Motorcycle instrument with efficient heat dissipation function

Abstract

The motorcycle instrument comprises an upper cover and a bottom shell which are arranged up and down, a display module is arranged in the upper cover, a PCB connected with the display module is arranged on the bottom face of the upper cover, display glass is arranged on the upper cover, and display content of the display module can be seen through the display glass. And the upper cover is made of a material of which the heat dissipation performance is not less than that of aluminum alloy. The display module and the PCB are directly arranged on the upper cover, and meanwhile, the upper cover is made of a material with good heat dissipation performance, so that heat dissipation of the display screen and the PCB can be ensured, and the situations of shutdown and the like caused by overheating are prevented; the display module and the PCB are directly arranged on the upper cover, and a supporting piece is omitted, so that the overall structure is simple, and cost and installation difficulty are reduced conveniently.

Description

Technical Field

[0001] The invention belongs to the technical field of motorcycle instruments, and in particular relates to a motorcycle instrument with high-efficiency heat dissipation. Background Art

[0002] Currently, there are two ways to dissipate heat for motorcycle instruments. One is to expose the corresponding display screen to the outside to allow it to dissipate heat naturally, and the other is to set up a separate air guide channel to dissipate heat through air cooling. The former makes the display screen easy to be damaged, and the latter has a complex structure and poor waterproofness. Summary of the invention

[0003] The present invention proposes a motorcycle instrument with high heat dissipation efficiency, which simplifies the structure while ensuring the heat dissipation effect.

[0004] To this end, the technical solution adopted by the present invention is: a motorcycle instrument with high efficiency in heat dissipation, comprising an upper cover and a bottom shell arranged up and down, a display module is arranged in the upper cover, a PCB board connected to the display module is arranged on the bottom surface of the upper cover, a display glass through which the display content of the display module can be seen is arranged on the upper cover, and the upper cover is made of a material with heat dissipation performance not less than that of aluminum alloy.

[0005] As a preferred embodiment of the above scheme, a double-layer step structure is used for sealing between the upper cover and the bottom shell, and the double-layer step structure includes an inner protrusion and an outer protrusion arranged on the outer ring of the bottom shell, and an inner groove and a matching protrusion are correspondingly arranged on the outer ring of the upper cover.

[0006] Further preferably, the top surface of the upper cover is recessed inwardly to form a groove which is larger at the top and smaller at the bottom, the upper groove is used for installing the display glass, the lower groove is used for installing the display module, and the upper cover is provided with a through hole for passing the connecting cable between the PCB board and the display module.

[0007] Further preferably, a circle of bonding grooves for accommodating display glass bonding glue is provided on the step of the groove.

[0008] Further preferably, a mounting nut for installing the instrument is embedded in the bottom shell.

[0009] Further preferably, a breathable column is provided on the bottom shell, a breathable hole is provided on the breathable column, and a breathable waterproof membrane is provided on the breathable hole.

[0010] Further preferably, the upper cover is provided with mounting holes for corresponding installation of the display module, the PCB board and the bottom shell.

[0011] Further preferably, a photosensitive component is disposed in the upper cover.

[0012] The beneficial effects of the present invention are as follows: the display module and the PCB board are both directly arranged on the upper cover, and the upper cover is made of a material with good heat dissipation performance, which can ensure the heat dissipation of the display screen and the PCB board, thereby preventing the occurrence of shutdown due to overheating and the like; the display module and the PCB board are both directly arranged on the upper cover, and the arrangement of the supporting parts is cancelled, so that the overall structure is simple, which is convenient for reducing costs and reducing the difficulty of installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A three-dimensional schematic diagram of the present invention Figure 1 .

[0014] Figure 2 A three-dimensional schematic diagram of the present invention Figure 2 .

[0015] Figure 3 It is a schematic diagram of the present invention.

[0016] Figure 4 It is a schematic diagram of the back cover in the present invention.

[0017] Figure 5 Schematic diagram of the front cover in the present invention Figure 1 .

[0018] Figure 6 Schematic diagram of the front cover in the present invention Figure 2 .

[0019] Figure markings: upper cover -1, inner groove -1a, matching protrusion -1b, groove -1c, bonding groove -1d, bottom shell -2, inner protrusion -2a, outer protrusion -2b, air hole -2c, display module -3, PCB board -4, display glass -5, mounting nut -6, breathable waterproof membrane -7, photosensitive component -8. DETAILED DESCRIPTION

[0020] The present invention will be further described below by way of embodiments and in conjunction with the accompanying drawings:

[0021] like Figure 1-Figure 6 As shown, a motorcycle instrument with high efficiency in heat dissipation is mainly composed of an upper cover 1, a bottom shell 2, a display module 3, a PCB board 4 and a display glass 5, wherein the bottom shell 2 is arranged below the upper cover 1, and to ensure sealing, a double-layer step structure is used to seal between the upper cover 1 and the bottom shell 2. The double-layer step structure includes an inner protrusion 2a and an outer protrusion 2b arranged on the outer ring of the bottom shell 2, and the inner protrusion is higher than the outer protrusion. An inner groove 1a and a matching protrusion 1b are correspondingly arranged on the outer ring of the upper cover 1, and a mounting nut 6 for instrument installation is embedded on the bottom shell 2. After installation, the inner protrusion is inserted into the inner groove, and the outer protrusion is against the matching protrusion, thereby achieving double-layer sealing.

[0022] The display glass 5 and the display module 3 are both arranged in the upper cover, and the display content of the display module can be seen through the display glass. To facilitate the installation of the display glass and the display module, a groove 1c with a larger upper part and a smaller lower part is provided inwardly on the top surface of the upper cover 1. The upper groove is used for installing the display glass 5, and the lower groove is used for installing the display module 3.

[0023] The PCB board 4 is arranged on the bottom surface of the upper cover 1 and can be connected to the display module 3. A through hole is arranged on the upper cover 1 for the connection cable between the PCB board 4 and the display module 3 to pass through, that is, the through hole is connected to the groove.

[0024] The upper cover 1 is provided with mounting holes for corresponding installation of the display module, PCB board and bottom shell, so that the display module and PCB board are directly arranged on the upper cover. Preferably, a thermal pad is pasted on the position of the PCB board where the heat is high, and a boss that fits the thermal pad is provided on the upper cover. The heat dissipation of the instrument body is achieved through the thermal conductivity of the upper cover. The entire heat dissipation structure is simple, which can not only achieve heat dissipation, but also protect the display module.

[0025] A vent column is provided on the bottom shell 2, a vent hole 2c is provided on the vent column, and a vent waterproof membrane 7 is provided on the vent hole. When the instrument is assembled, a cavity is formed between the PCB board and the bottom shell, and the vent hole is connected to the cavity, which can further achieve heat dissipation of the PCB board.

[0026] Preferably, a photosensitive component is provided inside the upper cover, and the photosensitive component adjusts the display brightness by sensing the external light intensity.

Claims

1. A motorcycle instrument with high heat dissipation efficiency, characterized by: The invention comprises an upper cover (1) and a bottom shell (2) which are arranged upper and lower, wherein a display module (3) is arranged inside the upper cover (1), a PCB board (4) connected to the display module (3) is arranged on the bottom surface of the upper cover (1), and display glass (5) through which display contents of the display module can be seen is arranged on the upper cover (1), and the upper cover (1) is made of a material with heat dissipation performance not less than that of aluminum alloy.

2. The motorcycle instrument with high efficiency heat dissipation according to claim 1, characterized in that: A double-layer step structure is used to seal between the upper cover (1) and the bottom shell (2), wherein the double-layer step structure comprises an inner protrusion (2a) and an outer protrusion (2b) arranged on the outer ring of the bottom shell (2), and an inner groove (1a) and a matching protrusion (1b) are correspondingly arranged on the outer ring of the upper cover (1).

3. The motorcycle instrument with high efficiency heat dissipation according to claim 1, characterized in that: The top surface of the upper cover (1) is inwardly recessed and provided with a groove (1c) that is larger at the top and smaller at the bottom. The upper groove is used for installing the display glass (5), and the lower groove is used for installing the display module (3). The upper cover (1) is provided with a through hole for the connection cable between the PCB board (4) and the display module (3) to pass through.

4. The motorcycle instrument with high efficiency heat dissipation according to claim 2, characterized in that: A circle of bonding grooves (1d) is provided on the step of the groove (1c) for accommodating the display glass bonding glue.

5. The motorcycle instrument with high efficiency heat dissipation according to claim 1, characterized in that: The bottom shell (2) is embedded with a mounting nut (6) for mounting the instrument.

6. The motorcycle instrument with high efficiency heat dissipation according to claim 1, characterized in that: The bottom shell (2) is provided with a breathable column, the breathable column is provided with a breathable hole (2c), and the breathable hole is provided with a breathable waterproof membrane (7).

7. The motorcycle instrument with high efficiency heat dissipation according to claim 1, characterized in that: The upper cover (1) is provided with mounting holes for corresponding mounting of the display module, the PCB board and the bottom shell.

8. The motorcycle instrument with high heat dissipation efficiency according to claim 1, characterized in that: A photosensitive component (8) is arranged inside the upper cover (1).

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