High-stability packaging device for semiconductor device production

Abstract

The invention discloses a high-stability packaging device for semiconductor device production, and relates to the technical field of semiconductor device production equipment, the high-stability packaging device comprises a driving assembly, six bearing assemblies are arranged at the top of the driving assembly at equal intervals, air exhaust assemblies are arranged in the bearing assemblies, and fixing assemblies are arranged at the bottoms of the bearing assemblies. After the semiconductor substrate is placed in the bearing shell, the semiconductor substrate moves to the position below the first pressing plate under the action of the driving assembly and is pressed, a closed space with the air pressure lower than the external atmospheric pressure is formed below the semiconductor substrate through the arrangement of the air exhaust assembly, and the semiconductor substrate is fixed through the cooperation of the fixing assembly and the air exhaust assembly. The semiconductor substrate is firmly adsorbed and fixed above the perforated rubber plate, the effect of fixing the semiconductor substrate is achieved, the stability of the semiconductor substrate in the follow-up packaging process is ensured, the conditions that the semiconductor device is extruded and damaged and the clamping force is insufficient cannot be caused by the fixing mode, and the packaging quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device production equipment, in particular to a high-stability packaging device for semiconductor device production. Background Art

[0002] In the production process of semiconductor devices, the chip and basic connections are first powered on and tested to obtain a qualified substrate, and then it is combined with the packaging shell to complete the packaging. Packaging is an extremely critical link that directly affects the performance, reliability and service life of semiconductor devices.

[0003] In the prior art, such as Chinese patent publication number CN214176004U, a packaging device for semiconductor device production is disclosed, including a base, fixed seats are fixedly installed on both sides of the top of the base, a frame, a packaging mechanism, and an adjustment mechanism, the adjustment mechanism includes a drive motor, one end of the drive motor extends into a cavity opened inside the base and is fixedly connected to a transmission rod, right-handed threads and left-handed threads are respectively opened on both sides of the outer wall of the transmission rod, and the right-handed threads are located on one side of the left-handed threads, and sliding nuts are slidably installed on the right-handed threads and the left-handed threads on the outside of the transmission rod; the utility model can clamp and fix the semiconductor device through the clamping assembly through the installed adjustment mechanism, which can ensure the stability of the semiconductor device during packaging and avoid the deviation of the semiconductor device, thereby improving the quality of semiconductor device packaging.

[0004] Although this patent can ensure the stability of semiconductor devices during packaging and avoid displacement, thereby improving the quality of semiconductor device packaging, traditional semiconductor packaging devices usually use a clamping method to fix the substrate to be packaged. In this method, the clamping force not only needs to be precisely controlled, but the clamping device is also affected by external factors such as wear, making it difficult to accurately control the size of the clamping force. If the clamping force is too large, it is easy to cause physical damage to the semiconductor device on the substrate, and if the clamping force is too small, it will cause the substrate to shift during the packaging process and reduce stability, thereby affecting the packaging quality of the semiconductor device.

[0005] Therefore, a high stability packaging device for semiconductor device production is proposed to solve the problems mentioned in the above background technology. Summary of the invention

[0006] The object of the present invention is to provide a high-stability packaging device for semiconductor device production to solve the problems raised by the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A high-stability packaging device for semiconductor device production, comprising a driving component, six supporting components are equidistantly arranged on the top of the driving component, an exhaust component is arranged inside the supporting component, a fixing component is arranged at the bottom of the supporting component, a working component is arranged above the driving component, the driving component comprises a workbench, the working component comprises a fan blade plate, the number of the supporting components is set to six, the six supporting components each comprise a supporting shell, a filling block is fixedly connected to the inner bottom of the supporting shell near the edge, a circular cavity is opened at the top center of the filling block, the exhaust component comprises a piston plate, the outer surface of the piston plate is tightly fitted with the inner surface wall of the circular cavity, a connecting frame is fixedly connected to the top of the piston plate, a rubber plate with holes is fixedly connected to the top of the connecting frame, a connecting column is fixedly connected to the bottom center of the piston plate, the bottom end of the connecting column slides through the inner bottom of the supporting shell and extends downward, a second spring is sleeved on the outer surface of the connecting column, and the fixing component comprises a fixing plate.

[0008] Preferably, a base is fixedly connected to the bottom of the workbench near the edge, a first electric push rod is fixedly installed at the top center of the workbench, and the top end of the first electric push rod is fixedly connected to the fan blade plate.

[0009] Preferably, the outer surface of the first electric push rod is fixedly connected to a rotating shell through a bearing, and six connecting arms are equidistantly fixedly connected to the outer surface of the rotating shell, one end of the connecting arm is fixedly connected to the outer surface of the supporting shell, and a gear sleeve is fixedly connected to the outer surface of the rotating shell near the bottom, and a servo motor is installed near the center of the bottom of the workbench, and the output end of the servo motor rotates through the bottom of the workbench and extends upward, and the output end of the servo motor is fixedly connected to a driving gear, and the outer surface of the driving gear is meshingly connected with the outer surface of the gear sleeve.

[0010] Preferably, the fixed plate is fixedly connected to the bottom of the supporting shell, a third spring is symmetrically fixedly connected to the outer surface of one side of the fixed plate, an end of the third spring away from the fixed plate is fixedly connected to an engaging block, the bottom end of the connecting column is fixedly connected to a lifting block, a bevel is provided on the outer surface of the lifting block near the engaging block, the bevel and the engaging block are arranged in a one-way engaging manner, and the outer surface of the engaging block 503 is symmetrically fixedly connected to a connecting rod.

[0011] Preferably, a damper is fixedly connected to the bottom of the blade plate near the edge, a first pressure plate is fixedly connected to the bottom end of the damper, a first spring is provided on the outer sleeve of the damper, and a glue dispenser is fixedly installed at the bottom of the blade plate near the damper.

[0012] Preferably, the bottom of the fan blade plate near the dispensing machine is fixedly connected to an upwardly extending feed channel, and an outer surface of one side of the feed channel near the bottom is fixedly connected to a U-shaped shell, and the outer surface of the U-shaped shell near the side of the feed channel is symmetrically fixedly connected to a second electric push rod, and the telescopic ends of the two second electric push rods are fixedly connected to push blocks, and the push blocks slide through the outer surface of the feed channel and extend to the other side, and a third electric push rod is fixedly installed at the bottom of the fan blade plate near the feed channel, and the bottom end of the third electric push rod is fixedly connected to a second pressure plate.

[0013] Preferably, the connecting rod is fixedly connected to a connecting plate at one end away from the engaging block, an arc-shaped plate is fixedly connected to the outer surface of the connecting plate, a ring-shaped part is fixedly connected to the top of the workbench near the edge, an arc-shaped part is fixedly connected to the workbench near the front side, both ends of the arc-shaped part are fixedly connected to both ends of the ring-shaped part, and the arc plate is arranged to be in contact with the arc-shaped part.

[0014] Preferably, avoidance grooves are provided at the top of the supporting shell near the four edges, rollers are symmetrically rotatably connected between the inner walls of the avoidance grooves, a filling strip is fixedly connected at a position between the two rollers between the inner walls of the avoidance grooves, a rubber sleeve is sleeved between the outer surfaces of the two rollers and the filling strips, a limiting frame is fixedly connected at the top edge of the filling block, and the inner wall of the limiting frame and the outer surface of the rubber plate with holes are slidably fitted.

[0015] Preferably, the bottom of the supporting shell is fixedly connected to support columns near the four corners, and the bottom ends of the support columns are movably embedded with balls. The bottom of the balls fits in with the top of the workbench, and the top of the lifting block is fixedly connected to a limiting rod at a position away from the connecting column. The outer surface of the limiting rod slides through the bottom of the supporting shell and extends upward, and the top of the limiting rod is fixedly connected to the bottom of the piston plate.

[0016] Preferably, a triangular block is fixedly connected to the bottom of the connecting plate, and five trigger switches are embedded on the top of the workbench. The five trigger switches correspond to the positions of five supporting shells respectively, and the triangular block and the trigger switches cooperate with each other.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. When the present invention is used, after the semiconductor substrate is placed inside the supporting shell, it is moved to the bottom of the first pressure plate under the action of the driving component to be pressurized. By arranging the vacuum component, a closed space with an air pressure lower than the external atmospheric pressure is formed under the semiconductor substrate. The fixing component and the vacuum component cooperate to make the semiconductor substrate firmly adsorbed and fixed on the perforated rubber plate, which plays a role in fixing the semiconductor substrate and ensures the stability of the semiconductor substrate in the subsequent packaging process. In addition, this fixing method will not cause extrusion damage and insufficient clamping force to the semiconductor device, thereby improving the packaging quality.

[0018] 2. When the present invention is used, during the packaging process, the six supporting shells will rotate cyclically, so that continuous loading and unloading of materials can be performed at fixed positions without stopping for waiting, which effectively improves the packaging efficiency of semiconductor devices and has good economic benefits.

[0019] 3. When the present invention is used, after packaging is completed, the arc plate will be squeezed by the arc part and move outward, which will pull the engaging block outward and disengage from the inclined head, thereby releasing the fixation of the lifting block. At this time, the second spring and the external air pressure simultaneously generate an upward thrust on the piston plate, thereby causing the semiconductor device packaged on the perforated rubber plate to lose its fixation and can be easily removed without the aid of an ejector, thereby reducing damage to the semiconductor device during material removal and further improving the quality of the packaged product.

[0020] 4. When the present invention is used, the cooperation between the support column and the ball is used to improve the stability of the semiconductor device during the packaging process, and the cooperation between the triangular block and the trigger switch ensures the stable operation of the packaging process.

[0021] 5. When the present invention is used, when the semiconductor substrate is placed inside the supporting shell and pressed down, the rubber sleeve, roller and filling strip cooperate to avoid friction damage when the semiconductor substrate slides downward inside the supporting shell after being pressed, thereby improving the quality of the packaged product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional diagram of a high-stability packaging device for semiconductor device production according to the present invention; Figure 2 A top view of a high-stability packaging device for semiconductor device production according to the present invention; Figure 3 This is a schematic diagram of the structure of a driving component of a high-stability packaging device for semiconductor device production according to the present invention; Figure 4 This is a schematic diagram of the working component structure of a high-stability packaging device for semiconductor device production according to the present invention; Figure 5This is a schematic diagram of the structure of a material discharge channel of a high-stability packaging device for semiconductor device production according to the present invention; Figure 6 This is a schematic diagram of the connection of a supporting component, an exhaust component and a fixing component of a high-stability packaging device for semiconductor device production according to the present invention; Figure 7 A cross-sectional view of a supporting component of a high-stability packaging device for semiconductor device production according to the present invention; Figure 8 The present invention is a schematic diagram of the structure of a fixing component of a high-stability packaging device for semiconductor device production.

[0023] In the figure: 1. driving assembly; 101. base; 102. workbench; 103. trigger switch; 104. ring member; 105. arc member; 106. first electric push rod; 107. rotating shell; 108. connecting arm; 109. gear sleeve; 110. servo motor; 111. driving gear; 2. working assembly; 201. fan blade; 202. damper; 203. first spring; 204. glue dispenser; 205. unloading channel; 206. U-shaped shell; 207. second electric push rod; 208. push block; 209. third electric push rod; 210. first pressing plate; 211. second pressing plate; 3. supporting assembly; 3 01. Support shell; 302. Avoidance groove; 303. Roller; 304. Filling strip; 305. Rubber sleeve; 306. Support column; 307. Ball; 308. Filling block; 309. Limit frame; 310. Circular cavity; 4. Vacuum assembly; 401. Lifting block; 402. Connecting column; 403. Limit rod; 404. Bevel head; 405. Second spring; 406. Piston plate; 407. Connecting frame; 408. Rubber plate with holes; 5. Fixing assembly; 501. Fixing plate; 502. Third spring; 503. Engaging block; 504. Connecting rod; 505. Connecting plate; 506. Arc plate; 507. Triangular block. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Example 1: Please refer to Figure 1-Figure 8As shown, the present invention provides a technical solution: a high-stability packaging device for semiconductor device production, comprising a driving component 1, six supporting components 3 are equidistantly arranged on the top of the driving component 1, a vacuum component 4 is arranged inside the supporting component 3, a fixing component 5 is arranged at the bottom of the supporting component 3, a working component 2 is arranged above the driving component 1, the driving component 1 includes a workbench 102, the working component 2 includes a fan blade plate 201, the number of supporting components 3 is set to six, the six supporting components 3 all include a supporting shell 301, and a filling block 3 is fixedly connected to the inner bottom of the supporting shell 301 near the edge. 08. A circular cavity 310 is provided at the top center of the filling block 308. The vacuum assembly 4 includes a piston plate 406. The outer surface of the piston plate 406 fits tightly against the inner wall of the circular cavity 310. A connecting frame 407 is fixedly connected to the top of the piston plate 406. A rubber plate 408 with holes is fixedly connected to the top of the connecting frame 407. A connecting column 402 is fixedly connected to the bottom center of the piston plate 406. The bottom end of the connecting column 402 slides through the inner bottom of the supporting shell 301 and extends downward. A second spring 405 is sleeved on the outer surface of the connecting column 402. The fixing assembly 5 includes a fixing plate 501.

[0026] The bottom of the workbench 102 is fixedly connected to a base 101 near the edge, and a first electric push rod 106 is fixedly installed at the top center of the workbench 102. The top of the first electric push rod 106 is fixedly connected to the fan blade plate 201. The base 101 is mainly used to support the workbench 102 off the ground, and the first electric push rod 106 is used to drive the fan blade plate 201 to move up and down.

[0027] The outer surface of the first electric push rod 106 is fixedly connected to a rotating shell 107 through a bearing, and six connecting arms 108 are equidistantly fixedly connected to the outer surface of the rotating shell 107, and one end of the connecting arm 108 is fixedly connected to the outer surface of the supporting shell 301. A gear sleeve 109 is fixedly connected to the outer surface of the rotating shell 107 near the bottom, and a servo motor 110 is installed near the center of the bottom of the workbench 102. The output end of the servo motor 110 rotates through the bottom of the workbench 102 and extends upward. The output end of the servo motor 110 is fixedly connected to a driving gear 111, and the outer surface of the driving gear 111 is meshed with the outer surface of the gear sleeve 109. When in use, the servo motor 110 drives the driving gear 111 to rotate after starting. When the driving gear 111 rotates, it drives the gear sleeve 109 to rotate 60°. When the gear sleeve 109 rotates, it will drive the rotating shell 107 to rotate synchronously. When the rotating shell 107 rotates, it will drive the supporting shell 301 to rotate 60° counterclockwise through the connecting arms 108 on the surface.

[0028] The fixing plate 501 is fixedly connected to the bottom of the supporting shell 301, and the outer surface of one side of the fixing plate 501 is symmetrically fixedly connected with the third spring 502, and the end of the third spring 502 away from the fixing plate 501 is fixedly connected with the meshing block 503, and the bottom end of the connecting column 402 is fixedly connected with the lifting block 401, and the outer surface of the lifting block 401 is close to the meshing block 503. The position is provided with an inclined head 404, and the inclined head 404 and the meshing block 503 are arranged in a one-way meshing manner. The outer surface of the meshing block 503 is symmetrically fixedly connected with the connecting rod 504, and the fixing plate 501 is fixed to the supporting shell 301. 01 bottom, the third spring 502 is used to squeeze the engaging block 503 close to the lifting block 401. When the lifting block 401 is pressed against the engaging block 503 during the descending process, the engaging block 503 is pushed away and squeezes the third spring 502 to contract. When the lifting block 401 moves upward, the third spring 502 generates an extrusion force on the engaging block 503, making it close to the lifting block 401 and one-way meshing with the inclined head 404, thereby preventing the lifting block 401 from moving upward. The connecting rod 504 is used to connect the lifting block 401 and the piston plate 406.

[0029] A damper 202 is fixedly connected to the bottom of the fan blade 201 near the edge, and a first pressure plate 210 is fixedly connected to the bottom end of the damper 202. A first spring 203 is sleeved on the outside of the damper 202. A glue dispenser 204 is fixedly installed at the bottom of the fan blade 201 near the damper 202. Driven by the first electric push rod 106, when the fan blade 201 descends, the damper 202 and the first pressure plate 210 will be driven to descend synchronously, thereby applying pressure to the semiconductor substrate inside the supporting shell 301. During the process, the damper 202 and the first spring 203 will slowly contract to avoid damage to the semiconductor substrate caused by excessive squeezing. As the first spring 203 contracts and accumulates energy, the pressure applied by the first pressure plate 210 on the semiconductor substrate will gradually increase, thereby ensuring that the semiconductor substrate, the perforated rubber plate 408, the connecting frame 407 and the piston plate 406 move to the lowest point. After the glue dispenser 204 moves down, it will perform glue dispensing on the surface of the semiconductor substrate to prepare for the subsequent installation of the packaging shell.

[0030] The bottom of the fan blade plate 201 near the dispensing machine 204 is fixedly connected to an upwardly extending feeding channel 205, and the outer surface of one side of the feeding channel 205 is fixedly connected to a U-shaped shell 206 near the bottom, and the outer surface of the U-shaped shell 206 near the side of the feeding channel 205 is symmetrically fixedly connected to the second electric push rod 207, and the telescopic ends of the two second electric push rods 207 are fixedly connected to push blocks 208, and the push blocks 208 slide through the outer surface of the feeding channel 205 and extend to the other side. The bottom of the fan blade plate 201 near the feeding channel 205 is fixedly installed with a third electric push rod 209, and the bottom end of the third electric push rod 209 is fixedly connected to a second pressing plate 211. The feeding channel 205 is mainly used to accommodate stacked packaging shells, and the U-shaped shell 206 is mainly used to install There are two second electric push rods 207. When the lower second electric push rod 207 contracts, the lower push block 208 releases the obstruction of the lowest packaging shell inside the feeding channel 205. At this time, the upper second electric push rod 207 extends and pushes the push block 208 to squeeze and fix the second-to-last packaging shell inside the feeding channel 205. In the alternating process, the lowest packaging shell will fall on the lower second electric push rod 207 and the push block 208. After being released, as the lower second electric push rod 207 extends, the upper second electric push rod 207 will contract and make the packaging shell fall back to the bottom. After the third electric push rod 209 is started, it is mainly used to drive the second pressure plate 211 to move downward and squeeze the packaging shell, so that it is bonded and connected with the semiconductor substrate, thereby achieving the purpose of packaging.

[0031] The use steps of the present invention are as follows: during the production process of semiconductor devices, when the qualified semiconductor substrates prepared are packaged using the present device, the substrates are first placed in the supporting shell 301 located on the clockwise side of the first pressing plate 210. When the semiconductor substrate falls on the top of the rubber plate 408 with holes, the servo motor 110 is started and drives the driving gear 111 to rotate. When the driving gear 111 rotates, it drives the gear sleeve 109 to rotate 60°. At this time, the gear sleeve 109 will drive the supporting shell 301 to rotate 60° counterclockwise through the connecting arm 108 on the surface, so that it reaches the bottom of the first pressing plate 210. Subsequently, the first electric push rod 106 is started and the fan blade plate 201 is pulled down. At this time, the fan blade plate 201 drives the first pressing plate 210 to move downward through the damper 202 and squeezes the rubber plate with holes. During the process, the damper 202 will slowly shrink until the semiconductor substrate is pressed tightly. At the same time, the rubber plate with holes 408 will move downward synchronously so that the top surface is flush with the top surface of the limit frame 309. During the process, the piston plate 406 will be forced to move downward inside the circular cavity 310 through the connecting frame 407. At the same time, the rubber plate with holes 408 is in a deformed state. At this time, the holes above the rubber plate with holes 408 are blocked by the substrate, so that the space above the piston plate 406 inside the circular cavity 310 forms a closed state, and after the piston plate 406 moves downward, the space between the rubber plate with holes 408 and the piston plate 406 will increase, so that the air pressure is reduced. At this time, under the action of the external air pressure, the semiconductor substrate will be firmly adsorbed on the rubber plate with holes 4 08, and the piston plate 406 will drive the lifting block 401 to move downward synchronously through the connecting column 402 during the descent process. When the lifting block 401 moves to the lowest point, the third spring 502 will push the meshing block 503 to engage with the inclined head 404 in one direction, so that the lifting block 401 and the piston plate 406 cannot move up, thereby playing a role in fixing the semiconductor substrate, ensuring the stability of the semiconductor substrate in the subsequent packaging process, and this fixing method will not cause extrusion damage and insufficient clamping force to the semiconductor device, thereby improving the accuracy and quality of packaging. Subsequently, with the cooperation of the servo motor 110 and the first electric push rod 106, the fixed semiconductor substrate follows the supporting shell 301 to continue to rotate 60° and then moves to the bottom of the dispensing machine 204, and the dispensing machine 204 descends and completes the glue dispensing operation, and then moves to the bottom of the material discharge channel 205. At this time, after the material discharge channel 205 descends, the two second electric push rods 207 on the surface of the U-shaped shell 206 extend and retract alternately and then push and pull the push block 208, thereby releasing the lowest packaging shell inside so that it falls on the semiconductor substrate after glue coating, and squeezes and fixes the second to last packaging shell, and then moves to the bottom of the second pressing plate 211. The third electric push rod 209 follows the fan blade plate 201 to descend and push the second pressing plate 211 to press the packaging shell to connect it with the semiconductor substrate, thereby completing the packaging operation, and finally continues to rotate 60° and moves to the outside of the fan blade plate 201 to take out the packaged semiconductor device. During the packaging process, the six supporting shells 301 will rotate cyclically.Therefore, continuous loading and unloading can be performed at a fixed position without stopping or waiting, which effectively improves the packaging efficiency of semiconductor devices and has good economic benefits.

[0032] Embodiment 2: Figure 1-Figure 3 and Figure 6-Figure 8 As shown, the difference between the embodiment and the basis is that the connecting rod 504 is fixedly connected to a connecting plate 505 at one end away from the engaging block 503, and an arc plate 506 is fixedly connected to the outer surface of the connecting plate 505. A ring member 104 is fixedly connected to the top of the workbench 102 near the edge, and an arc member 105 is fixedly connected to the position of the workbench 102 near the front side. The two ends of the arc member 105 are fixedly connected to the two ends of the ring member 104, and the arc plate 506 is set in conflict with the arc member 105. After the packaging is completed, the supporting shell 301 continues to rotate from under the second pressing plate 211. The arc plate 506 that is in contact with the surface of the ring member 104 will be squeezed by the arc member 105 and move outward. At this time, the engaging block 503 is pulled outward and squeezes the third spring 502 to contract, thereby causing the engaging block 503 and the inclined head 404 to disengage, thereby releasing the fixation of the lifting block 401. When the supporting shell 301 is located in the area of ​​the arc plate 506 in the ring member 104, the ring member 104 and the arc plate 506 are in contact with each other, thereby limiting the maximum movement of the engaging block 503, thereby preventing the engaging block 503 from being too close to the center of the workbench 102 and being unable to cooperate with the inclined head 404.

[0033] The use steps of the present invention are as follows: after the packaging is completed, the supporting shell 301 continues to rotate 60° from the bottom of the second pressure plate 211 to the outer side of the fan blade plate 201. The arc plate 506 corresponding to the bottom of the supporting shell 301 and in contact with the surface of the annular member 104 will be squeezed by the arc member 105 and move outward. At this time, the arc plate 506 will pull the engagement block 503 to move outward through the connecting rod 504 and squeeze the third spring 502 to contract. At this time, the engagement block 503 and the inclined head 404 are separated, thereby releasing the fixation of the lifting block 401. At this time, the second spring 405 at the bottom of the piston plate 406 rebounds and pushes the piston plate 406 to move upward. At the same time, the external air pressure is greater than the air pressure in the closed space above the piston plate 406, and an upward thrust is generated on the piston plate 406, so that the perforated rubber plate 408 moves upward and allows air to enter the circular cavity 310. At this time, the semiconductor device packaged on the perforated rubber plate 408 loses its fixation and can be easily removed without the help of a ejector, thereby reducing damage to the semiconductor device during material removal and further improving the quality of the packaged product.

[0034] Embodiment 3: Figure 1-Figure 8As shown, the difference between the embodiment and the base is that the top of the supporting shell 301 is provided with avoidance grooves 302 near the edges on all sides, and rollers 303 are symmetrically connected to the inner surface walls of the avoidance grooves 302, and a filling strip 304 is fixedly connected to the position between the two rollers 303 between the inner surface walls of the avoidance grooves 302, and a rubber sleeve 305 is sleeved between the outer surfaces of the two rollers 303 and the filling strip 304, and a limited position frame 309 is fixedly connected to the top edge of the filling block 308, and the inner surface wall of the limit frame 309 and the hole are fixedly connected to the inner surface wall of the limit frame 309. The outer surface of the rubber plate 408 is slidably fitted, and the avoidance groove 302 is mainly used to accommodate the roller 303, the filling strip 304 and the rubber sleeve 305. The filling strip 304 is mainly used to fill the gap formed between the two rollers 303. When the semiconductor substrate is placed on the inner side of the supporting shell 301 and pressed down, the surface of the substrate will fit with the rubber sleeve 305. As the substrate descends, the rubber sleeve 305 will slide on the surface of the roller 303 and the filling strip 304, and remain relatively stationary with the substrate, thereby avoiding friction damage when fixing the semiconductor substrate.

[0035] The bottom of the supporting shell 301 near the four corners is fixedly connected with support columns 306, and the bottom ends of the support columns 306 are movably embedded with balls 307. The bottom of the balls 307 fits against the top of the workbench 102, and the top of the lifting block 401 is located away from the connecting column 402 and is fixedly connected with a limiting rod 403. The outer surface of the limiting rod 403 slides through the bottom of the supporting shell 301 and extends upward. The top of the limiting rod 403 is fixedly connected to the bottom of the piston plate 406. The support columns 306 cooperate with the balls 307 to support the supporting shell 301. During the movement of the supporting shell 301, the balls 307 will roll at the bottom of the support columns 306, thereby converting the sliding friction into rolling friction. The limiting rod 403 cooperates with the connecting column 402 to limit the lifting block 401, so that it can only move up and down.

[0036] A triangular block 507 is fixedly connected to the bottom of the connecting plate 505, and five trigger switches 103 are embedded on the top of the workbench 102. The five trigger switches 103 correspond to the positions of five of the supporting shells 301 respectively. The triangular block 507 cooperates with the trigger switch 103. The five trigger switches 103 correspond to the process positions of loading, first pressing down, dispensing, and second pressing down respectively. During the rotation of the supporting shell 301, when the triangular block 507 at the bottom coincides with the position of the trigger switch 103, it serves the purpose of pressing and starting the trigger switch 103. The trigger switch 103 is mainly used to control the timely start of the first electric push rod 106, the dispensing machine 204 and the second electric push rod 207. When in use, every time the supporting shell 301 rotates 60° to enter the downward packaging process position, the triangular block 507 below will squeeze the trigger switch 103, thereby triggering the start signal of the corresponding electrical component.

[0037] The use steps of the present invention are as follows: during use, when the semiconductor substrate is placed on the inner side of the supporting shell 301 and pressed down, the surface of the substrate will fit with the rubber sleeve 305. As the substrate descends, under the action of friction, the rubber sleeve 305 will slide on the surfaces of the roller 303 and the filling strip 304, and remain relatively static with the substrate, effectively avoiding friction damage caused when the semiconductor substrate is fixed, and improving the quality of the packaged product. During the rotation and movement of the supporting shell 301 on the top of the workbench 102, the support column 306 cooperates with the ball 307 to support the supporting shell 301, so that it maintains a high degree of stability during the movement and packaging operations. During the movement, the ball 307 will roll at the bottom of the support column 306, thereby converting the sliding friction into rolling friction, further improving the stability of the semiconductor device during the packaging process, and ensuring the packaging quality. At the same time, when the supporting shell 301 rotates 60° to enter the downward packaging process position, the triangle block 507 below will squeeze the trigger switch 103, thereby triggering the start signal of the corresponding electrical device, ensuring the stable operation of the packaging process.

[0038] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-stability packaging device for semiconductor device production, comprising a drive assembly (1), characterized in that: Six supporting assemblies (3) are equidistantly arranged on the top of the driving assembly (1); an exhaust assembly (4) is arranged inside the supporting assembly (3); a fixing assembly (5) is arranged at the bottom of the supporting assembly (3); and a working assembly (2) is arranged above the driving assembly (1); The driving assembly (1) comprises a workbench (102); The working component (2) comprises a fan blade (201); The number of the supporting components (3) is set to be six, and the six supporting components (3) each comprise a supporting shell (301), a filling block (308) being fixedly connected to the inner bottom of the supporting shell (301) near the edge, and a circular cavity (310) being provided at the top center of the filling block (308); The air extraction assembly (4) comprises a piston plate (406), the outer surface of the piston plate (406) is tightly fitted to the inner surface wall of the circular cavity (310), the top of the piston plate (406) is fixedly connected to a connecting frame (407), the top of the connecting frame (407) is fixedly connected to a rubber plate with holes (408), the bottom center of the piston plate (406) is fixedly connected to a connecting column (402), the bottom end of the connecting column (402) slides through the inner bottom of the supporting shell (301) and extends downward, and the outer surface of the connecting column (402) is sleeved with a second spring (405); The fixing assembly (5) comprises a fixing plate (501).

2. The high stability packaging device for semiconductor device production according to claim 1, characterized in that: A base (101) is fixedly connected to the bottom of the workbench (102) near the edge, and a first electric push rod (106) is fixedly installed at the center of the top of the workbench (102), and the top end of the first electric push rod (106) is fixedly connected to the fan blade plate (201).

3. The high stability packaging device for semiconductor device production according to claim 2, characterized in that: The outer surface of the first electric push rod (106) is fixedly connected to a rotating shell (107) via a bearing, and the outer surface of the rotating shell (107) is fixedly connected to six connecting arms (108) at equal intervals, and one end of the connecting arm (108) is fixedly connected to the outer surface of the supporting shell (301), and a gear sleeve (109) is fixedly connected to the outer surface of the rotating shell (107) near the bottom, and a servo motor (110) is installed near the center of the bottom of the workbench (102), and the output end of the servo motor (110) rotates through the bottom of the workbench (102) and extends upward, and the output end of the servo motor (110) is fixedly connected to a driving gear (111), and the outer surface of the driving gear (111) is meshingly connected to the outer surface of the gear sleeve (109).

4. The high stability packaging device for semiconductor device production according to claim 1, characterized in that: The fixing plate (501) is fixedly connected to the bottom of the supporting shell (301); a third spring (502) is symmetrically fixedly connected to the outer surface of one side of the fixing plate (501); an end of the third spring (502) away from the fixing plate (501) is fixedly connected to an engagement block (503); a bottom end of the connecting column (402) is fixedly connected to a lifting block (401); an oblique head (404) is provided on the outer surface of the lifting block (401) near the engagement block (503); the oblique head (404) and the engagement block (503) are arranged to be unidirectionally engaged; and a connecting rod (504) is symmetrically fixedly connected to the outer surface of the engagement block 503.

5. The high stability packaging device for semiconductor device production according to claim 1, characterized in that: A damper (202) is fixedly connected to the bottom of the blade plate (201) near the edge, a first pressure plate (210) is fixedly connected to the bottom end of the damper (202), a first spring (203) is sleeved on the outside of the damper (202), and a glue dispenser (204) is fixedly installed at a position near the damper (202) at the bottom of the blade plate (201).

6. The high stability packaging device for semiconductor device production according to claim 1, characterized in that: The bottom of the fan blade plate (201) is fixedly connected to a feeding channel (205) extending upward near the dispensing machine (204); the outer surface of one side of the feeding channel (205) is fixedly connected to a U-shaped shell (206) near the bottom; the outer surface of the U-shaped shell (206) on one side near the feeding channel (205) is symmetrically fixedly connected to a second electric push rod (207); the telescopic ends of the two second electric push rods (207) are fixedly connected to push blocks (208); the push blocks (208) slide through the outer surface of the feeding channel (205) and extend to the other side; the bottom of the fan blade plate (201) is fixedly installed with a third electric push rod (209) near the feeding channel (205); the bottom end of the third electric push rod (209) is fixedly connected to a second pressing plate (211).

7. The high stability packaging device for semiconductor device production according to claim 4, characterized in that: The connecting rod (504) is fixedly connected to a connecting plate (505) at one end away from the engaging block (503); an arc-shaped plate (506) is fixedly connected to the outer surface of the connecting plate (505); a ring-shaped member (104) is fixedly connected to the top of the workbench (102) near the edge; a arc-shaped member (105) is fixedly connected to a position near the front side of the workbench (102); two ends of the arc-shaped member (105) are fixedly connected to two ends of the ring-shaped member (104); and the arc-shaped plate (506) is arranged to be in contact with the arc-shaped member (105).

8. The high stability packaging device for semiconductor device production according to claim 1, characterized in that: The top of the supporting shell (301) is provided with avoidance grooves (302) near the edges on all sides; rollers (303) are symmetrically rotatably connected between the inner surface walls of the avoidance grooves (302); a filling strip (304) is fixedly connected between the inner surface walls of the avoidance grooves (302) and between the two rollers (303); a rubber sleeve (305) is sleeved between the outer surfaces of the two rollers (303) and the filling strip (304); a limit frame (309) is fixedly connected at the top edge of the filling block (308); the inner surface wall of the limit frame (309) and the outer surface of the rubber plate (408) with holes are slidably fitted.

9. The high stability packaging device for semiconductor device production according to claim 4, characterized in that: The bottom of the supporting shell (301) is fixedly connected to support columns (306) near the four corners, and the bottom ends of the support columns (306) are movably embedded with balls (307). The bottom of the balls (307) fits the top of the workbench (102). The top of the lifting block (401) is located at a position away from the connecting column (402) and is fixedly connected to a limiting rod (403). The outer surface of the limiting rod (403) slides through the bottom of the supporting shell (301) and extends upward, and the top of the limiting rod (403) is fixedly connected to the bottom of the piston plate (406).

10. The high stability packaging device for semiconductor device production according to claim 7, characterized in that: A triangular block (507) is fixedly connected to the bottom of the connecting plate (505), and five trigger switches (103) are embedded on the top of the workbench (102). The five trigger switches (103) respectively correspond to the positions of five of the supporting shells (301), and the triangular block (507) and the trigger switches (103) cooperate with each other.

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