Miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology

Abstract

The miniaturized high-energy laser heat exchanger based on the vapor-liquid phase change heat dissipation technology comprises a shell of a hollow structure, the upper surface of the shell is provided with an optical fiber groove and a heating element installation hole site, the lower surface of the shell is provided with a heating element installation hole site, and an air cooling heat dissipation structure and a liquid cooling heat dissipation structure are arranged in the shell. The air cooling heat dissipation structures are arranged in the direction of the center line of the shell at intervals, the adjacent air cooling heat dissipation structures form a liquid cavity channel of the liquid cooling heat dissipation structure, and a liquid refrigerant in the substrate can absorb heat of a laser heating component on the shell to be gasified and enters the liquid cavity channel in a vapor-liquid mixed state. Heat is transmitted into the air cooling heat dissipation structure through the liquid cavity channel, the heat in the air cooling heat dissipation structure is dissipated into air along with work of the high-performance axial flow fan, and efficient heat management of the whole system is achieved through low power consumption and the compact heat dissipation structure.

Description

Technical Field

[0001] The present invention belongs to the technical field of lasers, and in particular relates to a miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology. Background Art

[0002] At present, the high-energy laser thermal management system designed based on conventional heat dissipation technologies such as air cooling and liquid cooling is huge in size and weight, and cannot meet the requirements of lightweight and low power consumption of airborne optoelectronic products and portable high-energy laser products. It is urgent for us to carry out research on miniaturized high-energy laser heat exchangers based on vapor-liquid phase change heat dissipation technology.

[0003] Commonly used high-energy laser systems use an intermittent working mode. When the high-energy laser system is working, the waste heat it generates can even reach the order of 10,000 watts or 100,000 watts. In the non-working cycle, the high-energy laser system generates very little heat. When designed in the conventional way of high-energy laser thermal management system, in order to meet the working temperature control requirements of the laser light source, refrigeration compressors, fluorine pumps and other methods will be used. The cooling capacity must be higher than the peak heat load of the laser light source. Therefore, the conventional high-energy laser thermal management system also requires a large power consumption, which cannot meet the requirements of high efficiency, miniaturization, lightweight and low power consumption of the laser heat exchanger, and the performance is low. Summary of the invention

[0004] In view of this, the miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology provided by the present invention enables the high-energy laser to operate efficiently and stably in low-altitude airborne environments and ground environments.

[0005] Provided is a miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology, comprising a shell with a hollow structure, wherein the upper surface of the shell is provided with optical fiber grooves and heating component mounting holes, the lower surface is provided with heating component mounting holes, and the shell is provided with air-cooling heat dissipation structure and liquid-cooling heat dissipation structure. The air-cooling heat dissipation structures are arranged at intervals in the direction of the center line of the shell, and liquid cavity channels of the liquid-cooling heat dissipation structures are formed adjacent to the air-cooling heat dissipation structures. The refrigerant in the liquid cavity channel can absorb the heat emitted by the electronic components on the shell and convert it into gaseous state. When the gaseous refrigerant flows through the air-cooling heat dissipation structure, the refrigerant can be converted from gaseous state to liquid state under the action of cooling wind.

[0006] The technical beneficial effects of the present invention are:

[0007] Pool boiling high-efficiency heat conduction technology can quickly conduct away the heat generated by the laser, enhancing the heat conduction capacity of the heat exchanger. Microchannel high-efficiency heat dissipation technology effectively solves the heat storage problem of high-power pulsating heat load and short-term high heat flux density of high-energy lasers. The design of three-dimensional temperature-averaging heat dissipation components with double-sided heat sources not only improves the compactness of high-energy lasers, but also the cavity structure of the upper and lower substrates can be connected with the microchannel fins to make the internal pressure of the heat exchanger equal, ensure the air pressure stability of each part of the radiator, accelerate the reflux of the liquid working fluid after condensation in the microchannel fins, and improve the heat dissipation capacity of the overall heat exchanger. The microchannel fins and the air side fins adopt the technology of welding and forming thin plates and profile plates, which effectively increases the heat dissipation area in the microchannel and reduces the weight of the heat exchanger; seals are added to the upper and lower sides of the air side fins welded between the two microchannel fins to improve the pressure resistance of the heat exchanger; the left support plate and the right support plate are located on the left and right sides of the heat exchanger to further improve the mechanical strength of the heat exchanger. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 It is the front view of the overall structure;

[0010] Figure 2 for Figure 1 Left side view of BB section in;

[0011] Figure 3 This is the schematic diagram of the overall heat dissipation;

[0012] Figure 4 It is a top view of the overall structure.

[0013] 1. Lower substrate; 2. Capillary core; 3. Lower cover; 4. Air side fins; 5. Support plate; 6. Upper substrate; 7. First heat dissipation fins; 8. Upper cover; 9. Shell; 10. Liquid cavity channel; 11. Seal; 12. Shell. DETAILED DESCRIPTION

[0014] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0015] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0016] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0017] like Figures 1 to 4 The miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology shown in the figure includes an upper surface provided with an optical fiber groove and a heating component installation hole, a lower surface provided with a heating component installation hole, and a shell 12 with a hollow structure inside, wherein independent air-cooling heat dissipation structures and liquid-cooling heat dissipation structures are arranged in the shell, wherein the air-cooling heat dissipation structures are arranged at intervals in the direction of the center line of the shell, and adjacent air-cooling heat dissipation structures form a liquid cavity channel of the liquid-cooling heat dissipation structure, and the liquid refrigerant in the liquid cavity channel can absorb the heat emitted by the electronic components on the shell and convert it into a gas state, and when the gaseous refrigerant flows through the air-cooling heat dissipation structure, under the action of cooling wind, the refrigerant can be converted from a gas state to a liquid state. The air-cooling heat dissipation structure and the liquid-cooling heat dissipation structure of the structure are based on a thermal management heat exchange system integrating pool boiling efficient heat conduction technology and microchannel efficient heat dissipation technology, which can improve the heat dissipation efficiency, thereby realizing the miniaturization, lightweight and high-efficiency design of the high-energy laser heat exchanger, and can effectively deal with the heat dissipation problems of high-power pulsating heat load and high heat flux density brought by high-energy lasers.

[0018] As a specific embodiment provided in this case, the shell includes an upper base plate 6 and a lower base plate 1 having a hollow structure, wherein the inner bottom surfaces of the upper base plate 6 and the lower base plate 1 are filled with a capillary core 2 and a liquid refrigerant, and the upper base plate 6 and the lower base plate 1 are connected through a liquid cavity channel to ensure the uniformity of the pressure of the entire heat exchanger and improve the thermal conductivity of pool boiling. The upper base plate 6 and the lower base plate 1 are provided with an upper cover plate 8 and a lower cover plate 3 as a transition of the liquid cooling channel.

[0019] Working principle: The heat generated by the high-energy laser is transferred to the capillary core 2 in the substrate through the upper substrate 6 and the lower substrate 1; the vapor-liquid phase change medium adsorbed in the capillary core 2 (in liquid state) undergoes pool boiling reaction as the temperature of the capillary core 2 and the substrate increases, and enters the microchannel fins in a vapor-liquid mixed state; the vapor-liquid phase change medium in the vapor-liquid mixed state is cooled back to a liquid state in the microchannel fins, and returns to the capillary core 2 in the substrate along the microchannel fins, and the heat is also transferred to the air-side fins 4 through the microchannel fins; as the high-performance axial flow fan works, the heat in the air-side fins 4 is dissipated into the air, achieving efficient thermal management of the entire system with lower power consumption.

[0020] As a specific implementation provided in this case, a boss structure or a groove structure is provided in the upper substrate 6 and the lower substrate 1, and the boss structure or the groove structure is used to fill the capillary core 2. The effect of the capillary core 2 provided in this structure is: the contact between the substrate and the capillary core 2 is increased, the effective heat transfer area between the substrate and the capillary core 2 is increased, and the welding area between the substrate and the cover plate is increased, the pressure resistance of the heat exchanger is improved, and the porous structure of the capillary core 2 increases the vaporization core of the pool boiling and improves the heat conduction efficiency. As a specific implementation scheme provided in this case, support plates 5 are integrally provided on both sides of the shell, and the support plates 5 are used to support and reinforce the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure, and the air-cooled heat dissipation structure is not connected to the liquid-cooled heat dissipation structure. The air-cooled heat dissipation structure includes a first heat dissipation fin 7 and a welding plate 9, wherein two adjacent welding plates form a liquid cavity channel 10, and a second heat dissipation fin (not shown in the figure) is arranged on the wall surface of the liquid cavity channel 10. The size of the first heat dissipation fin 7 is larger than that of the second heat dissipation fin. The second heat dissipation fin and the first heat dissipation fin are formed by continuously arranging U-shaped corrugated plates. The first heat dissipation fin 7 is provided between the welding plate and the support plates 5 on both sides, and between the welding plates, respectively, to increase the contact area with the air, and to transfer heat when the refrigerant in the liquid cavity channel 10 changes phase, and to exchange heat through the second heat dissipation fin, thereby improving the heat exchange efficiency of the overall structure.

[0021] The refrigerant mentioned above is acetone or R134a or R1233zd or other liquids or media. Seals 11 are respectively provided at both ends of the first heat dissipation fin and the second heat dissipation fin. The seals 11 are used to improve the pressure resistance and sealing effect of the heat exchanger. The inside of the microchannel fin and the air side fin 4 adopt the technology of welding and forming of thin plates and profile plates, which effectively improves the heat dissipation area in the microchannel and reduces the weight of the heat exchanger. Seals 11 are added to the upper and lower sides of the air side fin 4 welded between the two microchannel fins to improve the pressure resistance of the heat exchanger; the left support plate 5 and the right support plate 5 are located on the left and right sides of the heat exchanger to further improve the mechanical strength of the heat exchanger.

[0022] Overall working principle:

[0023] like Figure 3 As shown, the arrows and the thick solid lines are a thermal management heat exchange system based on pool boiling efficient heat conduction technology and microchannel efficient heat dissipation technology. The heat generated by the high-energy laser is transferred to the capillary core 2 in the substrate through the upper substrate 6 and the lower substrate 1; the vapor-liquid phase change medium adsorbed in the capillary core 2 (in liquid state) undergoes pool boiling reaction as the temperature of the capillary core 2 and the substrate increases, and enters the microchannel fins in a vapor-liquid mixed state; the vapor-liquid phase change medium in the vapor-liquid mixed state is cooled back to liquid in the microchannel fins, and returns to the capillary core 2 in the substrate along the microchannel fins, and the heat is also transferred to the air side fins 4 through the microchannel fins; with the operation of the high-performance axial flow fan, the heat in the air side fins 4 is dissipated into the air, and the efficient thermal management of the entire system is achieved with low power consumption and a compact heat dissipation structure.

[0024] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology, characterized in that: A shell body with a hollow structure is provided, wherein the upper surface of the shell body is provided with optical fiber grooves and heating component mounting holes, the lower surface is provided with heating component mounting holes, and the inside of the shell body is provided with air-cooled heat dissipation structure and liquid-cooled heat dissipation structure, wherein the air-cooled heat dissipation structures are arranged at intervals in the direction of the center line of the shell body, and adjacent air-cooled heat dissipation structures form liquid cavity channels of the liquid-cooled heat dissipation structure, the liquid refrigerant in the liquid cavity channel can absorb the heat emitted by the electronic components on the shell body and convert it into gas, and when the gaseous refrigerant flows through the air-cooled heat dissipation structure, the refrigerant can be converted from gas to liquid under the action of cooling wind.

2. The miniaturized high-energy laser heat exchanger according to claim 1, characterized in that: The shell includes an upper base plate and a lower base plate with a hollow structure, wherein the bottom surface inside the upper base plate and the lower base plate is filled with a capillary core and the refrigerant whose volume is larger than the capillary core, and the upper base plate and the lower base plate are connected through a liquid cavity channel to ensure the uniformity of the pressure of the entire heat exchanger.

3. The miniaturized high-energy laser heat exchanger according to claim 2, characterized in that: A boss structure or a groove structure is arranged in the upper substrate and the lower substrate, and the boss structure or the groove structure is used to fill the capillary core.

4. The miniaturized high-energy laser heat exchanger according to claim 3, characterized in that: Support plates are integrally provided on both sides of the shell, and the support plates are used to support and reinforce the air-cooling heat dissipation structure and the liquid-cooling heat dissipation structure.

5. The miniaturized high-energy laser heat exchanger according to claim 4, characterized in that: The air-cooled heat dissipation structure is not connected to the liquid-cooled heat dissipation structure, and the air-cooled heat dissipation structure includes a first heat dissipation fin and a welding plate; two adjacent welding plates form the liquid cavity channel, and a second heat dissipation fin is arranged on the wall of the liquid cavity channel. The size of the first heat dissipation fin is larger than the size of the second heat dissipation fin, and the second heat dissipation fin and the first heat dissipation fin are both formed by continuously arranging U-shaped corrugated plates.

6. The miniaturized high-energy laser heat exchanger according to claim 5, characterized in that: The refrigerant is acetone or R134a or R1233zd.

7. The miniaturized high-energy laser heat exchanger according to claim 6, characterized in that: Both ends of the first heat dissipation fin and the second heat dissipation fin are respectively provided with seals, and the seals are used to improve the pressure resistance and sealing effect of the heat exchanger.

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