One-piece composite liquid-absorbing core heat sink and manufacturing method
Through the one-piece composite liquid-absorbing core structure, combined with the tree-like and circular protrusion design, the problems of large human resource requirements and insufficient heat transfer performance of traditional heat spreaders are solved, and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202411816816.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2044-12-11
AI Technical Summary
Traditional heat sink cooling devices require a lot of manpower and have insufficient heat transfer performance, making it difficult to effectively meet the cooling needs of high-power chips.
An integrated composite liquid-absorbing core structure is adopted, including a cover plate and a bottom plate. A composite liquid-absorbing core is provided on the inner side of the bottom plate, which is composed of a first plane wire mesh and a spiral woven mesh. A second plane wire mesh is provided on the inner side of the cover plate. The two are connected into an integrated structure through copper columns. The design of the dendritic structure and circular protrusions is combined to improve the liquid reflux capacity and heat transfer efficiency.
It significantly reduces human resource requirements, improves heat dissipation efficiency and heat distribution performance, and can effectively dissipate heat from high-power chips in a short period of time to meet work needs.
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Figure CN119812134B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic heat dissipation, and in particular to an integrally formed composite liquid wick vapor chamber and a manufacturing method thereof. Background Art
[0002] With the rapid development of the Internet industry, the power of communication equipment chips has increased. When other communication equipment is running, the chips generate a large heat flux density, causing the chip temperature to be too high, resulting in frequency loss and overclocking.
[0003] Traditional heat spreader heat sinks usually use a flat wire mesh structure or a flat wire mesh and copper powder sintered wick structure. The base plate and cover plate wick are connected by powder ring connection, which requires more manpower. Summary of the Invention
[0004] In order to improve multiple technical problems, the present invention provides an integrated composite liquid-absorbing core heat sink and a manufacturing method. From the perspective of high-power chip heat dissipation, the integrated composite liquid-absorbing core heat sink has high thermal conductivity and low thermal resistance. It can transfer the heat of the chip to the heat dissipation fins in a short time and dissipate the heat, so that the high-power chip can meet the working range. In addition, it also provides
[0005] The present invention provides the following technical solutions:
[0006] An integrally formed composite liquid-absorbing core heat spreader includes a cover plate and a base plate, which together form a heat spreader shell. A composite liquid-absorbing core is provided on the inner side of the base plate, which is composed of a first planar wire mesh and a spirally woven mesh. A second planar wire mesh is provided on the inner side of the cover plate, which serves as the liquid-absorbing core. The first planar wire mesh is connected to the second planar wire mesh through a copper column to form an integral structure.
[0007] The first plane screen has an annular protrusion, which replaces the traditional way of placing powder rings and greatly reduces manpower.
[0008] The copper column has the same inner diameter and height as the circular protrusion of the first flat screen. This design is to allow the liquid at the cover plate to flow back to the bottom plate through the flat screen, further improving the heat dissipation performance of the heat dissipation plate.
[0009] The spiral woven mesh has a dendritic structure at the evaporation end and the condensation end. The dendritic branches are tangent to the circular protrusions of the first flat screen. This design greatly improves the liquid reflux capacity. The cross-sectional size of the spiral woven mesh is 0.26mm×2.6mm.
[0010] The first flat screen adopts a 200-mesh double-layer structure, the 200-mesh flat screen adopts a double-strand 0.05mm wire diameter, and the 100-mesh flat screen adopts a double-strand 0.1mm wire diameter.
[0011] The cross-sectional size of the spiral braided mesh is 0.26 mm×2.6 mm.
[0012] The second flat screen is a single-layer 100-mesh flat screen, which has a double-strand 0.05 mm wire diameter.
[0013] The manufacturing method of the integrally formed composite liquid wick vapor chamber comprises the following steps:
[0014] Step 1: manufacture at least four cover plates and base plates, a welding mesh mold, a riveting mold, and a diffusion welding graphite mold;
[0015] Step 2: Place the spiral woven mesh on a graphite mold with a strip groove depth of 1 mm for annealing to eliminate internal stress and finalize the shape;
[0016] Step 3: Trim the spiral woven mesh into a dendritic structure at the evaporation end and the condensation end and place it in a welded mesh graphite mold with a strip groove depth of H. Place a first flat wire mesh on the upper part of the spiral woven mesh and sinter it into an integrated composite liquid wick;
[0017] Step 4: The bottom plate and the sintered composite liquid-absorbing core are first fixed to the mesh, and then the copper column is placed in the circular protrusion of the first flat screen, the circular protrusion of the flat screen and the copper column are placed in the cylindrical groove of the graphite, and the spiral mesh is placed in the strip groove of the graphite mold. The bottom plate, the composite liquid-absorbing core and the graphite module are placed in a resistance welding furnace for sintering; at the same time, the cover plate and the second flat screen are fixed to the mesh and sintered together to form the liquid-absorbing core;
[0018] Step 5, annealing the sintered composite absorbent core and the absorbent core and testing the water absorption capacity of the absorbent core;
[0019] Step 6: After the sintered cover plate and base plate are placed in a riveting mold for integral molding, they are then placed in a diffusion welding graphite mold for diffusion welding to form a heat spreader.
[0020] Step 7: Vacuum the heat sink, perform secondary degassing, and weld the liquid injection pipe;
[0021] Step 8: Fill the heat spreader with liquid, trim the edges, level it, and perform surface treatment.
[0022] Compared with the prior art, the present invention has the following beneficial effects:
[0023] The present invention provides a method for manufacturing an integrally formed composite vapor chamber. Compared to existing technologies, this radiator and heat dissipation system has the following advantages:
[0024] (1) The one-piece composite liquid wick heat spreader is a flat wire mesh composite spiral woven mesh design structure, in which the spiral woven mesh has a dendritic liquid wick structure at the evaporation end and the condensation end. This design is conducive to the rapid flow of liquid from the condensation end to the heat source at the evaporation end. Since the evaporation end is also a dendritic liquid wick structure, it is conducive to the uniform dispersion of the liquid at the evaporation end, thereby increasing the gas-liquid flow rate and further improving the heat transfer performance of the heat spreader.
[0025] (2) In the manufacturing method of the integrally formed composite liquid-absorbing core heat spreader, the heat spreader liquid-absorbing core is integrally formed. The integrally formed liquid-absorbing core has a circular ring protrusion instead of the traditional method of placing the powder ring, which reduces the steps of the traditional method of placing the powder ring, greatly reduces labor, and improves the efficiency of heat spreader manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 This is an overall exploded view of the heat sink provided in the embodiment of the present invention.
[0027] Figure 2 These are the steps for manufacturing the heat spreader of the embodiment provided by the present invention.
[0028] Figure 3 It is the three-dimensional structure of the spiral woven mesh of the embodiment provided by the present invention.
[0029] Figure 4 It is the three-dimensional structure of the flat screen of the embodiment provided by the present invention.
[0030] Figure 5 The embodiment provided by the present invention Figure 4 Partial view of location A.
[0031] Figure 6 It is a three-dimensional structure formed by combining a flat wire mesh and a spiral woven mesh in the embodiment provided by the present invention.
[0032] Figure 7 The invention provides a mold for compositely forming a flat wire mesh and a spiral woven mesh.
[0033] Figure 8 The invention discloses a heat spreader riveting die according to an embodiment of the present invention.
[0034] The following are marked in the figure:
[0035] 101 bottom plate, 102 first plane wire mesh, 103 spiral woven mesh, 104 copper column, 105 second plane wire mesh, 106 cover plate. DETAILED DESCRIPTION
[0036] The present invention is described in detail below with reference to the embodiments and accompanying drawings. However, it should be understood that the embodiments and accompanying drawings are merely exemplary descriptions of the present invention and do not constitute any limitation on the scope of protection of the present invention. All reasonable variations and combinations within the scope of the inventive concept of the present invention fall within the scope of protection of the present invention.
[0037] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "rear", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting the present invention. The terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. In addition, unless otherwise expressly specified and limited, the terms "disposed", "installed", "connected", and "connected" should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrally connected; they can be mechanically connected or electrically connected; they can be directly connected or indirectly connected through an intermediate medium, or they can be internal communication between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0038] The present invention will be further described below with reference to the accompanying drawings.
[0039] Example 1
[0040] like Figure 1 As shown, the present invention provides an integrally formed composite liquid-absorbing core heat-absorbing plate, which mainly includes a cover plate 106 and a bottom plate 101, and the cover plate 106 and the bottom plate 101 form a heat-absorbing plate shell; a composite liquid-absorbing core is provided on the inner side of the bottom plate 101, and the composite liquid-absorbing core is composed of a first plane screen 102 and a spiral woven screen 103; a second plane screen 105 is provided on the inner side of the cover plate 106, and the second plane screen 105 serves as the liquid-absorbing core; the composite liquid-absorbing core contacted by the bottom plate 101 is a composite structure composed of the first plane screen 102 and the spiral woven screen 103, and the first plane screen 102 is formed by The copper column 104 is connected to the second flat screen 105 as an integrated structure, and the spiral woven mesh 103 is a dendritic structure at the evaporation end and the condensation end. The spiral woven mesh 103 can provide a greater capillary force than the flat screen. The dendritic spiral woven mesh 103 at the evaporation end and the condensation end can well return the liquid at the condensation end to the heat source at the evaporation end, which can improve and accelerate the efficiency of the gas-liquid circulation of the liquid wick, so that the entire heat spreader has better heat dissipation performance; the liquid wick contacted by the cover plate 106 has only one layer of the second flat screen 105 liquid wick structure.
[0041] like Figure 4 and Figure 5 As shown, the first plane screen 102 in contact with the bottom plate 101 has a circular protrusion, which replaces the traditional way of placing powder rings and greatly reduces human resources.
[0042] like Figure 3 A spiral woven mesh 103 is positioned above the first flat mesh 102 in contact with the bottom plate 101. It has a dendritic structure at both the evaporation and condensation ends, with the branches tangent to the circular protrusions of the first flat mesh. The cross-sectional dimensions of the spiral woven mesh 103 are 0.26 mm x 2.6 mm.
[0043] like Figure 6 As shown, at the condensing end, the spiral woven mesh 103 is tangent to the circular protrusion of the first planar screen 102, greatly improving liquid reflux. Inside the vapor chamber, an array of copper pillars 104 serves as support columns. Copper pillars 104 have the same inner diameter and height as the circular protrusion of the first planar screen 102. This design allows liquid at the cover plate 106 to flow back to the base plate 101 through the second planar screen 105 and the first planar screen 102, further improving the spiral vapor chamber's heat dissipation performance.
[0044] The first flat screen 102 adopts a 200-mesh double-layer structure. The 200-mesh flat screen adopts a double-strand 0.05mm wire diameter, and the 100-mesh flat screen adopts a double-strand 0.1mm wire diameter. The double-layer aperture forms a V-shape, which helps the bubbles to detach and improves the temperature uniformity of the entire heat spreader. The second flat screen 105 adopts a single-layer 100-mesh liquid absorbent core; this design improves the reflux capacity of the entire liquid absorbent core, and also increases the gas channel, which is conducive to better gas flow, further improving the temperature uniformity of the entire heat spreader.
[0045] Example 2
[0046] like Figure 2 As shown, the present invention also provides a method for manufacturing an integrally formed composite liquid wick vapor chamber, the steps comprising:
[0047] Step 1: Make at least four cover plates 106 and base plates 101, such as Figure 7 The welding mesh mold shown, Figure 8 The riveting die shown;
[0048] Step 2: Place the spiral woven mesh 103 on a graphite mold with a strip groove depth of 1 mm and perform annealing to eliminate internal stress and finalize the shape;
[0049] Step 3: Trim the spiral woven mesh 103 into a dendritic structure at the evaporation end and the condensation end and place it in a welded mesh graphite mold with a strip groove depth of H. Place the first flat wire mesh 102 on top of the spiral woven mesh 103 and sinter them into an integrated composite liquid wick.
[0050] Step 4: The bottom plate 101 and the sintered composite liquid-absorbing core are first fixed to the mesh, and then the copper column 104 is placed in the circular protrusion of the first flat screen, the circular protrusion of the flat screen and the copper column are placed in the cylindrical groove of the graphite, and the spiral mesh is placed in the strip groove of the graphite mold. The bottom plate 101, the composite liquid-absorbing core and the graphite module are placed in a resistance welding furnace for sintering; at the same time, the cover plate 106 and the second flat screen 105 are fixed to the mesh and sintered together to form the liquid-absorbing core;
[0051] Step 5, annealing the sintered composite absorbent core and the absorbent core and testing the water absorption capacity of the absorbent core;
[0052] Step 6: After the sintered cover plate 106 and base plate 101 are placed in a riveting mold for integral molding, they are then placed in a diffusion welding graphite mold for diffusion welding to form a vapor chamber.
[0053] Step 7: Vacuum the heat sink, perform secondary degassing, and weld the liquid injection pipe;
[0054] Step 8: Perform post-processing on the heat spreader, including filling, trimming, leveling, and surface treatment.
[0055] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be considered as equivalent replacement methods and are included in the scope of protection of the present invention.
Claims
1. One-piece composite liquid wick heat sink, characterized by: The invention comprises a cover plate (106) and a bottom plate (101), wherein the cover plate (106) and the bottom plate (101) form a heat soaking plate shell; a composite liquid wick is provided on the inner side of the bottom plate (101), and the composite liquid wick is composed of a first plane screen (102) and a spiral woven screen (103); a second plane screen (105) is provided on the inner side of the cover plate (106), and the second plane screen (105) serves as the liquid wick; the first plane screen (102) is connected to the second plane screen (105) through a copper column (104) to form an integrated structure; The spiral woven mesh (103) has a dendritic structure at the evaporation end and the condensation end. The first plane screen (102) in contact with the bottom plate (101) has a circular protrusion. The dendritic bifurcation is tangent to the circular protrusion of the first plane screen (102). The copper column (104) has the same inner diameter and height as the circular protrusion of the first plane screen (102).
2. The integrally formed composite liquid wick vapor chamber according to claim 1, characterized in that: The first planar screen (102) adopts a 200-mesh double-layer structure, and the 200-mesh planar screen adopts a double-strand 0.05 mm wire diameter.
3. The integrally formed composite liquid wick vapor chamber according to claim 1, characterized in that: The second flat screen (105) is a single-layer 100-mesh flat screen.
4. The integrally formed composite vapor chamber according to claim 1, wherein: The cross-sectional size of the spiral braided mesh is 0.26 mm×2.6 mm.
5. The method for manufacturing the integrally formed composite vapor chamber according to any one of claims 1 to 4, characterized in that: The following steps are involved: Step 1: manufacturing a cover plate (106), a base plate (101), a welding mesh mold, a riveting mold, and a diffusion welding graphite mold; Step 2: placing the spiral braided mesh (103) on a graphite mold with a strip groove depth of 1 mm for annealing to eliminate internal stress and finalize the shape; Step 3: trimming the spiral woven mesh (103) into a dendritic structure at the evaporation end and the condensation end and placing it in a welded mesh graphite mold with a strip groove depth of 0.22 mm, placing a first flat wire mesh (102) on the upper part of the spiral woven mesh (103), and sintering them into a composite liquid wick in an integrated manner; Step 4: The bottom plate (101) and the sintered composite liquid absorbent core are first subjected to a fixed mesh treatment, and then the copper column (104) is placed in the first plane screen ring protrusion, the plane screen ring protrusion and the copper column are placed in the graphite cylindrical groove, and the spiral mesh is placed in the graphite mold strip groove. The bottom plate (101), the composite liquid absorbent core and the graphite module are placed in a resistance welding furnace for sintering treatment; at the same time, the cover plate (106) and the second plane screen (105) are fixed and sintered together to form the liquid absorbent core; Step 5, annealing the sintered composite absorbent core and the absorbent core and testing the water absorption capacity of the absorbent core; Step 6: The sintered cover plate (106) and base plate (101) are first placed in a riveting mold for integral molding, and then placed in a diffusion welding graphite mold for diffusion welding, and welded together to form a heat spreader; Step 7: Vacuum the heat sink, perform secondary degassing, and weld the liquid injection pipe; Step 8: Fill the heat spreader with liquid, trim the edges, level it, and perform surface treatment.
Citation Information
Patent Citations
Vapor chamber with gradient wick structure and preparation method thereof
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