Semiconductor raw material pulverizer

Abstract

The invention belongs to the technical field of semiconductor raw material smashing, and particularly discloses a semiconductor raw material smashing machine which comprises a connecting base and a containing cavity detachably connected to the connecting base, a smashing structure is detachably connected to the interior of the containing cavity, and material pushing structures are distributed on the portions, located on the two sides of the smashing structure, of the containing cavity. A discharging structure is arranged on the portion, close to the pushing structure, of the containing cavity. A pushing hydraulic cylinder in the pulverizer can drive a pushing piece to move in a containing cavity, at the moment, semiconductor raw materials in the containing cavity can be gathered around a hammer head, the semiconductor raw materials can be conveniently pulverized through the hammer head and a pulverizing piece, and the pulverized semiconductor raw materials can be pushed by the pushing piece to move; and meanwhile, the crushed semiconductor raw materials can be discharged into the collecting cavity through the discharging hole, the pushing piece can drive the upper grinding column to move through the inclined part, and at the moment, the upper grinding column can be matched with the lower grinding column to grind the semiconductor raw materials in the collecting cavity.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor raw material crushing, and specifically discloses a semiconductor raw material crusher. Background Art

[0002] Semiconductor raw materials are the basic materials for manufacturing semiconductor devices and integrated circuits. Their electrical conductivity is between that of conductors and insulators. Common semiconductor materials include silicon, germanium, gallium quaternary, etc., among which silicon is the most influential one. When semiconductors are made, the raw materials of semiconductors need to be crushed, and at this time a crusher is needed; A traditional crusher usually consists of a crushing structure and a collecting structure. The staff places the semiconductor raw materials inside the collecting structure in advance, and then the crushing structure connected to the collecting structure can crush the semiconductor raw materials, and then the collecting structure can transport the crushed semiconductor raw materials to the outside. This crusher can indeed have a good crushing effect on the semiconductor raw materials, but the interior of the collecting structure is not provided with a good material guiding structure. When the semiconductor raw materials are placed inside the collecting structure, the crushed semiconductor raw materials will be mixed with the uncrushed semiconductor raw materials, which cannot be convenient for the crushed semiconductor raw materials to be discharged, and it is also inconvenient for the uncrushed semiconductor raw materials to contact the crushing structure, resulting in low crushing efficiency of the semiconductor raw materials, and also low efficiency of semiconductor raw material discharge.

[0003] Therefore, the existing pulverizers cannot meet the needs in actual use, so there is an urgent need for improved technology to solve the above problems. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a semiconductor raw material pulverizer to solve the above-mentioned problems.

[0005] To achieve the above objectives, the present invention provides a semiconductor raw material crusher, comprising a connecting base and a storage chamber detachably connected to the connecting base, wherein a crushing structure is detachably connected to the interior of the storage chamber, pusher structures are distributed on both sides of the crushing structure on the storage chamber, and a discharge structure is arranged on a portion of the storage chamber close to the pusher structure; The pushing structure includes a pushing sheet distributed inside the storage chamber, the pushing sheet is fixedly connected to a dividing sheet on one side close to the crushing structure, the top and bottom surfaces of the dividing sheet are both provided with friction parts, an arc-shaped end head is provided at one end of the dividing sheet close to the crushing structure, connecting films are fixedly connected to the two sides of the pushing sheet, a connecting groove is provided on the storage chamber, the connecting film is fixed to the side wall of the connecting groove, a through hole and a sliding groove are provided on the storage chamber below the pushing sheet, the bottom end of the pushing sheet is fixedly connected to a through bar, the through bar penetrates the storage chamber through the through hole, the through bar is fixedly connected to a sliding bar, the sliding bar is slidably connected to the storage chamber through the sliding groove, the storage chamber is detachably connected to a mounting bracket, the mounting bracket is connected to a pushing hydraulic cylinder, and the output end of the pushing hydraulic cylinder penetrates the storage chamber and is fixedly connected to the pushing sheet; The cutting section is a sheet-like structure. When the cutting section cooperates with the hammer to crush the semiconductor raw material, the friction part can rub the cut semiconductor raw material, and can further crush the cut semiconductor raw material. The friction part is a rough surface structure arranged on the cutting section. When the hydraulic cylinder drives the pushing sheet to push the semiconductor raw material, the cutting section can drive the arc-shaped end head to cut the semiconductor raw material.

[0006] In the above technical solution, further, the discharge structure includes a flow-gathering portion arranged on the bottom wall of the storage chamber, the flow-gathering portion is provided with a discharge hole, the bottom surface of the storage chamber is fixedly connected with a collecting chamber, the collecting chamber is communicated with the inner cavity of the storage chamber through the discharge hole, the collecting chamber is fixedly connected with a discharge pipe, the inner cavity of the discharge pipe is communicated with the inner cavity of the collecting chamber; When the semiconductor raw material is crushed, the crushed semiconductor raw material in the receiving chamber can pass through the discharge hole into the interior of the collecting chamber, and then the semiconductor raw material in the collecting chamber can be discharged through the discharge pipe.

[0007] In the above technical solution, further, the flow-gathering part is arranged below the pushing piece, the top surface of the flow-gathering part near the discharge hole is concave downward, and the discharge holes are arranged on both sides of the through hole; After the semiconductor raw material is crushed inside the storage chamber, the crushed semiconductor raw material can pass through the converging portion and through the discharge hole into the collecting chamber.

[0008] In the above technical solution, further, a push block is fixedly connected to the lower end of the penetration bar, the push block is distributed inside the collection chamber, an inclined portion is provided on the side of the push block away from the discharge pipe, and the bottom surface of the push block abuts against a guide block; When the pushing sheet moves inside the receiving cavity, the inclined portion on the pushing block can push the semiconductor raw material in the collecting cavity, which can facilitate laying the semiconductor raw material on the guide block.

[0009] In the above technical solution, further, the bottom surface of the push block is distributed with upper grinding columns in a matrix shape, the top surface of the guide block is distributed with lower grinding columns in a matrix shape, the top surface of the guide block is provided with a guide portion, and a discharge hole is opened on the guide block near the upper end of the discharge pipe; When the pushing block moves inside the collecting chamber, the upper grinding column cooperates with the lower grinding column to grind the semiconductor raw material, and then the ground semiconductor raw material can be discharged into the discharge pipe.

[0010] In the above technical solution, further, the bottom wall of the inner cavity of the storage chamber is provided with a diverter, the diverter is a conical structure, the crushing structure includes a transmission rod passing through the diverter, the bottom surface of the storage chamber is detachably connected to a transmission motor, and the output end of the transmission motor is fixedly connected to the transmission rod; When the transmission motor drives the hammer head to crush the semiconductor raw material through the transmission rod, the crushed semiconductor raw material can be transported to the focusing part through the diversion part, and at this time, the crushed semiconductor raw material can be guided to the discharge hole through the focusing part.

[0011] In the above technical solution, further, the transmission rod is evenly spaced with top discs and bottom discs, the bottom discs are distributed below the top discs, connecting rods are evenly spaced between the top discs and the bottom discs, the connecting rods are connected between the top discs and the bottom discs by rivets, and a hammer head is fixedly connected to one end of the connecting rod away from the transmission rod; The transmission rod can drive the hammer head to crush the semiconductor raw material through the connecting rod. Since the connecting rods are evenly distributed between the top disc and the bottom disc, the hammer head can quickly crush the semiconductor raw material.

[0012] In the above technical solution, further, the storage chamber is penetrated by a mounting roller, the top wall of the inner cavity of the storage chamber is fixedly connected with a rotating seat, the rotating seat is sleeved with a transmission rod, the mounting roller is fixedly connected with a crushing piece at one end close to the transmission rod, the crushing piece does not contact the hammer head and the dividing slice, the top surface of the storage chamber is provided with a connection port close to the dividing slice, and the top surface of the storage chamber is connected with a controller; When the crushing piece is used in conjunction with the hammer head and the dividing piece, the semiconductor raw materials inside the storage cavity can be quickly crushed, and the crushing efficiency of the semiconductor raw materials can be improved.

[0013] Compared with the prior art, the present invention has the following beneficial effects: The pushing hydraulic cylinder in the crusher can drive the pushing plate to move inside the storage chamber. At this time, the semiconductor raw materials inside the storage chamber can be gathered around the hammer head, which can facilitate the crushing of the semiconductor raw materials by the hammer head and the crushing plate.

[0014] 2. When the push plate in the pulverizer pushes the semiconductor raw material, the pulverized semiconductor raw material can move under the push of the push plate, and at the same time, the pulverized semiconductor raw material can be discharged into the collecting chamber through the discharge hole.

[0015] 3. When the push plate in the pulverizer moves inside the storage chamber, the push plate can drive the upper grinding column to move through the inclined portion. At this time, the upper grinding column can cooperate with the lower grinding column to grind the semiconductor raw materials inside the collection chamber.

[0016] 4. When the pushing piece in the pulverizer pushes the semiconductor raw material, the dividing slice can cooperate with the crushing piece and the hammer head to crush the uncrushed semiconductor raw material, which can facilitate the crushing processing of the uncrushed semiconductor raw material. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 This is a diagram showing the connection structure between the push piece and the storage cavity in the present invention; Figure 3 Schematic diagram of the distribution of crushing pieces and hammers in the present invention; Figure 4 It is a schematic diagram of the distribution of the connecting grooves and the crushing pieces in the present invention; Figure 5 The diagram is a schematic diagram of the distribution of the slices and hammers in the present invention; Figure 6 This is a diagram of the connection structure of the connecting rod and the top disc and the bottom disc in the present invention; Figure 7 It is a connection structure diagram of the pushing hydraulic cylinder and the pushing plate in the present invention; Figure 8 for Figure 2 A is an enlarged view of the middle image.

[0018] 1. Storage chamber; 2. Pushing hydraulic cylinder; 3. Connecting base; 4. Transmission rod; 5. Crushing piece; 6. Mounting roller; 7. Pushing piece; 8. Friction part; 9. Slicing piece; 10. Discharge pipe; 11. Transmission motor; 12. Connecting groove; 13. Bottom disc; 14. Hammer; 15. Top disc; 16. Mounting bracket; 17. Collecting chamber; 18. Diverter; 19. Converging part; 20. Discharge hole; 21. Rotating seat; 22. Through hole; 23. Sliding groove; 24. Guide block; 25. Discharge hole; 26. Lower grinding column; 27. Guide part; 28. Connecting film; 29. ​​Through strip; 30. Sliding strip; 31. Pushing block; 32. Upper grinding column; 33. Inclined part; 34. Rivet; 35. Connecting rod; 36. Connecting port; 37. Arc end; 38. Controller. DETAILED DESCRIPTION

[0019] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0021] See also Figure 1-8 As shown, the present invention is a semiconductor raw material crusher, comprising a connecting base 3 and a storage chamber 1 detachably connected to the connecting base 3, a crushing structure is detachably connected inside the storage chamber 1, a pushing structure is distributed on both sides of the crushing structure on the storage chamber 1, and a discharge structure is arranged near the pushing structure on the storage chamber 1; The storage chamber 1 is connected to the external material guiding structure via the connection port 36 . The external material guiding structure can transport the semiconductor raw materials to the interior of the storage chamber 1 . The semiconductor raw materials entering the storage chamber 1 can be crushed by the crushing structure.

[0022] The pushing structure includes a pushing piece 7 distributed inside the storage chamber 1, a dividing piece 9 is fixedly connected to one side of the pushing piece 7 close to the crushing structure, a friction portion 8 is provided on the top and bottom surfaces of the dividing piece 9, an arc-shaped end 37 is provided at one end of the dividing piece 9 close to the crushing structure, connecting rubber pieces 28 are fixedly connected to both sides of the pushing piece 7, the connecting rubber pieces 28 are made of rubber, a connecting groove 12 is provided on the storage chamber 1, the connecting rubber pieces 28 are fixed to the side walls of the connecting groove 12, a through hole 22 and a sliding groove 23 are provided on the storage chamber 1 below the pushing piece 7, a through bar 29 is fixedly connected to the bottom end of the pushing piece 7, the through bar 29 penetrates the storage chamber 1 through the through hole 22, a sliding bar 30 is fixedly connected to the through bar 29, the sliding bar 30 is slidably connected to the storage chamber 1 through the sliding groove 23, a mounting bracket 16 is detachably connected to the storage chamber 1, a pushing hydraulic cylinder 2 is connected to the mounting bracket 16, and the output end of the pushing hydraulic cylinder 2 penetrates the storage chamber 1 and is fixedly connected to the pushing piece 7; When the staff starts the pushing hydraulic cylinder 2, the output end of the pushing hydraulic cylinder 2 can drive the pushing piece 7 to push the semiconductor raw material. At this time, the cutting piece 9 can cut the uncrushed semiconductor raw material. It should be noted that the pushing hydraulic cylinder 2 does not work at the same time as the transmission motor 11. When the pushing hydraulic cylinder 2 drives the pushing piece 7 to move inside the storage chamber 1, the through bar 29 can drive the sliding bar 30 to slide inside the sliding groove 23. At this time, the pushing piece 7 can be directional moved inside the storage chamber 1.

[0023] The discharge structure includes a focusing portion 19 arranged on the bottom wall of the storage chamber 1, and a discharge hole 20 is opened on the focusing portion 19. The bottom surface of the storage chamber 1 is fixedly connected with the collecting chamber 17, and the collecting chamber 17 is communicated with the inner cavity of the storage chamber 1 through the discharge hole 20. A discharge pipe 10 is fixedly connected to the collecting chamber 17, and the inner cavity of the discharge pipe 10 is communicated with the inner cavity of the collecting chamber 17. The focusing portion 19 is distributed below the pushing piece 7, and the top surface of the focusing portion 19 is concave near the discharge hole 20, and the discharge holes 20 are distributed on both sides of the through hole 22; When the pushing sheet 7 pushes the semiconductor raw material, the crushed semiconductor raw material particles will be smaller than the uncrushed semiconductor raw material particles. Since the uncrushed semiconductor raw material particles are larger, there will be larger gaps between the uncrushed semiconductor raw material particles. At this time, the crushed semiconductor raw material particles will penetrate the uncrushed semiconductor raw material particles and flow downward under the action of gravity. At this time, the focusing portion 19 can gather the crushed semiconductor raw materials, and the semiconductor raw materials gathered by the focusing portion 19 can pass through the discharge hole 20 and enter the interior of the collecting chamber 17.

[0024] The lower end of the penetration bar 29 is fixedly connected with a push block 31, which is distributed inside the collecting chamber 17. The push block 31 is provided with an inclined portion 33 on the side away from the discharge pipe 10, and the bottom surface of the push block 31 abuts against the guide block 24. When the crushed semiconductor raw material enters the collecting chamber 17 , the pushing block 31 can push the semiconductor raw material through the inclined portion 33 . Since the pushing block 31 repeatedly moves inside the collecting chamber 17 , the pushing block 31 can drive the semiconductor raw material to be evenly laid on the guide portion 27 when moving.

[0025] The bottom surface of the push block 31 is provided with upper grinding columns 32 in a matrix shape, the top surface of the guide block 24 is provided with lower grinding columns 26 in a matrix shape, the top surface of the guide block 24 is provided with a guide portion 27, and the upper end of the guide block 24 near the discharge pipe 10 is provided with a discharge hole 25; When the crushed semiconductor raw material is laid on the guide part 27, the pushing block 31 can drive the upper grinding column 32 and the lower grinding column 26 to grind the semiconductor raw material. The ground semiconductor raw material can pass through the discharge hole 25 and enter the interior of the discharge pipe 10, so that the ground semiconductor raw material can be discharged through the discharge pipe 10.

[0026] The bottom wall of the inner cavity of the storage chamber 1 is provided with a diverter 18, and the diverter 18 is a conical structure. The crushing structure includes a transmission rod 4 that runs through the diverter 18. The bottom surface of the storage chamber 1 is detachably connected to a transmission motor 11, and the output end of the transmission motor 11 is fixedly connected to the transmission rod 4. The transmission rod 4 is evenly spaced with top discs 15 and bottom discs 13, and the bottom discs 13 are distributed below the top discs 15. Connecting rods 35 are evenly spaced between the top discs 15 and the bottom discs 13, and the connecting rods 35 are connected by rivets 3. 4 is connected between the top disc 15 and the bottom disc 13, the end of the connecting rod 35 away from the transmission rod 4 is fixedly connected to the hammer 14, the installation roller 6 runs through the storage chamber 1, the top wall of the inner cavity of the storage chamber 1 is fixedly connected to the rotating seat 21, the rotating seat 21 is sleeved with the transmission rod 4, the end of the installation roller 6 close to the transmission rod 4 is fixedly connected to the crushing piece 5, the crushing piece 5 does not contact the hammer 14 and the dividing slice 9, the top surface of the storage chamber 1 is provided with a connection port 36 close to the dividing slice 9, and the top surface of the storage chamber 1 is connected to a controller 38; When the storage chamber 1 is connected to the external material guide structure through the connection port 36, the external material guide structure can inject the semiconductor raw material into the storage chamber 1 through the connection port 36. At this time, the staff starts the transmission motor 11 to work, and the output shaft of the transmission motor 11 can drive the connecting rod 35 to rotate through the transmission rod 4. The connecting rod 35 can drive the hammer head 14 to cooperate with the crushing piece 5 and the dividing piece 9 to crush the semiconductor raw material. The crushed semiconductor raw material can be guided to the focusing part 19 through the diversion part 18, and then the semiconductor raw material inside the focusing part 19 can pass through the discharge hole 20 and enter the inside of the collecting chamber 17; The controller 38 can be selected as a PLC controller currently available on the market. A computer control program can be placed inside the controller 38. The controller 38 can control the transmission motor 11 to work intermittently. At the same time, the controller 38 can control the transmission motor 11 to not work, so as to push the hydraulic cylinder 2 to drive the push piece 7 to move inside the storage chamber 1. When the crusher is in use, the staff will pre-connect the connection port 36 with the external material guiding structure. The external material guiding structure can inject the semiconductor raw material into the interior of the storage chamber 1 through the connection port 36. When the semiconductor raw material is injected into the interior of the storage chamber 1, the controller 38 controls the transmission motor 11 to work. It should be added that the transmission motor 11 works intermittently. When the transmission motor 11 is not working, the controller 38 controls the pushing hydraulic cylinder 2 to work. When the pushing hydraulic cylinder 2 drives the pushing piece 7 to reset, the controller 38 continues to control the transmission motor 11 to work. When the transmission motor 11 is working, the output shaft of the transmission motor 11 can drive the connecting rod 35 to rotate through the transmission rod 4. The connecting rod 35 can drive the hammer head 14 to cooperate with the crushing piece 5 and the dividing piece 9 to crush the semiconductor raw material. When the pushing piece 7 moves inside the storage chamber 1, the pushing piece 7 can push the semiconductor raw material. The crushed semiconductor raw material can be guided to the focusing part 19 through the diversion part 18, and then the semiconductor raw material inside the focusing part 19 can pass through the discharge hole 20 and enter the collection The inside of the cavity 17 and the uncrushed semiconductor raw materials can be cut by the cutting slices 9. After the semiconductor raw materials are cut, the friction part 8 can rub the semiconductor raw materials, so that the cut semiconductor raw materials can be further crushed. Since a connecting film 28 is connected between the pushing piece 7 and the connecting groove 12, the connecting film 28 can block the gap between the pushing piece 7 and the connecting groove 12, so as to prevent the crushed semiconductor raw materials from entering the inside of the connecting groove 12. When the crushed semiconductor raw materials enter the inside of the collecting chamber 17, the crushed semiconductor raw materials can fall onto the guide part 27. At the same time, the pushing block 31 can push the semiconductor raw materials through the inclined part 33, so that the crushed semiconductor raw materials can be evenly distributed on the guide block 24. When the pushing block 31 is moving, the upper grinding column 32 and the lower grinding column 26 can grind the crushed semiconductor raw materials again. The ground semiconductor raw materials can pass through the discharge hole 25 and enter the inside of the discharge pipe 10, and the discharge pipe 10 can discharge the ground semiconductor raw materials.

[0027] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor raw material crusher, comprising a connecting base (3) and a storage chamber (1) detachably connected to the connecting base (3), characterized in that: The interior of the storage chamber (1) is detachably connected to a crushing structure, and pusher structures are distributed on both sides of the crushing structure on the storage chamber (1), and a discharge structure is provided at a position of the storage chamber (1) close to the pusher structure; The pushing structure comprises a pushing sheet (7) distributed inside the storage chamber (1); a dividing sheet (9) is fixedly connected to the side of the pushing sheet (7) close to the crushing structure; the top and bottom surfaces of the dividing sheet (9) are both provided with a friction portion (8); an arc-shaped end (37) is provided at one end of the dividing sheet (9) close to the crushing structure; connecting films (28) are fixedly connected to the two sides of the pushing sheet (7); a connecting groove (12) is provided on the storage chamber (1); the connecting film (28) is fixed to the side wall of the connecting groove (12); and a connecting film (28) is provided on the storage chamber (1) below the pushing sheet (7). A through hole (22) and a sliding groove (23), the bottom end of the pushing sheet (7) is fixedly connected with a through bar (29), the through bar (29) penetrates the storage chamber (1) through the through hole (22), a sliding bar (30) is fixedly connected to the through bar (29), the sliding bar (30) is slidably connected to the storage chamber (1) through the sliding groove (23), the storage chamber (1) is detachably connected with a mounting bracket (16), the mounting bracket (16) is connected with a pushing hydraulic cylinder (2), and the output end of the pushing hydraulic cylinder (2) penetrates the storage chamber (1) and is fixedly connected to the pushing sheet (7).

2. A semiconductor raw material pulverizer according to claim 1, characterized in that: The discharge structure comprises a converging portion (19) arranged on the bottom wall of the storage chamber (1), a discharge hole (20) being provided on the converging portion (19), a collecting chamber (17) being fixedly connected to the bottom surface of the storage chamber (1), the collecting chamber (17) being communicated with the inner cavity of the storage chamber (1) via the discharge hole (20), a discharge pipe (10) being fixedly connected to the collecting chamber (17), the inner cavity of the discharge pipe (10) being communicated with the inner cavity of the collecting chamber (17).

3. A semiconductor raw material pulverizer according to claim 2, characterized in that: The converging portion (19) is located below the pushing piece (7), and a portion of the top surface of the converging portion (19) close to the discharge holes (20) is recessed downwards, and the discharge holes (20) are located on both sides of the through hole (22).

4. A semiconductor raw material pulverizer according to claim 1, characterized in that: A push block (31) is fixedly connected to the lower end of the penetration bar (29); the push block (31) is arranged inside the collecting chamber (17); a side of the push block (31) facing away from the discharge pipe (10) is provided with an inclined portion (33); and the bottom surface of the push block (31) abuts against a guide block (24).

5. A semiconductor raw material pulverizer according to claim 4, characterized in that: The bottom surface of the push block (31) is provided with upper grinding columns (32) in a matrix shape, the top surface of the guide block (24) is provided with lower grinding columns (26) in a matrix shape, the top surface of the guide block (24) is provided with a guide portion (27), and a discharge hole (25) is provided on the guide block (24) near the upper end of the discharge pipe (10).

6. A semiconductor raw material pulverizer according to claim 1, characterized in that: The bottom wall of the inner cavity of the storage chamber (1) is provided with a diverter portion (18), the diverter portion (18) is a conical structure, the pulverizing structure comprises a transmission rod (4) penetrating the diverter portion (18), the bottom surface of the storage chamber (1) is detachably connected to a transmission motor (11), and the output end of the transmission motor (11) is fixedly connected to the transmission rod (4).

7. A semiconductor raw material pulverizer according to claim 6, characterized in that: The transmission rod (4) is provided with top discs (15) and bottom discs (13) at equal intervals, the bottom discs (13) are provided below the top discs (15), connecting rods (35) are provided between the top discs (15) and the bottom discs (13) at equal intervals, the connecting rods (35) are connected between the top discs (15) and the bottom discs (13) via rivets (34), and a hammer head (14) is fixedly connected to one end of the connecting rod (35) that is away from the transmission rod (4).

8. A semiconductor raw material pulverizer according to claim 7, characterized in that: The storage chamber (1) is penetrated by a mounting roller (6), the top wall of the inner cavity of the storage chamber (1) is fixedly connected to a rotating seat (21), the rotating seat (21) is sleeved with a transmission rod (4), one end of the mounting roller (6) close to the transmission rod (4) is fixedly connected to a crushing sheet (5), the crushing sheet (5) does not contact the hammer head (14) and the dividing sheet (9), a connection port (36) is provided on the top surface of the storage chamber (1) close to the dividing sheet (9), and the top surface of the storage chamber (1) is connected to a controller (38).

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