Insulation heat dissipation structure of high-power high-voltage power supply LLC circuit
By adopting a modularly assembled in a dual radiator in a high-power high-voltage LLC power supply, the problems of low power density and poor heat dissipation effect in the prior art are solved, and more efficient heat dissipation and higher power density are achieved.
Patent Information
- Application Number
- CN202411621676.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-04-11
AI Technical Summary
Existing high-power high-voltage LLC power supply products face the problems of low power density and poor heat dissipation effect, resulting in a decrease in working efficiency.
The insulated heat dissipation structure is modularly assembled by dual radiators, including the primary radiator and the secondary radiator, which is connected through thermally conductive insulating components to achieve mutual transfer of heat and balanced heat dissipation.
It effectively improves the heat dissipation efficiency of the high-power high-voltage power supply LLC circuit, meets the heat dissipation needs of the high-power high-voltage power supply LLC circuit, and improves the power density.
Smart Images
Figure CN119815765A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of heat dissipation of switching power supplies, and more specifically, to an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit. Background Art
[0002] At present, the power level of AC-DC power supply products is mainly concentrated below 5kW, and the voltage level is below 270V, which indicates that there is a lack of high-power high-voltage products and related technical reserves in the market. With the gradual improvement of the level of equipment electrification, the widespread application of high-voltage busbars, and the popularization of all-electric special vehicles, the demand for high-power high-voltage power supplies is becoming more and more urgent. These power supplies not only charge high-voltage battery packs, but also provide power for high-voltage loads such as motor controllers and servo controllers. However, existing high-power high-voltage LLC power supply products face several challenges and limitations, such as large size, low power density, and serious heating problems during long-term operation, all of which lead to a decrease in work efficiency. High power density design requires more efficient thermal management solutions and more compact component layouts, but the current technical level has not yet fully met these requirements. As the power increases, the heat generated also increases, and the existing heat dissipation technology is difficult to effectively cope with the challenges of high-density heat flow. Therefore, although high-power high-voltage power supplies are used in many industrial applications, they still face many challenges and shortcomings in terms of power density and heat dissipation. Summary of the invention
[0003] In order to solve the technical problems of low power density and poor heat dissipation effect of existing high-power high-voltage power supplies, the present invention innovatively provides an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, which adopts a dual-heat sink modular assembly method to effectively improve the heat dissipation efficiency of the high-power high-voltage power supply LLC circuit, meet the heat dissipation requirements of the high-power high-voltage power supply LLC circuit, and improve the power density.
[0004] To achieve the above-mentioned technical objectives, an embodiment of the present invention discloses an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, including a primary heat sink and a secondary heat sink, wherein the primary heat sink is plate-shaped, and a plurality of power device mounting holes are provided in the middle of the right side wall of the primary heat sink along its length direction, and the secondary heat sink is box-shaped, and the secondary heat sink is installed on the left side of the primary heat sink through a thermally conductive insulating component, and a plurality of rectifier diode mounting holes are provided in the middle of the left side wall of the secondary heat sink along its length direction, and the secondary heat sink is provided with a cavity with an upper opening, and the cavity is divided into a plurality of independent mounting grooves, and a positioning partition covering the upper end opening of the cavity is provided on the upper surface of the secondary heat sink, and the positioning partition is provided with glue filling holes corresponding to the plurality of mounting grooves one by one.
[0005] Furthermore, the present invention provides an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein the thermally conductive insulation component includes an insulating partition plate and a thermally conductive insulation pad, an embedding groove is provided on the right side wall of the insulating partition plate along its own length direction, and a plurality of window holes penetrating the bottom of the embedding groove are evenly spaced in the middle part of the insulating partition plate along its own length direction, the thermally conductive insulation pad is embedded in the embedding groove of the insulating partition plate, and the end of the secondary side heat sink is embedded in the window hole of the insulating partition plate and connected to the primary side heat sink through the thermally conductive insulation pad.
[0006] Furthermore, the present invention provides an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein a first through hole is provided between two adjacent window holes on the insulating partition plate, a second through hole is provided on the thermally conductive insulating pad that matches the majority of the first through holes one-to-one, a first fixed through hole is provided on the right side wall of the secondary radiator that matches the first through holes one-to-one, and a connecting hole is provided on the primary radiator that matches the first through holes one-to-one, and a first insulating connecting component is respectively provided in each of the connecting holes on the primary radiator, and each of the first insulating connecting components passes through the corresponding connecting hole, the second through hole and the first through hole from right to left in sequence and is fixed on the corresponding first fixed through hole of the secondary radiator.
[0007] Furthermore, the present invention provides an insulated heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein the right end of the secondary side heat sink is provided with a plurality of heat dissipation bosses that match the window holes on the insulating partition plate one by one, and the heat dissipation bosses are embedded one by one in the window holes on the insulating partition plate, and the thickness of the heat dissipation bosses is slightly greater than the depth of the window holes.
[0008] Furthermore, the present invention provides an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein a positioning protrusion is provided on the left side wall of the insulating partition plate, which is coaxial with the first through hole and extends to the left, and a positioning groove is provided on the secondary side heat sink, which is coaxial with the first fixed through hole, and the positioning protrusion is embedded in the positioning groove.
[0009] Furthermore, the present invention provides an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein a heat dissipation base extending to the right is provided at the lower end of the primary heat sink, so that the heat dissipation base and the primary heat sink form an L-shaped structure, and a plurality of first mounting bosses extending to the right are provided at intervals at the right end of the heat dissipation base, each of the first mounting bosses is provided with a second fixing through hole, and each of the second fixing through holes is provided with a second insulating connection component.
[0010] Furthermore, the present invention provides an insulated heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein a second mounting boss extending upward is respectively provided on the front half and the rear half of the primary heat sink, and a third mounting boss extending rightward is provided in the middle of the primary heat sink, and a first temperature sensor is mounted on the third mounting boss.
[0011] Furthermore, the present invention provides an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein a fourth mounting boss extending to the left is provided at the lower end of the left half of the secondary side heat sink, a plurality of third fixing through holes are provided on the fourth mounting boss, a third insulating connection component is respectively sleeved in each of the third fixing through holes, a fifth mounting boss extending toward the mounting groove is provided in the middle of the upper end of the left half of the secondary side heat sink, a second temperature sensor is installed on the fifth mounting boss, and sixth mounting bosses are respectively provided on the front and rear sides of the upper end of the left half of the secondary side heat sink.
[0012] Furthermore, the present invention provides an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein a first insulating connection component includes an insulating sleeve and a first screw, the insulating sleeve includes a first screw insulating sleeve and a first nut insulating sleeve with an inner diameter that is smaller on the left and larger on the right and are integrally formed, the first screw insulating sleeve passes through the primary heat sink, the thermal insulating pad and the insulating partition plate from right to left in sequence, and then abuts against the bottom of the positioning groove of the secondary heat sink, the connecting hole on the primary heat sink is a step hole, the left end of the first nut insulating sleeve abuts against the step surface of the step hole, the first fixing through hole on the secondary heat sink is a threaded hole, the first screw passes through the first screw insulating sleeve and the first nut insulating sleeve in sequence from right to left, and then is screwed into the threaded hole, and the length of the first nut insulating sleeve is greater than the nut length of the first screw.
[0013] Furthermore, the present invention provides an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, wherein the second insulating connection component and the third insulating connection component both include an upper insulating sleeve, a lower insulating sleeve and a second screw, the upper insulating sleeve includes a second nut insulating sleeve that is larger at the top and smaller at the bottom and is integrally formed, and the length of the second nut insulating sleeve is greater than the nut length of the second screw, the lower insulating sleeve includes an inner insulating sleeve and an outer insulating sleeve that are smaller at the top and larger at the bottom and are integrally formed, the inner insulating sleeve is sleeved on the second screw insulating sleeve, the length of the inner insulating sleeve is less than the second screw insulating sleeve, a flange extending radially thereof is provided at the lower port of the outer insulating sleeve, the second screw insulating sleeve is inserted into the inner insulating sleeve, the second screw is arranged in the second screw insulating sleeve, and the lower end of the second screw passes through the outer insulating sleeve.
[0014] The beneficial effects of the present invention are as follows: the present invention is provided with a primary radiator and a secondary radiator, the primary radiator is plate-shaped, and a plurality of power device mounting holes are arranged in the middle of the right side wall of the primary radiator along its own length direction, the secondary radiator is box-shaped, and the secondary radiator is installed on the left side of the primary radiator through a heat-conducting insulation component, and a plurality of rectifier diode mounting holes are arranged in the middle of the left side wall of the secondary radiator along its own length direction, the secondary radiator is provided with a cavity with an upper opening, and the cavity is divided into a plurality of mutually independent mounting grooves, and a positioning partition covering the upper opening of the cavity is arranged on the upper surface of the secondary radiator, and a glue injection hole corresponding to the plurality of mounting grooves is arranged on the positioning partition. The present invention fixes the secondary radiator and the primary radiator to the left and right sides of the heat-conducting insulation component respectively, and by adopting a double radiator design, that is, the configuration of the primary radiator and the secondary radiator, the heat generated by the high-power electrical components in the LLC power supply circuit can be quickly dissipated, thereby improving the heat dissipation efficiency and meeting the heat dissipation requirements of the high-power high-voltage power supply LLC circuit. While ensuring efficient heat dissipation, this design also enhances the ability of high-power high-voltage power supply LLC circuit to perform efficient energy conversion and output in a limited space, thereby improving power density. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a three-dimensional structural schematic diagram of an insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0016] Figure 2 It is a right-side structural schematic diagram of an insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0017] Figure 3 It is a front view structural schematic diagram of an insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0018] Figure 4 It is a top view structural schematic diagram of an insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0019] Figure 5 It is a three-dimensional structural schematic diagram of a heat-conducting insulation component in an insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0020] Figure 6 It is a three-dimensional structural schematic diagram of another angle of a heat-conducting insulation component in an insulation and heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0021] Figure 7 It is a three-dimensional structural schematic diagram of a primary side heat sink in an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0022] Figure 8It is a schematic diagram of the three-dimensional structure of a secondary side heat sink in an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0023] Fig. 9 It is a three-dimensional structural schematic diagram of another angle of a secondary side heat sink in an insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention;
[0024] Fig.10 It is a three-dimensional structural schematic diagram of a secondary side heat sink in an insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit of the present invention (the positioning partition and the third insulation connection component are hidden);
[0025] Fig.11 For along Figure 2 Schematic diagram of the cross-sectional structure in the AA direction;
[0026] Fig.12 for Fig.11 A partial enlarged view of the middle A part (1:3);
[0027] Fig.13 For along Figure 3 Schematic diagram of the cross-sectional structure in the middle BB direction;
[0028] Fig.14 for Fig.13 A partial enlarged view of part B in the middle (1:3). DETAILED DESCRIPTION
[0029] The insulation and heat dissipation structure of a high-power and high-voltage power supply LLC circuit of the present invention is explained and illustrated in detail below in conjunction with the drawings in the specification.
[0030] The embodiment of the present invention discloses a heat dissipation structure of an insulating heat dissipation structure of a high-power high-voltage power supply LLC circuit, which has a wide range of applicability and can meet the needs of various types of LLC power supply circuits. Whether the primary side adopts a full-bridge or half-bridge topology, or the secondary side adopts any combination of full-bridge rectification or half-bridge rectification, the heat dissipation structure can effectively manage heat. Specifically, it can adapt to the configuration of the full-bridge or half-bridge in the primary circuit, and can also cope with different combinations of full-bridge rectification or half-bridge rectification in the secondary circuit. This flexibility allows the heat dissipation structure to exert its heat dissipation efficiency in various power supply designs, ensuring that the power supply circuit remains within a safe temperature range during operation, thereby improving the stability and reliability of the overall system.
[0031] like Figure 1-4 Combined with Fig. 9As shown, the heat dissipation structure includes a primary heat sink 1 and a secondary heat sink 2. The primary heat sink 1 is set to a plate shape, and a plurality of power device mounting holes 11 are provided in the middle of the right side wall of the primary heat sink 1 along its own length direction. The secondary heat sink 2 is set to a box shape, and the secondary heat sink 2 is installed on the left side of the primary heat sink 1 through a thermally conductive insulating component 3. A plurality of rectifier diode mounting holes 21 are provided in the middle of the left side wall of the secondary heat sink 2 along its own length direction, and a cavity with an upper end opening is provided on the secondary heat sink 2, and the cavity is divided into a plurality of independent mounting grooves 22. A positioning partition 4 covering the upper end opening of the cavity is provided on the upper surface of the secondary heat sink 2, and a glue injection hole 41 corresponding to the plurality of mounting grooves 22 is provided on the positioning partition 4.
[0032] In actual use, the primary switching tube power device (MOSFET) is threadedly connected to the power device mounting hole 11 of the primary heat sink 1 through screws to achieve the installation of the switching tube power device. In order to transfer the heat generated by the switching tube power device to the primary heat sink 1 while meeting the electrical insulation requirements, a thermally conductive insulating pad 32 may be laid between the switching tube power device and the primary heat sink 1 to ensure that the switching tube power device fits tightly with the primary heat sink 1 to improve the heat transfer efficiency. The number of switching tube power devices depends on the number of switching tubes required by the topological structure of the primary side of the LLC power supply circuit. Magnetic devices such as transformers and resonant inductors are installed in the mounting groove 22 of the secondary heat sink 2. Fig.10As shown, the cavity of the secondary heat sink 2 is divided into four installation grooves 22. The two middle installation grooves 22 are larger and used to install the transformer. The two sides of the two large installation grooves 22 are two small installation grooves 22 for installing the resonant inductor. Because each magnetic device has two coils, which are respectively installed on their own coil skeletons, in order to position the magnetic device more accurately after installation, with a smaller offset, and to facilitate potting and fixing, corresponding herringbone-shaped limit plates are designed in the four installation grooves. After the positioning partition 4 and the secondary heat sink 2 are assembled, the overall structure of the transformer and the resonant inductor is formed. The four independent installation grooves 22 are respectively filled with glue and sealed through the glue holes 41 on the positioning partition 4. The magnetic device after potting not only solves the installation and fixing problem, but also the thermal conductive sealant is conducive to the heat dissipation of the magnetic device. The rectifier diode of the secondary side is threadedly connected to the rectifier diode mounting hole 21 of the secondary heat sink 2 by screws to achieve the installation of the switch tube power device. In order to transfer the heat generated by the rectifier diode to the secondary radiator 2 under the premise of meeting electrical insulation, a thermally conductive insulating pad 32 can be laid between the rectifier diode and the secondary radiator 2 to ensure that the rectifier diode is closely fitted to the secondary radiator 2 and improve the heat transfer efficiency. The number of rectifier diodes depends on the number of diodes required by the rectification topology of the secondary side of the LLC power supply circuit. The thermally conductive insulating component 3 is an intermediate structure for heat conduction between the primary radiator 1 and the secondary radiator 2, which is used to achieve installation positioning, enhance heat transfer and electrical isolation. The heat generated by the primary radiator 1 and the secondary radiator 2 can be transferred to each other through the thermally conductive insulating component 3 to avoid heat concentration, so that the LLC power supply circuit as a whole tends to a thermal equilibrium state. The secondary radiator 2 and the primary radiator 1 are respectively fixed on the left and right sides of the thermally conductive insulating component 3. By adopting a double radiator design, that is, the configuration of the primary radiator 1 and the secondary radiator 2, the heat generated by the high-power electrical components in the LLC power supply circuit can be quickly dissipated, thereby improving the heat dissipation efficiency and meeting the heat dissipation requirements of the high-power high-voltage power supply LLC circuit. While ensuring efficient heat dissipation, this arrangement also enhances the ability of the high-power high-voltage power supply LLC circuit to perform efficient energy conversion and output in a limited space, thereby improving power density.
[0033] like Figure 5-6 Combined with Figure 8As shown, in one embodiment of the present invention, the thermally conductive insulating assembly 3 includes an insulating partition plate 31 and a thermally conductive insulating pad 32. An embedding groove 311 is provided on the right side wall of the insulating partition plate 31 along its length direction, and a plurality of window holes 312 penetrating the bottom of the embedding groove 311 are evenly spaced in the middle of the insulating partition plate 31 along its length direction, so that the thermally conductive insulating pad 32 is embedded in the embedding groove 311 of the insulating partition plate 31. The end of the secondary radiator 2 is embedded in the window hole 312 of the insulating partition plate 31 and connected to the primary radiator 1 through the thermally conductive insulating pad 32. The size of the insulating partition plate 31 is consistent with that of the primary radiator 1, the primary radiator 1 is in close contact with the right surface of the thermally conductive insulating pad 32, and the secondary radiator 2 is in close contact with the left surface of the thermally conductive insulating pad 32 through the window hole 312 on the insulating partition plate 31. After the three are connected and fastened, the overall installation size can be ensured and installed on an external mechanism (external chassis or external radiator). The thermally conductive insulating pad 32 has excellent thermal conductivity and a certain elasticity. By calculating the compression amount of the thermally conductive insulating pad 32, when the primary heat sink 1, the insulating partition plate 31, and the secondary heat sink 2 are connected and tightened, the thermally conductive insulating pad 32 is fully squeezed to form a good contact with the heat conductive surfaces on both sides, forming a good heat conduction path, thereby improving the overall heat transfer effect. At the same time, the thermally conductive insulating pad 32 has good electrical insulation, realizes the electrical isolation of the primary and secondary sides of the LLC power supply circuit, realizes heat transfer, ensures the balance of heat between the primary heat sink 1 and the secondary heat sink 2, improves the heat dissipation efficiency, and prevents heat concentration.
[0034] like Figure 5-6 Combined with Figure 7-8 As shown, the primary heat sink 1, the secondary heat sink 2, the insulating partition plate 31 and the thermally conductive insulating pad 32 are connected in the following manner: a first through hole 313 is provided between two adjacent window holes 312 on the insulating partition plate 31, a second through hole 321 matching one-to-one with the majority of the first through holes 313 is provided on the thermally conductive insulating pad 32, a first fixing through hole 23 matching one-to-one with the first through holes 313 is provided on the right side wall of the secondary heat sink 2, a connecting hole 12 matching one-to-one with the first through hole 313 is provided on the primary heat sink 1, and a first insulating connecting component 5 is respectively provided in each connecting hole 12 on the primary heat sink 1, so that each first insulating connecting component 5 passes through the corresponding connecting hole 12, the second through hole 321 and the first through hole 313 from right to left in sequence and is fixed on the corresponding first fixing through hole 23 of the secondary heat sink 2. By adopting the above connection structure, the primary heat sink 1, the secondary heat sink 2, the insulating partition plate 31 and the thermally conductive insulating pad 32 can be tightly connected together through the first insulating connection component 5, and the electrical isolation between the primary heat sink 1 and the secondary heat sink 2 can be ensured to meet the use of a higher power LLC power supply circuit.
[0035] like Figure 8 Combined with Figure 6As shown, a plurality of heat dissipation bosses 24 are provided at the right end of the secondary heat sink 2, which are matched one by one with the window holes 312 on the insulating partition plate 31. The heat dissipation bosses 24 are embedded one by one into the window holes 312 on the insulating partition plate 31, so that the thickness of the heat dissipation bosses 24 is slightly greater than the depth of the window holes 312. Figure 6 As shown, the window holes 312 are set to four. Fig.10 As shown, the heat dissipation bosses 24 are also correspondingly set to four, and the heat dissipation bosses 24 have the same shape as the window holes 312. After the secondary heat sink 2 is fixed to the insulating partition plate 31, the four heat dissipation bosses 24 will be completely embedded in the window holes 312 on the insulating partition plate 31, and the right surface of the heat dissipation bosses 24 and the thermal insulation pad 32 are fully squeezed to improve the heat transfer effect. Under different working conditions, when the heat generated by the primary side of the LLC power supply circuit is greater than the heat generated by the secondary side, the heat is transferred from the primary side heat sink 1 to the secondary side heat sink 2; when the heat generated by the secondary side of the LLC power supply circuit is greater than the heat generated by the primary side, the heat is transferred from the secondary side heat sink 2 to the primary side heat sink 1, so that the primary and secondary sides of the LLC power supply circuit assist each other in heat dissipation.
[0036] like Figure 6 Combined with Fig.10 As shown, a positioning protruding ring 314 is provided on the left side wall of the insulating partition plate 31, which is coaxial with the first through hole 313 and extends to the left, and a positioning groove 25 is provided on the secondary radiator 2, which is coaxial with the first fixing through hole 23, and the positioning protruding ring 314 is embedded in the positioning groove 25. In this way, when the secondary radiator 2 and the insulating partition plate 31 are assembled, the positioning can be quickly installed and positioned through the matching relationship between the positioning protruding ring 314 and the positioning groove 25, thereby improving the assembly efficiency.
[0037] like Figure 7As shown, in one embodiment of the present invention, a heat dissipation base 13 extending to the right is provided at the lower end of the primary radiator 1, so that the heat dissipation base 13 and the primary radiator 1 form an L-shaped structure, and a plurality of first mounting bosses 131 extending to the right are provided at intervals at the right end of the heat dissipation base 13, and a second fixing through hole is provided on each first mounting boss 131, and a second insulating connection component 6 is provided in each second fixing through hole. The heat dissipation base 13 can be connected to an external mechanism (external chassis or radiator) through the second insulating connection component 6, and the insulating installation is ensured, and the heat absorbed by the primary radiator 1 can be transferred to the external mechanism by using the heat dissipation base 13, and then the heat is transferred to the external environment by the external mechanism. A second mounting boss 14 extending upward is provided on the front and rear halves of the primary heat sink 1, respectively. The second mounting boss 14 is used to install the power switch board of the LLC power supply circuit. By providing the second mounting boss 14, a concave-convex structure can be formed on the upper end of the primary heat sink 1. The second mounting boss 14 is in contact with the ground wire (copper-clad position) of the power switch board to achieve good grounding, and a certain safety distance is maintained between the concave position at the upper end of the primary heat sink 1 and the power switch board to achieve electrical isolation. A third mounting boss 15 extending to the right is provided in the middle of the primary heat sink 1, and a first temperature sensor 7 is installed on the third mounting boss 15. The first temperature sensor 7 is used to monitor the temperature of the switch tube power device on the primary heat sink 1 in real time. Specifically, the first temperature sensor 7 can use a thermistor.
[0038] like Fig. 9 Combined with Fig.10 As shown, in one embodiment of the present invention, a fourth mounting boss 26 extending to the left is provided at the lower end of the left half of the secondary heat sink 2, and a plurality of third fixing through holes 261 are provided on the fourth mounting boss 26, so that each third fixing through hole 261 is respectively sleeved with a third insulating connection component 8. Fig.10 As shown, a third fixing through hole 261 is respectively provided along the front and rear positions of the fourth mounting boss 26, and the secondary radiator 2 is connected to the external mechanism through the third insulating connection component 8. A fifth mounting boss 27 extending toward the mounting groove 22 is provided in the middle of the upper end of the left half of the secondary radiator 2, and a second temperature sensor 9 is installed on the fifth mounting boss 27. The second temperature sensor 9 is used to monitor the temperature of the heating element installed in the secondary radiator 2 in real time. Specifically, the second temperature sensor can use a thermistor. Sixth mounting bosses 28 are respectively provided on the front and rear sides of the upper end of the left half of the secondary radiator 2. The number of the sixth mounting bosses 28 can be set according to actual conditions. In this embodiment, part of the sixth mounting bosses 28 are used to install the power switch board of the LLC power supply circuit, and the other part of the sixth mounting bosses 28 are used to install the positioning partition 4.
[0039] like Figure 2 Combined with Figure 11-12As shown, in one embodiment of the present invention, the first insulating connection component 5 includes an insulating sleeve 51 and a first screw 52. The insulating sleeve 51 includes a first screw insulating sleeve 511 and a first nut insulating sleeve 512, which are integrally formed and have a smaller inner diameter on the left and a larger inner diameter on the right. The first screw insulating sleeve 511 passes through the primary heat sink 1, the thermal insulation pad 32, and the insulating partition plate 31 from right to left in sequence, and then abuts against the bottom of the positioning groove 25 of the secondary heat sink 2. The connection hole 12 on the primary heat sink 1 is set as a step hole, and the left end of the first nut insulating sleeve 512 abuts against the step surface of the step hole. The first fixing through hole 23 on the secondary heat sink 2 is set as a threaded hole. The first screw 52 passes through the first screw insulating sleeve 511 and the first nut insulating sleeve 512 from right to left in sequence, and then is screwed into the threaded hole, so that the primary heat sink 1, the thermal insulation pad 32, the insulating partition plate 31 and the secondary heat sink 2 are connected and fastened. The first screw 52 is isolated from the primary radiator 1 by the first screw insulating sheath 511 and the first nut insulating sheath 512, which not only realizes the electrical isolation between the primary radiator 1 and the secondary radiator 2, but also realizes the connection and tightening. The length of the first nut insulating sheath 512 is greater than the nut length of the first screw 52. The nut of the first screw 52 can be completely sunk into the first nut insulating sheath 512, avoiding the nut of the first screw 52 from contacting other non-insulating structures around it, and the sheath portion higher than the nut increases the creepage distance.
[0040] like Figure 3 Combined with Figure 13-14 As shown, in one embodiment of the present invention, the second insulating connection component 6 and the third insulating connection component 8 both include an upper insulating sheath 61, a lower insulating sheath 62 and a second screw 63. The second insulating connection component 6 is used to achieve the insulating installation between the primary heat sink 1 and the external mechanism, and the third insulating connection component 8 is used to achieve the insulating installation between the secondary heat sink 2 and the external mechanism. Fig.14 The upper insulating sheath 61 has the same structure as the insulating sheath in the first insulating connection component. The upper insulating sheath 61 includes a second nut insulating sheath 611 that is larger at the top and smaller at the bottom and is integrally formed with a second screw rod insulating sheath 612, so that the length of the second nut insulating sheath 611 is greater than the nut length of the second screw 63. The lower insulating sheath 62 includes an inner insulating sheath 621 that is smaller at the top and larger at the bottom and is integrally formed with an outer insulating sheath 622. The inner insulating sheath 621 is sleeved on the second screw rod insulating sheath 612, so that the length of the inner insulating sheath 621 is less than that of the second screw rod insulating sheath 612. A flange 623 extending in its radial direction is provided at the lower end of the outer insulating sheath 622, so that the second screw rod insulating sheath 612 is inserted into the inner insulating sheath 621, and the second screw 63 is arranged in the second screw rod insulating sheath 612, and the lower end of the second screw 63 passes through the outer insulating sheath 622.
[0041] During actual installation, the upper insulating sleeve 61 is installed from top to bottom in the first fixing through hole 23 of the first mounting boss 131 of the primary radiator 1, the length of the second screw insulating sleeve 612 depends on the thickness of the first mounting boss 131, the lower insulating sleeve 62 is installed from bottom to top in the first fixing through hole 23 of the first mounting boss 131 of the primary radiator 1, and the inner insulating sleeve 621 of the lower insulating sleeve 62 is sleeved on the second screw insulating sleeve 612, so that the first mounting boss 131 is sandwiched between the upper insulating sleeve 61 and the lower insulating sleeve 62, and the electrical isolation requirements are jointly guaranteed. Secondly, the length of the inner insulating sleeve 621 is less than that of the second screw insulating sleeve 612, so as to ensure that the upper insulating sleeve 61 and the lower insulating sleeve 62 do not interfere with each other during installation. In addition, a fixing boss is provided on the mounting plane of the external mechanism, and a threaded hole is provided at the center of the fixing boss. The outer insulating sheath 622 of the lower insulating sheath 62 is sleeved on the fixing boss, and the flange 623 at the lower end of the outer insulating sheath 622 is used to increase the creepage distance between the external mechanism and the primary heat sink 1. The second screw 63 passes through the upper insulating sheath 61 and the lower insulating sheath 62 from top to bottom and is screwed into the threaded hole of the fixing boss to fasten the primary heat sink 1 to the external mechanism. The fastening process of the secondary heat sink 2 and the external mechanism is the same as that of the primary heat sink 1, and will not be repeated here.
[0042] It is worth noting that both the primary radiator 1 and the secondary radiator 221 can be realized through the fine processing technology of aluminum. This process not only benefits from the low density of aluminum metal, which enables aluminum to reduce the overall weight while maintaining structural strength, thereby providing convenience during movement and installation; it also benefits from the excellent thermal conductivity of aluminum, which ensures that heat can be quickly and evenly transferred from the heat source to various parts of the radiator, and then effectively dissipated to the environment; in addition, the excellent processability of aluminum makes the shape and structure of the radiator more diverse to adapt to different heat dissipation needs and space constraints.
[0043] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0044] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and simple improvements made to the essential contents of the present invention should be included in the protection scope of the present invention.
Claims
1. An insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit, characterized in that: The invention comprises a primary radiator and a secondary radiator, wherein the primary radiator is plate-shaped, and a plurality of power device mounting holes are arranged in the middle of the right side wall of the primary radiator along its length direction; the secondary radiator is box-shaped, and the secondary radiator is installed on the left side of the primary radiator through a heat-conducting insulating component, and a plurality of rectifier diode mounting holes are arranged in the middle of the left side wall of the secondary radiator along its length direction; the secondary radiator is provided with a cavity with an upper opening, and the cavity is divided into a plurality of mutually independent mounting grooves; a positioning partition covering the upper opening of the cavity is arranged on the upper surface of the secondary radiator, and the positioning partition is provided with glue filling holes corresponding to the plurality of mounting grooves one by one.
2. The insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 1, characterized in that: The thermally conductive insulation component includes an insulating partition plate and a thermally conductive insulation pad. An embedding groove is provided on the right side wall of the insulating partition plate along its length direction. A plurality of window holes penetrating the bottom of the embedding groove are evenly spaced along its length direction in the middle part of the insulating partition plate. The thermally conductive insulation pad is embedded in the embedding groove of the insulating partition plate. The end of the secondary side radiator is embedded in the window hole of the insulating partition plate and connected to the primary side radiator through the thermally conductive insulation pad.
3. The insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 2, characterized in that: A first through hole is provided between two adjacent window holes on the insulating partition plate, a second through hole is provided on the thermally conductive insulating pad that matches the majority of the first through holes one by one, a first fixing through hole is provided on the right side wall of the secondary radiator that matches the first through holes one by one, a connecting hole is provided on the primary radiator that matches the first through holes one by one, a first insulating connecting component is provided in each connecting hole on the primary radiator, and each of the first insulating connecting components passes through the corresponding connecting hole, the second through hole and the first through hole from right to left in sequence and is fixed on the corresponding first fixing through hole of the secondary radiator.
4. The insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 3, characterized in that: The right end of the secondary radiator is provided with a plurality of heat dissipation bosses which match the window holes on the insulating partition plate one by one. The heat dissipation bosses are embedded in the window holes on the insulating partition plate one by one. The thickness of the heat dissipation bosses is slightly greater than the depth of the window holes.
5. The insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 4, characterized in that: A positioning convex ring coaxial with the first through hole and extending to the left is provided on the left side wall of the insulating partition plate, and a positioning groove coaxially arranged with the first fixed through hole is provided on the secondary side heat sink, and the positioning convex ring is embedded in the positioning groove.
6. The insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 1, characterized in that: A heat sink base extending to the right is provided at the lower end of the primary radiator, so that the heat sink base and the primary radiator form an L-shaped structure. A plurality of first mounting bosses extending to the right are provided at intervals at the right end of the heat sink base, each of the first mounting bosses is provided with a second fixing through hole, and each of the second fixing through holes is provided with a second insulating connection component.
7. The insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 6, characterized in that: A second mounting boss extending upward is respectively provided on the front half and the rear half of the primary radiator, and a third mounting boss extending rightward is provided in the middle of the primary radiator, and a first temperature sensor is mounted on the third mounting boss.
8. The insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 1, characterized in that: A fourth mounting boss extending to the left is provided at the lower end of the left half of the secondary radiator, and a plurality of third fixing through holes are provided on the fourth mounting boss, and a third insulating connection component is respectively sleeved in each of the third fixing through holes. A fifth mounting boss extending toward the mounting groove is provided in the middle of the upper end of the left half of the secondary radiator, and a second temperature sensor is installed on the fifth mounting boss. Sixth mounting bosses are respectively provided on the front and rear sides of the upper end of the left half of the secondary radiator.
9. The insulation heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 5, characterized in that: The first insulating connection component includes an insulating sleeve and a first screw, the insulating sleeve includes a first screw insulating sleeve and a first nut insulating sleeve with an inner diameter smaller on the left and larger on the right and integrally formed, the first screw insulating sleeve passes through the primary heat sink, the thermal insulating pad and the insulating partition plate from right to left in sequence, and then abuts against the bottom of the positioning groove of the secondary heat sink, the connecting hole on the primary heat sink is a step hole, the left end of the first nut insulating sleeve abuts against the step surface of the step hole, the first fixing through hole on the secondary heat sink is a threaded hole, the first screw passes through the first screw insulating sleeve and the first nut insulating sleeve in sequence from right to left, and then is screwed into the threaded hole, and the length of the first nut insulating sleeve is greater than the nut length of the first screw.
10. The insulation and heat dissipation structure of a high-power high-voltage power supply LLC circuit according to claim 9, characterized in that: The second insulating connection component and the third insulating connection component both include an upper insulating sleeve, a lower insulating sleeve and a second screw, the upper insulating sleeve includes a second nut insulating sleeve and a second screw insulating sleeve which are larger at the top and smaller at the bottom and are integrally formed, the length of the second nut insulating sleeve is greater than the nut length of the second screw, the lower insulating sleeve includes an inner insulating sleeve and an outer insulating sleeve which are smaller at the top and larger at the bottom and are integrally formed, the inner insulating sleeve is sleeved on the second screw insulating sleeve, the length of the inner insulating sleeve is less than that of the second screw insulating sleeve, a flange extending radially thereof is provided at the lower end of the outer insulating sleeve, the second screw insulating sleeve is inserted into the inner insulating sleeve, the second screw is arranged in the second screw insulating sleeve, and the lower end of the second screw passes through the outer insulating sleeve.