Lightweight high-efficiency heat dissipation phased-array antenna device

Abstract

The invention relates to a lightweight high-efficiency heat dissipation phased array antenna device, which comprises a circuit board, the circuit board comprises an upper surface and a lower surface, the upper surface is provided with radio frequency modules arranged in an array, the lower surface is provided with a power supply module and a control module, and the power supply module is electrically connected with the control module and the radio frequency modules; the electromagnetic signal shielding net is arranged on the circuit board and covers the radio frequency modules, and the electromagnetic signal shielding net forms a first heat dissipation channel in the interval extension direction of the adjacent radio frequency modules; and the radiation array element layer is arranged on the electromagnetic signal shielding net, the radiation array element layer comprises antenna radiation arrays in one-to-one correspondence with the radio frequency modules in position, and the antenna radiation arrays are electrically connected with the radio frequency modules.

Description

Technical Field

[0001] The present application relates to the field of antenna technology, and in particular to a lightweight and efficient heat dissipation phased array antenna device. Background Art

[0002] Phased antennas are the core part of phased array systems, especially two-dimensional active phased array antennas. Their integration level determines the performance and level of the entire phased array system. Active phased array antennas can be roughly divided into brick and tile types according to the assembly method of the circuit. Brick-type active phased array antennas can be considered as the first generation of products, with the disadvantages of heavy weight, bulky volume, and difficult production and assembly. The tile-type active phased array antenna is a second-generation product. It uses the method of horizontal integration and vertical assembly to distribute MMIC in a plane parallel to the antenna aperture surface, and forms a phased array through the stacking assembly of the bus. Compared with the brick-type finite element phased array antenna, the weight and volume are greatly reduced. The cost of the tile-type TR component is 76% lower than that of the brick-type TR component side, and the volume and weight are 86% and 67% of the brick-type TR component respectively. The existing tile-type active phased array architecture includes antenna array surface, T / R component, and beamforming network, etc. When the antenna receives and transmits signals, electronic interference will be generated between the RF channels of each antenna, affecting the stability of the signal.

[0003] In order to solve this technical problem, the related technology often adopts the method of setting a shielding layer around the RF module to achieve shielding of the RF module. However, the related technology requires the use of a shielding layer and an isolation fence in combination, and both are solid structures. Although the RF module is shielded, a sealed chamber is formed around the RF module, which makes it difficult for the heat of the RF module to dissipate, and the use of a solid shielding layer is likely to increase the weight of the RF antenna. Summary of the invention

[0004] The present application provides a lightweight and efficient heat dissipation phased array antenna device, which can solve the technical problem that the existing lightweight and efficient heat dissipation phased array antenna device requires an additional fill light component, resulting in an increase in product thickness.

[0005] A lightweight and efficient heat dissipation phased array antenna device, comprising: A circuit board, the circuit board comprising an upper surface and a lower surface, the upper surface being provided with an array of radio frequency modules, the lower surface being provided with a power module and a control module, the power module being electrically connected to the control module and the radio frequency module; an electromagnetic signal shielding net, which is disposed on the circuit board and covers the radio frequency module, and the electromagnetic signal shielding net forms a first heat dissipation channel in the direction of extension of the interval between adjacent radio frequency modules; and The radiation element layer is arranged on the electromagnetic signal shielding net, and the radiation element layer includes antenna radiation arrays corresponding to the positions of the radio frequency modules one by one, and the antenna radiation arrays are electrically connected to the radio frequency modules.

[0006] In one embodiment, the lightweight and efficient heat dissipation phased array antenna device also includes a lower hollow bracket, which is arranged on the upper surface of the circuit board. The lower hollow bracket includes a first plate body with a plurality of first windows and a plurality of internal heat dissipation corner columns located around each first window. The first windows correspond one-to-one to the RF modules, and the RF modules extend from the first windows. The electromagnetic signal shielding net is arranged on the surface of the lower hollow bracket.

[0007] In one embodiment, the lightweight and efficient heat dissipation phased array antenna device also includes an upper hollow bracket, which is arranged on the lower hollow bracket, and the upper hollow bracket includes a second plate body with a second window and a plurality of external support columns arranged around each second window; the position of the second window corresponds one-to-one to the position of the first window, the external support columns and the inner heat dissipation corner columns jointly limit the electromagnetic signal shielding net, and the upper hollow bracket reveals the electromagnetic signal shielding net.

[0008] In one embodiment, each of the inner heat dissipation corner columns includes a guide groove opened along its length direction, and a plurality of the guide grooves jointly limit the RF module.

[0009] In one embodiment, the side of the antenna radiating array facing the upper hollow bracket is a convex arc surface, and the side of the antenna radiating array away from the upper hollow bracket is a concave arc surface. A radiation module is arranged in the concave arc surface of the antenna radiating array, and the radiation module is electrically connected to the radio frequency module.

[0010] In one of the embodiments, the electromagnetic signal shielding net is a flexible wire mesh, and a surface of the electromagnetic signal shielding net facing the radio frequency module is provided with a plurality of supporting parts for flattening the electromagnetic signal shielding net.

[0011] In one of the embodiments, the electromagnetic signal shielding net is a rigid wire mesh, and the electromagnetic signal shielding net includes a plurality of covering parts corresponding to the radio frequency modules one by one, each covering part is covered on one of the radio frequency modules, and each covering part is spaced apart from the radio frequency module to form the first heat dissipation channel.

[0012] In one embodiment, the electromagnetic signal shielding net includes an inner shielding net and an outer heat dissipation net arranged on the surface of the inner shielding net, and the mesh size of the inner shielding net is smaller than the mesh size of the outer heat dissipation net, and the mesh density of the inner shielding net is greater than the mesh density of the outer heat dissipation net.

[0013] In one of the embodiments, it also includes a heat dissipation enhancement structure. The heat dissipation enhancement structure is square and includes multiple cover plates and folded edges surrounding the cover plates. The cover plates are fixed to the top surface of the RF module, and the folded edges on the adjacent sides are disconnected. The folded edges are made of shape memory alloy. The folded edges are in a curled state when the temperature is low, and will automatically unfold when the temperature generated when the RF module is working is too high.

[0014] In one of the embodiments, the heat dissipation enhancement structure includes a folded edge and a cover sheet in which coolant is sealed, and a blocking bar is provided at the junction of the cover sheet and each folded edge, so that a certain amount of coolant is stored in the cover sheet.

[0015] The present application provides a lightweight and efficient heat dissipation phased array antenna device, which can achieve the following technical effects: 1. The solution provided in the present application is to set an electromagnetic signal shielding net between the radio frequency module and the antenna radiation element. Since the electromagnetic signal shielding net is in a mesh shape, it can reduce the weight of the entire device while playing an electromagnetic shielding role, so that the electromagnetic signal shielding net forms a first heat dissipation channel in the extension direction of the interval between adjacent radio frequency modules, and can also improve the heat dissipation effect of the entire device.

[0016] 2. In the solution provided in this application, the radiation element layer is provided with a concave arc surface, and the electromagnetic waves are focused by the reflective surface, thereby enhancing the directivity of the beam. This design can make the antenna gain higher and the directivity stronger.

[0017] 3. The solution provided in the present application also includes a heat dissipation enhancement structure. The heat dissipation enhancement structure is square and includes multiple cover plates and folded edges surrounding the cover plates. The cover plates are fixed to the top surface of the RF module to maintain the stable position of the electromagnetic signal shielding net. The folded edges on the adjacent sides are disconnected. The cover plates are arranged on the surface of the electromagnetic signal shielding net. The folded edges are made of shape memory alloy. The folded edges are in a curled state when the temperature is low. The heat dissipation enhancement structure mainly utilizes the cover plates to enhance heat dissipation. When the temperature generated during the operation of the RF module is too high, it will automatically unfold to be located on the side of the electromagnetic signal shielding net to quickly conduct heat. The folded edges and the cover plates jointly dissipate heat. When the folded edges are unfolded, the heat dissipation area can be increased, thereby optimizing the heat dissipation effect, thereby achieving a dynamic heat dissipation effect inside the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a lightweight and efficient heat dissipation phased array antenna device provided in the first embodiment of the present application; Figure 2 yes Figure 1 A schematic diagram of the structure of a lightweight and efficient heat dissipation phased array antenna device flipped 180 degrees is provided; Figure 3 This application Figure 1 A schematic diagram of the internal structure of a lightweight and efficient heat dissipation phased array antenna device is provided; Figure 4 yes Figure 1 An exploded view of a lightweight and efficient heat dissipation phased array antenna device is provided; Figure 5 yes Figure 4 Another exploded schematic diagram of a lightweight and efficient heat dissipation phased array antenna device is provided; Figure 6 This application Figure 1 A cross-sectional schematic diagram of a lightweight and efficient heat dissipation phased array antenna device is provided; Figure 7 yes Figure 6 A schematic diagram of an electromagnetic signal shielding net included in the provided lightweight and efficient heat dissipation phased array antenna device; Figure 8 It is a structural schematic diagram of a lightweight and efficient heat dissipation phased array antenna device provided in the second embodiment of the present application; Fig. 9 It is a structural schematic diagram of a lightweight and efficient heat dissipation phased array antenna device provided in the fourth embodiment of the present application.

[0019] Explanation of the accompanying drawings: 100, lightweight and efficient heat dissipation phased array antenna device; 1, circuit board; 10, radio frequency module; 12, power module; 14, control module; 2, electromagnetic signal shielding net; 3, radiation element layer; 30, antenna radiation array; 310, first heat dissipation channel; 4, lower hollow bracket; 402, first window; 42, inner heat dissipation corner column; 5, upper hollow bracket; 50, second plate body; 40, first plate body; 52, outer support column; 301, radiation module; 502, second window; 22, cover part; 21, inner shielding net; 23, outer heat dissipation net; 6, heat dissipation reinforcement structure; 60, cover plate; 62, folded edge; 410, guide groove; 420, second heat dissipation channel; 63, connecting section; 201, heat dissipation hole. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1-9 The lightweight and efficient heat dissipation phased array antenna device and display device provided in the present application are further described in detail.

[0021] Example 1 See also Figure 1-7 This embodiment provides a lightweight and efficient heat dissipation phased array antenna device 100, including a circuit board 1, an electromagnetic signal shielding net 2 and a radiation element layer 3.

[0022] See also Figure 1 and Figure 2The circuit board 1 includes an upper surface and a lower surface, wherein the upper surface is provided with an array of RF modules 10, and the lower surface is provided with a power module 12 and a control module 14, wherein the power module 12 is electrically connected to the control module 14 and the RF module 10. The power module 12 provides the power required for the device to work, and the control module 14 provides the control signal for the normal operation of the device.

[0023] The electromagnetic signal shielding net 2 is arranged on the circuit board 1 and covers the radio frequency module 10. The electromagnetic signal shielding net 2 forms a first heat dissipation channel 310 in the direction of the interval extension of the adjacent radio frequency modules 10. The electromagnetic signal shielding net 2 adopts a mesh structure, and the outside air can enter through the mesh structure of the electromagnetic signal shielding net 2, thereby facilitating the heat dissipation of the radio frequency module 10.

[0024] In this embodiment, the electromagnetic signal shielding net 2 includes a plurality of cover parts 22 corresponding to the radio frequency modules 10, the cover parts 22 are connected to each other, each cover part 22 is covered on one of the radio frequency modules 10, and each cover part 22 is spaced apart from the radio frequency module 10 to form the first heat dissipation channel 310. In other embodiments, the surface of the electromagnetic signal shielding net 2 facing the radio frequency module 10 is provided with a plurality of support parts (not shown), the support parts are honeycomb structures, and the support parts are used to support the electromagnetic signal shielding net 2 while assisting in heat dissipation.

[0025] In this embodiment, the electromagnetic signal shielding net 2 is a flexible wire mesh. The flexible shielding net can be a mesh structure woven of metal wires, and can also be formed by stamping copper foil or aluminum foil. Copper has good conductivity and ductility, and can withstand certain bending and extrusion without breaking easily. Aluminum foil is light and has good ductility, and the cost of aluminum foil is relatively low and easy to form. When using copper foil or aluminum foil for stamping, a number of heat dissipation holes 201 can also be formed on the copper foil or aluminum foil. Multiple heat dissipation holes 201 opposite to the arrangement direction of the RF module can form a second heat dissipation channel 420.

[0026] See also Figure 7 , Figure 7A feasible structure style of electromagnetic signal shielding net 2 is shown. The electromagnetic signal shielding net 2 can also be a conductive polymer film, which has good flexibility and conductivity (such as a polyester film coated with a conductive coating) and can form the required chamber structure during the extrusion process; or conductive silicone, which has high flexibility and elasticity, can withstand repeated extrusion deformation and is not easy to break, or a composite material metal coated fabric, which is plated with a layer of metal (such as copper or aluminum) on the surface of the fabric to obtain good shielding effect and flexibility. The fabric itself has a certain degree of structure and can withstand extrusion; or conductive fiber fabric, which is a fabric woven with conductive fibers (such as carbon fibers or metal-doped fibers) and has good shielding effect and flexibility.

[0027] The radiation element layer 3 is disposed on the electromagnetic signal shielding net 2 . The radiation element layer 3 includes antenna radiation arrays 30 corresponding to the positions of the radio frequency modules 10 . The antenna radiation arrays 30 are electrically connected to the radio frequency modules 10 .

[0028] In some optional embodiments, the RF module 10 includes a signal receiving module and a signal transmitting module, and both the transmitting module and the receiving module can generate and receive electromagnetic waves; the signal transmitting module includes a driving amplifier and a power amplifier; the signal transmitting module includes a control switch, a phase shifter, and a driving amplifier. When the RF module 10 is in the transmitting state, the excitation signal passes through the control switch, the phase shifter, and the driving amplifier, and drives the high-power amplifier to amplify the small signal and output it to the antenna radiation array 30. The control switch here refers to the T / R switch. When the RF module 10 is in the receiving state, the signal received from the antenna enters the limiter through the switch conversion, and then enters the receiver through the low noise amplifier, the attenuator, the shifter, and finally through the transceiver switch, thereby realizing signal amplification. The transceiver and the shifter are shared by the transceiver converter. The signal is controlled by the beam control module 14, and the beam execution and shape phase control are performed according to the predetermined working mode.

[0029] In one of the more specific embodiments, the lightweight and efficient heat dissipation phased array antenna device 100 also includes a lower hollow bracket 4, which is arranged on the upper surface of the circuit board 1, and the lower hollow bracket 4 includes a first plate body 40 having a plurality of first windows 402 and a plurality of inner heat dissipation corner columns 42 located around each first window 402, the first windows 402 corresponding to the RF modules 10 one by one, the RF modules 10 extending from the first windows 402 and the four sides of the RF modules 10 are in contact with the inner heat dissipation corner columns 42, and the height of the inner heat dissipation corner columns 42 is higher than the height of the RF module 10 extending from the first windows 402, and the electromagnetic signal shielding net 2 is arranged on the surface of the lower hollow bracket 4.

[0030] See also Figure 3 and Figure 4 In this embodiment, each inner heat dissipation corner column 42 includes a guide groove 410 opened along its length direction, and the plurality of guide grooves 410 jointly limit the RF module 10.

[0031] That is, in this embodiment, the inner heat dissipation corner column 42 not only limits the RF module 10, but also makes each RF module 10 independent of each other. The contact between the RF module 10 and the inner heat dissipation corner column 42 increases the contact area of ​​heat conduction, which helps to disperse the heat more evenly, thereby improving the heat dissipation efficiency. Since the height of the inner heat dissipation corner column 42 exceeds the height of the RF module 10, the heat around the module can be more evenly diffused to the surrounding environment through these inner heat dissipation corner columns 42, avoiding the heat from being concentrated in the local area of ​​the module. This can ensure the temperature balance around the module, which helps to improve the stability of the system and the reliability of long-term operation. The lower hollow bracket 4 adopts a hollow structure, thereby reducing the overall weight of the device. The inner heat dissipation corner column 42 is slidably provided with a pressing plate (not shown in the figure) on the part of the RF module 10 that is higher than the RF module 10. The pressing plate limits the upper surface of the RF module 10 after the RF module 10 is assembled, and can further dissipate heat when in contact with the RF module 10.

[0032] The lower hollow support 4 is made of insulating material, such as rubber or plastic. The insulating plate presses down the electromagnetic signal shielding net 2 to form a shielding cavity structure, while preventing the flexible shielding net from directly contacting the circuit board 1, causing the exposed contacts on the circuit board 1 to short-circuit.

[0033] In one of the more specific embodiments, the lightweight and efficient heat dissipation phased array antenna device 100 also includes an upper hollow bracket 5, which is arranged on the electromagnetic signal shielding net 2, and the upper hollow bracket 5 includes a second plate body 50 with a second window 502 and a plurality of outer support columns 52 arranged around each second window 502; the position of the second window 502 corresponds one-to-one to the position of the first window 402, the outer support columns 52 and the inner heat dissipation corner columns 42 jointly limit the electromagnetic signal shielding net 2, and the upper hollow bracket 5 exposes the side of the electromagnetic signal shielding net 2, so that outside air can enter the interior of the electromagnetic signal shielding net 2 for heat dissipation.

[0034] See also Figure 5-7 In a more specific embodiment, the side of the antenna radiation element 30 facing the upper hollow bracket 5 is a convex arc surface, which is mainly used to cooperate with the second window 502. The convex arc surface can extend from the second window 502 to press the electromagnetic signal shielding net 2, so that the electromagnetic signal shielding net 2 forms a cavity covering the radio frequency module 10, thereby playing a better shielding role for the radio frequency module 10. The hollow structure of the upper hollow bracket 5 allows the convex arc surface on the radiation element layer 3 to be located therein, thereby further reducing the volume and increasing compactness.

[0035] The side of the antenna radiation array 30 facing away from the upper hollow support 5 is a concave arc surface. A radiation module 301 is arranged in the concave arc surface of the antenna radiation array 30 . The radiation module 301 is electrically connected to the radio frequency module 10 .

[0036] The purpose of the concave arc design of the antenna radiation array 30 is to focus the beam. The concave arc design is similar to the design principle of the parabolic antenna. It can focus electromagnetic waves through the reflective surface, thereby enhancing the directivity of the beam. This design can make the antenna gain higher and more directive. Improve the radiation pattern: In some cases, the concave arc design can help improve the radiation pattern of the antenna, reduce the side lobes (Side Lobes) and the back lobe (Back Lobe), thereby improving the gain and directivity of the main lobe (Main Lobe). The concave arc design can control the width of the beam through the reflective surface, making the beam more concentrated, which is very useful for applications that require high gain and narrow beams. Reduce stray radiation: The concave arc design can help reduce the stray radiation around the antenna, improve the efficiency of the antenna, and reduce interference with other devices. Advantages of the concave arc design Gain improvement: The concave arc design can make the electromagnetic waves more concentrated, thereby increasing the gain of the antenna, which is especially important for long-distance communication. Improve the front-to-back ratio: Through the concave arc design, the front-to-back ratio of the antenna can be improved, the radiation on the back can be reduced, and the front gain of the antenna can be increased. Improve directivity: Antennas with stronger directivity can reduce interference with other devices and improve the overall performance of the communication system. The concave arc design can reduce unnecessary radiation, thereby reducing interference with other devices and improving the electromagnetic compatibility (EMC) of the system.

[0037] When installing the lightweight and efficient heat dissipation phased array antenna device 100, the circuit board 1, the insulating board, the inner heat dissipation corner column 42, the outer support column 52, the hollow bracket, and the radiation element layer 3 are arranged and extruded in sequence. Under the cooperation of the inner heat dissipation corner column 42 and the outer support column 52, the flexible shielding net is extruded to form a chamber structure covering the radio frequency module 10, thereby achieving shielding between the radio frequency modules 10. The mesh structure of the flexible net facilitates the electrical connection between the radiation module 301 of the radiation element layer 3 and the radio frequency module 10, and the radiation module 301 and the radio frequency module 10 can be electrically connected through a wire passing through the mesh of the flexible shielding net.

[0038] Example 2 See also Figure 8A lightweight and efficient heat dissipation phased array antenna device 100 provided in the second embodiment is basically the same as the first embodiment, except that, in the embodiment, it also includes a heat dissipation reinforcement structure 6, the heat dissipation reinforcement structure 6 is square and includes a plurality of cover sheets 60 and a folded edge 62 surrounding the cover sheet 60, the folded edges 62 are connected to each other by a connecting section 63, the cover sheet 60 is fixed to the top surface of the radio frequency module 10 to maintain the position of the electromagnetic signal shielding net 2 stable, and the plurality of folded edges 62 connected to each cover sheet 60 are disconnected, and the cover sheet 60 is arranged on the electromagnetic signal shielding net 2 On the surface, the folded edge 62 is made of shape memory alloy. The folded edge 62 is in a curled state when the temperature is low. The folded edge 62 is curled inward and stored on the top and sides of the RF module 10. The heat dissipation enhancement structure 6 mainly uses the cover plate 60 to enhance heat dissipation. When the temperature generated during the operation of the RF module 10 is too high, it will automatically unfold to be located on the side of the electromagnetic signal shielding net 2 to quickly conduct the heat inside the device. The folded edge 62 and the cover plate 60 jointly dissipate heat. When the folded edge 62 is unfolded, the heat dissipation area can be increased, thereby optimizing the heat dissipation effect, thereby achieving a dynamic heat dissipation effect inside the device.

[0039] Example 3 A lightweight and efficient heat dissipation phased array antenna device 100 provided in the third embodiment is basically the same as the second embodiment, except that, in the present embodiment, the heat dissipation enhancement structure 6 is a cavity structure formed by a shape memory alloy, and the cooling liquid is sealed in the folded edge 62 and the cover sheet 60 included in the heat dissipation enhancement structure 6, and a blocking bar is provided at the junction of the cover sheet 60 and each folded edge 62, and the blocking bar enables a certain amount of cooling liquid to be stored in the cover sheet 60. The folded edge 62 is in a curled state when the temperature is low, and the heat dissipation enhancement structure 6 mainly uses the cover sheet 60 to enhance the heat dissipation. When the temperature generated by the RF module 10 is too high during operation, the cooling liquid in the cavity of the cover sheet 60 heats up rapidly to form steam, and the steam will cause the folded edge 62 to expand rapidly. When the folded edge 62 expands, the cooling liquid in the cover sheet 60 will flow to the folded edges 62 around, and the water vapor and the low-temperature cooling liquid in the folded edge 62 will quickly merge to achieve rapid cooling of the RF module 10, thereby optimizing the heat dissipation effect.

[0040] Example 4 See also Fig. 9 A lightweight and efficient heat dissipation phased array antenna device 100 provided in the fourth embodiment is basically the same as that in the first embodiment, except that, in the present embodiment, the electromagnetic signal shielding net 2 includes an inner shielding net 21 and an outer heat dissipation net 23 arranged on the surface of the inner shielding net 21, wherein the mesh size of the inner shielding net 21 is smaller than the mesh size of the outer heat dissipation net 23, and the mesh density of the inner shielding net 21 is greater than the mesh density of the outer heat dissipation net 23, that is, in the same size, the number of meshes of the inner shielding net 21 is greater than the number of meshes of the outer heat dissipation net 23.

[0041] The mesh size of the inner shielding net 21 is relatively small, which can more effectively shield high-frequency electromagnetic signals and reduce the penetration of electromagnetic interference. The mesh size of the outer heat dissipation net 23 is relatively large, which can provide better air circulation, thereby enhancing the heat dissipation effect. Larger meshes can increase air convection, promote rapid heat dissipation, and avoid heat accumulation. The double-layer structure design of the inner shielding net 21 and the outer heat dissipation net 23 can improve the overall mechanical stability and durability of the device.

[0042] The inner shielding net 21 and the outer heat dissipation net 23 can also be formed by weaving flexible wires. Of course, it can be understood that the inner shielding net 21 and the outer heat dissipation net 23 can also be made of metal materials.

[0043] In this embodiment, the inner shielding mesh 21 is formed by weaving flexible conductive mesh yarn, and the outer heat dissipation mesh 23 is formed by weaving metal copper wires.

[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A lightweight and efficient heat dissipation phased array antenna device, characterized in that: include: A circuit board (1), the circuit board (1) comprising an upper surface and a lower surface, the upper surface being provided with array-arranged radio frequency modules (10), the lower surface being provided with a power module (12) and a control module (14), the power module (12) being electrically connected to the control module (14) and the radio frequency module (10); an electromagnetic signal shielding net (2), arranged on the circuit board (1) and covering the radio frequency module (10), the electromagnetic signal shielding net (2) forming a first heat dissipation channel (310) in a direction of extension of intervals between adjacent radio frequency modules (10); and A radiation element layer (3) is arranged on the electromagnetic signal shielding net (2), the radiation element layer (3) comprising antenna radiation arrays (30) corresponding one-to-one to the positions of the radio frequency modules (10), and the antenna radiation arrays (30) are electrically connected to the radio frequency modules (10).

2. A lightweight and efficient heat dissipation phased array antenna device according to claim 1, characterized in that: The lightweight and efficient heat dissipation phased array antenna device also includes a lower hollow bracket (4), which is arranged on the upper surface of the circuit board (1) and is located below the electromagnetic signal shielding net (2), and the lower hollow bracket (4) includes a first plate body (40) having a plurality of first windows (402) and a plurality of inner heat dissipation corner columns (42) located around each first window (402), wherein the first windows (402) correspond one-to-one to the radio frequency modules (10), and the radio frequency modules (10) extend out of the first windows (402).

3. The lightweight and efficient heat dissipation phased array antenna device according to claim 2, characterized in that: The lightweight and efficient heat dissipation phased array antenna device also includes an upper hollow bracket (5), which is arranged on the electromagnetic signal shielding net (2), and the upper hollow bracket (5) includes a second plate body (50) with a second window (502) and a plurality of outer support columns (52) arranged around each second window (502); the position of the second window (502) corresponds to the position of the first window (402) one by one, the outer support columns (52) and the inner heat dissipation corner columns (42) jointly limit the electromagnetic signal shielding net (2), and the electromagnetic signal shielding net (2) is exposed from the side of the upper hollow bracket (5).

4. The lightweight and efficient heat dissipation phased array antenna device according to claim 2, characterized in that: The RF module (10) is in contact with the inner heat dissipation corner column (42) on all sides, and the height of the inner heat dissipation corner column (42) is higher than the height of the RF module (10) extending from the first window (402), and a pressing sheet is slidably provided on the portion of the inner heat dissipation corner column (42) that is higher than the RF module (10).

5. The lightweight and efficient heat dissipation phased array antenna device according to claim 3, characterized in that: The side of the antenna radiation array (30) facing the upper hollow bracket (5) is a convex arc surface, and the side of the antenna radiation array (30) facing away from the upper hollow bracket (5) is a concave arc surface. A radiation module (301) is arranged in the concave arc surface of the antenna radiation array (30), and the radiation module (301) is electrically connected to the radio frequency module (10).

6. The lightweight and efficient heat dissipation phased array antenna device according to claim 2, characterized in that: The electromagnetic signal shielding net (2) is a flexible wire mesh or a rigid wire mesh.

7. The lightweight and efficient heat dissipation phased array antenna device according to claim 6, characterized in that: The surface of the electromagnetic signal shielding net (2) facing the radio frequency module (10) is provided with a plurality of supporting parts; the supporting parts are honeycomb structures; or The electromagnetic signal shielding net (2) comprises a plurality of cover parts (22) corresponding one to one with the radio frequency modules (10), each cover part (22) being covered on one of the radio frequency modules (10), and each cover part (22) being spaced apart from the radio frequency module (10) to form the first heat dissipation channel (310).

8. A lightweight and efficient heat dissipation phased array antenna device according to any one of claims 1 to 6, characterized in that: The electromagnetic signal shielding net (2) comprises an inner shielding net (21) and an outer heat dissipation net (23) arranged on the surface of the inner shielding net (21), wherein the mesh size of the inner shielding net (21) is smaller than the mesh size of the outer heat dissipation net (23), and the mesh density of the inner shielding net (21) is greater than the mesh density of the outer heat dissipation net (23).

9. The lightweight and efficient heat dissipation phased array antenna device according to claim 6, characterized in that: The heat dissipation enhancement structure (6) is square and includes a plurality of cover sheets (60) and folded edges (62) surrounding the cover sheets (60). The cover sheets (60) are fixed to the top surface of the radio frequency module (10), and the folded edges (62) on the adjacent side surfaces are disconnected. The folded edges (62) are made of a shape memory alloy. The folded edges (62) are in a curled state when the ambient temperature of the radio frequency module is low, and automatically unfold when the temperature generated by the radio frequency module (10) is too high.

10. The lightweight and efficient heat dissipation phased array antenna device according to claim 9, characterized in that: The heat dissipation enhancement structure (6) includes a folded edge (62) and a cover sheet (60) in which coolant is sealed, and a blocking strip is provided at the junction between the cover sheet (60) and each folded edge (62), so that a certain amount of coolant is stored in the cover sheet (60).

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