Soft board manufacturing method for improving soft board warping and soft board

Abstract

The invention discloses a soft board manufacturing method for improving soft board bending and a soft board, the soft board comprises an assembling area used for assembling a plurality of PCB units and a rim charge area surrounding the periphery of the assembling area, the soft board manufacturing method comprises the following steps: laying a plurality of bean-shaped copper blocks arranged in an array in the rim charge area to form a copper sheet layer; stacking a plurality of soft boards to form a soft board group, wherein the bean-shaped copper blocks on the copper sheet layers of any two soft boards are in one-to-one correspondence; clamping and fixing the soft plate group through a steel plate, and baking; wherein the contact surface of the steel plate and the soft plate group is coated with a release film and then baked. Compared with the prior art, the copper sheet layer is arranged in the rim charge area of the soft board, and the bending stress of the soft board is released in a steel plate clamping and baking mode.

Description

Technical Field

[0001] The invention relates to a method for manufacturing a soft board and a soft board for improving the warping of the soft board, and belongs to the technical field of circuit boards. Background Art

[0002] During the PCB production process, pure soft boards frequently warp and bend at the four corners and in the middle of the soft board.

[0003] The warping of the edges of the flexible board will cause problems such as failure to grasp during automated production and inability to automatically and continuously produce. The warping inside the board will cause abnormal PCB size during laser cutting and depaneling, which will affect both production efficiency and quality.

[0004] In view of this, it is indeed necessary to improve the existing flexible circuit board to solve the above problems. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a method for manufacturing a soft board with improved warping of the soft board. The method for manufacturing a soft board with improved warping of the soft board can solve the problem of warping of the soft board to improve production efficiency and laser cutting quality.

[0006] The technical solution of the present invention is:

[0007] A method for manufacturing a flexible board for improving the warping of a flexible board, wherein the flexible board comprises an assembly area for assembling a plurality of PCB units, and a side material area surrounding the assembly area, and the method for manufacturing the flexible board comprises:

[0008] Laying a plurality of bean-shaped copper blocks arranged in an array in the edge material area to form a copper skin layer;

[0009] A number of flexible boards are stacked to form a flexible board group, and the bean-shaped copper blocks on the copper skin layers of any two flexible boards correspond to each other one by one;

[0010] The soft plate group is clamped and fixed by steel plates and then baked;

[0011] Wherein, a release film is coated on the contact surface of the steel plate and the soft plate group and then baked.

[0012] As a further improvement of the present invention, copper skin layers are laid on both sides of each flexible circuit board, and the bean-shaped copper blocks of the copper skin layers on both sides are symmetrically arranged.

[0013] As a further improvement of the present invention, the number of soft boards in the soft board group is between 16 and 25.

[0014] As a further improvement of the present invention, the thickness of the release film is between 40-60 um.

[0015] As a further improvement of the present invention, the soft board group coated with the release film is clamped by steel plates and baked at a baking temperature between 140°C and 200°C.

[0016] As a further improvement of the present invention, a gap is provided between two adjacent PCB units, the gap is interconnected with the edge material area, and the flexible board manufacturing method further includes: laying a plurality of bean-shaped copper blocks arranged in an array in the gap to form a copper skin layer.

[0017] As a further improvement of the present invention, the size of the bean-shaped copper block is between 0.6-0.8*0.2-0.4mm.

[0018] As a further improvement of the present invention, the bean-shaped copper block is designed to be inclined at 45°.

[0019] As a further improvement of the present invention, after a plurality of soft boards are stacked to form a soft board group and sandwiched and baked by steel plates, a single soft board is subjected to laser cutting, sandwiched and baked, and passed through a furnace.

[0020] The present invention also provides a soft board, which can avoid warping and improve production efficiency and laser cutting quality.

[0021] The technical solution of the present invention is:

[0022] A soft board is manufactured by the above-mentioned soft board manufacturing method for improving the warping of the soft board.

[0023] The beneficial technical effect of the present invention is as follows: a method for manufacturing a soft circuit board for improving the warping of a soft circuit board of the present invention comprises laying a plurality of bean-shaped copper blocks arranged in an array on the edge material area of ​​the soft circuit board to form a copper skin layer, and then stacking a plurality of soft circuit boards to form a soft circuit board group, and the bean-shaped copper blocks on the copper skin layers of any two soft circuit boards correspond to each other one by one, and the soft circuit board group is clamped and fixed by a steel plate, and then baked; at the same time, a release film is applied on the contact surface of the steel plate and the soft circuit board group, so that the warping force is balanced by the copper skin layer, and the warping stress of the soft circuit board caused by the external force when the soft circuit board is manually held is released by baking, so that the board returns to flatness. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 The present invention is in accordance with a preferred embodiment of a method for manufacturing a flexible board to improve the warping of the flexible board.

[0025] Figure 2 Is used to test the Figure 1 Flow chart of a soft board prepared by a method for manufacturing a soft board for improving the warping of the soft board.

[0026] Figure 3 yes Figure 2 Test result graph.

[0027] Figure 4A schematic structural diagram of a flexible board according to a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0029] See also Figures 1 to 4 As shown, the present invention discloses a flexible board 100, including an assembly area 10 for assembling a plurality of PCB units 1, and a side material area 11 arranged around the outer periphery of the assembly area 10. The plurality of PCB units 1 are arranged in an array in the assembly area 10. Therefore, the side material area 11 can also be said to be a waste area, which will be cut off in the subsequent process.

[0030] In this embodiment, in order to solve the problem that the soft board 100 is bent and warped, which affects the laser cutting of the PCB unit 1, a plurality of bean-shaped copper blocks 2 arranged in an array are laid in the edge material area 11 to form a copper skin layer. This design can increase the local rigidity of the soft board 100 and reduce the bending phenomenon during assembly and use. Preferably, the soft board 100 can be made of FPC soft board material. For example, for products that require high temperature resistance, humidity resistance or corrosion resistance, high temperature resistant materials such as liquid crystal polymer (LCP) are selected.

[0031] There is a gap between two adjacent PCB units 1, and the gap is connected to the edge material area 11. The method for manufacturing the flexible board 100 further includes: laying a plurality of bean-shaped copper blocks 2 arranged in an array in the gap to form a copper skin layer. In other words, in addition to the area where the PCB unit 1 is assembled, bean-shaped copper blocks 2 can be arranged on the flexible board 100 to increase the local rigidity of the flexible board 100 as a whole and reduce the warping phenomenon during assembly and use.

[0032] Preferably, adjacent bean-shaped copper blocks 2 are designed to be inclined at 45°, and two adjacent bean-shaped copper blocks 2 are spaced apart to generate a force to balance the local bending of the flexible board 100. Optionally, the size of the bean-shaped copper block 2 is between 0.6-0.8*0.2-0.4mm.

[0033] Optionally, copper skin layers are laid on both sides of each flexible board 100, and the bean-shaped copper blocks 2 of the copper skin layers on both sides are symmetrically arranged. According to tests, such an arrangement ensures that the distribution of the copper skin layers on both sides is symmetrical, reduces the warping caused by uneven material distribution, and can further ensure the control of the warping degree of the flexible board 100.

[0034] After laying the copper skin layer on each flexible board 100, several flexible boards 100 are stacked to form a flexible board group 3, and the bean-shaped copper blocks 2 on the copper skin layers of any two flexible boards 100 correspond to each other. Such an arrangement helps to maintain the overall flatness of the flexible board group 3 and reduce stress concentration and warping caused by misalignment of the bean-shaped copper blocks 2 on the copper skin layers between the flexible boards 100 and 100.

[0035] The number of the soft boards 100 in the soft board group 3 is between 16 and 25. In this embodiment, the number of the soft boards 100 in the soft board group 3 is preferably 20. According to tests, the soft board group 3 arranged in this way has the strongest overall stability.

[0036] The soft board group 3 is clamped and fixed by the steel plate 4 and baked. This helps to soften the soft board 100 material, reduce the internal stress of the soft board 100, and further reduce warping by evenly distributing heat. In other words, the stress of the soft board 100 is released, avoiding warping during subsequent use.

[0037] During the baking process, special attention should be paid to the control of the baking temperature. In the present embodiment, the baking temperature of the soft board group 3 clamped by the steel plate 4 and baked is between 140°C and 200°C. Preferably, the baking temperature is 160°C. Too high a temperature will affect the heat treatment effect of the soft board 100 material and overheating will cause the material performance to deteriorate.

[0038] In this embodiment, a release film 5 is applied to the contact surface of the steel plate 4 and the soft board group 3 before baking. The use of the release film 5 can reduce the adhesion problem of the soft board 100 in the subsequent processing process, protect the surface of the soft board 100, and also help to maintain the shape of the soft board 100 during the baking process. Preferably, the thickness of the release film 5 is between 40-60um, such as 50um.

[0039] After stacking several soft boards 100 to form a soft board group 3 and sandwiching and baking with steel plates, the soft boards 100 are subjected to three processes of laser cutting, sandwich baking and furnace passing to test a single soft board 100. That is, after feeding, the soft boards are tested through three processes of UV, sandwich baking (removing external stress) and furnace passing (using 295°C to stimulate structural stress), and the test results are recorded respectively.

[0040] The laser cutting technology (ie UV) can achieve high-precision cutting of complex shapes, reduce mechanical stress and edge burr problems, is friendly to flexible materials, and reduces deformation and damage of the soft board 100 .

[0041] In this test, several improved ways of the flexible circuit board 100 were tested, including the original design (solid copper in the edge material area 11), the edge material area 11 designed with flow strips (3*1mm, C / S surface staggered design), the edge material area 11 designed with flow strips (3*2mm, C / S surface staggered design), the edge material area 11 designed with bean-shaped copper blocks 2 (0.8*0.2mm), the edge material area 11 designed with bean-shaped copper blocks 2 (0.6*0.4mm) and the edge material area 11 designed with grid copper (0.3*0.3mm). It can be clearly seen that when the bean-shaped copper block 2 is designed, the bending and warping of the flexible circuit board 100 can be effectively avoided.

[0042] The present invention also discloses a method for manufacturing a flexible board 100 for improving the warping of the flexible board 100. The flexible board 100 includes an assembly area 10 for assembling a plurality of PCB units 1, and a side material area 11 arranged around the outer periphery of the assembly area 10. The method for manufacturing the flexible board 100 includes:

[0043] A plurality of bean-shaped copper blocks 2 arranged in an array are laid in the edge material area 11 to form a copper skin layer;

[0044] A plurality of flexible boards 100 are stacked to form a flexible board group 3, and the bean-shaped copper blocks 2 on the copper skin layers of any two flexible boards 100 correspond to each other one by one;

[0045] The soft board group 3 is clamped and fixed by the steel plate 4 and then baked;

[0046] Wherein, a release film 5 is coated on the contact surface of the steel plate 4 and the soft plate group 3 and then baked.

[0047] In summary, a method for manufacturing a soft circuit board 100 for improving the warping of a soft circuit board 100 of the present invention comprises laying a plurality of bean-shaped copper blocks 2 arranged in an array on the edge material area 11 of the soft circuit board 100 to form a copper skin layer, and then stacking a plurality of soft circuit boards 100 to form a soft circuit board group 3, and the bean-shaped copper blocks 2 on the copper skin layers of any two soft circuit boards 100 correspond to each other one by one, and the soft circuit board group 3 is clamped and fixed by a steel plate 4, and baked; at the same time, a release film 5 is applied on the contact surface between the steel plate 4 and the soft circuit board group 3, so that the warping force is balanced by the copper skin layer, and the warping stress of the soft circuit board caused by the external force when the soft circuit board is manually held is released by baking, so that the board returns to flatness.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A method for manufacturing a soft board to improve the warping of the soft board, characterized in that: The flexible board includes an assembly area for assembling a plurality of PCB units, and a side material area surrounding the assembly area. The flexible board manufacturing method includes: Laying a plurality of bean-shaped copper blocks arranged in an array in the edge material area to form a copper skin layer; A number of flexible boards are stacked to form a flexible board group, and the bean-shaped copper blocks on the copper skin layers of any two flexible boards correspond to each other one by one; The soft plate group is clamped and fixed by steel plates and then baked; Wherein, a release film is coated on the contact surface of the steel plate and the soft plate group and then baked.

2. The method for manufacturing a soft board for improving the warping of a soft board according to claim 1, characterized in that: Copper layers are laid on both sides of each flexible circuit board, and the bean-shaped copper blocks on both sides of the copper layers are symmetrically arranged.

3. The method for manufacturing a soft board for improving the warping of a soft board according to claim 1, characterized in that: The number of the soft boards in the soft board group is between 16 and 25.

4. The method for manufacturing a soft board for improving the warping of a soft board according to claim 1, characterized in that: The thickness of the release film is between 40-60 um.

5. The method for manufacturing a soft board for improving the warping of a soft board according to claim 1, characterized in that: The baking temperature of the soft board group coated with the release film clamped by the steel plates and baked is between 140°C and 200°C.

6. The method for manufacturing a soft board for improving the warping of a soft board according to claim 1, characterized in that: A gap is provided between two adjacent PCB units, and the gap is communicated with the edge material area. The flexible circuit board manufacturing method further includes: laying a plurality of bean-shaped copper blocks arranged in an array in the gap to form a copper skin layer.

7. The method for manufacturing a soft board for improving the warping of a soft board according to claim 1, characterized in that: The size of the bean-shaped copper block is between 0.6-0.8*0.2-0.4mm.

8. The method for manufacturing a soft board with improved warping of a soft board according to claim 1, characterized in that: The bean-shaped copper block is designed to be inclined at 45°.

9. The method for manufacturing a soft board with improved warping of a soft board according to claim 1, characterized in that: After a number of flexible boards are stacked to form a flexible board group and sandwiched and baked by steel plates, a single flexible board is subjected to laser cutting, sandwich baking and furnace passing processes.

10. A soft board, characterized in that: The soft board is manufactured by the method for manufacturing a soft board for improving the warping of the soft board as described in any one of claims 1 to 9.

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