Electronic equipment

Abstract

The invention provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a first body, a second body, a rotating mechanism and a first heat dissipation assembly, the first body and the second body are rotationally connected through the rotating mechanism, the first heat dissipation assembly is arranged on the rotating mechanism, a first air outlet is formed in the first heat dissipation assembly, and when the electronic equipment is in a target state, the first air outlet is formed in the second body. At least part of airflow blown out of the first air outlet flows through the first body and / or the second body so as to dissipate heat of the electronic equipment.

Description

Technical Field

[0001] The present application relates to but is not limited to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] In the related art, the first body and the second body of the electronic device are rotatably connected through a rotating mechanism, but the air volume of the heat dissipation component in the electronic device can only cover a part of the first body and / or the second body, resulting in poor heat dissipation effect of the electronic device. Summary of the invention

[0003] The present application provides an electronic device, which includes a first body, a second body, a rotating mechanism and a first heat dissipation component, wherein the first body and the second body are rotationally connected via the rotating mechanism; the first heat dissipation component is arranged on the rotating mechanism, and the first heat dissipation component is provided with a first air outlet. When the electronic device is in a target state, the airflow blown out of the first air outlet at least partially flows through the first body and / or the second body to dissipate heat for the electronic device.

[0004] In an implementable method provided in the present application, the rotating mechanism includes a first part and a second part, the first part is rotatably connected to the second part, the first body and the second body are both rotatably connected to the first part, and the first body and the second body are both rotated relative to the second part to switch the electronic device between different states. The relative positions of the first body and the second body of the electronic device are different in different states, and the first heat dissipation component is arranged in the second part.

[0005] In an implementable method provided in the present application, a first air inlet is provided on the first body and / or the second body, and the first air outlet includes a third part and / or a fourth part. The airflow blown out by the third part flows through the interior of the first body and / or the interior of the second body through the first air inlet, and the airflow blown out by the fourth part flows through the surface of the first body and / or the surface of the second body. When the electronic device is in a target state, the first body and the second body have a first state and a second state. In the first state, the third part is larger than the fourth part, and in the second state, the fourth part is larger than the third part.

[0006] In an implementable method provided in the present application, in the second state, when the angle between the extension direction of the surface where the first body is located and the extension direction of the surface where the second body is located is within the target angle range, the airflow blown out from the first air outlet flows through the first air inlet completely through the interior of the first body and / or the interior of the second body.

[0007] In an implementable method provided in the present application, the electronic device also includes a second heat dissipation component and a heating module. The heating module is arranged inside the first body and / or inside the second body. The second heat dissipation component is arranged inside the body corresponding to the heating module, and is used to dissipate heat from the heating module. The second heat dissipation component includes an air suction channel. When the electronic device is in a target state, the airflow blown out of the first air outlet at least partially flows into the air suction channel.

[0008] In an implementable method provided in the present application, the rotating mechanism includes a first shell and a rotating shaft, the first shell has a first accommodating cavity, the rotating shaft is arranged in the first accommodating cavity, the rotating shaft forms a first part that is rotatably connected to the first body and the second body, the first shell forms a second part, the first heat dissipation assembly is arranged in the first accommodating cavity, and a second air outlet is opened on the first shell, the size of the second air outlet is smaller than the size of the first accommodating cavity, and the airflow blown out of the first air outlet flows out through the second air outlet.

[0009] In an implementable manner provided in the present application, the first heat dissipation component includes a vibrator, which is disposed on a rotating mechanism. When the electronic device is in a target state, the vibrator vibrates on the rotating mechanism to cause the first air outlet to blow out airflow.

[0010] In an implementable method provided in the present application, the first heat dissipation component includes a second shell, the second shell is arranged on a rotating mechanism, a first air outlet is opened on the second shell, and a vibrating member is fixed in a second accommodating cavity. When the electronic device is in a target state, the vibrating member vibrates in the second accommodating cavity to make the first air outlet blow out airflow.

[0011] In an implementable method provided in the present application, the vibrator is arranged in the second accommodating cavity to separate the second accommodating cavity into two second sub-accommodating cavities. When the electronic device is in a target state, the vibrator can vibrate along the two second sub-accommodating cavities in the arrangement direction of the second accommodating cavity.

[0012] In an implementation provided in the present application, the electronic device further includes a connection structure, which is disposed on at least one of a cavity wall of the first accommodating cavity and the second shell, and the first heat dissipation assembly is fixed in the first accommodating cavity via the connection structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of a structure in which the airflow from the first air outlet of the electronic device provided in an embodiment of the present application flows entirely through the interior of the second body;

[0014] Figure 2 A schematic diagram of the structure in which part of the airflow from the first air outlet of the electronic device provided in an embodiment of the present application flows through the interior of the second body and part of the airflow flows through the surface of the second body;

[0015] Figure 3 A schematic diagram of the structure in which a first heat dissipation component is disposed in a rotating mechanism in an electronic device provided in an embodiment of the present application;

[0016] Figure 4 A schematic diagram of the structure of a first heat dissipation component in an electronic device provided in an embodiment of the present application;

[0017] Figure 5 A structural schematic diagram of an electronic device provided in an embodiment of the present application, in which a first heat dissipation component is disposed in a rotating mechanism and a connection structure is disposed between the first heat dissipation component and a cavity wall of a first accommodating cavity;

[0018] Figure 6 A schematic diagram of a structure in which a first heat dissipation component is disposed in a rotating mechanism, a connection structure is disposed between the first heat dissipation component and a cavity wall of a first accommodating cavity, and a sound module is disposed inside a second body in an electronic device provided in an embodiment of the present application;

[0019] Figure 7 A structural schematic diagram of an electronic device provided in an embodiment of the present application, in which a first heat dissipation component is disposed in a rotating mechanism, a connection structure is disposed between the first heat dissipation component and the cavity wall of the first accommodating cavity, a sound module is disposed inside the second body, and a guide structure is disposed between the first air outlet and the second air outlet;

[0020] Figure 8 A schematic diagram of a structure in which the airflow from the first air outlet of the electronic device provided in an embodiment of the present application flows entirely through the interior of the second body and a second heat dissipation assembly is disposed in the second body;

[0021] Fig. 9 A schematic diagram of the structure in which part of the airflow from the first air outlet of the electronic device provided in an embodiment of the present application flows through the interior of the second body and part flows through the surface of the second body, and a second heat dissipation component is arranged inside the second body.

[0022] Description of reference numerals:

[0023] 1-electronic device; 11-first body; 12-second body; 121-first air inlet; 13-rotating mechanism; 131-rotating shaft; 132-first shell; 1321-first accommodating chamber; 13211-clamping protrusion; 1322-second air outlet; 14-first heat dissipation component; 141-vibrating member; 142-second shell; 1421-second accommodating chamber; 14211-second sub-accommodating chamber; 1422-clamping groove; 1423-first air outlet; 15-second heat dissipation component; 16-heating module; 17-sound module; 171-battery; 172-PCB; 173-CPU; 174-heat balancing board; 18-flow guide tube. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present application and should not be regarded as an improper limitation on the present application.

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the specific technical scheme of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0026] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0027] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0028] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0029] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0030] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0031] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 An embodiment of the present application provides an electronic device 1, which includes a first body 11, a second body 12, a rotating mechanism 13 and a first heat dissipation component 14, wherein the first body 11 and the second body 12 are rotatably connected via the rotating mechanism 13; the first heat dissipation component 14 is arranged on the rotating mechanism 13, and the first heat dissipation component 14 is provided with a first air outlet 1423. When the electronic device 1 is in the target state, the airflow blown out by the first air outlet 1423 at least partially flows through the first body 11 and / or the second body 12 to dissipate heat for the electronic device 1.

[0032] In some embodiments, the electronic device 1 may be a laptop computer; the electronic device 1 may be a computer host; the electronic device 1 may also be a game console, etc.; this is not limited in the embodiments of the present application. That is, those skilled in the art may determine the type of the electronic device 1 according to actual conditions. The above situation is only an exemplary description of the types of the electronic device 1 in the present application, but is not limited to the situations described in the above embodiments. In one possible implementation provided in the embodiments of the present application, the electronic device 1 is a laptop computer.

[0033] In some embodiments, the first body 11 and the second body 12 can be rotatably connected by a rotating mechanism 13, and the first body 11 and the second body 12 can both be display bodies with display modules (for example, display screens); the first body 11 can be a display body with a display module (for example, a display screen), and the second body 12 can be an output body with an output module (for example, a keyboard), etc.; this is not limited to the embodiments of the present application. That is, those skilled in the art can determine the types of the first body 11 and the second body 12 according to actual conditions. The above situation is only an exemplary explanation of what types the first body 11 and the second body 12 in the present application can be, but is not limited to the situation described in the above embodiment. In an implementable manner provided in the embodiments of the present application, the first body 11 and the second body 12 are both display bodies with display modules.

[0034] In some embodiments, the first body 11 and the second body 12 can be rotatably connected through a rotating mechanism 13, where the rotating mechanism 13 can be a single rotating shaft, a sleeve can be separately provided on the first body 11 and the second body 12, and the first body 11 and the second body 12 can be connected to the single rotating shaft through their sleeves to achieve rotatable connection; the rotating mechanism 13 can also be two rotating shafts and a co-moving member, the co-moving member can be located between the two rotating shafts, the first body 11 and the second body 12 can be connected to the two rotating shafts respectively, and the first body 11 and the second body 12 can be rotatably connected through the cooperation of the two rotating shafts and the co-moving member, etc.; this is not limited to the embodiments of the present application. That is, those skilled in the art can determine the type of the rotating mechanism 13 according to actual conditions, and the above situation is only an exemplary description of what types the rotating mechanism 13 in the present application can be, but is not limited to the situation recorded in the above embodiment. In an implementable manner provided in the embodiments of the present application, the rotating mechanism 13 is a single rotating shaft.

[0035] In some embodiments, the first heat dissipation component 14 can be arranged on the rotating mechanism 13, and the first heat dissipation component 14 can be provided with a first air outlet 1423. When the electronic device 1 is in the target state, at least part of the airflow blown out of the first air outlet 1423 can flow through the first body 11 and / or the second body 12 to dissipate heat for the electronic device 1; the first heat dissipation component 14 can be a rotating fan, and the rotation of the fan is used to make the first air outlet 1423 blow out airflow; the first heat dissipation component 14 can be a vibrating fan, and the vibration of the fan is used to make the first air outlet 1423 blow out airflow, etc.; in this regard, the embodiment of the present application is not limited. That is, those skilled in the art can determine the type of the first heat dissipation component 14 according to actual conditions. The above situation is only an exemplary explanation of what types the first heat dissipation component 14 in the present application can be, but it is not limited to the situation recorded in the above embodiment. Referring to the figure, in an implementable manner provided in the embodiment of the present application, the first heat dissipation component 14 is a vibrating fan.

[0036] In some embodiments, the first heat dissipation component 14 can be arranged on the rotating mechanism 13; the first heat dissipation component 14 can be arranged inside the rotating mechanism 13; the first heat dissipation component 14 can also be arranged outside the rotating mechanism 13, etc., and the embodiments of the present application do not limit this. That is, those skilled in the art can determine the setting position of the first heat dissipation component 14 on the rotating mechanism 13 according to actual conditions. The above situation is only an exemplary description of the setting positions of the first heat dissipation component 14 on the rotating mechanism 13 in the present application, but is not limited to the situations described in the above embodiments. In an achievable manner provided in the embodiments of the present application, the first heat dissipation component 14 is arranged inside the rotating mechanism 13.

[0037] In some embodiments, the first heat dissipation component 14 can be arranged on the rotating mechanism 13; the first heat dissipation component 14 can be detachably arranged on the rotating mechanism 13, for example, by snap-fit ​​arrangement; for example, by thread arrangement, etc.; the first heat dissipation component 14 can also be non-detachably arranged on the rotating mechanism 13, for example, by welding arrangement, integral molding arrangement, etc.; this is not limited by the embodiments of the present application. That is, those skilled in the art can determine the type of arrangement of the first heat dissipation component 14 on the rotating mechanism 13 according to actual conditions. The above situation is only an exemplary explanation of the types of the rotation arrangement of the first heat dissipation component 14 in the present application, but is not limited to the situation described in the above embodiment. In an achievable method provided in the embodiments of the present application, the first heat dissipation component 14 is detachably arranged on the rotating mechanism 13.

[0038] In some embodiments, when the electronic device 1 is in the target state, at least part of the airflow blown out of the first air outlet 1423 can flow through the first body 11 and / or the second body 12 to dissipate heat for the electronic device 1; the target state can be a state in which the electronic device 1 needs to dissipate heat during operation of the electronic device 1, the target state can be that the first body 11 and the second body 12 are rotated by the rotating mechanism 13 so that the first body 11 and the second body 12 are folded, and the first body 11 and the second body 12 are still in a working state; the target state can be that the first body 11 and the second body 12 are unfolded by the rotating mechanism 13 so that the first body 11 and the second body 12 are still in a working state, etc.; in this regard, the embodiments of the present application are not limited. That is, those skilled in the art can determine the target state of the electronic device 1 according to actual conditions, and the above situation is only an exemplary description of what types of target states of the electronic device 1 in the present application can be, but is not limited to the situations recorded in the above embodiments.

[0039] In some embodiments, when the electronic device 1 is in the target state, at least part of the airflow blown out of the first air outlet 1423 can flow through the first body 11 and / or the second body 12 to dissipate heat for the electronic device 1; part of the airflow blown out of the first air outlet 1423 can flow through the first body 11 and / or the second body 12; the airflow blown out of the first air outlet 1423 can flow through the first body 11 and / or the second body 12, etc.; the embodiments of the present application are not limited to this. That is, those skilled in the art can determine the extent to which the first air outlet 1423 flows through the first body 11 and / or the second body 12 according to actual conditions. The above situation is only an exemplary description of the extent to which the first air outlet 1423 can flow through the first body 11 and / or the second body 12 in this application, but is not limited to the situation described in the above embodiment.

[0040] In some embodiments, when the electronic device 1 is in the target state, at least part of the airflow blown out of the first air outlet 1423 can flow through the first body 11 and / or the second body 12 to dissipate heat for the electronic device 1; the airflow blown out of the first air outlet 1423 can only flow through the first body 11; the airflow blown out of the first air outlet 1423 can only flow through the second body 12; the airflow blown out of the first air outlet 1423 can flow through the first body 11 and the second body 12 at the same time, etc.; the embodiments of the present application are not limited to this. That is, those skilled in the art can determine the path through which the airflow blown out of the first air outlet 1423 flows according to actual conditions. The above situation is only an exemplary description of the possibility of the path through which the airflow of the first air outlet 1423 flows in the present application, but is not limited to the situation recorded in the above embodiment.

[0041] The electronic device 1 provided in the embodiment of the present application has a first body 11 and a second body 12 that are rotatably connected via a rotating mechanism 13, and the first heat dissipation component 14 is disposed on the rotating mechanism 13. At this time, the first heat dissipation component 14 is isolated from the first body 11 and / or the second body 12. In other words, the first heat dissipation component 14 does not occupy the space of the first body 11 and / or the second body 12. In this way, when the electronic device 1 is in the target state, the airflow blown out from the first air outlet 1423 avoids the influence of the space of the first body 11 and / or the second body 12 of the first heat dissipation component 14, so that at least part of the airflow blown out from the first air outlet 1423 flows through the first body 11 and / or the second body 12, so as to fully dissipate the heat of the first body 11 and / or the second body 12, thereby improving the heat dissipation effect of the electronic device 1. Compared with the technical problem in the related art that the air volume of the heat dissipation component in the electronic device 1 can only cover a part of the first body 11 and / or the second body 12, resulting in poor heat dissipation effect of the electronic device 1, the present application arranges the first heat dissipation component 14 on the rotating mechanism 13 so that the airflow blown out by the first air outlet 1423 at least partially flows through the first body 11 and / or the second body 12, so as to fully dissipate the heat of the first body 11 and / or the second body 12, thereby improving the heat dissipation effect of the electronic device 1.

[0042] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 An embodiment of the present application provides an electronic device 1, wherein a rotating mechanism 13 includes a first part and a second part, wherein the first part is rotatably connected to the second part, wherein a first body 11 and a second body 12 are both rotatably connected to the first part, and wherein the first body 11 and the second body 12 are both rotated relative to the second part so that the electronic device 1 can switch between different states. The relative positions of the first body 11 and the second body 12 of the electronic device 1 are different in different states, and a first heat dissipation component 14 is disposed in the second part.

[0043] In some embodiments, the rotating mechanism 13 may include a first part and a second part, the first part may be rotatably connected to the second part, the first body 11 and the second body 12 may both be rotatably connected to the first part, and the first body 11 and the second body 12 may rotate relative to the second part; the first part may be a sleeve, the second part may be a shaft 131, the sleeve may be rotatably connected to the first body 11 and the second body 12 respectively, the sleeve may be connected to the shaft 131, the shaft 131 may be connected to the sleeve, and the first body 11 and the second body 12 may be rotatably connected relative to the shaft 131; the first part may be the shaft 131, the second part may be a first shell 132 provided with the shaft 131, the shaft 131 may be rotatably connected to the first body 11 and the second body 12 respectively, the shaft 131 may be rotatably connected to the first shell 132, and the first body 11 and the second body 12 may be rotatably connected relative to the first shell 132, etc.; in this regard, the embodiments of the present application are not limited. That is, those skilled in the art may determine the specific structures of the first part and the second part according to actual conditions, and the above situation is only an exemplary description of what the specific structures of the first part and the second part in the present application may be, but it is not limited to the situations recorded in the above embodiments.

[0044] In some embodiments, the first body 11 and the second body 12 can both rotate relative to the second part to switch the electronic device 1 between different states, and the relative positions of the first body 11 and the second body 12 of the electronic device 1 in different states are different; the first body 11 and the second body 12 can rotate relative to the second part, the first body 11 can be folded with the second body 12, the electronic device 1 is in a folded state and unfolded toward the first body 11 and the second body 12, and the electronic device 1 is in an unfolded state when the state is converted; the first body 11 and the second body 12 can rotate relative to the second part, the first body 11 can be unfolded with the second body 12, the electronic device 1 is in an unfolded state and folded toward the first body 11 and the second body 12, and the electronic device 1 is in a folded state when the state is converted, etc.; in this regard, the embodiments of the present application are not limited. That is, those skilled in the art can determine in which state the electronic device 1 is switched according to actual conditions, and the above situation is only an exemplary description of the states in which the electronic device 1 in the present application can be switched, but is not limited to the situations recorded in the above embodiments.

[0045] In the electronic device 1 provided in the embodiment of the present application, the first body 11 and the second body 12 both rotate relative to the second part. In other words, the second part and the first body 11 and the second body 12 are independent entities, and the second part does not rotate with the first body 11 and the second body 12, and the first heat dissipation component 14 is arranged on the second part. During the rotation of the first body 11 and the second body 12, only the force required by the first body 11 and the second body 12 needs to be applied, and there is no need to apply the force required by the first heat dissipation component 14 other than the force required by the first body 11 and the second body 12. In this way, the force required to be applied for the rotation of the first body 11 and the second body 12 can be saved, thereby saving the time required for the first body 11 and the second body 12.

[0046] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 An embodiment of the present application provides an electronic device 1, wherein a first air inlet 121 is provided on a first body 11 and / or a second body 12, and a first air outlet 1423 includes a third part and / or a fourth part, and an airflow blown out of the third part flows through the interior of the first body 11 and / or the interior of the second body 12 through the first air inlet 121, and an airflow blown out of the fourth part flows through a surface of the first body 11 and / or a surface of the second body 12. When the electronic device 1 is in a target state, the first body 11 and the second body 12 have a first state and a second state. In the first state, the third part is larger than the fourth part, and in the second state, the fourth part is larger than the third part.

[0047] In some embodiments, the first body 11 and / or the second body 12 may be provided with a first air inlet 121, and the first air inlet 121 may be larger than the first air outlet 1423; the first air inlet 121 may be smaller than the first air outlet 1423; the first air inlet 121 may also be equal to the first air outlet 1423, and the embodiments of the present application do not limit this. That is, those skilled in the art may determine the size relationship between the first air inlet 121 and the first air outlet 1423 according to actual conditions, and the above situation is only an exemplary description of the size relationship between the first air inlet 121 and the first air outlet 1423 in the present application, but is not limited to the situations described in the above embodiments.

[0048] In some embodiments, the first air outlet 1423 may include a third part and / or a fourth part, the airflow blown out of the third part may flow through the first body 11 and / or the second body 12 through the first air inlet 121, and the airflow blown out of the fourth part may flow through the surface of the first body 11 and / or the second body 12; the first air outlet 1423 may include only the third part; the first air outlet 1423 may include only the fourth part; the first air outlet 1423 may include both the third part and the fourth part, etc.; this is not limited to the embodiments of the present application. That is, those skilled in the art may determine that the first air outlet 1423 specifically includes the third part and / or the fourth part according to actual conditions, and the above situation is only an exemplary description of the types of parts that the first air outlet 1423 in the present application may include, but is not limited to the situations described in the above embodiments.

[0049] In some embodiments, when the electronic device 1 is in the target state, the first body 11 and the second body 12 may have a first state and a second state; the first state and the second state may both be states in which the first body 11 and the second body 12 are in the unfolded state, and the angle between the extension direction of the surface where the first body 11 is located and the extension direction of the surface where the second body 12 is located is in different target angle intervals, etc. In one example, the first state is that the angle between the extension direction of the surface where the first body 11 is located and the extension direction of the surface where the second body 12 is located is between 90 degrees and 170 degrees; the second state is that the angle between the extension direction of the surface where the first body 11 is located and the extension direction of the surface where the second body 12 is located is between 90 degrees and 170 degrees. The angle between the extension direction of the surface where the two bodies 12 are located is between 170 degrees and 180 degrees, etc.; the first state can be when the first body 11 and the second body 12 are in a folded state, and the second state can be when the first body 11 and the second body 12 are in an unfolded state, etc. In one example, the first state is that the angle between the extension direction of the surface where the first body 11 is located and the extension direction of the surface where the second body 12 is located is between 0 degrees and 10 degrees; the second state is that the angle between the extension direction of the surface where the first body 11 is located and the extension direction of the surface where the second body 12 is located is between 10 degrees and 180 degrees, etc.; in contrast, the embodiments of the present application are not limited. That is, those skilled in the art can determine the first state and the second state according to actual conditions, and the above situation is only an exemplary explanation of what the first state and the second state in the present application can be specifically, but it is not limited to the situation recorded in the above embodiment.

[0050] In some embodiments, when the electronic device 1 is in the target state, the first body 11 and the second body 12 may have a first state and a second state. In the first state, the third part may be larger than the fourth part, and in the second state, the fourth part may be larger than the third part. It can be seen that the first air outlet 1423 including the third part and / or the fourth part changes dynamically with the state and is not fixed.

[0051] The electronic device 1 provided in the embodiment of the present application has the first air outlet 1423 include a third part and / or a fourth part, so that the airflow blown out of the third part can flow through the interior of the first body 11 and / or the interior of the second body 12 through the first air inlet 121, and the airflow blown out of the fourth part flows through the surface of the first body 11 and / or the surface of the second body 12, and when the electronic device 1 is in a target state, the third part and / or the fourth part changes dynamically, so that the heat of the electronic device 1 can be better performed according to the change of the target state of the electronic device 1.

[0052] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 In an embodiment of the present application, an electronic device 1 is provided. In a second state, when the angle between the extension direction of the surface where the first body 11 is located and the extension direction of the surface where the second body 12 is located is within a target angle range, the airflow blown out from the first air outlet 1423 flows completely through the interior of the first body 11 and / or the interior of the second body 12 through the first air inlet 121.

[0053] In some embodiments, when the angle between the extension direction of the surface where the first body 11 is located and the extension direction of the surface where the second body 12 is located is within the target angle range, the airflow blown out by the first air outlet 1423 can flow through the first air inlet 121 and all of it through the first body 11 and / or the second body 12; the target angle range can be a range of 170 to 180 degrees; the target angle range can be a range of 175 to 180 degrees, etc.; this is not limited to the embodiments of the present application. That is, those skilled in the art can determine the target angle range according to actual conditions, and the above situation is only an exemplary description of what the target angle ranges in the present application can be, but is not limited to the situations recorded in the above embodiments.

[0054] The electronic device 1 provided in the embodiment of the present application, when the angle between the extension direction of the surface where the first body 11 is located and the extension direction of the surface where the second body 12 is located is within the target angle range, allows the airflow blown out from the first air outlet 1423 to flow through the first air inlet 121 and / or the interior of the first body 11 and / or the interior of the second body 12. In this way, the interior of the first body 11 and / or the interior of the second body 12 can be fully dissipated.

[0055] Reference Figure 8 and Fig. 9An embodiment of the present application provides an electronic device 1, which also includes a second heat dissipation component 15 and a heating module 16. The heating module 16 is arranged inside the first body 11 and / or the second body 12. The second heat dissipation component 15 is arranged inside the body corresponding to the heating module 16, and is used to dissipate heat from the heating module 16. The second heat dissipation component 15 includes an air suction channel. When the electronic device 1 is in the target state, the airflow blown out from the first air outlet 1423 at least partially flows into the air suction channel.

[0056] In some embodiments, the electronic device 1 may include a heating module 16, and the heating module 16 may be arranged inside the first body 11 and / or inside the second body 12; the heating module 16 may include a battery 171; the heating module 16 may include a temperature equalizing plate 174; the heating module 16 may include a central processing unit (CPU173); the heating module 16 may also include a printed circuit board (PCB172), etc., and this embodiment of the present application is not limited to this. That is, those skilled in the art can determine what the heating module 16 may include according to actual conditions, and the above situation is only an exemplary description of what types the heating module 16 in the present application may include, but is not limited to the situation recorded in the above embodiment.

[0057] In some embodiments, the electronic device 1 may further include a heating module 16, and the heating module 16 may be arranged inside the first body 11 and / or inside the second body 12; the heating module 16 may be arranged only inside the first body 11; the heating module 16 may be arranged only inside the second body 12; the heating module 16 may also include a plurality of heating elements, wherein a portion of the heating elements are arranged inside the first body 11, and a portion of the heating elements are arranged inside the second body 12, etc., and the embodiments of the present application are not limited to this. That is, those skilled in the art may determine the specific setting position of the heating module 16 according to actual conditions, and the above situation is only an exemplary explanation of where the heating module 16 in the present application can be set, but is not limited to the situation recorded in the above embodiment. In some embodiments, the heating module 16 includes a battery 171, a CPU 173, a PCB 172 and a temperature plate 174, the battery 171 is arranged inside the first body 11, and the CPU 173, the PCB 172 and the temperature plate 174 are arranged inside the second body 12.

[0058] In some embodiments, the second heat dissipation component 15 can be arranged inside the body corresponding to the heating module 16, for dissipating heat from the heating module 16; the heating module 16 can be arranged only inside the first body 11, and the second heat dissipation component 15 is also arranged inside the first body 11; the heating module 16 can be arranged only inside the second body 12, and the second heat dissipation component 15 is also arranged inside the second body 12; the heating module 16 can include a plurality of heating elements, wherein a part of the heating elements can be arranged inside the first body 11, and a part of the heating elements can be arranged inside the second body 12, and the second heat dissipation component 15 can be arranged inside the first body 11 and inside the second body 12 respectively, and the second heat dissipation component 15 can also be arranged inside the body corresponding to the heating element with the largest heat generation, etc.; in this regard, the embodiments of the present application are not limited. That is, those skilled in the art can determine the specific setting position of the second heat dissipation component 15 according to actual conditions, and the above situation is only an exemplary description of where the second heat dissipation component 15 in the present application can be arranged, but is not limited to the situation recorded in the above embodiment. In some embodiments, the heating module 16 includes a battery 171, a CPU 173, a PCB 172 and a temperature equalizing plate 174, the battery 171 is arranged inside the first body 11, the CPU 173, the PCB 172 and the temperature equalizing plate 174 are arranged inside the second body 12, and the second heat dissipation component 15 is arranged inside the second body 12.

[0059] In some embodiments, the second heat dissipation component 15 can be arranged inside the body corresponding to the heating module 16, for dissipating heat from the heating module 16, and the second heat dissipation component 15 can also include an air suction channel; the second heat dissipation component 15 can be a rotating fan; the second heat dissipation component 15 can be a vibrating fan, etc.; this is not limited in the embodiments of the present application. That is, those skilled in the art can determine the type of the second heat dissipation component 15 according to actual conditions, and the above situation is only an exemplary description of what types the second heat dissipation component 15 in the present application can be, but is not limited to the situation recorded in the above embodiment.

[0060] In some embodiments, the electronic device 1 may further include heat dissipation fins, which may be disposed inside the first body 11 and / or inside the second body 12 and located on the side of the heating module 16 close to the first air inlet 121. In this way, the heat dissipation fins may absorb the heat of the heating module 16 into themselves, and then the airflow flowing through the first air outlet 1423 dissipates the heat through the first air inlet 121, thereby accelerating the heat dissipation efficiency of the heating module 16.

[0061] The electronic device 1 provided in the embodiment of the present application is configured such that a second heat dissipation component 15 is disposed inside a main body corresponding to a heating module 16. When the air volume required by the second heat dissipation component 15 is constant, at least a portion of the airflow blown out from the first air outlet 1423 flows into the air suction channel, thereby reducing the air volume absorbed by the second heat dissipation component 15 from the outside, and correspondingly, the air suction impedance of the second heat dissipation component 15 is also reduced. When the air volume absorbed by the second heat dissipation component 15 from the outside remains unchanged, at least a portion of the airflow blown out from the first air outlet 1423 flows into the air suction channel, thereby increasing the air volume of the second heat dissipation component 15, thereby accelerating the heat dissipation efficiency of the heating module 16.

[0062] Reference Figure 5 , Figure 6 and Figure 7 An embodiment of the present application provides an electronic device 1, which further includes a sound module 17, and the sound module 17 is disposed in the second part.

[0063] In some embodiments, the electronic device 1 may further include a sound module 17; the sound module 17 may produce sound by vibration; the sound module 17 may produce sound by piezoelectric effect, etc.; this is not limited in the embodiments of the present application. That is, those skilled in the art may determine the sound module 17's sound mode according to actual conditions, and the above situation is only an exemplary description of the types of sound that the sound module 17 may produce in the present application, but is not limited to the situations described in the above embodiments.

[0064] In some embodiments, the sound module 17 can be set in the second part, and the sound module 17 can be detachably set in the second part, for example, by snap setting; for example, by thread setting, etc.; the sound module 17 can also be non-detachably set in the second part, for example, by welding setting; for example, by riveting setting, etc.; this is not limited by the embodiments of the present application. That is, those skilled in the art can determine the setting type of the sound module 17 set in the second part according to actual conditions. The above situation is only an exemplary explanation of the ways in which the sound module 17 in the present application can be set in the second part, but it is not limited to the situation recorded in the above embodiment.

[0065] In some embodiments, the first heat dissipation component 14 can be arranged in the second part, and the sound module 17 can also be arranged in the second part; the first heat dissipation component 14 can be provided with a connection structure with the sound module 17, and the first heat dissipation component 14 and the sound module 17 are fixed to the second part through the connection structure; the first heat dissipation component 14 can also be provided with a connection structure with the sound module 17 respectively, and the first heat dissipation component 14 and the sound module 17 are fixed to the second part through their own connection structures, etc.; in this regard, the embodiments of the present application are not limited. That is, those skilled in the art can determine whether the first heat dissipation component 14 and the sound module 17 share a connection structure according to actual conditions. The above situation is only an exemplary explanation of the ways in which the first heat dissipation module and the sound module 17 in the present application can share a connection structure, but it is not limited to the situation recorded in the above embodiment.

[0066] In the electronic device 1 provided in the embodiment of the present application, the first body 11 and the second body 12 both rotate relative to the second part. In other words, the second part and the first body 11 and the second body 12 are independent entities, and the second part does not rotate with the first body 11 and the second body 12. The sound module 17 is arranged in the second part. During the rotation of the first body 11 and the second body 12, only the force required by the first body 11 and the second body 12 needs to be applied, and there is no need to apply the force required by the sound module 17 in addition to the force required by the first body 11 and the second body 12. In this way, the force required to be applied for the rotation of the first body 11 and the second body 12 can be saved, thereby saving the time required for the first body 11 and the second body 12.

[0067] Reference Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The embodiment of the present application provides an electronic device 1, wherein a rotating mechanism 13 includes a first shell 132 and a rotating shaft 131, wherein the first shell 132 has a first accommodating cavity 1321, wherein the rotating shaft 131 is disposed in the first accommodating cavity 1321, wherein the rotating shaft 131 forms a first portion which is rotatably connected to a first body 11 and a second body 12, wherein the first shell 132 forms a second portion, wherein a first heat dissipation assembly 14 is disposed in the first accommodating cavity 1321, wherein a second air outlet 1322 is provided on the first shell 132, wherein the size of the second air outlet 1322 is smaller than the size of the first accommodating cavity 1321, and wherein the airflow blown out by the first air outlet 1423 flows out through the second air outlet 1322.

[0068] In some embodiments, a second air outlet 1322 may be opened on the first shell 132, and the first heat dissipation component 14 may include a first air outlet 1423, and the airflow blown by the first air outlet 1423 may flow out through the second air outlet 1322; the first air outlet 1423 may be opposite to the second air outlet 1322; the first air outlet 1423 may be offset from the second air outlet 1322, etc.; the first air outlet 1423 may be larger than the second air outlet 1322; the first air outlet 1423 may be smaller than the second air outlet 1322; the first air outlet 1423 may be equal to the second air outlet 1322, etc., and the embodiments of the present application are not limited to this. That is, those skilled in the art can confirm the positional relationship and size relationship between the first air outlet 1423 and the second air outlet 1322 according to actual conditions, and the above situation is only an illustrative description of the positional relationship and size relationship of the first air outlet 1423 and the second air outlet 1322 in the present application, but is not limited to the situations described in the above embodiments.

[0069] The electronic device 1 provided in the embodiment of the present application forms the second part through the first shell 132, and the first heat dissipation component 14 is arranged in the first accommodating cavity 1321. In this way, the first shell 132 can protect the first heat dissipation component 14, and a second air outlet 1322 is opened on the first shell 132. The size of the second air outlet 1322 is smaller than the size of the first accommodating cavity 1321. In this way, the possibility of insufficient strength of the first shell 132 due to the second air outlet 1322 opened on the first shell 132 being too large can be reduced.

[0070] Reference Figure 3 Figure 4 , Figure 5 , Figure 6 and Figure 7 An embodiment of the present application provides an electronic device 1, wherein a first heat dissipation component 14 includes a vibrator 141, and the vibrator 141 is disposed on a rotating mechanism 13. When the electronic device 1 is in a target state, the vibrator 141 vibrates on the rotating mechanism 13 to allow the first air outlet 1423 to blow out airflow.

[0071] In some embodiments, when the electronic device 1 is in the target state, the vibrator 141 can vibrate on the rotating mechanism 13 so that the first air outlet 1423 blows out airflow; the vibrator 141 can be a vibrating film, which vibrates on the rotating mechanism 13 so that the air on the rotating mechanism 13 is compressed, so that the first air outlet 1423 blows out airflow; the vibrator 141 can be a vibrating piezoelectric ceramic, which vibrates on the rotating mechanism 13 so that the air on the rotating mechanism 13 is compressed, so that the first air outlet 1423 blows out airflow, etc., and the embodiments of the present application are not limited to this. That is, those skilled in the art can determine the type of the vibrator 141 according to actual conditions, and the above situation is only an exemplary description of what types the vibrator 141 in the present application can be, but it is not limited to the situation recorded in the above embodiment.

[0072] In some embodiments, the rotating mechanism 13 may include a first shell 132 and a rotating shaft 131. The first shell 132 has a first accommodating cavity 1321. The rotating shaft 131 can be arranged in the first accommodating cavity 1321. The rotating shaft 131 forms a first part which can be rotatably connected to the first body 11 and the second body 12. The first shell 132 forms a second part. The vibrator 141 can be arranged in the first accommodating cavity 1321 to provide protection for the vibrator 141 and separate the first accommodating cavity 1321 into two first sub-accommodating cavities. When the electronic device 1 is in the target state, the vibrator 141 can vibrate in the first accommodating cavity 1321, so that the two first sub-accommodating cavities are converted between two states: one of the first sub-accommodating cavities increases in volume and the other of the first sub-accommodating cavities decreases in volume, thereby causing the first air outlet 1423 to blow out airflow.

[0073] The electronic device 1 provided in the embodiment of the present application, when the electronic device 1 is in the target state, the vibration member 141 vibrates on the rotating mechanism 13 to make the first air outlet 1423 blow out airflow. The vibration of the vibration member 141 can make the first air outlet 1423 blow out airflow, which has the advantages of compact structure and less space occupied by the rotating structure.

[0074] Reference Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 An embodiment of the present application provides an electronic device 1, wherein a first heat dissipation component 14 includes a second shell 142, the second shell 142 is disposed on a rotating mechanism 13, a first air outlet 1423 is provided on the second shell 142, a vibrating member 141 is fixed in the second accommodating cavity 1421, and when the electronic device 1 is in a target state, the vibrating member 141 vibrates in the second accommodating cavity 1421 to make the first air outlet 1423 blow out airflow.

[0075] In some embodiments, the second housing 142 may be provided with a first air outlet 1423; the size of the first air outlet 1423 may be larger than the second accommodating chamber 1421; the size of the second air outlet 1322 may be smaller than the second accommodating chamber 1421; the size of the second air outlet 1322 may be smaller than the second accommodating chamber 1421, etc., and the embodiments of the present application do not limit this. That is, those skilled in the art may confirm the size relationship between the size of the first air outlet 1423 and the second accommodating chamber 1421 according to actual conditions, and the above situation is only an exemplary description of the size relationship between the size of the first air outlet 1423 and the second accommodating chamber 1421 in the present application, but is not limited to the situation described in the above embodiment.

[0076] In some embodiments, the rotating mechanism 13 may include a first shell 132 and a rotating shaft 131, the first shell 132 has a first accommodating cavity 1321, the rotating shaft 131 can be arranged in the first accommodating cavity 1321, the rotating shaft 131 can form a first part that is rotatably connected to the first body 11 and the second body 12, the first shell 132 can form a second part, the second shell 142 can be arranged in the first accommodating cavity 1321, and when the electronic device 1 is in the target state, the vibrator 141 can vibrate in the second accommodating cavity 1421 to make the first air outlet 1423 blow out airflow.

[0077] The electronic device 1 provided in the embodiment of the present application has the first heat dissipation component 14 include a second shell 142, so that the second shell 142 is arranged on the rotating mechanism 13, and the vibration member 141 is fixed in the second accommodating cavity 1421. In this way, the possibility of the vibration member 141 being directly arranged on the rotating mechanism 13, causing the vibration member 141 to be damaged and unable to vibrate, can be reduced.

[0078] Reference Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 An embodiment of the present application provides an electronic device 1, in which a vibrator 141 is disposed in a second accommodating cavity 1421 to separate the second accommodating cavity 1421 into two second sub-accommodating cavities 14211. When the electronic device 1 is in a target state, the vibrator 141 can vibrate along the two second sub-accommodating cavities 14211 in an arrangement direction of the second accommodating cavity 1421.

[0079] In some embodiments, the vibrating member 141 may be disposed in the second accommodating chamber 1421 to separate the second accommodating chamber 1421 into two second sub-accommodating chambers 14211; one of the two second sub-accommodating chambers 14211 may be larger than the other second sub-accommodating chamber 14211; one of the two second sub-accommodating chambers 14211 may be equal to the other second sub-accommodating chamber 14211, etc., and the embodiments of the present application do not limit this. That is, those skilled in the art may determine the size relationship between the two second sub-accommodating chambers 14211 according to actual conditions, and the above situation is only an exemplary description of the size relationship between the two second sub-accommodating chambers 14211 in the present application, but is not limited to the situation described in the above embodiment.

[0080] The electronic device 1 provided in the embodiment of the present application, when the electronic device 1 is in the target state, the vibration member 141 can vibrate along the two second sub-accommodating chambers 14211 in the second accommodation chamber 1421 in the arrangement direction so that the first air outlet 1423 blows out airflow. The vibration of the vibration member 141 can make the first air outlet 1423 blow out airflow, and has the advantages of compact structure and less space occupied by the rotating structure.

[0081] Reference Figure 5 , Figure 6 and Figure 7 An embodiment of the present application provides an electronic device 1, which also includes a connecting structure, which is arranged on the cavity wall of the first accommodating cavity 1321 and at least one of the second shell 142, and the first heat dissipation component 14 is fixed in the first accommodating cavity 1321 through the connecting structure.

[0082] In some embodiments, the first heat dissipation component 14 can be fixed in the first accommodating cavity 1321 by a connection structure; the first heat dissipation component 14 can be fixed in the first accommodating cavity 1321 by a snap connection; the first heat dissipation component 14 can be fixed in the first accommodating cavity 1321 by a threaded connection; the first heat dissipation component 14 can also be fixed in the first accommodating cavity 1321 by bonding, etc., and the embodiments of the present application do not limit this. That is, those skilled in the art can determine the connection method of fixing the first heat dissipation component 14 in the first accommodating cavity 1321 according to actual conditions. The above situation is only an exemplary description of what kind of connection method the first heat dissipation component 14 can be fixed in the first accommodating cavity 1321 in this application, but is not limited to the situation recorded in the above embodiment.

[0083] The electronic device 1 provided in the embodiment of the present application is provided with a connection structure on at least one of the cavity wall of the first accommodating cavity 1321 and the second shell 142, and the first heat dissipation component 14 is fixed in the first accommodating cavity 1321 through the connection structure. In this way, the shaking amplitude of the first heat dissipation component 14 in the first accommodating cavity 1321 can be reduced.

[0084] Reference Figure 5 , Figure 6 and Figure 7 An embodiment of the present application provides an electronic device 1, wherein the connection structure includes a snap-fit ​​protrusion 13211 provided on the cavity wall of the first accommodating cavity 1321 and a snap-fit ​​groove 1422 provided on the second shell 142, and the snap-fit ​​protrusion 13211 extends into the snap-fit ​​groove 1422.

[0085] In some embodiments, the connection structure may include a snap-fit ​​protrusion 13211 provided on the cavity wall of the first accommodating cavity 1321 and a snap-fit ​​groove 1422 provided on the second shell 142; the outer contour of the snap-fit ​​protrusion 13211 and the inner contour of the snap-fit ​​groove 1422 may both be regular shapes; the outer contour of the snap-fit ​​protrusion 13211 and the inner contour of the snap-fit ​​groove 1422 may both be irregular shapes, etc., and the embodiments of the present application do not limit this. That is, those skilled in the art may determine the shapes of the outer contour of the snap-fit ​​protrusion 13211 and the inner contour of the snap-fit ​​groove 1422 according to actual conditions, and the above situation is only an exemplary description of what shapes the outer contour of the snap-fit ​​protrusion 13211 and the inner contour of the snap-fit ​​groove 1422 may be in the present application, but is not limited to the situations described in the above embodiments.

[0086] The electronic device 1 provided in the embodiment of the present application has a connection structure including a snap-fitting protrusion 13211 arranged on the cavity wall of the first accommodating cavity 1321 and a snap-fitting groove 1422 arranged on the second shell 142. The snap-fitting protrusion 13211 extends into the snap-fitting groove 1422, so that the second shell 142 can be fixed inside the first accommodating cavity 1321, and has technical effects such as simple operation and easy implementation.

[0087] Reference Figure 7 An embodiment of the present application provides an electronic device 1, which further includes a guide structure, which is arranged between the first air outlet 1423 and the second air outlet 1322, and is used to guide the airflow blown out of the first air outlet 1423 to the second air outlet 1322.

[0088] In some embodiments, the electronic device 1 may further include a guide structure, which may be disposed between the first air outlet 1423 and the second air outlet 1322, and is used to guide the airflow blown out of the first air outlet 1423 to the second air outlet 1322; the guide structure may include a guide tube 18, and the guide tube 18 has a guide pipe; the guide structure may be a plurality of guide plates, and the plurality of guide plates are arranged to form a guide pipe, etc., and the embodiments of the present application are not limited to this. That is, those skilled in the art may determine the type of the guide structure according to actual conditions, and the above situation is only an exemplary description of what types of guide structures may be in the present application, but is not limited to the situations described in the above embodiments.

[0089] The electronic device 1 provided in the embodiment of the present application is configured with a guide structure between the first air outlet 1423 and the second air outlet 1322 to guide the airflow blown out of the first air outlet 1423 to the second air outlet 1322. In this way, the speed at which the airflow blown out of the first air outlet 1423 flows to the second air outlet 1322 can be increased, thereby improving the heat dissipation efficiency of the electronic device 1.

[0090] Reference Figure 7 The embodiment of the present application provides an electronic device 1, wherein the air guide structure includes an air guide tube 18, wherein the air guide tube 18 has an air guide pipe, and the first air outlet 1423 and the second air outlet 1322 are both connected to the air guide pipe.

[0091] The electronic device 1 provided in the embodiment of the present application has the technical effects of simple structure and easy implementation by setting the guide structure as a guide tube 18, wherein the guide tube 18 has a guide pipe, and the first air outlet 1423 and the second air outlet 1322 are both connected to the guide tube 18.

[0092] The above are only preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An electronic device, comprising: first ontology; Second entity; A rotating mechanism, through which the first body and the second body are rotatably connected; A first heat dissipation component is arranged on the rotating mechanism. The first heat dissipation component is provided with a first air outlet. When the electronic device is in the target state, the airflow blown out of the first air outlet at least partially flows through the first body and / or the second body to dissipate heat for the electronic device.

2. The electronic device according to claim 1, wherein the rotating mechanism comprises a first part and a second part, the first part is rotatably connected to the second part, the first body and the second body are both rotatably connected to the first part, the first body and the second body are both rotated relative to the second part to switch the electronic device between different states, the relative positions of the first body and the second body in different states of the electronic device are different, and the first heat dissipation component is arranged in the second part.

3. The electronic device according to claim 1, a first air inlet is provided on the first body and / or the second body, the first air outlet includes a third part and / or a fourth part, the airflow blown out by the third part flows through the interior of the first body and / or the interior of the second body through the first air inlet, and the airflow blown out by the fourth part flows through the surface of the first body and / or the surface of the second body, and when the electronic device is in the target state, the first body and the second body have a first state and a second state, and in the first state, the third part is larger than the fourth part, and in the second state, the fourth part is larger than the third part.

4. The electronic device according to claim 3, in the target state, when the angle between the extension direction of the surface where the first body is located and the extension direction of the surface where the second body is located is within the target angle range, the airflow blown out from the first air outlet flows completely through the interior of the first body and / or the interior of the second body through the first air inlet.

5. The electronic device according to claim 4, further comprising a second heat dissipation component and a heating module, the heating module being arranged inside the first body and / or inside the second body, the second heat dissipation component being arranged inside the body corresponding to the heating module, for dissipating the heat of the heating module, the second heat dissipation component comprising an air suction channel, and when the electronic device is in the target state, the airflow blown out of the first air outlet at least partially flows into the air suction channel.

6. The electronic device according to claim 2, wherein the rotating mechanism comprises a first shell and a rotating shaft, the first shell having a first accommodating cavity, the rotating shaft being arranged in the first accommodating cavity, the rotating shaft forming the first part being rotatably connected with the first body and the second body, the first shell forming the second part, the first heat dissipation assembly being arranged in the first accommodating cavity, the first shell being provided with the second air outlet, the size of the second air outlet being smaller than the size of the first accommodating cavity, and the airflow blown out of the first air outlet flows out through the second air outlet.

7. The electronic device according to claim 1, wherein the first heat dissipation component comprises a vibrator, and the vibrator is disposed on the rotating mechanism, and when the electronic device is in the target state, the vibrator vibrates on the rotating mechanism to make the first air outlet blow out airflow.

8. The electronic device according to claim 7, the first heat dissipation assembly includes a second shell, the second shell is arranged on the rotating mechanism, the first air outlet is opened on the second shell, the vibrator is fixed in the second accommodating cavity, and when the electronic device is in the target state, the vibrator vibrates in the second accommodating cavity to make the first air outlet blow out airflow.

9. The electronic device according to claim 8, wherein the vibrator is arranged in the second accommodating cavity to separate the second accommodating cavity into two second sub-accommodating cavities, and when the electronic device is in the target state, the vibrator can vibrate along the two second sub-accommodating cavities in the arrangement direction of the second accommodating cavity.

10. The electronic device according to claim 8, further comprising a connection structure, wherein the connection structure is arranged on at least one of a cavity wall of the first accommodating cavity and the second shell, and the first heat dissipation assembly is fixed in the first accommodating cavity through the connection structure.

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