Planar linear array for ultrasound

Abstract

An ultrasound transducer includes a planar array stack. The stack includes a lens layer including an acoustic lens and a lens support structure, where a portion of the acoustic lens is locked to the lens support structure. The stack further includes a piezoelectric layer including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounding the piezoelectric material on at least two sides, the non-metallic frame coupled to a portion of the lens support structure such that the acoustic lens and the non-metallic frame are oriented substantially parallel to each other. The transducer also includes an interposer frame for disposing one or more flexible circuits, where the interposer frame is coupled to the non-metallic frame via conductive elements in the non-metallic frame and to the one or more flexible circuits.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This PCT international patent application claims priority to U.S. Patent Application No. 63 / 368,756, entitled “PLANAR LINEAR ARRAY FOR ULTRASOUND,” filed on July 18, 2022, and U.S. Patent Application No. 18 / 158,904, entitled “PLANAR LINEAR ARRAY FOR ULTRASOUND,” both of which are incorporated herein by reference in their entirety. Background Art

[0003] In conventional ultrasonic diagnostic imaging systems, arrays are used as interfaces for converting electrical signals into ultrasonic waves and reconverting reflected ultrasound received from tissue structures into electrical signals. Some arrays use fixed acoustic lenses (such as convex RTV (room temperature vulcanized silicone) lenses) in the elevation direction to focus the ultrasound beam to improve image resolution or image slice thickness. Currently, the most popular ultrasonic transducer in medical imaging is a 1D array, which uses a fixed aperture with an acoustic lens in elevation to improve image resolution. The transducer elements can be arranged in linear 1D rows or chains (so-called linear arrays) and can be controlled separately or in groups by an electronic control unit to achieve a guiding effect. Although the elevation resolution can be improved by using a controlled multi-row array (e.g., 1.25D or 1.5D) for elevation aperture adjustment, the cost of establishing a multi-row array in production is high due to the complex electrical interconnection between rows and columns. The complexity of these connections also opens up the possibility of failure and can affect the life of the device. In addition, although the elevation resolution can be improved, the current multi-row array introduces the limitation that all rows usually have the same center frequency.

[0004] Some arrays used in conjunction with ultrasound imaging are free field voltage sensitivity (FFVS) high frequency (HF) arrays and are built on metal conical support structures. Existing structures for mounting these arrays increase the complexity of the resulting probe, in part because mounting various aspects at an angle proves to be necessary for the functional and structural integrity of the array. For example, a flexible circuit mounting the array at an angle equal to or approximately 45 degrees on such a conical support structure maintains lateral space and creates an electrical path in the vertical direction by adding a molded insulating layer. The metal in the conical support structure provides mechanical strength to the array structure and serves as a ground path. However, the tilted nature of the structure, which provides the intended function as described above, makes assembly challenging. Existing ultrasonic transducers have complex 3D structures within their array stacks. Assembling these stacks is a tedious process; the process includes complex processing performed by operators with a high level of skill. Summary of the invention

[0005] By providing a transducer, the disadvantages of the prior art can be overcome and the benefits of the present disclosure as described later can be achieved. Various examples of transducers are described below, and transducers including and excluding any combination of the additional examples listed below (assuming that these combinations are not inconsistent) overcome these disadvantages. The transducer includes, for example: a planar array stack, including: a lens layer, including an acoustic lens and a lens support structure, wherein a portion of the acoustic lens is locked to the lens support structure; and a piezoelectric layer, including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounds the piezoelectric material on at least two sides, the non-metallic frame is coupled to a portion of the lens support structure so that the acoustic lens and the non-metallic frame are oriented substantially parallel to each other; an interposer frame for arranging one or more flexible circuits, wherein the interposer frame is coupled to the non-metallic frame and coupled to the one or more flexible circuits via conductive elements in the non-metallic frame; and the one or more flexible circuits.

[0006] By providing a transducer, the disadvantages of the prior art can be overcome and the benefits of the present disclosure as described later can be achieved. Various examples of transducers are described below, and transducers including and excluding any combination of the additional examples listed below (assuming that these combinations are not inconsistent) overcome these disadvantages. The transducer includes, for example: a planar array stack, including: a lens layer, including a lens; one or more matching layers, located between the lens layer and the piezoelectric layer; and a piezoelectric layer, including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounding the piezoelectric material on at least two sides; an interposer frame for accommodating one or more flexible circuits, wherein the interposer frame is coupled to the non-metallic frame and coupled to the one or more flexible circuits via conductive elements in the non-metallic frame; and the one or more flexible circuits.

[0007] By providing a transducer, the disadvantages of the prior art can be overcome and the benefits of the present disclosure as described later can be achieved. Various examples of transducers are described below, and transducers including and excluding any combination of the additional examples listed below (assuming that these combinations are not inconsistent) overcome these disadvantages. The transducer includes, for example: a planar array stack, including: a lens layer, including a lens; and a piezoelectric layer, including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounding the piezoelectric material on at least two sides, the non-metallic frame being coupled to a portion of the lens layer; an interposer frame for accommodating one or more flexible circuits, wherein the interposer frame is coupled to the non-metallic frame and coupled to the one or more flexible circuits via conductive elements in the non-metallic frame; and the one or more flexible circuits.

[0008] By providing a method for processing a transducer, the shortcomings of the prior art can be overcome and the benefits of the present disclosure as described later can be achieved. Various examples of methods are described below, and methods including and excluding any combination of the additional examples listed below (assuming that these combinations are not inconsistent) overcome these shortcomings. The method includes, for example: forming a piezoelectric layer including a non-metallic material and a piezoelectric material, wherein the forming includes framing the piezoelectric material with a non-metallic material on at least two sides. The method can also include: forming a lens support structure, wherein the lens support structure orients the acoustic lens in a central position relative to the width and elevation of the planar array stack. The method can also include: bonding the lens support structure to the piezoelectric layer so that the lens support structure and the piezoelectric layer are parallel relative to the width and elevation.

[0009] Additional features are achieved through the devices and techniques described herein.Other embodiments and aspects are described in detail herein and are considered a part of the claimed aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] At the end of this specification, in the claims, one or more aspects are particularly pointed out and clearly claimed as examples. The foregoing and objects, features and advantages of one or more aspects are clear from the following detailed description in conjunction with the accompanying drawings, in which:

[0011] Figure 1 An exploded view depicting an example of a planar array stack of ultrasound transducers;

[0012] Figure 2 and 3 all describe examples of lens layers that can be integrated into the examples of planar array stacks described herein;

[0013] Figure 4 describing examples of piezoelectric layers that can be integrated into examples of planar array stacks described herein;

[0014] Figure 5 The illustrated lasers can be used to form different patterns in the piezoelectric material integrated in the examples of the planar array stacks described herein;

[0015] Figure 6 Describing structures that can be integrated into the examples of planar array stacks described herein for securing flexible circuits in a planar linear array stack;

[0016] Figure 7 Describes examples of integrated interposer frames that can be integrated into examples of planar array stacks described herein;

[0017] Figure 8describing flexible circuit structures that can be integrated into examples of planar array stacks described herein;

[0018] Fig.9A , 9B and 10 provide views of various elements of the planar linear array stack described herein;

[0019] Fig.11 illustrates examples of connections of an interposer frame to traces on the surface of the one or more flexible circuits in some examples of the planar linear arrays described herein;

[0020] Fig.12 and 13 illustrates an example of assembly of a flexible curved frame with certain elements of the planar linear array described herein;

[0021] Fig.14 illustrates an enlarged view of a flexible bending frame integrated into an example of a planar array stack described herein;

[0022] Fig.15 illustrates a backing preform during assembly of an example of a planar linear array of transducers disclosed herein;

[0023] Fig.16 A view illustrating an example of a planar linear array of transducers disclosed herein after assembly;

[0024] Fig.17 illustrates examples of shielding elements included in certain examples of planar linear arrays described herein;

[0025] Fig.18 orthogonal views of examples of planar linear array stacks described herein are provided;

[0026] Fig.19 provides a front view of an example of a planar linear array stack described herein;

[0027] Fig. 20 Describes an example of a diagram of a curved divider that can be integrated into certain examples of the planar linear arrays described herein;

[0028] Fig.21 A workflow diagram illustrating various aspects of some of the methods for fabricating planar linear arrays discussed herein; and

[0029] Fig. 22 Illustrated is an example of a technique for forming a lens for use in a transducer including an example of a planar linear array stack described herein. DETAILED DESCRIPTION

[0030] The accompanying drawings are not drawn to scale for ease of understanding, in which similar reference numerals may always refer to the same or functionally similar elements in separate views, and the accompanying drawings are included in and form a part of this specification, and the accompanying drawings also illustrate the present invention and explain the principles of the present invention together with the detailed description of the present invention. As will be appreciated by those skilled in the art, the accompanying drawings are provided for ease of understanding and illustrate various aspects of certain embodiments of the present invention. The present invention is not limited to the embodiments described in the accompanying drawings.

[0031] Terminology Examples

[0032] The terms "connected," "contacted," "coupled," and the like are broadly defined herein to include a variety of different arrangements and assembly techniques. These arrangements and techniques include, but are not limited to: (1) the direct connection of one component to another component without intervening components between them (i.e., the components are in direct physical contact); and (2) the connection of one component to another component with one or more components between them, provided that the one component "connected to" or "contacted with" or "coupled to" the other component is in operational communication (e.g., electrically, fluidically, physically, optically, etc.) with the other component in some manner (although one or more additional components are present between them). It should be understood that some components that are in direct physical contact with each other may or may not be in electrical and / or fluid contact with each other. In addition, two components that are electrically connected, electrically coupled, optically connected, optically coupled, fluidically connected, or fluidically coupled may or may not be in direct physical contact, and one or more other components may be placed between them.

[0033] As used herein, the terms "including" and "comprising" mean the same thing.

[0034] The terms "substantially", "approximately", "about", "relatively" or other such similar terms that may be used throughout this disclosure (including claims) are used to describe and illustrate small fluctuations relative to a benchmark or parameter, such as due to changes in processing. Such small fluctuations also include zero fluctuations relative to a benchmark or parameter. For example, they can refer to less than or equal to ±10%, such as less than or equal to ±5%, such as less than or equal to ±2%, such as less than or equal to ±1%, such as less than or equal to ±0.5%, such as less than or equal to ±0.2%, such as less than or equal to ±0.1%, such as less than or equal to ±0.05%. If used here, the terms "substantially", "approximately", "about", "relatively" or other such similar terms may also refer to no fluctuations.

[0035] As used herein, "electrical coupling" refers to the transfer of electrical energy between any combination of power sources, electrodes, conductive surfaces, droplets, conductive traces, wires, waveguides, nanostructures, other circuit segments, etc. The term electrical coupling may be used in conjunction with direct or indirect connections, and may be through various media, such as fluid media, air gaps, etc.

[0036] As used herein, the term "kerf" is an adjustable gap between sliced ​​portions of an acoustic surface, which gap can be filled with varying materials (to maintain and adjust the gap) in each instance.

[0037] The term "ROC" refers to the radius of curvature and is used in the context of acoustic design here. In medical ultrasound arrays, ROC lenses are typically cylindrical focusing lenses. The lenses referred to here as ROC lenses are single-radius focusing lenses, and the lenses referred to here as multi-ROC lenses are multi-radius focusing lenses. The ROC of a convex acoustic lens is the product of the geometric focal length and the sound velocity of the medium divided by the sound velocity of the lens material minus one. The acoustic lenses used here are designed based on the paraxial theory or Fresnel approximation in geometric optics, assuming that a plane wavefront is emitted in a direction orthogonal to the transducer surface.

[0038] As used herein, the term "PZT" refers to lead zirconate titanate or lead zirconate titanate, which is a ceramic perovskite material that exhibits the piezoelectric effect, i.e., the compound changes shape when an electric field is applied. In this case, it is used for ultrasonic transducers. PZT ceramic is the most commonly used piezoelectric ceramic because it has greater sensitivity and higher operating temperatures than other piezoelectric ceramics. As used herein, the term "SX" is used as "PZT / SX" in conjunction with "PZT" to refer to a single crystal lead zirconate titanate or lead zirconate titanate layer.

[0039] As used herein, the term "matching layer" refers to a layer in a transducer array that helps transfer ultrasonic energy from an element to a medium. In the examples herein (and in existing transducer arrays), the matching layer is typically located between the element and the lens. The matching layer includes materials that help achieve energy transfer, including but not limited to epoxy resins, elastomers, polyurethanes, polystyrene, etc. In an ultrasonic transducer, one or more matching layers provide an acoustic impedance gradient to allow the acoustic energy from the transducer to smoothly penetrate body tissue and to allow the reflected sound waves (return echoes) to smoothly return to the transducer for detection.

[0040] As used herein, the terms "signal flex" and "ground return flex" refer to signal and ground return elements in flexible electronic devices, also known as flex circuits, which are circuits that are capable of conforming to a desired shape (e.g., being flexible during use). The term "flex" is a flexible circuit. Flex circuits are used as connectors in a variety of applications where flexibility, space savings, and / or production constraints limit the serviceability of rigid circuit boards or hand wiring. Many flex circuits are passive wiring structures used to interconnect electronic components.

[0041] As used herein, the term "stack configuration" refers to a stack of objects, referred to herein as a "stack," which in the context of the examples herein includes multiple blocks of piezoelectric layers sliced ​​into multiple rows in elevation and, in some cases, matching layers and dematching layers. As described herein, each stack configuration is described with respect to three dimensions: width in elevation, length perpendicular to the width, and stack thickness configuration perpendicular to the length and perpendicular to the width. Here in Figure 1 Examples of these dimensions are provided in .

[0042] As used herein, the term "beam pattern" (which can also be referred to as the acoustic radiation pattern) is the relative sensitivity of a transducer as a function of spatial angle. This pattern is determined by various factors, such as the frequency of operation and the size, shape, and acoustic phase characteristics of the vibrating surface. The beam patterns of a transducer are interchangeable, meaning that the beam will be the same whether the transducer is used as a transmitter or a receiver. In general, a transducer can be designed to radiate sound in many different types of patterns, from omnidirectional to very narrow beams.

[0043] As discussed herein, the term "phased array" (PA) refers to an array of ultrasonic transducers that excite individual elements on the array in a specific order to direct sound waves in a specific direction. To this end, a PA probe includes many (e.g., small) ultrasonic transducers, each of which can be independently pulsed. Altering the timing by such pulse modulation (e.g., causing the pulses from each transducer to be progressively delayed along the line) causes the probe to radiate a beam pattern at set angles based on progressive time delays due to constructive interference. Changing the progressive time delays electronically steers the beam.

[0044] As used herein, the term "excimer laser," also known as an "exciplex laser," is a form of ultraviolet (UV) laser.

[0045] As used herein, the term "lens layer" refers to one or more elements in the planar linear array stack described herein, which one or more elements can include an acoustic lens and a lens support structure locked to a lens support structure, or in some examples, the lens layer can include an acoustic lens without a lens support structure.

[0046] As used herein, the term "piezoelectric layer" is a layer in a planar array stack that can include a piezoelectric material (e.g., PZT, PZT / SX, etc.). As will be discussed in more detail herein, in some examples, the piezoelectric layer can include a frame that does not include metal (e.g., it can include ceramic) that frames (surrounds) the piezoelectric material on at least two sides. Such a frame is referred to herein as a "non-metallic frame."

[0047] As used herein, the term "interposer frame" refers to a structure in a planar array stack that is non-conductive and can be used to house conductive elements, which in this example include one or more flexible circuits. The interposer frame can include a solid material (e.g., ceramic) coated with a conductive layer to bridge ground connections and signal electrode connections in the planar array stack.

[0048] As used herein, the term "overmold" refers to a material that can be used to join and position components in a planar array stack. In the examples herein, the overmold can be used to position conductive components, such as one or more flexible circuits.

[0049] As used herein, the term "flexible flex frame" is an element of a planar array stack that can be used to shape the aforementioned conductive elements that are positioned by an interposer frame.

[0050] As used herein, the term "backing preform" refers to a backing layer in a planar array stack that can be used to increase transducer signal quality by absorbing and attenuating back-end signals from a ceramic element (eg, interposer frame).

[0051] As used herein, the term "flexible separator" refers to a separator that can be used in a transducer to reduce side imaging and interference, and in the examples herein, the separator can assist in bending a conductive element (e.g., a flexible circuit) based on the placement of the separator.

[0052] As used herein, the term "uniformly scaled conductive shape" refers to shapes including, but not limited to, spheres, pyramids, and cubes. The term "uniformly scaled" refers to shapes having uniform height (eg, stack thickness). The relative orientation of height measurements will be discussed herein.

[0053] As discussed above, some existing arrays used in ultrasonic transducers are built on metal conical support structures, which are an example of complex three-dimensional (3D) structures used in this technology. These conical structures can provide mechanical strength (including by maintaining lateral space) for the array structure and can be used as a ground path. However, the result is a complex 3D structure that can be difficult to assemble (and expensive). In addition, the need to tilt the flexible circuit (for example, at 45 degrees) can limit the ability to miniaturize the array, and therefore, the obtained probe is not suitable for certain applications. In addition, in complex 3D structures, creating flat and parallel surfaces with a certain tolerance can be challenging. As the array footprint increases, such as in ultra-high resolution transrectal ultrasound (UHR-TRUS) probes, it becomes more difficult to keep flatness within a tight tolerance. As the footprint decreases, it is difficult to make tools to handle this tiny array and assemble the parts onto the tiny array. As will be described below, whether the array includes a conical support structure or another existing 3D structure with a similar volume, it is necessary to reduce the 3D complexity and volume in the transducer array. By the examples described herein, this need is addressed.

[0054] A method for manufacturing an ultrasonic transducer including a planar array stack and an example of a transducer including such a planar array stack are described herein. When compared to existing non-planar examples, transducers using examples having a planar structure described herein both simplify the manufacturing process and increase yield without compromising acoustic quality. Examples of planar array structures described herein can be integrated in a UHR-TRUS probe. Various aspects of the examples described herein will be discussed, but certain examples can include: 1) a substantially horizontal (e.g., flat) inserter frame that can include non-metallic materials, including but not limited to ceramics; 2) electrical connections, using shapes coated with conductive materials; 3) a piezoelectric frame (also referred to herein as a layer), which is non-conductive (e.g., ceramic) and is used to increase mechanical strength, flatten the array to facilitate ease of manufacturing, and provide embedded conductive channels for grounding; 4) a backing preform that is suitable for planar structures and reduces material costs; 5) a lens layer, including a lens with or without a surrounding frame. When present, the lens frame will enhance mechanical strength and electrical safety isolation. Advantages of the examples of arrays described herein and the manufacturing processes of these examples include, but are not limited to, simplifying manufacturing tools, eliminating lengthy manufacturing processes, reducing manufacturing difficulty, reducing dependence on operator skills, reducing failure rates, and reducing costs.

[0055] Figure 1 An exploded view of an example of a planar array stack 100 of an ultrasound transducer is depicted. In this figure, certain aspects are generally described, and the following figures illustrate these aspects in more detail. For example, Figure 2 and 3The planar array stack 100 ( Figure 1 ) in various aspects of the lens layers 210, 310. Figure 4 Describe the planar array stack 100 ( Figure 1 ) in various aspects of the piezoelectric layer 420, and Figure 5 Various examples of piezoelectric materials are described, which are the piezoelectric layer 120 ( Figure 1 ) part. Figure 6 An overmold 632 is depicted that secures the flexible circuit 630 to the interposer frame 625 . Figure 7 An example of an interposer frame 725 is described. Figure 8 A flexible circuit structure is depicted, including flexible registration strips 833 and flexible circuit 830 . Fig.12 and 13 Flexible curved frames 1235, 1335 are shown. Fig.15 A backing preform 1540 is shown. Fig. 20 Describe the curved separator 2045. The contents of the remaining figures will also be described here.

[0056] Reference Figure 1 , the illustrated example of a planar array stack 100 includes indicators of a width at elevation 101 (also referred to as elevation 101), a width 108, and a stack thickness 109. References herein to the bottom of the planar array stack 100 refer to the planar array stack 100 starting at the lens layer 110. References herein to the top of the planar array stack 100 refer to the planar array stack 100 starting at the curved divider 145. Thus, when a first element is described as being disposed below a second element, that means that the first element is closer to the lens layer 110 than the second element. When a first element is described as being above a second element, that means that the first element is closer to the curved divider 145 than the second element.

[0057] Reference Figure 1 , the planar array stack 100 includes a lens layer 110. This lens layer 110 can include an acoustic lens and a lens support structure that is locked to a lens support structure, or in some examples, the lens layer 110 can include an acoustic lens without a lens support structure. The acoustic lens used in various examples can be a concave lens or a convex lens. By way of example only, the acoustic lens images in the figures here are concave lenses.

[0058] The planar array stack 100 also includes a piezoelectric layer 120 of a piezoelectric material (e.g., PZT, PZT / SX, etc.). As shown in later figures, such a piezoelectric layer 120 includes a frame that does not include metal (e.g., it can be made of ceramic) and is referred to herein as a "non-metallic frame" that frames (surrounds) the piezoelectric material on at least two sides. In some examples, the non-metallic frame surrounds the piezoelectric material on four sides. Such a frame can position the piezoelectric material in a central position in the planar array stack 100 relative to the elevation 101 and the width 108. The non-metallic frame of the piezoelectric layer 120 not only centers the piezoelectric material in the planar array stack relative to the width 108 and the elevation 101, but the frame also defines the elevation depth.

[0059] In some examples of planar array stack 100, the non-metallic frame of the piezoelectric layer 120 is coupled to a portion of the lens support structure such that the acoustic lens and the non-metallic frame are oriented substantially parallel to each other along an axis of the stack thickness 109. Figure 1 In a planar array stack 100 of the present invention, at least one matching layer 115 separates the lens layer 110 and the piezoelectric layer 120. The matching layer 115 can provide a material buffer of acoustic impedance between elements in the transducer, including insulating elements and elements through which the generated signal will pass. The surface of the piezoelectric material in the piezoelectric layer 120 near the at least one matching layer 115 can include at least one electrode that electrically couples the piezoelectric material and the at least one matching layer 115. Above the piezoelectric layer 120 is an interposer frame 125 that houses one or more flexible circuits 130. The interposer frame 125 can include a ceramic or solid material that is non-conductive, but is used to anchor conductive materials and / or interconnect conductive elements within the planar array stack 100, and thus, enables electrical conduction. In some examples, a conductive layer is added to the interposer frame 125 so that the interposer layer 125 can bridge ground connections and signal electrode connections within the planar array stack 100 (described in more detail below).

[0060] For ease of illustration, Figure 1 Only a single flex circuit 130 is depicted. As shown in later figures, multiple flex circuits can be used, and these flex circuits can electrically couple the interposer frame 125 to the piezoelectric layer 120. The flex circuit 130 can additionally be coupled to a ground electrode. Figure 1100, but a variety of uniformly scaled shapes coated with or composed entirely of conductive material (e.g., metal micro-shapes) can couple the interposer frame 125 to the flexible circuit 130. Spheres are used as examples of shapes throughout, but as those skilled in the art will appreciate, the conductive shapes that can be used in the various examples herein can include, but are not limited to, pyramids and cubes, assuming that the heights (e.g., stack thickness 109) of these shapes are uniform (when positioned). Different shapes can be mixed with each other.

[0061] exist Figure 1 10, the relative position of the interposer frame 125 is directly below the one or more flexible circuits 130 (i.e., closer to the lens layer 110) and above the piezoelectric layer 120 (i.e., closer to the bend spacer 145), and the flexible bend frame 135 is substantially parallel (along the stack thickness 109 axis) to a first portion of the one or more flexible circuits 130. The overmold 132 locks the flexible circuits 130 to the interposer frame 125. As will be shown herein, a second portion of each of the one or more flexible circuits 130 is bent in the direction of the stack thickness 109 so that this portion of the one or more flexible circuits 130 is substantially perpendicular to a surface of the flexible bend frame 135 along the width 108 of the planar linear array 100 (e.g., this portion of the one or more flexible circuits 130 is substantially perpendicular to a plane defined by the width 108 dimension and the elevation 101 dimension, and a surface of the flexible bend frame 135 is substantially parallel to this plane). Thus, the one or more flex circuits 130 can be shaped using the flexible bending frame 135 so that a portion of the flex circuit is bent perpendicular to the width 108 axis of the planar array stack 100 and in the direction of the stack thickness 109 .

[0062] like Figure 1 As shown in FIG. 1 , both the interposer frame 125 and the flexible flex frame 135 have cavities 126, 136. When stacked in the planar array stack 100, these cavities 126, 136 are aligned with each other and create an opening or cavity in a central location along the width 108 and elevation 101 of the planar array stack 100. A portion of the backing preform 140 extends through this opening (created by 126, 136). The flex divider 145 assists in bending / positioning the one or more flexible circuits 130, which are positioned above the backing preform 140 along the stack thickness 109, so that a portion of each of the one or more flexible circuits 130 is substantially parallel to the surface of the flex divider (along the width 108), but another portion of the one or more flexible circuits 130 is bent and therefore perpendicular to the width 108 of the planar array stack (extending in the direction of the stack thickness 109).

[0063] Figure 2 and 3 Both describe lens layers 210, 310 (e.g., Figure 1 , 110) examples, which can be integrated into the planar array stack described herein (including but not limited to Figure 1 In the example of a planar array stack 100). Figure 2 The lens layer 210 and Figure 3 The difference between the lens layers 310 of EMBODIMENTS 1 and 2 lies in the lens support structure 212 , 312 used to place the acoustic lens 211 , 311 in each example.

[0064] exist Figure 2 In the lens layer 210, the support structure 212 of the acoustic lens 211 includes a first rod 213a and a second rod 213b located on opposite sides of the acoustic lens 211. The acoustic lens 211 can include a dielectric material, including but not limited to The material of the support structure 212 can be selected based on having a similar coefficient of thermal expansion as the acoustic lens 211 to minimize any warping (including doming) in the lens layer 210 when the lens layer 210 is subjected to heat (e.g., during use of the ultrasound transducer). Figure 1 ) and integrated planar array stack 100 ( Figure 1 ), it is desirable to avoid uneven expansion between the acoustic lens 211 and the support structure 212. The materials comprising the support structure 212 can include, but are not limited to, ceramic, plaster with ceramic, and plaster with metal (e.g., silver, gold).

[0065] As will be appreciated by those skilled in the art, the acoustic lens 211 can be used to focus the ultrasound beam to improve the sensitivity of the image. To this end, a certain curvature (ROC) is created in the acoustic lens 211 to properly focus the ultrasound beam. Thus, Figure 2 The acoustic lens 211 includes a curvature 214. When integrated in a planar array stack (e.g., Figure 1 , 100), the support structure 212 in the lens layer 210 places the curvature 214 in a position that is aligned with the piezoelectric layer (e.g., Figure 1 , 120) in the piezoelectric material in a similar width 108 and elevation 101 coordinate. This placement centers the acoustic lens 211 and the piezoelectric material along the width 108 and elevation 101 of the planar array stack 100.

[0066] exist Figure 3 In the lens layer 310, the support structure 312 of the acoustic lens 311 includes a frame 313 located around the perimeter of the acoustic lens 311. The acoustic lens can include dielectric materials, including but not limited to and Figure 2 The support structure 212 is the same as that of Figure 3 In the lens layer 310 of the ultrasonic transducer, the material of this support structure 312 can also be selected based on having a similar thermal expansion coefficient as the acoustic lens 311 to minimize any warping (including arching) in the lens layer 310 when the lens layer 310 is subjected to heat (during use of the ultrasonic transducer). Figure 1 ) and integrated planar array stack 100 ( Figure 1 ), it is desirable to avoid uneven expansion between the acoustic lens 311 and the support structure 312. The materials comprising the support structure 312 can include, but are not limited to, ceramic, plaster with ceramic, and plaster with metal (e.g., silver, gold). The acoustic lens 311 can include a curvature 314, and portions of the support structure 312 adjacent to the curvature 314 can also include such shaping, such as Figure 3 When integrated in a planar array stack (e.g. Figure 1 , 100), the support structure 312 in the lens layer 310 is arranged along the width 108 ( Figure 1 ) and width 108 elevation 101 ( Figure 1 ) places the curvature 314 of the lens at the center position.

[0067] Figure 4 An example of the piezoelectric layer 420 is described, and another example of the piezoelectric layer 420 is described as Figure 1 The piezoelectric layer 120 in Figure 4 The top view provided in the figure depicts an example of a piezoelectric layer 420, which includes a non-metallic frame 421, which can include an insulating material, including but not limited to ceramic. In the context of this example, the non-metallic frame 421 provides at least one of three functions: 1) it extends along the planar linear array 100 ( Figure 1 )'s elevation 101( Figure 1 ) and width 108( Figure 1 ) places the piezoelectric material 422 at the center; 2) it defines the planar linear array 100 ( Figure 1 ) (for example, Figure 1 , 101); and 3) it includes a grounding groove 423 to bring the ground connection from the front to the back of the piezoelectric layer 420 (forming part of the return signal path).

[0068] The non-metallic frame 421 surrounds the piezoelectric material 422 (e.g., PZT, PZT / SX, etc.). The piezoelectric layer 420 is used as a pure 1-3 composite for use in high-frequency transducers. In order to set the shape, size, and thickness of the piezoelectric material 422, the material itself can be pre-sliced ​​into segments or array elements of the desired shape, size, and thickness for the intended use. In a non-limiting example, the piezoelectric material 422 is cut to a precise size of 46.0 mm x 2.8 mm with an elevation width of 2.4 mm. The PZT is then bonded into the piezoelectric frame 421. With this structure, a pure 1-3 composite can be made and used for high-frequency transducers. The non-metallic frame 421 holds the piezoelectric material 422 in place so that the piezoelectric material 422 is located at a width of 108 ( Figure 1 ) and Elevation 101( Figure 1 ) is located at the center of the image. By using the width 108 ( Figure 1 ) and elevation 10( Figure 1 ) is arranged to control the width of the central opening (in which the piezoelectric material 422 is placed), and the non-metallic frame 421 defines a uniform elevation width. The non-metallic frame 421 also provides a connection from the piezoelectric material 422 to the flexible circuit (e.g., Figure 1 , 130) ground path. Fig.9A and 9B Electrical connectivity within a planar linear array is further discussed in the discussion of FIG. 9 (collectively referred to herein as FIG. 9 ).

[0069] The non-metallic frame 421 maintains the rigidity of the piezoelectric material 422 and improves the life of the piezoelectric material 422, which serves as the active area of ​​the piezoelectric layer 420. As described above, the size of the piezoelectric material 422 can be determined according to the intended use of the resulting transducer. Figure 4 In the example illustrated in FIG. 4 , the non-metallic frame 421 surrounds the piezoelectric material 422 on four sides, but in some examples, the non-metallic frame 421 surrounds the piezoelectric material 422 on two sides. In some examples, the non-metallic frame 421 positions the piezoelectric material 422 relative to the planar array stack (e.g., Figure 1 , 100) in width 108( Figure 1 ) and Elevation 101( Figure 1 ) so that the piezoelectric material 422 is located at the center. Figure 2 and 3 , 210 and 310), using an adhesive or epoxy that will not deteriorate during use of the resulting transducer, by having the support structure relative to the width 108 ( Figure 1 ) and Elevation 101( Figure 1 )The centrally located element can be attached to the supporting structure.

[0070] The size of the piezoelectric material 422 can be determined based on the intended use of the resulting transducer. The piezoelectric material 422 can vary in size, and in some examples, the piezoelectric material 422 is coupled to an acoustic lens (e.g., a corresponding Figure 2 and 3 , 211 and 311). The non-metallic frame 421 can be configured to hold the piezoelectric material 422 so that it is sized relative to the width 108 ( Figure 1 ) and Elevation 101( Figure 1 ) is located substantially parallel to the acoustic lens (e.g., corresponding to Figure 2 and 3 , 211 and 311) at the same location, but in the representative stack thickness 109 ( Figure 1 ) are located at different coordinates on the axis. Therefore, in these examples, the lens layer (e.g., the corresponding Figure 2 and 3 , 210 and 310) and the piezoelectric layer 420 is substantially stacked in a planar array (e.g., Figure 1 , 100) are parallel to each other.

[0071] like Figure 4 As shown in , the non-metallic frame 421 can include one or more grounding grooves 423. To machine the grounding grooves 421 in the non-metallic (e.g., ceramic) frame 421, as will be discussed later with respect to the method of manufacturing a planar array stack disclosed herein, in an example, a groove is drilled in the non-metallic frame 421, the groove is filled with a first conductive material metal (e.g., silver, gold), and the filled groove is coated with a second conductive material, creating the grounding grooves 423. These conductive materials can be the same, or they can vary. For example, the grounding grooves can be coated with gold and filled with a solution epoxy. Providing the grounding grooves 423 in the non-metallic frame 421 represents a simplified grounding connection for the array when compared to the grounding connections in existing arrays. When working with piezoelectric materials, machining the signal ground can be challenging because exposed electrodes are typically used, which can interfere with the expected planar quality of the array. In the example here, a non-metallic frame 421 acts as an insulator around the grounding trenches 423, which is able to be flush with the top surface of the piezoelectric layer 420, maintaining the planar (flat) quality of the array.

[0072] Returning to the piezoelectric material 422 itself, the piezoelectric material 422 includes one or more saw cuts cut into the pattern. The timing of cutting the pattern into the piezoelectric material 422 can vary. In some examples, the piezoelectric material 422 is patterned before the piezoelectric layer 410 is assembled. In other examples, the piezoelectric material 422 is patterned after the piezoelectric layer 410 is assembled. Different patterns can be selected depending on the intended use of the transducer. In other examples, the piezoelectric material 422 is patterned both before and after the piezoelectric layer 410 is assembled.

[0073] Figure 5 The illustration shows that a laser can be used to form different patterns in the piezoelectric material 422, for example, before or after the piezoelectric material 422 is integrated into the piezoelectric layer 420 by bonding the piezoelectric material 422 to the non-metallic frame 421 (including by bonding the non-metallic frame 421 to the piezoelectric material 422, or vice versa). The patterns include a first pattern 502, a second pattern 503, and a third pattern 504. The elevations 505 (e.g., elevations 101, Figure 1 ) and thickness 506 (e.g., stack thickness 109, Figure 1 ) is also shown in Figure 5 As will be appreciated by those skilled in the art, the piezoelectric material can be patterned using a conventional sub-slicing pattern, wherein the transducer element is bisected longitudinally along its center by a single sub-slicing saw kerf cut. Such a sub-slicing saw kerf cut has the same length as the transducer element. Those skilled in the art will appreciate that the width / height ratio of the transducer element should be less than or equal to the "golden ratio" of approximately 0.6 to minimize lateral vibration modes in the PZT. As will be appreciated by those skilled in the art, the piezoelectric material can be patterned using a conventional sub-slicing pattern, wherein the transducer element is bisected longitudinally along its center by a single sub-slicing saw kerf cut. Such a sub-slicing saw kerf cut has the same length as the transducer element. Figure 5 As shown in , each pattern includes a main kerf 507 (the aforementioned sub-slicing kerf) that subdivides the dielectric (e.g., piezoelectric) material. The main kerf 507 can be cut between each element according to the spacing. The sub-slicing kerf is cut in the middle of each element. In addition to the main kerf 507, the second pattern 503 also includes a square pattern, and the third pattern 504 also includes a parallelogram pattern. For example, these patterns can be used in a 90 micron pitch array. A laser (including but not limited to an excimer laser) can machine the piezoelectric material 422 in some examples to create these kerfs. For example, a laser can cut 8-10 micron kerfs in a piezoelectric material (such as a PZT ceramic) to a depth of ~100 microns, forming a kerf of approximately 35 microns in the piezoelectric material 422. In some examples, lasers are also used to perform back cutting to maintain uniformity of kerf width along vertical structures.

[0074] like Figure 1 As shown in , the planar linear array stack 100 can include an interposer frame 125 that houses one or more flexible circuits 130 . Figure 6 A structure 600 is described for securing a flexible circuit in a planar linear array stack. Figure 6 Such a structure 600, which is described as an exploded view in FIG. 1 , includes: the aforementioned inserter frame 625 (eg, Figure 1 , 125); the aforementioned flexible circuit 630 (for example, Figure 1 , 130); and an overmold 632, locking the flexible circuit 630 to the inserter frame 625. In some examples, the overmold 632 includes electrodes on its surface, and the electrodes can include conductive materials, such as metals (e.g., gold, silver). The electrodes can become channels, including but not limited to gold channels. For example, the overmold can include gold foil. The flexible circuit 630 includes traces (e.g., copper (Cu), gold and / or silver, etc.) of conductive material ( Figure 6 The flexible registration strip is not included in the Figure 6 and are discussed below, but in Figure 6 In this example, the interposer frame 625 is positioned directly beneath the one or more flexible circuits 630 , and the overmold 632 helps secure the one or more flexible circuits 630 to the interposer frame 625 .

[0075] Figure 7 and 8 Provide Figure 6 For easy understanding, Figure 7 Only the inserter frame 725 itself is described, since the inserter frame 625 is Figure 6 At the same time, Figure 8 A flexible circuit structure 800 is described, which includes a flexible registration strip 833 and a flexible circuit 830. In various examples of planar linear arrays described herein, the flexible registration strip 833 is positioned between the interposer frame 625 and the flexible bending frame 135 (e.g., Figure 1 ), the flexible bending frame 135 is substantially parallel to a portion of the one or more flexible circuits 830. Figure 8 As shown in FIG. 8 , in some embodiments of the planar linear arrays described herein, each flexible registration strip 833 connects four flexible circuits 830. The flexible registration strips 833 provide precise alignment (eg, linear alignment) for the array elements at 90 micron pitch.

[0076] 9 and 10 provide alternative views of the various elements of the planar linear array stack described herein (when viewed with reference to FIG. Figure 1 In some embodiments, the method for transmitting electrical signals from the inserter frame 625 ( Figure 6 ) is sent to the one or more flexible circuits 630 ( Figure 6) on the surface of the track structure (uniform scale conductive shape 950, 1050 (Figure 9, Fig.10 )) before providing these views. Fig. 9B Additional illustrations of electrical connections from the piezoelectric material to ground of the one or more flexible circuits 930 are provided. Additionally, Fig.9A The one or more flexible circuits 930 are shown before being bent. Fig. 9B The one or more flexible circuits 930 are shown after the one or more flexible circuits 930 are bent. Fig.10 )) are illustrated here as spheres, but spheres are provided as non-limiting examples, as shapes can include pyramids, cubes, etc. The shapes including uniformly scaled conductive shapes in the planar array stack can be uniform or mixed, and they can be distributed along the stack depth 109 axis ( Figure 1 ) have uniform height.

[0077] 9 and 10, starting from the bottom of a portion of a planar linear array 900, 1000 and moving upward (e.g., Figure 1 , from the lens layer 110 to the curved separator 145, along the stack thickness 109 axis), this array includes lens layers 910, 1010, and the lens layers 910, 1010 include acoustic lenses 911 with curvature 914. Above the top surface of the lens layers 910, 1010 are one or more matching layers 915, 1015. The lens bonding adhesive 934, 1034 bonds the upper surface of the lens layer 910 to the piezoelectric layer 920 or the matching layer 1015 to the piezoelectric layer 1020. The piezoelectric layer 920, 1020 includes: a piezoelectric material 922, 1022 with electrodes on both sides; a non-metallic frame 921, 1021; and a grounding groove 923, 1023. After the flexible circuit 930, 1030 is bent, the flexible circuit 930, 1030 is connected 947 to the ground electrode. This connection is Fig. 9B Described in more detail and illustrated in FIG.

[0078] The interposer frame 925, 1025 includes conductive electrodes and / or traces (e.g., gold, copper, silver) located above the piezoelectric layer 920, 1020 (relative to the stack thickness 109, Figure 1 ). Fig.9A and 10 , the flexible circuits 930, 1030 are illustrated before they are bent, which is why each flexible circuit 930, 1030 is overall parallel to the piezoelectric layer 920 (meaning, having different coordinates along the stack thickness 109 axis, but sharing coordinates with respect to the width 108 and elevation 101, Figure 1 ).exist Fig. 9B , the flexible circuit 930 is illustrated after the flexible circuit 930 has been bent. In this example, the interposer frame 925, 1025 includes conductive electrodes and / or traces (e.g., gold, copper, silver). The overmold 932, 1032 is located on a surface including an upper surface of the interposer frame 925. The overmold includes electrodes (e.g., gold) on its upper surface. Fig.10 As shown in FIG. 1 , the overmolded part 1032 structure includes: a separation ridge 1051; and grooves 1052, below the separation ridge 1051. These grooves 1052 are coated with a conductive material, including but not limited to gold.

[0079] The interposer frame 925, 1025 is electrically coupled to the one or more flexible circuits 930, 1030 via one or more uniform scale conductive shapes 950, 1050 coated with a conductive material (e.g., gold, silver, etc.). In this non-limiting example, the surface of the interposer frame 925, 1025 contacts the uniform scale conductive shapes 950, 1050 and includes one or more conductive tracks. The uniform scale conductive shapes 950, 1050 conduct electrical signals from the surface of the interposer frame 925, 1025 in contact with the uniform scale conductive shapes 950, 1050 to the tracks on the surface of the one or more flexible circuits 930, 1030 in contact with the uniform scale conductive shapes 950, 1050. Each shape can include a dielectric material and be uniformly coated with a conductive material. When the array is oriented as in the example of FIG. 9, the uniform scale conductive shapes 950 form a vertical electrical connection.

[0080] Fig. 9B The various elements of the planar linear array 900 are shown, but the focus is on the electrical connection from the piezoelectric layer 920 to the ground of the one or more flexible members 930 (at Fig.9A Described as connection 947). Fig. 9B An example of a portion of a planar linear array 900 is shown with the one or more flexible members 930 bent into their final configuration (for simplicity of illustration, Fig. 9B A single flexible member is shown to represent one or more flexible members). Fig. 9B Also included is a diagram of the insulating and conducting portions of the planar linear array 900. Fig. 9B , electrical path 941 illustrates connection 947 (e.g., Fig.9A ).

[0081] The electrical path 941 is a ground path that forms a return signal path. The electrical path 941 is illustrated and its path, which passes through the ground plane 939 of the one or more flexible members 930, through the conductive layer 943 on the interposer frame 925 (as previously discussed, as a conductive layer, the interposer frame 925 includes conductive electrodes and / or tracks (e.g., gold, copper, silver)) and is located in the ground groove 923 on the piezoelectric layer 920. The ground path (electrical path 941) advances from the ground groove 923 on the piezoelectric layer 920 to the non-metallic frame 921, through the conductive electrodes on the interposer frame 925, and to the one or more flexible members 930. The ground groove 923 includes a conductive material, including but not limited to epoxy resin. In this example, the interposer frame 925 includes: an electrically insulating material 946, including but not limited to epoxy resin; and a conductive material 949, which can also be epoxy resin. Conductive material 949 can be adjacent to electrical path 941, while electrically insulating material 946 bridges a portion of conductive layer 943 on interposer frame 925 and conductive material 949. The connection between conductive layer 943 on interposer frame (conductive layer 943 can include copper fingers 931) and the one or more flexible members 930 can be bridged by uniform scale conductive shape 950.

[0082] Fig.11 Provide traces on the surface of the interposer frame 925, 1025 to the one or more flexible circuits 930, 1030 (these traces are Fig. 9B A more detailed example of a connection 1100 (illustrated as ground plane 939 in FIG. 1 ) is shown. A uniform scale conductive shape 1150 is applied using bonding adhesive and positioned between the interposer frame and the flexible circuit. Specifically, the uniform scale conductive shape 1150 electrically connects each flexible circuit ( Fig.11 1137 on the substrate (not shown) and the tracks (e.g., gold tracks) on the interposer frame 1125. In this example, each shape 1150 comprises a dielectric material (e.g., glass, polymer) and is uniformly coated with a conductive material (e.g., copper, gold, silver, titanium, etc.).

[0083] Figure 12-14 The flexible bending frame 135 ( Figure 1 ) example. Fig.12 The flexible curved frame 1235 is shown assembled with certain elements of the planar linear array described herein, and Fig.13 These portions of the planar linear array are shown after a flexible bending frame 1335 is used to bend the flexible circuit 1330. Fig.14An enlarged view of the flexible flex frame 1435 is shown. The flexible flex frame 1235, 1335, 1435 can be attached to the top of the flexible circuit 1230, 1330, 1430. The flexible flex frame 1235, 1335, 1435 provides a consistent and reliable guide for bending the flexible circuits 1230, 1330, 1430 and locking their joints. To illustrate the array (e.g., Figure 1 , the orientation of the flexible bending frames 1235, 1335, 1435 within 100), Figure 12-14 Elements described in other figures are illustrated, such as lens layers 1210, 1310, 1410, overmolds 1232, 1332, 1432, interposer frames 1225, 1325, 1425, and flexible registration strips 1233, 1333, 1433. Typically, the flexible bending frames 1235, 1335, 1435 guide the flexible circuits 1230, 1330, 1430 when they are bent.

[0084] Back to Figure 1 In addition to the flexible bending frame 135 guiding the flexible circuit 130, in some embodiments of the present invention, the backing preform 140 also guides the flexible circuit 130 when a person (and a person or mechanical process) bends the flexible circuit 130. The backing preform 140 is shaped to accommodate the planar structure of the planar linear array 100. Because of the planar structure of the examples of the arrays described herein, the backing preform is simpler in structure and, therefore, easier to manufacture than other examples of existing non-planar arrays. Using the backing preform 140 described herein reduces cost and manufacturing complexity. As Figure 1 As shown in FIG. 1 and as previously described, both the flexible bending frame 135 and the inserter frame 125 have cavities 126, 136 (or for width 108 ( Figure 1 ) and Elevation 101( Figure 1 ) have similar or identical coordinates). The backing preform 140 is oriented so that it extends through the cavities 126, 136. Based on this placement, the backing preform 140 contacts a portion of the one or more flexible circuits 130.

[0085] The backing preform 140 and its orientation of the planar linear array of transducers disclosed herein are further illustrated in Fig.15 and 16 Medium (1540, 1640). Fig.15 The backing preform 1540 is shown during assembly of an example of a planar linear array of transducers disclosed herein, and Fig.1616. An example of a planar linear array of transducers disclosed herein is shown assembled to illustrate the relative orientation of the backing preform 1640. As part of the example of a planar linear array shown in both figures, Fig.15 and 16 Also illustrated are lens layers 1510, 1610 and an interposer frame using flexible registration strips 1533 to which one or more flexible circuits 1530, 1630 are attached, and overmolded parts 1532, 1632, as described earlier herein. Figure 1 Sample, Fig.15 and 16 The number of flexible circuits 1530, 1630 in FIG. 1 is provided as an example only. The number of flexible circuits 1530, 1630 and the number of flexible circuits 1530, 1630 attached to each flexible registration strip 1533, 1633 can vary. Fig.16 In FIG. 1 , the flexible circuit 1630 has not yet been bent using the flexible bending frames 1535, 1635. Fig.16 A piezoelectric layer 1620 oriented above the lens layer 1610 is included to illustrate the elements of this example of a planar linear array discussed herein and their relative placement to one another.

[0086] In some embodiments of the present invention, to reduce electromagnetic interference (EMI), a machine or person deposits a layer of conductive material on the backing preform 1540, 1640. For example, the backing preform 1540, 1640 can be wrapped with conductive tape (including but not limited to copper tape) to create an EMI shielding element and bridge the return signal to ground. Alternatively, in some embodiments, a layer of conductive material can be deposited just above the surface of the backing preform and just above the flexible bending frame. Fig.17 An example of a shielding element 1742 added to the example of the planar linear array described herein is illustrated. In this example, the shielding element 1742 is a conductive coating (e.g., copper) deposited on the upper surface of the backing preform 1740 and deposited on the upper surface of the flexible curved frame 1735.

[0087] Another element of the planar linear array described herein included in some embodiments is a curved divider 145 ( Figure 1 The bent separator 145 assists the person or machine assembling the planar linear array of transducers in making the one or more flexible circuits 130 ( Figure 1 ) bending and / or positioning the one or more flexible circuits 130 ( Figure 1 ). An individual or machine will bend the separator 145 ( Figure 1 ) is placed on the backing preform 140 ( Figure 1 ) above, so that when the one or more flexible circuits 130 ( Figure 1 ) is bent, the one or more flexible circuits 130 are substantially parallel to the stack thickness 109 axis. Return to Fig. 9B When the one or more flexible circuits 930 are bent, the first portion of each of the one or more flexible circuits 930 is bent along the elevation 101 ( Figure 1 ) is maintained parallel to the piezoelectric layer, while the second portion of the one or more flexible circuits 930 is along the elevation 101 ( Figure 1 ) is bent perpendicular to the piezoelectric layer. Figure 1 )The portion parallel to the piezoelectric layer includes copper fingers 931.

[0088] Fig.18 and 19 Examples of planar linear array stacks 1800, 1900 including curved dividers 1845, 1945 are illustrated from two different vantage points. Fig.18 An orthogonal view of a planar linear array stack 1800 is provided, and Fig.19 A front view of a planar linear array stack 1900 is provided. As shown in both figures, the planar linear array stack 1800, 1900 includes a lens layer 1810, 1910, and a piezoelectric layer 1820, 1920 is stacked on the lens layer 1810, 1910. As previously discussed, in certain embodiments of the planar linear array stack 1800, 1900, one or more matching layers separate the lens layer 1810, 1910 and the piezoelectric layer 1820, 1920. Although not depicted, as previously discussed, the lens layer 1810, 1910 can include both the acoustic lens itself and the lens support structure. Similarly, the piezoelectric layer 1820, 1920 can include both the piezoelectric material and the support or frame structure, and the support or frame structure is along the elevation 101 ( Figure 1 ) and width 108( Figure 1 ) and positions the piezoelectric material in substantially the same orientation as the acoustic lens on parallel planes. The piezoelectric layer 1820, 1920 can include a grounding groove. The interposer frame 1825, 1925, the overmold 1832, 1932, and the flexible registration strips 1833, 1933 combine to lock the flexible circuits 1830, 1930. The flexible bend frame 1835, 1935 and the backing preform 1540, 1640 guide the bending of the flexible circuits 1830, 1930, while the bend dividers 1845, 1945 are used to keep the flexible circuits 1830, 1930 in place after the flexible circuits 1830, 1930 are bent. The flexible circuits 1830, 1930 are bent so that a portion of each flexible circuit 1830, 1930 is substantially perpendicular to the width 108 ( Figure 1 ) axis, and the other portion is substantially parallel to the width 108 ( Figure 1). The curved dividers 1845, 1945 are adjacent to the top surface 1861, 1961 and at least two side surfaces 1862, 1962 of the backing preform 1540, 1640, typically surrounding a portion of these surfaces. Fig. 20 An example of a diagram of the curved divider 2045 by itself is described so that the shape of this element can be understood outside the context of a planar linear array.

[0089] Figure 1-20 Various aspects of some embodiments of planar linear arrays that can be integrated in ultrasound transducers are illustrated. Fig.21 2100 is a flow chart illustrating the manufacturing process discussed herein and Figure 1-20 and Fig. 22 Various aspects of some methods of planar linear arrays illustrated in FIG. The steps of the process described in the workflow 2100 can be accomplished by a personal and / or automated process, with the aid of various machines and manufacturing technologies. The steps provided are examples of various aspects of some embodiments of the present invention, and some examples may combine, omit and / or add one or more aspects. In order to Figure 1-20 The planar array stack described in the present invention manufactures a planar array stack of an ultrasonic transducer, forming a piezoelectric layer (2110) including a non-metallic frame and a piezoelectric material. In order to manufacture certain embodiments, in order to form the piezoelectric layer, the piezoelectric material is framed with a non-metallic material on at least two sides. The non-metallic material can be locked to a portion of the perimeter of the piezoelectric material. In some embodiments, in order to form the piezoelectric layer, one or more grounding grooves are also formed in the non-metallic material, the one or more grounding grooves are filled with a first conductive material (e.g., silver, gold), and the one or more grounding grooves are coated with a second conductive material (e.g., silver, gold). The first and second materials can be the same material or different materials. For some embodiments of the planar linear array, one or more electrodes are formed on the surface of the piezoelectric material.

[0090] To continue with workflow 2100, a lens support structure is formed (2120). The formed device will align the lens to the center position in the stack, but the lens formation workflow will be discussed later herein. The lens support device is also referred to as a lens support structure (see Figure 2 212 and Figure 3 312). Depending on the structure of the lens support device (also referred to as the lens support structure), which can be ceramic, the method of forming the structure will vary. In some examples, such as Figure 2 As shown in , the lens support structure includes a first rod 213a and a second rod 213b, so forming the lens support structure includes orienting the first rod and the second rod to be located on opposite sides of the lens 211. In some examples, such as in Figure 3In some examples, the lens support structure (lens support structure 312) is a frame, and forming the lens support structure includes orienting the frame around the perimeter of lens 314. In some examples, in addition to the curved separator, the planar linear array ( Figure 1 , 18 After all aspects of the planar linear array (as shown in Figures 1 and 19) are formed or positioned, the lenses in the planar linear array are added. Therefore, this workflow 2100 includes forming a lens support device, but does not necessarily include forming a lens, as the lens can be formed at different times during the manufacturing process.

[0091] In some examples, before the piezoelectric layer is formed, the piezoelectric material can be machined (e.g., laser machined) to include one or more saw cuts (see Figure 5 ). Thus, prior to forming the piezoelectric layer (2110), one or more saw cuts can be formed in the piezoelectric material, for example, by using an excimer laser. The saw cut patterns that can be formed vary, and can include, but are not limited to: cutting at least one saw cut in the piezoelectric material that subdivides the piezoelectric material to maintain an aspect ratio; and / or cutting a square pattern and / or a parallelogram pattern. Examples of these patterns are illustrated in Figure 5 middle.

[0092] Return to Fig.21 To continue with workflow 2100, one or more matching layers are formed between the lens layer and the piezoelectric layer (2140). The non-metallic material of the piezoelectric layer is coupled to an interposer frame (e.g., Figure 6 625 Figure 7 725)(2150). The interposer frame (as a frame, the interposer frame includes an opening) is electrically coupled to one or more flexible circuits (see, Figure 8 )(2160). These flexible circuits include traces. In some examples, overmolded parts and / or flexible registration strips are used (see, Figure 6-8 ) locks the flexible circuit to the interposer frame. The interposer frame is electrically coupled to the tracks by orienting a plurality of uniformly scaled conductive shapes on a surface of the interposer frame such that the uniformly scaled conductive shapes are in contact with the tracks and the interposer frame (2170). In some examples, such as Fig.11As shown in , the uniform scale conductive shapes 1150 can be applied with a bonding adhesive and oriented between the interposer frame and the flexible circuit so that the uniform scale conductive shapes 1150 electrically connect the traces (e.g., Cu fingers) 1137 on each flexible circuit and the traces (e.g., gold traces) on the interposer frame 1125. As previously discussed, in this example, each uniform scale conductive shape 1150 includes a dielectric material (e.g., glass, polymer) and is uniformly coated with a conductive material (e.g., copper, gold, silver, titanium, etc.).

[0093] Once the flex is secured to the interposer frame and electrical connectivity has been established via the uniformly scaled conductive shapes, the flexible bending frame (having an opening) is oriented substantially parallel to the first portion of the one or more flex circuits so that the second portion of each of the one or more flex circuits extends beyond the outer boundary of the interposer frame. It is around this outer boundary that the second portion will be bent (2180). Figure 12-14 Examples of flexible bending frames 1235, 1345, 1435 and their orientation within a planar linear stack during assembly of the planar linear stack are included. Bending of the flexible circuit is also guided by the backing preform. To enable bending, the backing preform is oriented so that it extends through openings in the inserter frame and the flexible bending frame (see, e.g., Figure 14-16 )(2190).

[0094] As previously discussed, the lens can be formed at various points in the workflow 2100. However, the lens can be formed in the lens support structure. Specifically, once the array is completed to a certain stage where the flexible circuit is attached and the array is backed to lock the structure (e.g., a backing preform), the lens can be inserted into the lens support structure and the curvature created in the lens by rotating the rod and rubbing the surface of the lens parallel to a certain depth. Alternatively, the lens can be added as the lens layer is added to the stack, but the curvature is created at this later time after the backing preform has been attached. Therefore, once the preform is attached, the curvature can be added and / or achieved in the lens (2192).

[0095] Fig. 22An example of a technique for forming a lens for use in a transducer including an example of a planar linear array stack described herein is illustrated. The resulting transducer will focus an ultrasound beam to a certain depth of the imaging field. The curvature 2216 of the lens provides this focusing. To form the curvature of the lens, a portion of the planar linear array stack 2200 is assembled, the portion including a lens layer (in this non-limiting example, the lens layer is simply the acoustic lens 2211), an inserter frame 2225, one or more flexible members 2230, a flexible curved frame 2235, and a backing preform 2240. Assembly of the planar linear array stack 2200 is completed by attaching the one or more flexible members 2230 and backing the structure with a backing preform 2240 (e.g., Fig.21 , 2110, -2910). Place the planar linear array 2200 in a fixture so that the acoustic lens 2211 is oriented upward (when aligned with Figure 1 This is the opposite vertical orientation of this element when compared to ). By rotating the rod and rubbing the exposed upper surface 2217 parallel to a certain depth, a curvature 2216 is created on the acoustic lens 2211.

[0096] Back to Fig.21 To further enable bending and support the flexible circuit once it is in a bent position, the separator is oriented above the upper surface of the backing preform and on a portion of both sides of the backing preform, wherein the sides of the backing preform are parallel to the upper surface of the backing preform (2194). The flexible member is bent around the outer boundaries of the separator and the flexible bending frame (2195). The resulting planar linear array can be placed in a housing for use with an ultrasound probe.

[0097] Advantages of the examples of linear planar arrays described herein and the manufacturing processes of these examples include, but are not limited to: simplifying manufacturing tools, eliminating lengthy manufacturing processes, reducing manufacturing difficulty, reducing reliance on operator skills, reducing failure rates, and reducing costs. When the arrays described herein are integrated into an ultrasonic transducer, the arrays described herein provide the advantages listed above without compromising yield, and therefore, provide substantially the same and / or improved fit, form, and function when compared to existing systems.

[0098] Embodiments of the present invention include ultrasonic transducers and methods of making and using such ultrasonic transducers. In some examples, the ultrasonic transducer includes a planar array stack. The planar array stack can include: a lens layer, including an acoustic lens and a lens support structure. A portion of the acoustic lens is locked to the lens support structure. The planar array stack can also include: a piezoelectric layer, including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounds the piezoelectric material on at least two sides, and the non-metallic frame is coupled to a portion of the lens support structure so that the acoustic lens and the non-metallic frame are oriented substantially parallel to each other. The ultrasonic transducer can also include: an interposer frame for arranging one or more flexible circuits, wherein the interposer frame is coupled to the non-metallic frame and coupled to the one or more flexible circuits via conductive elements in the non-metallic frame. The one or more flexible circuits are also included in this ultrasonic transducer.

[0099] In some examples of ultrasound transducers, the one or more flexible circuits and the interposer frame are electrically coupled to a ground electrode.

[0100] In some examples of ultrasound transducers, the lens support structure includes a first rod and a second rod. The first rod and the second rod are located on opposite sides of the acoustic lens.

[0101] In some examples of ultrasound transducers, the lens support structure includes a frame that surrounds a rectangular perimeter of the acoustic lens.

[0102] In some examples of ultrasound transducers, the lens support structure includes ceramic.

[0103] In some examples of ultrasound transducers, the acoustic lens includes a curvature, wherein the curvature has a minimum on a line parallel to the piezoelectric material in the planar array stack.

[0104] In some examples of ultrasound transducers, the acoustic lens includes a dielectric material.

[0105] In some examples of ultrasonic transducers, the piezoelectric material includes one or more kerfs; the kerfs include a pattern.

[0106] In some examples of ultrasonic transducers, the one or more kerfs include lines that subdivide the dielectric material to maintain an aspect ratio.

[0107] In some examples of ultrasound transducers, the pattern is selected from the group consisting of a square pattern and a parallelogram pattern.

[0108] In some examples of ultrasound transducers, the non-metallic frame includes one or more grounding grooves.

[0109] In some examples of the ultrasound transducer, at least one of the one or more ground trenches is filled with a first conductive material and, upon being filled, coated with a second conductive material.

[0110] In some examples of ultrasound transducers, a non-metallic frame surrounding the piezoelectric material is bonded to the outer periphery of the piezoelectric material using glue.

[0111] In some examples of ultrasound transducers, the ultrasound transducer includes: one or more matching layers located between the lens layer and the piezoelectric layer.

[0112] In some examples of ultrasound transducers, the piezoelectric layer includes electrodes on a surface proximate to the one or more matching layers.

[0113] In some examples of ultrasound transducers, the interposer frame is electrically coupled to the one or more flex circuits via a plurality of uniformly scaled conductive shapes coated with a conductive material.

[0114] In some examples of ultrasound transducers, the plurality of uniform-scale conductive shapes conduct electrical signals from a surface of the interposer frame in contact with the plurality of uniform-scale conductive shapes to traces on a surface of the one or more flexible circuits in contact with the plurality of uniform-scale conductive shapes.

[0115] In some examples of ultrasound transducers, each uniformly scaled conductive shape of the plurality of uniformly scaled conductive shapes includes a dielectric material.

[0116] In some examples of ultrasound transducers, each uniformly scaled conductive shape of the plurality of uniformly scaled conductive shapes is coated with a conductive material.

[0117] In some examples of ultrasound transducers, a surface of the interposer frame that contacts the plurality of uniformly scaled conductive shapes includes one or more conductive traces.

[0118] In some examples of ultrasound transducers, electrical connections of the plurality of uniformly scaled conductive shapes coated with a conductive material form perpendicular electrical connections between the interposer frame and the one or more conductive traces, the one or more conductive traces being oriented in parallel planes.

[0119] In some examples of an ultrasonic transducer, the ultrasonic transducer includes a frame positioned substantially parallel to a first portion of the one or more flexible circuits such that a second portion of each of the one or more flexible circuits is bent substantially perpendicular to a surface of the frame that is perpendicular to the planar array stack such that the frame and the lens layer are located on parallel horizontal planes.

[0120] In some examples of ultrasound transducers, the ultrasound transducer includes one or more flexible registration strips. Each flexible registration strip is positioned between the interposer frame and a frame positioned substantially parallel to the first portion of the one or more flexible circuits.

[0121] In some examples of ultrasound transducers, each of the one or more flexible circuits is attached to a flexible registration strip of the one or more flexible registration strips.

[0122] In some examples of the ultrasonic transducer, the frame disposed substantially parallel to the first portion of the one or more flexible circuits includes a first cavity, and the interposer frame includes a second cavity. In this example, the ultrasonic transducer also includes a backing preform extending through the first cavity and the second cavity in contact with a portion of the one or more flexible circuits.

[0123] In some examples of ultrasonic transducers, the backing preform is coated with a conductive tape.

[0124] In some examples of ultrasound transducers, the transducer includes a curved separator positioned over the backing preform such that a second portion of each of the one or more flexible circuits is substantially parallel to a surface of the curved separator that is perpendicular to the planar array stack.

[0125] In some examples of ultrasound transducers, the non-metallic frame centers the piezoelectric material relative to the height and width of the planar array stack.

[0126] In some examples of ultrasound transducers, the transducer includes an overmold that secures the one or more flexible circuits to the inserter frame.

[0127] In some examples of ultrasonic transducers, the overmold includes an electrode on at least one surface.

[0128] In some examples of ultrasonic transducers, the ultrasonic transducer includes a planar array stack, the planar array stack including: a lens layer including a lens; one or more matching layers located between the lens layer and the piezoelectric layer; and a piezoelectric layer including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounding the piezoelectric material on at least two sides. The transducer can also include: an interposer frame for accommodating one or more flexible circuits. The interposer frame is coupled to the non-metallic frame via conductive elements in the non-metallic frame and is coupled to the one or more flexible circuits. The transducer also includes the one or more flexible circuits.

[0129] In some examples of ultrasonic transducers, the ultrasonic transducer includes a planar array stack, the planar array stack including: a lens layer including a lens; and a piezoelectric layer including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounding the piezoelectric material on at least two sides, the non-metallic frame being coupled to a portion of the lens layer. The transducer can also include: an interposer frame for accommodating one or more flexible circuits, wherein the interposer frame is coupled to the non-metallic frame and coupled to the one or more flexible circuits via conductive elements in the non-metallic frame. The transducer can also include the one or more flexible circuits.

[0130] In some examples of a method of manufacturing a planar array stack of an ultrasonic transducer, the method includes: forming a piezoelectric layer including a non-metallic material and a piezoelectric material, wherein the forming includes framing the piezoelectric material with the non-metallic material on at least two sides. The method can also include: forming a lens support structure, wherein the lens support structure orients the acoustic lens in a central position relative to the width and elevation of the planar array stack. The method can also include: bonding the lens support structure to the piezoelectric layer so that the lens support structure and the piezoelectric layer are parallel relative to the width and elevation.

[0131] In some examples of the method, the lens support structure includes a first rod and a second rod, and forming the lens support structure includes orienting the first rod and the second rod to be located on opposite sides of the lens.

[0132] In some examples of the method, the lens support structure includes a frame, and forming the lens support structure includes orienting the frame around a perimeter of the lens.

[0133] In some examples of the method, the lens support structure includes ceramic.

[0134] In some examples of the method, the method includes forming one or more kerfs in the piezoelectric material.

[0135] In some examples of the method, forming the one or more kerfs includes cutting at least one kerf in the piezoelectric material, the at least one kerf subdividing the piezoelectric material to maintain an aspect ratio.

[0136] In some examples of the method, forming the one or more kerfs includes cutting a pattern of kerfs in the piezoelectric material.

[0137] In some examples of the method, the pattern is selected from the group consisting of a square pattern and a parallelogram pattern.

[0138] In some examples of the method, the method includes forming one or more grounding trenches in a non-metallic material.

[0139] In some examples of the method, the method includes: filling the one or more grounding trenches with a first conductive material. The method can also include: coating the one or more grounding trenches with a second conductive material.

[0140] In some examples of the method, forming the piezoelectric layer further includes: locking the non-metallic material to a portion of a perimeter of the piezoelectric material.

[0141] In some examples of the method, the method includes forming one or more matching layers between the lens layer and the piezoelectric layer.

[0142] In some examples of the method, forming the piezoelectric layer further includes: forming one or more electrodes on a surface of the piezoelectric material.

[0143] In some examples of the method, the method includes coupling a non-metallic material of the piezoelectric layer to an interposer frame.

[0144] In some examples of the method, the method includes electrically coupling an inserter frame to one or more flexible circuits, wherein a surface of each of the one or more flexible circuits includes a trace, wherein the inserter frame includes a first opening, wherein the electrical coupling includes locking the one or more flexible circuits to the inserter frame using an overmold, and wherein a surface of the overmold includes one or more electrodes.

[0145] In some examples of the method, the electrically coupling includes orienting a plurality of uniform-scale conductive shapes on a surface of an interposer frame. The method can also include electrically coupling the interposer frame to the traces by coupling the traces to the plurality of uniform-scale conductive shapes.

[0146] In some examples of the method, each uniform-scale conductive shape of the plurality of uniform-scale conductive shapes includes a dielectric material coated with a conductive material.

[0147] In some examples of the method, the method includes: orienting the flexible flex frame to be substantially parallel to the first portion of the one or more flexible circuits so that a second portion of each of the one or more flexible circuits extends beyond an outer boundary of the interposer frame, wherein the flexible flex frame includes a second opening.

[0148] In some examples of the method, electrically coupling the interposer frame to the one or more flexible circuits also includes: attaching each of the one or more flexible circuits to an alignment bar among a plurality of alignment bars; and orienting each of the plurality of flexible alignment bars so that it is positioned between the interposer frame and the flexible bending frame.

[0149] In some examples of the method, the method includes orienting the backing preform wherein the backing preform contacts a given portion of the one or more flexible members based on extending through the first opening and the second opening.

[0150] In some examples of the method, the method includes forming a lens in a lens support structure.

[0151] In some examples of the method, the method includes bending the second portion of each of the one or more flexible circuits to orient the second portion of each flexible circuit substantially perpendicular to a surface of the flexible bending frame.

[0152] In some examples of the method, the method includes orienting a separator above an upper surface of the backing preform and on a portion of two sides of the backing preform, wherein the two sides of the backing preform are parallel to the upper surface of the backing preform.

[0153] In some examples of the method, the method includes depositing a copper shield on an upper surface of the backing preform.

[0154] In some examples of the method, the method includes positioning the piezoelectric material at a central location in the planar array stack relative to the elevation and width using a non-metallic material.

[0155] The flowchart and block diagrams in the accompanying drawings illustrate the possible implementation architecture, function and operation of the system, method and computer program product according to various embodiments of the present invention. In this respect, each square block in the flowchart or block diagram may represent a module, section or part of an instruction including one or more executable instructions for realizing (one or more) specified logical functions. In some alternative implementations, the functions marked in the square blocks may not occur in the order marked in the accompanying drawings. For example, according to the functions involved, the two square blocks shown in succession may in fact be executed substantially in parallel, or these square blocks may sometimes be executed in the opposite order. It should also be noted that each square block in the block diagram and / or the flowchart illustration and the combination of the square blocks in the block diagram and / or the flowchart illustration can be implemented by performing a system based on special hardware for performing a specified function or action or performing a combination of special hardware and computer instructions.

[0156] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when used in this specification, the terms "include" and / or "comprise" specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or combinations thereof.

[0157] All apparatus or steps in the following claims plus corresponding structures, materials, actions, and equivalents of functional elements, if any, are intended to include any structure, material, or action for performing a function in conjunction with other claimed elements specifically claimed. The description of one or more embodiments has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the disclosed form. Many modifications and variations will be clear to those of ordinary skill in the art. The embodiments are selected and described to best explain various aspects and practical applications, and to enable others of ordinary skill in the art to understand various embodiments with various modifications suitable for the specific use envisioned.

Claims

1. An ultrasonic transducer, comprising: Planar array stack, including: a lens layer comprising an acoustic lens and a lens support structure, wherein a portion of the acoustic lens is secured to the lens support structure; and a piezoelectric layer including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounding the piezoelectric material on at least two sides, the non-metallic frame coupled to a portion of the lens support structure such that the acoustic lens and the non-metallic frame are oriented substantially parallel to each other; an interposer frame for housing one or more flexible circuits, wherein the interposer frame is coupled to the non-metallic frame and to the one or more flexible circuits via conductive elements in the non-metallic frame; and The one or more flexible circuits.

2. The ultrasonic transducer of claim 1, wherein the one or more flexible circuits and the interposer frame are electrically coupled to a ground electrode.

3. The ultrasonic transducer of claim 1, wherein the lens support structure comprises a first rod and a second rod, wherein the first rod and the second rod are located on opposite sides of the acoustic lens.

4. The ultrasound transducer of claim 1 , wherein the lens support structure comprises a frame that surrounds a rectangular perimeter of the acoustic lens.

5. The ultrasonic transducer of claim 1, wherein the lens support structure comprises ceramic.

6. The ultrasound transducer of claim 1, wherein the acoustic lens comprises a curvature, wherein the curvature has a minimum on a line, the line being parallel to the piezoelectric material in the planar array stack.

7. The ultrasonic transducer of claim 1, wherein the acoustic lens comprises a dielectric material.

8. The ultrasonic transducer of claim 1, wherein the piezoelectric material comprises one or more kerfs, wherein the kerfs comprise a pattern.

9. The ultrasonic transducer of claim 8, wherein the one or more kerfs comprise lines that subdivide the dielectric material to maintain an aspect ratio.

10. The ultrasonic transducer of claim 8, wherein the pattern is selected from the group consisting of a square pattern and a parallelogram pattern.

11. The ultrasonic transducer of claim 1 , wherein the non-metallic frame comprises one or more grounding grooves.

12. The ultrasonic transducer of claim 11, wherein at least one of the one or more ground trenches is filled with a first conductive material and, upon being filled, coated with a second conductive material.

13. The ultrasonic transducer of claim 1, wherein the non-metallic frame surrounding the piezoelectric material is bonded to an outer boundary of the piezoelectric material using an adhesive.

14. The ultrasonic transducer of claim 1, further comprising: One or more matching layers are located between the lens layer and the piezoelectric layer.

15. The ultrasound transducer of claim 15, wherein the piezoelectric layer comprises electrodes on a surface proximate to the one or more matching layers.

16. The ultrasound transducer of claim 1, wherein the interposer frame is electrically coupled to the one or more flex circuits via a plurality of uniformly scaled conductive shapes coated with a conductive material.

17. The ultrasonic transducer of claim 16, wherein the plurality of uniform-scale conductive shapes conduct electrical signals from a surface of an interposer frame in contact with the plurality of uniform-scale conductive shapes to traces on a surface of the one or more flexible circuits in contact with the plurality of uniform-scale conductive shapes.

18. The ultrasonic transducer of claim 16, wherein each uniformly scaled conductive shape of the plurality of uniformly scaled conductive shapes comprises a dielectric material.

19. The ultrasonic transducer of claim 16, wherein each uniformly scaled conductive shape of the plurality of uniformly scaled conductive shapes is coated with a conductive material.

20. The ultrasound transducer of claim 17, wherein a surface of the interposer frame in contact with the plurality of uniformly scaled conductive shapes comprises one or more conductive traces.

21. The ultrasonic transducer of claim 16, wherein the electrical connections of the plurality of uniformly scaled conductive shapes coated with a conductive material form perpendicular electrical connections between an interposer frame and the one or more conductive traces, the one or more conductive traces being oriented in parallel planes.

22. The ultrasonic transducer of claim 1, further comprising: A frame is positioned substantially parallel to the first portion of the one or more flexible circuits so that the second portion of each of the one or more flexible circuits is bent substantially perpendicular to a surface of the frame that is perpendicular to the planar array stack so that the frame and the lens layer are located on parallel horizontal planes.

23. The ultrasonic transducer of claim 22, further comprising: One or more flexible registration strips, wherein each flexible registration strip is positioned between the interposer frame and the frame positioned substantially parallel to the first portion of the one or more flexible circuits.

24. The ultrasound transducer of claim 23, wherein each of the one or more flexible circuits is attached to a flexible registration strip of the one or more flexible registration strips.

25. The ultrasonic transducer of claim 22, wherein the frame disposed substantially parallel to the first portion of the one or more flexible circuits comprises a first cavity and the interposer frame comprises a second cavity, the ultrasonic transducer further comprising: A backing preform extends through the first cavity and the second cavity in contact with a portion of the one or more flexible circuits.

26. The ultrasonic transducer of claim 25, wherein the backing preform is coated with a conductive tape.

27. The ultrasonic transducer of claim 25, further comprising: A curved separator is positioned over the backing preform such that the second portion of each of the one or more flexible circuits is substantially parallel to a surface of the curved separator that is perpendicular to the planar array stack.

28. The ultrasonic transducer of claim 1, wherein the non-metallic frame positions the piezoelectric material at a central location relative to the elevation and width of the planar array stack.

29. The ultrasonic transducer of claim 1, further comprising: An overmold is provided, wherein the overmold secures the one or more flexible circuits to the interposer frame.

30. The ultrasonic transducer of claim 29, the overmold comprising an electrode on at least one surface.

31. An ultrasonic transducer comprising: Planar array stack, including: a lens layer, comprising a lens; one or more matching layers positioned between the lens layer and the piezoelectric layer; and A piezoelectric layer includes a non-metallic frame and a piezoelectric material, wherein the non-metallic frame surrounds the piezoelectric material on at least two sides; an interposer frame for housing one or more flexible circuits, wherein the interposer frame is coupled to the non-metallic frame and to the one or more flexible circuits via conductive elements in the non-metallic frame; and The one or more flexible circuits.

32. An ultrasonic transducer comprising: Planar array stack, including: a lens layer including lenses; and a piezoelectric layer including a non-metallic frame and a piezoelectric material, the non-metallic frame surrounding the piezoelectric material on at least two sides, the non-metallic frame being coupled to a portion of the lens layer; an interposer frame for housing one or more flexible circuits, wherein the interposer frame is coupled to the non-metallic frame and to the one or more flexible circuits via conductive elements in the non-metallic frame; and The one or more flexible circuits.

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