appropriate etching position.

[0004] To solve the above-mentioned technical problems, the technical solution of the present invention is: a method for adjusting a wafer stage, the method comprising the following steps:

[0005] S1. Equipment preparation: A wafer adjustment stage is provided, including a base plate on which a wafer turntable is rotatably mounted. The base plate is equipped with a turntable drive device for rotating the wafer turntable. The wafer turntable includes an upper disk at the bottom and a shell surrounding the upper disk. A lifting and leveling device is mounted on the upper disk, and a worktable is mounted on the lifting and leveling device. A wafer placement stage is mounted on the worktable. The lifting and leveling device drives the wafer placement stage to lift and level. A pin is lifted and leveled on the upper disk, penetrating the wafer placement stage to support wafer lifting. The pin is driven by a pin lifting power device. The upper disk is also equipped with multiple bottom-measuring sensors that lift and penetrate the wafer placement stage. The bottom-measuring sensors are driven by a sensor lifting power device. The wafer placement stage is equipped with a negative pressure channel for negative pressure suction of the wafer, and the negative pressure channel is connected to a negative pressure system.

[0006] S2. The ejector pin is driven to rise by the ejector pin lifting power device. After the ejector pin supports the wafer, it falls down and the wafer lands on the wafer placement stage.

[0007] S3. The negative pressure system draws air through the negative pressure channel, and the wafer is adsorbed and placed on the wafer placement stage.

[0008] S4. The bottom sensor is driven to rise by the sensor lifting power device. The bottom sensor touches the bottom of the wafer placement stage to determine whether the wafer is placed horizontally.

[0009] S5. Based on the data measured by the bottom sensor, the lifting and leveling device adjusts the level and height of the wafer placement stage.

[0010] S6. The turntable drive device drives the wafer turntable to rotate, and the wafer rotates to the corresponding etching angle.

[0011] As a preferred embodiment, in step S4, the upper disc is provided with a receiving groove corresponding to the bottom-measuring sensor, and a mounting base is installed in the receiving groove. A sensor driving cylinder is vertically inserted into the mounting base. The upper surface of the mounting base is a reference surface, and the bottom of the sensor driving cylinder is in contact with the reference surface. The mounting base is provided with an airflow channel communicating with the sensor driving cylinder, and the airflow channel is connected to the cylinder driving air source. The bottom-measuring sensor is lifted and lowered on the sensor driving cylinder. The sensor driving cylinder is also provided with a sensor wiring harness connected to the bottom-measuring sensor. The upper disc is provided with an auxiliary fixing device to assist in the vertical installation of the sensor driving cylinder. The method for installing the bottom-measuring sensor and determining its initial position is as follows:

[0012] The sensor-driven cylinder drives the bottom-measuring sensor to rise and fall. A receiving groove is opened on the upper disc. The mounting base is installed on the receiving groove with the bottom surface of the receiving groove as the reference. The sensor-driven cylinder is inserted and installed on the mounting base. With the upper surface of the mounting base as the reference, after the bottom of the sensor-driven cylinder contacts the upper surface of the mounting base, the auxiliary fixing device assists in fixing the sensor-driven cylinder, thus completing the determination of the initial position of the bottom-measuring sensor.

[0013] As a preferred embodiment, in step S6, the turntable driving device includes a rotating connecting rod fixedly mounted on the upper disk and rotating synchronously with the wafer turntable. A push block that pushes the rotating connecting rod is horizontally and linearly slidably mounted on the base plate. The end of the push block is in close contact with the side of the rotating connecting rod. The push block is driven by a linear pushing power device. The base plate is provided with a reset structure connected to the rotating connecting rod to pull and rotate the wafer turntable. The base plate is also provided with a limiting structure that restricts the rotation range of the rotating connecting rod following the wafer turntable. The rotation adjustment method of the wafer turntable is as follows:

[0014] The linear drive power device drives the push block to extend and retract linearly. The push block extends to push the rotating connecting rod, and the rotating connecting rod swings forward to drive the wafer turntable to rotate until the rotating connecting rod hits the limit structure and stops rotating. Then the push block retracts, and the reset structure pulls the rotating connecting rod to swing backward. At the same time, the push block always presses against the rotating connecting rod, completing the rotation adjustment of the wafer turntable.

[0015] As a preferred embodiment, in step S5, the lifting and leveling device includes four lifting mounting frames fixedly installed on the upper disc. The four lifting mounting frames are evenly arranged circumferentially around the wafer placement stage. Each lifting mounting frame has a vertically sliding sliding seat, driven by a worktable lifting power device. Two sliding seats are located on the X diameter and are defined as X sliding seats, while the other two are located on the Y diameter and are defined as Y sliding seats. Each X sliding seat has an X adjusting block fixedly installed, and each Y sliding seat has a Y adjusting block fixedly installed. The worktable is fixed to the X adjusting blocks and the Y adjusting blocks. On the segment, the X adjustment block is divided into an upper X layer block and an lower X layer block. A Y-oriented connecting block is provided between the upper X layer block and the lower X layer block. An X-oriented connecting block is provided between the lower X layer block and the X sliding seat. Gaps are provided between the upper X layer block and the lower X layer block, and between the lower X layer block and the X sliding seat. The Y adjustment block is divided into an upper Y layer block and a lower Y layer block. An X-oriented connecting block is provided between the upper Y layer block and the lower Y layer block. A Y-oriented connecting block is provided between the lower Y layer block and the Y sliding seat. Gaps are provided between the upper Y layer block and the lower Y layer block, and between the lower Y layer block and the Y sliding seat. The horizontal adjustment method of the wafer placement stage is as follows:

[0016] After the wafer is placed on the wafer placement stage, when the two X-slide seats move up and down, the Y-connecting blocks on the X-slide seats twist respectively, causing the wafer placement stage to swing up and down on both sides in the X direction. The Y-connecting blocks on the Y-slide seats also twist accordingly, and the gaps on both sides of the Y-connecting blocks are compressed and expanded respectively. When the two Y-slide seats move up and down, the X-connecting blocks on the Y-slide seats twist respectively, causing the wafer placement stage to swing up and down on both sides in the Y direction. The X-connecting blocks on the X-slide seats also twist accordingly, thus completing the horizontal adjustment of the wafer placement stage.

[0017] As a preferred embodiment, the auxiliary fixing device includes an auxiliary rod vertically fixed on the upper disc, with a clamping block between the auxiliary rod and the sensor driving cylinder for mutual clamping; the auxiliary fixing device also includes an auxiliary positioning component, which has an inner positioning sleeve fitted on the auxiliary rod and an outer positioning sleeve fitted on the sensor driving cylinder, with the clamping block located above the auxiliary positioning component; the auxiliary positioning component uses the inner and outer positioning sleeves to initially constrain the auxiliary rod and the sensor driving cylinder to be parallel and aligned before inserting them into the mounting base, and the clamping block clamps and fixes the sensor driving cylinder and the auxiliary rod, with the bottom of the sensor driving cylinder pressed against the mounting base.

[0018] As a preferred embodiment, in step S6, the base plate is further provided with a sensing device for detecting the moving position of the push block. The sensing device cooperates with the limiting stop to limit the movement. The sensing device is a grating ruler, which is fixed on the push block to detect the moving distance of the push block. The grating ruler is used to detect the linear extension distance of the push block, and the linear distance corresponds to the angle of rotation of the wafer turntable.

[0019] As a preferred embodiment, in step S5, after the wafer turntable is leveled, the bottom sensor is driven to rise by the sensor-driven cylinder to detect whether the wafer is level. Then, the X sliding seat and the Y sliding seat are simultaneously raised and lowered to adjust the distance between the wafer and the mask.

[0020] After adopting the above technical solution, the effect of the present invention is as follows: Due to the adjustment method of the wafer stage, the adjustment method of the wafer stage includes the following steps:

[0021] S1. Equipment preparation: A wafer adjustment stage is provided, including a base plate on which a wafer turntable is rotatably mounted. The base plate is equipped with a turntable drive device for rotating the wafer turntable. The wafer turntable includes an upper disk at the bottom and a shell surrounding the upper disk. A lifting and leveling device is mounted on the upper disk, and a worktable is mounted on the lifting and leveling device. A wafer placement stage is mounted on the worktable. The lifting and leveling device drives the wafer placement stage to lift and level. A pin is lifted and leveled on the upper disk, penetrating the wafer placement stage to support wafer lifting. The pin is driven by a pin lifting power device. The upper disk is also equipped with multiple bottom-measuring sensors that lift and penetrate the wafer placement stage. The bottom-measuring sensors are driven by a sensor lifting power device. The wafer placement stage is equipped with a negative pressure channel for negative pressure suction of the wafer, and the negative pressure channel is connected to a negative pressure system.

[0022] S2. The ejector pin is driven to rise by the ejector pin lifting power device. After the ejector pin supports the wafer, it falls down and the wafer lands on the wafer placement stage.

[0023] S3. The negative pressure system draws air through the negative pressure channel, and the wafer is adsorbed and placed on the wafer placement stage.

[0024] S4. The bottom sensor is driven to rise by the sensor lifting power device. The bottom sensor touches the bottom of the wafer placement stage to determine whether the wafer is placed horizontally.

[0025] S5. Based on the data measured by the bottom sensor, the lifting and leveling device adjusts the level and height of the wafer placement stage.

[0026] S6. The turntable drive device drives the wafer turntable to rotate, and the wafer rotates to the corresponding etching angle. In this method, the ejector pin lifting power device drives the ejector pin to rise and effectively support the conveyed wafer. Then, it descends to make the wafer fall onto the wafer placement stage. The negative pressure channel on the wafer placement stage is evacuated by the negative pressure system to effectively adsorb the wafer. Then, the sensor lifting power device drives the bottom sensor to rise and touch the bottom of the wafer. The distance length is calculated to determine whether the wafer is horizontal. Then, the lifting and leveling device is used to control the wafer surface to be in a horizontal state. Finally, the turntable drive device drives the rotation to ensure that the wafer is in the same position when it is repeatedly etched, so as to achieve accurate etching.

[0027] Furthermore, in step S4, the upper disc has a receiving groove corresponding to the bottom-measuring sensor, and a mounting base is installed in the receiving groove. A sensor driving cylinder is vertically inserted into the mounting base. The upper surface of the mounting base is a reference surface, and the bottom of the sensor driving cylinder is in contact with the reference surface. The mounting base has an airflow channel communicating with the sensor driving cylinder, and the airflow channel is connected to the cylinder driving air source. The bottom-measuring sensor is lifted and lowered on the sensor driving cylinder. The sensor driving cylinder also has a sensor wiring harness connected to the bottom-measuring sensor. The upper disc has an auxiliary fixing device for vertically installing the sensor driving cylinder. The method for installing the bottom-measuring sensor and determining its initial position is as follows:

[0028] A sensor-driven cylinder drives the bottom-measuring sensor to rise and fall. A receiving groove is opened on the upper disc. Using the bottom surface of the receiving groove as a reference, the mounting base is installed on the receiving groove. The sensor-driven cylinder is inserted and installed on the mounting base. Using the upper surface of the mounting base as a reference, after the bottom of the sensor-driven cylinder contacts the upper surface of the mounting base, an auxiliary fixing device assists in fixing the sensor-driven cylinder, thus determining the initial position of the bottom-measuring sensor. Using the receiving groove as a preliminary reference ensures the stability of the mounting base. Then, using the upper surface of the mounting base as a reference, the sensor-driven cylinder is installed. Reducing the contact support area facilitates improved reference accuracy and ensures fast and accurate installation.

[0029] Furthermore, in step S6, the turntable driving device includes a rotating connecting rod fixedly mounted on the upper disk and rotating synchronously with the wafer turntable. A push block is horizontally and linearly slidably mounted on the base plate to push the rotating connecting rod. The end of the push block is tightly against the side of the rotating connecting rod. The push block is driven by a linear pushing power device. The base plate is provided with a reset structure connected to the rotating connecting rod to pull and rotate the wafer turntable. The base plate is also provided with a limiting structure to restrict the rotation range of the rotating connecting rod following the wafer turntable. The rotation adjustment method of the wafer turntable is as follows:

[0030] A linear drive power unit drives the push block to extend and retract linearly. The push block extends to push the rotating connecting rod, which swings forward, causing the wafer turntable to rotate until it hits the limit structure and stops rotating. Then, the push block retracts, and the reset structure pulls the rotating connecting rod to swing backward. At the same time, the push block always presses against the rotating connecting rod, completing the rotation adjustment of the wafer turntable. By driving the push block to extend and retract linearly through the linear drive power unit, the movement of the rotating connecting rod can be directly pushed, thereby driving the wafer turntable to rotate. During rotation, only the push block needs to retract, and the reset structure pulls the rotating connecting rod. The driving method is simple and convenient.

[0031] Furthermore, in step S5, the lifting and leveling device includes four lifting mounting frames fixedly installed on the upper disc. These four lifting mounting frames are evenly arranged circumferentially around the wafer placement stage. Each lifting mounting frame has a vertically sliding sliding seat, driven by a worktable lifting power device. Two sliding seats are located on the X diameter and are defined as X sliding seats, while the other two are located on the Y diameter and are defined as Y sliding seats. Each X sliding seat has an X adjusting block fixedly installed, and each Y sliding seat has a Y adjusting block fixedly installed. The worktable is fixed to the X and Y adjusting blocks. The X-adjustment block is divided into an upper X-layer block and a lower X-layer block. A Y-oriented connecting block is provided between the upper X-layer block and the lower X-layer block. An X-oriented connecting block is provided between the lower X-layer block and the X-slider. Gaps are provided between the upper X-layer block and the lower X-layer block, and between the lower X-layer block and the X-slider. The Y-adjustment block is divided into an upper Y-layer block and a lower Y-layer block. An X-oriented connecting block is provided between the upper Y-layer block and the lower Y-layer block. A Y-oriented connecting block is provided between the lower Y-layer block and the Y-slider. Gaps are provided between the upper Y-layer block and the lower Y-layer block, and between the lower Y-layer block and the Y-slider. The horizontal adjustment method of the wafer placement stage is as follows:

[0032] After the wafer is placed on the wafer placement stage, when the two X-sliders move up and down, the Y-connecting blocks on the X-sliders twist, causing the wafer placement stage to swing up and down in the X direction. The Y-connecting blocks on the Y-sliders also twist, compressing and widening the gaps on both sides of the Y-connecting blocks respectively. When the two Y-sliders move up and down, the X-connecting blocks on the Y-sliders twist, causing the wafer placement stage to swing up and down in the Y direction. The X-connecting blocks on the X-sliders also twist, completing the horizontal adjustment of the wafer placement stage. Since there are gaps between the X-adjustment blocks and the Y-adjustment blocks, the X-connecting blocks and Y-connecting blocks can deform through the gaps when twisting. Because the wafer placement stage is closer to the X-sliders when the X-sliders move up and down, the adjustment range is large. Therefore, the Y-connecting blocks are placed between the upper and lower X-sliders. The Y-sliders are in the middle of the horizontal adjustment, so the adjustment range is small. The Y-connecting blocks are placed between the lower Y-sliders and the Y-sliders. Conversely, the same applies when the Y-sliders move up and down. The structure is simple and the adjustment is convenient.

[0033] Furthermore, the auxiliary fixing device includes an auxiliary rod vertically fixed on the upper disc, with a clamping block between the auxiliary rod and the sensor drive cylinder for mutual clamping; the auxiliary fixing device also includes an auxiliary positioning component, which has an inner positioning sleeve fitted on the auxiliary rod and an outer positioning sleeve fitted on the sensor drive cylinder, with the clamping block located above the auxiliary positioning component; the auxiliary positioning component initially constrains the auxiliary rod and the sensor drive cylinder to be parallel and aligned for insertion into the mounting base through the inner and outer positioning sleeves, and the clamping block clamps and fixes the sensor drive cylinder and the auxiliary rod, with the bottom of the sensor drive cylinder pressed against the mounting base; the auxiliary positioning component can first limit the sensor drive cylinder to ensure parallel cooperation between the sensor drive cylinder and the auxiliary rod, and then the clamping block can fix it, so that the sensor drive cylinder can be accurately vertically fixed and drive the bottom-measuring sensor to rise and fall accurately.

[0034] Furthermore, in step S6, the base plate is also equipped with a sensing device for detecting the movement position of the push block. The sensing device works in conjunction with the limiting stop to limit the movement. The sensing device is a grating ruler, which is fixed on the push block to detect the movement distance of the push block. The grating ruler is used to detect the linear extension distance of the push block, and the linear distance corresponds to the angle of rotation of the wafer turntable. The grating ruler can quickly determine the movement distance of the push block, thereby calculating the rotation angle accurately.

[0035] Furthermore, in step S5, after the wafer turntable is leveled, the sensor-driven cylinder drives the bottom sensor to rise to detect whether the wafer is level. Then, the X and Y sliding blocks are simultaneously raised and lowered to adjust the distance between the wafer and the mask. This ensures that the wafer is in an accurate level state after adjustment before height adjustment is performed, thereby improving etching accuracy. Attached Figure Description

[0036] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0037] Figure 1 This is a perspective view of an embodiment of the present invention;

[0038] Figure 2 This is a schematic diagram of the structure on the base plate of an embodiment of the present invention;

[0039] Figure 3 This is a schematic diagram of the lifting and leveling device according to an embodiment of the present invention;

[0040] Figure 4 This is a structural schematic diagram of the pin lifting power device in an embodiment of the present invention;

[0041] Figure 5 This is a schematic diagram of the turntable drive device according to an embodiment of the present invention;

[0042] Figure 6 This is a schematic diagram of the bottom-measuring sensor according to an embodiment of the present invention;

[0043] Figure 7 This is a schematic diagram of the mounting base and sensor drive cylinder in an embodiment of the present invention;

[0044] Figure 8 This is a schematic diagram of the structure of the frustum in an embodiment of the present invention;

[0045] Figure 9 This is a schematic diagram of the installation structure of the bottom-measuring sensor according to an embodiment of the present invention;

[0046] In the attached diagram: 1. Base plate; 2. Wafer turntable; 3. Upper disk; 4. Housing; 5. Worktable; 6. Wafer placement stage; 7. Ejector pin; 8. Bottom sensor; 9. Negative pressure channel; 10. Annular arc-shaped protrusion; 11. Negative pressure suction port; 12. Rotating connecting rod; 13. Push block; 14. Receiving groove; 15. Mounting base; 16. Sensor drive cylinder; 17. Airflow channel; 18. Sensor wiring harness; 19. Lifting mounting bracket; 20. X sliding seat; 21. Insertion port; 22. Y sliding seat; 23. X adjusting block; 231. X upper layer block; 232. X lower layer block; 24. Y adjusting block; 241. Y upper layer block; 242. Y lower layer block; 25. X connecting block; 26. Y 27. Connecting block; 28. Screw; 29. ​​Connecting tension spring; 30. Vertical slide; 31. Support base; 32. Strip-shaped through hole; 33. Eccentric rotating rod; 34. Ejector pin drive motor; 35. Arc protrusion; 36. Sliding guide rail; 37. Voice coil motor; 38. Motor fixing plate; 39. Mounting plate; 40. Reset fixing rod; 41. Reset tension spring; 42. Limiting stop bar; 43. Grating ruler; 44. Cover; 45. Pipe protrusion; 46. Sealing groove; 47. Auxiliary rod; 48. Fixing clamp; 49. Limiting step; 40. Auxiliary positioning component; 491. Inner positioning sleeve; 492. Outer positioning sleeve; 50. Connecting rod; 51. Mounting pad; 52. Semicircular groove. Detailed Implementation

[0047] The present invention will be further described in detail below through specific embodiments.

[0048] like Figures 1 to 9 As shown in the figure, an embodiment of the present invention discloses an adjustment method for a wafer adjustment stage, which includes the following steps:

[0049] S1. Equipment preparation: A wafer adjustment stage is provided, including a base plate 1. A wafer turntable 2 is rotatably mounted on the base plate 1. A turntable drive device for driving the wafer turntable 2 to rotate is provided on the base plate 1. The wafer turntable 2 includes an upper disk 3 located at the bottom and a shell 4 surrounding the upper disk 3. A lifting and leveling device is installed on the upper disk 3. A worktable 5 is installed on the lifting and leveling device. A wafer placement stage 6 is installed on the worktable 5. The lifting and leveling device drives the wafer placement stage 6 to lift and level. A pin 7 for supporting the lifting and lowering of the wafer is lifted and lowered through the wafer placement stage 6 and is installed on the upper disk 3. The pin 7 is driven by a pin 7 lifting power device. The upper disk 3 is also provided with multiple bottom-testing sensors 8 that lift and lower through the wafer placement stage 6. The bottom-testing sensors 8 are driven by a sensor lifting power device. The wafer placement stage 6 is provided with a negative pressure channel 9 for negative pressure suction of the wafer. The negative pressure channel 9 is connected to a negative pressure system.

[0050] S2. The ejector pin 7 is driven to rise by the lifting power device of the ejector pin 7. After supporting the wafer, the ejector pin 7 falls down and the wafer lands on the wafer placement stage 6.

[0051] S3. The negative pressure system draws air through the negative pressure channel 9, and the wafer is adsorbed and placed on the wafer placement stage 6.

[0052] S4. Drive the bottom sensor 8 to rise through the sensor lifting power device. The bottom sensor 8 touches the bottom of the wafer placement stage 6 to determine whether the wafer is placed horizontally.

[0053] S5. Based on the data measured by the bottom sensor 8, the lifting and leveling device adjusts the level and height of the wafer placement stage 6.

[0054] S6. The turntable drive device drives the wafer turntable 2 to rotate, and the wafer rotates to the corresponding etching angle. In this method, the lifting power device of the ejector pin 7 drives the ejector pin 7 to rise to effectively support the conveyed wafer, and then lowers it to make the wafer fall onto the wafer placement stage 6. The negative pressure channel 9 on the wafer placement stage 6 is evacuated by the negative pressure system to effectively adsorb the wafer. Then, the sensor lifting power device drives the bottom sensor 8 to rise to touch the bottom of the wafer, calculates the distance length to determine whether the wafer is horizontal, and then controls the wafer surface to be in a horizontal state through the lifting and leveling device. Finally, the turntable drive device drives the rotation to ensure that the wafer is in the same position when it is repeatedly etched, so as to achieve accurate etching.

[0055] Preferably, in step S4, the upper disc 3 is provided with a receiving groove 14 corresponding to the bottom-measuring sensor 8. A mounting base 15 is installed in the receiving groove 14. A sensor driving cylinder 16 is vertically inserted into the mounting base 15. The upper surface of the mounting base 15 is a reference surface, and the bottom of the sensor driving cylinder 16 contacts the reference surface. The mounting base 15 is provided with an airflow channel 17 communicating with the sensor driving cylinder 16. The airflow channel 17 is connected to a cylinder driving air source. The bottom-measuring sensor 8 is vertically mounted on the sensor driving cylinder 16. The sensor driving cylinder 16 is also provided with a sensor wiring harness 18 connecting to the bottom-measuring sensor 8. The upper disc 3 is provided with an auxiliary fixing device for vertically mounting the sensor driving cylinder 16. The method for installing and determining the initial position of the bottom-measuring sensor 8 is as follows:

[0056] The sensor-driven cylinder 16 drives the bottom-measuring sensor 8 to rise and fall. A receiving groove 14 is opened on the upper disc 3. The mounting base 15 is installed on the receiving groove 14 with the bottom surface of the receiving groove 14 as the reference. The sensor-driven cylinder 16 is inserted and installed on the mounting base 15. With the upper surface of the mounting base 15 as the reference, after the bottom of the sensor-driven cylinder 16 contacts the upper surface of the mounting base 15, the auxiliary fixing device assists in the fixed installation of the sensor-driven cylinder 16, thus completing the determination of the initial position of the bottom-measuring sensor 8. Using the receiving groove 14 as the initial reference ensures that the mounting base 15 is set stably. Then, the upper surface of the mounting base 15 is used as the reference to complete the installation of the sensor-driven cylinder 16. Reducing the contact support area facilitates the improvement of reference accuracy and ensures fast and accurate installation.

[0057] Preferably, in step S6, the turntable driving device includes a rotating connecting rod 12 fixedly mounted on the upper disk 3 and rotating synchronously with the wafer turntable 2. A push block 13 is horizontally and linearly slidably mounted on the base plate 1 to push the rotating connecting rod 12. The end of the push block 13 is in close contact with the side of the rotating connecting rod 12. The push block 13 is driven by a linear pushing power device. The base plate 1 is provided with a reset structure connected to the rotating connecting rod 12 to pull and rotate the wafer turntable 2. The base plate 1 is provided with a limiting structure to restrict the rotation range of the rotating connecting rod 12 following the wafer turntable 2. The rotation adjustment method of the wafer turntable 2 is as follows:

[0058] A linear drive power device drives the push block 13 to extend and retract linearly. The push block 13 extends to push the rotating connecting rod 12, and the rotating connecting rod 12 swings forward to drive the wafer turntable 2 to rotate until the rotating connecting rod 12 hits the limit structure and stops rotating. Then the push block 13 retracts, and the reset structure pulls the rotating connecting rod 12 to swing backward. At the same time, the push block 13 always presses against the rotating connecting rod 12, completing the rotation adjustment of the wafer turntable 2. By driving the push block 13 to extend and retract linearly through the linear drive power device, the movement of the rotating connecting rod 12 can be directly pushed, thereby driving the wafer turntable 2 to rotate. When rotating, only the push block 13 needs to retract, and at the same time the reset structure pulls the rotating connecting rod 12. The driving method is simple and convenient.

[0059] Preferably, in step S5, the lifting and leveling device includes four lifting mounting frames 19 fixedly installed on the upper disc 3. The four lifting mounting frames 19 are evenly arranged in a circle with the wafer placement stage 6 as the center. Each lifting mounting frame 19 has a sliding seat vertically slidably installed on it. The sliding seats are driven by the lifting power device of the worktable 5. Two of the sliding seats are located on the X diameter and are defined as X sliding seats 20, and the other two sliding seats are located on the Y diameter and are defined as Y sliding seats 22. X adjustment blocks 23 are fixedly installed on each X sliding seat 20, and Y adjustment blocks 24 are fixedly installed on each Y sliding seat 22. The worktable 5 is fixed on the X adjustment blocks 23 and Y adjustment blocks 24. The X adjustment blocks 23 are divided into an upper X block 231 and a lower X block 231. Block 232, wherein a Y-oriented Y-connecting block 26 is provided between the upper X-block 231 and the lower X-block 232, and an X-oriented X-connecting block 25 is provided between the lower X-block 232 and the X-slider 20; gaps are provided between the upper X-block 231 and the lower X-block 232, and between the lower X-block 232 and the X-slider 20; the Y-adjusting block 24 is divided into an upper Y-block 241 and a lower Y-block 242, wherein an X-oriented X-connecting block 25 is provided between the upper Y-block 241 and the lower Y-block 242, and a Y-oriented Y-connecting block 26 is provided between the lower Y-block 242 and the Y-slider 22; gaps are provided between the upper Y-block 241 and the lower Y-block 242, and between the lower Y-block 242 and the Y-slider 22; the horizontal adjustment method of the wafer placement stage 6 is as follows:

[0060] After the wafer is placed on the wafer placement stage 6, when the two X-slide seats 20 slide up and down, the Y-connecting blocks 26 on the X-slide seats 20 twist respectively, causing the wafer placement stage 6 to swing up and down on both sides in the X direction. The Y-connecting blocks 26 on the Y-slide seats 22 also twist accordingly, and the gaps on both sides of the Y-connecting blocks 26 are compressed and expanded respectively. When the two Y-slide seats 22 slide up and down, the X-connecting blocks 25 on the Y-slide seats 22 twist respectively, causing the wafer placement stage 6 to swing up and down on both sides in the Y direction. The X-connecting blocks 25 on the X-slide seats 20 also twist accordingly, completing the wafer placement stage 6. The horizontal adjustment is as follows: Since there is a gap between the X adjustment block 23 and the Y adjustment block 24, the X connecting block 25 and the Y connecting block 26 can deform through the gap when they are twisted. Since the wafer placement stage 6 is close to the X sliding seat 20 when the X sliding seat 20 is raised and lowered, the adjustment range is large. Therefore, the Y connecting block 26 is set between the upper X block 231 and the lower X block 232. The Y sliding seat 22 is located in the middle of the horizontal adjustment, so the range is small. The Y connecting block 26 is set between the lower Y block 242 and the Y sliding seat 22. Conversely, the same applies when the Y sliding seat 22 is raised and lowered. The structure is simple and the adjustment is convenient.

[0061] Preferably, the auxiliary fixing device includes an auxiliary rod 46 vertically fixed on the upper disc 3, and a fixing block 47 clamping the auxiliary rod 46 and the sensor driving cylinder 16; the auxiliary fixing device also includes an auxiliary positioning member 49, which is provided with an inner positioning sleeve 491 fitted on the auxiliary rod 46 and an outer positioning sleeve 492 fitted on the sensor driving cylinder 16, and the fixing block 47 is located above the auxiliary positioning member 49; the auxiliary positioning member 49 is positioned by the inner positioning sleeve 491 and the outer positioning sleeve 492. The sleeve 492 initially constrains the auxiliary rod 46 and the sensor drive cylinder 16 to be parallel and aligned, and inserts them into the mounting base 15. The fixing block 47 clamps and fixes the sensor drive cylinder 16 and the auxiliary rod 46, and the bottom of the sensor drive cylinder 16 is pressed against the mounting base 15. The auxiliary positioning component 49 can first limit the sensor drive cylinder 16 to ensure that the cooperation between the sensor drive cylinder 16 and the auxiliary rod 46 is parallel. Then, the fixing block 47 can fix it, so that the sensor drive cylinder 16 can be accurately vertically fixed and drive the bottom measuring sensor 8 to rise and fall accurately.

[0062] Preferably, in step S6, the base plate 1 is further provided with a sensing device for detecting the moving position of the push block 13. The sensing device cooperates with the limiting stop to limit the movement. The sensing device is a grating ruler 42, which is fixed on the push block 13 to detect the moving distance of the push block 13. The grating ruler 42 is used to detect the linear extension distance of the push block 13, and the linear distance corresponds to the rotation angle of the wafer turntable 2. The grating ruler 42 can quickly determine the moving distance of the push block 13, thereby calculating the rotation angle accurately.

[0063] Preferably, in step S5, after the wafer turntable 2 is leveled, the sensor-driven cylinder 16 drives the bottom sensor 8 to rise to detect whether the wafer is level. Then, the X slide 20 and Y slide 22 are simultaneously raised and lowered to adjust the distance between the wafer and the mask. This ensures that the wafer is in an accurate level state after adjustment before height adjustment is performed to improve etching accuracy.

[0064] Furthermore, this embodiment of the invention also discloses a wafer adjustment stage for implementing this adjustment method.

[0065] like Figures 1 to 9 As shown, a wafer adjustment stage includes a base plate 1, on which a wafer turntable 2 is rotatably mounted. The base plate 1 is equipped with a turntable drive device for driving the wafer turntable 2 to rotate. The wafer turntable 2 includes an upper disk 3 located at the bottom and a housing 4 surrounding the upper disk 3. A lifting and leveling device is mounted on the upper disk 3, and a worktable 5 is mounted on the lifting and leveling device. A wafer placement stage 6 is mounted on the worktable 5. The lifting and leveling device drives the wafer placement stage 6 to lift and level. A pin 7 is movably mounted on the upper disk 3, penetrating the wafer placement stage 6 to support wafer lifting. The pin 7 is driven by a pin 7 lifting power device. The upper disk 3 is also equipped with multiple bottom-sensing sensors 8 that move through the wafer placement stage 6. The wafer placement stage 6 is equipped with a negative pressure channel 9 for negative pressure suction of the wafer, and the negative pressure channel 9 is connected to a negative pressure system.

[0066] In this embodiment, the wafer placement stage 6 and the worktable 5 are fixedly connected to each other, and the worktable 5 and the outer shell 4 are fitted with a gap to facilitate the horizontal adjustment of the worktable 5. The wafer placement stage 6 is provided with several layers of annular arc-shaped protrusions 10. The annular arc-shaped protrusions 10 are provided with negative pressure exhaust ports 11 that communicate with the negative pressure channel 9. Then, the negative pressure system is used to extract air from the negative pressure exhaust ports 11. When the wafer is pressed on the annular arc-shaped protrusions 10, a negative pressure is formed inside the annular arc-shaped protrusions 10, which can effectively adsorb the wafer.

[0067] like Figure 5As shown, the turntable driving device includes a rotating connecting rod 12 fixedly mounted on the upper disc 3 and rotating synchronously with the wafer turntable 2. A push block 13, which pushes the rotating connecting rod 12, is horizontally and linearly slidably mounted on the base plate 1. The end of the push block 13 is in close contact with the side of the rotating connecting rod 12. The push block 13 is driven by a linear push power device. The base plate 1 is provided with a reset structure that is connected to the rotating connecting rod 12 and pulls to make the wafer turntable 2 rotate. The base plate 1 is also provided with a limiting structure that restricts the rotation range of the rotating connecting rod 12 following the wafer turntable 2. The push block 13 is driven by the linear push power device to push, and then the push block 13 pushes the rotating connecting rod 12, making the wafer turntable 2 rotate. When the wafer turntable 2 needs to rotate, the reset structure drives the rotation, and at the same time, the push block 13 pushes the rotating connecting rod 12 and retracts. This effectively drives the wafer turntable 2 to rotate stably and accurately, with a simple structure and improved practicality.

[0068] like Figure 8 and Figure 9 As shown, the upper disc 3 has a receiving groove 14 corresponding to the bottom-measuring sensor 8. A mounting base 15 is installed in the receiving groove 14. A sensor driving cylinder 16 is vertically inserted into the mounting base 15. The upper surface of the mounting base 15 is a reference surface, and the bottom of the sensor driving cylinder 16 contacts the reference surface. The mounting base 15 has an airflow channel 17 communicating with the sensor driving cylinder 16. The airflow channel 17 is connected to a cylinder driving air source. The bottom-measuring sensor 8 is vertically mounted on the sensor driving cylinder 16. The upper disk 6 is also equipped with a sensor harness 18 for connecting the bottom-measuring sensor 8. The upper disk 3 is equipped with an auxiliary fixing device for vertically mounting the auxiliary sensor drive cylinder 16. Inserting the sensor drive cylinder 16 into the mounting base 15 ensures effective communication with the airflow channel 17, making installation convenient. The mounting base 15 is installed in the receiving groove 14, ensuring stable installation. Based on this, the installation is effectively vertical, and the measurement is accurate. Then, the auxiliary fixing device ensures that the sensor drive cylinder 16 can rise and fall stably. The sensor harness 18 enables the bottom-measuring sensor 8 to effectively detect, improving the usage effect.

[0069] like Figure 2As shown, the lifting and leveling device includes four lifting mounting frames 19 fixedly mounted on the upper disc 3. The four lifting mounting frames 19 are evenly arranged in a circle with the wafer placement stage 6 as the center. Each lifting mounting frame 19 has a sliding seat vertically slidably mounted on it. The sliding seats are driven by a worktable lifting power device, which includes a worktable lifting cylinder. Two of the sliding seats are located on the X diameter and are defined as X sliding seats 20, and the other two sliding seats are located on the Y diameter and are defined as Y sliding seats 22. X adjustment blocks 23 are fixedly mounted on each X sliding seat 20, and Y adjustment blocks 23 are fixedly mounted on each Y sliding seat 22. 4. The worktable 5 is fixed on the X-adjustment block 23 and the Y-adjustment block 24. The X-adjustment block 23 is divided into an upper X-block 231 and a lower X-block 232. A Y-oriented connecting block 26 is provided between the upper X-block 231 and the lower X-block 232. An X-oriented connecting block 25 is provided between the lower X-block 232 and the X-sliding seat 20. Gaps are provided between the upper X-block 231 and the lower X-block 232, and between the lower X-block 232 and the X-sliding seat 20. The Y-adjustment block 24 is divided into an upper Y-block 241 and a lower Y-block 242. An X-oriented connecting block 25 is provided between the upper Y-block 241 and the lower Y-block 242. A Y-oriented connecting block 26 is provided between the lower Y block 242 and the Y sliding seat 22. Gaps are provided between the upper Y block 241 and the lower Y block 242, and between the lower Y block 242 and the Y sliding seat 22. The lifting mounting brackets 19 are evenly distributed at four positions on the circumference of the upper disc 3, ensuring that the four lifting mounting brackets 19 are symmetrical in pairs. Then, the lifting cylinders of the worktable 5 on the lifting mounting brackets 19 can drive the sliding seats to rise and fall. When the four sliding seats rise and fall synchronously, the worktable 5 can be raised and lowered as a whole. When horizontal adjustment is required, the sliding seats on the same diameter are raised and lowered. When the two X sliding seats 20 rise and fall, the X sliding... When the Y-connecting block 26 on the moving seat 20 is twisted, the Y-connecting block 26 on the Y-sliding seat 22 also twists. The gaps on both sides of the Y-connecting block 26 are compressed and expanded respectively, which enables the wafer placement stage 6 to be effectively adjusted horizontally. Since the wafer placement stage 6 is close to the X-sliding seat 20 when the X-sliding seat 20 is raised or lowered, the adjustment range is large. Therefore, the Y-connecting block 26 is set between the X upper block 231 and the X lower block 232. The Y-sliding seat 22 is located in the middle of the horizontal adjustment, so the range is small. The Y-connecting block 26 is set between the Y lower block 232 and the Y-sliding seat 22. Conversely, the same applies when the Y-sliding seat 22 is raised or lowered. The structure is simple and the adjustment is convenient.

[0070] Furthermore, the bottom of the workbench 5 is provided with a groove for mounting with the X adjustment block 23 and the Y adjustment block 24. The workbench 5 is fixedly mounted to the X adjustment block 23 and the Y adjustment block 24 by screws 27. The groove allows the workbench 5 to be quickly and accurately fastened onto the X adjustment block 23 and the Y adjustment block 24, and then fixed by screws 27. This ensures that when adjusting to a horizontal position, the workbench 5 can move synchronously with the X adjustment block 23 and the Y adjustment block 24, making the installation accurate and secure.

[0071] A connecting tension spring 28 is also provided between the upper disc 3 and the worktable 5 to ensure that the worktable 5 can be effectively pressed against the X adjustment block 23 and the Y adjustment block 24. When the worktable 5 rises, the connecting tension spring 28 can effectively pull, so that the worktable 5 returns to the initial position quickly and accurately.

[0072] like Figure 4 As shown, the upper disk 3 is provided with a vertical slide 29, and a support seat 30 for supporting the ejector pin 7 is fixedly installed on the vertical slide 29. A horizontally extending strip-shaped through hole 31 is provided below the support seat 30. The lifting power device of the ejector pin 7 includes an ejector pin drive motor 33 fixedly installed on the upper disk 3. The output end of the ejector pin drive motor 33 is connected to an eccentric rotating rod 32, which is constrained within the strip-shaped through hole 31. A mounting plate 38 supporting the ejector pin drive motor 33 is provided in the middle of the upper disk 3. The mounting plate 38 makes the ejector pin drive motor 33 horizontally placed, and then drives the eccentric rotating rod 32 to rotate, so that the eccentric rotating rod 32 drives the support seat 30 with the strip-shaped through hole 31 to rise and fall. The support seat 30 slides along the vertical slide 29, and the rising and falling is accurate, ensuring that the wafer can be accurately supported and placed on the wafer placement stage 6.

[0073] like Figure 5As shown, the push block 13 has an arc-shaped protrusion 34 at its end, which is in close contact with the side of the rotating connecting rod 12. A sliding guide rail 35 is provided on the base plate 1, and the push block 13 is slidably mounted on the base plate 1 via the sliding guide rail 35. The push block 13 and the rotating connecting rod 12 are not fixedly connected; therefore, they will deviate when the rotating connecting rod 12 is pushed to rotate. The arc-shaped protrusion 34 facilitates stable relative movement with the rotating connecting rod 12 during push-pull and ensures stable and accurate pushing. Furthermore, when the arc-shaped protrusion 34 pushes the rotating connecting rod 12, since there is a certain distance between the rotating connecting rod 12 and the wafer turntable 2, the rotation angle will be adjusted accordingly. The swing distance of the connecting rod 12 is much greater than the rotation distance of the wafer turntable 2, thus reducing the impact of the swing error of the rotating connecting rod 12 and improving the performance. The linear drive power device includes a voice coil motor 36, which is fixedly mounted on the motor mounting plate 37 and drives the push block 13 to move horizontally in a linear fashion. The voice coil motor 36 has the characteristics of simple structure, small size, high speed, and fast acceleration response, thus making the structure more compact. The sliding guide rail 35 is a cross ball guide rail, with one part fixed to the push block 13 and the other part fixed to the base plate 1. This allows the push plate to slide linearly and effectively determine the direction of linear movement.

[0074] The reset structure includes a reset fixing rod 39 vertically fixed on the base plate 1. A reset tension spring 40 is provided between the end of the reset fixing rod 39 and the end of the rotating connecting rod 12. The reset tension spring 40 can always pull the rotating connecting rod 12, so that the rotating connecting rod 12 can be pulled back and cooperate with the push block 13 to complete the rotation of the wafer turntable 2. The structure is simple and easy to use. The connection between the reset tension spring 40 and the end of the rotating connecting rod 12 can maximize the force of the reset pull rope spring and improve the reset effect.

[0075] The limiting structure includes limiting stops 41 located on both sides of the rotating connecting rod 12, and the limiting stops 41 are fixedly installed on the base plate 1. The base plate 1 is also provided with a sensing device for detecting the movement position of the push plate, and the sensing device cooperates with the limiting stops 41 to limit the movement. There are two limiting stops 41, located on both sides of the rotating connecting rod 12, which effectively block the swing range of the rotating connecting rod 12, prevent the wafer turntable 2 from rotating excessively, and improve the rotation accuracy. The sensing device is a grating ruler 42, which is fixed on the push block 13 and used to detect the movement distance of the push block 13. Since the push block 13 pushes the rotating connecting rod 12, the rotating connecting rod 12 can only swing back and forth between the limiting stops 41. The extension and retraction distance of the push block 13 corresponds to the rotation angle of the wafer turntable 2. Therefore, by detecting the distance moved by the push block 13 through the grating ruler 42, the rotation angle can be accurately obtained, ensuring rotation accuracy and improving the performance.

[0076] The base plate 1 is fixedly installed with a cover 43 that covers the push block 13; it works in conjunction with the motor fixing plate 37 to effectively protect the push block 13 and ensure its safe and stable pushing.

[0077] like Figure 7 As shown, the mounting base 15 is provided with an insertion port 21, and the bottom of the sensor driving cylinder 16 is provided with a pipe protrusion 44 that cooperates with the insertion port 21. The upper end face of the mounting base 15 is provided with a sealing groove 45 at the edge of the insertion port 21. The sealing groove 45 is provided with a sealing ring that cooperates with the lower end face of the pipe protrusion 44 for sealing. Inserting or pulling out the pipe protrusion 44 can complete the connection or disconnection with the airflow channel 17, and the sealing ring can effectively improve the sealing effect, making the sensor driving cylinder 16 more stable.

[0078] like Figure 6 As shown, the auxiliary fixing device includes an auxiliary rod 46 vertically fixed on the upper disc 3. A fixing block 47 clamps the auxiliary rod 46 and the sensor driving cylinder 16 together. There are three receiving slots 14 on the upper disc 3, and three mounting bases 15 are respectively installed in the three receiving slots 14. The sensor driving cylinder 16 is inserted into each mounting base 15. The auxiliary rod 46 is then set parallel to the sensor driving cylinder 16. The fixing block 47 can effectively fix the sensor driving cylinder 16 with the auxiliary rod 46 as the reference. The fixing block 47 has a simple structure and is easy to use. The fixing block 47 consists of two mirror-arranged fixing half-blocks. The fixing half-blocks have semi-circular grooves 52 that fit with the auxiliary rod 46 and the sensor driving cylinder 16. In this way, the semi-circular grooves 52 on the two fixing half-blocks form a complete circular groove to fix the auxiliary rod 46 and the sensor driving cylinder 16.

[0079] The auxiliary fixing device further includes an auxiliary positioning component 49, which has an inner positioning sleeve 491 fitted onto the auxiliary rod 46 and an outer positioning sleeve 492 fitted onto the sensor driving cylinder. The fixing block 47 is located above the auxiliary positioning component 49. The auxiliary rod 46 has a limiting step 48, and the inner positioning sleeve 491 abuts against the limiting step 48. First, the auxiliary positioning component 49 is fitted onto the sensor driving cylinder 16, and then the inner positioning sleeve 491 of the auxiliary positioning component 49 is fitted onto the auxiliary rod 46. Next, the sensor drive cylinder 16 is inserted into the mounting base 15, completing the engagement between the sensor drive cylinder 16 and the mounting base 15. Then, the fixing clamp 47 is fixed on the auxiliary positioning component 49 to further ensure stable fixation and to effectively press the sensor drive cylinder 16 onto the mounting base 15. The limiting step 48 locks the inner positioning sleeve 491, thus ensuring that the auxiliary positioning component 49 will not fall down, thereby limiting the auxiliary rod 46 and the sensor drive cylinder 16 at a certain height, so that the sensor drive cylinder 16 can be installed more accurately and the constraint is stable and reliable.

[0080] like Figure 8 and Figure 9 As shown, the receiving groove 14 is a straight-line hole, and the mounting base 15 is provided with a mounting pad 51 that fits into the straight-line hole. The mounting pad 51 is installed in the straight-line hole, and the mounting base 15 and the mounting pad 51 are detachably fixed. The outlet of the airflow channel 17 is located on the side of the mounting base 15. First, the mounting pad 51 is fixedly installed in the straight-line hole, and then the mounting base 15 is installed on the mounting pad 51 to ensure that the airflow channel 17 on the mounting base 15 is exposed, which facilitates connection and replacement, and improves convenience.

[0081] In this embodiment, there are three bottom-measuring sensors 8 evenly distributed around the circumference, and there are also three corresponding sensor-driving cylinders 16. The auxiliary positioning component 49 also includes a connecting rod portion 50 that sequentially connects the outer positioning sleeve portion 492. In this way, the auxiliary positioning component 49 forms a whole, constraining all three bottom-measuring sensors 8. This ensures that the corresponding sensor-driving cylinder 16 and the corresponding auxiliary rod 46 are effectively parallel, while the three sensor-driving cylinders 16 also restrict each other, further improving the installation accuracy. Moreover, all three sensor-driving cylinders 16 can be inserted into the corresponding mounting base 15 at the same time, making installation convenient and improving the usage effect.

[0082] The above-described embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modifications and alterations made to the technical solutions of the present invention without departing from the spirit of the present invention shall fall within the protection scope defined by the claims of the present invention.

Claims

1. A method for adjusting a wafer adjustment stage, characterized in that: The adjustment method for this wafer adjustment stage includes the following steps: S1. Equipment preparation: A wafer adjustment stage is provided, including a base plate on which a wafer turntable is rotatably mounted. The base plate is equipped with a turntable drive device for rotating the wafer turntable. The wafer turntable includes an upper disk at the bottom and a shell surrounding the upper disk. A lifting and leveling device is mounted on the upper disk, and a worktable is mounted on the lifting and leveling device. A wafer placement stage is mounted on the worktable. The lifting and leveling device drives the wafer placement stage to lift and level. A pin is lifted and leveled on the upper disk, penetrating the wafer placement stage to support wafer lifting. The pin is driven by a pin lifting power device. The upper disk is also equipped with multiple bottom-measuring sensors that lift and penetrate the wafer placement stage. The bottom-measuring sensors are driven by a sensor lifting power device. The wafer placement stage is equipped with a negative pressure channel for negative pressure suction of the wafer, and the negative pressure channel is connected to a negative pressure system. S2. The ejector pin is driven to rise by the ejector pin lifting power device. After the ejector pin supports the wafer, it falls down and the wafer lands on the wafer placement stage. S3. The negative pressure system draws air through the negative pressure channel, and the wafer is adsorbed and placed on the wafer placement stage. S4. The bottom sensor is driven to rise by the sensor lifting power device. The bottom sensor touches the bottom of the wafer placement stage to determine whether the wafer is placed horizontally. S5. Based on the data measured by the bottom sensor, the lifting and leveling device adjusts the level and height of the wafer placement stage. S6. The turntable drive device drives the wafer turntable to rotate, and the wafer rotates to the corresponding etching angle.

2. The adjustment method for a wafer adjustment stage as described in claim 1, characterized in that: In step S4, the upper disc has a receiving groove corresponding to the bottom-measuring sensor, and a mounting base is installed in the receiving groove. A sensor driving cylinder is vertically inserted into the mounting base. The upper surface of the mounting base is a reference surface, and the bottom of the sensor driving cylinder is in contact with the reference surface. The mounting base has an airflow channel communicating with the sensor driving cylinder, and the airflow channel is connected to the cylinder driving air source. The bottom-measuring sensor is lifted and lowered on the sensor driving cylinder. The sensor driving cylinder also has a sensor wiring harness connected to the bottom-measuring sensor. The upper disc has an auxiliary fixing device for vertically installing the sensor driving cylinder. The method for installing the bottom-measuring sensor and determining its initial position is as follows: The sensor-driven cylinder drives the bottom-measuring sensor to rise and fall. A receiving groove is opened on the upper disc. The mounting base is installed on the receiving groove with the bottom surface of the receiving groove as the reference. The sensor-driven cylinder is inserted and installed on the mounting base. With the upper surface of the mounting base as the reference, after the bottom of the sensor-driven cylinder contacts the upper surface of the mounting base, the auxiliary fixing device assists in fixing the sensor-driven cylinder, thus completing the determination of the initial position of the bottom-measuring sensor.

3. The adjustment method for a wafer adjustment stage as described in claim 2, characterized in that: In step S6, the turntable driving device includes a rotating connecting rod fixedly mounted on the upper disk and rotating synchronously with the wafer turntable. A push block that pushes the rotating connecting rod is horizontally and linearly slidably mounted on the base plate. The end of the push block is in close contact with the side of the rotating connecting rod. The push block is driven by a linear pushing power device. The base plate is provided with a reset structure connected to the rotating connecting rod to pull and rotate the wafer turntable. The base plate is also provided with a limiting structure that restricts the rotation range of the rotating connecting rod following the wafer turntable. The rotation adjustment method of the wafer turntable is as follows: The linear drive power device drives the push block to extend and retract linearly. The push block extends to push the rotating connecting rod, and the rotating connecting rod swings forward to drive the wafer turntable to rotate until the rotating connecting rod hits the limit structure and stops rotating. Then the push block retracts, and the reset structure pulls the rotating connecting rod to swing backward. At the same time, the push block always presses against the rotating connecting rod, completing the rotation adjustment of the wafer turntable.

4. The adjustment method for a wafer adjustment stage as described in claim 3, characterized in that: In step S5, the lifting and leveling device includes four lifting mounting frames fixedly installed on the upper disc. The four lifting mounting frames are evenly arranged circumferentially around the wafer placement stage. Each lifting mounting frame has a vertically sliding sliding seat, driven by a worktable lifting power device. Two sliding seats are located on the X diameter and defined as X sliding seats, and the other two sliding seats are located on the Y diameter and defined as Y sliding seats. Each X sliding seat has an X adjusting block fixedly installed, and each Y sliding seat has a Y adjusting block fixedly installed. The worktable is fixed to the X and Y adjusting blocks. The X-adjustment block is divided into an upper X-layer block and a lower X-layer block. A Y-oriented connecting block is provided between the upper X-layer block and the lower X-layer block. An X-oriented connecting block is provided between the lower X-layer block and the X-slider. Gaps are provided between the upper X-layer block and the lower X-layer block, and between the lower X-layer block and the X-slider. The Y-adjustment block is divided into an upper Y-layer block and a lower Y-layer block. An X-oriented connecting block is provided between the upper Y-layer block and the lower Y-layer block. A Y-oriented connecting block is provided between the lower Y-layer block and the Y-slider. Gaps are provided between the upper Y-layer block and the lower Y-layer block, and between the lower Y-slider. The horizontal adjustment method of the wafer placement stage is as follows: After the wafer is placed on the wafer placement stage, when the two X-slide seats move up and down, the Y-connecting blocks on the X-slide seats twist respectively, causing the wafer placement stage to swing up and down on both sides in the X direction. The Y-connecting blocks on the Y-slide seats also twist accordingly, and the gaps on both sides of the Y-connecting blocks are compressed and expanded respectively. When the two Y-slide seats move up and down, the X-connecting blocks on the Y-slide seats twist respectively, causing the wafer placement stage to swing up and down on both sides in the Y direction. The X-connecting blocks on the X-slide seats also twist accordingly, thus completing the horizontal adjustment of the wafer placement stage.

5. The adjustment method for a wafer adjustment stage as described in claim 4, characterized in that: The auxiliary fixing device includes an auxiliary rod vertically fixed on the upper disc, and a fixing clamping block that clamps the auxiliary rod and the sensor driving cylinder together. The auxiliary fixing device also includes an auxiliary positioning component, which has an inner positioning sleeve fitted on the auxiliary rod and an outer positioning sleeve fitted on the sensor driving cylinder. The fixing clamping block is located above the auxiliary positioning component. The auxiliary positioning component initially constrains the auxiliary rod and the sensor driving cylinder to be parallel and aligned with each other by the inner and outer positioning sleeves and inserts them into the mounting base. The fixing clamping block clamps and fixes the sensor driving cylinder and the auxiliary rod, and the bottom of the sensor driving cylinder is pressed against the mounting base.

6. The adjustment method for a wafer adjustment stage as described in claim 5, characterized in that: In step S6, the base plate is also provided with a sensing device for detecting the moving position of the push block. The sensing device cooperates with the limiting stop to limit the movement. The sensing device is a grating ruler, which is fixed on the push block to detect the moving distance of the push block. The grating ruler is used to detect the linear extension distance of the push block, and the linear distance corresponds to the angle of rotation of the wafer turntable.

7. The adjustment method for a wafer adjustment stage as described in claim 6, characterized in that: In step S5, after the wafer turntable is leveled, the sensor-driven cylinder drives the bottom sensor to rise to detect whether the wafer is level. Then, the X sliding seat and Y sliding seat are raised and lowered synchronously to adjust the distance between the wafer and the mask.

Images