Insoluble anode preparation method and insoluble anode

By cleaning, activation and morphological analysis of porous plate-like substrates, electroplating is formulated and plating is carried out in stages, the problem of porous plate-like electrodes being prone to porous structures is solved, and the electrochemical performance and stability of the anode is improved.

CN119824503AInactive Publication Date: 2025-04-15SHENZHEN IRETRON TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510314262.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-17
Publication Date
2025-04-15
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

In the prior art, pore blockage is prone to occur when preparing plate-shaped electrodes with porous structures, which affects the electrochemical reaction efficiency and the stability of the anode.

Method used

By cleaning and surface activation of the porous plate-like substrate, combining morphological analysis to formulate an electroplating plan, and performing electroplating treatment in stages to ensure uniform coating and maintain the integrity of the porous structure.

Benefits of technology

It effectively solves the problem of pore blockage, improves the electrochemical performance, durability and stability of the anode, and ensures the uniformity and adhesion of the coating.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of electrode preparation, and discloses an insoluble anode preparation method and an insoluble anode.The morphology of a porous plate-shaped substrate is analyzed to formulate a corresponding electroplating scheme, an insoluble coating is prepared according to the electroplating scheme, the electroplating process can be carried out in stages, and the electroplating efficiency is improved. The effect of staged electroplating treatment is observed and analyzed to correct the subsequent stage in time so as to ensure the yield of electrode preparation, and through accurate morphology analysis and an electroplating scheme, uniform coating coverage is ensured, the electrochemical performance of the anode is improved, the adhesive force of the coating is improved through cleaning and surface activation treatment, the coating stripping phenomenon is reduced, and the service life of the anode is prolonged. In the electroplating process, the integrity of the porous structure is kept, the durability and stability of the anode are improved, and the problem that in the prior art, when a plate-shaped electrode of the porous structure is prepared, the pore blockage phenomenon is likely to occur is solved.
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Description

Technical Field

[0001] The invention relates to the technical field of electrode preparation, and in particular to a method for preparing an insoluble anode and the insoluble anode. Background Art

[0002] Insoluble anodes are widely used in the electrochemical industry, especially in electrolysis, coating and other fields. Compared with traditional anodes, insoluble anodes have longer service life and better stability, so they play an important role in industrial production.

[0003] The porous structure can increase the specific surface area of ​​the anode, thereby improving the efficiency of the electrochemical reaction. In addition, the porous structure can provide better coating adhesion and improve the overall performance of the anode. However, during the electroplating and coating preparation process, improper control can easily lead to pore blockage and damage the integrity of the pore structure. Summary of the invention

[0004] The object of the present invention is to provide a method for preparing an insoluble anode and an insoluble anode, aiming to solve the problem of pore clogging that is prone to occur when preparing a plate-shaped electrode with a porous structure in the prior art.

[0005] The present invention is implemented in this way. In a first aspect, the present invention provides a method for preparing an insoluble anode, comprising: The substrate of the insoluble anode is manufactured to obtain a porous plate-shaped substrate with a porous structure; Performing a cleaning operation on the porous plate-like substrate to remove surface attachments on the porous plate-like substrate during the manufacturing process, and performing a surface activation treatment on the porous plate-like substrate from which the surface attachments have been removed; Performing morphological analysis on the porous plate-like substrate to obtain a coating preparation scheme corresponding to the porous plate-like substrate; According to the coating preparation scheme, the porous plate-like substrate is placed in an active electroplating solution environment, and the porous plate-like substrate is electroplated to generate an electroplated coating on the surface of the porous plate-like substrate to complete the preparation of the insoluble anode.

[0006] In a second aspect, the present invention provides an insoluble anode prepared by the insoluble anode preparation method described in any one of the first aspects.

[0007] The present invention provides a method for preparing an insoluble anode, which has the following beneficial effects: The present invention analyzes the morphology of a porous plate-like substrate to formulate a corresponding electroplating scheme, thereby preparing an insoluble coating according to the electroplating scheme, and the electroplating process can be carried out in stages. The effects of the stage-by-stage electroplating treatment are observed and analyzed to make timely corrections in subsequent stages to ensure the yield of electrode preparation. Accurate morphology analysis and electroplating schemes are used to ensure uniform coating coverage and improve the electrochemical properties of the anode. Cleaning and surface activation treatments are used to improve coating adhesion and reduce coating peeling. The integrity of the porous structure is maintained during the electroplating process, and the durability and stability of the anode are improved, thereby solving the problem of pore clogging that is prone to occur when preparing plate-like electrodes with porous structures in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram of the steps of a method for preparing an insoluble anode provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0009] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0010] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0011] Reference Figure 1 As shown, a preferred embodiment of the present invention is provided.

[0012] In a first aspect, the present invention provides a method for preparing an insoluble anode, comprising: S1: preparing a substrate of an insoluble anode to obtain a porous plate-shaped substrate having a porous structure; S2: performing a cleaning operation on the porous plate-like substrate to remove surface attachments on the porous plate-like substrate during the manufacturing process, and performing a surface activation treatment on the porous plate-like substrate from which the surface attachments have been removed; S3: performing morphology analysis on the porous plate-like substrate to obtain a coating preparation scheme corresponding to the porous plate-like substrate; S4: placing the porous plate-like substrate in an active electroplating solution environment according to the coating preparation scheme, and performing electroplating treatment on the porous plate-like substrate to generate an electroplating coating on the surface of the porous plate-like substrate to complete the preparation of the insoluble anode.

[0013] Specifically, in step S1 of the embodiment provided by the present invention, a substrate of an insoluble anode is manufactured to obtain a porous plate-shaped substrate having a porous structure.

[0014] More specifically, in the embodiments provided by the present invention, the insoluble anode has a plate-like shape and a porous structure. The plate-like shape and the porous structure are intended to increase the surface area, thereby improving the anode performance.

[0015] More specifically, the role of the substrate is to provide structural support, and its insolubility is mainly reflected in the insoluble coating on the substrate. Since the overall appearance structure of the anode and the substrate are both plate-like and porous, the specific preparation details need to be adjusted accordingly according to its plate-like appearance and porous structure to adapt to changes in its morphology.

[0016] Specifically, in step S2 of the embodiment provided by the present invention, the porous plate-like substrate is cleaned to remove surface attachments on the porous plate-like substrate during the manufacturing process, and the porous plate-like substrate from which the surface attachments are removed is subjected to surface activation treatment.

[0017] More specifically, the purpose of the cleaning operation is to remove surface attachments and various contaminants that may adhere to the surface of the porous substrate during the manufacturing process, including dust, grease, oxides, organic matter, metal chips and other process residues, to ensure the cleanliness of the substrate surface to improve the effectiveness of subsequent processes.

[0018] More specifically, by removing contaminants, the inherent surface properties of the substrate are restored, and its surface energy is increased, surface activity is enhanced, and bonding with other materials (such as coatings or adhesives) is improved.

[0019] More specifically, the purpose of surface activation treatment is to enhance surface activity, activate the substrate surface by chemical or physical means, make it more reactive, promote the adhesion of subsequent coatings, plating or adhesives, and form a new active layer on the substrate surface to improve its chemical bonding ability with coatings or other materials, improve the adhesion and uniformity of subsequent materials, and enhance the durability and performance of the finished product.

[0020] More specifically, oxides and difficult-to-remove trace contamination on the metal surface are removed through methods such as anodizing to prevent the oxides or contaminants from affecting the bonding of the substrate and the new material in subsequent processes.

[0021] Specifically, in step S3 of the embodiment provided by the present invention, since the appearance of the porous plate-like substrate is plate-like and has a porous structure, when preparing a coating on the porous plate-like substrate, it is necessary to consider the plate-like appearance and porous structure of the porous plate to avoid the occurrence of problems such as uneven coating preparation and coating obstruction of pores.

[0022] More specifically, the porous plate-like substrate is subjected to morphological analysis to obtain a coating preparation plan corresponding to the porous plate-like substrate, thereby guiding the coating preparation process of the porous plate-like substrate, controlling the specific execution parameters in the subsequent preparation process, and adjusting the preparation parameters of the coating preparation according to the specific morphological details of the porous plate-like substrate, thereby ensuring perfect coating preparation.

[0023] Specifically, in step S4 of the embodiment provided by the present invention, the porous plate-like substrate is placed in an active electroplating solution environment according to the coating preparation scheme, and the porous plate-like substrate is electroplated to generate an electroplating coating on the surface of the porous plate-like substrate to complete the preparation of the insoluble anode.

[0024] More specifically, the present invention provides an embodiment in which electroplating is used to prepare a coating on a porous plate-like substrate. The coating preparation effect is closely related to the ratio of the electroplating solution and the application of the electroplating signal. Therefore, it is necessary to perform a morphology analysis based on the porous plate-like substrate in the previous step to obtain a corresponding coating preparation plan, and to proportion the electroplating solution environment according to the coating preparation plan, and to perform electroplating on the porous plate-like substrate.

[0025] More specifically, the electroplating treatment method is to intermittently apply an electroplating pulse signal to the porous plate-like substrate. That is to say, in this process, the electroplating preparation process is implemented in stages, so the porous plate-like substrate can be monitored in real time, thereby ensuring the effect accuracy of the coating preparation of the porous plate-like substrate.

[0026] The present invention provides a method for preparing an insoluble anode, which has the following beneficial effects: The present invention analyzes the morphology of a porous plate-like substrate to formulate a corresponding electroplating scheme, thereby preparing an insoluble coating according to the electroplating scheme, and the electroplating process can be carried out in stages. The effects of the stage-by-stage electroplating treatment are observed and analyzed to make timely corrections in subsequent stages to ensure the yield of electrode preparation. Accurate morphology analysis and electroplating schemes are used to ensure uniform coating coverage and improve the electrochemical properties of the anode. Cleaning and surface activation treatments are used to improve coating adhesion and reduce coating peeling. The integrity of the porous structure is maintained during the electroplating process, and the durability and stability of the anode are improved, thereby solving the problem of pore clogging that is prone to occur when preparing plate-like electrodes with porous structures in the prior art.

[0027] Preferably, the step of cleaning the porous plate-like substrate to remove surface attachments on the porous plate-like substrate during the manufacturing process comprises: S21: performing a surface spraying treatment on the porous plate-like substrate by using an air spray gun to remove dust and large particles attached on the surface of the porous plate-like substrate; S22: immersing the porous plate-like substrate in an organic solvent environment, and ultrasonically cleaning the porous plate-like substrate in the organic solvent environment by an ultrasonic cleaner to remove organic pollutants on the surface of the porous plate-like substrate; S23: transferring the porous plate-like substrate out of the organic solvent environment, and repeatedly washing the porous plate-like substrate with deionized water to remove the organic solvent remaining on the surface of the porous plate-like substrate; S24: immersing the porous plate-like substrate in a dilute acid solution environment, and ultrasonically cleaning the porous plate-like substrate in the dilute acid solution environment by an ultrasonic cleaner to remove metal oxides and inorganic pollutants on the surface of the porous plate-like substrate; S25: transferring the porous plate-like substrate out of the dilute acid solvent environment, and repeatedly washing the porous plate-like substrate with deionized water to remove the dilute acid solvent remaining on the surface of the porous plate-like substrate; S26: immersing the porous plate-like substrate in a dilute alkaline solution environment, and ultrasonically cleaning the porous plate-like substrate in the dilute alkaline solution environment by an ultrasonic cleaner to remove organic residues and grease on the surface of the porous plate-like substrate; S27: transferring the porous plate-like substrate out of the dilute alkali solvent environment, and repeatedly washing the porous plate-like substrate with deionized water to remove the dilute alkali solvent remaining on the surface of the porous plate-like substrate; S28: performing nitrogen spraying treatment on the porous plate-like substrate through an air spray gun to keep the porous plate-like substrate in a dry state.

[0028] Specifically, an air spray gun is used to perform surface spraying treatment on the porous plate-like substrate to remove dust and large particles attached to the surface. During spraying, it is necessary to ensure that the spray pressure is moderate to avoid damaging the substrate surface.

[0029] More specifically, the porous plate-like substrate is immersed in a suitable organic solvent (such as acetone or isopropanol) to dissolve and remove organic pollutants on the surface of the substrate, and an ultrasonic cleaner is used to ultrasonically clean the substrate immersed in the organic solvent to enhance the removal effect of the organic pollutants.

[0030] More specifically, the substrate is taken out from the organic solvent and repeatedly rinsed with deionized water to remove the organic solvent remaining on the surface of the substrate.

[0031] More specifically, the substrate is immersed in a dilute acid solution (such as dilute hydrochloric acid or nitric acid) to remove metal oxides and inorganic pollutants on the surface of the substrate, and an ultrasonic cleaner is used to ultrasonically clean the substrate immersed in the dilute acid solution to improve the cleaning effect and ensure that the inorganic pollutants are completely removed.

[0032] More specifically, the substrate is taken out from the dilute acid solution and repeatedly rinsed with deionized water to remove the dilute acid solution remaining on the surface of the substrate.

[0033] More specifically, the substrate is immersed in a dilute alkaline solution (such as a dilute sodium hydroxide solution) to remove organic residues and grease on the surface of the substrate, and an ultrasonic cleaner is used to ultrasonically clean the substrate immersed in the dilute alkaline solution to enhance the removal effect of grease and organic residues.

[0034] More specifically, the substrate is taken out from the dilute alkali solution and repeatedly rinsed with deionized water to remove the dilute alkali solution remaining on the surface of the substrate.

[0035] More specifically, an air spray gun is used to perform nitrogen spray treatment on the substrate to dry the substrate surface to ensure that it is in a dry state, and the nitrogen flow rate is controlled to avoid re-contamination of the substrate surface.

[0036] It is understandable that through a multi-step cleaning process, dust, particles, organic pollutants, metal oxides, inorganic pollutants, grease, etc. on the surface of the substrate are fully removed to ensure the cleanliness of the substrate surface and improve the adhesion and uniformity of the electroplated coating. Combined with ultrasonic cleaning, the cleaning efficiency and effect are significantly improved, especially for tiny particles and stubborn pollutants, which are thoroughly cleaned to avoid the influence of residual pollutants on the subsequent electroplating process. The clean substrate surface improves the adhesion of the coating, reduces the risk of coating peeling and blistering, ensures that the coating is firm, improves the durability and reliability of the product, and the thorough removal of surface pollutants makes the coating more uniform and reduces coating defects.

[0037] Preferably, the step of performing surface activation treatment on the porous plate-like substrate from which surface attachments have been removed comprises: S29: immersing the porous plate-shaped substrate in an electrolyte environment; S210: connecting the porous plate-like substrate to an anode, and performing an anodic treatment on the porous plate-like substrate in an electrolyte environment through the anode to generate an active layer on the surface of the porous plate-like substrate; S211: transferring the porous plate-like substrate out of the electrolyte environment, and washing the porous plate-like substrate with deionized water to remove the electrolyte remaining on the surface of the porous plate-like substrate.

[0038] Specifically, the porous plate-shaped substrate is immersed in a suitable electrolyte environment to ensure that the substrate surface is in full contact with the electrolyte, so as to prepare for the subsequent anode treatment.

[0039] More specifically, a porous plate-like substrate is connected to an anode to establish an electrical circuit, causing an anode reaction to occur on the substrate surface.

[0040] More specifically, a porous plate-like substrate in an electrolyte is anodized by an anode to generate an active layer on the surface of the substrate. During the treatment process, the current density and treatment time need to be controlled to ensure that the generated active layer is uniform and stable.

[0041] More specifically, the porous plate-shaped substrate is taken out from the electrolyte and repeatedly rinsed with deionized water to remove the residual electrolyte on the surface of the substrate to prevent the residue from affecting subsequent processes.

[0042] It can be understood that through anodizing, a uniform and highly active oxide or other active material layer is formed on the surface of the substrate. The active layer improves the chemical reaction activity of the substrate surface, which is beneficial to the subsequent electroplating process. The active layer modifies the substrate surface, enhances the affinity and adhesion of the substrate surface, and the modified substrate surface can better combine with the electroplating layer, thereby improving the adhesion and uniformity of the electroplating layer. The generated active layer significantly improves the adhesion between the electroplating layer and the substrate, reduces the risk of peeling and blistering of the electroplating layer, makes the electroplating layer more firm, and extends the service life of the product.

[0043] Preferably, the step of performing morphological analysis on the porous plate-like substrate to obtain a coating preparation scheme corresponding to the porous plate-like substrate comprises: S31: acquiring substrate specification information of the porous plate-like substrate, and constructing a substrate digital model for performing digital feedback on the porous plate-like substrate according to the substrate specification information of the porous plate-like substrate; S32: Acquire pore size information and pore density information of the porous structure of the porous plate-like substrate, and construct a pore digital model for digital feedback of the porous structure based on the substrate digital model according to the pore size information and pore density information of the porous structure of the porous plate-like substrate; S33: using the substrate digital model and the pore digital model together as an electroplating test model; S34: performing electroplating operation effect simulation processing according to the electroplating test model to obtain an electroplating test characteristic distribution of the electroplating test model; wherein the electroplating test characteristic distribution is used to describe the electroplating effect characteristics of the electroplating test model when corresponding to different electroplating operation parameters, and the electroplating operation parameters are used to describe the specific composition parameters of the electroplating solution environment and the specific execution parameters of the electroplating process; S35: Analyze the electroplating test characteristic distribution to determine the best electroplating effect characteristic in the electroplating test characteristic distribution, and use the electroplating operation parameters corresponding to the best electroplating effect characteristic as the coating preparation plan.

[0044] Specifically, the substrate specification information of the porous plate-like substrate, including size, thickness, material, etc., is collected to provide accurate basic data for subsequent modeling. Based on the collected substrate specification information, a digital model of the substrate is constructed using digital modeling tools for subsequent digital feedback and electroplating simulation.

[0045] More specifically, the pore specification information and pore density information of the porous plate-like substrate are collected, including the size, shape, distribution, density, etc. of the pores, to provide data support for accurate simulation of the pore structure. Based on the pore specification and density information, a digital model of the pore structure is constructed on the basis of the digital model of the substrate to simulate the impact of the pores on the electroplating process and provide more precise analysis.

[0046] More specifically, the substrate digital model and the pore digital model are combined to form a complete electroplating test model, which is used to simulate the influence of various parameters in the electroplating operation on the electroplating effect. Based on the electroplating test model, simulation software is used to simulate the electroplating operation effect, and the influence of different electroplating operation parameters (such as electroplating solution composition, current density, electroplating time, etc.) on the electroplating effect is predicted, so as to obtain the electroplating test characteristic distribution and describe the electroplating effect characteristics of the electroplating test model under different operating parameters.

[0047] More specifically, the distribution of electroplating test characteristics obtained by simulation is analyzed to find the electroplating effect characteristics under different operating parameters. Through analysis, the operating parameter combination with the best electroplating effect is found. The operating parameters corresponding to the best electroplating effect characteristics obtained by analysis are used as the final coating preparation plan to provide guidance for the actual electroplating process and ensure the quality and consistency of the coating.

[0048] It can be understood that by constructing precise digital models of the substrate and the pores, the microscopic features of the electroplating process can be simulated, which improves the accuracy of the simulation and makes the predicted electroplating effect closer to the actual situation. The electroplating test model can fully simulate the influence of different electroplating operating parameters on the electroplating effect, help optimize the electroplating process, and reduce the cost and time of actual experiments. By analyzing the distribution of electroplating test characteristics, the best combination of electroplating operating parameters can be determined, providing the optimal coating preparation solution to ensure the uniformity, adhesion and durability of the electroplated layer. Based on the results of the simulation analysis, the electroplating process can be optimized, the number of experiments can be reduced, and production efficiency can be improved.

[0049] Preferably, the step of simulating the electroplating operation effect according to the electroplating test model to obtain the electroplating test characteristic distribution of the electroplating test model includes: S341: Retrieving a number of preset electroplating operation parameters and electroplating simulation operation rules corresponding to the electroplating test model from a database; S342: Based on the electroplating simulation operation rule, sequentially adopting a plurality of the preset electroplating operation parameters to perform electroplating effect simulation processing on the electroplating test model to obtain the electroplating effect characteristics corresponding to the plurality of the preset electroplating operation parameters; S343: performing effect characteristic analysis processing according to the electroplating effect characteristics corresponding to the plurality of preset electroplating operation parameters to obtain effect characteristic evaluation parameters of each of the electroplating effect characteristics; S344: generating a plurality of electroplating operation parameter intervals based on the respective preset electroplating operation parameters, and performing interval optimization possibility analysis on the plurality of electroplating operation parameter intervals according to the effect characteristic evaluation parameters of the respective electroplating effect characteristics, so as to obtain an interval optimization index of each electroplating operation parameter interval; S345: performing a detailed selection process of the electroplating operation parameters based on the electroplating operation parameter interval with the best interval optimization index, so as to select a number of optimized electroplating operation parameters in the electroplating operation parameter interval, and sequentially using a number of the optimized electroplating operation parameters to perform electroplating effect simulation process on the electroplating test based on the electroplating simulation operation specification, so as to obtain the electroplating effect characteristics corresponding to the number of the optimized electroplating operation parameters; S346: The optimized electroplating operation parameters are generated cyclically according to the above steps until the electroplating effect characteristics corresponding to the optimized electroplating operation parameters meet the preset standards, and the electroplating effect characteristics corresponding to several preset electroplating operation parameters and several optimized electroplating operation parameters are used together as the electroplating test characteristic distribution.

[0050] Specifically, several preset electroplating operation parameters and electroplating simulation operation rules of the corresponding electroplating test model are retrieved from the database to provide basic data and operation rules for subsequent simulation processing; based on the electroplating simulation operation rules, several preset electroplating operation parameters are used in turn to simulate the electroplating test model to obtain the electroplating effect characteristics corresponding to the several preset electroplating operation parameters.

[0051] More specifically, the electroplating effect characteristics corresponding to a number of preset electroplating operation parameters are analyzed and processed to obtain effect characteristic evaluation parameters of each electroplating effect characteristic for subsequent optimization analysis.

[0052] More specifically, a number of electroplating operation parameter intervals are generated based on the divisions of each preset electroplating operation parameter, so as to facilitate system optimization analysis of different parameter combinations, and according to the effect characteristic evaluation parameters of each electroplating effect characteristic, the possibility of interval optimization is analyzed and processed for a number of electroplating operation parameter intervals, so as to obtain the interval optimization index of each electroplating operation parameter interval.

[0053] More specifically, based on the electroplating operation parameter interval with the optimal interval optimization index, the electroplating operation parameters are refined and selected, and several optimized electroplating operation parameters are selected in the parameter interval. Based on the electroplating simulation operation specifications, the electroplating test model is simulated using several optimized electroplating operation parameters in turn to obtain the electroplating effect characteristics corresponding to the several optimized electroplating operation parameters.

[0054] More specifically, the optimized electroplating operation parameters are generated cyclically according to the above steps, and the electroplating effect characteristics corresponding to a plurality of preset electroplating operation parameters and a plurality of optimized electroplating operation parameters are used together as the electroplating test characteristic distribution.

[0055] It can be understood that by calling preset parameters and precise simulation operation rules to ensure the high precision of the simulation process, it is possible to more accurately predict the electroplating effect, provide reliable data for optimization, and systematically analyze the electroplating effect characteristics under different parameter combinations to obtain comprehensive effect characteristic evaluation parameters, providing comprehensive data support for optimization analysis. By dividing parameter intervals and performing interval optimization analysis, it is possible to systematically optimize electroplating operation parameters, reduce blind experiments, improve optimization efficiency, refine selected parameters within the optimal interval, ensure that the selected optimization parameter combination has the best effect, and further improve the quality and consistency of the electroplating layer.

[0056] Preferably, according to the coating preparation scheme, the porous plate-like substrate is placed in an active electroplating solution environment, and the porous plate-like substrate is electroplated to generate an electroplated coating on the surface of the porous plate-like substrate to complete the step of preparing the insoluble anode, which includes: S41: analyzing the coating preparation scheme to obtain an electroplating environment preparation scheme and an electroplating treatment execution scheme in the coating preparation scheme; S42: preparing an electroplating solution environment according to the electroplating environment preparation plan, and placing the electroplating solution environment in a corresponding active state through a liquid circulation device; S43: placing the porous plate-shaped substrate in the active electroplating solution environment; S44: dividing the electroplating process execution plan into several execution stages; S45: performing electroplating treatment on the porous plate-like substrate in sequence according to the several execution stages of the electroplating treatment execution scheme, performing characteristic observation treatment on the surface coating of the porous plate-like substrate between the electroplating treatments corresponding to the various execution stages to obtain electroplating effect observation characteristics of the porous plate-like substrate after the electroplating treatments corresponding to the execution stages, performing execution effect analysis treatment on the electroplating effect observation characteristics to obtain execution reference characteristics, and performing stage correction on the subsequent execution stages according to the execution reference characteristics to generate an electroplating coating on the surface of the porous plate-like substrate through the electroplating treatments of the several execution stages to complete the preparation of the insoluble anode.

[0057] Specifically, the coating preparation plan is analyzed to determine the electroplating environment preparation plan and the electroplating treatment execution plan, clarify the key parameters such as chemical composition, temperature, pH value required for electroplating, and develop a detailed operating procedure.

[0058] More specifically, according to the requirements of the electroplating environment preparation plan, the electroplating solution is prepared to ensure that the chemical composition and concentration of the solution meet the standards, so as to obtain a solution that meets the electroplating requirements. The electroplating solution is maintained in a dynamic state through a liquid circulation device to ensure uniform ion distribution, avoid solution inhomogeneity under static conditions, and ensure the uniformity and quality of the electroplating layer.

[0059] More specifically, the porous plate-like substrate is placed in an active electroplating solution to be completely immersed, ensuring that all surfaces of the substrate are exposed to the electroplating solution, and is ready for electroplating. The electroplating treatment execution plan is divided into several execution stages, each stage has specific electroplating time, temperature, applied current and other parameters, and the electroplating process is finely controlled to ensure that the expected electroplating effect is achieved in each stage. According to the electroplating treatment execution plan, the porous plate-like substrate is electroplated in sequence. Each stage is operated according to the set conditions to gradually form the desired electroplating coating on the surface of the substrate.

[0060] More specifically, after each execution stage, the surface coating of the substrate is observed for characteristics, including inspection of indicators such as surface uniformity, thickness and adhesion, the electroplating effect of each stage is monitored to ensure that it meets the expected standards, the observation characteristics of the electroplating effect of each stage are analyzed, the electroplating quality and consistency are evaluated, and it is determined whether the electroplating parameters need to be adjusted to optimize the electroplating effect in subsequent stages.

[0061] More specifically, based on the analysis results, necessary parameter adjustments are made to the subsequent electroplating stages, such as current density, time or solution composition, to optimize the electroplating process and ensure the performance and quality of the final electroplated coating.

[0062] It can be understood that through precise electroplating environment control and staged monitoring, the coating can evenly cover the surface of the porous plate-like substrate, improving the uniformity and adhesion of the coating. The staged electroplating treatment and real-time observation allow precise control of the coating thickness to meet the requirements of specific applications. By analyzing the electroplating effect at each stage, the process parameters can be adjusted in time to optimize the electroplating process and improve production efficiency. Through detailed analysis and correction, the quality consistency of each batch of products is guaranteed and the defective rate is reduced.

[0063] Preferably, the step of performing a characteristic observation process on the surface coating of the porous plate-like substrate between the electroplating processes corresponding to the execution stages to obtain the observation characteristics of the electroplating effect of the porous plate-like substrate after the electroplating processes corresponding to the execution stages comprises: S451: performing characteristic observation processing of the surface coating of the porous plate-like substrate by using a plurality of high-precision cameras to obtain the coating degree and distribution uniformity of the surface coating of the porous plate-like substrate, and the pore retention degree of the porous structure of the porous plate-like substrate; S452: The coating degree and distribution uniformity of the surface of the porous plate-like substrate and the porosity retention of the porous structure of the porous plate-like substrate are taken as observation characteristics of the electroplating effect of the porous plate-like substrate after the electroplating treatment corresponding to the execution stage.

[0064] Specifically, several high-precision cameras are installed near the electroplating solution tank to ensure that the cameras can cover the entire surface of the porous plate-like substrate and to ensure that the cameras can clearly capture all details of the substrate surface for comprehensive observation and analysis.

[0065] More specifically, according to the electroplating treatment execution plan, the porous plate-like substrate is electroplated in stages, the electroplating is suspended after each stage, the substrate is taken out for surface observation, and a coating is gradually formed on the surface of the substrate, while necessary observations and adjustments are made at each stage.

[0066] More specifically, a high-precision camera is used to photograph the surface of the porous plate-like substrate after electroplating, and detailed images of the surface coating are captured to obtain high-resolution images for subsequent analysis. Image processing software is used to analyze the captured images, and the degree of coverage and distribution uniformity of the surface coating of the porous plate-like substrate are evaluated. The uniformity and thickness of the coating are determined, and the electroplating effect is evaluated. Image analysis software is used to measure the pore retention of the porous plate-like substrate to ensure that the pore structure is not blocked or damaged during the electroplating process, to ensure the integrity of the porous structure, and to ensure that its functionality is not affected.

[0067] More specifically, the surface coating coverage, distribution uniformity and porosity retention data of each stage are recorded to form a detailed electroplating effect data set for subsequent analysis and reference. The recorded data are comprehensively analyzed to evaluate the electroplating effect of each stage and determine whether the electroplating parameters need to be adjusted to optimize the electroplating treatment in subsequent stages. Based on the results of the comprehensive evaluation, necessary corrections and optimizations are made to the subsequent electroplating treatment execution plan to ensure the quality and consistency of the final coating and achieve the expected electroplating effect.

[0068] It can be understood that through real-time monitoring and image analysis by high-precision cameras, the uniformity and thickness of the coating can be accurately controlled, the coating quality can be improved, and the pore retention analysis can ensure that the porous structure is not damaged during the electroplating process to ensure its functionality. Real-time surface observation and analysis allows the electroplating process to be finely controlled and optimized to improve production efficiency. Through detailed data analysis of each stage, the electroplating parameters can be adjusted in time to ensure the best effect at each stage.

[0069] Preferably, the step of analyzing and processing the execution effect of the electroplating effect observation feature to obtain an execution reference feature for performing stage correction on the subsequent execution stage includes: S453: acquiring theoretical effect characteristics of the execution stage according to the stage step sequence of the execution stage in the electroplating process execution scheme; S454: performing feature deviation analysis on the electroplating effect observation feature and the theoretical effect feature to obtain an effect deviation feature; S455: Analyze and process the effect deviation feature based on several influencing factors corresponding to the execution stage preset in the database to obtain factor weights of the several influencing factors corresponding to the effect deviation feature; wherein the factor weights are used to describe the possibility degree that the influencing factors lead to the effect deviation feature; S456: Taking the factor weights of several influencing factors together as the execution reference feature.

[0070] Specifically, according to the sequence of phase steps in the electroplating process execution plan, the theoretical effect characteristics of each execution stage are obtained. These characteristics usually include the expected coating thickness, uniformity, pore integrity, etc., to establish an ideal benchmark for comparison with actual observed results.

[0071] More specifically, the actual observed characteristics of the electroplating effect are compared with the theoretical effect characteristics to find out the differences between the two and determine which aspects of the electroplating effect do not meet expectations, so as to conduct a more in-depth analysis and calculate the deviation of each feature, including thickness deviation, uniformity deviation, pore retention deviation, etc., to quantify the difference between the observed effect and the theoretical effect, and provide a data basis for subsequent analysis.

[0072] More specifically, extract several influencing factors related to each execution stage from the database, which may include current density, temperature change, solution composition, etc., identify potential influencing factors, help explain the cause of deviation, analyze the effect deviation characteristics based on known influencing factors, identify the main factors that may cause deviation, find out the potential cause of each deviation, assist in optimizing the electroplating process, and calculate the factor weight for each influencing factor, that is, the contribution of each factor to the effect deviation. Use statistical analysis, regression analysis or machine learning models to evaluate factor weights, quantify the role of influencing factors, and identify which factors have the greatest impact on deviations.

[0073] More specifically, the factor weights of all influencing factors are combined to generate an overall execution reference feature, which provides a reference basis for the subsequent electroplating execution stage and helps adjust the process parameters. According to the execution reference feature, the electroplating treatment execution plan is corrected in stages, and the process parameters are adjusted to optimize the electroplating effect. Through continuous feedback and adjustment, the consistency and quality of the electroplating effect are improved.

[0074] It is understandable that through deviation analysis, the specific reasons that lead to deviations in electroplating effects can be accurately identified, which helps to quickly locate problems. Data-based analysis makes the problem identification process more scientific and systematic. By analyzing influencing factors and adjusting process parameters, fluctuations in the electroplating process can be effectively reduced, and product consistency and quality can be improved. After identifying the influencing factors, preventive measures can be taken in advance to reduce potential risks.

[0075] In a second aspect, the present invention provides an insoluble anode prepared by the insoluble anode preparation method described in any one of the first aspects.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preparing an insoluble anode, characterized in that: include: The substrate of the insoluble anode is manufactured to obtain a porous plate-shaped substrate with a porous structure; Performing a cleaning operation on the porous plate-like substrate to remove surface attachments on the porous plate-like substrate during the manufacturing process, and performing a surface activation treatment on the porous plate-like substrate from which the surface attachments have been removed; Performing morphological analysis on the porous plate-like substrate to obtain a coating preparation scheme corresponding to the porous plate-like substrate; According to the coating preparation scheme, the porous plate-like substrate is placed in an active electroplating solution environment, and the porous plate-like substrate is electroplated to generate an electroplated coating on the surface of the porous plate-like substrate to complete the preparation of the insoluble anode.

2. The method for preparing an insoluble anode according to claim 1, characterized in that: The step of cleaning the porous plate-like substrate to remove surface attachments on the porous plate-like substrate during the manufacturing process comprises: Performing surface spraying treatment on the porous plate-like substrate by using an air spray gun to remove dust and large particles attached on the surface of the porous plate-like substrate; Immersing the porous plate-like substrate in an organic solvent environment, and ultrasonically cleaning the porous plate-like substrate in the organic solvent environment by an ultrasonic cleaner to remove organic pollutants on the surface of the porous plate-like substrate; Transferring the porous plate-like substrate out of the organic solvent environment, and repeatedly rinsing the porous plate-like substrate with deionized water to remove the organic solvent remaining on the surface of the porous plate-like substrate; The porous plate-like substrate is immersed in a dilute acid solution environment, and the porous plate-like substrate in the dilute acid solution environment is ultrasonically cleaned by an ultrasonic cleaner to remove metal oxides and inorganic pollutants on the surface of the porous plate-like substrate; Transferring the porous plate-like substrate out of the dilute acid solvent environment, and repeatedly rinsing the porous plate-like substrate with deionized water to remove the dilute acid solvent remaining on the surface of the porous plate-like substrate; The porous plate-like substrate is immersed in a dilute alkaline solution environment, and the porous plate-like substrate in the dilute alkaline solution environment is ultrasonically cleaned by an ultrasonic cleaner to remove organic residues and grease on the surface of the porous plate-like substrate; Transferring the porous plate-like substrate out of the dilute alkali solvent environment, and repeatedly rinsing the porous plate-like substrate with deionized water to remove the dilute alkali solvent remaining on the surface of the porous plate-like substrate; The porous plate-like substrate is subjected to nitrogen spraying treatment by an air spray gun to keep the porous plate-like substrate in a dry state.

3. The method for preparing an insoluble anode according to claim 1, characterized in that: The step of performing surface activation treatment on the porous plate-like substrate from which surface attachments have been removed comprises: Immersing the porous plate-like substrate in an electrolyte environment; Connecting the porous plate-like substrate to an anode, and performing an anodic treatment on the porous plate-like substrate in an electrolyte environment through the anode to generate an active layer on the surface of the porous plate-like substrate; The porous plate-like substrate is transferred out of the electrolyte environment, and the porous plate-like substrate is rinsed with deionized water to remove the electrolyte remaining on the surface of the porous plate-like substrate.

4. The method for preparing an insoluble anode according to claim 1, characterized in that: The step of performing morphological analysis on the porous plate-like substrate to obtain a coating preparation scheme corresponding to the porous plate-like substrate comprises: Acquiring substrate specification information of the porous plate-like substrate, and constructing a substrate digital model for performing digital feedback on the porous plate-like substrate according to the substrate specification information of the porous plate-like substrate; Acquiring pore size information and pore density information of the porous structure of the porous plate-like substrate, and constructing a pore digital model for digital feedback of the porous structure based on the substrate digital model according to the pore size information and pore density information of the porous structure of the porous plate-like substrate; Using the substrate digital model and the pore digital model together as an electroplating test model; Performing electroplating operation effect simulation processing according to the electroplating test model to obtain an electroplating test characteristic distribution of the electroplating test model; wherein the electroplating test characteristic distribution is used to describe the electroplating effect characteristics of the electroplating test model when corresponding to different electroplating operation parameters, and the electroplating operation parameters are used to describe the specific composition parameters of the electroplating solution environment and the specific execution parameters of the electroplating process; The electroplating test characteristic distribution is analyzed to determine the best electroplating effect characteristic in the electroplating test characteristic distribution, and the electroplating operation parameters corresponding to the best electroplating effect characteristic are used as the coating preparation plan.

5. The method for preparing an insoluble anode according to claim 4, characterized in that: The step of simulating the electroplating operation effect according to the electroplating test model to obtain the electroplating test characteristic distribution of the electroplating test model includes: Retrieving a number of preset electroplating operation parameters and electroplating simulation operation rules corresponding to the electroplating test model from a database; Based on the electroplating simulation operation rule, sequentially using a plurality of the preset electroplating operation parameters to perform electroplating effect simulation processing on the electroplating test model to obtain the electroplating effect characteristics corresponding to the plurality of the preset electroplating operation parameters; Performing effect characteristic analysis processing according to the electroplating effect characteristics corresponding to the plurality of preset electroplating operation parameters to obtain effect characteristic evaluation parameters of each of the electroplating effect characteristics; Based on the division of each of the preset electroplating operation parameters, a plurality of electroplating operation parameter intervals are generated, and according to the effect characteristic evaluation parameters of each of the electroplating effect characteristics, the plurality of electroplating operation parameter intervals are analyzed and processed for interval optimization possibilities, so as to obtain an interval optimization index of each of the electroplating operation parameter intervals; Based on the electroplating operation parameter interval with the best interval optimization index, a detailed selection process of the electroplating operation parameters is performed to select a number of optimized electroplating operation parameters in the electroplating operation parameter interval, and based on the electroplating simulation operation specification, a number of the optimized electroplating operation parameters are sequentially used to perform electroplating effect simulation processing on the electroplating test to obtain the electroplating effect characteristics corresponding to the number of the optimized electroplating operation parameters; The optimized electroplating operation parameters are generated cyclically according to the above steps until the electroplating effect characteristics corresponding to the optimized electroplating operation parameters meet the preset standards, and the electroplating effect characteristics corresponding to several of the preset electroplating operation parameters and several of the optimized electroplating operation parameters are used together as the electroplating test characteristic distribution.

6. The method for preparing an insoluble anode according to claim 1, characterized in that: The steps of placing the porous plate-like substrate in an active electroplating solution environment according to the coating preparation scheme and electroplating the porous plate-like substrate to generate an electroplated coating on the surface of the porous plate-like substrate to complete the preparation of the insoluble anode include: Analyzing the coating preparation scheme to obtain an electroplating environment preparation scheme and an electroplating treatment execution scheme in the coating preparation scheme; Prepare an electroplating solution environment according to the electroplating environment preparation plan, and put the electroplating solution environment into a corresponding active state through a liquid circulation device; placing the porous plate-like substrate in an active electroplating solution environment; Dividing the electroplating treatment execution plan into several execution stages; The porous plate-like substrate is electroplated in sequence according to the several execution stages of the electroplating execution scheme, and the surface coating of the porous plate-like substrate is observed between the electroplating treatments corresponding to the various execution stages to obtain the electroplating effect observation characteristics of the porous plate-like substrate after the electroplating treatments corresponding to the execution stages, and the electroplating effect observation characteristics are analyzed and processed to obtain the execution reference characteristics, and the subsequent execution stages are corrected according to the execution reference characteristics to generate an electroplating coating on the surface of the porous plate-like substrate through the electroplating treatments of the several execution stages to complete the preparation of the insoluble anode.

7. The method for preparing an insoluble anode according to claim 6, characterized in that: The step of performing a characteristic observation process on the surface coating of the porous plate-like substrate between the electroplating processes corresponding to the execution stages to obtain the observation characteristics of the electroplating effect of the porous plate-like substrate after the electroplating processes corresponding to the execution stages comprises: Observing the characteristics of the surface coating of the porous plate-like substrate by using a plurality of high-precision cameras to obtain the coating degree and distribution uniformity of the surface coating of the porous plate-like substrate and the pore retention degree of the porous structure of the porous plate-like substrate; The coating degree and distribution uniformity of the surface of the porous plate-like substrate and the pore retention of the porous structure of the porous plate-like substrate are taken together as observation characteristics of the electroplating effect of the porous plate-like substrate after the electroplating treatment corresponding to the execution stage.

8. The method for preparing an insoluble anode according to claim 6, characterized in that: The step of analyzing and processing the execution effect of the electroplating effect observation feature to obtain an execution reference feature for stage correction of the subsequent execution stage includes: According to the sequence of the stages of the execution stage in the electroplating process execution scheme, obtaining the theoretical effect characteristics of the execution stage; Performing feature deviation analysis on the electroplating effect observation feature and the theoretical effect feature to obtain an effect deviation feature; The effect deviation feature is analyzed and processed based on several influencing factors corresponding to the execution stage preset in the database to obtain factor weights of several influencing factors corresponding to the effect deviation feature; wherein the factor weight is used to describe the possibility degree that the influencing factor causes the effect deviation feature; The factor weights of several influencing factors are collectively used as the execution reference feature.

9. An insoluble anode, characterized in that The insoluble anode is prepared by the method for preparing the insoluble anode according to any one of claims 1 to 8.