Silicon wafer polishing equipment for integrated circuit chip production

Abstract

The invention discloses silicon wafer polishing equipment for integrated circuit chip production, and relates to the technical field of polishing equipment.The silicon wafer polishing equipment comprises a base cabinet, supporting legs are fixedly mounted at the four corners of the bottom of the base cabinet, stand columns are fixedly mounted on the side edges of the top of the base cabinet, and a mounting cabinet is fixedly mounted at the tops of the outer surfaces of the stand columns; and heat dissipation holes are formed in the surface of the base cabinet, a placement pressing mechanism is mounted in the middle of the top of the base cabinet, and a polishing mechanism is mounted at the bottom of the mounting cabinet. According to the silicon wafer polishing equipment for integrated circuit chip production, cut silicon wafers are placed through the placing and pressing mechanism, the silicon wafers are extruded upwards so that the silicon wafers can be tightly attached to the polishing part, polishing liquid is added in the polishing process of the polishing mechanism, and unified polishing operation is conducted on the silicon wafers placed in the pressing mechanism; and the polishing efficiency of the silicon wafer is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of polishing equipment, in particular to a silicon wafer polishing equipment for producing integrated circuit chips. Background Art

[0002] In the production of integrated circuit chips, especially in the preparation of silicon wafers, polishing operations are often required. First, the silicon needs to be cut into silicon wafers with a certain thickness and shape through a cutting process, and then the cut silicon wafers can be polished and other subsequent processes. Cutting first and then polishing can process the silicon single crystal ingot into multiple silicon wafers in the cutting stage, and then these silicon wafers are polished uniformly, which is conducive to improving the overall production efficiency and processing quality control.

[0003] Traditional silicon wafer polishing equipment usually adds polishing liquid on the surface of the silicon wafer before the polishing operation. However, since the polishing layer and the silicon wafer are tightly attached under the action of high pressure during polishing, it is difficult to add polishing liquid during the polishing process. The polishing liquid can prevent the surface temperature of the silicon wafer from being too high during polishing. Therefore, it is necessary to artificially add polishing liquid to the surface of the silicon wafer, resulting in a short single polishing time, low processing efficiency, and a decline in the surface quality of the silicon wafer, affecting the quality and efficiency of integrated circuit chip production. Summary of the invention

[0004] To achieve the above purpose, the present invention is implemented through the following technical scheme: a silicon wafer polishing device for integrated circuit chip production, comprising:

[0005] A base cabinet, and supporting feet fixedly installed at the four corners of the bottom of the base cabinet, a column fixedly installed at the side of the top of the base cabinet, a guide rail fixedly installed on the surface of the column, an installation cabinet fixedly installed on the top of the outer surface of the column, the installation cabinet is arranged directly above the base cabinet, and a heat dissipation hole is opened on the surface of the base cabinet;

[0006] A placing and pressing mechanism is installed in the middle of the top of the base cabinet and on the outer surface of the guide rail. The placing and pressing mechanism is used to place the cut silicon wafers and press the silicon wafers upward to make them fit tightly with the polishing parts.

[0007] A polishing mechanism, which is installed at the bottom of the installation cabinet and is arranged just above the pressing mechanism. The polishing mechanism is used to perform a uniform polishing operation on the cut silicon wafers;

[0008] Among them, the polishing mechanism includes a motor, which is fixedly installed at the bottom of the inner cavity of the installation cabinet through a bracket, the output end of the motor is fixedly connected to a transmission shaft, the outer surface of the transmission shaft is rotatably installed with a stabilizing ring, the outer surface of the stabilizing ring is fixedly installed with a support rod, the other end of the support rod is fixedly installed at the bottom of the installation cabinet, and a liquid storage part is fixedly installed at the bottom of the transmission shaft. The liquid storage part is used to add polishing liquid and guide the polishing liquid to the liquid outlet position, and a polishing part is fixedly installed at the bottom of the liquid storage part. The polishing part is used to evenly output the polishing liquid to the surface of the silicon wafer and polish the silicon wafer. Mounting bolts are fixedly installed between the edges of the liquid storage part and the polishing part. The mounting bolts are used to fix the liquid storage part and the polishing part to ensure that the two are firmly connected so that the polishing process can proceed normally.

[0009] Preferably, a sealing groove is provided at the bottom of the liquid storage component, and a sealing ring is fixedly installed inside the sealing groove. The sealing ring is sealed and adapted to the top of the polishing component. The sealing groove and the sealing ring can prevent the polishing liquid from leaking from the connection between the liquid storage component and the polishing component, thereby ensuring that the polishing liquid can flow out normally.

[0010] Preferably, the liquid storage component includes a fixed cover, the middle of the top of the fixed cover is fixedly installed on the bottom of the transmission shaft, the top of the fixed cover is provided with a liquid inlet, the liquid inlet is used to add polishing liquid, the top of the liquid inlet is provided with a sealing plug, the sealing plug passes through the liquid inlet and extends to the interior thereof, the top of the fixed cover is provided with an air hole, the liquid inlet and the air hole are spaced apart, and the air hole can balance the internal air pressure to facilitate liquid intake.

[0011] Preferably, an arc-shaped liquid guide plate, a liquid separation plate and a screen are fixedly installed on the inner wall of the fixed cover in sequence from top to bottom. A leakage hole is provided on the surface of the arc-shaped liquid guide plate, and a liquid separation hole is provided at the bend of the liquid separation plate. The arc-shaped liquid guide plate guides and disperses the poured polishing liquid, and the liquid flows to the liquid separation plate through the leakage hole. The liquid separation plate further evenly separates the liquid through the liquid separation hole. The screen can filter impurities to prevent impurities in the polishing liquid from damaging the silicon wafer.

[0012] Preferably, the arc-shaped liquid guide plate is an inverted V-shape as a whole, and the bending part of the arc-shaped liquid guide plate is arranged directly below the liquid inlet. The number of the arc-shaped liquid guide plates is four, and the four arc-shaped liquid guide plates are fixedly connected at one end away from the inner wall of the fixed cover, and the liquid separation hole is arranged at the bending part of the lower part of the liquid separation plate.

[0013] Preferably, the polishing member comprises a liquid outlet plate, which is fixedly mounted on the bottom of the fixed cover by mounting bolts, a liquid outlet and a rubber layer are mounted on the bottom of the liquid outlet plate, the liquid outlet and the rubber layer are spaced apart, and a polishing layer is fixedly mounted on the bottom of the rubber layer.

[0014] Preferably, the liquid outlet and the rubber layer are evenly distributed at the bottom of the liquid outlet plate. The liquid outlet can evenly output the polishing liquid in the liquid storage member to the surface of the silicon wafer. The rubber layer plays a buffering role to avoid damage caused by direct rigid contact between the polishing layer and the silicon wafer. The polishing layer is used to directly polish the silicon wafer.

[0015] Preferably, the placement and clamping mechanism includes a cylinder and a placement plate, the cylinder is fixedly mounted on the top of the inner cavity of the base cabinet, the telescopic end of the cylinder is fixedly connected to a telescopic rod, the top of the telescopic rod is fixedly mounted in the middle of the bottom of the placement plate, and the placement plate is pushed up and down by the telescopic rod to achieve the clamping and loosening operations of the silicon wafer, and an elastic bearing shaft is fixedly mounted on one side of the bottom of the placement plate, and the elastic bearing shaft is fixedly mounted on the top of the base cabinet. The elastic bearing shaft can play a buffering and stabilizing role when the placement plate moves.

[0016] Preferably, a connecting block is fixedly installed on the side of the placing plate, and the connecting block is arranged opposite to the elastic bearing shaft. A sliding groove is opened on the side of the connecting block, and the connecting block is slidably installed on the outer surface of the guide rail through the sliding groove. The sliding groove cooperates with the guide rail to ensure the smoothness and linearity of the movement of the placing plate, and a placing component is installed on the surface of the placing plate.

[0017] Preferably, the placement component includes a placement groove, which is opened on the upper surface of the placement plate, and is used to position the silicon wafer. A fixing frame is fixedly installed on the inner wall of the placement groove, and Ω-shaped elastic bars are fixedly installed at the four corners of the inner wall of the fixing frame. An angle pad is fixedly installed on the inner curved surface of the Ω-shaped elastic bar, and the Ω-shaped elastic bar and the angle pad thereon can protect the silicon wafer and stabilize the silicon wafer in the placement groove.

[0018] The present invention provides a silicon wafer polishing device for integrated circuit chip production. It has the following beneficial effects:

[0019] 1. The silicon wafer polishing equipment for the production of integrated circuit chips, through the setting of the liquid storage part and the polishing part, adds the polishing liquid into the liquid storage part before polishing. During the polishing process, the polishing liquid in the liquid storage part is guided to the polishing part, and then output to the surface of the silicon wafer through the liquid outlet on the polishing part, so that the polishing liquid is automatically added during the polishing process without manual addition, which prolongs the single polishing time, improves the processing efficiency, and at the same time ensures the surface quality of the silicon wafer, thereby improving the quality and efficiency of integrated circuit chip production.

[0020] 2. The silicon wafer polishing equipment for the production of integrated circuit chips has an arc-shaped liquid guide plate and a liquid separation plate. After the polishing liquid is poured in, it is first guided and dispersed by the arc-shaped liquid guide plate, and then flows to the liquid separation plate through the leakage hole. The liquid is further evenly separated by the liquid separation holes of the liquid separation plate, so that the polishing liquid is evenly distributed in the liquid storage part, and finally can be evenly output to the surface of the silicon wafer, ensuring that all parts of the silicon wafer can get sufficient and even supply of polishing liquid, thereby improving the uniformity and quality of polishing.

[0021] 3. The silicon wafer polishing equipment for the production of integrated circuit chips, through the setting of the Ω-shaped spring bar and the corner pad in the placement component, when the silicon wafer is placed in the placement groove, the Ω-shaped spring bar and the corner pad on it stabilize the silicon wafer from the corners, fix the silicon wafer and prevent the silicon wafer from being damaged. The stability of the silicon wafer during the polishing process is guaranteed, and the silicon wafer is prevented from being scratched during the placement and polishing process, thereby improving the production quality of the silicon wafer.

[0022] Fourth, the silicon wafer polishing equipment for integrated circuit chip production, through the setting of elastic bearing shaft, guide rail and slide groove, during the up and down movement of the placement plate, the elastic bearing shaft plays a buffering role, and the guide rail and slide groove cooperate to provide guidance for the movement of the placement plate, making the lifting process of the placement plate more stable and smooth, reducing vibration. Ensure the stability of the position of the silicon wafer during the pressing and loosening process, avoid the silicon wafer from being offset or damaged by collision with the polishing parts due to vibration, which is conducive to improving the polishing accuracy.

[0023] 5. The silicon wafer polishing equipment for the production of integrated circuit chips has a sealing groove and a sealing ring. When the liquid storage part is connected to the polishing part, the sealing ring is embedded in the sealing groove to form a seal, preventing the polishing liquid from leaking from the connection between the liquid storage part and the polishing part, and ensuring that the polishing liquid can be normally output through the liquid outlet. This ensures the effective use of the polishing liquid, avoids damage to the equipment caused by the leakage of the polishing liquid, and ensures the stability and continuity of the polishing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the appearance of the present invention;

[0026] Figure 3 It is a partial cross-sectional view of the base cabinet and the installation cabinet of the present invention;

[0027] Figure 4 It is a schematic diagram of the polishing mechanism structure of the present invention;

[0028] Figure 5 It is a partial cross-sectional view of the liquid storage member of the present invention;

[0029] Figure 6 is a cross-sectional view of the polishing member of the present invention;

[0030] Figure 7 This is a schematic diagram of the structure of the clamping mechanism of the present invention;

[0031] Figure 8 It is an enlarged schematic diagram of part A of the present invention.

[0032] In the figure: 1, base cabinet; 2, placement and clamping mechanism; 21, cylinder; 22, telescopic rod; 23, placement plate; 24, elastic bearing shaft; 25, placement component; 251, placement slot; 252, fixing frame; 253, Ω-shaped elastic strip; 254, corner pad; 26, connection block; 27, slide; 3, column; 4, installation cabinet; 5, polishing mechanism; 51, motor; 52, transmission shaft; 53, stabilizing ring; 54, support rod; 55, liquid storage part ; 551, fixed cover; 552, liquid inlet; 553, sealing plug; 554, arc-shaped liquid guide plate; 555, leakage hole; 556, liquid separation plate; 557, liquid separation hole; 558, screen; 559, air vent; 56, polishing part; 561, liquid outlet plate; 562, liquid outlet; 563, rubber layer; 564, polishing layer; 57, mounting bolts; 58, sealing groove; 59, sealing ring; 6, guide rail; 7, support foot; 8, heat dissipation hole. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] The first embodiment, as Figures 1 to 8 As shown, the present invention provides a technical solution: a silicon wafer polishing device for producing integrated circuit chips, comprising:

[0035] A base cabinet 1, and support feet 7 fixedly installed at the four corners of the bottom of the base cabinet 1, a column 3 fixedly installed on the side of the top of the base cabinet 1, a guide rail 6 fixedly installed on the surface of the column 3, an installation cabinet 4 fixedly installed on the top of the outer surface of the column 3, the installation cabinet 4 is arranged directly above the base cabinet 1, and a heat dissipation hole 8 is opened on the surface of the base cabinet 1;

[0036] The clamping mechanism 2 is installed in the middle of the top of the base cabinet 1 and the outer surface of the guide rail 6. The clamping mechanism 2 is used to place the cut silicon wafers and squeeze them upward to make them fit tightly with the polishing parts.

[0037] The placing and pressing mechanism 2 includes a cylinder 21 and a placing plate 23. The cylinder 21 is fixedly mounted on the top of the inner cavity of the base cabinet 1. The telescopic end of the cylinder 21 is fixedly connected with a telescopic rod 22. The top of the telescopic rod 22 is fixedly mounted at the middle of the bottom of the placing plate 23. The placing plate 23 is pushed up and down by the telescopic rod 22 to realize the pressing and releasing operations on the silicon wafer. An elastic bearing shaft 24 is fixedly mounted on one side of the bottom of the placing plate 23. The elastic bearing shaft 24 is fixedly mounted on the top of the base cabinet 1. The elastic bearing shaft 24 can play a buffering and stabilizing role when the placing plate 23 moves. When the cylinder 21 is working, the telescopic end of the cylinder 21 pushes the telescopic rod 22 to move upward, thereby driving the placing plate 23 to move upward along the guide rail 6. The elastic bearing shaft 24 at the bottom of the placing plate 23 plays a buffering and stabilizing role. At the same time, the slide groove 27 of the connecting block 26 cooperates with the guide rail 6 to ensure that the placing plate 23 rises steadily and linearly until the silicon wafer is tightly fitted with the polishing piece 56.

[0038] A connecting block 26 is fixedly installed on the side of the placement plate 23. The connecting block 26 is arranged opposite to the elastic bearing shaft 24. A slide groove 27 is opened on the side of the connecting block 26. The connecting block 26 is slidably installed on the outer surface of the guide rail 6 through the slide groove 27. The slide groove 27 cooperates with the guide rail 6 to ensure the stability and linearity of the movement of the placement plate 23, so that the lifting process of the placement plate 23 is more stable and smooth, and the vibration is reduced, which ensures that the position of the silicon wafer is stable during the pressing and loosening process, and avoids the silicon wafer from being offset or colliding with the polishing piece 56 due to vibration, which is conducive to improving the polishing accuracy. A placement component 25 is installed on the surface of the placement plate 23;

[0039] The placement component 25 includes a placement groove 251, which is opened on the upper surface of the placement plate 23. The placement groove 251 is used to position the silicon wafer. A fixing frame 252 is fixedly installed on the inner wall of the placement groove 251. Ω-shaped elastic bars 253 are fixedly installed at the four corners of the inner wall of the fixing frame 252. An angle pad 254 is fixedly installed on the inner curved surface of the Ω-shaped elastic bar 253. The Ω-shaped elastic bar 253 and the angle pad 254 thereon can protect the silicon wafer and stabilize the silicon wafer in the placement groove 251, thereby ensuring the stability of the silicon wafer during the polishing process and preventing the silicon wafer from being scratched during the placement and polishing process, thereby improving the production quality of the silicon wafer.

[0040] The second embodiment is based on the first embodiment. Figures 1 to 6 As shown, the polishing mechanism 5 is installed at the bottom of the installation cabinet 4, and the polishing mechanism 5 is arranged just above the pressing mechanism 2. The polishing mechanism 5 realizes automatic addition of polishing liquid during the polishing process, without the need for manual addition in the middle, thereby extending the single polishing time, improving the processing efficiency, and ensuring the surface quality of the silicon wafer, thereby improving the quality and efficiency of the integrated circuit chip production, and performing a uniform polishing operation on the cut silicon wafers;

[0041] The polishing mechanism 5 includes a motor 51, which is fixedly installed at the bottom of the inner cavity of the installation cabinet 4 through a bracket, and a transmission shaft 52 is fixedly connected to the output end of the motor 51. A stabilizing ring 53 is rotatably installed on the outer surface of the transmission shaft 52, and a support rod 54 is fixedly installed on the outer surface of the stabilizing ring 53. The other end of the support rod 54 is fixedly installed at the bottom of the installation cabinet 4. A liquid storage part 55 is fixedly installed at the bottom of the transmission shaft 52. The liquid storage part 55 is used to add polishing liquid and guide the polishing liquid to the liquid outlet position. A polishing part 56 is fixedly installed at the bottom of the liquid storage part 55. The polishing part 56 is used to evenly output the polishing liquid to the surface of the silicon wafer and perform a polishing operation on the silicon wafer. A mounting bolt 57 is fixedly installed between the edges of the liquid storage part 55 and the polishing part 56. The mounting bolt 57 is used to fix the liquid storage part 55 and the polishing part 56 to ensure that the two are firmly connected so that the polishing process can proceed normally.

[0042] A sealing groove 58 is provided at the bottom of the liquid storage member 55, and a sealing ring 59 is fixedly installed inside the sealing groove 58. The sealing ring 59 is sealed and adapted with the top of the polishing member 56. The sealing groove 58 and the sealing ring 59 can prevent the polishing liquid from leaking from the connection between the liquid storage member 55 and the polishing member 56, so as to ensure that the polishing liquid can flow out normally.

[0043] The liquid storage member 55 includes a fixed cover 551. The middle of the top of the fixed cover 551 is fixedly mounted on the bottom of the transmission shaft 52. A liquid inlet 552 is mounted on the top of the fixed cover 551. The liquid inlet 552 is used to add polishing liquid. A sealing plug 553 is mounted on the top of the liquid inlet 552. The sealing plug 553 penetrates the liquid inlet 552 and extends to the inside thereof. A vent hole 559 is opened on the top of the fixed cover 551. The liquid inlet 552 and the vent hole 559 are spaced apart. The vent hole 559 can balance the internal air pressure to facilitate liquid inlet.

[0044] The inner wall of the fixed cover 551 is fixedly installed with an arc-shaped liquid guide plate 554, a liquid separation plate 556 and a screen 558 in order from top to bottom. The surface of the arc-shaped liquid guide plate 554 is provided with a liquid leakage hole 555, and the liquid separation plate 556 is provided with a liquid separation hole 557 at the bend. The arc-shaped liquid guide plate 554 guides and disperses the poured polishing liquid, and the polishing liquid flows to the liquid separation plate 556 through the liquid leakage hole 555. The liquid separation plate 556 further evenly separates the liquid through the liquid separation hole 557, ensuring that each part of the silicon wafer can be fully and evenly supplied with polishing liquid, thereby improving the uniformity and quality of polishing. The screen 558 can filter impurities to prevent the impurities in the polishing liquid from damaging the silicon wafer.

[0045] The arc-shaped liquid guide plate 554 is in an inverted V shape as a whole, and the bending part of the arc-shaped liquid guide plate 554 is arranged directly below the liquid inlet 552. There are four arc-shaped liquid guide plates 554, and one end of the four arc-shaped liquid guide plates 554 away from the inner wall of the fixed cover 551 is fixedly connected, and the liquid separation hole 557 is arranged at the bending part of the lower part of the liquid separation plate 556;

[0046] The polishing member 56 includes a liquid outlet plate 561, which is fixedly mounted on the bottom of the fixed cover 551 by means of mounting bolts 57, a liquid outlet 562 and a rubber layer 563 are mounted on the bottom of the liquid outlet plate 561, the liquid outlet 562 and the rubber layer 563 are arranged at intervals, and a polishing layer 564 is fixedly mounted on the bottom of the rubber layer 563;

[0047] The liquid outlet 562 and the rubber layer 563 are evenly distributed at the bottom of the liquid outlet plate 561. The liquid outlet 562 can evenly output the polishing liquid in the liquid storage part 55 to the surface of the silicon wafer. The rubber layer 563 plays a buffering role to prevent the polishing layer 564 from being damaged by direct rigid contact with the silicon wafer. The polishing layer 564 is used to directly polish the silicon wafer.

[0048] When in use, the operator opens the sealing plug 553 on the liquid inlet 552 and pours the polishing liquid into the fixed cover 551 through the liquid inlet 552. The air vent 559 balances the internal air pressure, making it easy for the polishing liquid to enter smoothly.

[0049] The cut silicon wafer is placed in the placement groove 251 on the placement plate 23. The Ω-shaped elastic bars 253 on the inner wall of the fixing frame 252 and the corner pads 254 thereon work together to firmly fix the silicon wafer in the placement groove 251, thereby completing the positioning and fixing of the silicon wafer.

[0050] Start the cylinder 21, and the telescopic end of the cylinder 21 pushes the telescopic rod 22 to move upward, thereby driving the placement plate 23 to move upward along the guide rail 6. The elastic bearing shaft 24 at the bottom of the placement plate 23 plays a buffering and stabilizing role. At the same time, the slide groove 27 of the connecting block 26 cooperates with the guide rail 6 to ensure that the placement plate 23 rises steadily and straightly until the silicon wafer is tightly fitted with the polishing piece 56;

[0051] The motor 51 is turned on, and the motor 51 drives the liquid storage part 55 and the polishing part 56 to rotate through the transmission shaft 52. The polishing liquid poured into the fixed cover 551 first falls on the arc-shaped liquid guide plate 554, and then flows to the liquid separation plate 556 through the leakage hole 555 after being guided and dispersed. The liquid separation plate 556 further evenly separates the liquid through the liquid separation hole 557, and after filtering impurities through the screen 558, it reaches the liquid outlet plate 561. The polishing liquid is output to the surface of the silicon wafer through the liquid outlet 562 evenly distributed at the bottom of the liquid outlet plate 561. The rubber layer 563 plays a buffering role to prevent the polishing layer 564 from being directly and rigidly contacted with the silicon wafer to cause damage. The rotating polishing layer 564 performs a polishing operation on the silicon wafer.

[0052] After polishing is completed, the cylinder 21 contracts, and the telescopic rod 22 drives the placement plate 23 to descend, so that the silicon wafer is separated from the polishing piece 56, and the polished silicon wafer is taken out.

[0053] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0054] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer polishing device for integrated circuit chip production, characterized in that: include: A base cabinet (1), and supporting feet (7) fixedly mounted at the four corners of the bottom of the base cabinet (1), a column (3) fixedly mounted on the side of the top of the base cabinet (1), a guide rail (6) fixedly mounted on the surface of the column (3), an installation cabinet (4) fixedly mounted on the top of the outer surface of the column (3), the installation cabinet (4) being arranged directly above the base cabinet (1), and a heat dissipation hole (8) being opened on the surface of the base cabinet (1); A placing and clamping mechanism (2), wherein the placing and clamping mechanism (2) is installed in the middle of the top of the base cabinet (1), and the placing and clamping mechanism (2) is installed on the outer surface of the guide rail (6); A polishing mechanism (5), the polishing mechanism (5) being installed at the bottom of the installation cabinet (4), and the polishing mechanism (5) being arranged just above the pressing mechanism (2); The polishing mechanism (5) comprises a motor (51), the motor (51) is fixedly mounted on the bottom of the inner cavity of the installation cabinet (4) through a bracket, the output end of the motor (51) is fixedly connected to a transmission shaft (52), a stabilizing ring (53) is rotatably mounted on the outer surface of the transmission shaft (52), a support rod (54) is fixedly mounted on the outer surface of the stabilizing ring (53), the other end of the support rod (54) is fixedly mounted on the bottom of the installation cabinet (4), a liquid storage component (55) is fixedly mounted on the bottom of the transmission shaft (52), a polishing component (56) is fixedly mounted on the bottom of the liquid storage component (55), and a mounting bolt (57) is fixedly mounted between the edges of the liquid storage component (55) and the polishing component (56).

2. The silicon wafer polishing equipment for integrated circuit chip production according to claim 1, characterized in that: A sealing groove (58) is provided at the bottom of the liquid storage member (55), a sealing ring (59) is fixedly installed inside the sealing groove (58), and the sealing ring (59) is sealed and adapted to the top of the polishing member (56).

3. The silicon wafer polishing equipment for integrated circuit chip production according to claim 2, characterized in that: The liquid storage component (55) comprises a fixed cover (551), the middle of the top of the fixed cover (551) is fixedly mounted on the bottom of the transmission shaft (52), a liquid inlet (552) is mounted on the top of the fixed cover (551), a sealing plug (553) is mounted on the top of the liquid inlet (552), the sealing plug (553) penetrates the liquid inlet (552) and extends into the interior thereof, a ventilation hole (559) is opened on the top of the fixed cover (551), and the liquid inlet (552) and the ventilation hole (559) are spaced apart.

4. The silicon wafer polishing equipment for integrated circuit chip production according to claim 3, characterized in that: An arc-shaped liquid guide plate (554), a liquid separation plate (556) and a screen (558) are fixedly mounted on the inner wall of the fixed cover (551) in order from top to bottom. A liquid leakage hole (555) is provided on the surface of the arc-shaped liquid guide plate (554), and a liquid separation hole (557) is provided at the bend of the liquid separation plate (556).

5. The silicon wafer polishing equipment for integrated circuit chip production according to claim 4, characterized in that: The arc-shaped liquid guide plate (554) is in an inverted V-shape as a whole, and the bending part of the arc-shaped liquid guide plate (554) is arranged directly below the liquid inlet (552). There are four arc-shaped liquid guide plates (554), and the four arc-shaped liquid guide plates (554) are fixedly connected at one end away from the inner wall of the fixed cover (551), and the liquid separation hole (557) is arranged at the bending part of the lower part of the liquid separation plate (556).

6. The silicon wafer polishing equipment for integrated circuit chip production according to claim 5, characterized in that: The polishing member (56) comprises a liquid outlet plate (561), the liquid outlet plate (561) being fixedly mounted on the bottom of the fixed cover (551) by means of mounting bolts (57), a liquid outlet (562) and a rubber layer (563) being mounted on the bottom of the liquid outlet plate (561), the liquid outlet (562) and the rubber layer (563) being arranged at intervals, and a polishing layer (564) being fixedly mounted on the bottom of the rubber layer (563).

7. The silicon wafer polishing equipment for integrated circuit chip production according to claim 6, characterized in that: The liquid outlet (562) and the rubber layer (563) are evenly distributed at the bottom of the liquid outlet plate (561).

8. The silicon wafer polishing equipment for integrated circuit chip production according to claim 1, characterized in that: The placement and clamping mechanism (2) comprises a cylinder (21) and a placement plate (23); the cylinder (21) is fixedly mounted on the top of the inner cavity of the base cabinet (1); the telescopic end of the cylinder (21) is fixedly connected to a telescopic rod (22); the top of the telescopic rod (22) is fixedly mounted in the middle of the bottom of the placement plate (23); an elastic bearing shaft (24) is fixedly mounted on one side of the bottom of the placement plate (23); and the elastic bearing shaft (24) is fixedly mounted on the top of the base cabinet (1).

9. The silicon wafer polishing equipment for integrated circuit chip production according to claim 8, characterized in that: A connecting block (26) is fixedly mounted on the side of the placement plate (23), the connecting block (26) is arranged opposite to the elastic bearing shaft (24), a sliding groove (27) is opened on the side of the connecting block (26), and the connecting block (26) is slidably mounted on the outer surface of the guide rail (6) through the sliding groove (27), and a placement component (25) is installed on the surface of the placement plate (23).

10. The silicon wafer polishing equipment for integrated circuit chip production according to claim 9, characterized in that: The placement component (25) comprises a placement groove (251), the placement groove (251) being opened on the upper surface of the placement plate (23), a fixing frame (252) being fixedly mounted on the inner wall of the placement groove (251), Ω-shaped elastic bars (253) being fixedly mounted on the four corners of the inner wall of the fixing frame (252), and an angle pad (254) being fixedly mounted on the inner curved surface of the Ω-shaped elastic bar (253).

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