A semiconductor package cooling device

Abstract

The present invention discloses a semiconductor packaging cooling device, belonging to the technical field of semiconductor devices, including a protective mounting substrate. A first detachable cooling mechanism for cooling the power semiconductor device is arranged on the upper surface of the protective mounting substrate. A second detachable cooling mechanism for cooling the first detachable cooling mechanism is arranged below the protective mounting substrate. One end of the protective mounting substrate away from the first detachable cooling mechanism is provided with a detachable liquid storage tank for cooling the second detachable cooling mechanism. The top of the detachable liquid storage tank is provided with a plurality of adjustable feeding hoses. Through the mutual cooperation of multiple structures, the power semiconductor device is cooled in all directions, so that the cooling effect of the cooling device on the power semiconductor device is better, and the power semiconductor device is prevented from being damaged due to excessive temperature.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor devices, and particularly relates to a semiconductor package cooling device. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, a diode is a device made of a semiconductor. A corresponding cooling device is used when a semiconductor package module is in use;

[0003] Traditional cooling devices include structures such as a heat conduction plate, a bottom case, a substrate, a heat conduction part, a diversion plate, a shunt plate, and a power semiconductor device. The advantage of this cooling device is that it can cool multiple power semiconductor devices through the use of a heat conduction plate;

[0004] However, the traditional cooling device can only simply cool the bottom of the power semiconductor device, resulting in a poor cooling effect of the cooling device on the power semiconductor device, making it easy for the power semiconductor device to be damaged due to excessive temperature, and there is an urgent need for improvement. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor package cooling device to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A semiconductor package cooling device includes a protective mounting substrate. A first detachable cooling mechanism for cooling the power semiconductor device is arranged on the upper surface of the protective mounting substrate. A second detachable cooling mechanism for cooling the first detachable cooling mechanism is arranged below the protective mounting substrate. One end of the protective mounting substrate away from the first detachable cooling mechanism is provided with a detachable liquid storage tank for cooling the second detachable cooling mechanism. The top of the detachable liquid storage tank is provided with a plurality of adjustable feeding hoses. The bottom of the side of the detachable liquid storage tank is provided with a plurality of adjustable material pumps. The output ends of the adjustable material pumps are provided with a plurality of first adjustable feeding hoses for feeding the second detachable cooling mechanism.

[0007] As a further solution of the present invention: the first detachable cooling mechanism includes a first liquid storage and temperature-adjusting metal box, and several liquid storage and temperature-adjusting metal tubes are arranged on the top of the first liquid storage and temperature-adjusting metal box. The liquid storage and temperature-adjusting metal tubes penetrate through the top wall of the first liquid storage and temperature-adjusting metal box. The first liquid storage and temperature-adjusting metal box is fixedly connected to the liquid storage and temperature-adjusting metal tubes. The inside of the first liquid storage and temperature-adjusting metal box is filled with temperature-adjusting cooling liquid. A metal lifting substrate for supporting and cooling the power semiconductor device is arranged inside the liquid storage and temperature-adjusting metal tube, and the metal lifting substrate is fixedly connected to the liquid storage and temperature-adjusting metal tube.

[0008] As a further solution of the present invention: a second liquid storage and temperature-adjusting metal box is arranged above the first liquid storage and temperature-adjusting metal box. Several third liquid storage and temperature-adjusting metal boxes for cooperating with the liquid storage and temperature-adjusting metal tubes to limit, fix and cool the power semiconductor device are arranged on one side of the second liquid storage and temperature-adjusting metal box facing the first liquid storage and temperature-adjusting metal box. The third liquid storage and temperature-adjusting metal box is slidably connected to the liquid storage and temperature-adjusting metal tube, and the third liquid storage and temperature-adjusting metal box penetrates through the side wall of the second liquid storage and temperature-adjusting metal box.

[0009] As a further solution of the present invention: several first hollow infusion connecting tubes are arranged at both ends of the first liquid storage and temperature-adjusting metal box. Several second hollow infusion connecting tubes for cooperating with the first hollow infusion connecting tubes to fix the second liquid storage and temperature-adjusting metal box and for conveying the temperature-adjusting cooling liquid are arranged at both ends of the second liquid storage and temperature-adjusting metal box. The second hollow infusion connecting tube is hermetically and slidably connected to the first hollow infusion connecting tube.

[0010] As a further solution of the present invention: several limit fastening screws for fixing the second hollow infusion connecting tube are threadedly connected to the top of the first hollow infusion connecting tube. An elastic insulating and heat-conducting sheet for insulating, heat-conducting and buffering is arranged on one side of the second liquid storage and temperature-adjusting metal box facing the first liquid storage and temperature-adjusting metal box. The elastic insulating and heat-conducting sheet is arranged at one end of the third liquid storage and temperature-adjusting metal box away from the second liquid storage and temperature-adjusting metal box, and the elastic insulating and heat-conducting sheet is fixedly connected to the third liquid storage and temperature-adjusting metal box.

[0011] As a further solution of the present invention: the second detachable cooling mechanism includes a fourth liquid storage and temperature-adjusting metal box. Several second adjustable feeding hoses communicating with the first hollow infusion connecting tube for conveying the temperature-adjusting cooling liquid are arranged at both ends of the fourth liquid storage and temperature-adjusting metal box. A hollow temperature-reducing metal tube for cooling the temperature-adjusting cooling liquid is arranged inside the fourth liquid storage and temperature-adjusting metal box. The hollow temperature-reducing metal tube penetrates through the fourth liquid storage and temperature-adjusting metal box, and the hollow temperature-reducing metal tube is fixedly connected to the fourth liquid storage and temperature-adjusting metal box.

[0012] As a further solution of the present invention: A number of hollow infusion dispersion tubes communicating with the first adjustable feeding hose are arranged at both ends of the hollow cooling metal tube. The hollow infusion dispersion tubes are fixedly connected to the hollow cooling metal tube. A number of detachable atomizing nozzles are arranged at intervals on the hollow infusion dispersion tubes. A number of limiting metal guide plates for guiding the temperature-adjusting cooling liquid are arranged on the hollow cooling metal tube.

[0013] As a further solution of the present invention: A number of adjustable cooling members for cooperating with the fourth liquid storage and temperature-adjusting metal box to cool the temperature-adjusting cooling liquid are arranged below the hollow cooling metal tube. The number of adjustable cooling members are arranged at intervals at both ends of the lower surface of the fourth liquid storage and temperature-adjusting metal box. The fourth liquid storage and temperature-adjusting metal box is fixedly connected to the adjustable cooling members.

[0014] As a further solution of the present invention: A number of limiting heat dissipation grooves for heat dissipation and storage are arranged at intervals at the bottom of the hollow cooling metal tube. The limiting metal guide plates are fixedly connected to the hollow cooling metal tube.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: The structure of the present invention is simple and easy to use. During use, through the mutual cooperation of multiple structures, the power semiconductor device is cooled in all directions, so that the cooling effect of the cooling device on the power semiconductor device is better, avoiding damage to the power semiconductor device due to overheating. Secondly, through the mutual cooperation of multiple structures, the temperature-adjusting cooling liquid is cooled by air cooling, water cooling, evaporation cooling and refrigeration cooling. Through the mutual cooperation of the four cooling and temperature-reducing methods, the rapid and sufficient cooling of the temperature-adjusting cooling liquid is realized, so that the temperature-adjusting cooling liquid can be maintained in a highly efficient cooling state for a long time, improving the cooling effect of the cooling device. Description of the Drawings

[0016] Figure 1 It is a structural schematic diagram of a semiconductor packaging cooling device;

[0017] Figure 2 It is a structural schematic diagram of the first detachable cooling mechanism in a semiconductor packaging cooling device;

[0018] Figure 3 It is a structural schematic diagram of the second liquid storage and temperature-adjusting metal box in a semiconductor packaging cooling device;

[0019] Figure 4 It is a structural schematic diagram of the second detachable cooling mechanism in a semiconductor packaging cooling device;

[0020] Figure 5 It is a structural sectional view of the fourth liquid storage and temperature-adjusting metal box in a semiconductor packaging cooling device;

[0021] In the figure: 1 - protective mounting substrate, 2 - first detachable cooling mechanism, 3 - detachable liquid storage tank, 4 - adjustable feeding hose, 5 - adjustable material pump, 6 - first adjustable feeding hose, 7 - second detachable cooling mechanism, 20 - first liquid storage temperature regulating metal box, 21 - liquid storage temperature regulating metal pipe, 22 - second liquid storage temperature regulating metal box, 23 - first hollow liquid infusion connecting pipe, 24 - temperature regulating coolant, 25 - metal lifting substrate, 26 - limit fastening screw, 27 - elastic insulating heat conducting sheet, 28 - second hollow liquid infusion connecting pipe, 29 - third liquid storage temperature regulating metal box, 70 - detachable atomizing nozzle, 71 - hollow liquid infusion dispersion pipe, 72 - fourth liquid storage temperature regulating metal box, 73 - second adjustable feeding hose, 74 - adjustable cooling element, 75 - limit metal diversion plate, 76 - hollow cooling metal pipe, 77 - limit heat dissipation groove. Detailed implementation manner

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0023] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", and "setting" should be understood in a broad sense. For example, it can be fixedly connected and set, or detachably connected and set, or integrally connected and set.

[0024] For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0025] Please refer to Figure 1 , this embodiment provides a semiconductor package cooling device, including a protective mounting substrate 1. A first detachable cooling mechanism 2 for cooling the power semiconductor device is provided on the upper surface of the protective mounting substrate 1. A second detachable cooling mechanism 7 for cooling the first detachable cooling mechanism 2 is provided below the protective mounting substrate 1. A detachable liquid storage tank 3 for cooling the second detachable cooling mechanism 7 is provided at one end of the protective mounting substrate 1 away from the first detachable cooling mechanism 2. A plurality of adjustable feeding hoses 4 are provided at the top of the detachable liquid storage tank 3. A plurality of adjustable material pumps 5 are provided at the bottom of the side surface of the detachable liquid storage tank 3. The adjustable material pump 5 is a water pump. The output end of the adjustable material pump 5 is provided with a plurality of first adjustable feeding hoses 6 for feeding the second detachable cooling mechanism 7. The first adjustable feeding hose 6 is a rubber hose or a plastic hose.

[0026] Please refer to Figure 1 、 Figure 2 and Figure 3 In one embodiment, to make the use of the first detachable cooling mechanism 2 more reliable, preferably, the first detachable cooling mechanism 2 includes a first liquid storage and temperature-regulating metal box 20. A plurality of liquid storage and temperature-regulating metal tubes 21 are provided on the top of the first liquid storage and temperature-regulating metal box 20. The liquid storage and temperature-regulating metal tubes 21 penetrate through the top wall of the first liquid storage and temperature-regulating metal box 20 and are connected to the internal space of the first liquid storage and temperature-regulating metal box 20. The first liquid storage and temperature-regulating metal box 20 is fixedly connected to the liquid storage and temperature-regulating metal tubes 21. The inside of the first liquid storage and temperature-regulating metal box 20 is filled with a temperature-regulating coolant 24, and the temperature-regulating coolant 24 is mineral oil. A metal supporting substrate 25 for supporting and cooling the power semiconductor device is provided inside the liquid storage and temperature-regulating metal tube 21, and the metal supporting substrate 25 is fixedly connected to the liquid storage and temperature-regulating metal tube 21;

[0027] Please refer to Figure 2 and Figure 3 In one embodiment, to make the function of the first detachable cooling mechanism 2 more abundant, preferably, a second liquid storage and temperature-regulating metal box 22 is provided above the first liquid storage and temperature-regulating metal box 20. A plurality of third liquid storage and temperature-regulating metal boxes 29 for cooperating with the liquid storage and temperature-regulating metal tubes 21 to limit, fix and cool the power semiconductor device are provided on one side of the second liquid storage and temperature-regulating metal box 22 facing the first liquid storage and temperature-regulating metal box 20. The third liquid storage and temperature-regulating metal box 29 is slidably connected to the liquid storage and temperature-regulating metal tube 21. The third liquid storage and temperature-regulating metal box 29 penetrates through the side wall of the second liquid storage and temperature-regulating metal box 22, and the internal spaces of the third liquid storage and temperature-regulating metal box 29 and the second liquid storage and temperature-regulating metal box 22 are connected;

[0028] Please refer to Figure 2 and Figure 3, in one embodiment, to make the functions of the first detachable cooling mechanism 2 more diverse, preferably, in this embodiment, a plurality of first hollow liquid infusion connecting pipes 23 are provided at both ends of the first liquid storage and temperature regulating metal box 20, and a plurality of second hollow liquid infusion connecting pipes 28 are provided at both ends of the second liquid storage and temperature regulating metal box 22. The second hollow liquid infusion connecting pipes 28 are used to cooperate with the first hollow liquid infusion connecting pipes 23 to fix the second liquid storage and temperature regulating metal box 22 and to convey the temperature regulating coolant 24. The second hollow liquid infusion connecting pipes 28 are hermetically and slidably connected to the first hollow liquid infusion connecting pipes 23. A plurality of limit fastening screws 26 for fixing the second hollow liquid infusion connecting pipes 28 are threadedly connected to the top of the first hollow liquid infusion connecting pipes 23. On the side of the second liquid storage and temperature regulating metal box 22 facing the first liquid storage and temperature regulating metal box 20, an elastic insulating and heat-conducting sheet 27 for insulation, heat conduction and buffering is provided. The elastic insulating and heat-conducting sheet 27 is a heat-conducting silica gel sheet. The elastic insulating and heat-conducting sheet 27 is provided at one end of the third liquid storage and temperature regulating metal box 29 away from the second liquid storage and temperature regulating metal box 22, and the elastic insulating and heat-conducting sheet 27 is fixedly connected to the third liquid storage and temperature regulating metal box 29.

[0029] In another embodiment, the first detachable cooling mechanism 2 includes a first liquid storage and temperature regulating metal box 20. A plurality of liquid storage and temperature regulating metal pipes 21 are provided on the top of the first liquid storage and temperature regulating metal box 20. The liquid storage and temperature regulating metal pipes 21 penetrate through the top wall of the first liquid storage and temperature regulating metal box 20 and are communicated with the internal space of the first liquid storage and temperature regulating metal box 20. The first liquid storage and temperature regulating metal box 20 is fixedly connected to the liquid storage and temperature regulating metal pipes 21. The internal space of the first liquid storage and temperature regulating metal box 20 is filled with a temperature regulating coolant 24, and the temperature regulating coolant 24 is water. Inside the liquid storage and temperature regulating metal pipes 21, a metal supporting substrate 25 for supporting and cooling the power semiconductor device is provided. The metal supporting substrate 25 is fixedly connected to the liquid storage and temperature regulating metal pipes 21. A second liquid storage and temperature regulating metal box 22 is provided above the first liquid storage and temperature regulating metal box 20. On the side of the second liquid storage and temperature regulating metal box 22 facing the first liquid storage and temperature regulating metal box 20, a plurality of third liquid storage and temperature regulating metal boxes 29 for cooperating with the liquid storage and temperature regulating metal pipes 21 to limit, fix and cool the power semiconductor device are provided. The third liquid storage and temperature regulating metal boxes 29 are slidably connected to the liquid storage and temperature regulating metal pipes 21. The third liquid storage and temperature regulating metal boxes 29 penetrate through the side wall of the second liquid storage and temperature regulating metal box 22, and the internal spaces of the third liquid storage and temperature regulating metal boxes 29 and the second liquid storage and temperature regulating metal boxes 22 are communicated;

[0030] In another embodiment, in order to enrich the functions of the first detachable cooling mechanism 2, preferably, in this embodiment, a plurality of first hollow infusion connecting pipes 23 are provided at both ends of the first liquid storage and temperature-regulating metal box 20. A plurality of second hollow infusion connecting pipes 28 are provided at both ends of the second liquid storage and temperature-regulating metal box 22. The second hollow infusion connecting pipes 28 are used to cooperate with the first hollow infusion connecting pipes 23 to fix the second liquid storage and temperature-regulating metal box 22 and to convey the temperature-regulating coolant 24. The second hollow infusion connecting pipes 28 are hermetically and slidably connected to the first hollow infusion connecting pipes 23. A plurality of limit fastening screws 26 for fixing the second hollow infusion connecting pipes 28 are threadedly connected to the tops of the first hollow infusion connecting pipes 23. An elastic insulating and heat-conducting sheet 27 for insulation, heat conduction and buffering is provided on one side of the second liquid storage and temperature-regulating metal box 22 facing the first liquid storage and temperature-regulating metal box 20. The elastic insulating and heat-conducting sheet 27 is made of thermal grease. The elastic insulating and heat-conducting sheet 27 is provided at one end of the third liquid storage and temperature-regulating metal box 29 away from the second liquid storage and temperature-regulating metal box 22. The elastic insulating and heat-conducting sheet 27 is fixedly connected to the third liquid storage and temperature-regulating metal box 29.

[0031] Please refer to Figure 1 , Figure 4 and Figure 5 , in one embodiment, in order to make the use of the second detachable cooling mechanism 7 more reliable, preferably, in this embodiment, the second detachable cooling mechanism 7 includes a fourth liquid storage and temperature-regulating metal box 72. A plurality of second adjustable feeding hoses 73 communicating with the first hollow infusion connecting pipes 23 are provided at both ends of the fourth liquid storage and temperature-regulating metal box 72 for conveying the temperature-regulating coolant 24. The second adjustable feeding hoses 73 are rubber hoses, and heat-insulating tubes are sleeved on the second adjustable feeding hoses 73. A hollow temperature-reducing metal tube 76 for cooling the temperature-regulating coolant 24 is provided inside the fourth liquid storage and temperature-regulating metal box 72. The hollow temperature-reducing metal tube 76 penetrates through the fourth liquid storage and temperature-regulating metal box 72 and is fixedly connected to the fourth liquid storage and temperature-regulating metal box 72;

[0032] Please refer to Figure 4 and Figure 5, in one embodiment, to make the functions of the second detachable cooling mechanism 7 more diverse, in this embodiment, preferably, a plurality of hollow infusion dispersion tubes 71 communicating with the first adjustable supply hose 6 are provided at both ends of the hollow cooling metal tube 76. The hollow infusion dispersion tubes 71 are fixedly connected to the hollow cooling metal tube 76. A plurality of detachable atomizing nozzles 70 are spaced apart on the hollow infusion dispersion tubes 71. During use, the inner wall of the hollow cooling metal tube 76 is atomized and sprayed through the detachable atomizing nozzles 70. Thus, during the movement of the vehicle, the hollow cooling metal tube 76 is cooled by air cooling and evaporation cooling through the flow of air. Through the mutual cooperation of the two cooling methods, the hollow cooling metal tube 76 is quickly cooled. A plurality of limiting metal guide plates 75 for guiding the temperature-adjusting coolant 24 are provided on the hollow cooling metal tube 76. The limiting metal guide plates 75 are fixedly connected to the hollow cooling metal tube 76. During use, the temperature-adjusting coolant 24 is guided by the limiting metal guide plates 75 to change the flow path of the temperature-adjusting coolant 24, thereby extending the moving distance of the temperature-adjusting coolant 24 and enhancing its heat exchange effect, and thus enhancing the cooling effect on the temperature-adjusting coolant 24;

[0033] Please refer to Figure 4 and Figure 5 , in one embodiment, to make the functions of the second detachable cooling mechanism 7 more diverse, in this embodiment, preferably, a plurality of adjustable cooling members 74 for cooperating with the fourth liquid storage and temperature-adjusting metal box 72 to cool the temperature-adjusting coolant 24 are provided below the hollow cooling metal tube 76. The adjustable cooling members 74 are semiconductor refrigeration chips. During use, the cold end of the adjustable cooling members 74 is used to cool the hollow cooling metal tube 76, and the hot end of the adjustable cooling members 74 is cooled by air cooling during the movement of the vehicle. A plurality of adjustable cooling members 74 are spaced apart at both ends of the lower surface of the fourth liquid storage and temperature-adjusting metal box 72. The fourth liquid storage and temperature-adjusting metal box 72 is fixedly connected to the adjustable cooling members 74. A plurality of limiting heat dissipation grooves 77 for heat dissipation and storage are spaced apart at the bottom of the hollow cooling metal tube 76. During use, the liquid sprayed by the detachable atomizing nozzles 70 is temporarily stored through the limiting heat dissipation grooves 77, preventing the liquid sprayed by the detachable atomizing nozzles 70 from directly sliding off the hollow cooling metal tube 76 under the action of wind, thereby enhancing the cooling effect on the hollow cooling metal tube 76. Moreover, by providing the limiting heat dissipation grooves 77, the surface area of the hollow cooling metal tube 76 is increased, thereby further enhancing the heat exchange effect of the hollow cooling metal tube 76 and making the cooling effect of the hollow cooling metal tube 76 better.

[0034] In another embodiment, to make the use of the second detachable cooling mechanism 7 more reliable, in this embodiment, preferably, the second detachable cooling mechanism 7 includes a fourth liquid storage and temperature-adjusting metal box 72. At both ends of the fourth liquid storage and temperature-adjusting metal box 72, there are provided a number of second adjustable feeding hoses 73 that are connected to the first hollow infusion connecting pipe 23 and are used to convey the temperature-adjusting coolant 24. The second adjustable feeding hose 73 is a silicone tube, and a heat-insulating tube is sleeved on the second adjustable feeding hose 73. Inside the fourth liquid storage and temperature-adjusting metal box 72, there is provided a hollow cooling metal tube 76 that cools the temperature-adjusting coolant 24. The hollow cooling metal tube 76 penetrates through the fourth liquid storage and temperature-adjusting metal box 72 and is fixedly connected to the fourth liquid storage and temperature-adjusting metal box 72;

[0035] In another embodiment, to make the functions of the second detachable cooling mechanism 7 more diverse, in this embodiment, preferably, at both ends of the hollow cooling metal tube 76, there are provided a number of hollow infusion dispersion tubes 71 that are connected to the first adjustable feeding hose 6. The hollow infusion dispersion tubes 71 are fixedly connected to the hollow cooling metal tube 76. A number of detachable atomizing nozzles 70 are spaced apart on the hollow infusion dispersion tubes 71. During use, the inner wall of the hollow cooling metal tube 76 is atomized and sprayed through the detachable atomizing nozzles 70. Thus, during the movement of the vehicle, the hollow cooling metal tube 76 is air-cooled and evaporatively cooled through the flow of air. Through the mutual cooperation of the two cooling methods, the hollow cooling metal tube 76 is quickly cooled. On the hollow cooling metal tube 76, there are provided a number of limit metal guide plates 75 that guide the temperature-adjusting coolant 24. The limit metal guide plates 75 are fixedly connected to the hollow cooling metal tube 76. During use, the temperature-adjusting coolant 24 is guided through the limit metal guide plates 75 to change the flow path of the temperature-adjusting coolant 24, thereby extending the moving distance of the temperature-adjusting coolant 24 and enhancing its heat exchange effect, and thus enhancing the cooling effect on the temperature-adjusting coolant 24;

[0036] Please refer to Figure 4 and Figure 5, in one embodiment, to enrich the functions of the second detachable cooling mechanism 7, preferably, several adjustable cooling elements 74 for cooling the temperature-adjusting coolant 24 in cooperation with the fourth liquid storage and temperature-adjusting metal box 72 are arranged below the hollow temperature-reducing metal tube 76. The adjustable cooling element 74 is a semiconductor refrigeration chip. During use, the cold end of the adjustable cooling element 74 is used to cool the hollow temperature-reducing metal tube 76, and the hot end of the adjustable cooling element 74 is air-cooled by the air flow generated during the vehicle movement. The several adjustable cooling elements 74 are arranged at intervals at both ends of the lower surface of the fourth liquid storage and temperature-adjusting metal box 72. The fourth liquid storage and temperature-adjusting metal box 72 is fixedly connected to the adjustable cooling element 74. Several limiting heat dissipation grooves 77 for heat dissipation and storage are arranged at intervals at the bottom of the hollow temperature-reducing metal tube 76. During use, the liquid sprayed by the detachable atomizing nozzle 70 is temporarily stored through the limiting heat dissipation grooves 77, preventing the liquid sprayed by the detachable atomizing nozzle 70 from directly sliding off the hollow temperature-reducing metal tube 76 under the action of wind, thereby improving the temperature-reducing effect on the hollow temperature-reducing metal tube 76.

[0037] The working principle and usage process of the present invention: During use, the cooling device is installed on the new energy vehicle, and the second detachable cooling mechanism 7 is installed on the lower surface of the vehicle chassis (the user can adjust the thickness of the fourth liquid storage and temperature-adjusting metal box 72 according to actual needs, so the installation of the fourth liquid storage and temperature-adjusting metal box 72 will not affect the safety of the vehicle), and the rest are installed inside the new energy vehicle. The interiors of the first liquid storage and temperature-adjusting metal box 20, the liquid storage and temperature-adjusting metal tube 21, the second liquid storage and temperature-adjusting metal box 22, the third liquid storage and temperature-adjusting metal box 29, and the fourth liquid storage and temperature-adjusting metal box 72 are all filled with the temperature-adjusting coolant 24;

[0038] During use, water is injected into the interior of the detachable liquid storage tank 3 through the adjustable feeding hose 4 (in a low-temperature environment, common low-temperature-resistant coolants can also be injected, or even the common low-temperature-resistant windshield washer fluid for vehicles can be injected). The bottom of the power semiconductor device is cooled by the metal supporting substrate 25 in cooperation with the temperature-adjusting coolant 24, and the top of the power semiconductor device is cooled by the elastic insulating heat-conducting sheet 27 and the third liquid storage and temperature-adjusting metal box 29 in cooperation with the temperature-adjusting coolant 24. Moreover, the liquid storage and temperature-adjusting metal tube 21 and the third liquid storage and temperature-adjusting metal box 29 cooperate with each other to jointly create a low-temperature working environment for the power semiconductor device, so as to achieve all-round cooling of the power semiconductor device;

[0039] During the movement of the vehicle, air passes through the interior of the hollow cooling metal tube 76. At this time, the hollow cooling metal tube 76 is cooled by the flow of air, so that the hollow cooling metal tube 76 cools the temperature-adjusting coolant 24. At the same time, the power supply of the adjustable material pump 5 is turned on, and the detachable atomizing nozzle 70 atomizes and sprays the precipitation. The sprayed water mist scatters on the inner wall of the hollow cooling metal tube 76, so as to uniformly moisten the inner wall of the hollow cooling metal tube 76, realize the water cooling of the hollow cooling metal tube 76, and cooperate with the flow of air to evaporate the water on the hollow cooling metal tube 76, realize the evaporation cooling of the hollow cooling metal tube 76, so as to significantly improve the cooling effect of the hollow cooling metal tube 76. Thus, only through the movement of the vehicle, multiple cooling of the temperature-adjusting coolant 24 can be realized. If the cooling effect does not meet the expectation, at this time, the power supply of the adjustable cooling member 74 can be turned on, so that the adjustable cooling member 74 cools the hollow cooling metal tube 76 by refrigeration, so as to realize multiple cooling of the hollow cooling metal tube 76, so that the hollow cooling metal tube 76 cools the temperature-adjusting coolant 24 quickly and sufficiently;

[0040] Thus, through the mutual cooperation of multiple structures, the power semiconductor device is cooled in all directions, so that the cooling effect of the cooling device on the power semiconductor device is better, and the power semiconductor device is prevented from being damaged due to excessive temperature. Secondly, through the mutual cooperation of multiple structures, the temperature-adjusting coolant 24 is cooled by air cooling, water cooling, evaporation cooling and refrigeration cooling. Through the mutual cooperation of the four cooling methods, the temperature-adjusting coolant 24 is cooled quickly and sufficiently, so that the temperature-adjusting coolant 24 can be kept in an efficient cooling state for a long time, and the cooling effect of the cooling device is improved. In addition, only through the movement of the new energy vehicle, multiple cooling of the temperature-adjusting coolant 24 can be realized, making the use of the cooling device more environmentally friendly. Moreover, the structure of the present invention is simple, easy to use, low in cost and low in failure rate.

[0041] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0042] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor package cooling device, comprising a protective mounting substrate, characterized in that: The upper surface of the protective mounting substrate is provided with a first detachable cooling mechanism for cooling the power semiconductor device, and a second detachable cooling mechanism for cooling the first detachable cooling mechanism is provided below the protective mounting substrate. A detachable liquid storage tank for cooling the second detachable cooling mechanism is provided at one end of the protective mounting substrate away from the first detachable cooling mechanism, and a plurality of adjustable injection hoses are provided on the top of the detachable liquid storage tank, and a plurality of adjustable material pumps are provided at the bottom of the side of the detachable liquid storage tank, and a plurality of first adjustable feeding hoses for feeding the second detachable cooling mechanism are provided at the output end of the adjustable material pump. The first detachable cooling mechanism includes a first liquid storage and temperature regulating metal box, and a plurality of liquid storage and temperature regulating metal tubes are provided on the top of the first liquid storage and temperature regulating metal box. The liquid storage and temperature regulating metal tubes penetrate the top wall of the first liquid storage and temperature regulating metal box, and the first liquid storage and temperature regulating metal box is fixedly connected to the liquid storage and temperature regulating metal tubes. The interior of the first liquid storage and temperature regulating metal box is filled with temperature regulating coolant, and the interior of the liquid storage and temperature regulating metal tubes is provided with a plurality of first adjustable feeding hoses for feeding the second detachable cooling mechanism. A metal supporting substrate for supporting and cooling, the metal supporting substrate is fixedly connected to the liquid storage and temperature adjustment metal tube, a second liquid storage and temperature adjustment metal box is arranged above the first liquid storage and temperature adjustment metal box, and a plurality of third liquid storage and temperature adjustment metal boxes are arranged on the side of the second liquid storage and temperature adjustment metal box facing the first liquid storage and temperature adjustment metal box for cooperating with the liquid storage and temperature adjustment metal tube to limit, fix and cool the power semiconductor device, the third liquid storage and temperature adjustment metal box is slidably connected to the liquid storage and temperature adjustment metal tube, the third liquid storage and temperature adjustment metal box passes through the side wall of the second liquid storage and temperature adjustment metal box, and the first liquid storage A plurality of first hollow infusion connecting tubes are arranged at both ends of the temperature-regulating metal box, the second detachable cooling mechanism comprises a fourth liquid storage and temperature-regulating metal box, a plurality of second adjustable feeding hoses connected with the first hollow infusion connecting tubes for conveying the temperature-regulating coolant are arranged at both ends of the fourth liquid storage and temperature-regulating metal box, a hollow cooling metal tube for cooling the temperature-regulating coolant is arranged inside the fourth liquid storage and temperature-regulating metal box, the hollow cooling metal tube runs through the fourth liquid storage and temperature-regulating metal box, and the hollow cooling metal tube is fixedly connected to the fourth liquid storage and temperature-regulating metal box.

2. The semiconductor package cooling device according to claim 1, characterized in that: A plurality of second hollow infusion connecting tubes are provided at both ends of the second liquid storage and temperature regulating metal box for cooperating with the first hollow infusion connecting tube to fix the second liquid storage and temperature regulating metal box and to transport the temperature regulating cooling liquid. The second hollow infusion connecting tube is sealed and slidably connected to the first hollow infusion connecting tube.

3. The semiconductor package cooling device according to claim 2, characterized in that: The top of the first hollow infusion connecting tube is threadedly connected with a plurality of limiting fastening screws for fixing the second hollow infusion connecting tube; an elastic insulating thermally conductive sheet for insulation, heat conduction and buffering is provided on the side of the second liquid storage and temperature regulating metal box facing the first liquid storage and temperature regulating metal box; the elastic insulating thermally conductive sheet is provided at one end of the third liquid storage and temperature regulating metal box away from the second liquid storage and temperature regulating metal box; the elastic insulating thermally conductive sheet is fixedly connected to the third liquid storage and temperature regulating metal box.

4. The semiconductor package cooling device according to claim 3, characterized in that: A plurality of hollow infusion dispersion tubes connected to the first adjustable feed hose are arranged at both ends of the hollow cooling metal tube, the hollow infusion dispersion tubes are fixedly connected to the hollow cooling metal tube, a plurality of detachable atomizing nozzles are arranged at intervals on the hollow infusion dispersion tubes, and a plurality of limiting metal guide plates for guiding the temperature regulating coolant are arranged on the hollow cooling metal tube.

5. The semiconductor package cooling device according to claim 4, characterized in that: A plurality of adjustable cooling components are arranged below the hollow cooling metal tube to cooperate with the fourth liquid storage and temperature regulating metal box to cool the temperature regulating coolant. The plurality of adjustable cooling components are arranged at intervals at both ends of the lower surface of the fourth liquid storage and temperature regulating metal box, and the fourth liquid storage and temperature regulating metal box is fixedly connected to the adjustable cooling components.

6. The semiconductor package cooling device according to claim 5, characterized in that: The bottom of the hollow cooling metal tube is provided with a plurality of limiting heat dissipation grooves for heat dissipation and storage, and the limiting metal guide plate is fixedly connected to the hollow cooling metal tube.

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