Test arrangement for over-the-air transmission (OTA) testing of angled device under test in socket of device under test

Abstract

The present invention relates to a test arrangement for performing an over-the-air transmission (OTA) test on an angled device under test, where the test arrangement comprises a carrier structure, where the test arrangement comprises a socket of the device under test, the socket is coupled with the carrier structure, wherein the receptacle of the device under test is configured to establish an electrical connection with an inner surface of the angled device under test or with a connector disposed on the inner surface of the angled device under test.

Description

Technical Field

[0001] Embodiments according to the invention relate to a test arrangement for over-the-air (OTA) testing, in particular using a socket of a device under test.

[0002] Embodiments according to the present invention are directed to a socket for over-the-air (OTA) testing of an L-type antenna in a packaged module using automated test equipment. Background Art

[0003] The test arrangement can be used to test a device under test (e.g., an antenna in a packaged device) that is capable of receiving and / or emitting electromagnetic radiation. Typically, the device under test has a planar shape with two opposing surfaces so that, for example, the device under test can be mounted in a socket of the device under test (e.g., an over-the-air (OTA) socket for radiated near-field testing of a packaged antenna device) so that one of the surfaces faces the socket of the device under test and the other surface faces away from the socket of the device under test. For example, the device under test can be oriented so that the surface of the device under test with the antenna faces away from the socket of the device under test.

[0004] However, the shape of the device under test may not be planar. For example, the device under test may have an angled shape, such as an L-shape. In addition, the angled device may be configured to transmit and / or receive electromagnetic radiation on at least one exterior surface. For example, the angled device under test may have one or more antenna arrays (or other antennas) on one or both exterior surfaces. Thus, the angled device under test may have connectors and / or chips on the interior surface, which is typically a more difficult surface to access.

[0005] Angled DUTs present challenges in terms of coupling to the socket, making electrical contact with the socket, and orientation of the DUT, all of which impact test efficiency, accuracy, and repeatability.

[0006] Therefore, there is a need for a testing arrangement that improves the trade-off between testing efficiency, accuracy and repeatability. Summary of the invention

[0007] An embodiment of the present invention is directed to a test arrangement for performing over-the-air (OTA) testing on an angled (e.g., L-shaped) device under test (e.g., an L-shaped packaged antenna device under test), wherein the test arrangement includes a carrier structure (e.g., a printed circuit board (PCB) test fixture or a load board), wherein the test arrangement includes a socket of the device under test, wherein the socket of the device under test is coupled to the carrier structure (e.g., a PCB test fixture or a load board) (e.g., directly coupled, or coupled using an extender component and / or a PCB interposer between the carrier structure and the socket of the device under test), wherein the socket of the device under test is configured to establish an electrical connection with an inner surface of the angled (e.g., L-shaped) device under test (e.g., an inner surface of the angled device under test opposite to a second outer surface of the angled device under test) or a connector, wherein the connector is arranged on the inner surface of the angled (e.g., L-shaped) device under test.

[0008] The socket of the device under test allows the angled device under test to be coupled to the test arrangement. In addition, the electrical connection allows the transmission (unidirectional or bidirectional) of at least one of the following between the test arrangement and the device under test coupled to the socket of the device under test: electrical energy, one or more control signals, measurement signals, or signals. Since the electrical connection is established with the inner surface of the angled device under test, the outer surface can be arranged to face away from the socket of the device under test. This orientation allows the angled device under test to test itself (for example, testing its power consumption during transmission or interaction between antenna arrays of the angled device under test), and also allows the angled device to be tested using one or more external antenna structures (for example, using a measurement antenna that wirelessly receives signals transmitted by the angled device under test, and / or using a test antenna that transmits signals wirelessly received by the angled device under test). The design of the socket of the device under test allows for advantageous placement of one or more antenna arrays (or one or more other antennas, such as one or more single antennas) relative to one or more external antenna structures (e.g., one or more test antenna structures) contained within one or more external surfaces of the angled device under test. Thus, one or more external antenna structures (e.g., one or more antennas or antenna arrays for testing the device under test, or one or more transmit paths of the device under test, or one or more receive paths of the device under test) can be arranged such that the angled antenna device is located between the socket of the device under test and the one or more external antenna structures. Furthermore, the external surface of the angled device under test can thereby be mechanically contacted in order to maintain the angled device under test coupled to the socket of the device under test (e.g., by pressing the angled device under test into the socket of the device under test).

[0009] According to an embodiment, the socket of the device under test is configured to position the angled device under test so that a first outer surface (e.g., a surface including a radiating structure) of the angled (e.g., L-shaped) device under test is spaced apart from a surface (e.g., a main surface) of a carrier structure (e.g., a load board), and so that a surface normal direction of the first outer surface of the angled (e.g., L-shaped) device under test is parallel to the surface of the carrier structure (e.g., the main surface of the load board) within an error range of ±15 degrees.

[0010] It has been recognised that the design of the socket of the device under test allows for carrying the device under test such that a surface normal of a first outer surface of the device under test is substantially parallel to a surface of a carrier structure. Thus, an antenna array or one or more antennas which may be arranged on the first outer surface of the device under test may have a transmission direction (e.g. the direction of a main lobe) which is at least substantially parallel to the surface of the carrier structure. Thus, the position of an antenna structure (e.g. of a test antenna for testing the device under test) may be selected along the surface of the carrier structure. Such a placement of an antenna structure (e.g. of a test antenna) is mechanically advantageous, since the carrier structure may serve as a carrier for the antenna structure. For example, the surface of the carrier structure may be used as a guide for determining the position and / or orientation of the antenna structure.

[0011] Since the first outer surface is arranged to be spaced apart from the surface of the carrier, interactions with the surface of the carrier (eg, the surface of the carrier structure), such as short circuits, reflections, and interferences, may be reduced or eliminated.

[0012] According to an embodiment, the socket of the device under test is configured to position the angled device under test so that the second outer surface (e.g., a surface including a radiating structure) of the angled (e.g., L-shaped) device under test faces away from the carrier structure, and so that the surface normal of the second outer surface of the angled (e.g., L-shaped) device under test is perpendicular to the surface of the carrier structure (e.g., a load board) within an error range of ±15 degrees.

[0013] The design of such a socket for a device under test allows efficient testing of a device under test, which includes antenna structures on two outer surfaces. It is recognized that the design of the socket for the device under test allows the device under test to be carried so that the surface normal direction of the second outer surface of the device under test can be substantially perpendicular to the surface of the carrier structure. Therefore, the antenna array or one or more antennas that may be arranged on the second outer surface of the device under test may have a transmission direction (e.g., the direction of the main lobe) that is at least substantially perpendicular to the surface of the carrier structure. However, it is recognized that it is possible to reasonably place an external antenna (e.g., a test antenna) so that it is well aligned with the antenna structure on the second outer surface of the device under test.

[0014] Furthermore, it has been appreciated that the design of the DUT receptacle described above allows for application of a force to the second outer surface (eg for holding an angled DUT) directed at least substantially perpendicular to the surface of the carrier structure.

[0015] According to an embodiment, an area of ​​a carrier structure (e.g., a load board) has no power plane and / or no ground plane, and the area is adjacent to (e.g., with a gap between the two) the first outer surface of the angled device under test, (e.g., an area of ​​the carrier structure (e.g., a load board) that is adjacent to a projection of an outward (facing outward) surface normal of the first outer surface of the angled device under test on the load board). The adjacent area can be arranged in a half space through a socket of the device under test or the device under test, which space includes the first outer surface. The adjacent area can be adjacent to (e.g., with a gap between the two) the first outer surface of the angled device under test (e.g., an area adjacent to a projection of an outward (facing outward) surface normal of the first outer surface of the angled device under test on the carrier structure).

[0016] It is recognized that the power plane and / or the ground plane may negatively impact the reception and / or transmission (e.g., beam forming) of electromagnetic radiation by the device under test. Since there is no power plane and / or no ground plane in the adjacent area, the impact on electromagnetic radiation may be reduced, thereby improving the accuracy of the test of the device under test at an angle (e.g., where the antenna structure is arranged on the first outer surface).

[0017] According to an embodiment, an area of ​​the carrier structure (e.g., a load board) is free of metallization, which is adjacent to (e.g., with a space between) the first outer surface of the angled device under test (e.g., an area of ​​the carrier structure (e.g., a load board) that is adjacent to a projection of an outward (outward-facing) surface normal of the first outer surface of the angled device under test onto the carrier structure (e.g., a load board).

[0018] It has been recognized that metallization of adjacent areas may negatively impact transmission and / or reception of electromagnetic radiation (e.g., beam forming), for example where the antenna structure is arranged on the first outer surface. Since adjacent areas are free of metallization, the impact on electromagnetic radiation may be reduced, and the accuracy of testing of angled devices under test may be improved.

[0019] According to an embodiment, the absorbing material is disposed on a carrier structure (e.g., a load plate) in an area adjacent to (e.g., with a space therebetween) the first outer surface of the angled device under test (e.g., in an area adjacent to a projection of an outward (outwardly facing) surface normal of the first outer surface of the angled device under test on the carrier structure (e.g., load plate). The absorbing material may include a radio frequency absorbing material (e.g., a rubberized foam material impregnated with carbon and / or iron).

[0020] The absorbing material reduces reflections and / or interference. Thus, for example in case the antenna structure is arranged on the first outer surface, the accuracy of the test of an angled device under test may be improved.

[0021] In accordance with an embodiment, the socket of the device under test is configured to position the angled device under test such that a spacing between a first outer surface of the angled device under test and a carrier structure (e.g., a load board) is at least 2 wavelengths (e.g., a free space wavelength, or a wavelength in a medium between the first outer surface of the angled device under test and the carrier structure) of a lowest operating frequency of the angled device under test (e.g., a lowest operating frequency of a packaged antenna module (AIP) constituting or included in the device under test).

[0022] It has been recognised that at such a distance, effects on transmission and / or reception (eg beam forming, reflections, standing wave formation and interference) of one or more antenna arrays arranged at the first outer surface and resulting from the carrier structure are significantly reduced.

[0023] According to an embodiment, the socket of the device under test is attached to (e.g., arranged on) a daughterboard, which is mounted to a carrier structure (e.g., a test fixture printed circuit board (PCB) or a load board), with a certain spacing between the daughterboard and the load board (e.g., wherein the spacing between the daughterboard and the load board is provided using a reinforcement member, and wherein the electrical connection between the daughterboard and the load board is provided using, for example, an electrical connector (e.g., using an array connector, suitable for digital / power signals, and optionally also suitable for intermediate frequency RF signals)).

[0024] The daughterboard allows for easier upgrading of older test arrangements and switching between sockets of different devices under test by using different daughterboards. In addition, the spacing between the daughterboard and the load board establishes a spacing between the angled device under test and the carrier structure (e.g., at least two wavelengths of the lowest operating frequency of the angled device under test). This spacing can be particularly reliably established, for example, by using reinforcements. The daughterboard can further support electrical wiring, auxiliary circuits, and connectors. For example, the daughterboard can support a coaxial connector that can be electrically connected to the socket of the device under test for achieving an electrical connection with the device under test when coupled to the socket of the device under test.

[0025] According to an embodiment, the test arrangement includes a first antenna or antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), which is configured to receive signals radiated from a first outer surface of an angled device under test and / or is configured to transmit signals to be received at the first outer surface of the angled device under test.

[0026] The first antenna or antenna structure allows an over-the-air connection to be established with the device under test in a socket of the device under test. Thus, the first antenna or antenna structure allows the device under test to be tested. The socket of the device under test allows the device under test to be positioned in a defined manner such that the first antenna or antenna structure can be accurately oriented relative to the angled device under test (or such that an accurate alignment between the first antenna or antenna structure and the angled device under test can be achieved).

[0027] According to an embodiment, the test arrangement includes a first antenna or antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), wherein the aperture of the first antenna or antenna structure is arranged at a position at a certain distance from a first outer surface of the angled device under test, so that (e.g., at least when the second antenna or antenna structure is placed in an operating position) the surface normal of the first outer surface of the angled device under test extends through the aperture of the first antenna or antenna structure.

[0028] The first outer surface may have a main lobe or be configured to transmit and / or receive a main lobe in a direction perpendicular to the first outer surface (e.g., by beamforming). By arranging the surface normal of the first outer surface to pass through the aperture of the first antenna or antenna structure (or in other words, by placing the first antenna so that the surface normal extends through the aperture of the first antenna), the reception and / or transmission of the first antenna or antenna structure can be improved, and good electromagnetic coupling between the first antenna or antenna structure and the antenna of the device under test can be achieved.

[0029] According to an embodiment, the first antenna or antenna structure is mounted to have a fixed position relative to the socket of the device under test.

[0030] Such a fixed position allows repeated coupling and testing of multiple angled devices under test, thereby improving the accuracy and repeatability of the test. In addition, it should be noted that using the above arrangement, the first antenna or antenna structure may not be in the operating path in some cases, so the first antenna or antenna structure does not need to be removed when the operator changes the device under test.

[0031] In accordance with an embodiment, the first antenna or antenna structure (or the second antenna or antenna structure) is mechanically attached to an arm of an operator (e.g., the arm is configured to insert an angled device under test into a socket of the device under test) such that the first antenna or antenna structure (or the second antenna or antenna structure) is movable.

[0032] The arm allows the first antenna or antenna structure (or second antenna or antenna structure) to be movable, which makes it possible to remove the first antenna or antenna structure (or second antenna or antenna structure) (e.g., to more easily couple the angled device under test to the receptacle of the device under test) or realign the first antenna or antenna structure (or second antenna or antenna structure). Where the operator is configured to insert the angled device under test into the receptacle of the device under test, the operator can facilitate coupling and positioning of the first antenna or antenna structure (or second antenna or antenna structure) during or after coupling the angled device under test to the receptacle of the device under test.

[0033] According to an embodiment, the first antenna or antenna structure (or the second antenna or antenna structure) is configured to be connected to a signal source and / or a signal receiver via a blind-mate microwave connection (for example, via a blind-mate waveguide connection) when an operator places the first antenna or antenna structure (or the second antenna or antenna structure) in an operating position (or equivalently, when the operator inserts an angled device under test into a test socket, or when the operator pushes the device under test into the test socket).

[0034] The signal source and / or signal receiver enable the first antenna or antenna structure (or the second antenna or antenna structure) to transmit (e.g., for reception by the antenna or antenna array of the angled device under test) and / or receive (e.g., transmitted by the antenna or antenna array of the angled device under test) signals, thereby facilitating testing of the angled device under test. The blind-mate microwave connection facilitates (e.g., manual and / or automatic) coupling between the signal source and / or signal receiver and the first antenna or antenna structure (or the signal source and / or signal receiver and the second antenna or antenna structure).

[0035] According to an embodiment, the test arrangement includes a second antenna or antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), which is configured to (e.g., at least when the second antenna or antenna structure is placed in an operating position) (or equivalently, when an operator inserts the angled device under test into the test socket, or when the operator pushes the device under test into the test socket) receive signals radiated from a second outer surface of the angled device under test and / or transmit signals to be received at the second outer surface of the angled device under test.

[0036] The second antenna or antenna structure allows the antenna structure and / or the device under test to be tested at the second outer surface. The second antenna or antenna structure benefits from the orientation of the second outer surface defined by the receptacle of the device under test. The first antenna or antenna structure and the second antenna or antenna structure allow the device under test to be tested (e.g., simultaneously or sequentially) using signals transmitted and / or received by the first and second outer surfaces without recoupling the angled device under test in a different orientation (e.g., at a different receptacle of the device under test).

[0037] According to an embodiment, the test arrangement includes a second antenna or antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), wherein the aperture of the second antenna or antenna structure is arranged at a position at a certain distance from a second outer surface of the angled device under test, so that (e.g., at least when the second antenna or antenna structure is placed in an operating position) (or equivalently, when an operator inserts the angled device under test into a test socket, or when the operator pushes the device under test into the test socket) a surface normal of the second outer surface of the angled device under test extends through the aperture of the second antenna or antenna structure.

[0038] The second outer surface may have a main lobe or be configured to transmit and / or receive (e.g., by beamforming) a main lobe in a direction perpendicular to the second outer surface. By arranging the surface normal of the second outer surface to pass through the aperture of the second antenna or antenna structure (or in other words, by placing the second antenna so that the surface normal extends through the aperture of the second antenna), the reception and / or transmission of the second antenna or antenna structure can be improved, and good electromagnetic coupling between the second antenna or antenna structure and the antenna of the device under test can be achieved.

[0039] According to an embodiment, the second antenna or antenna structure is mechanically attached to an arm of an operator (e.g., the operating arm is configured to insert the angled device under test into a socket of the device under test) such that the second antenna or antenna structure is movable. The first antenna or antenna structure and the second antenna or antenna structure may, for example, be attached to the same / common arm, or may be attached to respective arms.

[0040] The arm allows the second antenna or antenna structure to be movable, which makes it possible to remove the second antenna or antenna structure (for example, to more easily insert / couple the angled device under test into the receptacle of the device under test) or realign the second antenna or antenna structure. In the case where the operator is configured to insert the angled device under test into the receptacle of the device under test, the operator facilitates coupling and positioning of the first antenna or antenna structure during coupling of the angled device under test to the receptacle of the device under test. In the case of a common arm, the first antenna and the second antenna structure can be arranged in a predetermined orientation for facilitating orientation of the first antenna and the second antenna structure relative to the first and second outer surfaces. In the case of separate arms, a customized orientation of the first antenna and the second antenna structure can be achieved.

[0041] According to an embodiment, the second antenna or antenna structure is part of a push rod for pushing the angled device under test into the socket of the device under test, or the second antenna or antenna structure is configured to be movable together with the push rod for pushing the angled device under test into the socket of the device under test (for example, the push rod is arranged so that when the device under test is inserted into the socket of the device under test, the push rod or a portion of the push rod is located between the second antenna or antenna structure and the second outer surface of the angled device under test) (wherein, and / or for example, the push rod is arranged so that when the angled device under test is inserted into the socket of the device under test, the push rod or a portion of the push rod is located between the first antenna and the first outer surface of the angled device under test).

[0042] The second antenna or antenna structure is movable with the push rod and can thus be moved (e.g., for easier coupling of the angled device under test to the socket of the device under test) or realigned (e.g., by adjusting its orientation). Since the push rod is configured to push the angled device under test into the socket of the device under test, the push rod can facilitate coupling and positioning of the second antenna or antenna structure during coupling of the angled device under test to the socket of the device under test.

[0043] According to an embodiment, the second antenna or antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection) when an operator places the second antenna or antenna structure in an operating position (or equivalently, when an operator inserts an angled device under test into a test socket, or when an operator pushes the device under test into the test socket).

[0044] The connection to the signal source and / or signal receiver enables the second antenna or antenna structure to transmit (e.g., for reception by the antenna or antenna array of the angled device under test) and / or receive (e.g., transmitted by the antenna or antenna array of the angled device under test) signals, thereby facilitating testing of the angled device under test. The blind-mate microwave connection can facilitate (manually and / or automatically) coupling between the signal source and / or signal receiver and the second antenna or antenna structure.

[0045] According to an embodiment, the socket of the device under test includes an angled recess or an angled notch configured to support and / or align the angled device under test. The angled recess or the angled notch may have side walls at one or both ends thereof.

[0046] The angled recess or angled notch has two (or more) abutment surfaces (e.g., angled) that can abut against the first inner surface and the second inner surface, respectively. These abutment surfaces can (at least partially) achieve a predetermined orientation and / or position of the angled device under test. The predetermined orientation and / or position of the angled device under test can facilitate establishing electrical connections and improve the repeatability and accuracy of testing. One or more optional side walls can further limit lateral movement of the angled device under test.

[0047] According to an embodiment, the socket of the device under test is arranged so that the second inner surface of the angled device under test (opposite to the second outer surface of the angled device under test) is spaced apart from the carrier structure (e.g., load board) by at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths of the lowest operating frequency of the angled device under test (e.g., at the lowest operating frequency of a package antenna module (AIP) constituting the device under test or included in the device under test), or at least 3 wavelengths, or at least 4 wavelengths (e.g., free space wavelength, or at the lowest operating frequency of the angled device under test) wavelength in the medium between the first outer surface of the device under test and the carrier structure) (for example, preferably, the edge of the first outer surface is spaced from the load board by at least 10 mm, or at least 20 mm, or at least the lowest operating frequency of the angled device under test, for example, 2 times the wavelength, or at least 3 times the wavelength, or at least 4 times the wavelength, for example, the free space wavelength, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure, the lowest operating frequency of a packaged antenna module (AIP) constituting or included in the device under test).

[0048] It has been recognized that such a spacing significantly reduces the impact of the carrier structure on the characteristics of one or more antenna structures of the device under test (e.g., reflection, beamforming, and interference), or generally on circuits on the second inner surface and / or the second outer surface (e.g., antenna structures, signal transmission circuits, or silicon chips for signal conversion, e.g., converting intermediate frequency signals into millimeter wave signals and vice versa).

[0049] According to an embodiment, the height of the socket of the device under test is at least 10 mm, or at least 30 mm, or at least 45 mm, so that the second inner surface of the angled device under test (opposite the second outer surface of the angled device under test) is at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths (e.g., at the lowest operating frequency of the angled device under test) (e.g., at the lowest operating frequency of the package antenna module (AIP) constituting the device under test or included in the device under test) from the carrier structure (e.g., a load board). free space wavelength, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure), (e.g., preferably, the edge of the first outer surface is spaced from the load board by at least 10 mm, or at least 20 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths, of the lowest operating frequency of the angled device under test, e.g., the lowest operating frequency of a packaged antenna module (AIP) constituting or included in the device under test, e.g., the free space wavelength, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure).

[0050] It has been recognized that such a spacing significantly reduces the impact of the carrier structure on the characteristics of one or more antenna structures of the device under test (e.g., reflection, beamforming, and interference), or generally on the circuits of the second inner surface and / or the second outer surface (e.g., antenna structures, signal transmission circuits, or silicon chips for signal conversion, e.g., converting intermediate frequency signals into millimeter wave signals and vice versa).

[0051] According to an embodiment, the socket of the device under test includes one or more coaxial spring pins (the coaxial spring pins may, for example, extend from a lower surface of the socket of the device under test that contacts the load board to an upper surface of the socket of the device under test that contacts the second inner surface of the angled device under test) so as to establish an electrical connection between a carrier structure (e.g., a load board) and the angled device under test (e.g., a first end of the coaxial spring pin may contact a pad on the load board, and a second end of the coaxial spring pin may contact a pad on the angled device under test).

[0052] The spring pins are typically compressible and allow the socket of the device under test to establish a reliable electrical connection with the device under test when the device under test is coupled to the socket of the device under test (e.g., when pushed into the socket of the device under test by an operating arm / push rod). For example, a coaxial spring can achieve a high-frequency interconnection with the socket of the device under test.

[0053] According to an embodiment, an extender structure (eg, including an extender and a PCB interposer) is arranged between a carrier structure (eg, a load board or a PCB test fixture) and a socket of a device under test.

[0054] The expander allows separation of the function of establishing an electrical connection to the device under test and the function of implementing the spacing between the carrier structure and the device under test. Thus, for example, the socket of the same device under test can be used in combination with multiple expanders with different heights. The structure (or circuit) for establishing an electrical connection to the device under test can be mainly or completely implemented in the socket of the device under test, allowing a simpler design of the expander. An optional PCB interposer can, for example, allow rewiring between electrical contacts of different geometries of the socket of the device under test and the expander.

[0055] In accordance with an embodiment, an expander structure includes an expander component, wherein the expander component includes one or more coaxial spring pins (e.g., the spring pins extend from a lower surface of the expander component that contacts a carrier structure (e.g., a load board) to an upper surface of the expander component that contacts a PCB interposer or a socket of a device under test) so as to establish an electrical connection between the carrier structure (e.g., the load board) and an angled device under test (e.g., wherein a first end of the coaxial spring pin can contact a pad on the load board and wherein, for example, a second end of the coaxial spring pin can contact a pad on the PCB interposer, which is located between the expander component and the socket of the device under test).

[0056] The extender assembly provides spacing between the socket of the device under test and the carrier structure, wherein the coaxial spring pins provide electrical contact that can cover the distance over the space provided by the extender. The coaxial spring pins also provide an electrical interface compatible with the socket of the device under test, which is configured to receive the device under test pushed inward, thereby improving compatibility with other / older carrier structures.

[0057] According to an embodiment, the test arrangement includes at least two sockets of the devices under test, which are configured to respectively carry respective angled devices under test (e.g., two identical devices under test), wherein the sockets of the at least two devices under test are arranged (e.g., back to back) to position the respective angled devices under test so that the first outer surfaces of the respective angled devices under test are aligned in opposite (facing away) directions, respectively.

[0058] A test arrangement with at least two sockets of the devices under test allows testing of more than one device under test at one time (e.g., simultaneously (or sequentially); for example, within one operation cycle of the operating arm placing the device under test in the socket of the device under test). In addition, since the first outer surfaces of the angled devices under test are aligned in opposite (dividing) directions, interference between signals transmitted and / or received at the respective first outer surfaces can be reduced.

[0059] According to an embodiment, the test arrangement includes at least two rows (e.g., parallel rows) of sockets of the devices under test, which are configured to respectively carry respective angled devices under test, wherein the sockets of the devices under test in at least two rows are arranged (e.g., back to back; for example, the sides of the sockets of the devices under test where the first outer surfaces of the devices under test are located face away from each other) to position the respective angled devices under test so that the respective first outer surfaces of the angled devices under test face opposite (facing away) directions, respectively.

[0060] This arrangement improves the trade-off between arranging the devices under test at a high density and reducing interference between signals transmitted and / or received at the respective first outer surfaces.

[0061] According to an embodiment, a test arrangement for performing over-the-air (OTA) testing of an angled (e.g., L-shaped) device under test (e.g., an L-shaped packaged antenna device under test) includes a carrier structure (e.g., a PCB test fixture or a load board). The test arrangement also includes a socket of the device under test, the socket being coupled to the carrier structure (e.g., a PCB test fixture or a load board) (e.g., directly or using an extender component and / or a PCB interposer between the carrier structure and the socket of the device under test), wherein the socket of the device under test is configured to establish an electrical connection with an inner surface of the angled (e.g., L-shaped) device under test (e.g., an inner surface of the angled device under test that is opposite to a second outer surface of the angled device under test) or a connector, the connector being arranged on the inner surface of the angled (e.g., L-shaped) device under test, wherein the socket of the device under test is configured to be positioned with An angled device under test is provided such that a first outer surface (e.g., a surface including a radiating structure) of the angled (e.g., L-shaped) device under test is spaced apart from a surface (e.g., a main surface) of a load board, and a surface normal of the first outer surface of the angled (e.g., L-shaped) device under test is parallel to the surface (e.g., the main surface) of the load board within an error range of ±15 degrees, and a second outer surface (e.g., a surface including a radiating structure) of the angled (e.g., L-shaped) device under test is away from the load board, and a surface normal of the second outer surface of the angled (e.g., L-shaped) device under test is perpendicular to the surface of the load board within an error range of ±15 degrees.

[0062] It has been recognized that such an arrangement of the first outer surface and the second outer surface achieves a better compromise between accessibility of the antenna structure for testing and reducing the influence of the surface of the carrier structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] The accompanying drawings are not necessarily drawn to scale, and emphasis is generally placed on illustrating the principles of the invention. In the following description, various embodiments of the invention will be described in conjunction with the following drawings, in which:

[0064] Figure 1 A schematic cross-sectional view of a test arrangement for performing over-the-air (OTA) testing of an angled device under test is shown;

[0065] Figure 2A A schematic cross-sectional view of a first example of an angled device under test is shown;

[0066] Figure 2B A schematic cross-sectional view of a second example of an angled device under test is shown;

[0067] Figure 3 shows a perspective view of an angled device under test;

[0068] Figure 4 Shows Figure 3 a simulation result of a far field emitted by an antenna element of a first antenna array on a first outer surface of a device under test;

[0069] Figure 5 shows a perspective view of an angled device under test;

[0070] Figure 6 Shows Figure 5 Simulation results of far fields emitted by antenna elements of a first antenna array of a first external surface antenna array of the device under test depicted in;

[0071] Figure 7 shows a schematic cross-sectional view of another example of a test arrangement with a device under test;

[0072] Figure 8 A perspective view showing an example of a socket of a device under test;

[0073] Fig. 9 A schematic diagram showing another example of a test arrangement with a device under test;

[0074] Fig.10 A schematic diagram showing another example of a test arrangement with a device under test;

[0075] Fig.11 shows a top view of another example of a test arrangement with multiple devices under test;

[0076] Fig.12 shows a top view of another example of a test arrangement with multiple devices under test;

[0077] Fig.13A A perspective view showing an example of a device under test; and

[0078] Fig. 13B Shows Fig.13A A perspective view of the device under test depicted in FIG. DETAILED DESCRIPTION

[0079] In the following description, the same or equivalent elements or elements having the same or equivalent functions will be denoted by the same or equivalent reference numerals even if they appear in different drawings.

[0080] In the following description, a large amount of details are provided to more fully explain the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other cases, in order not to obscure the embodiments of the present invention, known structures and devices are shown in block diagram form rather than in detailed form. In addition, unless otherwise specified, the features of the different embodiments described herein can be selectively combined with each other.

[0081] Figure 1 A schematic cross-sectional view of a test arrangement 100 for performing an over-the-air (OTA) test of an angled device under test 140 is shown. The test arrangement 100 includes a carrier structure 110 and a socket 130 of the device under test coupled to the carrier structure 110. The socket 130 of the device under test is configured to be in contact with an inner surface 142 of the angled device under test 140 or with a connector ( Figure 1 Electrical contact is established (not shown).

[0082] The carrier structure 110 can be a printed circuit board (PCB) test fixture or a load board. For example, the carrier structure 110 can be or include at least one area having a flat surface. The socket 130 of the device under test can be arranged on top of the carrier structure 110 (e.g., on a flat surface) or can be coupled to the carrier structure 110 through one or more intermediate devices or structures. An area of ​​the carrier structure 110 (e.g., a load board) adjacent to the first outer surface 144a of the angled device under test 140 (e.g., with a gap between the two) has no power plane and / or no ground plane. The area can be located in a half space separated by a plane passing through the socket 130 of the device under test or the device under test 140 (e.g., defined by the first outer surface 144a or the first inner surface 142a when the device under test is coupled to the socket 130 of the device under test), for example. Figure 1, a space 111 to the left of the first outer surface 144a or the first inner surface 142a. The area can be an area of ​​the carrier structure 110 (e.g., a load board) that is adjacent to a projection of an outward (externally facing) surface normal 143 of the first outer surface 144a of the angled device under test on the load board. The adjacent area can be adjacent to (e.g., with a gap 114 therebetween) the first outer surface of the angled device under test 140 (e.g., an area adjacent to a projection of an outward (externally facing) surface normal 143 of the first outer surface 144a of the angled device under test 140 on the carrier structure 110 (e.g., a load board)).

[0083] Figure 1 The test arrangement 100 shown in FIG. 1 can be used, for example, to test the angled device under test 140 by itself (e.g., without an antenna structure that detects electromagnetic radiation emitted by the angled device under test), or can also be used to test the angled device under test 140 in combination with one or more additional antennas. For example, the test arrangement 100 can be used to test the power consumption of the device under test 140 or the interference between the antennas of the device under test 140. Alternatively, the test arrangement 100 can be configured to wirelessly test one or more antenna structures of the device under test.

[0084] Since the socket 130 of the device under test is configured to contact the inner surface 142 of the device under test, the outer surface of the device under test 140 is completely (or at least mostly) facing away from the socket 130 of the device under test and the carrier 110. Therefore, the impact of the socket 130 of the device under test and / or the carrier structure 110 on the radiation emitted (and / or received) by the outer surface of the device under test 140 (and the testing thereof) is reduced.

[0085] The angled device under test 140 may be (or include) an antenna in package (AiP) device. The angled device under test 140 may have an L-shape (eg, Figure 1), for example, the device under test can be a device having a first board 141a connected to a second board 141b, wherein the angle between the first board 141a and the second board 141b is at least substantially 90 degrees (e.g., within a tolerance range of + / -15 degrees). The angled device under test 140 can include a first outer surface 144a (e.g., of the first board 141a) and a second outer surface 144b (e.g., of the second board 141b), wherein the angle between the first outer surface 144a and the second outer surface 144b is at least substantially 270 degrees (e.g., within a tolerance range of + / -15 degrees). The inner surface 142 of the angled device under test 140 can include a first inner surface 142a (e.g., of the first plate 141a) and a second inner surface 142b (e.g., of the second plate 141b), wherein the angle between the first inner surface 142a and the second inner surface 142b is at least substantially 90 degrees (e.g., within a tolerance range of + / - 15 degrees). The first inner surface 142a and the first outer surface 144a can be arranged parallel to each other. The second inner surface 142b and the second outer surface 144b can be arranged parallel to each other.

[0086] The socket 130 of the device under test can be configured to position the angled device under test 140 so that the second outer surface 144b of the angled device under test 140 faces away from the carrier structure 110. The socket 130 of the device under test can be configured to position the angled device under test 140 so that the surface normal of the second outer surface 144b of the angled device under test is perpendicular (within a tolerance range of + / - 15 degrees) to the surface 112 of the carrier structure 110. The second outer surface 144b can be arranged to be parallel to the surface 112 of the carrier structure 110.

[0087] Figure 2A A cross-sectional view of a first example angled device under test 240 is shown, which may be an alternative to angled device under test 140 .

[0088] The device under test 240 includes a first plate 241a and a second plate 241b, the angle between which is 90 degrees (e.g., within a tolerance range of + / -15 degrees). The first plate 241a includes a first outer surface 244a and a first inner surface 242a, and the second plate 241b includes a second outer surface 244b and a second inner surface 242b.

[0089] exist Figure 2AIn the example shown, the first outer surface 244a includes a first antenna array 246a, and the first antenna array 246a has four antenna elements. However, the first outer surface 244a may also (additionally or alternatively) include any other form of antenna (e.g., a single antenna and / or a circularly polarized antenna) and any number of antenna elements or antenna arrays. Alternatively, the second outer surface 244b may include the first antenna array 246a. The first antenna array 246a may be configured to receive and / or transmit electromagnetic radiation.

[0090] The device under test 240 may also include a connector 248, such as an array connector. Figure 2A In the example shown, the (array) connector 248 is arranged on the second inner surface 242b. Alternatively, the (array) connector 248 can be arranged on the first inner surface 242a or (for example, in the case of multiple (array) connectors 248) on the first inner surface 242a and the second inner surface 242b. The (array) connector 248 is electrically connected to at least one antenna element (of all antenna elements) of the first antenna array 246a. Therefore, an electrical signal applied to the (array) connector 248 can cause the first antenna array 246a to emit electromagnetic radiation. Alternatively or additionally, the electromagnetic radiation received by the first antenna array 246a can generate an electrical signal at the (array) connector 248. The (array) connector 248 can be or include one or more solder balls. The (array) connector 248 can be configured to connect the device under test 140 (for example, a packaged antenna module) to a system (for example, a mobile phone or a socket 130 of the device under test) and can transmit signals such as power signals, digital signals, radio frequency (RF) signals or intermediate frequency (IF) signals.

[0091] The first antenna array 246a may be directly electrically connected to the (array) connector 248, or may be indirectly coupled to the (array) connector 248 via other electrical components therebetween. For example, these other electrical components may include at least one amplifier, filter, switch, resistor, capacitor, and integrated circuit. Figure 2A In the example shown, other electrical components include antenna circuit 249 (e.g., a silicon chip). Antenna circuit 249 can be configured to convert an intermediate frequency (IF) signal to a millimeter wave signal (e.g., a 5G frequency band, such as in the range of 24 GHz to 53 GHz) and / or vice versa. Alternatively or additionally, antenna circuit 249 can also be configured to (at least partially) control the beamforming of the first antenna array 246a.

[0092] Figure 2B A cross-sectional view of a second example angled device under test 240 a is shown, which may be substituted for angled device under test 140 .

[0093] The second example angled device under test 240a is essentially the same as Figure 2A 244b, and thus like elements will be designated with like reference numerals, but further comprising a second antenna array 246b on a second outer surface 244b. The second antenna array 246b may have similar characteristics to the first antenna array 246a. The second antenna array 246b may also be electrically connected to at least one (array) connector 248 and an antenna circuit 249. Alternatively, the second antenna array 246b may be electrically connected to a separate (array) connector and / or a separate antenna circuit.

[0094] The device under test socket 130 can be configured to position the angled device under test 140 (e.g., angled device under test 240 or angled device under test 240a) such that the first outer surface 144a of the angled device under test 140 (e.g., first outer surface 244a) is spaced apart from the surface 112 of the carrier structure 110. Figure 1 14 and 15. The first distance 114 is schematically shown (in dashed form) in FIG. 14, which represents the space (spacing) between the first outer surface 144a and the surface 112 of the carrier structure 110. The socket 130 of the device under test can be configured to position the angled device under test 140 so that the surface normal of the first outer surface 144a of the angled device under test 140 is parallel to the surface 112 of the carrier structure 110 (e.g., Figure 1 The first outer surface 144a may be arranged perpendicular to the surface 112 of the carrier structure 110, for example, within a tolerance range of + / -15 degrees.

[0095] The socket 130 of the device under test can be configured to position the angled device under test 140 so that the spacing (e.g., first distance 114) between the first outer surface 144a of the angled device under test 140 and the carrier structure 110 (e.g., its surface 112) is at least two wavelengths of the lowest operating frequency of the angled device under test. For example, the angled device under test 140 can operate within a frequency band of the 5G standard, such as in the range of 24 GHz to 53 GHz (e.g., band 2). In this case, the lowest operating frequency can be 24 GHz with a wavelength of 12.5 mm. The space between the first outer surface 144a and the surface 112 of the carrier structure 110 can be, for example, 25 mm or greater (i.e., twice 12.5 mm).

[0096] The spacing may be defined by different surfaces of the device under test 140. The device under test receptacle 130 may be arranged such that there is at least 10 mm, 30 mm, or 45 mm of spacing between a second inner surface 142 b of the angled device under test 140 (e.g., second inner surface 242 b of the angled device under test 240) and the carrier structure 110 (e.g., and surface 112), or at least two wavelengths, three wavelengths, or four wavelengths of the lowest operating frequency of the angled device under test, wherein the second inner surface 142 b is opposite the second outer surface 114 b of the angled device under test 140.

[0097] The socket 130 of the device under test can include a socket height 115 (indicated by dashed lines) of at least 10 mm, 30 mm, or 45 mm, such that the spacing between the second inner surface 142b of the angled device under test 140 and the carrier structure is at least 10 mm, 30 mm, or 45 mm, or at least two wavelengths, three wavelengths, or four wavelengths of the lowest operating frequency of the angled device under test, wherein the second inner surface 142b is opposite to the second outer surface 144b of the angled device under test 140.

[0098] Figure 3 A perspective view of an angled device under test 340 is shown, which may be an alternative to angled device under test 140 .

[0099] The device under test 340 includes a first outer surface 344a having a first antenna array and a second outer surface 344b having a second antenna array, the first antenna array having four antenna elements and the second antenna array having four antenna elements. At least one antenna element may include at least one parasitic patch. Figure 3 In the example shown, each antenna element has four parasitic patches surrounding the central antenna structure. The first outer surface 344a contains two central antenna elements 345a and 345b. There are no metallized surfaces around the device under test 340.

[0100] Figure 4 Shows Figure 3 The simulation results of the far field emitted by the antenna element (e.g., antenna element 345a or 345b) of the first antenna array of the first outer surface 344a of the device under test 340 are depicted. It should be noted that for simplicity, Figure 3The simulation of the far field depicted in is from the center of the first antenna array of the first outer surface 344a (e.g., between the central antenna elements 345a and 345b). However, the simulation of the far field may have substantially the same shape when starting from the center of one of the central antenna elements 345a or 345b. The far field shows significant lobes that are oriented perpendicular to the antenna elements 345a and 345b of the first outer surface 344a (however, when the device under test 340 is used in a system, such as in a system that provides a metallized backplane, reverse radiation may be reduced or suppressed).

[0101] Figure 5 A perspective view of an angled device under test 540 is shown, which can replace the angled device under test 140. The device under test 540 includes a first outer surface 544a including a first antenna array having four antenna elements and a second outer surface 544b including a second antenna array having four antenna elements. The first antenna array of the first outer surface 544a includes two central antenna elements 545a and 545b. There is a metal (e.g., copper) surface 551 at a distance of 2 mm from the first outer surface 544a.

[0102] Figure 6 Shows Figure 5 Simulation results of the far field emitted by the antenna elements (e.g., antenna elements 545a or 545b) of the first external surface antenna array 544a of the device under test 530 depicted in FIG (preferably considering the metal surface 551). Figure 4 Compared to the results depicted in , the far field shows less significant radiation from the two antenna elements of the antenna array 544a oriented perpendicular to the first outer surface. Instead, the intensity of the far field is more evenly distributed around the device under test 540, with separate main lobes in two directions that are different from the direction of the surface normal on the first outer surface 544a. The results indicate that nearby metallized surfaces can affect the far field emitted by the device under test 540, thereby reducing the accuracy and / or repeatability of the test. For example, the metallized surface may reduce the spatial selectivity of the beamforming antenna array and / or change the direction of the main lobe.

[0103] Thus, spacing as described above (eg, at least two wavelengths, or at least 10 mm, or at least 30 mm, or at least 45 mm) may improve the accuracy and / or repeatability of the test.

[0104] Fig.13A A perspective view of an example of a device under test 1340 is shown, which can replace the angled device under test 140. The device under test 1340 includes a first inner surface 1342a and a second inner surface 1342b. Fig.13AIn the example shown, the device under test includes a first plate 1341a and a second plate 1341b, the first plate 1341a having a first inner surface 1342a, and the second plate 1341b having a second inner surface 1342b. The first plate 1341a and the second plate 1341b are mechanically (and optionally electrically) connected by a flexible conductive structure (e.g., three flexible printed circuits 1347a, b, c). The first plate 1341a and the second plate 1341b are movable (e.g., bendable) relative to each other to facilitate manufacturing or assembly in a system. However, in some cases, the movability of the plate may facilitate coupling with the socket of the device under test, but may also complicate testing in some cases. Alternatively, the first plate 1341a and the second plate 1341b may be fixedly arranged relative to each other.

[0105] The device under test 1340 includes a silicon chip 1349 (or any other antenna circuit) and a connector 1348 (e.g., an array connector) on the second inner surface 1342b. The silicon chip 1349 can be electrically contacted indirectly via the array connector 1348, or via electrical contacts of the silicon chip 1349 itself ( Fig.13A The socket of the device under test described herein is configured to establish electrical contact with the inner surface of the device under test 1340 (eg, the array connector 1348 on the second inner surface 1342b).

[0106] Fig. 13B Shows Fig.13A Another perspective view of the device under test 1340 depicted in . The device under test 1340 includes a first outer surface 1344a (on a first plate 1341a) and a second outer surface 1344b (on a second plate 1341b). The first outer surface 1344a and the second outer surface 1344b are configured to emit and / or receive electromagnetic radiation (e.g., by forming corresponding antenna structures). To this end, antenna elements (e.g., antenna arrays) can be arranged partially on the first surface 1344a and / or the second surface 1344b, or can be arranged partially within the first plate 1341a and / or the second plate 1341b. In Fig. 13B In the example shown, the first outer surface 1344a and the second outer surface 1344b are configured to emit and / or receive electromagnetic radiation. Alternatively, only the first outer surface 1344a or only the second outer surface 1344b may be configured to emit and / or receive electromagnetic radiation.

[0107] Figure 7A schematic cross-sectional view of another example of a test arrangement 700 is shown, which has a device under test 740. The device under test 740 includes a first inner surface 742a, a second inner surface 742b, a first outer surface 744a, and a second outer surface 744b. The test arrangement includes a carrier structure 710 (e.g., a load board). The device under test 740 can be any device under test described herein. The test arrangement 700 includes a socket 730 for the device under test, which can be a socket for any device under test described herein.

[0108] The test arrangement 700 may include an expander structure 732, which is arranged between a carrier structure 710 (e.g., a load board or a PCB test fixture) and a socket 730 of a device under test. The expander structure 732 may include an expander 733 and a PCB interposer 734. The expander forms a structure that allows the socket 730 of the device under test to be arranged to be elevated relative to the carrier structure 710 (e.g., spaced apart from the carrier structure 710). The expander 733 may be configured to receive the socket 730 of the device under test directly or indirectly (e.g., via the PCB interposer 734 and / or other components). The PCB interposer may be configured to form an adapter (e.g., structurally and / or at an electrical connection location) between the expander 733 and the socket 730 of the device under test. For example, the PCB interposer 734 may allow rewiring between different electrical contact geometries of the expander 733 and the socket 730 of the device under test, thereby improving compatibility between them. PCB interposer 734 may, for example, (optionally) contain one or more decoupling capacitors.

[0109] exist Figure 7 In the example shown, the expander structure 732 includes an expander assembly 735, wherein the expander assembly includes one or more coaxial spring pins 735 to establish an electrical connection between a carrier structure (e.g., a load board) and an angled device under test (where, for example, a first end of the coaxial spring pin can contact a pad on the load board, and wherein, for example, a second end of the coaxial spring pin can contact a pad on a PCB interposer, which is located between the expander assembly and the socket of the device under test). The coaxial spring pins (e.g., Figure 7 ) can extend from a lower surface of the expander assembly 735 to an upper surface of the expander assembly 735, the lower surface of the expander assembly 735 contacts the carrier structure 710, and the upper surface of the expander assembly 735 contacts the PCB interposer 734 or the socket 730 of the device under test. Figure 7In the example shown, the expander structure 732 has four coaxial spring pins, however, other numbers of coaxial spring pins may be provided. At least one coaxial spring pin may be pressed down by the PCB interposer 734 and / or the socket 730 of the device under test. The height of the expander assembly 735 (e.g., in a direction perpendicular to the surface of the carrier structure 710) may be greater than the height of the socket 730 of the device under test.

[0110] Next, we will discuss how to improve the characteristics of the test layout by designing different spatial areas. For example, the so-called "adjacent area" can be designed so that it has no power plane or ground plane. Alternatively or additionally, the so-called "first designated area" can be designed so that it is completely free of metallization.

[0111] An adjacent region 716 of a carrier structure 710 (e.g., a load board) has no power plane and / or no ground plane, and the adjacent region is adjacent to (e.g., has a gap between the two) a first outer surface 744a of the angled device under test 740 (e.g., a region of the carrier structure 710 (e.g., a load board) that is adjacent to a projection of an outward (outward-facing) surface normal of the first outer surface 744a of the angled device under test 740 on the carrier structure 710 or the load board). The adjacent region can be arranged in a half space that passes through the socket 730 of the device under test that includes the first outer surface 734a. The adjacent region can be adjacent to (e.g., has a gap between the two) a first outer surface 744a of the angled device under test 740 (e.g., a region adjacent to a projection of an outward (outward-facing) surface normal of the first outer surface 744a of the angled device under test 740 on the carrier structure 710 (e.g., a load board). Figure 7 In the example shown, the adjacent region 716 is a rectangular region that is adjacent to the surface of the expander 733 that faces the first inner surface 742a. ​​However, the adjacent region may have any other shape (e.g., a triangle, a trapezoid, a polygon, or an ellipse). In addition, the adjacent region may be spaced apart from the expander 733 (e.g., at Figure 7 ), or at least partially surround the expander 733 (e.g., Figure 7 to the right in the middle).

[0112] A first designated area 718 of the carrier structure 710 (e.g., load board) is free of metallization, and the first designated area 718 is adjacent to (e.g., with a space therebetween) the first outer surface 744a of the angled device under test 740. The first designated area 718 of the carrier structure 710 (e.g., load board) can be adjacent to a projection of an outward (outwardly facing) surface normal of the first outer surface 744a of the angled device under test 740 onto the carrier structure 710 (e.g., load board). The first designated area 718 can be the same as, intersect with, or include the adjacent area 716.

[0113] The test arrangement 700 may include an absorbent material 717 disposed on a carrier structure 710 (e.g., a load plate) in a second designated area adjacent to (e.g., with a gap therebetween) a first outer surface 744a of the angled device under test 740 (e.g., in a second designated area adjacent to a projection of an outward (outwardly facing) surface normal of the first outer surface of the angled device under test onto the carrier structure (e.g., load plate)). The absorbent material may include a radio frequency absorbing material (e.g., a rubberized foam material impregnated with carbon and / or iron). The second designated area may be the same as, intersect with, or include the adjacent area 716 (718) (and / or the first designated area 718). However, the second designated area may preferably be adjacent to a so-called "adjacent area 716" of the carrier structure 710. In Figure 7 In the example shown, the absorbent material 717 is arranged to be elevated relative to the surrounding area of ​​the carrier structure 710 (e.g., attached to the top of the carrier structure 710). Alternatively, the absorbent material 717 can be arranged to be at least substantially flush with the surrounding area of ​​the carrier structure 710, or embedded therein (e.g., embedded in an opening of the carrier structure).

[0114] The socket 730 of the device under test is configured to establish an electrical connection with a connector 748 (eg, an array connector) of the device under test 740. Alternatively, the socket 730 of the device under test may be configured to establish an electrical connection with at least one of the first inner surface 742a and the second inner surface 742b.

[0115] Figure 7 The test arrangement 700 shown has a first antenna or antenna structure 750 and a second antenna or antenna structure 752. Alternatively, the test arrangement 700 may include only the first antenna or antenna structure 750, or only the second antenna or antenna structure 752 (i.e., not a combination of the first antenna or antenna structure 750 and the second antenna or antenna structure 752).

[0116] The first antenna or antenna structure 750 (e.g., a single aperture antenna, such as a dual linear polarization or circular polarization antenna) is configured to receive signals radiated by the first outer surface 744a of the angled device under test 740 and / or is configured to transmit signals to be received at the first outer surface 744a of the angled device under test 740. To this end, the first antenna or antenna structure 750 is arranged at a distance from the first outer surface 744a of the angled device under test 740, for example, such that the surface normal of the first outer surface 744a of the angled device under test 740 extends through the aperture of the first antenna or antenna structure 750. The first antenna or antenna structure 750 is positionable in an operational position. A surface normal of a first outer surface 744a of the angled device under test 740 (e.g., the surface normal may be coaxial with a main lobe (e.g., beamforming) of an antenna structure on the first outer surface, and / or extend through the geometric center of one or more antenna arrays of the first outer surface 744a) may extend through an aperture of the first antenna or antenna structure 750 (e.g., through the center of the aperture). The first antenna or antenna structure 750 may be mechanically attached to an arm of an operator 754 (or push rod) such that the first antenna or antenna structure 750 is movable. The operator 754 may be configured to insert the angled device under test 740 into the receptacle 730 of the device under test.

[0117] When the operator 754 has placed the first antenna or antenna structure 750 in the operating position (or equivalently, when the operator 754 has inserted the angled device under test 740 into the receptacle 730 of the device under test, or when the operator 754 has pushed the device under test 740 into the receptacle 730 of the device under test), the first antenna or antenna structure 750 can be configured to connect to the signal source and / or signal receiver (at the interface) via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection). Figure 7 The operating position can be defined by aligning the radiation direction of the first outer surface 744a (e.g., perpendicular to the first outer surface 744a) with the reception direction of the first antenna or antenna structure 750. The signal source and / or the signal receiver can be part of a processing device for testing a device under test, for example, using a computer program product containing instructions that, when executed by, for example, automated test equipment, cause the processing device to perform at least one of the following: generating a signal to be transmitted by the first antenna or antenna structure 750, and processing (e.g., detecting) a signal received by the first antenna or antenna structure 750.

[0118] (At least when the second antenna or antenna structure 752 is placed in the operating position) (or equivalently, when the operator 754 has inserted the angled device under test 740 into the socket 730 of the device under test, or when the operator 754 has pushed the device under test 740 into the socket 730 of the device under test), the second antenna or antenna structure 752 (e.g., a single-hole antenna, such as a dual-linear polarization or circularly polarized antenna) can be configured to receive signals radiated by the second outer surface 744b of the angled device under test 740, and / or to transmit signals to be received at the second outer surface 744b of the angled device under test 740.

[0119] The aperture of the second antenna or antenna structure 752 can be arranged at a certain distance from the second outer surface 744b of the angled device under test 740 so that (at least when the second antenna or antenna structure 752 is placed in the operating position) (or equivalently, when the operator has inserted the angled device under test into the test socket, or when the operator has pushed the device under test into the test socket) the surface normal of the second outer surface 744b of the angled device under test 740 extends through the aperture of the second antenna or antenna structure 752. The surface normal of the second outer surface 744b of the angled device under test 740 is coaxial with the main lobe of the antenna structure on the second outer surface, and / or the surface normal extending through the geometric center of one or more antenna arrays on the first outer surface 744a can extend through the aperture of the first antenna or antenna structure 750 (for example, through the center of the aperture of the first antenna or antenna structure).

[0120] The second antenna or antenna structure 752 can be mechanically attached to an arm of an operator (e.g., a push rod) 754 so that the second antenna or antenna structure 752 is movable.

[0121] The second antenna or antenna structure 752 may be part of a push rod 754 for pushing the angled device under test 740 into the socket 730 of the device under test, or the second antenna or antenna structure 752 may be configured to be movable with the push rod 754 for pushing the angled device under test 740 into the socket 730 of the device under test. The push rod 754 may be arranged so that when the device under test 740 is inserted into the socket 730 of the device under test, the push rod 754 or a portion of the push rod 754 is between the second antenna or antenna structure 752 and the second outer surface 744b of the angled device under test 740. The push rod 754 may be arranged so that when the angled device under test 740 is inserted into the socket 730 of the device under test, the push rod 754 or a portion of the push rod 754 is between the first antenna or antenna structure 750 and the first outer surface 744a of the angled device under test 740. It should be noted that in some cases, the force pushing the device under test can act in two directions, for example, to push both the first inner surface of the device under test and the second inner surface of the device under test toward the receptacle of the device under test. Therefore, the push rod can be angled so as to contact (push) the first outer surface of the device under test and the second outer surface of the device under test. Therefore, the push rod can move in a direction along the surface normal of the first outer surface of the device under test and in a direction along the surface normal of the second outer surface of the device under test.

[0122] When the operator 754 has placed the second antenna or antenna structure 752 in the operating position (or equivalently, when the operator 754 has inserted the angled device under test 740 into the receptacle 730 of the device under test, or when the operator 754 has pushed the device under test 740 into the receptacle 730 of the device under test), the second antenna or antenna structure 752 can be configured to connect to the signal source and / or signal receiver (at the interface) via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection). Figure 7 The operating position can be defined by the alignment of the radiation direction of the second outer surface 744b (e.g., perpendicular to the second outer surface 744b) with the receiving direction of the second antenna or antenna structure 752. The signal source and / or signal receiver can be part of a processing device for testing the device under test 740, for example, using a computer program product containing instructions that, when executed by, for example, automated test equipment, cause the processing device to perform at least one of the following: generating a signal transmitted by the second antenna or antenna structure 752, and processing (e.g., detecting) a signal received by the second antenna or antenna structure 752. The first antenna or antenna structure 750 and the second antenna or antenna structure 752 can be configured to be connected to the same signal source and / or signal receiver, or to separate signal sources and / or signal receivers. The signal source and / or signal receiver can, for example, be included by the test arrangement 700.

[0123] Figure 8A perspective view of an example of a device under test socket 830 is shown, which may be used, for example, in any of the embodiments disclosed herein.

[0124] The socket 830 of the device under test can be configured to receive any device under test described herein and can be part of any test arrangement described herein. The socket 830 of the device under test includes an angled recess or angled notch 860, which is configured to support and / or align the angled device under test. The angled recess or angled notch 860 includes a first abutment surface 862a and a second abutment surface 862b, the first abutment surface 862a is used to abut with a first inner surface of the device under test (e.g., the first inner surface 142a, 242a or 742a), and the second abutment surface 862b is used to abut with a second inner surface of the device under test (e.g., the second inner surface 142b, 242b or 742b). The first abutment surface 862a and the second abutment surface 862b may be arranged at an abutment surface angle, wherein the sum of the abutment surface angle (e.g., 270 degrees) and the angle between the first inner surface and the second inner surface of the device under test (e.g., 90 degrees) is at least substantially 360 degrees. For example, if the first inner surface and the second inner surface of the device under test are arranged at an angle of 90 degrees, the abutment surface angle may be 270 degrees (the sum of 90 degrees and 270 degrees is 360 degrees).

[0125] Any surface of the socket 830 of the device under test can be configured to establish an electrical connection with the inner surface of the device under test. For example, the first abutment surface 862a and / or the second abutment surface 862b can be configured to establish an electrical connection with the inner surface of the device under test, and / or provide a ground plane for the antenna structure of the device under test. To this end, the first abutment surface 862a and / or the second abutment surface 862b can include or can be made of a conductive material (e.g., at least one of gold, copper, iron and nickel). Alternatively, the first abutment surface and / or the second abutment surface can include or be made of a dielectric (non-conductive) material (e.g., a wear-resistant material). Optionally, the first abutment surface 862a and / or the second abutment surface 862b can include one or more (local) socket connectors 865 (or other contact structures for contacting the device under test, such as conductive pads, spring pins, spring-loaded contacts, etc.). The socket connector 865 is arranged so that when the device under test is placed in the socket 860 of the device under test, the connector 865 establishes an electrical connection with an inner surface of the device under test or a connector thereof (eg, array connector 248, 748).

[0126] The socket 830 of the device under test includes a support body 864, which includes a main socket structure 864a and a leg socket structure 864b. Both the main socket structure 864a and the leg socket structure 864b have an outer shape of a cuboid (optionally with rounded edges), wherein at least two edges of the leg socket structure 864b are smaller (shorter) than two edges (e.g., corresponding edges) of the main socket structure 864a. The main socket structure 864a and the leg socket structure 864b can, for example, have the same height. The side surface 861 of the leg socket structure 864b is arranged to be flush with the side surface of the main socket structure 864a, while the other three side surfaces of the leg socket structure 864b are recessed relative to the other three (corresponding) side surfaces of the main socket structure 864a. Therefore, for example, the leg socket structure 864b can be received by an opening in a carrier structure or an expander structure, so that, for example, the lateral movement of the socket 830 of the device under test is limited by the side surface of the leg socket structure 864b. However, the socket of the device under test may also be attached to the top of an expander structure (e.g., the top of expander structure 732), where the main socket structure 864a may be arranged on the top surface of the expander structure and where the leg socket structure 864b may be adjacent to the side wall of the expander structure.

[0127] The socket 830 of the device under test may additionally or alternatively include one or more protrusions 866 extending from the support body 864 (e.g., from the main socket structure 864a) in the direction of the carrier structure. The protrusion 866 may be or include a (e.g., cylindrical) shaft. The protrusion 866 may be received by a recess of the carrier structure or the expander structure 732. Alternatively or additionally, the socket 830 of the device under test may include one or more through holes for receiving attachment elements such as pins or screws.

[0128] exist Figure 8 In the example shown, the angled recess or angled notch 860 extends into both the main socket structure 864a and the leg socket structure 864b. Alternatively, the angled recess or angled notch 860 may extend only into the main socket structure 864a.

[0129] The angled recess or angled notch 860 has corresponding side walls 868a, b at its ends (the side walls 868a, b are Figure 8 Only one of them is directly visible). The side walls 868a, b face each other and are arranged at least substantially parallel to each other (ignoring the optional taper). Figure 8In the example shown, the side walls 868a, b are oriented vertically or at least substantially vertically relative to the first abutment surface 862a and the second abutment surface 862b. The side walls 868a, b can limit lateral movement of the device under test within the angled recess or angled notch 860, while still allowing the device under test to be smoothly and well inserted into the angled recess or angled notch 860, and also allowing the device under test to be smoothly removed. Alternatively, the angled recess or angled notch 860 can include only one side wall, for example, to increase flexibility with respect to positioning.

[0130] The angled recess or angled notch 860 may include at least one taper, for example, such that the cross-section (e.g., parallel to the first abutment surface 862a or the second abutment surface 862b) decreases in a direction from the outside toward the first or second abutment surface 862b. Figure 8 In the example shown, the angled recess or angled notch 860 includes a first and a second taper. According to the first taper, the distance between the side walls 868a, b decreases toward the first abutment surface 862a. According to the second taper, the cross-section of the three side walls of the main socket structure 864a surrounding the second abutment surface 862b decreases toward the second abutment surface 862b. The taper can have a self-centering function and facilitate the insertion of the device under test into the angled recess or angled notch 860.

[0131] The socket 830 of the device under test can have adjacent openings 869 that intersect the angled recess or angled notch 860. Figure 8 In the example shown, the socket 830 of the device under test includes four adjacent openings 869, and the adjacent openings 869 are arranged near the corners of the second abutment surface 862b. Alternatively, the socket 830 of the device under test can include any other number of adjacent openings 869 at any other position, and these positions are located adjacent to the second abutment surface 862b (and / or the first abutment surface 862a). For example, adjacent openings can be adapted to prevent the device under test from tilting when the device under test is inserted into the socket 830. However, adjacent openings can also help to remove the device under test from the socket 830.

[0132] The angled recess or angled notch 860 may include additional recesses or protrusions, for example, to conform to the shape of the device under test. Figure 8 The angled recess or angled notch 860 shown in the figure includes a step 867 in the first abutment surface 862a. The step 867 can, for example, accommodate a structural feature of the first inner surface, or provide a support surface for the device under test, for example, to form a space below (e.g., for grasping the device under test).

[0133] The socket 830 of the device under test may include a blind mate interface. Figure 8 In the example shown, the main socket structure 864a includes two (blind) mating recesses 863a, b. Alternatively, the main socket structure 864a can include any other number of mating recesses. The mating recesses 863a, b are configured to receive a (blind) mating protrusion of a push rod or an operator (e.g., operator 754). Alternatively or additionally, the main socket structure 864a can include one or more (blind) mating protrusions, for example, which are configured to be received by a (blind) mating recess of a push rod or an operator (e.g., operator 754).

[0134] In summary, the socket 830 can receive an angled device under test and can establish an electrical connection with the angled device under test. The device under test can be positioned (aligned) within the angled recess or angled notch 860, making it possible to perform over-the-air testing of the device under test using antenna structures or antennas on both outer surfaces of the angled device under test. The device under test is well aligned in the socket, while the deformation of the radiation characteristics of the antenna or antenna structure of the device under test by the socket can be kept reasonably small. The socket can be easily attached to a carrier structure and can be used in any of the embodiments disclosed herein.

[0135] Fig. 9 A schematic cross-sectional view of another example of a test arrangement 900 is shown with a device under test 940, which may be any device under test described herein. The test arrangement 900 includes a socket 930 for the device under test, which may be any socket for the device under test described herein.

[0136] Fig. 9 The example shown may correspond to Figure 7 The example is shown, except that the socket 930 of the device under test is attached to the daughterboard 970, rather than the expander structure 732. However, the daughterboard 970 and the expander structure 732 are not mutually exclusive of each other and can be used in combination (e.g., the expander structure can be arranged between the daughterboard 970 and the carrier structure, and / or between the daughterboard 970 and the socket 930 of the device under test).

[0137] The socket 930 of the device under test is attached to (e.g., arranged on) a daughterboard 970, which is mounted to a carrier structure 910 (e.g., a test fixture PCB or a load board), with a spacing between the daughterboard 970 and the carrier structure 910. The spacing between the daughterboard 970 and the carrier structure 910 can be provided, for example, using one or more reinforcements 972. The reinforcement 972 can include at least one of a polymer, a resin, a glass, and a metal. The reinforcement 972 can include one or more reinforcement structures. At least one reinforcement structure can include a step (e.g., to facilitate placing the daughterboard 970 on the reinforcement and / or limit movement in a direction parallel to the surface of the carrier structure 910). The reinforcement 972 can include one or more structures of at least substantially equal height, or the surfaces are arranged at at least substantially equal height (e.g., in the case of a reinforcement structure with a step). The reinforcement 972 can form or be part of a socket guide. The socket guides may be configured to facilitate placement of the daughterboard 970 onto the stiffener 972 (eg, for a user or automated equipment).

[0138] Alternatively or additionally, an expander structure (e.g., similar to expander structure 732) may be provided between the carrier structure 910 and the stiffener 972, or between the stiffener 972 and the daughter board 970, or between the carrier structure 910 and the daughter board 970, or between the daughter board 970 and the socket 930 of the device under test.

[0139] The test arrangement 900 may include an electrical connection between the daughterboard 970 and the carrier structure 910, using an electrical connector 974 (e.g., using a connector for digital / power signals (e.g., an array connector), optionally also for high-frequency signals or microwave signals, such as for intermediate frequency (IF) radio frequency (RF) signals). The electrical connector 974 may be configured to establish an electrical connection between the load board and the device under test 940 (e.g., by electrically connecting the carrier structure 910 to the device under test 940). The electrical connector 974 may be configured to transmit intermediate frequency (IF) radio frequency (RF) signals or microwave signals. A high-performance electrical connector 974 may be provided, such as a high-performance array connector.

[0140] The daughterboard 970 may include one or more mounted electrical connectors 976 that are electrically connected (or connectable) to the socket 930 of the device under test (e.g., to contacts of the socket 930 of the device under test that are configured to establish an electrical connection with the device under test 940). Alternatively, the one or more electrical connectors 976 may be configured to establish an electrical connection with an automated test device, or to establish an electrical connection with an external signal generating and / or measuring device that may be controlled, for example, by the automated test device. Fig. 9In the example shown, the electrical connector 976 is a coaxial connector. The installed electrical connector 976 can be provided as a replacement for the electrical connector 974 or in addition.

[0141] The socket 930 and / or the daughterboard 970 of the device under test may include one or more coaxial spring pins (eg, pogo pins). Fig. 9 In the example shown, the socket 930 of the device under test includes a socket spring pin 978. (For example, when the device under test is pushed into the socket 930 of the device under test, this may cause the socket spring pin 978 to at least partially retract) The coaxial spring pin allows an electrical connection to be established with the device under test 940.

[0142] In summary, the test arrangement 900 allows testing of one or more devices under test, which can be placed in the socket 930 of the device under test. The device under test can be placed at a certain distance from the carrier structure 910, wherein the daughter board 970 is located between the carrier structure (e.g., load board) 910 and the socket of the device under test. The daughter board can be, for example, a printed circuit board, and can, for example, contain electrical circuits that establish electrical connections between connectors that connect the carrier structure, the daughter board, and the socket of the device under test. Therefore, the socket of the device under test can be directly (or closely) attached (connected) to the daughter board, for example, using conventional technology, and the daughter board can be coupled to the carrier structure (e.g., load board) using a "long distance" connection, and the "long distance" connection is suitable for covering a certain distance, such as a range between 5 mm and 50 mm. Therefore, the correct placement of the device under test can be achieved, and good electrical characteristics and good mechanical stability of the connection between the support structure and the device under test can be achieved.

[0143] Fig.10 A schematic cross-sectional view of another example test arrangement 1000 is shown including a device under test 1040 .

[0144] The test arrangement includes a first antenna or antenna structure 1050 configured to receive signals radiated by a first outer surface 1044a of the angled device under test 1040 and / or configured to transmit signals to be received at the first outer surface 1044a of the angled device under test 1040. Fig.10In the example shown, the aperture of the first antenna or antenna structure 1050 is arranged at a distance from the first outer surface 1044a of the angled device under test 1040, so that the surface normal 1043 of the first outer surface 1044a of the angled device under test extends through the aperture of the first antenna or antenna structure 1050. Alternatively, the first antenna or antenna structure 1050 can be arranged in a different orientation and / or a different distance (e.g., close to or abutting the first outer surface 1044a). There can optionally be a push rod (for pushing the device under test into the socket of the device under test) between the first outer surface 1044a and the first antenna or antenna structure 1050.

[0145] The first antenna or antenna structure 1050 is, for example, mounted to have a fixed position relative to the socket 1030 of the device under test. The first antenna or antenna structure 1050 may be mounted to the carrier structure 1010. Signal transmission between the first antenna or antenna structure 1044a may be performed in a direction parallel to the surface of the carrier structure 1010 (e.g., due to the positioning of the angled device under test 1140 in the socket 1140 of the device under test), so that the angled device under test 1140 may be inserted into the socket 1030 of the device under test from above (e.g., in a direction perpendicular or at least approximately perpendicular to the surface of the carrier structure 1010) without removing the first antenna or antenna structure 1050.

[0146] The first antenna or antenna structure 1050 may include a housing with a waveguide (or be part of a housing with a waveguide), wherein the aperture of the waveguide forms (or is part of, or transitions into) the aperture of the first antenna or antenna structure 1050. The waveguide of the first antenna or antenna structure 1050 may be coupled to a coaxial connector or a coaxial cable, for example.

[0147] The first antenna or antenna structure 1050 may be connected (or connectable) to a signal source and / or signal receiver 1056a. Fig.10 In the example shown, the first antenna or antenna structure 1050 includes a first coaxial cable 1053a that is connected (or connectable) to a signal source and / or signal receiver 1056a. However, any other form of electrical signal transmission (such as a waveguide connection or a blind-mate waveguide connection) may also be used.

[0148] When the first antenna or antenna structure 1050 is placed in the operating position (e.g., by an operator), the first antenna or antenna structure 1050 can be configured to connect (via a first coaxial cable 1053a) to a first signal source and / or signal receiver 1056a via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection). In this case, the first antenna or antenna structure can be moved, for example, by an operator.

[0149] The test arrangement 1000 may include a second antenna or antenna structure 1152 (eg, Fig.10 The second antenna or antenna structure 1152 is configured to receive signals radiated by the second outer surface 1044b of the angled device under test 1040 and / or transmit signals to be received at the second outer surface 1044b of the angled device under test 1040 (e.g., at least when the second antenna or antenna structure 1052 is placed in an operating position).

[0150] The second antenna or antenna structure 1052 and / or antenna carrier structure 1054 (e.g., which may mechanically carry the antenna structure 1052 and include one or more feed lines that are coupled to the antenna or antenna structure 1052) is, for example, mechanically attached (or attachable) to an arm of the operator so that the second antenna or antenna structure 1052 and / or antenna carrier structure 1054 are movable. The operator may be movable (e.g., removable), for example, to facilitate access to the socket 1030 of the device under test, for example, to allow insertion and / or removal of the device under test 1140. Fig.10 In the example shown, the antenna structure 1052 or the antenna carrier structure 1054 is connected (or connectable) to (e.g., blind mating) a microwave connector 1055. For example, the operator can move the antenna structure 1052 and the carrier structure, and can push the antenna carrier structure 1054 (the antenna carrier structure 1054 can include a connection structure, such as a hollow waveguide and / or a coaxial cable, and / or a microstrip line) toward the microwave connector, thereby establishing an electrical connection between the antenna and the microwave connector 1055. The microwave connector 1055 is electrically connected to a second signal source and / or signal receiver 1056b.

[0151] Note that, Fig.10The test arrangement 1000 is shown with two separate signal sources and / or signal receivers 1056a, b that are coupled to different antenna structures 1050, 1052. However, the test arrangement 1000 may have a common (e.g., single) signal source and / or signal receiver that may be connected to the first and second antennas or antenna structures 1050, 1052 via separate or common electrical connections (e.g., coaxial cables and / or hollow waveguides).

[0152] The aperture of the second antenna or antenna structure 1052 can be arranged at a position at a certain distance from the second outer surface 1044b of the angled device under test 1040 so that (for example, at least when the second antenna or antenna structure 1052 is placed in the operating position) the surface normal 1092 of the second outer surface 1044b of the angled device under test 1040 extends through the aperture of the second antenna or antenna structure 1052.

[0153] exist Fig.10 In the example shown, the first antenna or antenna structure 1050 and the second antenna or antenna structure 1052 are arranged at a distance from the first outer surface 1044a and the second outer surface 1044b. However, in some cases, at least one of the first antenna or antenna structure 1050 and the second antenna or antenna structure 1052 can be arranged so as to almost or completely contact one of the corresponding first outer surface 1044a and the second outer surface 1044b. To this end, at least one of the first antenna or antenna structure 1050 and the second antenna or antenna structure 1052 can include a cover or spacer covering the corresponding aperture, and the cover or spacer includes a material that is at least partially transparent to the operating frequency of the device under test 1040.

[0154] The second antenna or antenna structure 1052 may include a housing (or part of a housing) with a waveguide, wherein an aperture of the waveguide forms an aperture (or part of an aperture of the second antenna or antenna structure 1052). The waveguide of the second antenna or antenna structure 1052 or the waveguide of the microwave connector 1055 may be coupled to a coaxial connector.

[0155] The test arrangement 1000 includes a first coaxial cable 1053a coupled (or coupleable) to a coaxial connector of (or associated with) a first antenna or antenna structure 1050. The test arrangement 1000 also includes a second coaxial cable 1053b coupled (or coupleable) to a microwave connector 1055 of (or associated with) a second antenna or antenna structure 1052. Alternatively, the test arrangement 1000 may include different devices or any number of coaxial cables for signal transmission.

[0156] exist Fig.10 In the example shown, the carrier structure 1010 includes a first carrier opening 1013a and a second carrier opening 1013b, the first carrier opening 1013a being configured to receive a first coaxial cable 1053a, and the second carrier opening 1013b being configured to receive a second coaxial cable 1053b. The test arrangement 1000 includes a daughter board 1070 having a board opening 1073, the board opening 1073 being configured to receive the second coaxial cable 1053b. Thus, the first coaxial cable 1053a and the second coaxial cable 1053b may be partially arranged on a side of the carrier structure 1010 opposite to the socket 1030 of the device under test (e.g., as shown in FIG. 1 ). Fig.10 1010). Thus, the effects of the signal transmission between the device under test 1030 and the first antenna or antenna structure 1050 and / or the second antenna or antenna structure 1052 that may be caused by the first coaxial cable 1053a and the second coaxial cable 1053b and other devices (such as the first and / or second signal sources and / or signal receivers 1056a, b connected thereto) are reduced. In addition, arranging the first and / or second signal sources and / or signal receivers 1056a, b on opposite sides of the carrier structure 1010 allows the length of the first coaxial cable 1053a and the second coaxial cable 1053b to be shortened, which improves the signal quality.

[0157] At least one of the first coaxial cable 1053a and the second coaxial cable 1053b can be arranged to be movable within the corresponding board opening 1013a, 1013b, 1073 (e.g., can be completely removed from the corresponding board opening), for example, because the diameter of the corresponding opening is large enough to allow the corresponding first coaxial cable 1053a or the second coaxial cable 1053b to move. Alternatively, at least one of the first coaxial cable 1053a and the second coaxial cable 1053b can be fixedly retained by the corresponding board opening 1013a, 1013b, 1073 (e.g., by friction fit).

[0158] Alternatively, the carrier structure 1010 may not have a board opening for the first coaxial cable 1053a and / or the second coaxial cable 1053b, wherein the first coaxial cable 1053a and / or the second coaxial cable 1053b are arranged entirely on the same side of the carrier structure 1010 as the socket 1040 of the device under test (e.g., as shown in FIG. Fig.10 , above the carrier structure 1010). Alternatively or additionally, the daughterboard 1070 may not have a board opening for the second coaxial cable 1053b.

[0159] Daughterboard 1070 can be any daughterboard described herein (e.g., daughterboard 970). Fig.10 In the example shown, the daughterboard 1070 includes spacers or stacking connectors 1075a, b, where, for example, one or more electrical connectors can be integrated into one of the spacers or stacking connectors 1075a, 1075b, or one or more of the electrical connectors can replace one or more spacers or stacking connectors 1075a, 1075b. At least one stacking connector can be configured to transmit signals (e.g., digital signals) and / or power. To this end, at least one of the spacers or stacking connectors 1075a, b can include an electrical connector (e.g., electrical connector 974).

[0160] The socket 1030 of the device under test includes a socket spring pin 1078. The socket spring pin 1078 can be configured to establish an electrical connection between the socket 1030 of the device under test and the inner surface of the device under test 1140. The socket spring pin 1078 can be retracted into the socket 1030 and / or the daughterboard 1070 of the device under test.

[0161] Fig.11 A schematic top view of another example test arrangement 1100 is shown, which includes a plurality of devices under test 1140a, b, c, d. The test arrangement 1100 includes a carrier structure 1110 (which may include any carrier structure described herein) (e.g., a printed circuit board test fixture or a load board) and four (e.g., four identical) sockets 1130a, b, c, d for devices under test (which may be sockets for any device under test described herein). However, the test arrangement 1100 may include any other number of sockets for devices under test (e.g., two, three, five, six, or more). The plurality of devices under test 1140a-d may be arranged in a row 1115a, such as Fig.11 As shown. The test arrangement 1100 allows multiple devices under test 1140a-d to be tested, thereby improving test efficiency. Tests can be performed simultaneously, for example, to improve time efficiency. Alternatively, tests can be performed sequentially to reduce crosstalk between devices under test 1140a-d.

[0162] The device under test receptacles 1130a-d are arranged to position the respective angled devices under test 1140a-d such that the respective first outer surfaces (at the Fig.11 , showing the first outer surface 1144a of the device under test 1140a as an example) in the same direction (in Fig.11 Aligning in the same direction allows for a more densely packed arrangement of the sockets 1130a-d of the devices under test.

[0163] The test arrangement 1100 includes four first antennas or antenna structures 1150a, b, c, d (which may be any first antenna or antenna structure described herein) (e.g., side measurement antennas). However, the test arrangement 1100 may include any other number of first antennas or antenna structures 1150a-d, for example, the same number as the number of sockets 1130a-d of the device under test. Fig.11 In the example shown, each socket 1130a-d of the device under test is assigned a corresponding first antenna or antenna structure 1150a-d. Each first antenna or antenna structure 1150a-d is configured to receive signals radiated by the first outer surface of the assigned (corresponding) angled device under test 1140a-d, and / or is configured to transmit signals received at the first outer surface of the assigned (corresponding) angled device under test 1140a-d.

[0164] The aperture of at least one of the first antennas or antenna structures 1150a-d may be disposed at a distance from a first outer surface of a corresponding angled device under test 1140a-d such that a surface normal of the first outer surface of the corresponding angled device under test 1140a-d extends through the aperture of a corresponding one of the first antennas or antenna structures 1150a-d.

[0165] exist Fig.11 In the example shown, the test arrangement 1100 does not include the second antenna or antenna structure in order not to block the devices under test 1140a-d. However, the test arrangement 1100 may include only the first antenna or antenna structure (i.e., without the second antenna or antenna structure), only the second antenna or antenna structure (i.e., without the first antenna or antenna structure), or the first antenna or antenna structure and the second antenna or antenna structure.

[0166] The carrier structure 1110 may define a board stop 1113 (eg, an operator docking board stop) that defines an area (eg, a rectangular frame) that encloses an area that supports the receptacles 1130a-d to which the device under test is mounted.

[0167] Fig.12A schematic top view of another example test arrangement 1200 is shown, which includes a plurality of devices under test 1240. The test arrangement 1200 includes a carrier structure 1210 (which may include any carrier structure described herein) (e.g., a printed circuit board test fixture or a load board) and eight (e.g., eight identical) sockets 1230 for devices under test (which may be sockets for any device under test described herein). However, the test arrangement 1200 may include any other number of sockets for devices under test (e.g., two, three, five, six, or more).

[0168] At least two DUT receptacles 1230 are arranged (e.g., back-to-back) to position corresponding angled DUTs 1240 such that first outer surfaces 1244aa of the corresponding angled DUTs are aligned in opposite (facing away) directions. Fig.12 Only the leftmost device under test socket 1230 is discussed in the present invention, and reference numerals 1230a, b are provided accordingly. However, the same principles apply to the remaining device under test sockets 1230. The first device under test socket 1230a is configured to arrange the corresponding device under test 1240a so that its corresponding first outer surface 1244aa faces a first direction (e.g., in Fig.12 The socket 1230b of the second device under test is configured to arrange the corresponding device under test 1240b so that its corresponding first outer surface 1244ab faces the second direction (for example, in Fig.12 The first direction is the positive x direction in the figure), and the second direction is opposite to the first direction (for example, antiparallel). Therefore, the first outer surfaces 1244aa, 1244ab of the devices under test 1240a, 1240b arranged in the socket 1230a of the first device under test and the socket 1230b of the second device under test face opposite directions. Therefore, the first antennas or antenna structures 1250a, 1250b assigned to the sockets 1230a, 1230b of the corresponding first device under test and the sockets 1230b of the second device under test can be arranged in opposite directions. In addition, the first antennas or antenna structures 1250a, 1250b assigned to the sockets 1230a, 1230b of the corresponding first device under test and the sockets 1230b of the second device under test can be arranged so that the sockets 1230a, 1230b of the first device under test and the sockets 1230b of the second device under test are arranged (for example, sandwiched) between the assigned first antennas or antenna structures 1250a, 1250b. This arrangement reduces the risk of crosstalk between the devices under test 1240a, 1240b coupled to the socket 1230a of the first device under test and the socket 1230b of the second device under test.

[0169] The test arrangement 1200 includes two rows (e.g., parallel rows) 1215a, b of sockets 1230a, 1230b of devices under test and associated first antennas 1250a, 1250b, wherein the sockets 1230 of the devices under test are configured to carry corresponding angled devices under test 1240a, 1240b, wherein the sockets 1240 of the devices under test of at least two rows 1215a, b are arranged (e.g., back to back; e.g., the sides of the sockets 1230 of the devices under test where the first outer surfaces 1244a of the devices under test 1240 are located face away from each other) to position the corresponding angled devices under test 1240a, 1240b such that the corresponding first outer surfaces 1244aa, 1244ab of the corresponding angled devices under test 1240a, 1240b are aligned in opposite (facing away) directions. This arrangement enhances the tradeoff between reduction of crosstalk and increase of packaging density.

Claims

1. A device for measuring an angled device (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) a test arrangement (100; 700; 900; 1000; 1100; 1200) for performing an over-the-air (OTA) test, wherein the test arrangement comprises a carrier structure (110; 710; 910; 1010; 1110; 1210); The test arrangement comprises a socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of a device under test, the socket of the device under test being coupled to the carrier structure (110; 710; 910; 1010; 1110; 1210), The socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test is configured to be aligned with an angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) or an inner surface (142a, 142b; 242a, 242b; 742a, 742b) of a device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) to establish electrical connections with connectors on the inner surfaces (142a, 142b; 242a, 242b; 742a, 742b).

2. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to claim 1, wherein the socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test is configured to position the device under test at an angle, spaced apart a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) of an angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) from a surface (112) of a carrier structure (110; 710; 910; 1010; 1110; 1210), and The surface normal of the first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) is parallel to the surface (112) of the carrier structure (110; 710; 910; 1010; 1110; 1210) within an error range of ±15 degrees.

3. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to claim 1 or 2, wherein the socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test is configured to position the device under test at an angle, causing a second outer surface (144b; 244b; 344b; 544b; 744b; 1044b) of the angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) to face away from the carrier structure (110; 710; 910; 1010; 1110; 1210), and The surface normal of the second outer surface (144b; 244b; 344b; 544b; 744b; 1044b) of the angled device under test is perpendicular to the surface (112) of the carrier structure (110; 710; 910; 1010; 1110; 1210) within an error range of ±15 degrees.

4. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 3, Wherein an area of ​​the carrier structure (110; 710; 910; 1010; 1110; 1210) adjacent to a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) of the angled device under test has no power plane and / or no ground plane.

5. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 4, Wherein an area of ​​the carrier structure (110; 710; 910; 1010; 1110; 1210) adjacent to a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) of the angled device under test is devoid of metallization.

6. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 5, Wherein an absorbent material (714) is arranged on a carrier structure (110; 710; 910; 1010; 1110; 1210) in an area adjacent to a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) of an angled device under test.

7. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 6, The socket of the device under test (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) is configured to position the device under test at an angle so that the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) and a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) and a carrier structure (110; 710; 910; 1010; 1110; 1210) having a spacing of at least 1000 m / s and an angular distance between the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) is twice the wavelength of the lowest operating frequency.

8. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 7, A socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of a device under test is attached to a daughter board (970; 1070), which is mounted to a carrier structure (110; 710; 910; 1010; 1110; 1210), with a spacing between the daughter board (970; 1070) and a load board.

9. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 8, The test arrangement comprises a first antenna or antenna structure (750; 1050; 1150a-d; 1250) configured to receive an angled image of a device under test (140; 240; 340; 530；740；940；1040； 1140a-d; 1240) of a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) radiates a signal and / or is configured to transmit at an angle to the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) at a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) to be received.

10. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 9, The test arrangement comprises a first antenna or antenna structure (750; 1050; 1150a-d; 1250), wherein the aperture of the first antenna or antenna structure (750; 1050; 1150a-d; 1250) is arranged at an angle to the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) has a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) positioned at a distance such that the angled device under test (140; 240; 340; 530; 740; 940; 1040; A surface normal of a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) of a first antenna or antenna structure extends through an aperture of the first antenna or antenna structure.

11. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 9 to 10, Wherein a first antenna or antenna structure (750; 1050; 1150a-d; 1250) is mounted to have a fixed position relative to a socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of a device under test.

12. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 9 to 10, Wherein a first antenna or antenna structure (750; 1050; 1150a-d; 1250) is mechanically attached to an arm of an operator (754; 1054) such that the first antenna or antenna structure is movable.

13. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 9 to 12, The first antenna or antenna structure (750; 1050; 1150a-d; 1250) is configured to be connected to a signal source and / or a signal receiver (1056a, b) via a blind-mate microwave connector (1055) when an operator (754; 1054) has placed the first antenna or antenna structure in an operating position.

14. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 13, The test arrangement includes a second antenna or antenna structure (752; 1052) configured to receive an angled image of the device under test (140; 240; 340; 530；740；940；1040； 1140a-d; 1240) of the second outer surface (144b; 244b; 344b; 544b; 744b; 1044b) radiates signals and / or transmits signals at an angle to the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) at a second outer surface (144b; 244b; 344b; 544b; 744b; 1044b) to be received.

15. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 14, The test arrangement includes a second antenna or antenna structure (752; 1052), the aperture of the second antenna or antenna structure being arranged at an angle to the device under test (140; 240; 340; 530；740；940；1040； 1140a-d; 1240) and a second outer surface (144b; 244b; 344b; 544b; 744b; 1044b) are located at a certain distance so that the angled device under test (140; 240; 340; 530; 740; 940; 1040; A surface normal of a second outer surface (144b; 244b; 344b; 544b; 744b; 1044b) of the antenna structure 1140a-d; 1240) extends through an aperture of the second antenna or antenna structure.

16. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 14 to 15, Wherein the second antenna or antenna structure (752; 1052) is mechanically attached to the arm of the operator (754; 1054) so ​​that the second antenna or antenna structure is movable.

17. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 14 to 16, The second antenna or antenna structure (752; 1052) is used to angle the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) is pushed into the portion of the push rod (754) in the socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test, or wherein the second antenna or antenna structure is configured to be used to provide an angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) are pushed into the socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test and are movable together.

18. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 14 to 17, The second antenna or antenna structure (752; 1052) is configured to connect to a signal source and / or signal receiver (1056a, b) via a blind-mate microwave connection when an operator (754; 1054) has placed the second antenna or antenna structure in an operating position.

19. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 18, A socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of a device under test includes an angled recess or angled notch (860) configured to support and / or align an angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240).

20. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 19, The sockets (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test are arranged so that the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) is spaced at least 10 mm, or at least 30 mm, or at least 45 mm, or at least the angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) from the carrier structure (110; 710; 910; 1010; 1110; 1210). 1140a-d; 1240) of the lowest operating frequency, or at least 3 times the wavelength, or at least 4 times the wavelength; the second inner surface (142b; 242b; 742b) is angled with the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) are opposite to the second outer surface (144b; 244b; 344b; 544b; 744b; 1044b).

21. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 20, The height of the socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test is at least 10 mm, or at least 30 mm, or at least 45 mm, so that the angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) is spaced at least 10 mm, or at least 30 mm, or at least 45 mm, or at least the angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) from the carrier structure (110; 710; 910; 1010; 1110; 1210). 1140a-d; 1240), the second inner surface (142b; 242b; 742b) is at an angle to the device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) are opposite to the second outer surface (144b; 244b; 344b; 544b; 744b; 1044b).

22. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 21, A socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test includes one or more coaxial spring pins to establish an electrical connection between a carrier structure (110; 710; 910; 1010; 1110; 1210) and an angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240).

23. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 22, The expander structure is arranged between the carrier structure (110; 710; 910; 1010; 1110; 1210) and the socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, 1230b) of the device under test.

24. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to claim 24, The expander structure includes an expander component, The extender assembly includes one or more coaxial spring pins (978) to establish an electrical connection between a carrier structure (110; 710; 910; 1010; 1110; 1210) and an angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240).

25. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 24, wherein the test arrangement comprises at least two device under test sockets (130; 730; 830; 930; 1030; 1130a-d; 1230a, b), the device under test sockets being configured to carry respective angled devices under test, The sockets (130; 730; 830; 930; 1030; 1130a-d; 1230a, b) of at least two of the devices under test are arranged to position the respective angled devices under test so that the respective first outer surfaces (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) of the respective angled devices under test are aligned in opposite directions.

26. The test arrangement (100; 700; 900; 1000; 1100; 1200) according to one of claims 1 to 25, wherein the test arrangement comprises at least two rows (1215a, b) of sockets (130; 730; 830; 930; 1030; 1130a-d; 1230a, b) of the device under test, wherein the sockets (130; 730; 830; 930; 1030; 1130a-d; 1230a, b) of the device under test are configured to carry respective angled devices under test; At least two rows (1215a, b) of sockets (130; 730; 830; 930; 1030; 1130a-d; 1230a, b) of the devices under test are arranged to position respective angled devices under test so that respective first outer surfaces (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) of the respective angled devices under test are aligned in opposite directions.

27. A device for measuring an angled device (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) a test arrangement (100; 700; 900; 1000; 1100; 1200) for performing an over-the-air (OTA) test, wherein the test arrangement comprises a carrier structure (110; 710; 910; 1010; 1110; 1210); The test arrangement comprises a socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, b) of a device under test, the socket of the device under test being coupled to a carrier structure (110; 710; 910; 1010; 1110; 1210), The socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, b) of the device under test is configured to be aligned with an angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) or an inner surface (142a, 142b; 242a, 242b; 742a, 742b) of a device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) to establish electrical connections with connectors on the inner surfaces (142a, 142b; 242a, 242b; 742a, 742b), and wherein the device under test socket (130; 730; 830; 930; 1030; 1130a-d; 1230a, b) is configured to position the device under test at an angle, Make the angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) having a first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) spaced from a surface of the load plate; and The surface normal of the first outer surface (144a; 244a; 344a; 544a; 744a; 1044a; 1144a; 1244a) of the angled device under test is parallel to the surface of the load plate within an error range of ±15 degrees; Make the angled device under test (140; 240; 340; 530; 740; 940; 1040; 1140a-d; 1240) having a second outer surface (144b; 244b; 344b; 544b; 744b; 1044b) facing away from the load plate; and The surface normal of the second outer surface (144b; 244b; 344b; 544b; 744b; 1044b) of the angled device under test is perpendicular to the surface of the load board within an error range of ±15 degrees.

Images