Single-tube-based power module for hybrid power vehicle

Abstract

The invention relates to the technical field of power modules, in particular to a single-tube-based power module for a hybrid vehicle. A plurality of single-tube devices are distributed on the first surface of the radiator, and terminals of the single-tube devices are connected with an external circuit; an insulating pad is also included; the insulating pad is arranged in a gap area between the single-tube device and the radiator; and the edge of the insulating pad protrudes out of the radiator and is used for preventing the creepage phenomenon of the terminal of the single-tube device during working. In order to solve the problem that after the density of a power module in the prior art is increased, creepage is generated between a terminal of a single-tube device and a metal part of a radiator, in the scheme, a group of insulating pads are clamped in a gap part between the single-tube device and the radiator, and the edge parts of the insulating pads are more prominent relative to the outer contour of the radiator, so that the power module is more compact in structure. Therefore, the path length between the terminal of the single-tube device and the radiator is prolonged, and the problem that the single-tube device may generate creepage in a high-voltage scene is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and in particular to a single-tube based power module for a hybrid vehicle. Background Art

[0002] Single-tube devices refer to power devices such as IGBT and MOSFET, which are encapsulated in a specific housing to form an electronic component that can be used independently. The power module is a power drive device that integrates power electronics and integrated circuit technology. With its many advantages such as high integration and high reliability, the power module occupies an increasingly large share in the market. This device is particularly suitable for frequency converters and various inverter power supplies for driving motors. It has become a commonly used power electronic device in the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo drive, and variable frequency home appliances. At present, with the continuous development of new energy vehicles and their popularization and application on a large scale, hybrid vehicles with better applicability are gradually becoming the mainstream development trend. In order to meet this market demand, it is particularly important to develop power modules with higher reliability and lower stray inductance.

[0003] In the prior art, there are technical solutions for integrating multiple single-tube devices to form a power module. For example, Chinese patent CN202022201965.0 discloses a single-tube high-power module device, including a cooling plate, an input support, an IGBT, an output support, an AC output copper busbar and a pressure plate, wherein the left and right sides of the cooling plate are respectively fixedly connected to the output support and the input support; the IGBT is arranged on the upper surface of the cooling plate through an insulating sheet, and the IGBT is provided with an even number, and each two are arranged in a group of rotational symmetry; the pressure plate presses the upper surface of the IGBT from the upper side through the reinforcing ribs of the plate body; the AC output copper busbar is arranged on the upper surface of the copper busbar at the output end of the IGBT. They are respectively connected and fixed with the IGBT, the input support, and the input support, so that the IGBT is in more stable contact with the insulating sheet and the cooling plate, and the heat dissipation performance is better. Through this integrated arrangement of multiple IGBTs and cooling plates, the overall cost performance of the motor controller can be significantly improved, and it has the advantages of stable operation, high integration, and good heat dissipation effect.

[0004] However, in the actual implementation process, the inventors found that with the increase in the number of single-tube devices added to the power module and the increase in the demand for the overall power density of the module, the layout of the single-tube devices in the module has become more and more compact. This has led to some wiring areas in the module, such as exposed terminals, being prone to creepage in high-voltage scenarios, such as automotive scenarios, which in turn has led to device failure. Summary of the invention

[0005] In view of the above problems existing in the prior art, a power module for a hybrid vehicle based on a single tube is now provided.

[0006] The specific technical solutions are as follows:

[0007] A single-tube based hybrid vehicle power module includes a heat sink;

[0008] The radiator is in the shape of a long strip;

[0009] A plurality of single-tube devices are distributed on the first surface of the heat sink, and the terminals of the single-tube devices are connected to an external circuit;

[0010] Also included are insulating pads;

[0011] The insulating pad is in the shape of a long strip;

[0012] The outer contour of the insulating pad extends outwardly with a first width relative to the outer contour of the heat sink;

[0013] The insulating pad is provided with a through hole at a position corresponding to the single-tube device;

[0014] The insulating pad is arranged in a gap region between the single-tube device and the heat sink;

[0015] The edge of the insulating pad protrudes from the heat sink to prevent the terminal of the single-tube device from generating creepage during operation.

[0016] On the other hand, the single-tube device includes a packaging shell;

[0017] The packaging shell is in the shape of a long cube, and a long cube-shaped cavity is arranged inside;

[0018] A substrate is arranged inside the packaging shell, and the substrate is in the shape of an elongated cube;

[0019] A power chip is mounted on the first surface of the substrate;

[0020] A power input terminal is welded to the first end of the substrate;

[0021] The other end of the power input terminal passes through the packaging shell;

[0022] The second ends of the substrate facing each other are respectively provided with a signal terminal and a power output terminal;

[0023] The other ends of the signal terminal and the power output terminal pass through the packaging shell respectively;

[0024] The chip pins of the power chip are respectively connected to the power input terminal, the signal terminal and the power output terminal.

[0025] On the other hand, the power input area of ​​the power chip is arranged on the back side of the power chip;

[0026] The power input region is located in the region between the substrate and the power chip;

[0027] The power input area is connected to the power input terminal through the printed circuit of the substrate;

[0028] The front side of the power chip is respectively provided with a signal area and a power output area;

[0029] The signal area is connected to the signal terminal via a bonding wire;

[0030] The power output region is connected to the power output terminal via a bonding wire.

[0031] On the other hand, a plurality of welding bosses are distributed on the first surface of the heat sink;

[0032] The height of the welding boss matches the thickness of the insulating pad;

[0033] The second surface of the substrate exposes the packaging shell;

[0034] The second surface of the substrate is fixedly welded to the surface of the welding boss.

[0035] On the other hand, a first rectangular area and a second rectangular area are provided on the first surface of the heat sink;

[0036] Two rows of the single-tube devices are respectively arranged in the first rectangular area and the second rectangular area;

[0037] A plurality of the single-tube devices are arranged in each row;

[0038] The terminals of the single-tube device are distributed along the short axis of the heat sink.

[0039] On the other hand, the insulating pad is provided with matching rectangular insulating pad openings at positions corresponding to the positions where the single-tube device exists in the first rectangular area and the second rectangular area.

[0040] On the other hand, a plurality of first insulating pad fixing holes are provided on the first surface of the heat sink;

[0041] A matching second insulating pad fixing hole is provided on the insulating pad at a position corresponding to the first insulating pad fixing hole;

[0042] The first insulating pad fixing hole and the second insulating pad fixing hole are matched and fixed by screws.

[0043] On the other hand, the material of the insulating pad includes at least one of glass fiber, polyimide, liquid crystal polymer, and epoxy resin.

[0044] On the other hand, a heat dissipation component is distributed on the second surface of the heat sink;

[0045] The heat dissipation assembly is vertically arranged on the radiator;

[0046] The heat dissipation component is cylindrical, rectangular, elliptical or truncated cone-shaped.

[0047] On the other hand, a heat dissipation component is distributed on the second surface of the heat sink;

[0048] The heat dissipation components are distributed at positions corresponding to the first rectangular area and the second rectangular area where the single-tube devices are arranged.

[0049] The above technical solution has the following advantages or beneficial effects:

[0050] In view of the problem that after the density of the power module in the prior art is increased, the terminals of the single-tube device will generate creepage with the metal part of the heat sink. In this solution, a group of insulating pads are clamped in the gap between the single-tube device and the heat sink. The edge of the insulating pad is more prominent than the outer contour of the heat sink, thereby extending the path length between the terminal of the single-tube device and the heat sink, avoiding the problem of creepage that may be generated by the single-tube device in high-voltage scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The embodiments of the present invention will be described more fully with reference to the attached drawings, which are provided for illustration and description only and are not intended to limit the scope of the present invention.

[0052] Figure 1 A side view of an embodiment of the present invention;

[0053] Figure 2 This is a back view of an embodiment of the present invention;

[0054] Figure 3 It is a front cross-sectional view of a single-tube device in an embodiment of the present invention;

[0055] Figure 4 is a front view of a heat sink and an insulating pad combination according to an embodiment of the present invention;

[0056] Figure 5 Schematic diagram of an insulating pad in an embodiment of the present invention;

[0057] Figure 6 It is a front view of an embodiment of the present invention. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this specification and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this specification.

[0060] In this specification, unless otherwise clearly specified and limited, the terms "set", "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0061] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0062] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0063] The present invention comprises:

[0064] A hybrid vehicle power module based on a single tube, such as Figure 1-6 As shown, it includes a radiator 1;

[0065] The radiator 1 is in the shape of a long strip;

[0066] A plurality of single-tube devices 2 are distributed on the first surface of the heat sink 1, and the terminals of the single-tube devices 2 are connected to an external circuit;

[0067] Also includes an insulating pad 3;

[0068] The insulating pad 3 is in the shape of a long strip;

[0069] The outer contour of the insulating pad 3 extends outwardly with a first width relative to the outer contour of the heat sink 1;

[0070] A through hole is provided on the insulating pad 3 at a position corresponding to the single-tube device 2;

[0071] The insulating pad 3 is arranged in the gap area between the single-tube device 2 and the heat sink 1;

[0072] The edge of the insulating pad 3 protrudes from the heat sink 1 to prevent the terminal of the single-tube device 2 from generating creepage during operation.

[0073] Specifically, in view of the problem that after the density of the power module in the prior art is increased, the terminals of the single-tube device will generate creepage with the metal part of the heat sink. In this solution, a group of insulating pads 3 are clamped in the gap between the single-tube device 2 and the heat sink 1. The edge of the insulating pad 3 is more prominent relative to the outer contour of the heat sink 1, thereby extending the path length between the terminal of the single-tube device 2 and the heat sink, avoiding the problem of creepage that may occur in the single-tube device under high-voltage scenarios.

[0074] In one embodiment, the single-tube device 2 includes a packaging shell 21;

[0075] The packaging shell 21 is in the shape of a long cube, and a long cube-shaped cavity is provided inside;

[0076] A substrate 22 is disposed inside the package shell 21, and the substrate 22 is in the shape of an elongated cube;

[0077] A power chip 23 is mounted on the first surface of the substrate 22;

[0078] A power input terminal 24 is welded to the first end of the substrate 23;

[0079] The other end of the power input terminal 24 passes through the package housing;

[0080] The second ends of the substrate 23 facing each other are respectively provided with a signal terminal 25 and a power output terminal 26;

[0081] The other ends of the signal terminal 25 and the power output terminal 26 pass through the packaging shell 21 respectively;

[0082] The chip pins of the power chip 23 are respectively connected to the power input terminal 24 , the signal terminal 25 and the power output terminal 26 .

[0083] Specifically, in order to achieve a better packaging effect, in this embodiment, the packaging structure of the above-mentioned single-tube device 2 is also designed, and corresponding terminal positions are configured so that the terminals on the power supply side and the terminals on the load side are distinguished at both ends of the device.

[0084] Specifically, in order to meet relevant driving requirements, such as the motor drive circuit of a vehicle, it is usually necessary to set up a large number of power devices to form the corresponding drive circuit. For example, the H-bridge three-phase drive circuit requires three pairs of six power devices. The drive circuit includes a power supply input terminal, a control terminal of the power device, and an output terminal of the bridge arm.

[0085] In order to achieve effective access to a large number of power devices, in this embodiment, a power input terminal 24 is welded to the first end of the substrate 23, and a signal terminal 25 and a power output terminal 26 are respectively provided at the second end opposite to the substrate 23.

[0086] In the above scenario, the power input terminal 24 is connected to one side of the battery busbar of the vehicle, the signal terminal 25 is connected to the motor controller, and the power output terminal 26 is connected to the power supply phase of the motor. Based on the above settings, the electrical circuits on both sides can be effectively separated.

[0087] On this basis, the power chip 23 is welded and led out through relevant connection methods. The power chip 23 is composed of one or more silicon-based, silicon carbide-based or gallium nitride-based IGBT, DOIDE, MOSFET chips.

[0088] The power input terminal 24 , the signal terminal 25 and the power output terminal 26 are fixed on the substrate 22 by welding.

[0089] The power input terminal 24 , the signal terminal 25 and the power output terminal 26 are made of metal, generally pure copper or copper alloy.

[0090] The power input terminal 24 , the signal terminal 25 and the power output terminal 26 are manufactured by stamping and cutting.

[0091] In some embodiments, the surfaces of the power input terminal 24 , the signal terminal 25 and the power output terminal 26 are provided with a plating layer, and the plating layer is gold, silver, nickel, tin or other equivalent solderable metals.

[0092] The outer sides of the power input terminal 24 , the signal terminal 25 and the power output terminal 26 are fixed to the external circuit by welding.

[0093] Accordingly, when it is necessary to design a circuit within a module, for example, by combining multiple single-tube devices to form an H-bridge drive circuit, the power input terminal 24 and the power output terminal 26 can be overlapped between two single-tube devices 2, and then connected by laser welding or soldering to construct a circuit unit.

[0094] In one embodiment, the power input area of ​​the power chip 23 is disposed on the back side of the power chip;

[0095] The power input region is located between the substrate 22 and the power chip 23;

[0096] The power input area is connected to the power input terminal 24 through the printed circuit of the substrate 22;

[0097] The front side of the power chip 23 is provided with a signal area and a power output area;

[0098] The signal area is connected to the signal terminal 25 via a bonding wire;

[0099] The power output region is connected to the power output terminal 26 via a bonding wire.

[0100] Specifically, in order to achieve a better device output path, in this embodiment, the power chip 23 is selected to be adjusted, and a chip circuit with lead-out areas on two sides is introduced.

[0101] The power input area is arranged on the back side, and when the power chip is soldered to the substrate 22, usually by reflow soldering based on the BOP process, the power input area is connected to the printed circuit of the substrate 22 via solder, and then connected to the power input terminal 24 via the printed circuit of the substrate 22.

[0102] Correspondingly, the signal area and the power output area are configured on the front side of the chip, located above the power chip 23. A lead frame is provided on the substrate 22. The signal area is connected to the signal terminal 25 through a bonding wire, and the power output area is connected to the power output terminal 26 through a bonding wire. The bonding wire is fixed through the lead frame on the terminal.

[0103] The lead frame is fixed to the substrate 22 by reflow soldering.

[0104] In one embodiment, a plurality of welding bosses 11 are distributed on the first surface of the heat sink 1;

[0105] The height of the welding boss 11 matches the thickness of the insulating pad;

[0106] The second surface of the substrate 22 exposes the package housing 21;

[0107] The second surface of the substrate 22 is fixed to the surface of the welding boss 11 by welding.

[0108] Specifically, in order to achieve a better heat dissipation effect, in this embodiment, a plurality of welding bosses 11 are distributed on the first surface of the heat sink 1 , and the welding bosses 11 are welding areas predetermined to be formed on the heat sink 1 .

[0109] Furthermore, in order to achieve a better heat dissipation effect, in this embodiment, the structure of the plastic housing 21 is adjusted to form a plastic housing 21 with an open bottom surface. When the substrate 22 is disposed on the plastic housing, its bottom is exposed to the outside of the plastic housing 21.

[0110] Then, the substrate 22 is brought into direct contact with the welding boss 11 and fixed by welding.

[0111] Based on the above configuration, when the power chip 23 is working, the heat generated by it will be conducted to the substrate 22, and then transferred to the heat sink 1 through the substrate 22 for heat dissipation.

[0112] The above arrangement enables direct contact with the heat source, and by selecting a substrate 22 with relatively good thermal conductivity during the selection process, a shorter heat transfer path and a higher heat transfer efficiency can be achieved.

[0113] Furthermore, in order to achieve a better fixing effect on the insulating pad 3, in this embodiment, the height of the welding boss 11 is also controlled to match the thickness of the insulating pad. During the welding process, the insulating pad 3 is first put on the welding boss 11 so that the insulating pad 3 is attached to the radiator.

[0114] Then, solder and the single-tube device 2 are placed on the soldering boss 11 so that the substrate 22 contacts the soldering boss 11, and soldering is performed.

[0115] During the soldering process, the soldering method is reflow soldering or silver paste sintering.

[0116] The welding material is one of SnSb, SnAg, PbSnAg or SnAgCu solder;

[0117] The welding or sintering temperature is controlled between 100℃ and 300℃.

[0118] Based on the above process, the insulating pad 3 separates the single-tube device 2 and the heat sink, thereby avoiding the creepage phenomenon that may be generated when the power device is working.

[0119] In one embodiment, a first rectangular area 12 and a second rectangular area 13 are provided on the first surface of the heat sink 1;

[0120] Two rows of single-tube devices 2 are respectively arranged in the first rectangular area 12 and the second rectangular area 13;

[0121] A plurality of single-tube devices 2 are arranged in each row;

[0122] The terminals of the single-tube device 2 are distributed along the short axis of the heat sink 1 .

[0123] Specifically, in order to achieve a more compact device layout, in this embodiment, a first rectangular area 12 and a second rectangular area 13 are provided on the first surface of the heat sink 1 .

[0124] The first rectangular region 12 and the second rectangular region 13 have a certain dislocation in the short axis direction, so as to match different module structure designs.

[0125] A wider spacing area is provided between the first rectangular area 12 and the second rectangular area 13 to facilitate operations such as wiring.

[0126] Two rows of single-tube devices 2 are respectively arranged in the first rectangular area 12 and the second rectangular area 13 .

[0127] Taking the first rectangular area 12 as an example, the first rectangular area 12 is a rectangle with two rows of single-tube devices 2 arranged along the long axis direction of the rectangle. The terminals of the single-tube devices 2 are distributed along the short axis of the heat sink 1, and usually the power output terminal is arranged close to the power input terminal.

[0128] With this arrangement, when configuring the H-bridge driving circuit, the terminals of the single-tube devices 2 in the upper and lower rows can be directly connected to form the midpoint of the circuit for lead-out.

[0129] Similarly, the second rectangular area 13 is a rectangle, in which two rows of single-tube devices 2 are arranged along the long axis direction of the rectangle, and the terminals of the single-tube devices 2 are distributed along the short axis of the heat sink 1, usually with the power output terminal and the power input terminal arranged close to each other.

[0130] In one embodiment, the insulating pad 3 is provided with matching rectangular insulating pad openings 31 at positions corresponding to the positions where the single-tube devices exist in the first rectangular area 12 and the second rectangular area 13 .

[0131] Specifically, to achieve the assembly process, in this embodiment, the insulating pad 3 is provided with matching rectangular insulating pad openings 31 at positions corresponding to the single-tube devices in the first rectangular area 12 and the second rectangular area 13 .

[0132] Specifically, the insulating pad 3 is firstly provided with rectangular openings corresponding to the first rectangular area 12 and the second rectangular area 13 .

[0133] Two rows of single-tube devices 2 are respectively arranged in the first rectangular area 12 and the second rectangular area 13. The rectangular area is a rectangle. Two rows of single-tube devices 2 are arranged along the long axis direction of the rectangle. Each row is provided with multiple columns of single-tube devices 2. The terminals of the single-tube devices 2 are distributed along the short axis of the heat sink 1, and the power output terminal is usually arranged close to the power input terminal.

[0134] Then, in the two rows of single-tube devices, there is an area without single-tube devices 2, and for this area, the insulating pad 3 forms a complete connection area.

[0135] The connection area can shield the connection point between the upper power output terminal and the power input terminal, thereby preventing creepage between the connection point and the heat sink 1 below.

[0136] In one embodiment, a plurality of first insulating pad fixing holes 14 are provided on the first surface of the heat sink 1;

[0137] A matching second insulating pad fixing hole 22 is provided on the insulating pad 3 at a position corresponding to the first insulating pad fixing hole 14;

[0138] The first insulating pad fixing hole 14 and the second insulating pad fixing hole 22 are matched and fixed by screws.

[0139] Specifically, in order to achieve effective fixation of the insulating pad 3, in this embodiment, a plurality of first insulating pad fixing holes 14 are provided on the first surface of the radiator 1, and matching second insulating pad fixing holes 22 are provided on the insulating pad 3 at positions corresponding to the first insulating pad fixing holes 14, which are fixed by matching screws.

[0140] Specifically, during assembly, the insulating pad 3 is firstly put on the welding boss 11 so that the insulating pad 3 is attached to the heat sink.

[0141] Then, the position of the insulating pad 3 is adjusted so that the first insulating pad fixing hole 14 is aligned with the second insulating pad fixing hole 22 .

[0142] Subsequently, the first insulating pad fixing hole 14 and the second insulating pad fixing hole 22 are matched and fixed by screws.

[0143] Then, solder and the single-tube device 2 are placed on the soldering boss 11 so that the substrate 22 contacts the soldering boss 11, and soldering is performed.

[0144] During the soldering process, the soldering method is reflow soldering or silver paste sintering.

[0145] The welding material is one of SnSb, SnAg, PbSnAg or SnAgCu solder;

[0146] The welding or sintering temperature is controlled between 100℃ and 300℃.

[0147] Based on the above process, the insulating pad 3 separates the single-tube device 2 and the heat sink, thereby avoiding the creepage phenomenon that may be generated when the power device is working.

[0148] In one embodiment, the material of the insulating pad 3 includes at least one of glass fiber, polyimide, liquid crystal polymer, and epoxy resin.

[0149] Specifically, in order to achieve a better insulation effect, in this embodiment, the material of the insulation pad is configured to be at least one of glass fiber, polyimide, liquid crystal polymer, and epoxy resin, thereby achieving a better insulation effect.

[0150] In one embodiment, a heat dissipation component 15 is distributed on the second surface of the heat sink 1;

[0151] The heat dissipation component 15 is vertically arranged on the radiator;

[0152] The heat dissipation component 15 is cylindrical, rectangular, elliptical or truncated cone-shaped.

[0153] Specifically, to achieve a better heat dissipation effect, in this embodiment, a heat dissipation component 15 is distributed on the second surface of the radiator 1. The heat dissipation component 15 is vertically arranged on the radiator to achieve heat dissipation by contacting with an external cooling medium.

[0154] Specifically, taking the water cooling module as an example, the heat dissipation component 15 is vertically arranged on the radiator and has a plurality of cylindrical structures, which form a relatively dense comb-like structure.

[0155] When the module is assembled, the heat dissipation component 15 is set downward and immersed in the cooling channel. The cooling channel circulates cooling water through a circulating pump to take away the heat from the heat dissipation component 15, and then introduces it into the external radiator component to dissipate heat through a fan.

[0156] In other embodiments, such as air-cooling embodiments, the heat dissipation assembly 15 is used to extract the heat from the link of the power chip 23-substrate 22-welding boss 11, and then dissipate the heat through the passing air, thereby achieving heat dissipation.

[0157] In one embodiment, a heat dissipation component 15 is distributed on the second surface of the heat sink 1;

[0158] The heat dissipation components 15 are distributed at positions corresponding to the first rectangular area and the second rectangular area where the single-tube devices 2 are arranged.

[0159] Specifically, in order to achieve a better module weight reduction effect, in this embodiment, the position of the heat dissipation component 15 is adjusted, and the heat dissipation component 15 is set at a position corresponding to the first rectangular area and the second rectangular area where the single-tube device 2 is set. Weight reduction is achieved by reducing the area of ​​the heat dissipation component 15, and concentrated heat dissipation is performed at the heat source concentrated position to achieve better efficiency.

[0160] The terms used in the embodiments of this specification are only for the purpose of describing specific embodiments, and are not intended to limit this specification. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification should be the common meanings understood by people with ordinary skills in the field to which this specification belongs.

[0161] The words "first", "second" and similar terms used in this specification and claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, the words "a" or "an" and similar terms do not indicate a quantity limitation, but indicate the presence of at least one. "Multiple" or "several" means two or more.

[0162] Unless otherwise indicated, words such as "front", "rear", "lower" and / or "upper" are used for convenience of description only and are not limited to a position or a spatial orientation. Words such as "include" or "comprise" mean that the elements or objects listed before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects.

[0163] The words "connected" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0164] As used in this specification and the appended claims, the singular forms "a", "an", "said", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0165] The term "and / or" in the present application means at least one of the two. For example, "A and / or B" may include three options: A, B, and "A and B".

[0166] The various embodiments in the present application are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0167] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A single-tube hybrid vehicle power module, characterized in that: Including radiator; The radiator is in the shape of a long strip; A plurality of single-tube devices are distributed on the first surface of the heat sink, and the terminals of the single-tube devices are connected to an external circuit; Also included are insulating pads; The insulating pad is in the shape of a long strip; The outer contour of the insulating pad extends outwardly with a first width relative to the outer contour of the heat sink; The insulating pad is provided with a through hole at a position corresponding to the single-tube device; The insulating pad is arranged in a gap region between the single-tube device and the heat sink; The edge of the insulating pad protrudes from the heat sink to prevent the terminal of the single-tube device from generating creepage during operation.

2. The hybrid vehicle power module according to claim 1, characterized in that: The single-tube device comprises a packaging shell; The packaging shell is in the shape of a long cube, and a long cube-shaped cavity is arranged inside; A substrate is arranged inside the packaging shell, and the substrate is in the shape of an elongated cube; A power chip is mounted on the first surface of the substrate; A power input terminal is welded to the first end of the substrate; The other end of the power input terminal passes through the packaging shell; The second ends of the substrate facing each other are respectively provided with a signal terminal and a power output terminal; The other ends of the signal terminal and the power output terminal pass through the packaging shell respectively; The chip pins of the power chip are respectively connected to the power input terminal, the signal terminal and the power output terminal.

3. The hybrid vehicle power module according to claim 2, characterized in that: The power input area of ​​the power chip is arranged on the back side of the power chip; The power input region is located in the region between the substrate and the power chip; The power input area is connected to the power input terminal through the printed circuit of the substrate; The front side of the power chip is respectively provided with a signal area and a power output area; The signal area is connected to the signal terminal via a bonding wire; The power output region is connected to the power output terminal via a bonding wire.

4. The hybrid vehicle power module according to claim 2, characterized in that: A plurality of welding bosses are distributed on the first surface of the heat sink; The height of the welding boss matches the thickness of the insulating pad; The second surface of the substrate exposes the packaging shell; The second surface of the substrate is fixedly welded to the surface of the welding boss.

5. The hybrid vehicle power module according to claim 1, characterized in that: A first rectangular area and a second rectangular area are provided on the first surface of the heat sink; Two rows of the single-tube devices are respectively arranged in the first rectangular area and the second rectangular area; A plurality of the single-tube devices are arranged in each row; The terminals of the single-tube device are distributed along the short axis of the heat sink.

6. The hybrid vehicle power module according to claim 5, characterized in that: The insulating pad is provided with matching rectangular insulating pad openings at positions corresponding to the first rectangular area and the second rectangular area where the single-tube device exists.

7. The hybrid vehicle power module according to claim 1, characterized in that: A plurality of first insulating pad fixing holes are provided on the first surface of the radiator; A matching second insulating pad fixing hole is provided on the insulating pad at a position corresponding to the first insulating pad fixing hole; The first insulating pad fixing hole and the second insulating pad fixing hole are matched and fixed by screws.

8. The hybrid vehicle power module according to claim 1, characterized in that: The material of the insulating pad includes at least one of glass fiber, polyimide, liquid crystal polymer, and epoxy resin.

9. The hybrid vehicle power module according to claim 1, characterized in that: The second surface of the radiator is provided with a heat dissipation component; The heat dissipation assembly is vertically arranged on the radiator; The heat dissipation component is cylindrical, rectangular, elliptical or truncated cone-shaped.

10. The hybrid vehicle power module according to claim 5, characterized in that: The second surface of the radiator is provided with a heat dissipation component; The heat dissipation components are distributed at positions corresponding to the first rectangular area and the second rectangular area where the single-tube devices are arranged.

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