High-precision microcirculation sensor chip based on variable frequency temperature and monitoring value

Abstract

The invention belongs to the technical field of sensor chips, and discloses a high-precision microcirculation sensor chip based on variable frequency temperature and monitoring numerical values, which comprises a circuit board, a chip and a bottom plate, a chip groove is formed in the circuit board, the shape of an inner cavity of the chip groove is matched with that of the chip, and the bottom plate is mounted at the top end of the circuit board. The chip is arranged in the chip groove and is clamped between the circuit board and the bottom plate, when the chip works each time, heat emitted by the chip can promote the memory alloy to expand, and then the memory alloy pushes the multiple scrapers to clean dust on the surfaces and gaps of the fins, so that the chip cleaning efficiency is improved, and the chip cleaning efficiency is improved. The device is simple in structure, the dust removal process does not need to be driven by external electric power, the occupied space is effectively saved, it is guaranteed that the whole device is small and exquisite, dust removal can be automatically carried out after the chip is started every time, manual operation of a user is not needed, it is effectively guaranteed that dust cannot be hidden in fins for a long time, and the dust removal efficiency is improved. And the heat dissipation effect of the chip is stably maintained.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor chips, and in particular to a high-precision microcirculation sensor chip based on variable frequency temperature and monitoring values. Background Art

[0002] The high-precision microcirculation sensor chip based on variable frequency temperature and monitoring values ​​is a sensor chip that can achieve high-precision microcirculation monitoring through variable frequency temperature and monitoring values. This sensor has functions such as variable frequency temperature monitoring, high-precision monitoring values, and microcirculation monitoring. The application areas of this sensor chip may cover medical health, biomedicine, environmental monitoring and other fields, and can provide high-precision and real-time monitoring data for research and applications in related fields.

[0003] The ability to adjust the operating frequency according to temperature changes to ensure the accuracy and stability of the sensor under different temperature conditions is a specific manifestation of the chip's variable frequency temperature characteristics. For chip designs that need to adjust the operating frequency according to temperature changes, heat dissipation is an important consideration. Effective heat dissipation can help maintain the chip within a suitable temperature range, thereby reducing the impact of temperature on chip performance and improving system stability and reliability. Some existing chip heat dissipation methods, in consideration of space saving, mostly use heat dissipation fins to expand the heat dissipation area. The fins are closely arranged. During long-term use, dust hides between the fins. The accumulation of dust will reduce the heat dissipation efficiency of the fin surface, hinder the conduction and dissipation of heat, and lead to a decrease in the heat dissipation effect. This may cause the chip to overheat, reduce performance and shorten its life. However, most chips and fins are installed inside the device, which is inconvenient to clean. In addition, due to space considerations, it is not convenient to install a special cleaning mechanism. Summary of the invention

[0004] The present invention is intended to provide a high-precision microcirculation sensor chip based on variable frequency temperature and monitoring values ​​to solve the problems raised in the above-mentioned background technology. In this solution, each time the chip works, the heat it dissipates can cause the memory alloy to expand, and then the memory alloy pushes multiple scrapers to clean the surface and gap of the fins. After the chip stops working, the multiple scrapers will automatically reset. The device has a simple structure, and the cleaning process does not require external power drive, which effectively saves space and ensures the overall compactness of the device. It can be automatically performed after each chip is started, without the need for manual operation by the user, and effectively ensures that dust will not be hidden inside the fins for a long time, and stably maintains the heat dissipation effect of the chip.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value, comprising a circuit board, a chip and a bottom plate, wherein the circuit board is provided with a chip slot, the inner cavity shape of the chip slot matches the chip, the bottom plate is mounted on the top of the circuit board, the chip is arranged inside the chip slot and clamped between the circuit board and the bottom plate, a plurality of fins are integrally formed on the top of the bottom plate, the plurality of fins are arranged equidistantly, a pair of limit blocks are mounted on the top of the bottom plate, the pair of limit blocks are respectively arranged on both sides of the plurality of fins, a bracket is arranged on the upper side of the bottom plate, and a limit block is provided with a bracket that matches the bracket The bracket is provided with a pair of strip holes, and the two ends of the bracket respectively pass through a pair of strip holes and extend to the interior of the limit block, and one end of the bracket extending to the interior of the limit block is integrally formed with a movable block matching the shape of the inner cavity of the limit block, and the movable block is slidably connected to the inner wall of the limit block. The bracket is arranged on the upper side of a plurality of fins, and a plurality of scrapers are installed at the bottom end of the bracket, and the scrapers are arranged between two adjacent fins, and the shape of the scrapers matches the gap between two adjacent fins. A memory alloy is arranged inside the limit block, and the two ends of the memory alloy are respectively connected to the inner wall of the limit block and the movable block.

[0007] Preferably, a pair of heat-conducting pipes are installed on the bottom plate, and the top ends of the pair of heat-conducting pipes extend to the inner cavities of a pair of limiting blocks respectively and abut against a pair of memory alloys respectively.

[0008] Preferably, the scraper plate is provided with a plurality of through holes, and the plurality of through holes are arranged at equal intervals.

[0009] Preferably, a flexible pad is installed around the outer end of the scraper, and the flexible pad abuts against the surface of the fin.

[0010] Preferably, the material of the flexible pad is set to polyethylene.

[0011] Preferably, a placement groove is opened on the upper part of the inner wall of the chip groove, the placement groove is arranged around the chip groove, and a thermal pad matching the shape of the inner cavity of the placement groove is arranged inside the placement groove, and two surfaces of the thermal pad are respectively in contact with the chip and the bottom plate.

[0012] Preferably, a plurality of equally spaced through holes are provided at the bottom of the inner wall of the chip slot, both ends of the through holes penetrate the circuit board and extend to the top of the circuit board, and a heat conductive sheet matching the shape of the inner cavity is provided inside the through holes.

[0013] Compared with the prior art, this technical solution produces the following beneficial effects:

[0014] In this solution, each time the chip works, the heat it emits can cause the memory alloy to expand, and then the memory alloy pushes multiple scrapers to clean the surface and gap of the fins. After the chip stops working, the multiple scrapers will automatically reset. The device has a simple structure and the cleaning process does not require external power drive, which effectively saves space and ensures the overall compactness of the device. It can be automatically performed after each chip is started without manual operation by the user, which effectively ensures that dust will not be hidden inside the fins for a long time and stably maintains the heat dissipation effect of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the explosion structure provided by the present invention;

[0016] Figure 2 A schematic diagram of the overall structure provided by the present invention;

[0017] Figure 3 A schematic diagram of the internal structure of the limit block provided by the present invention;

[0018] Figure 4 A schematic diagram of a local structure provided by the present invention;

[0019] Figure 5 This is a schematic diagram of the structure of the heat conducting sheet provided by the present invention.

[0020] Figure numerals: 1. circuit board; 2. chip slot; 3. chip; 4. placement slot; 5. thermal pad; 6. bottom plate; 7. fin; 8. limit block; 9. scraper; 10. bracket; 11. movable block; 12. memory alloy; 13. heat pipe; 14. heat conductive sheet; 15. through hole; 16. flexible pad; 17. through hole. DETAILED DESCRIPTION

[0021] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments:

[0022] like Figure 1-3The high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value shown in the figure includes a circuit board 1, a chip 3 and a base plate 6. The circuit board 1 is provided with a chip slot 2, and the inner cavity shape of the chip slot 2 matches the chip 3. The base plate 6 is installed on the top of the circuit board 1, and the base plate 6 and the circuit board 1 can be fixed by bolts. The chip 3 is arranged inside the chip slot 2 and clamped between the circuit board 1 and the base plate 6. A plurality of fins 7 are integrally formed at the top of the base plate 6, and the plurality of fins 7 are arranged equidistantly. A pair of limit blocks 8 are installed at the top of the base plate 6. The limit blocks 8 can be fixed on the base plate 6 by welding. The pair of limit blocks 8 are respectively arranged on both sides of the plurality of fins 7. A bracket 10 is provided on the upper side of the base plate 6, and a strip hole matching the bracket 10 is provided on the limit block 8. The support The two ends of the bracket 10 respectively pass through a pair of strip holes and extend to the interior of the limit block 8, and one end of the bracket 10 extending to the interior of the limit block 8 is integrally formed with a movable block 11 matching the shape of the inner cavity of the limit block 8, and the movable block 11 is slidably connected to the inner wall of the limit block 8. The bracket 10 is arranged on the upper side of a plurality of fins 7, and a plurality of scrapers 9 are installed at the bottom end of the bracket 10. The scrapers 9 can be fixed to the bracket 10 by welding. The scrapers 9 are arranged between two adjacent fins 7, and the shape of the scrapers 9 matches the gap between two adjacent fins 7. A memory alloy 12 is arranged inside the limit block 8, and the two ends of the memory alloy 12 are respectively connected to the inner wall of the limit block 8 and the movable block 11, and the memory alloy 12 can be fixed to the inner wall of the limit block 8 and the movable block 11 by welding.

[0023] A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring values ​​is a sensor chip that can achieve high-precision microcirculation monitoring through variable frequency temperature and monitoring values. For chip designs that need to adjust the operating frequency according to temperature changes, heat dissipation is an important consideration. Some existing chip heat dissipation methods, in consideration of saving space, mostly use heat dissipation fins to expand the heat dissipation area. The fins are closely arranged. During long-term use, dust is hidden between the fins. The accumulation of dust will reduce the heat dissipation efficiency of the fin surface. However, most chips and fins are installed inside the equipment, which is inconvenient to clean. In addition, due to space considerations, it is not convenient to install a special cleaning mechanism.

[0024] In this solution, the chip 3 is sandwiched between the circuit board 1 and the base plate 6. The chip 3 is electrically connected to the sensor through the circuit board 1. The heat dissipated by the chip 3 can be conducted to the multiple fins 7 through the base plate 6 to expand the heat dissipation area, thereby promoting the heat dissipation. The memory alloy 12 is a material that can expand when heated and can return to its original shape after returning to normal temperature. The most famous one is the Nitinol alloy. The memory alloy 12 has a bidirectional shape memory effect, which allows the memory alloy 12 to switch between two different shapes. In this solution, when the chip 3 heats up, the heat will be conducted to the memory alloy 12, causing the memory alloy 12 to expand in the limit block 8, and then through the expansion of the memory alloy 12 The movable block 11 is pushed to move, and the bracket 10 is driven to move through a pair of movable blocks 11, thereby prompting multiple scrapers 9 to slide between multiple pairs of adjacent fins 7. Through the movement of the scrapers 9, the dust hidden between the adjacent fins 7 can be pushed to one side to achieve a cleaning effect. Thereafter, the memory alloy 12 will remain in an expanded state. When the chip 3 stops working for a period of time, the heat of the chip 3 will dissipate, and then the memory alloy 12 will cool down and return to its original state, driving a pair of movable blocks 11 to reset, thereby prompting multiple scrapers 9 to reset. With this arrangement, each time the chip 3 works, multiple scrapers 9 can automatically clean the fins 7 once without the need for external power drive, thereby effectively ensuring that dust will not be hidden inside the fins 7 for a long time.

[0025] A pair of heat conducting pipes 13 are installed on the bottom plate 6 , and the heat conducting pipes 13 can be fixed on the bottom plate 6 by welding. The top ends of the pair of heat conducting pipes 13 extend to the inner cavities of the pair of limit blocks 8 and abut against the pair of memory alloys 12 .

[0026] In this solution, the material of the heat pipe 13 can be set to copper. Copper has effective heat conductivity. Through the setting of the heat pipe 13, the heat of the bottom plate 6 can be conducted to the memory alloy 12 more quickly, thereby causing the memory alloy 12 to deform.

[0027] like Figure 4 As shown, the scraper 9 is provided with a plurality of through holes 15 which are arranged equidistantly. A flexible pad 16 is installed around the outer end of the scraper 9. The flexible pad 16 abuts against the surface of the fin 7. The material of the flexible pad 16 is set to polyethylene.

[0028] In this solution, the multiple through holes 15 opened on the scraper 9 can improve the ventilation of the scraper 9 and prevent the scraper 9 from blocking the air circulation between the fins 7 when standing on one side of the multiple fins 7. The multiple through holes 15 have a small aperture and will not affect the pushing effect of the scraper 9 on the dust. The flexible pad 16 set to polyethylene is a soft plastic material. The surface of polyethylene is relatively smooth, which can reduce the friction between the scraper 9 and the fin 7, prevent the surface of the fin 7 from being worn, and help the scraper 9 to move smoothly. The polyethylene material is easy to clean and can effectively clean the dust and debris on the surface of the fin 7.

[0029] A placement groove 4 is provided at the upper part of the inner wall of the chip groove 2. The placement groove 4 is arranged around the chip groove 2, and a thermal pad 5 matching the inner shape of the placement groove 4 is arranged inside the placement groove 4. The two surfaces of the thermal pad 5 are respectively in contact with the chip 3 and the bottom plate 6.

[0030] In this solution, the thermal pad 5 is a soft material that can fill the microscopic gap between the chip 3 and the base plate 6 to improve the heat conduction efficiency. It is usually made of silica gel, silicone rubber or other materials with good thermal conductivity.

[0031] The bottom of the inner wall of the chip slot 2 is provided with a plurality of equally spaced through holes 17 , both ends of which penetrate the circuit board 1 and extend to the top of the circuit board 1 , and a heat conducting sheet 14 matching the shape of the inner cavity is arranged inside the through hole 17 .

[0032] In this solution, the upper surface of the portion of the heat conductive sheet 14 located in the inner cavity of the chip slot 2 is flush with the bottom end of the inner wall of the chip slot 2, and the portion of the heat conductive sheet 14 located at the top end of the circuit board 1 is flush with the upper surface of the circuit board 1. When the chip 3 is placed in the chip slot 2, the bottom end of the chip 3 abuts against the heat conductive sheet 14. The heat conductive sheet 14 is set to a heat conductive material. The heat at the bottom end of the chip 3 can be conducted to the upper side of the circuit board 1 through the heat conductive sheet 14, and then conducted to the bottom plate 6, thereby improving the uniformity of the heat dissipation of the chip 3 and improving the heat dissipation effect. The position of the heat conductive sheet 14 should be arranged away from the contacts at the bottom end of the chip 3 to avoid affecting the connection between the chip 3 and the circuit board 1.

[0033] The specific implementation process is as follows:

[0034] When in use, the chip 3 is installed between the inside of the chip slot 2, the chip 3 is electrically connected to the sensor through the circuit board 1, the bottom plate 6 is installed on the top of the circuit board 1 by bolts, and a thermal pad 5 is installed inside the placement slot 4. The heat emitted by the chip 3 is conducted to the bottom plate 6 through the thermal pad 5, and then conducted to multiple fins 7, so as to expand the heat dissipation area and promote heat dissipation. The heat absorbed by the bottom plate 6 will be conducted to the memory alloy 12 through the heat pipe 13, so that the memory alloy 12 will expand in the limit block 8, and the movable block 11 will be pushed to move by the expansion of the memory alloy 12. A pair of movable blocks 11 drives the bracket 10 to move, thereby prompting multiple scrapers 9 to slide between multiple pairs of adjacent fins 7. Through the movement of the scraper 9, the flexible pad 16 at the outer end of the scraper 9 can scrape the dust on the surface of the fin 7, and the scraper 9 can push the dust on the inside of the fin 7, and then push the dust hidden between the adjacent fins 7 to one side, so as to achieve the dust cleaning effect. After that, the memory alloy 12 will remain in an expanded state. When the chip 3 stops working for a period of time, the heat of the chip 3 will dissipate, and then the memory alloy 12 will cool down and return to its original state, driving a pair of movable blocks 11 to reset, thereby prompting multiple scrapers 9 to reset.

[0035] The above is only an embodiment of the present invention, and the common knowledge such as the known specific technical solutions and / or characteristics in the solution is not described in detail here. It should be pointed out that for those skilled in the art, without departing from the technical solution of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value, characterized in that: The invention comprises a circuit board (1), a chip (3) and a bottom plate (6), wherein the circuit board (1) is provided with a chip slot (2), the inner cavity shape of the chip slot (2) matches that of the chip (3), the bottom plate (6) is mounted on the top of the circuit board (1), the chip (3) is arranged inside the chip slot (2) and clamped between the circuit board (1) and the bottom plate (6), the top of the bottom plate (6) is integrally formed with a plurality of fins (7), the plurality of fins (7) are arranged at equal distances, a pair of limit blocks (8) are mounted on the top of the bottom plate (6), the pair of limit blocks (8) are respectively arranged on both sides of the plurality of fins (7), a bracket (10) is arranged on the upper side of the bottom plate (6), the limit block (8) is provided with a strip hole matching the bracket (10), the bracket The two ends of the bracket (10) respectively penetrate a pair of strip holes and extend to the interior of the limit block (8), and one end of the bracket (10) extending to the interior of the limit block (8) is integrally formed with a movable block (11) matching the shape of the inner cavity of the limit block (8), and the movable block (11) is slidably connected to the inner wall of the limit block (8). The bracket (10) is arranged on the upper side of a plurality of fins (7), and a plurality of scrapers (9) are installed at the bottom end of the bracket (10), and the scrapers (9) are arranged between two adjacent fins (7), and the shape of the scrapers (9) matches the gap between two adjacent fins (7). A memory alloy (12) is arranged inside the limit block (8), and the two ends of the memory alloy (12) are respectively connected to the inner wall of the limit block (8) and the movable block (11).

2. A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value as claimed in claim 1, characterized in that: A pair of heat-conducting pipes (13) are installed on the bottom plate (6), and the top ends of the pair of heat-conducting pipes (13) respectively extend to the inner cavities of a pair of limiting blocks (8) and respectively abut against a pair of memory alloys (12).

3. A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value as claimed in claim 1, characterized in that: The scraper (9) is provided with a plurality of through holes (15), and the plurality of through holes (15) are arranged at equal intervals.

4. A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value as claimed in claim 1, characterized in that: A flexible pad (16) is installed around the outer end of the scraper (9), and the flexible pad (16) is in contact with the surface of the fin (7).

5. A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value as claimed in claim 4, characterized in that: The material of the flexible pad (16) is set to be polyethylene.

6. A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value as claimed in claim 1, characterized in that: A placement groove (4) is provided at the upper part of the inner wall of the chip groove (2), the placement groove (4) is arranged around the chip groove (2), and a thermal conductive pad (5) matching the shape of the inner cavity of the placement groove (4) is arranged inside the placement groove (4), and two surfaces of the thermal conductive pad (5) are respectively in contact with the chip (3) and the bottom plate (6).

7. A high-precision microcirculation sensor chip based on variable frequency temperature and monitoring value as claimed in claim 1, characterized in that: The bottom end of the inner wall of the chip slot (2) is provided with a plurality of equally spaced through holes (17), both ends of the through holes (17) penetrate the circuit board (1) and extend to the top of the circuit board (1), and a heat conducting sheet (14) matching the shape of the inner cavity is provided inside the through holes (17).

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