Filter vat, semiconductor temperature control equipment and heat exchange control method

Abstract

The invention relates to the technical field of semiconductors, in particular to a filter vat, semiconductor temperature control equipment and a heat exchange control method. The filter barrel comprises an inner barrel arranged in an outer barrel and a filter element arranged in the inner barrel; a cooling medium channel and a circulating medium channel which do not communicate with each other are arranged between the outer barrel and the inner barrel, so that a cooling medium circulating along the cooling medium channel exchanges heat with a circulating medium circulating along the circulating medium channel; the outer barrel is provided with an outer circulating medium inlet, a cooling medium inlet and a cooling medium outlet, the outer circulating medium inlet is communicated with the circulating medium channel, and the cooling medium inlet and the cooling medium outlet are both communicated with the cooling medium channel; the inner barrel is provided with an inner circulation medium inlet and an inner circulation medium outlet, and the inner circulation medium inlet is communicated with the circulation medium channel; the outer circulating medium inlet is used for being communicated with an outer circulating medium conveying pipeline, and the inner circulating medium outlet is used for being communicated with an outer medium output pipeline. The filtering barrel integrates a cooling function and can be used for cooling a circulating medium.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a filter barrel, a semiconductor temperature control device and a heat exchange control method. Background Art

[0002] In the integrated circuit manufacturing process, semiconductor temperature control equipment provides accurate temperature for the main equipment, and the circulating medium used includes FC-3283, 7200, DI and other liquids. Taking the semiconductor temperature control equipment using DI liquid as the circulating liquid as an example, in order to achieve the temperature control requirements, the resistivity of the DI liquid needs to be kept above a certain value. Figure 1 The figure shows the control system of semiconductor temperature control equipment in the related art. A filter element is installed in the filter barrel (FL), and the filter element is filled with resin. By adjusting the opening of the electric valve SV11, the resistivity is guaranteed to be within the range required by the customer. When the resistivity measurement value is lower than the resistivity setting value, the electric control valve SV11 opens to filter the circulating liquid; when the resistivity measurement value is higher than the resistivity setting value, the electric control valve SV11 closes.

[0003] However, the temperature range of semiconductor temperature control equipment is 30℃~90℃, while the resin in the filter element in the filter barrel can withstand a temperature of 60℃. If the circulating medium temperature exceeds the maximum operating temperature of the filter element, it will affect the service life of the resin and the service life of the filter element, increase costs, and also cause the resistivity value to fail to meet customer requirements, affecting the process. Summary of the invention

[0004] The purpose of the present invention is to provide a filter barrel, a semiconductor temperature control device and a heat exchange control method, so as to solve the technical problems existing in the prior art to a certain extent that if the temperature of the circulating medium exceeds the maximum operating temperature of the filter element, it will affect the service life of the resin, affect the service life of the filter element, increase the cost, and also cause the resistivity value to fail to meet customer requirements, affecting the process.

[0005] The present invention provides a filter barrel, comprising: an outer barrel, an inner barrel and a filter element; the inner barrel is arranged in the outer barrel, and the filter element is arranged in the inner barrel; a cooling medium channel and a circulating medium channel that do not circulate with each other are provided between the outer barrel and the inner barrel, so that the cooling medium flowing along the cooling medium channel can exchange heat with the circulating medium flowing along the circulating medium channel; the outer barrel is provided with an external circulating medium inlet, a cooling medium inlet and a cooling medium outlet, the external circulating medium inlet is connected to the circulating medium channel, and the cooling medium inlet and the cooling medium outlet are both connected to the cooling medium channel; the inner barrel is provided with an internal circulating medium inlet and an internal circulating medium outlet, the internal circulating medium inlet is connected to the circulating medium channel; the external circulating medium inlet is used to be connected to an external circulating medium delivery pipeline, and the internal circulating medium outlet is used to be connected to an external medium output pipeline.

[0006] Furthermore, the filter barrel also includes a heat exchange pipe, a cavity is provided between the outer barrel and the inner barrel, and the heat exchange pipe is located in the cavity; one of the inner cavity of the heat exchange pipe and the cavity forms the cooling medium channel, and the other forms the circulating medium channel.

[0007] Furthermore, the cavity surrounds the inner barrel; the cavity forms the cooling medium channel, and the inner cavity of the heat exchange pipe forms the circulating medium channel.

[0008] Furthermore, the heat exchange pipe is spirally wrapped around the outside of the inner barrel.

[0009] Further, the external circulation medium inlet and the internal circulation medium inlet are located on both sides of the height direction of the outer barrel, the internal circulation medium inlet and the internal circulation medium outlet are located on both sides of the height direction of the inner barrel, the cooling medium inlet and the cooling medium outlet are located on both sides of the height direction of the outer barrel, and the cooling medium inlet and the external circulation medium inlet are located on both sides of the height direction of the outer barrel.

[0010] Furthermore, the filter barrel further comprises a temperature detection element, and the temperature detection element is arranged at the inlet of the internal circulation medium to detect the temperature of the circulation medium entering the filter element.

[0011] The present invention provides a semiconductor temperature control device, comprising the above-mentioned filter barrel, and also comprising: a circulating medium delivery pipeline, a circulating medium output pipeline, a cooling medium delivery pipeline and a cooling medium output pipeline; the circulating medium delivery pipeline is connected to the external circulating medium inlet, the circulating medium output pipeline is connected to the internal circulating medium outlet, the cooling medium delivery pipeline is connected to the cooling medium inlet, and the cooling medium output pipeline is connected to the cooling medium outlet.

[0012] Furthermore, the semiconductor temperature control device also includes a control system, a first control valve and a second control valve; the first control valve is connected to the cooling medium delivery pipeline, and the second control valve is connected to the circulating medium delivery pipeline; the filter barrel includes a temperature detection element, and the temperature detection element is arranged at the inlet of the internal circulation medium; the first control valve, the second control valve and the temperature detection element are all communicatively connected to the control system.

[0013] The present invention provides a heat exchange control method, comprising: detecting the working state of the second control valve, if the second control valve is in a closed state, the first control valve is closed; if the second control valve is in an open state, the temperature of the circulating medium entering the filter element is detected, if the detected temperature is lower than the maximum working temperature of the filter element, the first control valve is closed, if the detected temperature is higher than the maximum working temperature of the filter element, the first control valve is opened.

[0014] Furthermore, the temperature of the circulating medium entering the filter element is monitored in real time, and the opening of the first control valve is adjusted according to the real-time temperature of the circulating medium to adjust the flow rate of the cooling medium.

[0015] The filter barrel of the present invention has at least the following beneficial effects:

[0016] The filter barrel provided by the present invention has a built-in cooling structure and an integrated cooling function. It can cool the circulating medium and control the temperature of the circulating medium entering the filter element. The temperature of the circulating medium is controlled not to exceed the maximum operating temperature of the filter element, and the temperature of the circulating medium is guaranteed to be within the allowable temperature range of the filter element. The filter element can be protected, the service life of the filter element can be extended, and the replacement and maintenance of the filter element can be reduced, thereby reducing costs. The reliability of the filtering effect of the filter element is also guaranteed, thereby ensuring that the resistivity meets the requirements and further ensuring the process.

[0017] It should be understood that both the foregoing general description and the following specific embodiments are for the purpose of example and illustration and do not necessarily limit the present disclosure. The accompanying drawings, which are incorporated into and constitute a part of the specification, illustrate the subject matter of the present disclosure. At the same time, the specification and the drawings are used to explain the principles of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of a semiconductor temperature control device in the prior art;

[0020] Figure 2 This is a schematic diagram of the structure of a filter barrel according to an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of a semiconductor temperature control device according to an embodiment of the present invention;

[0022] Figure 4It is a control flow chart of the heat exchange control method according to an embodiment of the present invention.

[0023] icon:

[0024] 1-outer barrel; 11-external circulation medium inlet; 12-cooling medium inlet; 13-cooling medium outlet;

[0025] 2-inner barrel; 21-inner circulation medium inlet; 22-inner circulation medium outlet;

[0026] 3-Filter element;

[0027] 4-Cooling medium channel;

[0028] 5-Heat exchange pipe;

[0029] 6- Temperature detection element;

[0030] 100 - filter barrel; 200 - circulating medium delivery pipeline; 300 - circulating medium output pipeline; 400 - cooling medium delivery pipeline; 500 - cooling medium output pipeline; 600 - first control valve; 700 - second control valve. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0032] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0033] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0037] It should be noted that the maximum operating temperature of the filter element 3 can be the maximum temperature allowed by the resin, or it can be a maximum operating temperature set according to the specific conditions of the filter element 3 (for example, the maximum temperature allowed by other components of the filter element 3), and the set maximum operating temperature is lower than the maximum temperature allowed by the resin.

[0038] like Figure 2 As shown, the present invention provides a filter barrel 100, comprising: an outer barrel 1, an inner barrel 2 and a filter element 3; the inner barrel 2 is arranged in the outer barrel 1, and the filter element 3 is arranged in the inner barrel 2; a cooling medium channel 4 and a circulating medium channel that do not circulate with each other are provided between the outer barrel 1 and the inner barrel 2, so that the cooling medium flowing along the cooling medium channel 4 can exchange heat with the circulating medium flowing along the circulating medium channel; the outer barrel 1 is provided with an external circulating medium inlet 11, a cooling medium inlet 12 and a cooling medium outlet 13, the external circulating medium inlet 11 is connected to the circulating medium channel, and the cooling medium inlet 12 and the cooling medium outlet 13 are both connected to the cooling medium channel 4; the inner barrel 2 is provided with an internal circulating medium inlet 21 and an internal circulating medium outlet 22, the internal circulating medium inlet 21 is connected to the circulating medium channel; the external circulating medium inlet 11 is used to communicate with an external circulating medium delivery pipeline 200, and the internal circulating medium outlet 22 is used to communicate with an external medium output pipeline.

[0039] When the filter barrel 100 provided in this embodiment is applied to semiconductor equipment, when the circulating medium needs to be filtered, the circulating medium can enter the circulating medium channel in the outer barrel 1 through the outer circulating medium inlet 11, flow into the inner barrel 2 along the circulating medium channel, then flow through the filter element 3 in the inner barrel 2, and then flow out of the barrel from the inner circulating medium outlet 22. When it is necessary to cool the circulating medium to avoid affecting the filter element 3, the cooling medium is supplied into the barrel from the cooling medium inlet 12, the cooling medium flows along the cooling medium channel 4, and finally flows out from the cooling medium outlet 13. In the process of the cooling medium flowing along the cooling medium channel 4 and the circulating medium flowing along the circulating medium channel, the cooling medium and the circulating medium can indirectly exchange heat, the cooling medium cools the circulating medium, and reduces the temperature of the circulating medium entering the filter element 3, thereby avoiding the circulating medium temperature exceeding the maximum operating temperature of the filter element 3, thereby protecting the resin of the filter element 3, protecting the filter element 3, avoiding affecting the normal operation of the filter element 3, thereby ensuring that the resistivity can meet customer requirements, and avoiding affecting the service life of the filter element 3, reducing the use cost.

[0040] Therefore, the filter barrel 100 provided in this embodiment has a built-in cooling structure and an integrated cooling function. It can cool the circulating medium and control the temperature of the circulating medium entering the filter element 3. The temperature of the circulating medium is controlled not to exceed the maximum operating temperature of the filter element 3, and the temperature of the circulating medium is guaranteed to be within the allowable temperature range of the filter element 3. The filter element 3 can be protected, the service life of the filter element 3 can be extended, and the replacement and maintenance of the filter element 3 can be reduced, thereby reducing costs. The reliability of the filtering effect of the filter element 3 is also guaranteed, thereby ensuring that the resistivity meets the requirements and further ensuring the process.

[0041] There are many ways to achieve heat exchange between the cooling medium flowing along the cooling medium channel 4 and the circulating medium flowing along the circulating medium channel, for example: the filter barrel 100 includes multiple first tubes and multiple second tubes, a first tube and a second tube are arranged alternately in sequence, the inner cavity of the first tube forms a cooling medium heat exchange tube, and the inner cavity of the second tube forms a circulating medium heat exchange tube; the multiple first tubes are all connected to the cooling medium inlet 12 (the connection can be achieved by setting an intermediate pipeline) and are all connected to the cooling medium outlet 13; the multiple second tubes are all connected to the external circulating medium inlet 11 and are all connected to the internal circulating medium outlet 22; at this time, the cooling medium and the circulating medium achieve heat exchange through the tube wall of the first tube and the tube wall of the second tube.

[0042] For another example: the filter barrel 100 includes heat exchange plates stacked along a set direction, and two adjacent channels are formed between three adjacent layers of heat exchange plates, one channel is a cooling medium channel 4, and the other channel is a circulating medium channel, that is, multiple cooling medium channels 4 and multiple circulating medium channels are alternately arranged along the set direction, and the filter barrel 100 also includes a cooling medium inlet pipe, a cooling medium outflow pipe, a circulating medium inlet pipe and a circulating medium outflow pipe; multiple cooling medium channels 4 are all connected to the cooling medium inlet pipe, and are all connected to the cooling medium outflow pipe, the cooling medium inlet pipe is connected to the cooling medium inlet 12, and the cooling medium outflow pipe is connected to the cooling medium outlet 13; multiple circulating medium channels are all connected to the circulating medium inlet pipe, and are all connected to the circulating medium outflow pipe, the circulating medium inlet pipe is connected to the external circulating medium inlet 11, and the circulating medium outflow pipe is connected to the internal circulating medium outlet 22; at this time, the cooling medium and the circulating medium exchange heat through the heat exchange plates.

[0043] As an optional solution, the filter barrel 100 also includes a heat exchange pipe 5, a cavity is provided between the outer barrel 1 and the inner barrel 2, and the heat exchange pipe is located in the cavity; one of the inner cavity and the cavity of the heat exchange pipe 5 forms a cooling medium channel 4, and the other forms a circulating medium channel.

[0044] In this embodiment, the cavity wraps the heat exchange pipe 5, and the medium in the cavity can wrap the heat exchange pipe 5, so that the heat exchange between the medium in the cavity and the medium in the heat exchange pipe 5 is more direct, thereby improving the heat exchange efficiency and ensuring that the temperature of the circulating medium entering the filter element 3 is lower than the maximum operating temperature of the filter element 3.

[0045] The cavity can form a circulating medium channel, and the inner cavity of the heat exchange pipe 5 forms a cooling medium channel 4.

[0046] A cavity may be provided on one side of the inner barrel 2, for example, a space is provided between the outer barrel 1 and the inner barrel 2, a partition is provided in the space, and a cavity is formed between the inner wall of the outer barrel 1, the outer wall of the inner barrel 2 and the partition.

[0047] As an optional solution, the cavity surrounds the inner barrel 2, that is, there are gaps between the outer barrel 1 and the inner barrel 2 in the width direction of the outer barrel, and a cavity is formed between the inner wall of the outer barrel 1 and the outer wall of the inner barrel 2; the cavity forms a cooling medium channel, and the inner cavity of the heat exchange pipe 5 forms a circulating medium channel.

[0048] In this embodiment, the circulating medium flows along the heat exchange pipe 5, and the cooling medium flows along the cavity. The cooling medium in the cavity can not only wrap the heat exchange pipe 5 but also wrap the inner barrel 2. Therefore, the cooling medium can not only cool the circulating medium in the heat exchange pipe 5, but also cool the inner barrel 2, and further cool the filter element 3 and the circulating medium in the inner barrel 2, and can ensure that the working temperature of the filter element 3 is lower than the maximum working temperature.

[0049] Optionally, the inner barrel 2 is located at the center of the outer barrel 1, and the thickness of the cavity formed in the direction from the outer barrel to the inner barrel 2 is the same everywhere, that is, the cooling medium is evenly distributed between the outer barrel 1 and the inner barrel 2, so that the heat exchange is uniform.

[0050] Among them, the cross-sectional shape of the outer barrel 1 can be a triangle, a quadrilateral, a pentagon or an ellipse, etc., and the optional cross-sectional shape of the outer barrel 1 is circular, which is convenient for processing. The cross-sectional shape of the inner barrel 2 can be a triangle, a quadrilateral, a pentagon or an ellipse, etc., and the optional cross-sectional shape of the inner barrel 2 is circular, which is convenient for processing.

[0051] The heat exchange pipe 5 can have various structural forms, for example: the heat exchange pipe 5 includes multiple pipe sections, the pipe sections extend along the height direction of the outer barrel 1, and the multiple pipe sections are arranged at intervals along the four sides of the inner barrel 2 (if the cross-section of the inner barrel 2 is circular, it is along the circumferential direction of the inner barrel 2), and the multiple pipe sections are connected end to end in sequence, the opening of the first pipe section away from the next pipe section is connected to the external circulation medium inlet 11, and the opening of the last pipe section away from the previous pipe section is connected to the internal circulation medium outlet 22.

[0052] As an alternative, Figure 2 As shown, the heat exchange pipe 5 is spirally wound around the inner barrel 2, with a simple structure, which can make the circulating medium always move downward or upward, thereby reducing the pressure loss of the circulating medium.

[0053] As an alternative, Figure 2 As shown, the external circulation medium inlet 11 and the internal circulation medium inlet 21 are located on both sides of the height direction of the outer barrel 1, so that the circulation medium flow can have a certain height to ensure the cooling effect. The internal circulation medium inlet 21 and the internal circulation medium outlet 22 are located on both sides of the height direction of the inner barrel 2, so that the circulation medium can flow through the entire filter element 3 to ensure the filtering effect, thereby ensuring that the resistivity meets the requirements. The cooling medium inlet 12 and the cooling medium outlet 13 are located on both sides of the height direction of the outer barrel 1, and the cooling medium inlet 12 and the external circulation medium inlet are located on both sides of the height direction of the outer barrel 1, which can realize the cross-flow of the circulation medium and the cooling medium and improve the heat exchange efficiency.

[0054] The external circulating medium inlet 11 may be disposed at the bottom of the outer barrel 1 .

[0055] As an optional solution, the external circulation medium inlet 11 is set at the top of the outer barrel 1. At this time, the internal circulation medium inlet 21 is located at the bottom of the inner barrel 2, and the internal circulation medium outlet 22 is located at the top of the inner barrel 2. Such a setting can realize the circulation of the entire circulation medium from top to bottom along the heat exchange pipe 5 to reduce the pressure drop. The circulation medium enters the filter element 3 from the bottom of the inner barrel 2 and then flows out of the filter element 3 from the top of the inner barrel 2, so that the circulation medium is in more complete contact with the filter element 3 and the filtering effect is better.

[0056] like Figure 2 As shown, based on any of the above embodiments, the filter barrel 100 also includes a temperature detection element 6, which is arranged at the internal circulation medium inlet 21 to detect the temperature of the circulating medium entering the filter element 3, and the temperature detection element 6 can be communicated with the control system of the semiconductor temperature control device.

[0057] In this embodiment, the temperature detection element 6 (for example, a temperature sensor, a thermometer, etc.) can detect the temperature of the circulating medium entering the filter element 3. If the measured temperature is higher than the maximum operating temperature of the filter element 3, the cooling medium is passed into the filter barrel 100 to cool the circulating medium. If the measured temperature is lower than the maximum operating temperature of the filter element 3, there is no need to supply cooling medium to the filter barrel 100, and there is no need to cool the circulating medium, which can save energy.

[0058] like Figure 3 As shown, the present invention provides a semiconductor temperature control device, including a filter barrel 100 of any of the above-mentioned technical solutions, and also including: a circulating medium delivery pipeline 200, a circulating medium output pipeline 300, a cooling medium delivery pipeline 400 and a cooling medium output pipeline 500; the circulating medium delivery pipeline 200 is connected to the external circulating medium inlet 11, the circulating medium output pipeline 300 is connected to the internal circulating medium outlet, the cooling medium delivery pipeline 400 is connected to the cooling medium inlet 12, and the cooling medium output pipeline 500 is connected to the cooling medium outlet 13.

[0059] In this embodiment, when the measured resistivity value of the circulating medium is lower than the set resistivity value of the circulating medium, the circulating medium needs to be filtered, and the circulating medium is controlled to enter the circulating medium channel through the circulating medium delivery pipe 200. If the temperature of the circulating medium is lower than the maximum operating temperature of the filter element 3, the circulating medium does not need to be cooled, and can directly enter the filter element 3 for filtration. If the temperature of the circulating medium is higher than the maximum operating temperature of the filter element 3, the circulating medium needs to be cooled, and the cooling medium is delivered to the cooling medium channel 4 through the cooling medium delivery pipe 400 to cool the circulating medium. The semiconductor temperature control device provided in this embodiment can achieve cooling of the circulating medium, so that the filter element 3 works within a suitable temperature range, the filter element 3 has a long service life, and the filtering effect is reliable, so that it can be ensured that the resistivity of the circulating medium meets the requirements, and the temperature control accuracy of the semiconductor temperature control device can be ensured to be high.

[0060] like Figure 3 As shown, based on the above embodiment, further, the semiconductor temperature control device also includes a control system, a first control valve 600 ( Figure 4 SV11 shown in FIG. 1 ) and the second control valve 700 ( Figure 4 SV12 shown in FIG); the first control valve 600 is connected to the cooling medium delivery pipeline 400, and the second control valve 700 is connected to the circulating medium delivery pipeline 200; the filter barrel 100 includes a temperature detection element 6 ( Figure 4 TS104 shown in FIG. 1 ), the temperature detection element 6 is arranged at the internal circulation medium inlet 21; the first control valve 600, the second control valve 700 and the temperature detection element 6 are all connected to the control system for communication.

[0061] The first control valve 600 and the second control valve 700 are both electric control valves, such as electric valves or solenoid valves, etc. The first control valve 600 can open and close the cooling medium delivery pipeline 400 and adjust the flow rate of the cooling medium, and the second control valve 700 can open and close the circulating medium delivery pipeline 200 and adjust the flow rate of the circulating medium.

[0062] According to a heat exchange control method, the working state of the second control valve 700 is detected. If the second control valve 700 is in a closed state, the first control valve 600 is closed; if the second control valve 700 is in an open state, the temperature of the circulating medium entering the filter element 3 is detected. If the detected temperature is lower than the maximum working temperature of the filter element 3, the first control valve 600 is closed; if the detected temperature is higher than the maximum working temperature of the filter element 3, the first control valve 600 is opened.

[0063] Specifically, Figure 4As shown, the maximum operating temperature of the filter element 3 can be input to the control system through an input device (e.g., a keyboard or a touch screen, etc.). If the second control valve 700 is in a closed state, it means that the circulating medium does not need to be filtered, and the circulating medium does not circulate in the filter barrel 100, so there is no need to cool the circulating medium, and the control system controls the first control valve 600 to be closed. If the second control valve 700 is not in an open state, it means that the circulating medium circulates in the filter barrel 100. At this time, the temperature detection element 6 detects the temperature of the circulating medium entering the filter element 3. If the detected temperature is lower than the maximum operating temperature of the filter element 3, the control system controls the first control valve 600 to be closed; if the detected temperature is higher than the maximum operating temperature of the filter element 3, the control system controls the first control valve 600 to be opened, thereby cooling the circulating medium. In this way, the first control valve 600 can be opened when needed, so as to supply cooling medium into the filter barrel 100. When cooling is not required, the first control valve 600 is closed to avoid the cooling medium from working ineffectively, saving energy, and reducing the use cost.

[0064] Furthermore, the temperature of the circulating medium entering the filter element 3 is monitored in real time, and the opening of the first control valve 600 is adjusted according to the real-time temperature of the circulating medium to adjust the flow rate of the cooling medium.

[0065] Specifically, the temperature detection element 6 detects the temperature of the circulating medium entering the filter element 3 in real time and transmits the data to the control system. The control system can adjust the opening of the first control valve 600 according to the difference between the real-time temperature of the circulating medium and the set maximum operating temperature, that is, adjust the flow rate of the cooling medium. On the one hand, it can cool the circulating medium in time, and on the other hand, it avoids wasting too much power of the circulating cooling medium, reduces energy consumption, achieves energy saving, and can further reduce the cost of use.

[0066] Furthermore, the semiconductor temperature control device also includes a circulation pump and a storage box for cooling the cooling medium (the storage box has a cooling function and can be of a conventional structure), the cooling medium delivery pipeline 400 is connected to the outlet of the storage box, and the cooling medium output pipeline 500 is connected to the inlet of the storage box. The circulation pump can be set in one of the cooling medium delivery pipeline 400 and the cooling medium output pipeline 500 to provide power for the circulation of the cooling medium. The cooling medium after passing through the filter barrel 100 is heated up, and it returns to the storage box along the cooling medium output pipeline 500. The cooling medium is cooled in the storage box to maintain a stable cooling temperature. The cooling medium enters the cooling medium delivery pipeline 400 from the outlet of the storage box, and then enters the cooling medium channel 4 in the barrel.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention. In the description provided herein, a large number of specific details are described. However, it can be understood that the embodiments of the present invention can be practiced without these specific details. In some examples, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description. In addition, those skilled in the art can understand that although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments means being within the scope of the present invention and forming different embodiments.

Claims

1. A filter barrel, characterized in that: include: An outer barrel (1), an inner barrel (2) and a filter element (3); The inner barrel (2) is arranged in the outer barrel (1), and the filter element (3) is arranged in the inner barrel (2); A cooling medium channel (4) and a circulating medium channel that do not flow between the outer barrel (1) and the inner barrel (2) are provided so that the cooling medium flowing along the cooling medium channel (4) can exchange heat with the circulating medium flowing along the circulating medium channel; The outer barrel (1) is provided with an external circulation medium inlet (11), a cooling medium inlet (12) and a cooling medium outlet (13); the external circulation medium inlet (11) is connected to the circulation medium channel; the cooling medium inlet (12) and the cooling medium outlet (13) are both connected to the cooling medium channel (4); the inner barrel (2) is provided with an internal circulation medium inlet (21) and an internal circulation medium outlet (22); the internal circulation medium inlet (21) is connected to the circulation medium channel; the external circulation medium inlet (11) is used to be connected to an external circulation medium delivery pipeline (200); the internal circulation medium outlet (22) is used to be connected to an external medium output pipeline.

2. The filter barrel according to claim 1, characterized in that: The filter barrel further comprises a heat exchange pipe (5); a cavity is provided between the outer barrel (1) and the inner barrel (2), and the heat exchange pipe (5) is located in the cavity; one of the inner cavity of the heat exchange pipe (5) and the cavity forms the cooling medium channel (4), and the other forms the circulating medium channel.

3. The filter barrel according to claim 2, characterized in that: The cavity surrounds the inner barrel (2); the cavity forms the cooling medium channel (4), and the inner cavity of the heat exchange pipe (5) forms the circulating medium channel.

4. The filter barrel according to claim 3, characterized in that: The heat exchange pipe (5) is spirally wound around the outside of the inner barrel (2).

5. The filter barrel according to claim 1, characterized in that: The external circulation medium inlet (11) and the internal circulation medium inlet (21) are located on both sides of the height direction of the outer barrel (1), the internal circulation medium inlet (21) and the internal circulation medium outlet (22) are located on both sides of the height direction of the inner barrel (2), the cooling medium inlet (12) and the cooling medium outlet (13) are located on both sides of the height direction of the outer barrel (1), and the cooling medium inlet (12) and the external circulation medium inlet are located on both sides of the height direction of the outer barrel (1).

6. The filter barrel according to any one of claims 1 to 5, characterized in that: The filter barrel further comprises a temperature detection element (6), wherein the temperature detection element (6) is arranged at the internal circulation medium inlet (21) to detect the temperature of the circulation medium entering the filter element (3).

7. A semiconductor temperature control device, characterized in that: The filter barrel comprises the filter barrel as described in any one of claims 1 to 6, and further comprises: a circulating medium delivery pipe (200), a circulating medium output pipe (300), a cooling medium delivery pipe (400) and a cooling medium output pipe (500); the circulating medium delivery pipe (200) is connected to the external circulating medium inlet (11), the circulating medium output pipe (300) is connected to the internal circulating medium outlet, the cooling medium delivery pipe (400) is connected to the cooling medium inlet (12), and the cooling medium output pipe (500) is connected to the cooling medium outlet (13).

8. The semiconductor temperature control device according to claim 7, characterized in that: The semiconductor temperature control device also includes a control system, a first control valve (600) and a second control valve (700); the first control valve (600) is connected to the cooling medium delivery pipeline (400), and the second control valve (700) is connected to the circulating medium delivery pipeline (200); the filter barrel includes a temperature detection element (6), and the temperature detection element (6) is arranged at the internal circulating medium inlet (21); the first control valve (600), the second control valve (700) and the temperature detection element (6) are all connected to the control system for communication.

9. A heat exchange control method, used for the semiconductor temperature control device according to claim 8, characterized in that: The working state of the second control valve is detected. If the second control valve is in a closed state, the first control valve is closed. If the second control valve is in an open state, the temperature of the circulating medium entering the filter element is detected. If the detected temperature is lower than the maximum working temperature of the filter element, the first control valve is closed. If the detected temperature is higher than the maximum working temperature of the filter element, the first control valve is opened.

10. The heat exchange control method according to claim 9, characterized in that: The temperature of the circulating medium entering the filter element is monitored in real time, and the opening of the first control valve is adjusted according to the real-time temperature of the circulating medium to adjust the flow rate of the cooling medium.

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