A vapor chamber and a processing method thereof

Abstract

The present application relates to the technical field of heat plate, and particularly relates to a heat plate and a processing method thereof, the heat plate comprising a plate body with a first cavity arranged inside, and a surface of the plate body in the thickness direction is provided with an opening hole communicated with the first cavity, and the heat plate further comprises a miscellaneous removal and lead-out universal assembly; the miscellaneous removal and lead-out universal assembly comprises a connecting shaft and a sealing piece, the sealing piece is arranged at one end of the connecting shaft and is in sealing abutment with the surface of the plate body provided with the opening hole, at least part of the connecting shaft penetrates through the opening hole and extends into the first cavity, and a lead-out channel communicated with the first cavity is arranged in the connecting shaft. The present application optimizes the internal structure of the heat plate, adopts the miscellaneous removal and lead-out universal assembly, and realizes a more simple and efficient processing flow.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat plate, in particular to a heat plate and a processing method thereof. BACKGROUND

[0002] In the prior art, the water injection structure usually needs to punch out a water injection port feature on the heat plate, then use tools or mechanical devices to insert a copper pipe into the water injection port, and point UV glue at the connection between the copper pipe and the water injection port for curing, so as to avoid loosening or liquid leakage at the connection between the copper pipe and the water injection port. Connect the liquid injection equipment to the water injection port, and slowly inject the working liquid into the VC heat plate. After the liquid injection is completed, multiple impurity removal treatments are performed. After the impurity removal treatment is completed, the excess part of the copper pipe or the heat plate is removed and processed or trimmed.

[0003] However, punching out a water injection port feature on the heat plate, then inserting a copper pipe into the water injection port, and pointing UV glue at the connection for curing, this series of steps is complex and inefficient. Secondly, since the connection mode of the water injection port and the copper pipe involves multiple components and links, the structure is relatively complex, which increases the risk of liquid leakage. Once the connection is loose or the seal is not tight, the working liquid will leak, affecting the performance and service life of the heat plate. Finally, due to the complicated production steps and complex structure, precise tools and mechanical devices are needed, which increases the production cost. At the same time, the use and processing of UV glue also requires additional cost and time. SUMMARY

[0004] In view of this, the present application provides a heat plate and a processing method thereof, aiming to solve the above technical problems.

[0005] In one aspect, the present application provides a heat plate, comprising a plate body provided with a first cavity inside, and a surface of the plate body in the thickness direction is provided with an opening hole communicating with the first cavity, the heat plate further comprises:

[0006] An impurity removal guide universal assembly, the impurity removal guide universal assembly comprises a connecting shaft and a sealing piece, the sealing piece is arranged at one end of the connecting shaft and sealingly abuts against a surface of the plate body provided with the opening hole, at least part of the connecting shaft penetrates through the opening hole and extends into the first cavity, and a guide channel communicating with the first cavity is arranged in the connecting shaft.

[0007] In some embodiments of the present application, the connecting shaft is provided with a sealing position structure that enables the sealing piece to sealingly abut against a surface of the plate body.

[0008] In some embodiments of the present application, the sealing position structure comprises an end face part arranged at one end of the connecting shaft extending into the first cavity and capable of contacting the cavity wall of the first cavity of the plate body.

[0009] In some embodiments of the present application, the sealing-in-place structure comprises an annular limiting portion arranged on the connecting shaft near one end of the plate body and capable of contacting a surface of the plate body.

[0010] In some embodiments of the present application, the annular limiting portion is provided with an embedded groove towards one end face of the plate body, at least part of the sealing member is arranged in the embedded groove, and the remaining part of the sealing member protrudes from the notch of the embedded groove.

[0011] In some embodiments of the present application, one end of the connecting shaft extending into the first cavity is provided with a bypass opening for enabling the discharge channel to communicate with the first cavity.

[0012] In some embodiments of the present application, the first cavity has a sealing flow channel chamber in communication with the opening.

[0013] In some embodiments of the present application, the plate body comprises an evaporation plate and a condensation plate, and the first cavity is formed inside after the edges of the evaporation plate and the condensation plate are fixed, the opening is arranged on the condensation plate, and a sealing flow channel groove is arranged on the inner surface of the condensation plate, the sealing flow channel groove and the evaporation plate form the sealing flow channel chamber after the edges of the evaporation plate and the condensation plate are fixed.

[0014] Compared with the prior art, the present application has the beneficial effects that: by optimizing the internal structure of the heat plate, the present application adopts a universal assembly for removing impurities and discharging, and realizes a more simple and efficient processing flow. Specifically, the design of the assembly not only avoids multiple tedious steps such as stamping water injection port features, inserting copper pipes, and curing UV glue in the traditional process, but also realizes a more compact structure design by opening a hole and designing a shaft and a sealing member in a matching manner, and at the same time, the copper pipe, a consumable, is saved, and the production cost is reduced. In addition, the improved process flow is more simple and clear, the water is injected first, and then the connecting shaft with the sealing member is pressed to form a cavity seal, and there is no need for the last pipe cutting operation in the whole process, further improving the production efficiency.

[0015] Specifically, by designing the universal assembly for removing impurities and discharging, the discharge of impurities inside the heat plate can be conveniently realized, and the reliability and service life of the heat plate are improved. The sealing abutment of the sealing member and the surface of the plate body ensures the sealing of the inside of the heat plate, and prevents the leakage of the working medium. At the same time, the design of the sealing-in-place structure ensures the stable sealing between the sealing member and the plate body, and improves the sealing performance of the heat plate. In addition, by providing the bypass opening, the discharge channel and the first cavity can be smoothly communicated, and the smooth discharge of impurities is further ensured.

[0016] On the other hand, the present application also proposes a processing method of a heat plate, which comprises the following steps:

[0017] S1, fixing the plate body and injecting a set amount of water into the first cavity of the plate body through the opening;

[0018] S2, making the impurity removal guide assembly perpendicular to a surface of the plate body in the thickness direction and making the seal of the impurity removal guide assembly sealingly abut against a surface of the plate body, and making the connecting shaft of the impurity removal assembly communicate with the first cavity through the guide channel;

[0019] S3, continuously performing impurity removal treatment on the first cavity while the seal of S2 sealingly abuts against a surface of the plate body;

[0020] S4, closing the communication between the opening and the first cavity of the plate body in S3, and then removing the impurity removal guide assembly, thereby obtaining a uniform heating plate.

[0021] In some embodiments of the present application, S3 includes the following steps:

[0022] S30, connecting a gas pump to the guide channel and performing first impurity removal treatment on the first cavity in S2 by the gas pump.

[0023] S31, heating the plate body in S30, so that the excess water vapor and non-condensable gas in the first cavity are discharged from the guide channel.

[0024] It can be understood that the processing method of the uniform heating plate provided in the embodiment has the same beneficial effects as the uniform heating plate described above, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0025] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not intended to limit the scope of the application. Moreover, the same reference numerals are used throughout the drawings to designate similar or equivalent parts. In the drawings:

[0026] Figure 1 a top view of the uniform heating plate provided in the embodiment of the present application;

[0027] Figure 2 a bottom view of the uniform heating plate provided in the embodiment of the present application;

[0028] Figure 3 a top view of the uniform heating plate provided in the embodiment of the present application; Figure 2 a sectional view in the A-A direction of the uniform heating plate provided in the embodiment of the present application;

[0029] Figure 4A schematic diagram of the lower half structure of the heat plate provided by the embodiment of the present application is shown in FIG. 5. Figure 3 A schematic diagram of the lower half structure of the heat plate provided by the embodiment of the present application is shown in FIG. 5.

[0030] Figure 5 A schematic diagram of the lower half structure of the heat plate provided by the embodiment of the present application is shown in FIG. 5.

[0031] Figure 6 A schematic diagram of the lower half structure of the heat plate provided by the embodiment of the present application is shown in FIG. 5.

[0032] Figure 7 A schematic diagram of the lower half structure of the heat plate provided by the embodiment of the present application is shown in FIG. 5. Figure 6 A schematic diagram of the lower half structure of the heat plate provided by the embodiment of the present application is shown in FIG. 5.

[0033] In the figure: 1, plate body; 11, evaporation plate; 12, condensation plate; 121, opening; 122, sealing flow channel groove; 13, first cavity; 14, sealing flow channel chamber; 2, connecting shaft; 21, leading-out channel; 221, end face part; 222, annular limiting part; 23, built-in groove; 24, bypass opening; 3, sealing member. DETAILED DESCRIPTION

[0034] Exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure can be more thoroughly understood, and the scope of the present disclosure can be accurately conveyed to those skilled in the art. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0035] Referring to Figures 1-5 The present embodiment provides a heat plate, which comprises a plate body 1 internally provided with a first cavity 13, and an opening 121 is provided on one surface of the plate body 1 in the thickness direction and is in communication with the first cavity 13. The heat plate further comprises:

[0036] The miscellaneous removal leading-out universal assembly comprises a connecting shaft 2 and a sealing member 3. The sealing member 3 is arranged at one end of the connecting shaft 2 and sealingly abuts against one surface of the plate body 1 provided with the opening 121. At least part of the connecting shaft 2 penetrates through the opening 121 and extends into the first cavity 13. The connecting shaft 2 is internally provided with a leading-out channel 21 in communication with the first cavity 13.

[0037] It can be understood that, in the embodiment, by arranging the first cavity 13 inside the plate body 1 and the opening 121 communicating with the first cavity 13 on one side surface of the plate body 1, the stamping water inlet feature can be avoided, the structure of the vapor chamber is simplified, and the production efficiency is improved. The introduction of the lead-out assembly, through the cooperation of the connecting shaft 2 and the sealing element 3, the sealing element 3 is sealed and abuts against the surface of the opening 121 of the plate body 1, which ensures the isolation of the inside of the first cavity 13 from the external environment, enhances the sealing performance of the vapor chamber, and avoids problems such as cooling liquid leakage. At least part of the connecting shaft 2 penetrates the opening 121 and extends into the first cavity 13, so that the cooling liquid or working medium inside the vapor chamber can be replaced or maintained through the lead-out channel 21, thereby improving the service life and reliability of the vapor chamber.

[0038] In a specific embodiment of the present application, the connecting shaft 2 is provided with a sealing-in-place structure that enables the sealing element 3 to be in sealing abutment with a surface of the plate body 1.

[0039] It can be understood that, in the embodiment, the sealing-in-place structure can ensure that the sealing element 3 forms effective sealing contact with the surface of the plate body 1, thereby preventing liquid or gas leakage and improving the sealing performance and reliability of the vapor chamber. In addition, the sealing-in-place structure can also help maintain the sealing element 3 in the correct position, reducing the risk of sealing failure due to vibration or displacement.

[0040] Referring to Figures 5-7 In a specific embodiment of the present application, the sealing-in-place structure includes an end face portion 221 provided on an end of the connecting shaft 2 extending into the first cavity 13 and capable of contacting the cavity wall of the first cavity 13 of the plate body 1.

[0041] It can be understood that, in the embodiment, the sealing-in-place structure includes the end face portion 221 of the connecting shaft 2 extending into the first cavity 13, and the end face portion 221 contacts the cavity wall of the first cavity 13. When the end face portion 221 does not contact the cavity wall of the first cavity 13, it indicates that the connecting shaft 2 is not properly arranged. The sealing-in-place structure ensures that the connecting shaft 2 is correctly arranged in the first cavity 13, thereby avoiding possible installation errors.

[0042] In a specific embodiment of the present application, the sealing-in-place structure includes an annular limiting portion 222 provided on an end of the connecting shaft 2 close to the plate body 1 and capable of contacting a surface of the plate body 1.

[0043] It can be understood that the sealing-in-place structure in the embodiment includes the annular limiting portion 222 arranged at the end of the connecting shaft 2 close to the plate body 1. The annular limiting portion 222 functions to limit the axial movement of the connecting shaft 2 and provide additional sealing effect. The annular limiting portion 222 can ensure that the connecting shaft 2 and the plate body 1 maintain appropriate contact pressure, thereby achieving good sealing effect, and can also prevent the connecting shaft 2 from being excessively displaced when subjected to external force, ensuring the stability and accuracy of the connection.

[0044] In a specific embodiment of the present application, the annular limiting portion 222 is provided with an embedded groove 23 at the end face thereof facing the plate body 1, at least part of the sealing member 3 is arranged in the embedded groove 23, and the remaining part of the sealing member 3 protrudes from the slot of the embedded groove 23.

[0045] Specifically, the single-side cross-sectional diameter of the sealing member 3 in the embodiment is greater than the depth of the embedded groove 23, so that when the sealing member 3 is arranged in the embedded groove 23, the sealing member 3 can have a remaining part protruding from the slot of the embedded groove 23, and when the connecting shaft 2 drives the annular limiting portion 222 to press down, pressure is applied to the sealing member 3, and the first cavity 13 is then sealed by the sealing member 3.

[0046] Specifically, the sealing member 3 in the embodiment can be a sealing ring or a sealing gasket.

[0047] It can be understood that the embedded groove 23 of the annular limiting portion 222 in the embodiment is provided with the sealing member 3, and part of the sealing member 3 protrudes from the slot of the embedded groove 23. The inner diameter of the sealing member 3 is greater than the depth of the embedded groove 23, so that part of the sealing member 3 protrudes outside the groove when installed, and when the connecting shaft 2 drives the annular limiting portion 222 to press down, pressure is applied to the sealing member 3, thereby sealing the first cavity 13 by the sealing member 3, and effectively preventing liquid or gas leakage, ensuring the sealing performance of the equipment.

[0048] In a specific embodiment of the present application, the end of the connecting shaft 2 extending into the first cavity 13 is provided with a bypass opening 24 for connecting the lead-out channel 21 and the first cavity 13.

[0049] In a specific embodiment of the present application, the end of the connecting shaft 2 extending into the first cavity 13 is not in contact with the cavity wall of the first cavity 13, and the connecting shaft 2 can be connected to the first cavity 13 through the lead-out channel 21.

[0050] Specifically, in this embodiment, the communication with the first cavity 13 is achieved through the export channel 21 and / or the bypass opening 24, and then the liquid injection or impurity removal process inside the vapor chamber can be completed by connecting a water injection device or an air pump at the other end of the connecting shaft 2, thereby omitting the stamping water injection port feature, the copper pipe insertion, the glue dispensing and curing, and the pipe cutting process after all operations are completed.

[0051] It can be understood that, in this embodiment, by providing the export channel 21 and the bypass opening 24, the first cavity 13 has a channel for communication with the outside through the connecting shaft 2, thereby simplifying the liquid injection or impurity removal process inside the vapor chamber, and thus avoiding complex stamping water injection port features, copper pipe insertion, glue dispensing and curing, and pipe cutting processes. Through the export channel 21 and / or the bypass opening 24 of the connecting shaft 2, it can be conveniently connected with a water injection device or an air pump, thereby realizing liquid filling or impurity removal inside the vapor chamber and improving the convenience and efficiency of the operation.

[0052] Referring to Figures 2-5 In a specific embodiment of the present application, the first cavity 13 has a sealed flow channel chamber 14 in communication with the opening 121.

[0053] In a specific embodiment of the present application, the plate body 1 includes an evaporation plate 11 and a condensation plate 12, and the first cavity 13 is formed inside after the edges of the evaporation plate 11 and the condensation plate 12 are fixed. The opening is provided on the condensation plate 12, and the inner surface of the condensation plate 12 is provided with a sealed flow channel groove 122. When the edges of the evaporation plate 11 and the condensation plate 12 are fixed, the sealed flow channel groove 122 and the evaporation plate 11 form a sealed flow channel chamber 14.

[0054] Specifically, in this embodiment, the side of the condensation plate 12 opposite to the evaporation plate 11 is provided with a point-shaped or strip-shaped protrusion.

[0055] It can be understood that, in this embodiment, the plate body 1 includes an evaporation plate 11 and a condensation plate 12, and the first cavity 13 is formed by edge sealing and fixing. The opening is provided on the condensation plate 12, and the inner surface of the condensation plate 12 is provided with a sealed flow channel groove 122. When the edges of the evaporation plate 11 and the condensation plate 12 are fixed, the sealed flow channel groove 122 and the evaporation plate 11 form a sealed flow channel chamber 14, which is sealed after the liquid injection and impurity removal process is completed, and the impurity removal flow guide universal assembly can be removed. This structure can simplify the manufacturing process, because the formation of the sealed flow channel chamber 14 is achieved by the fixing of the edges of the plate body 1, without the need for additional complex components or steps.

[0056] In another aspect, the present application also provides a processing method of a vapor chamber, which comprises the following steps:

[0057] S1, fixing the plate body and injecting a certain amount of water into the first cavity of the plate body through the opening;

[0058] S2, the impurity removal guide-out general assembly is perpendicular to a surface of the plate body in the thickness direction, and the seal of the impurity removal guide-out general assembly is sealed against the surface of the plate body, and the connecting shaft of the impurity removal guide-out assembly is communicated with the first cavity through the guide-out channel;

[0059] S3, in the state that the seal of S2 is always sealed against the surface of the plate body, the first cavity is subjected to continuous multiple impurity removal treatments;

[0060] S4, the communication between the opening of the plate body and the first cavity in S3 is closed, and then the impurity removal guide-out general assembly is removed, that is, the uniform heating plate is obtained.

[0061] S3 includes the following steps:

[0062] S30, a gas pump is communicated with the guide-out channel, and the gas pump is used to perform the first impurity removal treatment on a plurality of first cavities in S2.

[0063] S31, the plate body in S30 is heated, and the heating causes the excess water vapor and non-condensable gas in the first cavity to be discharged from the guide-out channel.

[0064] Specifically, in the embodiment, when the plate body is fixed and a certain amount of water is injected into the first cavity of the plate body through the opening, the plate body can be sealed after the water is injected to connect the evaporation plate and the condensation plate, or the plate body can be sealed before the water is injected to connect the evaporation plate and the condensation plate, and finally the plate body is subjected to the impurity removal treatment.

[0065] It can be understood that the processing method of the uniform heating plate in the embodiment has the same beneficial effects as the above-mentioned uniform heating plate, which will not be described here.

[0066] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system or a computer program product. Therefore, the present application can be in the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can be in the form of a computer program product implemented on one or more computer usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer usable program code.

[0067] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program goods according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0068] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0069] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A vapor chamber comprising a plate body having a first cavity provided inside, and an opening provided on a surface of the plate body in a thickness direction of the plate body, the opening being in communication with the first cavity, characterized in that: The uniform heating plate further comprises: The impurity removal and discharge universal assembly comprises a connecting shaft and a sealing member, the sealing member is arranged at one end of the connecting shaft and sealingly abuts against one surface of the plate body provided with the opening, at least part of the connecting shaft penetrates through the opening and extends into the first cavity, and a discharge channel is arranged in the connecting shaft and communicates with the first cavity.

2. The vapor chamber of claim 1, wherein The connecting shaft is provided with a sealing positioning structure for enabling the sealing member to sealingly abut against one surface of the plate body.

3. The vapor chamber of claim 2, wherein, The sealing positioning structure comprises an end face portion arranged at one end of the connecting shaft extending into the first cavity and capable of contacting the cavity wall of the first cavity of the plate body.

4. The vapor chamber of claim 2, wherein, The sealing positioning structure comprises an annular limiting portion arranged at one end of the connecting shaft close to the plate body and capable of contacting one surface of the plate body.

5. The vapor chamber of claim 4, wherein, The annular limiting portion is provided with an embedded groove towards one end face of the plate body, at least part of the sealing member is arranged in the embedded groove, and the remaining part of the sealing member protrudes from the groove of the embedded groove.

6. The vapor chamber of claim 2 or 3 or 4 or 5, wherein, One end of the connecting shaft extending into the first cavity is provided with a bypass opening for enabling the discharge channel to communicate with the first cavity.

7. The vapor chamber of claim 1, wherein The first cavity has a sealed flow channel chamber communicating with the opening.

8. The vapor chamber of claim 7, wherein, The plate body comprises an evaporation plate and a condensation plate, the first cavity is formed inside after the edges of the evaporation plate and the condensation plate are fixed, the opening is arranged on the condensation plate, and a sealed flow channel groove is arranged on the inner surface of the condensation plate, the sealed flow channel groove and the evaporation plate form the sealed flow channel chamber after the edges of the evaporation plate and the condensation plate are fixed.

9. A method of processing the vapor chamber according to any one of claims 1 to 8, characterized by, The processing method comprises the following steps: S1, fixing the plate body and injecting a certain amount of water into the first cavity of the plate body through the opening; S2, arranging the impurity removal and discharge universal assembly perpendicular to one surface of the plate body in the thickness direction and enabling the sealing member of the impurity removal and discharge universal assembly to sealingly abut against one surface of the plate body, and enabling the connecting shaft of the impurity removal and discharge universal assembly to communicate with the first cavity through the discharge channel; S3, continuously performing multiple impurity removal treatments on the first cavity while the sealing member of S2 sealingly abuts against one surface of the plate body; S4, closing the communication between the opening and the first cavity of the plate body in S3, and then removing the impurity removal and discharge universal assembly, thereby obtaining a uniform heating plate.

10. The method of processing a vapor chamber as claimed in claim 9, wherein The S3 comprises the following steps: S30, connecting a gas pump to the discharge channel and enabling the gas pump to exhaust air outward to perform the first impurity removal treatment on the first cavity in S2; S31, heating the plate body in S30, and enabling the excess water vapor and non-condensable gas in the first cavity to be discharged from the discharge channel.

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