Manufacturing method of packaging substrate with false four-layer plate structure

Abstract

The invention provides a manufacturing method of a package substrate with a false four-layer plate structure, which comprises the following steps of: obtaining four layers of copper foils, and performing circuit manufacturing on the second layer of copper foil; wherein a core plate is arranged between the second layer of copper foil and the third layer of copper foil; spraying a release agent on one surface, far away from the core plate, of the third layer of copper foil, and pressing a bonding sheet on the surface sprayed with the release agent; and further, symmetrically and sequentially pressing a PP plate and a copper foil on the bonding sheet and the second layer of copper foil, and carrying out plate splitting operation to finally form the packaging substrate. According to the invention, the plate is pressed in a symmetrical manner, so that stress is not generated on a single surface to cause plate bending during plate pressing, and separation is performed after pressing to obtain a three-layer plate structure without plate bending.

Description

Technical Field

[0001] The present application relates to a method for manufacturing a substrate, and in particular to a method for manufacturing a packaging substrate with a pseudo four-layer board structure, belonging to the technical field of packaging substrates. Background Art

[0002] Today's three-layer boards are processed using the Core+PP+copper foil method. Asymmetric lamination can lead to severe board bending, which can cause the process to fail and the finished product to fail to assemble. Summary of the invention

[0003] In view of this, the present application provides a method for manufacturing a packaging substrate with a pseudo four-layer board structure to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0004] The technical solution of the embodiment of the present application is implemented as follows: a method for manufacturing a packaging substrate with a pseudo four-layer board structure, comprising the following steps:

[0005] Four layers of copper foil are obtained, and a circuit is made on the second layer of copper foil; wherein a core board is arranged between the second layer of copper foil and the third layer of copper foil.

[0006] A release agent is sprayed on the side of the third copper foil away from the core board, and the bonding sheet is pressed on the surface of the sprayed release agent.

[0007] Furthermore, the PP board and the copper foil are symmetrically pressed on the bonding sheet and the second layer of copper foil in sequence, and the board separation operation is performed to finally form a packaging substrate.

[0008] Further preferably: the spray-release agent comprises:

[0009] Based on the type of release agent and the preset number of spray layers, the spray pressure of the current spraying equipment is adjusted, and the release agent is sprayed on the side of the third copper foil away from the core board at the spray pressure.

[0010] Further preferably, the step of pressing the adhesive sheet onto the surface of the spray release agent comprises:

[0011] Based on the preset pre-pressing parameters, the pre-pressing device is used to stick the adhesive sheet with the release film to the surface sprayed with the release agent.

[0012] Further preferably, the step of pressing the adhesive sheet onto the surface of the spray release agent further comprises:

[0013] The pre-pressed bonding sheet is quickly pressed using a quick pressing device based on preset quick pressing parameters, so that the bonding sheet is adhered to the surface of the spray release agent.

[0014] Further preferably, the laminating of the PP board and the copper foil comprises:

[0015] The release film of the bonding sheet is torn off, and the PP board and the fourth layer of copper foil are sequentially laminated on the bonding sheet based on preset lamination parameters.

[0016] Further preferably: the forming of the packaging substrate comprises:

[0017] The fourth layer of copper foil with a release agent is separated from the third layer of copper foil by using a preset fixture to obtain a packaging substrate including a first layer of copper foil, a PP board, a second layer of copper foil, a core board and a third layer of copper foil.

[0018] Further preferably, the type of the release agent is LR13.

[0019] Further preferably, the type of the bonding sheet is BA25.

[0020] Further preferably, the type of the PP board is S0165 with a resin content of 61%.

[0021] The embodiment of the present application adopts the above technical solution, which has the following advantages:

[0022] The present application adopts a symmetrical method to press the plates, so that stress is not generated on one side to cause plate bending during pressing, and after pressing, the plates are separated to obtain a three-layer plate structure without plate bending.

[0023] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 This is a flow chart of a method for manufacturing a packaging substrate with a pseudo four-layer board structure described in this application.

[0026] Figure 2 This is a schematic diagram of a substrate after the circuit described in this application is manufactured.

[0027] Figure 3 This is a schematic diagram of the substrate after spraying the release agent and pressing the adhesive sheet in this application.

[0028] Figure 4 This is a schematic diagram of the substrate after the PP board and the copper foil are symmetrically pressed on the bonding sheet and the second layer of copper foil in sequence in this application.

[0029] Figure 5 A schematic diagram of a packaging substrate formed by the panel separation operation described in this application.

[0030] Reference numerals:

[0031] 1-first layer of copper foil, 2-second layer of copper foil, 3-third layer of copper foil, 4-fourth layer of copper foil, 5-PP board, 6-core board, 7-release agent, 8-adhesive sheet. DETAILED DESCRIPTION

[0032] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0033] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0034] See also Figure 1 The embodiment of the present application provides a method for manufacturing a packaging substrate with a pseudo four-layer board structure, including the following steps S100-S300.

[0035] S100: Obtain four layers of copper foil, and make circuits on the second layer of copper foil 2; wherein a core board 6 is provided between the second layer of copper foil 2 and the third layer of copper foil 3 ( Figure 2 (shown in purple).

[0036] The copper foil material is cut into four parts of the same size, and the chip is also cut into a size corresponding to the copper foil.

[0037] It should be noted that copper foil has different thickness options. If it is too thin, the tensile strength will be insufficient, and if it is too thick, the cost will be high. Technical personnel in this field need to test different copper foil thicknesses (test T OZ, H OZ, 1OZ respectively) and select corresponding to the board curvature data of the finished product to ensure that the board curvature requirements are met and the optimal cost control is guaranteed.

[0038] Further, the second copper foil 2 ( Figure 2 The circuit is made by mixing the liquid with clean water and grinding it on the second copper foil 2 with mechanical equipment to remove the oxidized surface and increase the roughness of the copper foil to ensure the stability of the circuit connection; then the designed circuit pattern is transferred to the second copper foil 2 through an exposure machine to form a negative image of the circuit pattern; then the unexposed part is removed by a developer to leave the circuit pattern; further, an etching solution is used to remove the part of the copper foil not protected by the developer to form a circuit pattern; finally, cleaning is performed to remove the residual developer and etching solution to complete the circuit production.

[0039] S200: Spray a release agent 7 on the side of the third copper foil 3 away from the core board 6 ( Figure 3 Another purple part), and the bonding sheet 8 ( Figure 3 The red part is shown) pressed on the surface of the spray release agent 7.

[0040] In this embodiment, specifically, the type of the release agent 7 is LR13, and the type of the bonding sheet 8 is BA25.

[0041] Among them, through comparative tests (testing three types of release agents 7, RW-17, W-35, and LR-13 respectively), a release agent 7 that is sticky and easy to separate after pressing is selected, and at the same time has low cost and is easy to operate; LR-13 release agent 7 is preferred, which has low cost, is easy to separate, and is simple to operate.

[0042] Furthermore, in the early stage of the test, if the bonding sheet 8 layer is not added, it is difficult to separate the panels, and some panels cannot be separated. After adding the bonding sheet 8, the panels can be separated in the conventional way. At the same time, through the DOE test (four types of bonding sheets 8, BA-25, LF0100, BA-35, and BA-50, were tested respectively), different types of bonding sheets 8 and different thicknesses were tested. Considering the cost and panel separation effect, the BA-25 bonding sheet 8 was selected.

[0043] In this embodiment, specifically: the spray release agent 7 includes:

[0044] The spraying pressure of the current spraying equipment is adjusted based on the type of the release agent 7 and the preset number of spray layers, and the release agent 7 is sprayed on the side of the third copper foil 3 away from the core board 6 at the spraying pressure.

[0045] The release agent 7 needs to be evenly sprayed on the side of the third copper foil 3 away from the core board 6 to facilitate separation. A skilled person can perform the operation according to actual experimental results.

[0046] In this embodiment, specifically: the step of pressing the bonding sheet 8 onto the surface of the spray release agent 7 includes:

[0047] Based on the preset pre-pressing parameters, the pre-pressing device is used to stick the adhesive sheet 8 with the release film to the surface of the sprayed release agent 7.

[0048] Among them, the adhesive sheet 8 is pressed on the surface of the spray release agent 7. The pre-pressing equipment is first used for pre-pressing so that the adhesive sheet 8 sticks to the surface of the spray release agent 7. After the DOE experiment (four schemes of 100 degrees and 3 gears, 150 degrees and 3 gears, 150 degrees and 5 gears, and 190 degrees and 8 gears were tested respectively), the pre-pressing parameters are preset to 150 degrees, and the speed of 3 gears is optimal. The pre-pressing equipment needs to ensure the flatness of the pressing roller.

[0049] In this embodiment, specifically: the step of pressing the bonding sheet 8 onto the surface of the spray release agent 7 further includes:

[0050] The pre-pressed bonding sheet 8 is quickly pressed using a quick pressing device based on preset quick pressing parameters, so that the bonding sheet 8 is adhered to the surface of the spray release agent 7 .

[0051] Among them, after pre-pressing, fast pressing equipment is used for fast pressing to make the adhesive sheet 8 completely adhere to the surface of the spray release agent 7 to ensure that the adhesive sheet 8 is not separated. After the DOE experiment (three schemes of 50 degrees for 30 seconds, 70 degrees for 20 seconds, and 90 degrees for 15 seconds were tested respectively), the preset fast pressing parameters are 90 degrees for 15 seconds as the optimal, and the release film cannot be torn off after pressing.

[0052] After the quick pressing is completed, Figure 3 The substrate structure shown.

[0053] S300: PP board 5 is pressed symmetrically on the bonding sheet 8 and the second copper foil 2 in sequence ( Figure 4 The blue part shows) and copper foil ( Figure 4 The two ends are shown in orange), and the board is separated to finally form a packaging substrate.

[0054] It should be noted that Figure 4 The two layers of PP board 5 shown in the blue part are made of different materials. The upper layer can be freely selected according to user needs, and the type of the lower layer of PP board 5 is S0165 with a resin content of 61%.

[0055] Among them, the main purpose of PP board 5 is to make the laminate symmetrically pressed, and to facilitate the separation of the boards, and to eliminate the stress on both sides at the same time when pressing the boards. Because the viscosity of PP board 5 is too strong, it will make it impossible to separate the boards. At the same time, the Tg and CTE parameters of the materials do not match, and the board curvature cannot be improved. Through comparative tests (testing four schemes of S016510661%, DS-7409HGBS103776%, 1017GHPL-830NX AI F85, and SI 10NSB 107864% respectively), based on factors such as cost, separation effect, PP viscosity, and board curvature improvement, through DOE tests, PP with a resin content of 106 61% of S0165 material is preferred.

[0056] In this embodiment, specifically: the laminating of the PP board 5 and the copper foil includes:

[0057] The release film of the bonding sheet 8 is torn off, and the PP board 5 and the fourth layer of copper foil 4 are sequentially laminated on the bonding sheet 8 based on preset lamination parameters.

[0058] Among them, a release film is used for pre-pressing treatment to prevent the adhesive sheet 8 from being contaminated by the pre-pressing treatment. After the pre-pressing treatment, the release film is torn off, and the PP board 5 and copper foil are laid and then pressed. It is necessary to select appropriate pressing parameters, and focus on controlling the temperature and pressure parameters of the pressing program (such as temperature 220 degrees, pressure 600PS I).

[0059] At the same time, the focus is on controlling the time control of temperature and pressure to ensure that the plate curvature is minimized. After the DOE experiment, the platen parameters must ensure high temperature and high pressure, and the time must be long enough to minimize the plate curvature.

[0060] The substrate structure of the laminated PP board 5 and the fourth layer of copper foil 4 can be found in Figure 4 .

[0061] In this embodiment, specifically: the forming of the packaging substrate includes:

[0062] The fourth copper foil 4 with the release agent 7 is separated from the third copper foil 3 by a preset jig to obtain a package substrate including the first copper foil 1, the PP board 5, the second copper foil 2, the core board 6 and the third copper foil 3 (see Figure 5 ).

[0063] Among them, an ultra-thin steel wire with relatively hardness is used, and the steel wire is coated with a material that does not damage copper. When separating, the steel wire is pulled from beginning to end to separate the plates.

[0064] Furthermore, the pressing structure of the present application is a symmetrical structure. When the semi-solid is converted into a liquid state and then into a solid state, stress is generated on both sides after shrinkage, and the stress will be reduced. There will be no problem of board bending after pressing. During pressing, a release agent 7 is sprayed under the third layer of copper foil 3 and an adhesive sheet 8 is pre-pressed for separation after pressing; after separation, it becomes a three-layer board structure. After separation, the required three-layer board can be obtained, and at the same time, there will be no problem of board bending.

[0065] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for manufacturing a packaging substrate with a pseudo four-layer board structure, characterized in that: The following steps are involved: Obtain four layers of copper foil, and make circuits on the second layer of copper foil; wherein a core board is arranged between the second layer of copper foil and the third layer of copper foil; Spraying a release agent on the side of the third copper foil away from the core board, and pressing the bonding sheet onto the surface of the sprayed release agent; Furthermore, the PP board and the copper foil are symmetrically pressed on the bonding sheet and the second layer of copper foil in sequence, and the board separation operation is performed to finally form a packaging substrate.

2. The method for manufacturing a packaging substrate with a pseudo four-layer board structure according to claim 1, characterized in that: The spray-release agent comprises: Based on the type of release agent and the preset number of spray layers, the spray pressure of the current spraying equipment is adjusted, and the release agent is sprayed on the side of the third copper foil away from the core board at the spray pressure.

3. The method for manufacturing a packaging substrate with a pseudo four-layer board structure according to claim 2, characterized in that: The step of pressing the bonding sheet onto the surface of the spray release agent comprises: Based on the preset pre-pressing parameters, the pre-pressing device is used to stick the adhesive sheet with the release film to the surface sprayed with the release agent.

4. The method for manufacturing a packaging substrate with a pseudo four-layer structure according to claim 3, characterized in that: The step of pressing the bonding sheet onto the surface of the spray release agent further comprises: The pre-pressed bonding sheet is quickly pressed using a quick pressing device based on preset quick pressing parameters, so that the bonding sheet is adhered to the surface of the spray release agent.

5. The method for manufacturing a packaging substrate with a pseudo four-layer board structure according to claim 4, characterized in that: The laminated PP board and copper foil include: The release film of the bonding sheet is torn off, and the PP board and the fourth layer of copper foil are sequentially laminated on the bonding sheet based on preset lamination parameters.

6. The method for manufacturing a packaging substrate with a pseudo four-layer board structure according to claim 5, characterized in that: The forming of the packaging substrate comprises: The fourth layer of copper foil with a release agent is separated from the third layer of copper foil by using a preset fixture to obtain a packaging substrate including a first layer of copper foil, a PP board, a second layer of copper foil, a core board and a third layer of copper foil.

7. The method for manufacturing a packaging substrate with a pseudo four-layer board structure according to claim 2, characterized in that: The type of release agent is LR13.

8. The method for manufacturing a packaging substrate with a pseudo four-layer board structure according to claim 3, characterized in that: The bonding sheet is of type BA25.

9. The method for manufacturing a packaging substrate with a pseudo four-layer board structure according to claim 5, characterized in that: The type of the PP board is S0165 with 61% resin content.

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