Preparation method of lamp panel and lamp panel

Abstract

According to the preparation method of the lamp panel and the lamp panel provided by the invention, the conductive circuit and the light-emitting element are arranged on different surfaces of the glass substrate, so that after the light-emitting element is bound with the conductive circuit, if the light-emitting element has defects, rework (rework or repair) of the light-emitting element does not affect the conductive circuit, and the light-emitting element is prevented from being damaged. For example, the conductive circuit on the back is not damaged; or the conductive circuit does not influence the rework efficiency of the light-emitting element, so that the production efficiency of the lamp panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a light board and a light board. Background Art

[0002] Display devices include LED (Light Emitting Diode) display devices, Micro-LED (Micro-Light Emitting Diode) display devices, OLED (Organic Light Emitting Diode) display devices, and LCD (Liquid Crystal Display) display devices, etc. The above-mentioned display devices generally include a light board, which can be used as a light-emitting backboard or display substrate of the display device.

[0003] In the prior art, a light board generally includes a glass substrate, a conductive circuit arranged on the glass substrate, and a light-emitting element (such as an LED) bound to the conductive circuit. However, the production efficiency of the light board in the prior art is low. How to improve the production efficiency of the light board is an urgent problem to be solved in this industry. Summary of the invention

[0004] In order to solve the above problems, the preparation method of the lamp board and the lamp board provided in the present application can solve the problem of low production efficiency of the lamp board in the prior art.

[0005] In order to solve the above problems, the first technical solution provided by the present application is: to provide a method for preparing a light board, comprising:

[0006] Dividing the large plate glass to obtain a panel cutting area and a light bar cutting area; wherein the light bar cutting area includes a plurality of light bar areas, and a plurality of light emitting element binding areas are defined on the light bar area;

[0007] forming a conductive circuit on a surface of the light bar area;

[0008] Punching the light emitting element binding area to form a plurality of through holes penetrating the light bar area;

[0009] Cutting the light bar cutting area to cut out a plurality of the light bar areas respectively to obtain a plurality of light bar preforms; each of the light bar preforms comprises a glass substrate and the conductive circuit disposed on a surface of the glass substrate;

[0010] Performing grouting on the through hole to fill the through hole with a conductive material;

[0011] The light emitting element is bound in the light emitting element binding area so that the conductive circuit is electrically connected to the light emitting element through the conductive material in the through hole; wherein the light emitting element is located on a surface of the glass substrate away from the conductive circuit.

[0012] In some embodiments, before the step of binding the light-emitting element to the light-emitting element binding area, the step further includes:

[0013] Conducting circuit detection on each of the light bar preforms.

[0014] In some embodiments, before the step of binding the light-emitting element to the light-emitting element binding area, the step further includes:

[0015] Based on the detection result of the conductive circuit on the light bar preform being normal;

[0016] A protective layer is formed on a surface of the light bar preform close to the conductive circuit, and the protective layer covers the conductive circuit.

[0017] In some embodiments, the step of forming a protective layer on the surface of the light bar preform close to the conductive circuit includes:

[0018] forming a protective layer having a first thickness on a surface of the light bar preform close to the conductive circuit;

[0019] Wherein, the first thickness is 5-10 um; and / or, the material of the protective layer includes hydrogenated silicon nitride.

[0020] In some embodiments, each of the light bar regions extends along a first direction, and a plurality of the light emitting element binding regions on each of the light bar regions extends along the first direction to form a row of the light emitting element binding regions;

[0021] The step of forming a conductive circuit on a surface of the light bar cutting area comprises:

[0022] Forming rows of conductive circuits along the first direction on a surface of each of the light bar areas;

[0023] The step of binding the light emitting element in the light emitting element binding area comprises:

[0024] The light-emitting elements are bound to each of the light-emitting element binding areas in a row to form a row of the light-emitting elements on each of the light-bar preforms; wherein a row of the light-emitting elements on the same light-bar preform is electrically connected to a row of the conductive lines through the conductive material in the through holes.

[0025] In some embodiments, each of the light bar areas extends along a first direction, and a plurality of the light emitting element binding areas on each of the light bar areas extends along the first direction to form a plurality of rows of light emitting element binding areas; a plurality of the light emitting element binding areas in the plurality of rows of light emitting element binding areas are divided into a plurality of groups of light emitting element binding areas;

[0026] The step of forming a conductive circuit on a surface of the light bar cutting area comprises:

[0027] Forming rows of conductive circuits along the first direction on a surface of each of the light bar regions, each row of the conductive circuits comprising a plurality of sub-conductive circuits;

[0028] The step of binding the light emitting element in the light emitting element binding area comprises:

[0029] The light-emitting elements are bound in each of the plurality of rows of light-emitting element binding areas to form a plurality of rows of light-emitting elements on each of the light-bar preforms, and the plurality of rows of light-emitting elements are divided into a plurality of light-emitting element groups, each of which includes a plurality of light-emitting elements; wherein a group of light-emitting element groups on the same light-bar preform is electrically connected to a sub-conductive circuit through the conductive material in the through hole.

[0030] In some embodiments, it also includes:

[0031] A plurality of the light bar preforms are spliced ​​together to form the light panel.

[0032] In order to solve the above problems, the second technical solution provided by the present application is: to provide a method for preparing a light board, comprising:

[0033] Dividing the large plate glass to obtain a panel cutting area and a light bar cutting area; wherein the light bar cutting area includes a plurality of first light bar areas and a plurality of second light bar areas, and a plurality of light emitting element binding areas are defined on the first light bar area;

[0034] Forming a conductive circuit on a surface of the first light bar area and / or the second light bar area;

[0035] Punching the light emitting element binding area to form a plurality of through holes penetrating the light bar area;

[0036] The light bar cutting area is cut to respectively cut out a plurality of the first light bar regions to obtain a plurality of first light bar preforms; and a plurality of the second light bar regions are respectively cut out to obtain a plurality of second light bar preforms; wherein the first light bar preform comprises a first glass substrate and the conductive circuit disposed on a surface of the first glass substrate; and / or the second light bar preform comprises a second glass substrate and the conductive circuit disposed on a surface of the second glass substrate;

[0037] Performing grouting on the through hole to fill the through hole with a conductive material;

[0038] Binding a light-emitting element in the light-emitting element binding area, wherein the light-emitting element and the conductive circuit are located on different surfaces;

[0039] The first light bar preform is aligned and connected with the second light bar preform, so that the conductive circuit is electrically connected to the light emitting element through the conductive material in the through hole.

[0040] In some embodiments, before the step of binding the light-emitting element in the light-emitting element binding area, the step further includes:

[0041] Conducting circuit detection on the conductive circuits on the first light bar preform and / or the second light bar preform.

[0042] In some embodiments, before the step of binding the light-emitting element in the light-emitting element binding area, the step further includes:

[0043] Based on the detection result of the conductive circuit on the first light bar preform and / or the second light bar preform being normal;

[0044] A protective layer is formed on a surface of the first light bar preform close to the conductive circuit and / or a surface of the second light bar preform close to the conductive circuit, and the protective layer covers the conductive circuit.

[0045] In some embodiments, the size of the second light bar preform is larger than the size of the first light bar preform;

[0046] The step of aligning and connecting the first light bar preform with the second light bar preform comprises:

[0047] splicing a plurality of the first light bar preforms together along a second direction to form a first substrate;

[0048] Aligning and connecting the first substrate and the second light bar preform together to form the light panel;

[0049] Wherein, a sealed accommodating cavity is formed between the first substrate and the second light bar preform, and the conductive circuit is located in the accommodating cavity.

[0050] In some embodiments, the size of the first light bar preform is greater than the size of the second light bar preform;

[0051] The step of aligning and connecting the first light bar preform with the second light bar preform comprises:

[0052] splicing a plurality of the second light bar preforms together along a second direction to form a second substrate;

[0053] Aligning and connecting the second substrate and the first light bar preform together to form the light panel;

[0054] Wherein, a closed accommodating cavity is formed between the second substrate and the first light bar preform, and the conductive circuit is located in the accommodating cavity.

[0055] In some embodiments, the size of the first light bar preform is the same as the size of the second light bar preform;

[0056] The step of aligning and connecting the first light bar preform with the second light bar preform comprises:

[0057] splicing a plurality of the first light bar preforms together along a second direction to form a first substrate; and splicing a plurality of the second light bar preforms together along a second direction to form a second substrate;

[0058] Aligning the first substrate and the second substrate together to form the light board;

[0059] A sealed accommodating cavity is formed between the first substrate and the second substrate, and the conductive circuit is located in the accommodating cavity.

[0060] In order to solve the above problems, the third technical solution provided in the present application is: to provide a light board, wherein the light board is prepared by any of the preparation methods described above.

[0061] Different from the prior art, the beneficial effect of the present application is that the light board and display device provided by the present application, by arranging the conductive circuit and the light-emitting element on different surfaces of the glass substrate, after the light-emitting element is bound to the conductive circuit, if the light-emitting element is defective, the rework (rework or repair) of the light-emitting element will not affect the conductive circuit, for example, it will not damage the conductive circuit on the back; or the conductive circuit will not affect the rework efficiency of the light-emitting element, thereby improving the production efficiency of the light board. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0063] Figure 1 A schematic flow chart of an implementation of a method for preparing a light panel provided in the first embodiment of the present application;

[0064] Figure 2 for Figure 1 The area division diagram of the large plate glass provided in step S11;

[0065] Figure 3 for Figure 1 Schematic diagram of the intermediate product after step S12;

[0066] Figure 4 for Figure 1 A schematic diagram of a flow chart of an implementation method after step S12;

[0067] Figure 5 for Figure 1 Schematic diagram of the intermediate product after step S13;

[0068] Figure 6 for Figure 5 A structural cross-sectional view of an embodiment of the light bar cutting area of ​​the product shown in FIG. 1 along line AA;

[0069] Figure 7 A schematic diagram of the structure of a through hole is provided for one embodiment of the present application;

[0070] Figure 8 A schematic structural diagram of a through hole is provided for another embodiment of the present application;

[0071] Fig. 9 for Figure 1 Schematic diagram of the intermediate product after step S15;

[0072] Fig.10 for Figure 1 Schematic diagram of the intermediate product after step S16;

[0073] Fig.11 A schematic flow chart of another implementation of the method for preparing the light board provided in the first embodiment of the present application;

[0074] Fig.12 for Fig.11 A schematic diagram of an intermediate product of an embodiment after step S17 at a viewing angle;

[0075] Fig.13 for Fig.11 A schematic diagram of an intermediate product of an embodiment after step S17 at a second viewing angle;

[0076] Fig.14 for Fig.11 A schematic diagram of an intermediate product in another embodiment after step S17 at a viewing angle;

[0077] Fig.15 for Fig.11 A schematic diagram of an intermediate product in another embodiment after step S17 at a second viewing angle;

[0078] Fig.16 A schematic flow chart of an implementation of a method for preparing a light panel provided in the second embodiment of the present application;

[0079] Fig.17 for Fig.16 The area division diagram of the large plate glass provided in step S21;

[0080] Fig.18 for Fig.16 Schematic diagram of the intermediate product after step S22;

[0081] Fig.19 for Fig.16 A schematic diagram of a flow chart of an implementation method after step S22;

[0082] Fig. 20 for Fig.16 Schematic diagram of the intermediate product after step S23;

[0083] Fig.21 for Fig. 20 A structural cross-sectional view of an embodiment of the light bar cutting area of ​​the product shown in FIG. 1 along line AA;

[0084] Fig. 22 for Fig.16 Schematic diagram of the intermediate product after step S25;

[0085] Fig.23 for Fig.16 Schematic diagram of the intermediate product after step S26;

[0086] Fig.24 for Fig.16 A schematic flow chart of an implementation method of step S27;

[0087] Fig.25 for Fig.16 A schematic flow chart of another implementation of step S27;

[0088] Fig.26 for Fig.16 A schematic flow chart of another implementation of step S27;

[0089] Fig. 27 for Fig.16 A schematic diagram of an intermediate product of an embodiment after step S27;

[0090] Fig.28 A schematic structural diagram of an implementation of a display device provided in an embodiment of the present application.

[0091] Description of labels:

[0092] Large plate glass 1; panel cutting area A1; panel area A11; light bar cutting area A2; light bar area A21; first light bar area A22; second light bar area A23;

[0093] Light bar preform 2; first light bar preform 3; second light bar preform 4;

[0094] Glass substrate 10; residual glass; first substrate 101; second substrate 102;

[0095] Light emitting element 20; Light emitting element group 21;

[0096] Conductive circuit 30; connecting portion 301; row conductive circuit 31; sub-conductive circuit 32;

[0097] through hole; first hole section 41; second hole section 42; third hole section 43;

[0098] Conductive material 50;

[0099] Pad structure 60;

[0100] Protective layer 70;

[0101] Display device 1000; light board 100;

[0102] First direction x; second direction y; third direction z. DETAILED DESCRIPTION

[0103] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0104] The terms "first", "second", "third", etc. in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", "third" may explicitly or implicitly include at least one of the features.

[0105] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0106] As the display industry continues to expand, competition in the industry is becoming increasingly fierce. How to seize cost advantages has become an important factor in maintaining a firm market position; therefore, improving the utilization rate of glass has become the key to reducing costs. In related technologies, many large glass panels will have glass left over after being cut, which will result in a considerable amount of waste and increase production costs.

[0107] In some scenarios, the light board includes a glass substrate, a conductive circuit disposed on the glass substrate, and a light-emitting element bound to the conductive circuit. The light board can be used as a light-emitting backplane or a display substrate of a display device.

[0108] Among them, in the prior art, generally after a conductive circuit is prepared on a glass substrate, a light-emitting element is bound to the conductive circuit, and the conductive circuit and the light-emitting element are usually located on the same surface of the glass substrate.

[0109] Research has found that in the prior art, since the conductive circuit and the light-emitting element bound to the conductive circuit are usually located on the same surface of the glass substrate, after the light-emitting element is bound to the conductive circuit, if the light-emitting element is defective, the rework (rework or repair) of the light-emitting element will often damage the conductive circuit, or the presence of the conductive circuit will affect the rework efficiency of the light-emitting element, thereby affecting the production efficiency of the light board.

[0110] To solve the above problems, the present application provides a method for preparing a light board, in which the conductive circuit and the light-emitting element are respectively arranged on different surfaces of a glass substrate, and the glass substrate has a through hole therethrough, the through hole is filled with a conductive material, and the conductive circuit and the light-emitting element are bound by the conductive material in the through hole.

[0111] By arranging the conductive circuit and the light-emitting element on different surfaces of the glass substrate, in the process of binding the light-emitting element and the conductive circuit, if the light-emitting element is defective, the rework (rework or repair) of the light-emitting element will not affect the conductive circuit, for example, it will not damage the conductive circuit on the back; or the conductive circuit will not affect the rework efficiency of the light-emitting element, thereby improving the production efficiency of the light board. In addition, the light strip area outside the panel cutting area can be set to improve the utilization rate of the large plate glass.

[0112] See also Figure 1-Figure 15 , Figure 1 A schematic flow chart of an implementation of a method for preparing a light panel provided in the first embodiment of the present application; Figure 2 for Figure 1 The area division diagram of the large plate glass provided in step S11; Figure 3 for Figure 1 Schematic diagram of the intermediate product after step S12; Figure 4 for Figure 1 A schematic diagram of a flow chart of an implementation method after step S12; Figure 5 for Figure 1 Schematic diagram of the intermediate product after step S13; Figure 6 for Figure 5 A structural cross-sectional view of an embodiment of the light bar cutting area of ​​the product shown in FIG. 1 along line AA; Figure 7 A schematic diagram of the structure of a through hole is provided for one embodiment of the present application; Figure 8 A schematic structural diagram of a through hole is provided for another embodiment of the present application; Fig. 9 for Figure 1 Schematic diagram of the intermediate product after step S15; Fig.10 for Figure 1 Schematic diagram of the intermediate product after step S16; Fig.11 A schematic flow chart of another implementation of the method for preparing the light board provided in the first embodiment of the present application; Fig.12 for Fig.11 A schematic diagram of an intermediate product of an embodiment after step S17 at a viewing angle; Fig.13 for Fig.11 A schematic diagram of an intermediate product of an embodiment after step S17 at a second viewing angle; Fig.14 for Fig.11 A schematic diagram of an intermediate product in another embodiment after step S17 at a viewing angle; Fig.15 for Fig.11 A schematic diagram of an intermediate product in another embodiment after step S17 at a second viewing angle.

[0113] Specifically, the method for preparing the light board provided in the first embodiment of the present application includes:

[0114] Step S11: Divide the large plate glass 1 to obtain a panel cutting area A1 and a light strip cutting area A2; wherein the panel cutting area A1 includes a plurality of panel areas A11, the light strip cutting area A2 includes a plurality of light strip areas A21, and a plurality of light emitting element binding areas are defined on the light strip area A21.

[0115] See Figure 2 Specifically, the large plate glass 1 is a glass used for panel cutting of a display panel, such as cutting the substrate of a TFT or CF. In the present embodiment, the large plate glass 1 is divided so that the large plate glass 1 forms two cutting areas, namely a panel cutting area A1 and a light bar cutting area A2, and each cutting area forms a panel area A11 and a light bar area A21 respectively. The panel cutting area A1 includes a plurality of panel areas A11, and the light bar cutting area A2 includes a plurality of light bar areas A21. Each panel area A11 can be a substrate of a display panel, and each light bar area A21 can be a substrate of a light bar, which is used to form a light board. In the present embodiment, the substrate of the light bar is cut by utilizing the residual material left after the large plate glass 1 is cut into the display panel, thereby reducing the loss and waste of glass, improving the utilization rate of glass, and reducing the production cost.

[0116] It can be understood that the light bar area A21 is formed based on the residual material left after the large plate glass 1 is cut into the display panel, so the extension directions of multiple light bar areas A21 may be the same or different. In the embodiment of the present application, for the convenience of description, it is defined that each light bar area A21 extends along the first direction x, where the first direction x is the length or width direction of the large plate glass 1.

[0117] The light emitting element binding area on the light bar area A21 is used to bind the light emitting element 20 .

[0118] Step S12: forming a conductive circuit 30 on a surface of the light bar area A21.

[0119] See Figure 3In one embodiment, a conductive circuit 30 is uniformly formed on the large plate glass 1, that is, a conductive circuit 30 is uniformly formed on all areas of a surface of the large plate glass 1. The conductive circuit 30 may include a conductive circuit 30 located in the panel area A11 and a conductive circuit 30 located in the light bar area A21. That is, the steps of forming the conductive circuit 30 of the panel area A11 and the conductive circuit 30 of the light bar area A21 on the large plate glass 1 are implemented by the same semiconductor process. For example, in the process of making the conductive circuit 30 of the panel area A11, the panel area A11 needs to be etched, exposed and / or developed. Then, in the process of making the conductive circuit 31 in the panel area A11, the conductive circuit 30 of the light bar area A21 is also synchronously prepared in the same process, so that the conductive circuit 30 of the panel area A11 and the conductive circuit 30 of the light bar area A21 are made in the same process. The present application uses the process of preparing the conductive circuit 30 in the panel area A11 to prepare the conductive circuit 30 in the light bar area A21, thereby saving preparation time and improving production efficiency.

[0120] Of course, in other embodiments, forming the conductive circuit 30 on the panel area A11 and forming the conductive circuit 30 on the light bar area A21 can be manufactured in different processes, which is not limited here.

[0121] In some embodiments, the conductive circuit 30 on the light bar area A21 includes but is not limited to a driving line and a light emitting line. The driving line includes but is not limited to a driving circuit, such as a 2T1C driving circuit, a 7T1C driving circuit, a 7T2C driving circuit, etc. The light emitting line includes but is not limited to a data line, a scanning line, etc.

[0122] In one embodiment, after forming the conductive circuit 30 on the light bar area A21 and before binding the light emitting element 20 in the light emitting element binding area, the method further includes: performing circuit detection on the conductive circuit 30 on each light bar preform 2 .

[0123] The light bar preform 2 is obtained by cutting a plurality of light bar areas A21 on the light bar cutting area A2.

[0124] Specifically, before binding the light-emitting element 20, pre-detecting the conductive circuit 30 can ensure the conductivity of the conductive circuit 30, thereby avoiding the rework of the conductive circuit 30 due to defects in the conductive circuit 30 during the lighting test after binding the light-emitting element 20, which affects production efficiency and increases costs.

[0125] See also Figure 4 Further, in one embodiment, before the light emitting element 20 is bound to the light emitting element binding area, the method further includes:

[0126] Step S121: The detection result based on the conductive circuit 30 on the light bar preform 2 is normal.

[0127] That is, the test result of the conductive circuit 30 is normal and has conductivity.

[0128] Step S122 : forming a protection layer 70 on the surface of the light bar preform 2 close to the conductive circuit 30 , and the protection layer 70 covers the conductive circuit 30 .

[0129] Specifically, the protective layer 70 can protect the conductive circuit 30 from being corroded and oxidized.

[0130] The material of the protective layer 70 is a material having insulating properties and being corrosion-resistant, such as silicon oxide, silicon nitride, hydrogenated silicon nitride, etc. In one embodiment of the present application, the material of the protective layer 70 is hydrogenated silicon nitride. Specifically, hydrogenated silicon nitride has good insulating properties, as well as stability, uniformity, and cost-effectiveness.

[0131] In one embodiment, step S122 specifically includes: forming a protective layer 70 with a first thickness on the surface of the light bar preform 2 close to the conductive circuit 30; wherein the first thickness is 5-10 um.

[0132] For example, the first thickness may be 5um, 7um or 10um, etc., which is not limited here. Specifically, if the thickness of the protective layer 70 is too thin, its insulation performance and stability will be affected. If the thickness of the protective layer 70 is too thick, the cost will be increased and it will be unfavorable for the product to be thin and light.

[0133] Step S13: punching the light emitting element binding area to form a plurality of through holes 40 penetrating the light bar area A21.

[0134] See Figure 5 and Figure 6 In the embodiment of the present application, each light bar area A21 has an upper surface and a lower surface opposite to each other, and a plurality of through holes 40 correspond to the light emitting element binding area and penetrate the upper surface and the lower surface of the light bar area A21 along the third direction z. The first direction x intersects with the third direction z. The third direction z is the thickness direction of the large plate glass 1.

[0135] In some embodiments, see Figure 7 The through hole 40 may be a straight through hole, that is, in the third direction z, the aperture of the through hole 40 remains unchanged, thereby facilitating the preparation of the through hole 40.

[0136] Alternatively, see Figure 8, the through hole 40 can be a wedge-shaped hole; that is, each through hole 40 includes a first hole segment 41 close to the upper surface, a second hole segment 42 close to the lower surface, and a third hole segment 43 located between the first hole segment 41 and the second hole segment 42; wherein, in the direction away from the third hole segment 43, the inner diameter of the first hole segment 41 and the inner diameter of the second hole segment 42 are gradually increased. It can be understood that since the inner diameters at both ends of the through hole 40 are larger, when the slurry of the conductive material 50 is filled to the two ends of the through hole 40, the filling speed of the slurry is relatively slow and easy to observe, thereby improving the risk of the slurry of the conductive material 50 easily overflowing from the through hole 40.

[0137] Step S14 : cutting the light bar cutting area A2 to cut out a plurality of light bar areas A21 to obtain a plurality of light bar preforms 2 ; each light bar preform 2 includes a glass substrate 10 and a conductive circuit 30 disposed on a surface of the glass substrate 10 .

[0138] Step S15 : performing grouting on the through hole 40 to fill the through hole 40 with a conductive material 50 .

[0139] See Fig. 9 , wherein the conductive material 50 has conductivity, and the paste used to form the conductive material 50 includes but is not limited to copper, silver, aluminum, conductive polymer, conductive ink, conductive glue, etc.

[0140] In one embodiment, after step S15 , the method further includes: forming a pad structure 60 at one end of each through hole 40 away from the conductive circuit 30 .

[0141] The pad structure 60 can be formed by forming a metal conductive layer on the entire surface of the glass substrate 10 away from the conductive circuit 30 and then patterning the metal conductive layer, thereby forming the pad structure 60 at one end of each through hole 40 away from the conductive circuit 30 .

[0142] Specifically, the pad structure 60 is electrically connected to the conductive material 50 in the through hole 40, and the pin of the light emitting element 20 is electrically connected to the conductive material 50 in the through hole 40 through the pad structure 60. Specifically, the pad structure 60 can improve the connection reliability between the conductive material 50 and the light emitting element 20, and can serve as an alignment mark when the light emitting element 20 is bound.

[0143] Furthermore, a tin layer (not shown) is coated on the pad structure 60. Specifically, the main purpose of coating the tin layer on the pad structure 60 is to promote welding between the light emitting element 20 and the pad structure 60, improve conductivity, and enhance corrosion resistance of the pad structure 60.

[0144] Specifically, in a humid or high temperature environment, oxides are easily formed on the surface of the metal pad structure 60, which not only affects its conductivity, but also may cause problems such as poor contact and increased resistance. Tin has good oxidation resistance and corrosion resistance, and can effectively prevent oxidation and corrosion of the pad structure 60 during use, thereby significantly improving its oxidation resistance and extending its service life.

[0145] In another embodiment, the pad structure 60 may be replaced by anisotropic conductive adhesive (AFC adhesive). Specifically, after step S15 , the method further includes: forming anisotropic conductive adhesive on the surface of the glass substrate 10 away from the conductive circuit 30 .

[0146] Specifically, the anisotropic conductive adhesive is attached to the surface of the glass substrate 10 away from the conductive circuit 30, and the subsequently bound light-emitting element 20 is located on the surface of the anisotropic conductive adhesive away from the glass substrate 10. The anisotropic conductive adhesive can make the light-emitting element 20 conduction with the conductive material 50 in the through hole 40 in the third direction z.

[0147] Step S16 : Binding the light emitting element 20 in the light emitting element binding area so that the conductive circuit 30 is electrically connected to the light emitting element 20 through the conductive material 50 in the through hole 40 ; wherein the light emitting element 20 is located on the surface of the glass substrate 10 away from the conductive circuit 30 .

[0148] See Fig.10 In one embodiment of the present application, each light-emitting element 20 has a first pin (not shown) and a second pin (not shown), one of the first pin and the second pin is a positive pin, and the other is a negative pin, and the first pin and the second pin are respectively arranged corresponding to a through hole 40, that is, one light-emitting element 20 corresponds to two through holes 40.

[0149] Specifically, the conductive circuit 30 can be connected to an integrated circuit (IC) in the display device, wherein the conductive circuit 30 may include a connection portion 301, the IC is electrically connected to the conductive circuit 30 through the connection portion 301, and the IC controls the light-emitting element 20 to emit light through the conductive circuit 30. It can be understood that when the light board is used as a light-emitting substrate, the multiple light-emitting elements 20 on the light board can generate a specific picture under the control of the IC for the user to watch. When the light board is used as a backlight substrate, the multiple light-emitting elements 20 on the light board can emit light under the control of the IC to provide a backlight source for the display substrate.

[0150] Specifically, by arranging the conductive circuit 30 and the light-emitting element 20 on different surfaces of the glass substrate 10, after the light-emitting element 20 is bound to the conductive circuit 30, if there is a defect in the light-emitting element 20, the rework (rework or repair) of the light-emitting element 20 will not affect the conductive circuit 30, for example, the conductive circuit 30 on the back will not be damaged; or the conductive circuit 30 will not affect the rework efficiency of the light-emitting element 20, thereby improving the production efficiency of the light board.

[0151] It should be emphasized that, in the embodiment of the present application, the surface of the glass substrate 10 facing away from the conductive circuit 30 is only provided with a plurality of light-emitting elements 20 , but no conductive circuit 30 .

[0152] In some embodiments, each light bar area A21 extends along the first direction x, and the multiple light emitting element binding areas on each light bar area A21 extend along the first direction x to form at least one row of light emitting element binding areas; for example, one row, two rows, three rows, etc. Specifically, the size of each residual glass (i.e., the glass substrate 10) determines the number of rows of light emitting elements 20 on each residual glass. The following takes the multiple light emitting element binding areas on each light bar area A21 extending along the first direction x to form a row of light emitting element binding areas as an example.

[0153] Furthermore, the step of forming the conductive circuit 30 on a surface of the light bar cutting area A2 includes: forming rows of conductive circuits 31 along the first direction x on a surface of each light bar area A21 .

[0154] See also Fig.12 and Fig.13 , wherein the first viewing angle in the present application is the viewing angle toward the light emitting element, such as the viewing angle toward the upper surface of the glass substrate 10; the second viewing angle is the viewing angle toward the conductive circuit, such as the viewing angle toward the lower surface of the glass substrate 10. Each row of conductive circuits 31 further includes a connecting portion 301, which is located at one end of the light bar area A21 and is used to connect with the IC.

[0155] Furthermore, the step of binding the light-emitting element 20 in the light-emitting element binding area includes: binding the light-emitting element 20 in each light-emitting element binding area in a row of light-emitting element binding areas to form a row of light-emitting elements 20 on each light bar preform 2; wherein a row of light-emitting elements 20 on the same light bar preform 2 is electrically connected to rows of conductive circuits 31 through the conductive material 50 in the through hole 40.

[0156] See also Fig.14 and Fig.15In the following, it is taken as an example that multiple light emitting element binding areas on each light bar area A21 extend along the first direction x to form multiple rows of light emitting element binding areas, and multiple light emitting element binding areas in the multiple rows of light emitting element binding areas are divided into multiple groups of light emitting element binding areas.

[0157] Furthermore, the step of forming the conductive circuit 30 on a surface of the light bar cutting area A2 includes: forming rows of conductive circuits 31 along the first direction x on a surface of each light bar area A21 , each row of conductive circuits 31 including a plurality of sub-conductive circuits 32 .

[0158] Furthermore, the step of binding the light-emitting element 20 in the light-emitting element binding area includes: binding the light-emitting element 20 in each of the multiple rows of light-emitting element binding areas to form multiple rows of light-emitting elements 20 on each light-bar preform 2, and the multiple rows of light-emitting elements 20 are divided into multiple groups of light-emitting element groups 21, each light-emitting element group 21 includes multiple light-emitting elements 20; wherein a group of light-emitting element groups 21 on the same light-bar preform 2 is electrically connected to a sub-conductive circuit 32 through the conductive material 50 in the through hole 40.

[0159] Each light emitting element group 21 includes at least two adjacent light emitting elements 20 .

[0160] Among them, when each group of light-emitting element groups 21 includes at least two adjacent light-emitting elements 20, multiple light-emitting elements 20 can be connected in series or in parallel, and multiple light-emitting elements 20 can be connected in series and in parallel through series-parallel wiring arranged on the surface of the glass substrate 10 away from the light-emitting elements 20, or multiple light-emitting elements 20 are directly electrically connected to the same sub-conductive circuit 32 through the conductive material 50 in the corresponding through hole 40, thereby realizing series and parallel connection, which is not limited here.

[0161] Among them, in this implementation, the control effect of driving multiple lamps in one can be achieved.

[0162] In other embodiments, a plurality of rows of conductive circuits 31 having the same number as the plurality of rows of light-emitting elements 20 may be formed along the first direction x on one surface of each light-bar area A21, and each row of conductive circuits 31 includes a plurality of sub-conductive circuits 32. A group of light-emitting element groups 21 includes a light-emitting element 20, and a group of light-emitting element groups 21 on the same light-bar preform 2 is electrically connected to a sub-conductive circuit 32 through the conductive material 50 in the through hole 40.

[0163] Among them, in this implementation, a one-lamp-one-driver control effect can be achieved.

[0164] Specifically, a group of light-emitting element groups 21 on the same light bar preform 2 is electrically connected to a sub-conductive circuit 32 through the conductive material 50 in the through hole 40, and a group of light-emitting element groups 21 includes at least one light-emitting element 20, so that a control effect of one lamp one drive or multiple lamps one drive can be achieved. It can be understood that the control method of one lamp one drive can improve the contrast and achieve refined control. The control method of multiple lamps one drive helps to improve the uniformity of picture brightness and color, and is conducive to reducing costs.

[0165] In one embodiment, the preparation method further comprises:

[0166] Step S17: splicing a plurality of light bar preforms 2 together to form a light panel.

[0167] Combination Figure 11-Figure 15 Specifically, according to the designed size of the light board, multiple light bar preforms 2 can be spliced ​​together along the first direction x and / or the second direction y to form a light board.

[0168] The second direction y intersects with the first direction x. In the embodiment of the present application, the first direction x, the second direction y and the third direction z are all perpendicular.

[0169] Specifically, the light board is spliced ​​together with a plurality of light bar preforms 2. When one or more light emitting elements 20 on some of the light bar preforms 2 are defective, the entire light bar preform 2 can be directly replaced, thereby improving the production efficiency of the light board.

[0170] See also Figure 16-Figure 27 , Fig.16 A schematic flow chart of an implementation of a method for preparing a light panel provided in the second embodiment of the present application; Fig.17 for Fig.16 The area division diagram of the large plate glass provided in step S21; Fig.18 for Fig.16 Schematic diagram of the intermediate product after step S22; Fig.19 for Fig.16 A schematic diagram of a flow chart of an implementation method after step S22; Fig. 20 for Fig.16 Schematic diagram of the intermediate product after step S23; Fig.21 for Fig. 20 A structural cross-sectional view of an embodiment of the light bar cutting area of ​​the product shown in FIG. 1 along line AA; Fig. 22 for Fig.16 Schematic diagram of the intermediate product after step S25; Fig.23 for Fig.16 Schematic diagram of the intermediate product after step S26; Fig.24 for Fig.16 A schematic flow chart of an implementation method of step S27; Fig.25 for Fig.16 A schematic flow chart of another implementation of step S27; Fig.26 for Fig.16 A schematic flow chart of another implementation of step S27; Fig. 27 for Fig.16 A schematic diagram of an intermediate product of an embodiment after step S27.

[0171] Specifically, the method for preparing the light board provided in the second embodiment of the present application includes:

[0172] Step S21: Divide the large plate glass 1 to obtain a panel cutting area A1 and a light bar cutting area A2; wherein the light bar cutting area A2 includes a plurality of first light bar areas A22 and a plurality of second light bar areas A23, and a plurality of light emitting element binding areas are defined on the first light bar area A22.

[0173] See Fig.17 , wherein the large plate glass 1 in the second embodiment of the present application has the same structure and function as the large plate glass 1 in the first embodiment, and will not be described in detail herein.

[0174] In the second embodiment of the present application, the light board is a double-layer glass substrate, so the first light bar area A22 and the second light bar area A23 together form the substrate of the light bar.

[0175] Specifically, in the second embodiment of the present invention, the residual material left after the large plate glass 1 is cut into display panels is used to cut the substrate of the light bar, thereby reducing the loss and waste of glass, improving the utilization rate of glass, and reducing production costs.

[0176] It can be understood that the first light bar area A22 and the second light bar area A23 are formed based on the residual material left after the large plate glass 1 is cut into the display panel. Therefore, the extension directions of the plurality of first light bar areas A22 and second light bar areas A23 may be the same or different. In the embodiment of the present application, for the convenience of description, it is defined that the first light bar area A22 and the second light bar area A23 both extend along the first direction x, wherein the first direction x is the length or width direction of the large plate glass 1.

[0177] The light emitting element binding area on the light bar area A21 is used to bind the light emitting element 20 .

[0178] Step S22: forming a conductive circuit 30 on a surface of the first light bar area A22 and / or the second light bar area A23.

[0179] See Fig.18The specific implementation of step S22 can refer to the relevant description of the above step S12, which will not be repeated here. In the drawings of the present application, a conductive circuit 30 is formed on one surface of the first light bar area A22 and the second light bar area A23.

[0180] Among them, similar to the first embodiment of the present application, in the second embodiment of the present application, the conductive circuit 30 may include multiple rows of conductive circuits 31, each row of conductive circuits 31 may include multiple sub-conductive circuits 32, and a group of light-emitting element groups 21 is electrically connected to a sub-conductive circuit 32 through the conductive material 50 in the through hole 40.

[0181] Unlike the first embodiment, in the second embodiment of the present application, the conductive circuit 30 may be formed only on one surface of the first light bar area A22, or the conductive circuit 30 may be formed only on one surface of the second light bar area A23, or the conductive circuit 30 may be formed on one surface of the first light bar area A22 and the second light bar area A23.

[0182] In one embodiment, after forming the conductive circuit 30 on the light bar area A21 and before binding the light emitting element 20 in the light emitting element binding area, the method further includes: performing circuit detection on the conductive circuit 30 on the first light bar preform 3 and / or the second light bar preform 4 .

[0183] The first light bar preform 3 is obtained by cutting a plurality of first light bar regions A22 on the light bar cutting area A2; and the second light bar preform 4 is obtained by cutting a plurality of second light bar regions A23 on the light bar cutting area A2.

[0184] Specifically, before binding the light-emitting element 20, pre-detecting the conductive circuit 30 can ensure the conductivity of the conductive circuit 30, thereby avoiding the rework of the conductive circuit 30 due to defects in the conductive circuit 30 during the lighting test after binding the light-emitting element 20, which affects production efficiency and increases costs.

[0185] See Fig.19 Further, in one embodiment, before the light emitting element 20 is bound to the light emitting element binding area, the method further includes:

[0186] Step S221: the detection result of the conductive circuit 30 on the first light bar preform 3 and / or the second light bar preform 4 is normal.

[0187] That is, the test result of the conductive circuit 30 is normal and has conductivity.

[0188] Step S222 : forming a protective layer 70 on a surface of the first light bar preform 3 close to the conductive circuit 30 and / or a surface of the second light bar preform 4 close to the conductive circuit 30 , and the protective layer 70 covers the conductive circuit 30 .

[0189] Specifically, the process of forming the protective layer 70 in step S222 and the effect of the protective layer 70 can refer to the relevant description in the above-mentioned step S122, which will not be repeated here.

[0190] Step S23: punching the light emitting element binding area to form a plurality of through holes 40 penetrating the light bar area A21.

[0191] Combination Fig. 20 and Fig.21 Specifically, the specific implementation of step S23 can refer to the relevant description in the above step S13, which will not be described in detail here.

[0192] Step S24: cutting the light bar cutting area A2 to respectively cut out a plurality of first light bar regions A22 to obtain a plurality of first light bar preforms 3; and respectively cutting out a plurality of second light bar regions A23 to obtain a plurality of second light bar preforms 4; wherein the first light bar preform 3 comprises a first glass substrate 11 and a conductive circuit 30 disposed on a surface of the first glass substrate 11; and / or the second light bar preform 4 comprises a second glass substrate 12 and a conductive circuit 30 disposed on a surface of the second glass substrate 12.

[0193] Step S25 : performing grouting on the through hole 40 to fill the through hole 40 with the conductive material 50 .

[0194] See Fig. 22 Specifically, the specific implementation of step S25 can refer to the relevant description in the above step S15, which will not be described in detail here.

[0195] Step S26 : Binding the light emitting element 20 in the light emitting element binding area, and the light emitting element 20 and the conductive circuit 30 are located on different surfaces.

[0196] See Fig.23 Specifically, the specific implementation of step S26 can refer to the relevant description in the above step S16, which will not be described in detail here.

[0197] Specifically, by arranging the conductive circuit 30 and the light-emitting element 20 on different surfaces of the double-layer glass substrate, after the light-emitting element 20 is bound to the conductive circuit 30, if there is a defect in the light-emitting element 20, the rework of the light-emitting element 20 will not affect the conductive circuit 30, for example, the conductive circuit 30 on the back will not be damaged; or the conductive circuit 30 will not affect the rework efficiency of the light-emitting element 20, thereby improving the production efficiency of the light board.

[0198] Step S27 : aligning and connecting the first light bar preform 3 and the second light bar preform 4 , so that the conductive circuit 30 is electrically connected to the light emitting element 20 through the conductive material 50 in the through hole 40 .

[0199] After the first light bar preform 3 and the second light bar preform 4 are aligned and connected, at least one of the first light bar preform 3 and the second light bar preform 4 has a conductive circuit 30 on its surface.

[0200] Further, the conductive circuit 30 may be located on the surface of the first light bar preform 3 close to the second light bar preform 4; or the conductive circuit 30 may be located on the surface of the second light bar preform 4 close to the first light bar preform 3; or, see Fig. 27 The conductive circuit 30 includes a first conductive circuit 33 and a second conductive circuit 34. One of the first conductive circuit 33 and the second conductive circuit 34 may be located on a surface of the first light bar preform 3 close to the second light bar preform 4, and the other is located on a surface of the second light bar preform 4 close to the first light bar preform 3.

[0201] Specifically, the conductive circuit 30 can be connected to an integrated circuit (IC) in the display device, wherein the conductive circuit 30 may include a connection portion 301, the IC is electrically connected to the conductive circuit 30 through the connection portion 301, and the IC controls the light-emitting element 20 to emit light through the conductive circuit 30. It can be understood that when the light board is used as a light-emitting substrate, the multiple light-emitting elements 20 on the light board can generate a specific picture under the control of the IC for the user to watch. When the light board is used as a backlight substrate, the multiple light-emitting elements 20 on the light board can emit light under the control of the IC to provide a backlight source for the display substrate.

[0202] It should be noted that when the conductive circuit 30 includes a first conductive circuit 33 and a second conductive circuit 34 , since both the first conductive circuit 33 and the second conductive circuit 34 are covered with a protective layer 70 , the protective layer 70 can insulate the first conductive circuit 33 and the second conductive circuit 34 .

[0203] In one embodiment, the size of the second light bar preform 4 is larger than the size of the first light bar preform 3; and see Fig.24 , step S27 specifically includes:

[0204] Step S271: splicing a plurality of first light bar preforms 3 together along the second direction y to form a first substrate.

[0205] The plurality of first light bar preforms 3 may be spliced ​​together along the second direction y by bonding, laser welding or the like.

[0206] Step S272: Align and connect the first substrate and the second light bar preform 4 together to form a light panel.

[0207] The first substrate and the second light bar preform 4 may be connected together by bonding, laser welding or the like.

[0208] It can be understood that in this embodiment, the second light bar preform 4 is used as a substrate in the light board, and the second light bar preform 4 is an integral structure, which can improve the rigidity of the light board. The first substrate is formed by splicing a plurality of first light bar preforms 3, which can improve the utilization rate of the large plate glass 1.

[0209] In addition, in this embodiment, a sealed accommodating cavity is formed between the first substrate and the second light bar preform 4 , and the conductive circuit 30 is located in the accommodating cavity, thereby effectively improving the erosion of the conductive circuit 30 by external water vapor, thereby protecting the conductive circuit 30 .

[0210] In another embodiment, the size of the first light bar preform 3 is larger than the size of the second light bar preform 4; and see Fig.25 , step S27 specifically includes:

[0211] Step S273: splicing a plurality of second light bar preforms 4 together along the second direction y to form a second substrate.

[0212] The plurality of second light bar preforms 4 may be spliced ​​together along the second direction y by bonding, laser welding or the like.

[0213] Step S274: Align and connect the second substrate and the first light bar preform 3 together to form a light board.

[0214] The second substrate and the first light bar preform 3 may be connected together by bonding, laser welding or the like.

[0215] It can be understood that in this embodiment, the first light bar preform 3 is used as a substrate in the light board, and the first light bar preform 3 is an integral structure, which can improve the rigidity of the light board. The second substrate is formed by splicing a plurality of second light bar preforms 4, which can improve the utilization rate of the large plate glass 1.

[0216] Especially for direct display devices, such as OLED display devices and Micro-OLED display devices, the light board serves as a display substrate. Since the light-emitting element 20 is arranged on the first light bar preform 3, the first light bar preform 3 serves as a substrate of the light board and the one-piece molding design can ensure the display effect.

[0217] A sealed accommodating cavity is formed between the second substrate and the first light bar preform 3 , and the conductive circuit 30 is located in the accommodating cavity, so as to effectively improve the erosion of the conductive circuit 30 by external water vapor, thereby protecting the conductive circuit 30 .

[0218] In another embodiment, the size of the first light bar preform 3 is the same as the size of the second light bar preform 4; and see Fig.26 , step S27 specifically includes:

[0219] Step S275: splicing a plurality of first light bar preforms 3 together along the second direction y to form a first substrate; and splicing a plurality of second light bar preforms 4 together along the second direction y to form a second substrate.

[0220] The plurality of first light bar preforms 3 may be spliced ​​together along the second direction y by bonding, laser welding, etc. And the plurality of second light bar preforms 4 may be spliced ​​together along the second direction y by bonding, laser welding, etc.

[0221] Step S276: Align the first substrate and the second substrate together to form a light board.

[0222] The first substrate and the second substrate may be connected together by bonding, laser welding or the like.

[0223] It can be understood that in this embodiment, the first substrate is formed by splicing a plurality of first light bar preforms 3 , and the second substrate is formed by splicing a plurality of second light bar preforms 4 , which can improve the utilization rate of the large plate glass 1 .

[0224] A sealed accommodating cavity is formed between the first substrate and the second substrate, and the conductive circuit 30 is located in the accommodating cavity, so as to effectively improve the erosion of the conductive circuit 30 by external water vapor, thereby protecting the conductive circuit 30.

[0225] In addition, it should be noted that in the above-mentioned embodiments, the plurality of light-emitting elements 20 on the light board formed by splicing are located on the same surface of the light board.

[0226] Specifically, by setting different surfaces of the conductive circuit 30 and the light-emitting element 20, after the light-emitting element 20 is bound to the conductive circuit 30, if there is a defect in the light-emitting element 20, the rework (rework or repair) of the light-emitting element 20 will not affect the conductive circuit 30, for example, the conductive circuit 30 on the back will not be damaged; or the conductive circuit 30 will not affect the rework efficiency of the light-emitting element 20, thereby improving the production efficiency of the light board.

[0227] See also Fig.28 , Fig.28 A schematic structural diagram of an implementation of a display device provided in an embodiment of the present application.

[0228] Specifically, the present application further provides a display device 1000, which includes a light board 100, wherein the light board 100 can be prepared by the preparation method provided by any of the above embodiments.

[0229] Among them, the types of display devices 1000 include but are not limited to LED (Light Emitting Diode) display devices, Micro-LED (Micro-Light Emitting Diode) display devices, OLED (Organic Light Emitting Diode) display devices and LCD (Liquid Crystal Display) display devices, etc. The light board 100 can be used as a light-emitting backplane or display substrate of the display device.

[0230] For example, when the display device 1000 is an LCD display device, the light panel 100 can be used as a light-emitting back panel of the display device.

[0231] For another example, when the type of the display device 1000 is an LED display device, a Micro-LED display device or an OLED display device, the light board 100 can be used as a display substrate of the display device.

[0232] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for preparing a light panel, characterized in that: include: Dividing the large plate glass to obtain a panel cutting area and a light bar cutting area; wherein the light bar cutting area includes a plurality of light bar areas, and a plurality of light emitting element binding areas are defined on the light bar area; forming a conductive circuit on a surface of the light bar area; Punching the light emitting element binding area to form a plurality of through holes penetrating the light bar area; Cutting the light bar cutting area to cut out a plurality of the light bar areas respectively to obtain a plurality of light bar preforms; each of the light bar preforms comprises a glass substrate and the conductive circuit disposed on a surface of the glass substrate; Performing grouting on the through hole to fill the through hole with a conductive material; The light emitting element is bound in the light emitting element binding area so that the conductive circuit is electrically connected to the light emitting element through the conductive material in the through hole; wherein the light emitting element is located on a surface of the glass substrate away from the conductive circuit.

2. The preparation method according to claim 1, characterized in that: Before the step of binding the light emitting element in the light emitting element binding area, the method further comprises: Conducting circuit detection on each of the light bar preforms.

3. The preparation method according to claim 2, characterized in that: Before the step of binding the light emitting element in the light emitting element binding area, the method further comprises: Based on the detection result of the conductive circuit on the light bar preform being normal; A protective layer is formed on a surface of the light bar preform close to the conductive circuit, and the protective layer covers the conductive circuit.

4. The preparation method according to claim 3, characterized in that: The step of forming a protective layer on the surface of the light bar preform close to the conductive circuit comprises: forming a protective layer having a first thickness on a surface of the light bar preform close to the conductive circuit; Wherein, the first thickness is 5-10 um; and / or, the material of the protective layer includes hydrogenated silicon nitride.

5. The preparation method according to claim 1, characterized in that: Each of the light bar areas extends along a first direction, and a plurality of the light emitting element binding areas on each of the light bar areas extends along the first direction to form a row of the light emitting element binding areas; The step of forming a conductive circuit on a surface of the light bar cutting area comprises: Forming rows of conductive circuits along the first direction on a surface of each of the light bar areas; The step of binding the light emitting element in the light emitting element binding area comprises: The light-emitting elements are bound to each of the light-emitting element binding areas in a row to form a row of the light-emitting elements on each of the light-bar preforms; wherein a row of the light-emitting elements on the same light-bar preform is electrically connected to a row of the conductive lines through the conductive material in the through-holes.

6. The preparation method according to claim 1, characterized in that: Each of the light bar areas extends along a first direction, and a plurality of the light emitting element binding areas on each of the light bar areas extends along the first direction to form a plurality of rows of light emitting element binding areas; A plurality of the light emitting element binding areas in a plurality of rows of the light emitting element binding areas are divided into a plurality of groups of light emitting element binding areas; The step of forming a conductive circuit on a surface of the light bar cutting area comprises: Forming rows of conductive circuits along the first direction on a surface of each of the light bar regions, each row of the conductive circuits comprising a plurality of sub-conductive circuits; The step of binding the light emitting element in the light emitting element binding area comprises: The light-emitting elements are bound in each of the plurality of rows of light-emitting element binding areas to form a plurality of rows of light-emitting elements on each of the light-bar preforms, and the plurality of rows of light-emitting elements are divided into a plurality of light-emitting element groups, each of which includes a plurality of light-emitting elements; wherein a group of light-emitting element groups on the same light-bar preform is electrically connected to a sub-conductive circuit through the conductive material in the through hole.

7. The preparation method according to claim 1, characterized in that: Also includes: A plurality of the light bar preforms are spliced ​​together to form the light panel.

8. A method for preparing a light panel, characterized in that: include: Dividing the large plate glass to obtain a panel cutting area and a light bar cutting area; wherein the light bar cutting area includes a plurality of first light bar areas and a plurality of second light bar areas, and a plurality of light emitting element binding areas are defined on the first light bar area; Forming a conductive circuit on a surface of the first light bar area and / or the second light bar area; Punching the light emitting element binding area to form a plurality of through holes penetrating the light bar area; The light bar cutting area is cut to respectively cut out a plurality of the first light bar regions to obtain a plurality of first light bar preforms; and a plurality of the second light bar regions are respectively cut out to obtain a plurality of second light bar preforms; wherein the first light bar preform comprises a first glass substrate and the conductive circuit disposed on a surface of the first glass substrate; and / or the second light bar preform comprises a second glass substrate and the conductive circuit disposed on a surface of the second glass substrate; Performing grouting on the through hole to fill the through hole with a conductive material; Binding a light-emitting element in the light-emitting element binding area, wherein the light-emitting element and the conductive circuit are located on different surfaces; The first light bar preform is aligned and connected with the second light bar preform, so that the conductive circuit is electrically connected to the light emitting element through the conductive material in the through hole.

9. The preparation method according to claim 8, characterized in that: Before the step of binding the light emitting element in the light emitting element binding area, the method further comprises: Conducting circuit detection on the conductive circuits on the first light bar preform and / or the second light bar preform.

10. The preparation method according to claim 9, characterized in that: Before the step of binding the light emitting element in the light emitting element binding area, the method further comprises: Based on the detection result of the conductive circuit on the first light bar preform and / or the second light bar preform being normal; A protective layer is formed on a surface of the first light bar preform close to the conductive circuit and / or a surface of the second light bar preform close to the conductive circuit, and the protective layer covers the conductive circuit.

11. The preparation method according to claim 8, characterized in that: The size of the second light bar preform is larger than the size of the first light bar preform; The step of aligning and connecting the first light bar preform with the second light bar preform comprises: splicing a plurality of the first light bar preforms together along a second direction to form a first substrate; Aligning and connecting the first substrate and the second light bar preform together to form the light panel; Wherein, a closed accommodating cavity is formed between the first substrate and the second light bar preform, and the conductive circuit is located in the accommodating cavity.

12. The preparation method according to claim 8, characterized in that: The size of the first light bar preform is larger than the size of the second light bar preform; The step of aligning and connecting the first light bar preform with the second light bar preform comprises: splicing a plurality of the second light bar preforms together along a second direction to form a second substrate; Aligning and connecting the second substrate and the first light bar preform together to form the light panel; Wherein, a closed accommodating cavity is formed between the second substrate and the first light bar preform, and the conductive circuit is located in the accommodating cavity.

13. The preparation method according to claim 8, characterized in that: The size of the first light bar preform is the same as the size of the second light bar preform; The step of aligning and connecting the first light bar preform with the second light bar preform comprises: splicing a plurality of the first light bar preforms together along a second direction to form a first substrate; and splicing a plurality of the second light bar preforms together along a second direction to form a second substrate; Aligning the first substrate and the second substrate together to form the light board; A sealed accommodating cavity is formed between the first substrate and the second substrate, and the conductive circuit is located in the accommodating cavity.

14. A light board, characterized in that: The light panel is prepared by the preparation method described in any one of claims 1 to 7 above; Or, the light panel is prepared by the preparation method described in any one of claims 8-13.

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