Punching device for wafer production

Abstract

The present application relates to the technical field of blanking device, and provides a blanking device for wafer production, which comprises a mounting rack and a laser cutting device, further comprises an arc-shaped support seat, a mounting cylinder and a mounting seat, the number of the arc-shaped support seats is multiple, the middle part of the arc-shaped support seat is provided with an arc-shaped protrusion, a circumferential adjustment assembly is arranged between the arc-shaped support seats and the mounting rack, a support falling assembly is arranged on the arc-shaped support seat, an XY axis moving mechanism is arranged between the mounting cylinder and the top of the mounting rack, the laser cutting device is arranged in the mounting cylinder, and the mounting seat corresponds to the arc-shaped support seat one by one. Through the above technical scheme, the technical problem that the wafer waste material is easily inclined downward during continuous cutting of the outer side area of the wafer in the prior art is solved, and the wafer cutting end surface is not flat.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of punching apparatus technology, and more specifically, to a punching apparatus for wafer production. Background Technology

[0002] Chips are one of the most important raw materials for LEDs. They are the light-emitting components and the core of LEDs. The production process of chips first requires two steps: polycrystalline silicon preparation and crystal growth to produce polycrystalline silicon ingots. Then, the polycrystalline silicon ingots are sliced ​​to make wafers. Next, the surface of the wafers is ground and etched to reduce mechanical defects. Then, the surface of the wafers is polished. Then, various front-end processes are applied to the wafers to form multiple individual circuit patterns inside the wafers. According to the multiple circuit patterns on the wafer surface, laser cutting equipment is used to cut the wafer surface into multiple rectangular chips. Each chip has an individual circuit pattern. Finally, the chips are packaged to complete the chip production process.

[0003] When using laser cutting equipment to cut wafers, since each chip is generally rectangular, the outermost area of ​​the wafer needs to be cut first. When cutting the outer area of ​​the wafer, the laser cutting equipment is used to make a ring cut on the outer side of the wafer. However, when cutting some areas of the wafer, because the wafer is thin, the waste material cut off from the wafer will tilt downwards. When cutting the remaining area of ​​the wafer, it is easy for the waste material to tilt downwards, resulting in an uneven wafer surface and thus an uneven cut end face of the wafer. Summary of the Invention

[0004] To overcome the above-mentioned defects, embodiments of the present invention provide a punching apparatus for wafer production, which solves the technical problem in the related art that, during the cutting of the outer region of a wafer, due to the thinness of the wafer, the wafer waste tends to tilt downwards during continuous cutting of the outer region of the wafer, resulting in an uneven wafer cutting end face.

[0005] The present invention provides a punching apparatus for wafer manufacturing, comprising a mounting frame and a laser cutting device, and further comprising:

[0006] The arc-shaped support base is provided in multiple ways. The arc-shaped support base has an arc-shaped protrusion in the middle. A circumferential adjustment component is provided between the multiple arc-shaped support bases and the mounting frame. A support and drop component is provided on the arc-shaped support base.

[0007] An XY axis moving mechanism is provided between the mounting cylinder and the top of the mounting frame, and the laser cutting equipment is installed inside the mounting cylinder;

[0008] Mounting base, each mounting base corresponds one-to-one with the arc-shaped support base, and a circumferential adjustment component is also provided between the multiple mounting bases and the mounting cylinder. An elastic extrusion component is provided on one side of the mounting base, and a longitudinal punching component is provided on the other side of the mounting base.

[0009] To further adjust the positions of the arc-shaped support and the mounting base, the circumferential adjustment assembly includes a fixed cylinder, an annular threaded disc, and a movable base. The fixed cylinder is fixedly connected to the mounting frame or the mounting cylinder. The annular threaded disc is rotatably connected inside the fixed cylinder. A driving structure is provided between the annular threaded disc and the fixed cylinder. The fixed cylinder has multiple sliding grooves. The movable base is slidably connected through the sliding grooves and threadedly connected to the annular threaded disc. Both the arc-shaped support and the mounting base are fixedly connected to the movable base.

[0010] To further support the bottom of the die being punched, the support drop assembly includes a support frame, and a spring damper is provided between the support frame and the arc-shaped support base.

[0011] To further increase the support area for the wafer, an arc-shaped support plate is fixedly connected to one side of the arc-shaped protrusion, and the top of the arc-shaped protrusion is flush with the top of the arc-shaped support plate.

[0012] In order to drive the mounting cylinder to move in multiple directions, the XY axis moving mechanism further includes a first moving slot frame, which is fixedly connected to the top of the mounting frame. A second moving slot frame is slidably connected to the first moving slot frame. A screw drive structure is provided between the first moving slot frame and the second moving slot frame. The screw drive structure is also provided between the mounting cylinder and the second moving slot frame.

[0013] To further extrude the top of the punched wafer, the elastic extrusion assembly includes an arc-shaped extrusion plate, and a drive electric cylinder is provided on the mounting base. The arc-shaped extrusion plate is fixedly connected to the output end of the drive electric cylinder.

[0014] To punch the outermost area of ​​the wafer, the longitudinal punching assembly further includes a lifting plate, an arc-shaped punching plate, and a limiting assembly. A sliding member is fixedly connected to one side of the mounting base, and the lifting plate is longitudinally slidably connected to the sliding member. A spring damper is also provided between the lifting plate and the sliding member. The arc-shaped punching plate is fixedly connected to the bottom of the lifting plate, and the limiting assembly is provided between the lifting plate and the mounting base.

[0015] To complete the wafer fixing and punching operations, the arc-shaped extrusion plate corresponds to the arc-shaped support plate, and the arc-shaped punching plate corresponds to the support frame.

[0016] To facilitate longitudinal movement of the lifting plate, the limiting component further includes a rotating groove and a wedge-shaped support block. The rotating groove is fixedly connected to the mounting base, and a rotating shaft is rotatably connected inside the mounting base. A first drive motor is fixedly connected to the rotating groove, and the output end of the first drive motor is fixedly connected to the rotating shaft. The wedge-shaped support block is fixedly connected to the rotating shaft. A through groove is provided on the lifting plate, and the inner top wall of the through groove is sloped. The wedge-shaped support block contacts the sloped surface.

[0017] To ensure that the positions of the movable seat and the arc-shaped support seat correspond, a position sensor is further provided at the bottom of the mounting seat, and a calibration point is provided in the middle of the arc-shaped protrusion.

[0018] The beneficial effects of the embodiments of the present invention are as follows:

[0019] In this invention, when the outermost region of a wafer needs to be punched, the wafer to be punched is first placed between the tops of multiple arc-shaped support plates. Then, the circumferential moving mechanism drives the arc-shaped support base to move, so that the wafer is clamped between multiple support frames. Then, the laser cutting equipment cuts the outer region of the wafer, but does not directly and completely cut the wafer. A small area is used to connect the outer region of the wafer to the middle region of the wafer, and the thickness of the weld at the wafer connection is made as thin as possible. Then, the elastic extrusion assembly supports the top of the wafer, so that the wafer is clamped between the elastic extrusion assembly and the arc-shaped support plates. Then, the longitudinal punching assembly punches the outermost region of the wafer, performing a rapid longitudinal cut on the outer region of the wafer, while ensuring that the cut end of the outer region of the wafer remains flat. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are merely some exemplary embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the exemplary embodiments of the present invention and these drawings without any creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a partial cross-sectional structural diagram of the arc-shaped support, arc-shaped protrusion, mounting cylinder, mounting base and fixing cylinder in this invention;

[0023] Figure 3 This is a schematic diagram of the structure of the arc-shaped support base, arc-shaped protrusion, and support frame in this invention.

[0024] Figure 4 For the present invention Figure 3 A magnified structural diagram of point A in the middle;

[0025] Figure 5 This is a schematic diagram of the structure of the fixed cylinder, mounting base, lifting plate, arc-shaped extrusion plate and arc-shaped punching plate in this invention;

[0026] Figure 6 This is a schematic diagram of the structure of the mounting base, lifting plate, arc-shaped extrusion plate, arc-shaped punching plate and position sensor in this invention.

[0027] Figure 7 This is a partial cross-sectional structural diagram showing the cooperation of the mounting base, lifting plate, rotating groove, and wedge-shaped support block in this invention.

[0028] In the diagram: 1. Mounting frame; 2. Laser cutting equipment; 3. Arc-shaped support base; 4. Arc-shaped protrusion; 5. Mounting cylinder; 6. Mounting seat; 7. Fixed cylinder; 8. Annular threaded disc; 9. Moving seat; 10. Support frame; 11. Spring damper; 12. Arc-shaped support plate; 13. Moving slot frame one; 14. Moving slot frame two; 15. Arc-shaped extrusion plate; 16. Drive electric cylinder; 17. Lifting plate; 18. Sliding component; 19. Arc-shaped punching plate; 20. Rotating slot; 21. Rotating shaft; 22. First drive motor; 23. Wedge-shaped support block; 24. Position sensor; 25. Calibration point; 26. Second drive motor; 27. Transmission gear; 28. Transmission screw; 29. ​​Third drive motor. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it.

[0030] To keep the drawings concise, each drawing only schematically shows the parts relevant to the disclosure; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0031] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0034] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0035] like Figures 1 to 7As shown, the present invention discloses a die-cutting apparatus for wafer production, including a mounting frame 1 and a laser cutting device 2. The laser cutting device 2 is a prior art device for cutting wafers, which cuts the wafer surface according to the shape of the circuit pattern. The laser cutting device 2 is also a prior art device that can be used to adjust the cutting depth.

[0036] It also includes multiple arc-shaped support seats 3, each with an arc-shaped protrusion 4 in the center. A circumferential adjustment assembly is provided between the multiple arc-shaped support seats 3 and the mounting frame 1. The circumferential adjustment assembly includes a fixed cylinder 7, an annular threaded disc 8, and a movable seat 9. The fixed cylinder 7 is fixedly connected to the mounting frame 1 or the mounting cylinder 5. The annular threaded disc 8 is rotatably connected inside the fixed cylinder 7. A drive structure is provided between the annular threaded disc 8 and the fixed cylinder 7. The drive structure includes a second drive motor 26, which is mounted on the fixed cylinder 7. The annular threaded disc 8... Both the output end of the second drive motor 26 and the output end of the second drive motor 26 are provided with transmission gears 27. The two transmission gears 27 mesh. Multiple sliding grooves are provided on the fixed cylinder 7. The movable seat 9 is slidably connected to the sliding groove. The movable seat 9 is threadedly connected to the annular threaded disc 8. The arc-shaped support seat 3 and the mounting seat 6 are both fixedly connected to the movable seat 9. When it is necessary to adjust the position of the movable seat 9, the second drive motor 26 is started, and the annular threaded disc 8 is driven to rotate through the two transmission gears 27, so that the multiple movable seats 9 threadedly connected to the annular threaded disc 8 slide in the sliding groove, thereby adjusting the position of the arc-shaped support seat 3 or the mounting seat 6.

[0037] The arc-shaped support base 3 is equipped with a support and drop assembly, which includes a support frame 10. A spring damper 11 is provided between the support frame 10 and the arc-shaped support base 3. After the outermost area of ​​the wafer is punched, the spring damper 11 provided between the support frame 10 and the arc-shaped support base 3 contracts during the descent of the outermost area of ​​the wafer, thereby completely separating the outermost area of ​​the wafer from the center area of ​​the wafer. In the initial fixation of the wafer, the wafer contacts the arc-shaped surface of the inner wall of the support frame 10 to complete the fixation and clamping operation of the wafer. The support frame 10 can also provide sufficient support for the outermost area of ​​the wafer, so that the wafer remains stable during the cutting operation.

[0038] An arc-shaped support plate 12 is fixedly connected to one side of the arc-shaped protrusion 4. The top of the arc-shaped protrusion 4 is flush with the top of the arc-shaped support plate 12. When clamping the wafer, the wafer will be clamped between the support frame 10, the arc-shaped protrusion 4 and the arc-shaped support plate 12.

[0039] An XY-axis moving mechanism is provided between the top of the mounting cylinder 5 and the mounting frame 1. The laser cutting equipment 2 is installed inside the mounting cylinder 5. The XY-axis moving mechanism includes a first moving slot 13, which is fixedly connected to the top of the mounting frame 1. A second moving slot 14 is slidably connected to the first moving slot 13. A screw drive structure is provided between the first moving slot 13 and the second moving slot 14. A screw drive structure is also provided between the mounting cylinder 5 and the second moving slot 14. The screw drive mechanism includes a transmission screw 28. The transmission screw 28 is rotatably connected inside both the first moving slot 13 and the second moving slot 14. 4 is threadedly connected to the transmission screw 28 rotatably connected in the movable slot frame 13, and the mounting cylinder 5 is threadedly connected to the transmission screw 28 rotatably connected in the movable slot frame 24. Both the movable slot frame 13 and the movable slot frame 24 are equipped with a third drive motor 29. The output end of the third drive motor 29 is fixedly connected to the transmission screw 28. When it is necessary to adjust the components on the mounting cylinder 5 to realize the sequential cutting operation of multiple areas on the wafer, the two third drive motors 29 are used to drive the two transmission screws 28 to rotate, so as to realize the comprehensive movement operation of multiple components such as the mounting cylinder 5 and the laser cutting equipment 2.

[0040] The mounting base 6 corresponds one-to-one with the arc-shaped support base 3. A circumferential adjustment component is also provided between the multiple mounting bases 6 and the mounting cylinder 5. An elastic extrusion component is provided on one side of the mounting base 6. The elastic extrusion component includes an arc-shaped extrusion plate 15. A drive electric cylinder 16 is provided on the mounting base 6. The arc-shaped extrusion plate 15 is fixedly connected to the output end of the drive electric cylinder 16. After the mounting base 6 is moved to the position corresponding to the arc-shaped support base 3, in order to keep the center area of ​​the wafer stable during the wafer punching process, the drive electric cylinder 16 is activated to drive the arc-shaped extrusion plate 15 to descend, so that the arc-shaped extrusion plate 15 contacts the top of the wafer, thereby fixing the wafer.

[0041] On the other side of the mounting base 6, a longitudinal punching assembly is provided. The longitudinal punching assembly includes a lifting plate 17, an arc-shaped punching plate 19, and a limiting assembly. A sliding member 18 is fixedly connected to one side of the mounting base 6. The lifting plate 17 is longitudinally slidably connected to the sliding member 18. A spring damper 11 is also provided between the lifting plate 17 and the sliding member 18. The arc-shaped punching plate 19 is fixedly connected to the bottom of the lifting plate 17. A limiting assembly is provided between the lifting plate 17 and the mounting base 6. After the outermost area of ​​the wafer is cut by the laser cutting equipment 2, the limiting assembly stops the lifting operation. Under the action of the spring damper 11 provided between the lifting plate 17 and the sliding member 18, the lifting plate 17 descends rapidly, causing the lifting plate 17 to drive the arc-shaped punching plate 19 to descend. The arc-shaped punching plate 19 performs punching operations on the outer cutting area of ​​the wafer.

[0042] The limiting component includes a rotating groove 20 and a wedge-shaped support block 23. The rotating groove 20 is fixedly connected to the mounting base 6. A rotating shaft 21 is rotatably connected inside the mounting base 6. A first drive motor 22 is fixedly connected to the rotating groove 20. The output end of the first drive motor 22 is fixedly connected to the rotating shaft 21. The wedge-shaped support block 23 is fixedly connected to the rotating shaft 21. A through groove is provided on the lifting plate 17, and the inner top wall of the through groove is set as a slope. The wedge-shaped support block 23 contacts the slope. When it is necessary to keep the lifting plate 17 fixed, the first drive motor 22 is started to drive the rotating shaft 21 to rotate, so that the rotating shaft 21 drives the wedge-shaped support block 23 to rise, so that the top of the wedge-shaped support block 23 contacts the slope. The lifting plate 17 remains stable on the sliding member 18. When it is necessary to lower the lifting plate 17, the first drive motor 22 is started to drive the rotating shaft 21 and the wedge-shaped support block 23 to descend, so that the lifting plate 17 descends rapidly in the through groove.

[0043] The arc-shaped extrusion plate 15 corresponds to the arc-shaped support plate 12, the arc-shaped punching plate 19 corresponds to the support frame 10, the bottom of the mounting base 6 is provided with a position sensor 24, and the middle of the arc-shaped protrusion 4 is provided with a calibration point 25. During the use of this invention, it is necessary to strictly ensure that the position movement of the arc-shaped support base 3 and the mounting base 6 remains corresponding. Therefore, after adjusting the position of the moving base 9, the position of the arc-shaped support base 3 and the mounting base 6 is determined by the position sensor 24 and the calibration point 25.

[0044] The working principle of the punching device used in wafer production:

[0045] First, start the two second drive motors 26 to drive the annular threaded disc 8 to rotate, so that the moving seat 9 moves inside the fixed cylinder 7 to adjust the position of the arc support seat 3 and the mounting seat 6. Then, place the wafer between multiple arc support plates 12 and continue to adjust the position of the moving seat 9 so that the outer wall of the wafer contacts the inner arc surface of multiple support frames 10 to fix and clamp the wafer. Then, use the laser cutting equipment 2 to cut the outer area of ​​the wafer. Then, start the drive electric cylinder 16 to drive the arc extrusion plate 15 to descend, so that the arc extrusion plate 15 contacts the top of the wafer to fix the wafer. Start the first drive motor 22 to drive the rotating shaft 21 and the wedge support block 23 to descend, so that the lifting plate 17 descends rapidly in the through slot, so that the arc punching plate 19 descends to punch the outer area of ​​the wafer, so that the area of ​​the wafer that is cut off descends together with the support frame 10.

[0046] The cut wafer is removed from the support frame 10. Under the action of the spring damper 11, the support frame 10 continues to rise. At the position of the moving arc support 3, the inner arc surface of the support frame 10 clamps the remaining area of ​​the wafer. Then, the laser cutting equipment 2 is used to cut the remaining area of ​​the wafer.

[0047] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A die-cutting apparatus for wafer manufacturing, comprising a mounting frame (1) and a laser cutting device (2), characterized in that, Also includes: Arc-shaped support base (3), the number of arc-shaped support base (3) is set to multiple, an arc-shaped protrusion (4) is provided in the middle of the arc-shaped support base (3), a circumferential adjustment component is provided between the multiple arc-shaped support bases (3) and the mounting frame (1), and a support falling component is provided on the arc-shaped support base (3); The mounting cylinder (5) is provided with an XY axis moving mechanism between the top of the mounting cylinder (5) and the mounting frame (1), and the laser cutting equipment (2) is installed inside the mounting cylinder (5); Mounting seat (6), the mounting seat (6) corresponds one-to-one with the arc-shaped support seat (3), a circumferential adjustment component is also provided between the multiple mounting seats (6) and the mounting cylinder (5), an elastic extrusion component is provided on one side of the mounting seat (6), and a longitudinal punching component is provided on the other side of the mounting seat (6). The falling support component includes: A support frame (10) is provided with a spring damper (11) between the support frame (10) and the arc-shaped support seat (3). An arc-shaped support plate (12) is fixedly connected to one side of the arc-shaped protrusion (4), and the top of the arc-shaped protrusion (4) is flush with the top of the arc-shaped support plate (12). The elastic extrusion assembly includes: The arc-shaped extrusion plate (15) is mounted on the mounting base (6) and a drive electric cylinder (16) is provided on the mounting base (6). The arc-shaped extrusion plate (15) is fixedly connected to the output end of the drive electric cylinder (16). The longitudinal punching assembly includes: The lifting plate (17) is fixedly connected to one side of the mounting base (6), and the lifting plate (17) is longitudinally slidably connected to the sliding member (18). A spring damper (11) is also provided between the lifting plate (17) and the sliding member (18). Arc-shaped punching plate (19), the bottom of the lifting plate (17) is fixedly connected to the arc-shaped punching plate (19). A limiting component is provided between the lifting plate (17) and the mounting base (6); The arc-shaped extrusion plate (15) corresponds to the arc-shaped support plate (12), and the arc-shaped punching plate (19) corresponds to the support frame (10).

2. The punching apparatus for wafer manufacturing according to claim 1, characterized in that, The circumferential adjustment component includes: A fixed cylinder (7) is fixedly connected to the mounting frame (1) or the mounting cylinder (5); An annular threaded disc (8) is rotatably connected inside the fixed cylinder (7), and a driving structure is provided between the annular threaded disc (8) and the fixed cylinder (7). The movable seat (9) has multiple sliding grooves on the fixed cylinder (7). The movable seat (9) is slidably connected through the sliding grooves. The movable seat (9) is threadedly connected to the annular threaded disc (8). The arc-shaped support seat (3) and the mounting seat (6) are correspondingly fixedly connected to the movable seat (9).

3. The die-cutting apparatus for wafer production according to claim 2, characterized in that, The XY axis moving mechanism includes: A movable slot frame one (13) is fixedly connected to the top of the mounting frame (1). A movable slot frame two (14) is slidably connected to the movable slot frame one (13). A screw drive structure is provided between the movable slot frame one (13) and the movable slot frame two (14). The screw drive structure is also provided between the mounting cylinder (5) and the movable slot frame two (14).

4. A punching apparatus for wafer manufacturing according to claim 3, characterized in that, The limiting component includes: Rotating groove (20), the rotating groove (20) is fixedly connected to the mounting base (6), the mounting base (6) is rotatably connected to a rotating shaft (21), the rotating groove (20) is fixedly connected to a first drive motor (22), and the output end of the first drive motor (22) is fixedly connected to the rotating shaft (21); A wedge-shaped support block (23) is fixedly connected to the rotating shaft (21). A through groove is provided on the lifting plate (17), and the inner top wall of the through groove is set as a slope. The wedge-shaped support block (23) is in contact with the slope.

5. A punching apparatus for wafer manufacturing according to claim 4, characterized in that, A position sensor (24) is provided at the bottom of the mounting base (6), and a calibration point (25) is provided at the middle of the arc-shaped protrusion (4).

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