Substrate supporting assembly and semiconductor processing equipment thereof

Abstract

The invention provides a substrate supporting assembly which comprises the components of a substrate base which is provided with a plurality of pin holes in the upper surface; the lower surface opposite to the upper surface of the substrate base is provided with a guide groove which is concave towards the substrate base; the lifting pin is positioned in the pin hole; the lifting plate is provided with a first surface facing the substrate base, the first surface of the lifting plate is provided with a plurality of lifting pins, the shape of the lifting plate is matched with that of the guide groove, and the lifting plate is arranged in the guide groove; and the driving component drives the lifting plate to move up and down along the guide groove. The height consistency of the lifting pins of the substrate supporting assembly is good in the moving process, and the requirement for the levelness in the substrate machining process can be met.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a substrate support component and semiconductor processing equipment. Background Art

[0002] Semiconductor processing equipment (such as plasma processing equipment) includes a substrate support structure having an electrostatic chuck for supporting a substrate during processing of the substrate. The surface of the electrostatic chuck is provided with pin holes, and the pin holes accommodate lifting pins, which lift and / or lower the substrate onto the supporting surface of the electrostatic chuck.

[0003] In certain specific processes, for example, when the substrate is annealed, in order to ensure that the substrate is heated evenly, there are high requirements for the horizontality of the substrate. In the prior art, the substrate is generally supported on the surface of the electrostatic chuck by multiple lifting pins. Multiple lifting pins are arranged on the lifting plate, and the lifting pins are driven to move by driving the lifting plate. The lifting plate is generally located inside the cavity, and the driving device for driving the lifting plate to move is arranged outside the cavity. During the driving process, the horizontality deviation of the lifting plate will be large, which will affect the horizontality of the substrate and cause the substrate to be heated unevenly.

[0004] In addition, the lift pins in the prior art are generally long. When the horizontal deviation of the lift plate is large, it will affect the movement of the lift pins in the pin holes, causing the lift pins to get stuck in the pin holes or even break. In addition, due to the long lift pins, it is difficult to ensure the parallelism of any two lift pins during installation, resulting in poor installation accuracy. Summary of the invention

[0005] The purpose of the present invention is to provide a substrate support assembly and a semiconductor processing device using the substrate support assembly. The lifting pins of the substrate support assembly have good height consistency during movement, which can meet the requirements for horizontality during substrate processing. At the same time, the difficulty of assembling the lifting pins can be reduced by reducing the lifting length.

[0006] In order to achieve the above objectives, the present invention is implemented through the following technical solutions: a substrate support assembly, comprising: a substrate base, the upper surface of the substrate base is provided with a plurality of pin holes; the lower surface opposite to the upper surface of the substrate base is provided with a guide groove recessed toward the substrate base; the pin hole is connected to the guide groove; a lifting pin, the lifting pin is accommodated in the pin hole; a lifting plate, the lifting plate is provided with a first surface facing the substrate base, a plurality of the lifting pins are installed on the first surface of the lifting plate, the shape of the lifting plate is adapted to the guide groove of the substrate base, and the lifting plate is arranged in the guide groove; a driving component, the driving component drives the lifting plate to move up and down along the guide groove.

[0007] Preferably, the lifting plate is a C-shaped plate, and the angles between any two adjacent lifting pins and the line connecting the centers of the C-shape are equal.

[0008] Preferably, the lifting plate is an annular plate, and the angles between any two adjacent lifting pins and the line connecting the center of the annular plate are equal.

[0009] Preferably, the lifting plate is a Y-shaped plate, the Y-shaped plate is provided with three arms, any two arms have the same angle and the three arms have the same length, and the plurality of lifting pins are respectively mounted on the ends of the arms.

[0010] Preferably, the lifting plate is provided with a second surface opposite to the first surface, the lifting plate is provided with a side surface located between the first surface and the second surface, the side surface of the lifting plate is provided with a groove body concave toward the lifting plate, and a sealing ring is provided in the groove body.

[0011] Preferably, the driving member includes a cylinder and a connecting frame; the cylinder includes a cylinder body and a guide piston; the connecting frame includes a first fixed part, a second fixed part and a connecting part connecting the first fixed part and the second fixed part; the cylinder body of the cylinder is fixed to the lower surface of the substrate base, one end of the guide piston is located in the cylinder body, the other end of the guide piston is connected to the first fixed part of the connecting frame, and the second fixed part of the connecting frame is connected to the lifting plate.

[0012] Preferably, the lifting plate is provided with a mounting surface in contact with the second fixing portion of the connecting frame, and the mounting surface is located at a symmetric center line of the lifting plate.

[0013] Preferably, a guide rail is provided on the second surface of the lifting plate, the shape of the guide rail is adapted to the lifting plate, and the guide rail is a protrusion relative to the second surface of the lifting plate.

[0014] Preferably, the substrate support assembly also includes a ball joint bracket, which is located between the connecting frame and the lifting plate, a ball pin is provided at the bottom of the ball joint bracket, and a groove is provided at the top opposite to the bottom of the ball joint bracket; the guide rail on the second surface of the lifting plate is adapted to the groove, and the second fixed part of the connecting frame is provided with a ball seat adapted to the ball pin.

[0015] A semiconductor processing device comprises a chamber, wherein a substrate supporting assembly is arranged inside the chamber.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] (1) The lifting plate of the present invention is arranged in the guide groove of the substrate base, and the side surface of the lifting plate and the inner side surface of the guide groove cooperate to form a guide surface. Compared with the prior art, the guiding area is increased and the horizontality of the lifting plate during the lifting process is improved.

[0018] (2) The present invention installs the driving member on the lower surface of the substrate base, which reduces the volume of the lift pin assembly, significantly shortens the stroke, and reduces the difficulty of leveling the lift pins.

[0019] (3) The present invention provides a guide rail on the second surface of the lifting plate, and the guide rail drives the driving component to change the installation position, thereby avoiding other structures during the installation process, thereby improving the flexibility of installation.

[0020] (4) The present invention sets a ball joint support between the lifting plate and the driving member, which reduces the poor parallelism of the lifting pin caused by installation errors, etc., and effectively avoids the lifting pin from getting stuck in the pin hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for the description. Obviously, the drawings described below are an embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0022] Figure 1 It is a schematic diagram of a substrate support structure of a semiconductor processing device in the prior art;

[0023] Figure 2 It is a structural schematic diagram of an embodiment of the present invention;

[0024] Figure 3 A bottom view of an embodiment of the present invention;

[0025] Figure 4 It is a schematic diagram of the structure of the lifting pin of the present invention;

[0026] Figure 5 It is a schematic diagram of the structure of the lifting pin falling down of the present invention;

[0027] Figure 6 It is a structural schematic diagram of another embodiment of the present invention;

[0028] Figure 7 is a cross-sectional view of another embodiment of the present invention;

[0029] Figure 8 It is a structural schematic diagram of the lifting plate of the present invention;

[0030] Fig. 9 It is a schematic diagram of the structure of the ball joint support of the present invention. DETAILED DESCRIPTION

[0031] The scheme proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the accompanying drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0032] Semiconductor processing equipment may be, for example, plasma etching equipment and pre-cleaning equipment. Taking semiconductor plasma etching equipment as an example, the semiconductor processing equipment includes a chamber cover, an electrode assembly, a gas supply assembly and a chamber. The electrode assembly is used to excite plasma, and the gas supply assembly is used to inject process gas into the chamber. The chamber includes a substrate support assembly, which is arranged in the cavity. The substrate support assembly is used to place a substrate to be processed, and the substrate support assembly includes a plurality of lifting pins. The substrate is supported by the lifting pins so that the substrate is separated from the support base so that a robot can pick up the substrate. The substrate support assembly described in the present invention can be used for the semiconductor processing equipment.

[0033] The invention discloses a substrate support assembly, which can be used in semiconductor processing equipment.

[0034] Figure 1 The substrate support structure of the semiconductor processing equipment in the prior art is shown, and the substrate support structure includes an electrostatic chuck 11, a plurality of pin holes 13, a plurality of lifting pins 14, a lifting plate 15, and a driving member 16 for controlling the lifting of the lifting plate. The electrostatic chuck 11 includes a bearing surface, and the bearing surface is used to bear the substrate to be processed. The pin hole 13 passes through the electrostatic chuck 11, and a plurality of lifting pins 14 are respectively located in the lifting pin holes 13. Further, the bottom of the electrostatic chuck is connected to the equipment plate 12, and the equipment plate is made of metal. An insulating layer 10 is also provided at the bottom of the equipment plate. A plurality of lifting pins are fixed to the upper surface of the lifting plate 15, and the lower surface of the lifting plate 15 is connected to the shaft 17. The driving member 16 drives the lifting plate 15 to move up and down through the shaft, thereby driving the lifting pins 14 to move. In the prior art, the lifting plate is located inside the chamber 18, and the driving member 16 is located outside the chamber. The side wall 19 that contacts the chamber through the shaft is guided, and the guiding area is small. During the movement, there will be a large deviation in the horizontality of the lifting plate.

[0035] The present invention discloses a substrate support assembly, comprising: a substrate base, wherein the upper surface of the substrate base is provided with a plurality of pin holes; the lower surface opposite to the upper surface of the substrate base is provided with a guide groove concave toward the substrate base; a lifting pin, wherein the lifting pin is accommodated in the pin hole; a lifting plate, wherein the lifting plate is provided with a first surface facing the substrate base, wherein a plurality of the lifting pins are installed on the first surface of the lifting plate, wherein the shape of the lifting plate is adapted to the guide groove of the substrate base, and the lifting plate is arranged in the guide groove; and a driving component, wherein the driving component drives the lifting plate to move along the guide groove.

[0036] Figure 2 A substrate support assembly according to an embodiment of the present invention comprises a substrate base 21, and a plurality of pin holes are provided on the upper surface 211 of the substrate base. A guide groove concave toward the substrate base is provided on the lower surface 212 opposite to the upper surface 211 of the substrate base, and the pin hole is connected with the guide groove, and the guide groove is a C-shaped groove. The lifting plate 23 is a C-shaped plate, and the lifting plate is adapted to the guide groove, and the lifting plate 23 is arranged in the guide groove. The lifting plate 23 has a first surface facing the guide groove, and a plurality of lifting pins 22 are fixed on the first surface of the lifting plate, and the lifting pins include a shaft body, and the lifting pins 22 further include a pin head and a pin seat part, and the pin head of the lifting pin contacts the substrate, and the lifting pin is fixedly installed on the first surface of the lifting plate through the pin seat part, and the shaft body is located in the pin hole, and further, the shaft body moves in the pin hole under the drive of the driving member. The driving member 24 drives the lifting plate 23 to move up and down along the guide groove. The driving member includes a cylinder 241 and a connecting frame 242; the cylinder includes a cylinder body 2411 and a guide piston 2412; the connecting frame includes a first fixing portion and a second fixing portion, and the first fixing portion and the second fixing portion are connected by a connecting portion; the cylinder body of the cylinder is fixed to the lower surface of the substrate base, and further, the cylinder body of the cylinder is fixed to the lower surface of the substrate base by screws. One end of the guide piston 2412 is located in the cylinder body, and the other end of the guide piston is connected to the first fixing portion of the connecting frame, and the second fixing portion of the connecting frame is connected to the lifting plate.

[0037] In some embodiments, the substrate base 21 includes an electrostatic chuck and an equipment plate. The upper surface of the substrate base is provided with a plurality of pin holes, and the pin holes penetrate the electrostatic chuck and the equipment plate. The bearing surface of the electrostatic chuck, that is, the upper surface of the substrate base, is used to bear the substrate to be processed, and the electrostatic chuck has a built-in electrode. The equipment plate is made of metal material, and a guide groove is provided on the lower surface of the equipment plate. The lifting plate moves up and down along the guide groove in the equipment plate. The driving member is installed on the lower surface of the equipment plate.

[0038] In some embodiments, the pin head of the lifting pin 22 is truncated cone-shaped. Furthermore, the outer diameter of the pin head of the lifting pin is larger than the outer diameter of the shaft, ensuring that the lifting pin forms good contact with the substrate during the movement of the driving substrate to prevent the substrate from slipping.

[0039] Since a part of the lifting plate 23 is located inside the substrate base, the size of the lifting pin 22 is greatly shortened compared to the prior art. Due to the reduced size of the lifting pin, the parallelism of any two adjacent lifting pins can be ensured during the installation process. Generally speaking, the longer the length of the lifting pin, the more difficult it is to ensure the parallelism between any two adjacent lifting pins. Reducing the length of the lifting pin further reduces the installation errors of multiple parts, thereby improving the installation accuracy of the lifting pin.

[0040] like Figure 3 As shown, in some embodiments, the lifting plate is a C-shaped plate, the center of the C-shaped plate is aligned with the center of the substrate support assembly, the C-shaped plate is provided with two ends, the lifting pins are evenly distributed on the C-shaped plate, and there are multiple lifting pins. Preferably, the number of lifting pins is 3, and there is no limit on the number of lifting pins. When the number of lifting pins is 3, the lifting pins are evenly distributed on the C-shaped plate, which means that the angle formed by the line connecting two adjacent lifting pins and the center of the C-shaped plate is 120°. The lifting plate is provided with a mounting surface in contact with the second fixing portion of the connecting frame, and the mounting surface is located at the symmetry center line Z of the lifting plate.

[0041] Since the driving member 24 is eccentrically arranged relative to the lifting plate 23, when the size of the lifting plate is large, the lifting plate cannot remain completely horizontal due to the effect of gravity at the farthest end from the driving member during the driving process. By reducing the weight of the lifting plate at the farthest end from the driving member and adopting a C-shaped plate structure, the lifting plate can be operated smoothly and have a good levelness. Preferably, when the angle formed by the two ends of the C-shaped plate and the center of the circle is 120°, a lifting pin 22 is respectively provided at the two ends of the C-shaped plate.

[0042] Figure 4 Specifically shown as Figure 2The state in which the lifting pins in the substrate support assembly are raised is shown. The first surface of the lifting plate facing the substrate base is provided with a plurality of lifting pins 22, and the lifting pins protrude from the upper surface 211 of the substrate base. The lifting plate 23 is located in the guide groove of the substrate base. The side of the lifting plate is provided with a groove body concave toward the lifting plate, and a sealing ring 231 is provided in the groove body. The sealing ring 231 can ensure that the lifting plate can still maintain good airtightness during the up and down movement. The second surface 234 of the lifting plate is connected to the driving member 24 through a connecting frame. Further, the second surface of the lifting plate is fixedly connected to the second fixing portion of the connecting frame 242 by bolts. Further, the second surface 234 of the lifting plate is flush with the lower surface of the substrate base, that is, the second surface of the lifting plate does not protrude from the lower surface of the substrate base. The first fixing portion, the connecting portion and the second fixing portion of the connecting frame are integrally formed, and the cross-sectional view of the side of the connecting frame is Z-shaped, and the specific structure of the connecting frame is not limited.

[0043] Figure 5 Specifically shown as Figure 2 The state of the lifting pins falling in the substrate support assembly shown. The first surface of the lifting plate 23 facing the substrate base is provided with a plurality of lifting pins 22, and the lifting pins 22 do not protrude from the upper surface 211 of the substrate base, that is, the pin heads of the lifting pins are flush with or lower than the upper surface 211 of the substrate base. The second surface 234 of the lifting plate protrudes from the lower surface 212 of the substrate base. The running distance of the lifting pins (that is, the distance between the highest point when the lifting pins are raised and the lowest point when the lifting pins are dropped) is related to the cylinder body of the driving component cylinder, and the running distance of the lifting pins is equal to the running distance of the guide piston in the cylinder body. The side wall of the cylinder body of the cylinder is provided with an air path, and the air path is connected to the controller, and the movement of the guide piston in the cylinder body is controlled by the controller. The guide piston of the cylinder is fixedly connected to the first fixing part of the connecting frame by bolts.

[0044] Figure 6 and Figure 7Another embodiment of a substrate support assembly of the present invention is shown. The substrate support assembly includes a substrate base 61, and a plurality of pin holes are provided on the upper surface of the substrate base. A guide groove concave toward the substrate base is provided on the lower surface of the substrate base, and the pin holes are connected to the guide groove. The lifting plate 63 is a C-shaped plate, and the shape of the lifting plate is adapted to the guide groove. The lifting plate is arranged in the guide groove, and a plurality of lifting pins 62 are installed on the first surface of the lifting plate facing the guide groove. A guide rail 632 is provided on the second surface of the lifting plate, and the guide rail is a protrusion relative to the second surface. The driving member 64 includes a cylinder 641 and a connecting frame 642, and the cylinder includes a cylinder body 6411 and a guide piston 6412, and the lifting plate is connected to the cylinder through the connecting frame. A ball joint support 65 is also provided between the lifting plate and the connecting frame. A groove 651 is provided on the ball joint support. The groove 651 is matched with the raised guide rail 632 on the second surface of the lifting plate. A ball head pin 652 is provided below the ball joint support. The second fixing portion of the connecting frame is provided with a ball seat matched with the ball head pin. The ball joint support 65 can slide along the guide rail. The ball joint support further drives the cylinder to move along the guide rail through the connecting frame, and the position of the cylinder fixed to the substrate base can be changed. By driving the driving member to change the installation position through the guide rail, it is possible to avoid other structures during the installation process, thereby improving the flexibility of installation. A ball joint support is provided between the lifting plate and the driving member. The ball joint support reduces the poor parallelism of the lifting pin caused by installation errors, etc., and effectively avoids the lifting pin from getting stuck in the pin hole.

[0045] In some embodiments, the second surface of the lifting plate 63 is provided with a guide rail 632, and the shape of the guide rail is adapted to the lifting plate. Further, the lifting plate is a C-shaped plate, the guide rail is also a C-shaped guide rail, and the center of the guide rail is aligned with the center of the C-shaped plate. Further, the lifting plate is an annular plate, the guide rail is also an annular guide rail, and the center of the guide rail is aligned with the center of the annular plate. Further, the lifting plate is a Y-shaped plate, and the guide rail is also a Y-shaped guide rail.

[0046] like Figure 8 The figure shows the structure of the lifting plate. The lifting plate is a C-shaped plate. The lifting plate is provided with two ends. Furthermore, the angle between the two ends and the center of the C-shaped plate is 120°. There are three lifting pins, two of which are respectively provided on one end, and the angle between the two adjacent lifting pins and the center of the circle is 120°. The guide rail on the lower surface of the lifting pin is the same shape as the C-shaped plate, as shown in FIG. Figure 3 As shown, the guide rail is located on the circumferential symmetry line O of the C-shaped plate, and the circumferential symmetry line of the guide rail coincides with the circumferential symmetry line O of the C-shaped plate. The cross section of the guide rail is dovetail-shaped, T-shaped or other shapes, and there is no restriction on the cross-sectional shape of the guide rail. The two heads of the guide rail are respectively provided with limit pins to prevent the ball joint support 65 from sliding off the guide rail.

[0047] When there are three lifting pins, the lifting plate can be a Y-shaped plate, and the Y-shaped plate is provided with three arms, and the angles of any two arms are the same and the lengths of the three arms are the same. The three lifting pins are respectively provided with the ends of the three arms, and the distances of the three lifting pins from the center of the Y-shaped plate are equal. At this time, the second fixed part of the connecting frame of the driving member is fixedly connected to the center of the Y-shaped plate, and the lifting pins are driven up and down by driving the center of the Y-shaped plate. When the number of the lifting pins is greater than 3, the number of arms of the lifting plate is increased accordingly, and the arms meet the conditions that any adjacent arms have the same angles and the same arm lengths. The lifting pins are respectively fixed to the ends of the arms, and the distances of the lifting pins from the center of the lifting plate are equal. At this time, the driving member is fixedly connected to the center of the lifting plate, and the lifting pins are driven up and down by driving the central part of the lifting plate. At this time, each lifting pin is subjected to the same force and has good horizontality during the movement.

[0048] Further optionally, the lifting plate is an annular plate, and the angles between any two adjacent lifting pins and the line connecting the center of the annular plate are equal. The lifting plate of the annular plate is provided with a mounting surface in contact with the second fixing portion of the connecting frame, and the driving member drives the annular plate to move along the guide groove through the connection between the lifting plate and the connecting frame. At this time, the driving member is eccentrically arranged relative to the annular plate. When the size of the annular plate is small, the influence of the eccentric arrangement on the horizontality of the annular plate can be ignored.

[0049] Fig. 9 The figure shows the structure of the ball joint support. The width d of the ball joint support is consistent with the width of the lifting plate, and the size of the ball joint support is the same as the second fixing part of the connecting plate. The ball joint support has a groove matching the guide rail on the top, and a ball pin connected to the second fixing part of the connecting frame on the bottom.

[0050] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements. In addition, the term "connection" herein means that A and B are directly connected, or that A and B are indirectly connected, such as A and B are connected through C, or even through more components such as C and D, and A and B can be connected in one piece, or in separate pieces, or removable, or fixed. The term "optional" herein means that the technical feature can be combined or not combined with any feature in the text.

[0051] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A substrate support assembly, characterized in that: include: A substrate base, wherein a plurality of pin holes are provided on an upper surface of the substrate base; A guide groove concave toward the substrate base is provided on the lower surface opposite to the upper surface of the substrate base; the pin hole is connected to the guide groove; A lifting pin, the lifting pin being accommodated in the pin hole; A lifting plate, wherein the lifting plate is provided with a first surface facing the substrate base, a plurality of lifting pins are mounted on the first surface of the lifting plate, a shape of the lifting plate is adapted to a guide groove of the substrate base, and the lifting plate is arranged in the guide groove; A driving component drives the lifting plate to move up and down along the guide groove.

2. A substrate support assembly according to claim 1, characterized in that: The lifting plate is a C-shaped plate, and the angles between any two adjacent lifting pins and the line connecting the center of the C-shape are equal.

3. A substrate support assembly according to claim 1, characterized in that: The lifting plate is an annular plate, and the included angles between any two adjacent lifting pins and the line connecting the center of the annular plate are equal.

4. A substrate support assembly according to claim 1, characterized in that: The lifting plate is a Y-shaped plate, and the Y-shaped plate is provided with three arms, any two arms have the same angle and the three arms have the same length, and the plurality of lifting pins are respectively installed at the ends of the arms.

5. A substrate support assembly according to claim 2, characterized in that: The lifting plate is provided with a second surface opposite to the first surface, the lifting plate is provided with a side surface located between the first surface and the second surface, the side surface of the lifting plate is provided with a groove body concave toward the lifting plate, and a sealing ring is provided in the groove body.

6. A substrate support assembly according to claim 5, characterized in that: The driving component includes a cylinder and a connecting frame; the cylinder includes a cylinder body and a guide piston; the connecting frame includes a first fixed part, a second fixed part and a connecting part connecting the first fixed part and the second fixed part; the cylinder body of the cylinder is fixed to the lower surface of the substrate base, one end of the guide piston is located in the cylinder body, the other end of the guide piston is connected to the first fixed part of the connecting frame, and the second fixed part of the connecting frame is connected to the lifting plate.

7. A substrate support assembly according to claim 6, characterized in that: The lifting plate is provided with a mounting surface in contact with the second fixing portion of the connecting frame, and the mounting surface is located at the symmetric center line of the lifting plate.

8. A substrate support assembly according to claim 7, characterized in that: A guide rail is provided on the second surface of the lifting plate. The shape of the guide rail is adapted to the lifting plate. The guide rail is a protrusion relative to the second surface of the lifting plate.

9. A substrate support assembly according to claim 8, characterized in that: It also includes a ball joint bracket, the ball joint is located between the connecting frame and the lifting plate, a ball pin is provided at the bottom of the ball joint support, and a groove is provided at the top opposite to the bottom of the ball joint support; the guide rail on the second surface of the lifting plate is matched with the groove, and the second fixing part of the connecting frame is provided with a ball seat matched with the ball pin.

10. A semiconductor processing equipment, characterized in that: include, A chamber, wherein the substrate support assembly according to claims 1 to 9 is arranged inside the chamber.

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