A semiconductor dispensing and bonding device

Abstract

The present application relates to the technical field of semiconductors and provides a semiconductor dispensing and bonding device, which includes a workbench, a conveying mechanism disposed on the workbench for conveying a tooling equipped with a chip, a dispensing head and a suction nozzle disposed above the conveying mechanism, a mounting frame disposed on the workbench for mounting the dispensing head and the suction nozzle, and two drive mechanisms disposed on the mounting frame for respectively driving the dispensing head and the suction nozzle to perform reciprocating sliding motions. The conveying mechanism includes a plurality of guide rails spaced apart along the length of the mounting frame, and the dispensing head and the suction nozzle are disposed on both sides of the mounting frame. A cleaning mechanism is disposed on the workbench on the path of the dispensing head toward the conveying mechanism. The present application has the ability to clean residual glue on the dispensing head in a timely manner during the intervals between dispensing operations, effectively preventing the initial solidification of glue caused by excessive dwelling time, thereby preventing the solidified glue from mixing into the new glue and affecting the bonding quality.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductors, and in particular to a semiconductor dispensing and bonding device. Background Art

[0002] As one of the core pillars of modern high-tech industries, the semiconductor industry holds a strategically important position globally. With the continuous advancement of technology, the integration of semiconductor devices is becoming increasingly higher, placing increasingly stringent demands on manufacturing processes. The dispensing and lamination process, a key step in the semiconductor manufacturing process, directly impacts chip performance, reliability, and yield.

[0003] Currently, the industry's common approaches to addressing residual glue residue from dispensing tips include regular tip replacement, high-temperature heating to remove residual glue, or manual cleaning with auxiliary tools. Specifically, common approaches include: using an external cleaning device to spray solvent to dissolve the residue before wiping it off; using a built-in heating system to soften the cured glue for subsequent cleaning; and designing specialized scrapers to directly remove aged materials adhering to the surface. While these methods can alleviate the problem to some extent, they still have shortcomings.

[0004] However, the above traditional methods have exposed obvious limitations in practical applications. During the dispensing operation, since the dispensing head usually has a certain residence time after dispensing the chips on a tool or a batch of tools, if this time is long, especially for glue with a short initial curing time, the glue near the dispensing head may solidify to a certain extent. When dispensing the chips on the next batch or the next tool, the glue that has solidified to a certain extent will be mixed into the new glue, affecting the subsequent bonding effect between the chips and other components. At this time, the solidified glue on the dispensing head is not easy to clean using the above method during the operation, so further improvement is needed. Summary of the Invention

[0005] In order to solve the above problems, the present application provides a semiconductor dispensing and bonding device.

[0006] This application provides a semiconductor dispensing and bonding device, which adopts the following technical solutions:

[0007] A semiconductor dispensing and laminating device comprises a workbench, a conveying mechanism arranged on the workbench for conveying a tooling with chips, a dispensing head and a suction nozzle arranged above the conveying mechanism, a mounting frame arranged on the workbench for mounting the dispensing head and the suction nozzle, and two driving mechanisms arranged on the mounting frame for respectively driving the dispensing head and the suction nozzle to perform reciprocating sliding motion, the conveying mechanism comprises a plurality of guide rails arranged at intervals along the length direction of the mounting frame, the dispensing head and the suction nozzle are respectively arranged on both sides of the mounting frame; a cleaning mechanism is arranged on the workbench on the path where the dispensing head travels toward the conveying mechanism, the cleaning mechanism is used to clean the residual glue on the dispensing head, the cleaning mechanism comprises a receiving plate for receiving the residual glue that is separated from the dispensing head as the glue is heated, an elastic scraper arranged on the receiving plate for scraping the glue, and an adjusting component for adjusting the horizontal position of the receiving plate, the elastic scraper being arranged on the side of the receiving plate close to the conveying mechanism.

[0008] By adopting the above technical solution, as the driving mechanism drives the dispensing head to dispense glue on the next tooling or the next batch of chips, the dispensing head can be moved toward the chip. The heated new glue can be squeezed out with pressure, and then the solidified glue can be driven to flow out under the premise of pressure extrusion. Then, it is received by the receiving plate to prevent it from dripping randomly and causing waste or pollution. As it moves, it moves to the elastic scraper. The elasticity of the elastic scraper itself can flexibly scrape off residual glue in different forms to ensure a cleaning effect. In this way, the glue that has solidified before each dispensing can be scraped off to reduce the impact of the subsequent bonding effect between the chip and other components. Compared with replacing the dispensing head, using high-temperature heating to remove residual glue, or manual cleaning, this method has less impact on the working state of the dispensing head.

[0009] Among them, the dispensing head and the suction nozzle are respectively arranged on both sides of the mounting frame so as to be suitable for glue with a short initial solidification time. After the glue is initially solidified, other components are bonded to the chip through the suction nozzle to improve the bonding effect between the chip and other components. Since the path of the dispensing head moving toward the chip is relatively fixed, if the solidified glue on the dispensing head is scraped at the same place, the residual glue previously received and the glue scraped by the elastic scraper may also be bonded to the dispensing head along with the glue squeezed out again. In this regard, after the dispensing head is used a certain number of times at the same position on the receiving plate and the elastic scraper, the horizontal position of the receiving plate is changed by adjusting the assembly. At this time, the glue on the receiving plate and the elastic scraper can be cleaned manually or by disassembly. Compared with the prior art, this method can also reduce damage to the dispensing head.

[0010] Preferably, the cleaning mechanism also includes a collecting assembly for collecting the glue on the receiving plate and the elastic scraper, the collecting assembly includes a scraper abutting the receiving plate, a guide plate arranged on the scraper, and a collection trough for receiving the glue guided by the guide plate, and the scraper is used to abut the elastic scraper.

[0011] By adopting the above technical solution, a collection assembly is provided to collect glue on the receiving plate and the elastic scraper, further improving the system and comprehensively recovering waste glue generated during the cleaning process, maintaining a clean working environment. Specifically, the scraper can effectively remove residual glue on the receiving plate, and the guide plate guides the scraped glue into the collection tank for centralized processing, thus preventing residual glue from contaminating the dispensing head and affecting subsequent dispensing operations.

[0012] Preferably, the receiving plate and the elastic scraper are both non-stick plates, both of which are thermally conductive, the receiving plate has a accommodating cavity inside, and the receiving plate is provided with an input pipe for transporting high-temperature medium into the accommodating cavity and an output pipe for outputting the medium after heat exchange.

[0013] By adopting this technical solution, the receiving plate is thermally conductive and equipped with a receiving cavity. This allows the receiving plate to be heated by a high-temperature medium and conducts heat to the elastic scraper, effectively softening the residual glue it receives or melting the solidified glue remaining on the dispensing head. This improves cleaning efficiency on the receiving plate and the elastic scraper. Furthermore, the non-stick plate design reduces the adhesion of residual glue to the receiving plate and the elastic scraper, facilitating subsequent removal. The provision of input and output pipes allows for medium circulation, ensuring a continuous heat supply, improving energy utilization, and further enhancing cleaning effectiveness.

[0014] Preferably, the receiving plate is arranged at an upward tilt at one end close to the conveying mechanism, the collecting trough is arranged on the side of the receiving plate away from the conveying mechanism, and the collecting trough is arranged along the entire length of the receiving plate; the guide plate is arranged on the side of the scraper away from the collecting trough, the guide plate is arranged in an arc shape in the direction away from the collecting trough, one end of the guide plate is arranged close to the elastic scraper, and the other end of the guide plate is arranged close to the collecting trough, and the angle between the guide plate and the scraper is set to be an acute angle.

[0015] By adopting this technical solution, angling the receiving plate at an upward angle near the conveyor mechanism effectively guides the glue away from the conveyor, preventing backflow and contamination of the dispensing area. The collection trough, running the entire length of the receiving plate, ensures that all leaking glue is completely collected, improving cleaning efficiency and reducing waste. Furthermore, the curved design of the guide plate and the sharp angle between it and the scraper help optimize the glue flow path, allowing the glue to be more smoothly channeled into the collection trough, thereby improving cleaning effectiveness.

[0016] Preferably, the elastic scraper is a first airbag on the top of the receiving plate, the first airbag is filled with gas, and the first airbag is arranged along the entire length of the receiving plate.

[0017] By adopting the above technical solution, the elastic scraper is used as the first airbag and is arranged on the top of the receiving plate. Due to its own elasticity and deformation ability, it can adapt to different surface shapes when abutting the dispensing head, so as to avoid equipment damage or incomplete scraping due to rigid collision, and at the same time ensure that the residual glue is fully removed, thereby improving the quality and reliability of the dispensing process.

[0018] Preferably, the receiving plate is a flexible plate, and a heat conducting plate is provided under the receiving plate to abut against the receiving plate for heat conduction. The adjusting component includes two reels for winding around the two ends of the receiving plate and a second driving member for driving the reel to rotate. There are two scrapers and they are respectively provided at the two ends of the heat conducting plate.

[0019] By adopting this technical solution, the flexible board's receiving plate can better adapt to different working environments, improving the flexibility and efficiency of residual adhesive cleaning. The heat conduction plate abuts the receiving plate to conduct heat, effectively maintaining the receiving plate's surface temperature and preventing residual adhesive from cooling and solidifying. The scroll in the adjustment assembly works in conjunction with the second drive element to precisely adjust the horizontal position of the receiving plate and elastic scraper, ensuring a stable cleaning process.

[0020] As the second drive member drives the reels to rotate, the two reels reel in and unreel the receiving plate, respectively. During the reeling process, the scraper scrapes away the softened residual adhesive while squeezing the gas within the first airbag, forcing the gas within the first airbag wound on the reel into the first airbag located between the two reels, creating a bulge. This reduces the possibility of uneven reeling as the first airbag reels with the receiving plate. After reeling to a certain extent, the reel rotates in the opposite direction for reuse.

[0021] Preferably, both ends of the receiving plate are fixed to form a closed loop, and the adjusting assembly includes a rotating shaft for the receiving plate to rotate around and a third driving member for driving the rotating shaft to rotate.

[0022] By adopting the above technical solution, the two ends of the receiving plate are fixed to form a closed loop, so that the receiving plate forms a continuous loop structure. This design ensures that the receiving plate always maintains a stable shape during the cleaning process, avoiding deformation or failure due to uneven force.

[0023] Preferably, the first airbag is provided with elastic protrusions, and a plurality of the elastic protrusions are arranged at intervals along the length direction of the first airbag, and the elastic protrusions are used to abut against the side wall of the dispensing head.

[0024] By adopting the above technical solution, although the first airbag can adapt to dispensing heads of different shapes, when squeezed, the first airbag becomes concave, and the contact area between it and the side wall of the dispensing head is small. To this end, elastic protrusions are provided on the first airbag to increase the friction and contact area between the first airbag and the side wall of the dispensing head. The elastic protrusions can enhance the contact effect between the first airbag and the side wall of the dispensing head, and can more effectively remove residual glue on the side wall of the dispensing head.

[0025] Preferably, the elastic protrusion is a second airbag, and the second airbag is connected to the first airbag, or adjacent second airbags are connected.

[0026] By adopting this technical solution, the elastic bumps designed as second airbags effectively enhance cleaning effectiveness on the sidewalls of the dispensing head. Compared to other fixed structures, the second airbags possess greater flexibility, allowing them to deform appropriately upon contact with the dispensing head, more closely conforming to the surface contours of the dispensing head and improving residual adhesive removal efficiency. Furthermore, when the second airbag is connected to the first airbag, or when adjacent second airbags are connected to each other, pressure is evenly distributed, avoiding the risk of damage to the equipment from excessive localized cleaning force and ensuring a stable and reliable cleaning process.

[0027] Preferably, the first airbag is detachably connected to the receiving plate.

[0028] By adopting the above technical solution, a detachable connection is achieved between the first airbag and the receiving plate. This design allows the first airbag to be easily replaced or maintained after long-term use. At the same time, this detachable connection method also facilitates the separate cleaning or maintenance of the first airbag.

[0029] In summary, this application has the following beneficial effects:

[0030] By setting a cleaning mechanism on the dispensing head's travel path, the residual glue on the dispensing head can be cleaned in time during the dispensing operation, effectively preventing the initial curing of the glue caused by too long a dwelling time, thereby avoiding the solidified glue from mixing into the new glue and affecting the bonding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the present application;

[0032] Figure 2 This is a schematic diagram of the structure of the workbench in Example 1 of the present application;

[0033] Figure 3Schematic diagram of the structure of the nozzle in Example 1 of the present application;

[0034] Figure 4 yes Figure 2 A local enlarged schematic diagram at point A;

[0035] Figure 5 This is a schematic diagram of the internal structure of the receiving plate in Example 1 of the present application;

[0036] Figure 6 This is a schematic structural diagram of the cleaning mechanism in Example 2 of the present application;

[0037] Figure 7 This is a schematic structural diagram of Example 3 of the present application;

[0038] Figure 8 It is a structural schematic diagram of the elastic bump in Example 4 of the present application.

[0039] Explanation of the accompanying drawings: 1. workbench; 11. conveying mechanism; 111. guide rail; 112. sliding seat; 12. dispensing head; 13. suction nozzle; 14. mounting frame; 15. driving mechanism; 16. control mechanism; 17. cover body; 171. cabinet door; 18. annular light source detection equipment; 2. cleaning mechanism; 21. receiving plate; 211. accommodating chamber; 212. input pipe; 213. output pipe; 22. elastic scraper; 221. deformation space; 23. adjustment component; 231. rack; 232. incomplete gear; 233. first driving member; 234. reel; 235. second driving member; 236. rotating shaft; 237. third driving member; 24. collecting component; 241. scraper; 242. guide plate; 243. collecting trough; 25. heat conducting plate; 3. elastic protrusion. DETAILED DESCRIPTION

[0040] The following is combined with Figure 1-8 , further details of this application are given.

[0041] The embodiment of the present application discloses a semiconductor dispensing and bonding device.

[0042] Example 1:

[0043] A semiconductor dispensing and bonding equipment, referring to Figure 1 、 Figure 2 and Figure 3, including a workbench 1, a conveying mechanism 11 arranged on the workbench 1 for conveying a tooling with chips, a dispensing head 12 and a suction nozzle 13 arranged above the conveying mechanism 11, a mounting frame 14 arranged on the workbench 1 for installing the dispensing head 12 and the suction nozzle 13, two driving mechanisms 15 and a control mechanism 16 arranged on the mounting frame 14 to respectively drive the dispensing head 12 and the suction nozzle 13 to perform reciprocating sliding motion, wherein the control mechanism 16 is used to be electrically connected to the conveying mechanism 11, the driving mechanism 15, the dispensing head 12 and the suction nozzle 13, so as to respectively control the transportation of the tooling with chips, drive the dispensing head 12 or the suction nozzle 13 to move accordingly, control the dispensing head 12 to dispense glue and the suction nozzle 13 to adsorb parts for bonding with the chip. Since the control mechanism 16 is a prior art, it will not be described in detail here.

[0044] Among them, a cover body 17 is provided on the workbench 1 to cover the components arranged on the upper surface of the workbench 1 to achieve a dust-proof effect, and an opening is opened on the cover body 17, and a cabinet door 171 is provided on the cover body 17 to open and close the opening, so that the corresponding tooling equipped with chips can be placed in the cover body 17 for gluing and bonding.

[0045] The conveying mechanism 11 includes a plurality of guide rails 111 spaced apart along the length of the mounting frame 14, sliding seats 112 slidably connected to the guide rails 111, and a drive assembly (not shown) for driving the sliding seats 112 to slide. In this embodiment, two guide rails 111 are shown, corresponding to two sliding seats 112 for placing tooling for sliding transportation. The drive assembly can be a screw rod and a drive motor to drive the sliding seats 112 to slide, or other drive methods can be used to drive the sliding seats 112 to slide, which will not be detailed here.

[0046] Among them, the length direction of the mounting frame 14 is parallel to the width direction of the guide rail 111, and the dispensing head 12 and the suction nozzle 13 are respectively arranged on both sides of the mounting frame 14. The dispensing head 12 is used to dispense glue to the chip through the driving mechanism 15, and the suction nozzle 13 is used to suck parts to fit them with the glued chip.

[0047] Among them, in order to improve the dispensing accuracy and the fitting accuracy, an annular light source detection device 18 is provided on the side of the dispensing head 12 and the suction nozzle 13 close to the conveying mechanism 11. The annular light source detection device 18 is electrically connected to the control mechanism 16 for transmitting the corresponding detected image to the control mechanism 16 for processing or viewing, so as to improve the accuracy of dispensing or the suction nozzle 13 when working.

[0048] Reference Figure 2 、 Figure 4Furthermore, during the use of the dispensing head 12, due to the limited length of the guide rail 111 and the number of sliding seats 112 that can be placed, there will be a rest gap in the dispensing operation. For this reason, the glue in the dispensing head 12 may be initially solidified. When the operation is continued, it may be mixed with the newly squeezed glue to be dispensed on the chip, thereby affecting the subsequent bonding quality between the parts. For this reason, in this embodiment, a cleaning mechanism 2 is provided on the workbench 1 on the path where the dispensing head 12 moves toward the conveying mechanism 11.

[0049] The cleaning mechanism 2 is used to clean the residual glue on the dispensing head 12. The cleaning mechanism 2 specifically includes a receiving plate 21 for receiving the residual glue that is separated from the dispensing head 12 as the glue is heated, an elastic scraper 22 arranged on the receiving plate 21 for scraping the glue, an adjustment component 23 for adjusting the horizontal position of the receiving plate 21, and a collection component 24 for collecting the glue on the receiving plate 21 and the elastic scraper 22.

[0050] In this embodiment, the receiving plate 21 and the elastic scraper 22 are both non-stick plates and are thermally conductive. The receiving plate 21 can be made of ceramic, silicon dioxide, aluminum alloy, or stainless steel, depending on the specific requirements. The elastic scraper 22 can be made of thermally conductive silicone because it needs to have a certain degree of elasticity.

[0051] Reference Figure 4 、 Figure 5 The receiving plate 21 has a housing chamber 211 therein, and an input pipe 212 for conveying high-temperature medium into the housing chamber 211 and an output pipe 213 for discharging the medium after heat exchange are fixedly provided on the outside of the receiving plate 21. To facilitate the subsequent adjustment component 23 to adjust the horizontal position of the receiving plate 21, the input pipe 212 and the output pipe 213 are both hoses. The elastic scraper 22 is disposed on the side of the receiving plate 21 close to the conveying mechanism 11. Specifically, it can be thermoplastically connected to the receiving plate 21. The elastic scraper 22 can be arched in a direction away from the receiving plate 21. The arched portion can be triangular or arc-shaped, depending on the specific requirements. A deformation space 221 is left between the elastic scraper 22 and the receiving plate 21 for the elastic scraper 22 to deform when it abuts the dispensing head 12.

[0052] It should be noted that, with use, the elastic scraper 22 may be compressed and may become concave. To address this, a fixing plate fixedly connected to the receiving plate 21 may be provided at the end of the elastic scraper 22, and air at a certain pressure may be injected into the deformation space 221. Alternatively, springs may be provided at intervals along the length of the elastic scraper 22 within the deformation space 221 to provide support for the elastic scraper 22. The specific configuration is determined according to needs.

[0053] The adjustment assembly 23 can be a screw threaded through the lower end of the receiving plate 21 and a drive motor that drives the screw to rotate. As the drive motor rotates forward or reverse, the position on the receiving plate 21 is changed. Alternatively, the adjustment assembly 23 can include two racks 231 arranged on the upper surface of the workbench 1 to be arranged opposite each other, an incomplete gear 232 engaged with the racks 231, and a first drive member 233 fixedly connected to the incomplete gear 232. The first drive member 233 is specifically provided by the drive motor. Since it is an incomplete gear 232, it can drive the receiving plate 21 to slide back and forth under the unidirectional rotation of the drive motor. In this embodiment, the adjustment assembly 23 is specifically shown as the latter.

[0054] The collection assembly 24 includes a scraper 241 abutting the receiving plate 21, a guide plate 242 disposed on the scraper 241, and a collection trough 243 for receiving the glue diverted by the guide plate 242. The scraper 241 is configured to abut the elastic scraper 22. It should be noted that to facilitate the subsequent collection of the heated glue, in this embodiment, the end of the receiving plate 21 closest to the conveying mechanism 11 is tilted upward so that the softened glue flows along the tilt of the receiving plate 21. To this end, the collection trough 243 is disposed on the side of the receiving plate 21 away from the conveying mechanism 11 and extends along the entire length of the receiving plate 21. The guide plate 242 is arranged on the side of the scraper 241 away from the collection groove 243. The guide plate 242 is arranged in an arc shape in the direction away from the collection groove 243. One end of the guide plate 242 is arranged close to the elastic scraper 22, and the other end of the guide plate 242 is arranged close to the collection groove 243. The angle between the guide plate 242 and the scraper 241 is set at an acute angle, so as to flow the scraped glue into the collection groove 243 for collection.

[0055] It should be noted that, for the collected glue, the inner bottom wall of the collection tank 243 can be set at an angle, and a collection pipe can be fixedly penetrated on the end of the collection tank 243 so that the glue can flow to the corresponding storage box for collection and processing.

[0056] The implementation principle of a semiconductor dispensing and bonding device according to an embodiment of the present application is as follows: before the driving mechanism 15 drives the dispensing head 12 to dispense glue on the next tooling or the next batch of chips, the dispensing head 12 can move toward the chip, squeeze out the heated new glue with pressure, and then drive the solidified glue to flow out under the premise of pressure extrusion, and then receive it through the receiving plate 21 to prevent it from dripping randomly and causing waste or pollution; as it moves, it moves to the elastic scraper 22, and the elasticity of the elastic scraper 22 itself can flexibly scrape off residual glue in different forms to ensure a cleaning effect. In this way, the glue that has solidified before each dispensing can be scraped off to reduce the impact of the subsequent bonding effect between the chip and other components, and this method has a lower impact on the working state of the dispensing head 12 than replacing the dispensing head 12, using high-temperature heating to remove residual glue, or manual cleaning.

[0057] Example 2:

[0058] Reference Figure 6 The difference from Example 1 is that in this embodiment, the elastic scraper 22 is a first airbag on top of the receiving plate 21, which is filled with gas and extends along the entire length of the receiving plate 21. The receiving plate 21 is a flexible plate, and a heat conducting plate 25 is provided below the receiving plate 21 to abut against the receiving plate 21 for heat conduction. The configuration of the heat conducting plate 25 can refer to that of the receiving plate 21 in Example 1 and will not be described in detail here.

[0059] The adjustment assembly 23 comprises two reels 234, one for winding the ends of the receiving plate 21, and a second drive member 235 that drives the reels 234. The receiving plate 21 is either fixedly connected to the reels 234 at either end, or a reel 234 is detachably connected to the reels 234. The second drive member 235 is also specifically a drive motor. Two second drive members 235 are provided, each fixedly connected to the two reels 234, allowing the reel 234 at one end to rewind after unwinding. To this end, two scrapers 241 are provided, one at each end of the heat conducting plate 25.

[0060] Example 3:

[0061] Reference Figure 7 The difference from Example 2 is that, in this embodiment, the two ends of the receiving plate 21 are fixed to form a closed loop. At this time, the adjusting component 23 includes a rotating shaft 236 for the receiving plate 21 to rotate and a third driving member 237 for driving the rotating shaft 236 to rotate. The third driving member 237 is provided with one, and the third driving member 237 can also be provided as a driving motor.

[0062] Example 4:

[0063] Reference Figure 8 The difference from Example 2 is that the first airbag is provided with elastic protrusions 3, and a plurality of elastic protrusions 3 are provided at intervals along the length direction of the first airbag. The elastic protrusions 3 are used to abut the side wall of the dispensing head 12. It should be noted that the elastic protrusions 3 can be provided for the second airbag, and the second airbag can be connected to the first airbag, or adjacent second airbags can be connected.

[0064] Furthermore, as the first airbag or the second airbag is used, it may be damaged or deformed. To address this, the first airbag may be detachably connected to the receiving plate 21 , specifically by bonding it to the receiving plate 21 with tape.

[0065] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A semiconductor dispensing and bonding device, characterized by: The invention comprises a workbench (1), a conveying mechanism (11) arranged on the workbench (1) for conveying a tooling with a chip, a dispensing head (12) and a suction nozzle (13) arranged above the conveying mechanism (11), a mounting frame (14) arranged on the workbench (1) for mounting the dispensing head (12) and the suction nozzle (13), and two driving mechanisms (15) arranged on the mounting frame (14) for driving the dispensing head (12) and the suction nozzle (13) to perform reciprocating sliding motion, wherein the conveying mechanism (11) comprises a plurality of guide rails (111) arranged at intervals along the length direction of the mounting frame (14), the dispensing head (12) and the suction nozzle (13) are respectively arranged on both sides of the mounting frame (14); the workbench (1) A cleaning mechanism (2) is provided on the path of the dispensing head (12) toward the conveying mechanism (11), and the cleaning mechanism (2) is used to clean the residual glue on the dispensing head (12). The cleaning mechanism (2) includes a receiving plate (21) for receiving the residual glue separated from the dispensing head (12) after being heated, an elastic scraper (22) provided on the receiving plate (21) for scraping the glue, an adjusting component (23) for adjusting the horizontal position of the receiving plate (21), and a collecting component (24) for collecting the glue on the receiving plate (21) and the elastic scraper (22), wherein the elastic scraper (22) is provided on a side of the receiving plate (21) close to the conveying mechanism (11); The collecting assembly (24) comprises a scraper (241) abutting against the receiving plate (21), a guide plate (242) provided on the scraper (241), and a collecting trough (243) for receiving the glue guided by the guide plate (242); the scraper (241) is used to abut against the elastic scraper (22); The elastic scraper (22) is a first airbag on the top of the receiving plate (21), the first airbag is filled with gas, and the first airbag is arranged along the entire length of the receiving plate (21); the first airbag is provided with elastic convex points (3), and a plurality of the elastic convex points (3) are arranged at intervals along the length of the first airbag, and the elastic convex points (3) are used to abut against the side wall of the dispensing head (12); the elastic convex points (3) are a second airbag, and the second airbag is connected to the first airbag; One end of the receiving plate (21) close to the conveying mechanism (11) is arranged to be inclined upward, and a heat conducting plate (25) is arranged below the receiving plate (21) to abut against the receiving plate (21) for heat conduction. Two scrapers (241) are provided and are respectively arranged at both ends of the heat conducting plate (25).

2. The semiconductor dispensing and laminating device according to claim 1, characterized in that: The receiving plate (21) and the elastic scraper (22) are both non-stick plates. Both the receiving plate (21) and the elastic scraper (22) are thermally conductive. The receiving plate (21) has a receiving cavity (211) therein. The receiving plate (21) is provided with an input pipe (212) for conveying a high-temperature medium into the receiving cavity (211) and an output pipe (213) for outputting the medium after heat exchange.

3. The semiconductor dispensing and laminating device according to claim 1, characterized in that: The receiving plate (21) is arranged at an end thereof close to the conveying mechanism (11) and is tilted upward. The collecting trough (243) is arranged on a side of the receiving plate (21) away from the conveying mechanism (11), and the collecting trough (243) is arranged along the entire length of the receiving plate (21). The guide plate (242) is arranged on a side of the scraper (241) away from the collecting trough (243), and the guide plate (242) is arranged in an arc shape in a direction away from the collecting trough (243). One end of the guide plate (242) is arranged close to the elastic scraper (22), and the other end of the guide plate (242) is arranged close to the collecting trough (243). The angle between the guide plate (242) and the scraper (241) is set at an acute angle.

4. The semiconductor dispensing and laminating device according to claim 1, characterized in that: The receiving plate (21) is a flexible plate, and the adjusting component (23) comprises two reels (234) for winding around two ends of the receiving plate (21) and a second driving member (235) for driving the reels (234) to rotate.

5. The semiconductor dispensing and laminating device according to claim 1, characterized in that: The two ends of the receiving plate (21) are fixed to form a closed loop, and the adjustment component (23) comprises a rotating shaft (236) around which the receiving plate (21) is arranged, and a third driving member (237) for driving the rotating shaft (236) to rotate.

6. A semiconductor dispensing and laminating device according to any one of claims 1 to 5, characterized in that: The first airbag is detachably connected to the receiving plate (21).

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