Heat dissipation structure of dual-band quantum cascade laser

Abstract

The heat dissipation structure of the dual-band quantum cascade laser and the heat dissipation structure of the dual-band quantum cascade laser are suitable for heat dissipation of the laser, and the laser comprises a plurality of laser emission modules, a heat collection assembly and a heat dissipation assembly, heat generated when all the laser emission modules work is concentrated and collected by the heat collection assembly; the heat dissipation assembly conducts air cooling type heat dissipation on the heat collection assembly after heat is concentrated and collected. Uniform heat dissipation of the quantum cascade laser is realized by adopting a uniform heat dissipation design based on a uniform temperature plate and an aluminum-based silicon carbide material, the heat dissipation capability is greatly enhanced, the overall weight is greatly reduced, and the problem of difficulty in heat dissipation of the quantum cascade laser is fundamentally solved.

Description

Technical Field

[0001] The invention belongs to the technical field of lasers, and in particular relates to a heat dissipation structure of a dual-band quantum cascade laser. Background Art

[0002] Quantum cascade laser is a unipolar semiconductor laser with excellent medium-wave infrared laser output capability. It has the advantages of small size and light weight of traditional semiconductors, and has great advantages in the field of directional infrared countermeasures. Quantum cascade laser can be used as an infrared interference source in directional infrared countermeasure systems. Since quantum cascade lasers have extremely high temperature requirements, when the light-emitting module cannot dissipate heat in time and causes its temperature to rise, the light-emitting power of the light-emitting module will drop rapidly. The traditional heat dissipation structure is difficult to dissipate the heat in a short time, and the heat dissipation efficiency is low. Therefore, it is necessary to design a new heat dissipation structure to achieve uniform heat dissipation of quantum cascade lasers. Summary of the invention

[0003] In view of this, the heat dissipation structure of the dual-band quantum cascade laser provided by the present invention adopts a uniform heat dissipation design based on a temperature equalizing plate and an aluminum-based silicon carbide material to achieve uniform heat dissipation of the quantum cascade laser, greatly enhances the heat dissipation capacity, and significantly reduces the overall weight, fundamentally solving the problem of heat dissipation difficulties of the quantum cascade laser.

[0004] Provided is a heat dissipation structure of a dual-band quantum cascade laser, which is suitable for heat dissipation of the laser. The laser comprises a plurality of laser emission modules, a heat collection component and a heat dissipation component, wherein the heat generated by all the laser emission modules when working is concentrated and collected by the heat collection component; and the heat dissipation component performs air-cooling heat dissipation on the heat collection component after the heat is concentrated and collected.

[0005] The technical beneficial effects of the present invention are:

[0006] All the heat generated by the laser emitting modules when they are working is concentrated and collected by the heat collecting component; the heat dissipation component performs air-cooling heat dissipation on the heat collecting component after the heat is concentrated and collected. The laser emitting module generally includes a medium-wave laser emitting module and a short-wave laser emitting module. When the medium-wave laser emitting module and the short-wave laser emitting module are working, in addition to part of the input electrical energy being converted into light energy, the rest is stored in the heat sink as heat energy. The heat is transmitted to the temperature homogenizing plate welding part through the thermoelectric cooler, and the heat is dissipated to the external environment through the forced convection generated by the fan. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 This is the front view of the uniform heat dissipation structure of the dual-band quantum cascade laser;

[0009] Figure 2 This is an isometric view of the uniform heat dissipation structure of a dual-band quantum cascade laser, where:

[0010] 1. Heat sink; 2. Fan; 3. Laser emission module; 4. Fin group; 5. First air flow channel; 6. Second air flow channel; 7. Temperature averaging plate welding parts; 8. Thermoelectric cooler. DETAILED DESCRIPTION

[0011] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0012] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0013] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0014] like Figure 1 to Figure 2The heat dissipation structure of the dual-band quantum cascade laser shown is suitable for heat dissipation of the laser. The laser includes multiple laser emission modules 3, and the laser emission module 3 includes a short-wave laser emission module 3 and a medium-wave emission module. The short-wave emission module is an antimonide laser, and its expansion coefficient is close to that of aluminum-based silicon carbide. Its function is to emit medium-wave infrared laser. The medium-wave emission module is a unipolar semiconductor laser, and its expansion coefficient is close to that of aluminum-based silicon carbide. It is in the shape of a rectangular parallelepiped structure, and its function is to emit medium-wave infrared laser. It includes a heat collection component and a heat dissipation component, wherein,

[0015] The heat generated by all laser emission modules 3 when working is concentrated and collected by the heat collection component, and the heat dissipation component performs air cooling on the heat collection component after the heat is concentrated and collected. Specifically,

[0016] The heat collection component includes a thermoelectric cooler 8 and a heat sink 1. One side of the heat sink 1 is installed in contact with the laser emission module 3, and the other side is used to install the thermoelectric cooler 8. The thermoelectric cooler 8 is installed in the heat dissipation component through a temperature-equalizing plate welding part 7 of a matching shape. Preferably, the thermoelectric cooler 8 is made of ceramic and has a rectangular shape. The temperature-equalizing plate welding part 7 is formed by low-temperature brazing of the temperature-equalizing plate substrate and the heat dissipation fins, and the materials are 6063 aluminum alloy and 1100 aluminum strip. The inside of the temperature-equalizing plate substrate is filled with condensate. When a certain part generates heat, the condensate inside the temperature-equalizing plate is heated and evaporated. The steam diffuses to other areas with lower temperatures under the action of the pressure difference, and condenses into liquid again to release heat. This process is cyclically continuous, achieving a relatively uniform temperature inside the substrate. The heat dissipation fin is a fin-type structure with a fin thickness of 0.3mm and a fin spacing of 2mm. The function of the temperature equalizing plate welding part 7 is to achieve relatively uniform temperature of the uneven heat source through evaporation and condensation of the condensate, and then dissipate the heat to the external environment under the forced convection generated by the fan 2, wherein the heat generated by the laser emitting module 3 is concentrated and collected by the heat sink 1 in the form of heat conduction, and when receiving instructions sent by the external controller, the thermoelectric cooler 8 can form a hot end and a cold end, wherein the heat sink 1 transfers heat to the cold end in the form of heat transmission, and the heat is transferred from the cold end to the hot end, and the heat is discharged by the heat dissipation component in the form of air cooling.

[0017] Furthermore, the heat dissipation assembly includes a mounting base, a fan 2 and a fin group 4, a temperature equalizing plate welding part 7 is installed on one side of the mounting base, and the fin group 4 is installed at intervals on the other side, and a first air flow channel 5 is formed between the fin groups 4, and a fan 2 is installed on the side in the thickness direction of the mounting base, wherein the cooling air generated by the fan 2 flows through the first air flow channel 5, and can continuously take away the heat from the hot end.

[0018] Furthermore, the fin group 4 includes a plurality of heat dissipating fins, which are installed on the side of the mounting base, and a second air flow channel 6 is formed between the heat dissipating fins, and the size of the second air flow channel 6 is smaller than that of the first air flow channel 5. The second air flow channel 6 can increase the contact area between the fin group 4 and the cooling air. The fin group 4 is a fin-type structure with a fin thickness of 0.3 mm and a fin spacing of 2 mm.

[0019] Furthermore, both the hot end and the cold end of the thermoelectric cooler 8 are provided with indium platinum, which is used to increase the thermal conductivity of the contact position, increase the thermal conductivity of the cold end and the heat sink 1, and the hot end and the temperature-averaging plate welding part 7, and the heat sink 1 is made of aluminum-based silicon carbide material and the silicon carbide content is not less than 65%, and the surface is gold-plated; the roughness of the contact surface between the heat sink 1 and the laser emission module 3 is not more than 1.6μmm, and its function is to effectively absorb the heat emitted by the medium-wave emission module and the short-wave emission module. The thermoelectric cooler is made of ceramic and semiconductor materials in the prior art, and will form a hot end and a cold end after power is turned on. It is in the shape of a rectangular parallelepiped, and its function is to transfer the heat absorbed by the heat sink to the temperature-averaging plate welding part, and the heat is transferred to the temperature-averaging plate welding part through the thermoelectric cooler, and the heat is dissipated to the external environment through the forced convection generated by the fan.

[0020] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A heat dissipation structure of a dual-band quantum cascade laser, suitable for heat dissipation of a laser, wherein the laser comprises a plurality of laser emission modules, characterized in that: It includes a heat collection component and a heat dissipation component, wherein: The heat generated by all the laser emission modules when working is concentrated and collected by the heat collection component; The heat dissipation component performs air-cooling heat dissipation on the heat collection component after the heat is concentrated and collected.

2. The heat dissipation structure according to claim 1, characterized in that: The heat collection assembly includes a thermoelectric cooler and a heat sink, one side of the heat sink is installed in contact with the laser emission module, and the other side is used to install the thermoelectric cooler, and the thermoelectric cooler is installed on the heat dissipation assembly through a temperature-averaging plate welding part with a matching shape, wherein: The heat generated by the laser emission module during operation is concentrated and collected by the heat sink in a heat conduction manner; When receiving instructions sent by an external controller, the thermoelectric cooler can form a hot end and a cold end, wherein the heat sink transfers heat to the cold end in a heat transmission manner, and the cold end transfers heat to the hot end, and the heat is discharged by the heat dissipation component in an air-cooled manner.

3. The heat dissipation structure according to claim 2, characterized in that: The heat dissipation assembly includes a mounting seat, a fan and a fin group. A temperature equalizing plate welding piece is installed on one side of the mounting seat, and a fin group is installed at intervals on the other side, and a first air flow channel is formed between the fin groups. A fan is installed on the side of the mounting seat in the thickness direction, wherein: The cooling wind generated by the fan flows through the first air flow channel and can continuously take away the heat of the hot end.

4. The heat dissipation structure according to claim 3, characterized in that: The fin group includes a plurality of heat dissipation fins, which are installed on the side of the mounting base, and a second air flow channel is formed between the heat dissipation fins. The size of the second air flow channel is smaller than that of the first air flow channel. The second air flow channel can increase the contact area between the fin group and the cooling air.

5. The heat dissipation structure according to claim 4, characterized in that: The hot end and the cold end of the thermoelectric cooler are both provided with indium platinum, and the indium platinum is used to increase the thermal conductivity of the contact position, and increase the thermal conductivity of the cold end and the heat sink, and the hot end and the temperature equalizing plate welding parts.

6. The heat dissipation structure according to claim 5, characterized in that: The heat sink is made of aluminum-based silicon carbide material and the silicon carbide content is not less than 65%; the roughness of the contact surface between the heat sink and the laser emission module is not greater than 1.6 μm.

7. The heat dissipation structure according to claim 6, characterized in that: The thermoelectric cooler is made of ceramic and has a rectangular shape.

8. The heat dissipation structure according to claim 1, characterized in that: The laser emission module is a short-wave laser emission module.

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