Pin-fin micro-channel enhanced heat exchange device under vibration effect
By introducing vibration effects into the microchannel flow boiling heat exchange device, the bubbles are disengaged from the needle rib surface and the microchannel wall surface and transferred through the escape holes, the problems of bubble retention and impurity deposition are solved, achieving more efficient heat exchange effect and better device safety.
Patent Information
- Application Number
- CN202510232822.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2025-04-15
AI Technical Summary
In the existing microchannel flow boiling heat exchange device, it is difficult for air bubbles on the wall of the needle rib microchannel to be disconnected in time, resulting in the formation of air film, increasing thermal resistance, affecting the heat exchange effect, and impurities deposit into a dirt layer, further reducing the heat exchange efficiency.
The needle rib microchannel reinforcement heat exchange device under vibration is used to drive the matrix vibration through the vibration generation component, so that the bubbles are separated from the needle rib surface and the microchannel wall surface, and transferred to the second microchannel through the escape hole to avoid bubble retention and impurity deposition.
Effectively reduce thermal resistance, strengthen heat exchange effect, prevent the formation of air film and dirt layers, improve heat exchange efficiency, and ensure the safety and reliability of the device.
Smart Images
Figure CN119826613A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of heat exchange devices, and in particular relates to a pin-fin microchannel enhanced heat exchange device under vibration. Background Art
[0002] In the existing microchannel flow boiling heat exchange device for cooling electronic devices, the pin-fin microchannel can enhance boiling heat exchange. However, during the flow boiling heat exchange process, the liquid will be heated on the wall of the pin-fin microchannel to form bubbles. Since the structure of the pin-fin microchannel is relatively complex and there are several pin-fins, bubbles or fluid retention may occur on the back of the pin-fin or in the narrow corners between adjacent pin-fins.
[0003] If these bubbles cannot leave the wall in time, they will be retained and gathered near the wall to form an air film. The thermal conductivity of the air film is very low, which will greatly increase the thermal resistance, causing the wall temperature to rise sharply, resulting in deterioration of heat transfer and serious impact on the heat exchange effect. Therefore, if the bubbles generated on the wall during flow boiling are not removed in time, it is very easy to cause the wall liquid to dry up and avoid temperature rise, which will cause partial burning or even failure of the device, threatening the safety and reliability of the device.
[0004] In addition, during the long-term flow heat transfer process, impurities or solutes in the heat transfer medium may be deposited on the wall of the pin-fin microchannel to form a dirt layer. The thermal conductivity of the dirt layer is low, which will increase the thermal resistance and reduce the heat transfer efficiency. In addition, the accumulation of dirt will reduce the effective cross-sectional area of the channel, further increasing the flow resistance. Summary of the invention
[0005] The purpose of this application is to provide a pin-fin microchannel enhanced heat exchange device under vibration to solve the above-mentioned technical problems existing in the prior art.
[0006] This application is implemented as follows: An embodiment of the present application provides a pin-fin microchannel enhanced heat exchange device under vibration, comprising a substrate and a vibration generating component; a first microchannel and a second microchannel are arranged inside the substrate, and a plurality of pin-fins are arranged inside the first microchannel; the substrate is provided with a working fluid inlet, a first working fluid outlet and a second working fluid outlet connected to the interior thereof, the working fluid inlet and the first working fluid outlet are both connected to the first microchannel, and the second working fluid outlet is connected to the second microchannel; the substrate also has a plurality of escape holes connecting the first microchannel and the second microchannel; the vibration generating component is connected to the substrate, and the vibration generating component is used to drive the substrate to vibrate.
[0007] The technical solution adopted by the present invention can achieve the following beneficial effects: In the present application, a vibration generating assembly is used to drive the base to vibrate, so that the bubbles accumulated on the pin-fin surface and the first microchannel wall during the heat exchange process can be detached in time, avoiding the formation of an air film on the pin-fin surface and the first microchannel wall, thereby reducing the thermal resistance to a certain extent and achieving the purpose of enhancing the heat exchange; and after the bubbles detach from the pin-fin or the first microchannel wall, they can be transferred to the second microchannel through the escape hole, thereby avoiding the whole steam blockage in the first microchannel, ensuring the supply of liquid heat exchange working fluid in the first microchannel, delaying the deterioration of heat transfer, and increasing the critical heat flux density, thereby enhancing the flow boiling heat exchange effect.
[0008] In the process of bubbles moving toward the escape holes, the bubbles can drive the movement of the surrounding liquid, thereby enhancing the convective heat transfer between the liquid and the pin fin surface and the first microchannel wall, and improving the heat exchange efficiency of the heat exchange device.
[0009] In addition, when the vibration generating component drives the base to vibrate, the probability of impurities in the liquid in the first microchannel being deposited on the wall of the first microchannel can be reduced, the formation of a dirt layer can be prevented, and the increase in thermal resistance of the first microchannel wall can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0011] Figure 1 The overall structure of the heat exchange device provided in some embodiments of the present application is shown in FIG. Figure 1 ; Figure 2 This is a schematic diagram of the disassembly of the heat exchange device provided in some embodiments of the present application. Figure 1 ; Figure 3 is a cross-sectional view of a heat exchange device provided in some embodiments of the present application; Figure 4 Some embodiments of the present application provide Figure 3 Detailed view of point A; Figure 5 The overall structure of the heat exchange device provided in some embodiments of the present application is shown in FIG. Figure 2 ; Figure 6 This is a schematic diagram of the disassembly of the heat exchange device provided in some embodiments of the present application. Figure 2 ; Figure 7 This is a schematic diagram of the separation of the partition and the base provided in some embodiments of the present application Figure 1 ; Figure 8 This is a schematic diagram of the separation of the partition and the base provided in some embodiments of the present application Figure 2 .
[0012] In the figure: 100-substrate, 110-first microchannel, 120-second microchannel, 130-working fluid inlet, 140-first working fluid outlet, 150-second working fluid outlet, 160-escape hole, 170-upper cover plate, 180-partition plate, 190-base, 200-needle fin, 310-vibration plate, 320-excitation power supply, 330-wire. DETAILED DESCRIPTION
[0013] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.
[0014] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.
[0015] The present application embodiment provides a pin-fin microchannel enhanced heat exchange device under vibration, referring to Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown in FIG. 1 , the heat exchange device includes a substrate 100 and a vibration generating assembly. The substrate 100 is a main component of the heat exchange device, and a first microchannel 110 and a second microchannel 120 are arranged inside the substrate 100. Figure 3 and Figure 4 As shown, a plurality of pin fins 200 are arranged in the first microchannel 110. The substrate 100 is provided with a working fluid inlet 130, a first working fluid outlet 140 and a second working fluid outlet 150 communicating with the interior thereof, wherein the working fluid inlet 130 and the first working fluid outlet 140 are both communicated with the first microchannel 110, and the second working fluid outlet 150 is communicated with the second microchannel 120.
[0016] The pin fin 200 is inside the first microchannel 110, and the first microchannel 110 serves as the main channel for boiling heat exchange. The heat exchange liquid enters the first microchannel 110 from the working medium inlet 130, exchanges heat with the surface of the pin fin 200 and the wall of the first microchannel 110, and then flows out through the first working medium outlet 140 to complete the heat exchange.
[0017] The substrate 100 also has a plurality of escape holes 160 connecting the first microchannel 110 and the second microchannel 120, and the vibration generating component is connected to the substrate 100, and the vibration generating component is used to drive the substrate 100 to vibrate. During the heat exchange process, the heat exchange liquid is heated on the surface of the pin fin 200 and the wall of the first microchannel 110 to form bubbles. Driven by the vibration generating component, the substrate 100 vibrates, so that the bubbles are separated from the surface of the pin fin 200 and the wall of the first microchannel 110, avoiding the bubbles from gathering to form an air film, which can reduce the air film thermal resistance near the wall of the first microchannel 110 to a certain extent, and achieve the purpose of strengthening heat exchange. In addition, during the process of the vibration generating component driving the substrate 100 to vibrate, the vibration of the substrate 100 can also cause the heat exchange liquid inside the first microchannel 110 to be disturbed, thereby further enhancing the heat exchange effect to a certain extent.
[0018] In addition, since the escape hole 160 is provided to connect the first microchannel 110 and the second microchannel 120, in actual use, the first microchannel 110 is located below the second microchannel 120, the first microchannel 110 serves as the main channel for boiling heat exchange, and the second microchannel 120 serves as the steam flow channel for boiling generation. The second microchannel 120 is connected to the outside through the second working medium outlet 150.
[0019] After the bubbles leave the surface of the pin fin 200 or the wall of the first microchannel 110, they will move upward, and then transfer to the second microchannel 120 through the escape hole 160. The bubbles transfer to the second microchannel 120, which can avoid steam blockage in the first microchannel 110, ensure sufficient heat exchange liquid in the first microchannel 110, delay heat transfer deterioration, increase critical heat flux density, and thus enhance the flow boiling heat transfer effect.
[0020] It should be explained that the bubbles cannot move to the second microchannel 120 alone. The transfer of bubbles to the second microchannel 120 mentioned in the embodiment of the present application actually means that when the bubbles rise and move to the escape hole 160, the bubbles rise to the surface of the heat exchange liquid corresponding to the escape hole 160, the bubbles burst, and then the gas passes through the escape hole 160 into the second microchannel 120.
[0021] The vibration generating component cooperates with the escape hole 160, which can not only make the bubbles detach from the wall of the first microchannel 110 or the needle fin 200, but also make the detached bubbles transfer to the second microchannel 120 through the escape hole 160, so as to prevent the bubbles from affecting the normal heat exchange between the heat exchange liquid in the first microchannel 110 and the needle fin 200 and the wall of the first microchannel 110. The vibration generating component cooperates with the first microchannel 110, the second microchannel 120 and the escape hole 160, which can effectively improve the boiling heat transfer coefficient, improve the critical heat flux density, and meet the heat dissipation requirements of high heat flux density.
[0022] During the process of bubble detachment, the bubbles can drive the movement of the surrounding liquid and enhance the convective heat exchange between the liquid and the wall. The generation and movement of a large number of bubbles greatly improves the heat exchange efficiency in the first microchannel 110. In addition, when the steam output in the first microchannel 110 is large, the steam can enter the second microchannel 120 through the escape hole 160 and then be discharged through the second working fluid outlet 150, which plays the role of diverting steam, maintaining the pressure in the first microchannel 110 at a suitable level, delaying the deterioration of heat transfer, and increasing the critical heat flux density, thereby enhancing the flow boiling heat exchange effect.
[0023] In addition, since the vibration generating component can drive the base 100 to vibrate, the probability of impurities in the heat exchange liquid in the first microchannel 110 being deposited on the wall of the first microchannel 110 can be reduced to a certain extent, the formation of a dirt layer can be prevented, and the increase in the thermal resistance of the wall of the first microchannel 110 can be avoided.
[0024] In the embodiment of the present application, the internal space of the substrate 100 is divided into a first microchannel 110 and a second microchannel 120. During heat exchange, the heat exchange liquid is mainly distributed in the first microchannel 110. The first microchannel 110 is mainly filled with the heat exchange liquid, and the surface of the needle fin 200 can be fully utilized for heat exchange. The heat exchange efficiency is high and the boiling process is relatively stable. The second microchannel 120 is mainly filled with steam, and the instability of the boiling process caused by the mixing of vapor and liquid can be avoided.
[0025] In some embodiments of the present application, the arrangement direction of the first microchannel 110 and the second microchannel 120 is a first direction. Figures 1 to 6 In actual use, the first direction is the direction of gravity, and when setting up the heat exchange device, it should be noted that the second microchannel 120 should be located above the first microchannel 110 to facilitate the transfer of bubbles and the discharge of steam.
[0026] The pin fin 200 is a main heat exchange component in the first microchannel 110. In some embodiments of the present application, refer to Figure 3 and Figure 4As shown, the axial direction of the needle fin 200 is the same as the first direction, and one end of the needle fin 200 is fixed to the wall of the first microchannel 110 away from the second microchannel 120 , and the other end is fixed to the wall of the first microchannel 110 close to the second microchannel 120 .
[0027] During the heat exchange process, the heat exchange liquid enters the first microchannel 110 from the working medium inlet 130, then flows through the gaps between the pin fins 200 and flows toward the first working medium outlet 140. Both ends of the pin fin 200 are fixedly matched with the wall of the first microchannel 110, which is conducive to improving the installation stability of the pin fin 200.
[0028] The needle fin 200 is fixed to the wall of the first microchannel 110. In some embodiments, the needle fin 200 may be a part of the substrate 100, and the needle fin 200 is processed from the wall of the first microchannel 110, and the needle fin 200 and the substrate 100 are an integrally formed structure. In other embodiments, the needle fin 200 may also be an independent structure relative to the substrate 100, and the needle fin 200 is fixedly connected to the wall of the first microchannel 110.
[0029] In some embodiments, along the first direction, the projection of any diffusion hole 160 on the wall of the first microchannel 110 is located in the gap between the plurality of pin-fins 200 connected in the first microchannel 110. The pin-fins 200 are fixed to the wall of the first microchannel 110 and the axial direction of the pin-fins 200 is the same as the first direction. The projection of the diffusion hole 160 is located between the plurality of pin-fins 200, that is, the diffusion hole 160 is located on the wall of the portion of the first microchannel 110 between the plurality of pin-fins 200, and the pin-fins 200 and the diffusion hole 160 are independent of each other and do not interfere with each other.
[0030] During the heat exchange process, after the bubbles detach from the pin fins 200 or the wall of the first microchannel 110, the bubbles are more easily transferred to the diffusion holes 160 because the diffusion holes 160 are located in the gaps between the plurality of pin fins 200. After the bubbles detach from the wall, their moving direction is substantially the first direction, further increasing the speed at which the bubbles are transferred to the diffusion holes 160.
[0031] In some preferred embodiments, reference Figure 7 and Figure 8As shown, the number of the diffusion holes 160 is less than or equal to one-half of the number of the pin fins 200. The number of the diffusion holes 160 should not be too many to prevent the heat exchange liquid from flowing into the second microchannel 120 through the diffusion holes 160, affecting the boiling heat exchange. At the same time, the number of the diffusion holes 160 should not be too few to prevent the bubbles in the first microchannel 110 from being transferred in time. In some specific embodiments, the number of the diffusion holes 160 is half the number of the pin fins 200, and along the flow direction of the heat exchange liquid in the first microchannel 110, the distance between two adjacent diffusion holes 160 in the flow direction is twice the distance between two adjacent pin fins 200 in the flow direction, so as to ensure that the boiling bubbles escape in time while the heat exchange liquid does not flow into the second microchannel 120.
[0032] In some embodiments, in order to improve the heat exchange effect of the heat exchange device, all the pin-fins 200 in the first microchannel 110 are evenly distributed in the first microchannel 110. There are multiple arrangements for even distribution. In some embodiments, along the flow direction of the liquid in the first microchannel 110, all the pin-fins 200 are divided into multiple groups of pin-fin groups, and the multiple groups of pin-fin groups are evenly distributed. In each group of pin-fin groups, the spacing between two adjacent pin-fins 200 is equal. In addition, the pin-fins 200 in two adjacent pin-fin groups are relatively staggered, so that the pin-fins 200 in any pin-fin group correspond to the gap between two pin-fins 200 in another pin-fin group. During the flow of the heat exchange liquid, the contact with the pin-fins 200 is more sufficient, and the heat exchange effect is better.
[0033] In some embodiments of the present application, reference Figure 7 and Figure 8 As shown, all the diffusion holes 160 are divided into multiple diffusion hole groups, and any diffusion hole group includes at least two diffusion holes 160, and the multiple diffusion hole groups are evenly distributed along the flow direction of the working medium in the first microchannel 110. The diffusion holes 160 are arranged as evenly as possible in the flow direction of the heat exchange liquid, so that the diffusion holes 160 cover the entire first microchannel 110 as much as possible, thereby ensuring that the bubbles generated in the first microchannel 110 can be transferred to the second microchannel 120 as much as possible, and fully reducing the influence of the bubbles on the heat exchange effect.
[0034] In some preferred embodiments, reference Figure 3 and Figure 4 As shown, the axial direction of the diffusion hole 160 is the same as the first direction. The length of the diffusion hole 160 is reduced, thereby increasing the speed at which the bubbles are transferred to the second microchannel 120.
[0035] The substrate 100 is an important component of the heat exchange device. Figures 1 to 6 As shown, the base 100 includes an upper cover plate 170, a partition plate 180 and a base 190 arranged along a first direction. Figure 3 and Figure 4 As shown, the second microchannel 120 is located between the upper cover plate 170 and the partition plate 180, the first microchannel 110 is located between the partition plate 180 and the base 190, the escape hole 160 is arranged on the partition plate 180, the working fluid inlet 130 and the first working fluid outlet 140 are both arranged on the base 190, and the second working fluid outlet 150 is arranged on the upper cover plate 170. The vibration generating component is connected to the base 190 to drive the base 190 to vibrate, thereby driving the needle fin 200 located in the second microchannel 120 to vibrate.
[0036] The base 100 is divided into three parts for assembly, which can effectively improve the manufacturing efficiency and assembly efficiency of the base 100. It is also convenient to perform subsequent inspection and maintenance of the heat exchange device.
[0037] The upper cover plate 170 needs to be docked with the partition plate 180 to form the second microchannel 120. The surface of the upper cover plate 170 and / or the surface of the partition plate 180 is provided with a groove structure, so as to dock and form the second microchannel 120. The partition plate 180 and the base 190 are docked to form the first microchannel 110. The surface of the partition plate 180 and / or the surface of the base 190 is provided with a groove structure, so as to dock and form the first microchannel 110.
[0038] The working fluid inlet 130 and the first working fluid outlet 140 can be respectively disposed at both ends of the base 190, and the connecting direction of the two is the flow of the heat exchange liquid in the first microchannel 110. In other embodiments, the working fluid inlet 130 and the first working fluid outlet 140 can also be disposed at the bottom of the base 190 or other locations.
[0039] In some embodiments, the needle fin 200 is directly formed on the base 190 , and when the base 190 and the partition 180 are docked and installed, the needle fin 200 is tightly fixed between the partition 180 and the base 190 to stabilize the position of the needle fin 200 .
[0040] In some embodiments, the upper cover plate 170 and the base 190 are butted together to form a cavity, and the partition plate 180 is installed in the cavity formed by the butt joint of the upper cover plate 170 and the base 190. The partition plate 180 separates the cavity formed by the butt joint of the upper cover plate 170 and the base 190, so that the cavity is separated into a first microchannel 110 and a second microchannel 120 that are independent of each other.
[0041] In other embodiments, reference Figure 1 and Figure 5 As shown, the partition 180 is blocked between the upper cover 170 and the base 190, the upper cover 170 is fixed to one side surface of the partition 180, and the base 190 is fixed to the other side surface of the partition 180. The base 190, the partition 180 and the upper cover 170 are sequentially overlapped.
[0042] The vibration generating assembly provided in the embodiment of the present application is used to drive the base 100 to vibrate. In some specific embodiments, the vibration generating assembly includes an excitation power supply 320 and two vibration sheets 310. Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the two vibration sheets 310 are fixed to the substrate 100, and the vibration sheets 310 are connected to the excitation power supply 320, and the excitation power supply 320 is used to drive the vibration sheets 310 and the substrate 100 to vibrate. The vibration sheets 310 are generally connected to the excitation power supply 320 through a wire 330, and the two vibration sheets 310 are fixed to the substrate 100. The two vibration sheets 310 cooperate with the substrate 100, the wire 330 and the excitation power supply 320 to form a closed loop. The excitation power supply 320 is started to drive the vibration sheets 310 to vibrate.
[0043] The vibration principle of the vibration plate 310 is a prior art, and there are many implementation methods. In some embodiments, an electromagnetic drive method can be used, the power supply provides current, and a magnetic field is generated through the electromagnetic coil. The magnetic field interacts with the magnetic components on the vibration plate 310, thereby driving the vibration plate 310 to vibrate. In other embodiments, piezoelectric drive can also be used. The power supply provides voltage, and the vibration plate 310 is made of piezoelectric material (such as quartz crystal, ceramic, etc.). Through the piezoelectric effect of the piezoelectric material, electrical energy is converted into mechanical energy, so that the vibration plate 310 vibrates. In addition, if conditions permit, a motor drive method can also be used. The power supply drives the motor to rotate, and an eccentric block is installed on the motor shaft. The rotation of the eccentric block generates centrifugal force, thereby causing the vibration plate 310 to vibrate.
[0044] The vibration plate 310 is installed outside the substrate 100, and the vibration plate 310 can be stably installed outside the substrate 100 by an adhesive. In the case where the substrate 100 includes a base 190, the vibration plate 310 is fixedly connected to the base 190, thereby driving the pin fins 200 inside the base 190 to vibrate, driving the bubbles to separate from the surface of the pin fins 200 and the wall of the first microchannel 110.
[0045] Since the vibration plate 310 is installed outside the base 100 , the vibration form and vibration parameters of the vibration plate 310 can be flexibly adjusted to obtain the best vibration enhancement effect.
[0046] In addition, when the base 100 includes the upper cover plate 170, the partition plate 180 and the base 190, the best heat exchange effect can be obtained by assembling the base 190 with the pin fins 200 arranged in different ways and the partition plate 180 with the escape holes 160 arranged in different ways.
[0047] In some preferred embodiments, the arrangement direction of the two vibration plates 310 is arranged to intersect with the flow direction of the working medium in the first microchannel 110. The working medium is a heat exchange liquid. Under such a layout, the vibration effect of the vibration plate 310 is distributed as evenly as possible in the base 100, which can increase the disturbance of the working medium in the first microchannel 110 to a certain extent, thereby improving the heat exchange effect. In addition, in some preferred embodiments, the vibration plate 310 is located in the middle of the base 100, and the arrangement direction of the two vibration plates 310 is arranged perpendicular to the flow direction, further improving the effect of the vibration plate 310.
[0048] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.
[0049] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A pin-fin microchannel enhanced heat exchange device under vibration, characterized in that: The invention comprises a substrate (100) and a vibration generating component; the substrate (100) is provided with a first microchannel (110) and a second microchannel (120) inside, and the first microchannel (110) is provided with a plurality of pin fins (200); the substrate (100) is provided with a working fluid inlet (130), a first working fluid outlet (140) and a second working fluid outlet (150) which are communicated with the inside thereof, the working fluid inlet (130) and the first working fluid outlet (140) are both communicated with the first microchannel (110), and the second working fluid outlet (150) is communicated with the second microchannel (120); the substrate (100) further comprises a plurality of escape holes (160) which are communicated with the first microchannel (110) and the second microchannel (120); the vibration generating component is connected to the substrate (100), and the vibration generating component is used to drive the substrate (100) to vibrate.
2. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 1, characterized in that: The arrangement direction of the first microchannel (110) and the second microchannel (120) is a first direction, the axial direction of the needle fin (200) is the same as the first direction, and one end of the needle fin (200) is fixed to a wall surface of the first microchannel (110) away from the second microchannel (120), and the other end is fixed to a wall surface of the first microchannel (110) close to the second microchannel (120).
3. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 2, characterized in that: Along the first direction, a projection of any of the diffusion holes (160) on the wall surface of the first microchannel (110) is located in a gap between a plurality of the needle fins (200) connected in the first microchannel (110); And / or, the number of the escape holes (160) is less than or equal to half the number of the needle fins (200).
4. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 2, characterized in that: All of the needle fins (200) in the first microchannel (110) are evenly distributed in the first microchannel (110); And / or, all the diffusion holes (160) are divided into a plurality of diffusion hole groups, any of the diffusion hole groups comprises at least two of the diffusion holes (160), and along the flow direction of the working medium in the first microchannel (110), the plurality of diffusion hole groups are evenly distributed.
5. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 3, characterized in that: The axial direction of the escape hole (160) is the same as the first direction.
6. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 1, characterized in that: The base (100) comprises an upper cover plate (170), a partition plate (180) and a base (190) arranged along a first direction; the second microchannel (120) is located between the upper cover plate (170) and the partition plate (180); the first microchannel (110) is located between the partition plate (180) and the base (190); the escape hole (160) is arranged on the partition plate (180); the working fluid inlet (130) and the first working fluid outlet (140) are both arranged on the base (190); and the second working fluid outlet (150) is arranged on the upper cover plate (170); The vibration generating component is connected to the base (190).
7. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 6, characterized in that: The upper cover plate (170) and the base (190) are butt-jointed, and the partition plate (180) is installed in a cavity formed by the butt-jointed upper cover plate (170) and the base (190).
8. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 6, characterized in that: The partition (180) is blocked between the upper cover (170) and the base (190); the upper cover (170) is fixed to one side surface of the partition (180), and the base (190) is fixed to the other side surface of the partition (180).
9. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 1, characterized in that: The vibration generating component comprises an excitation power supply (320) and two vibration plates (310), wherein the two vibration plates (310) are both fixed to the base (100), the vibration plates (310) are connected to the excitation power supply (320), and the excitation power supply (320) is used to drive the vibration plates (310) and the base (100) to vibrate.
10. The pin-fin microchannel enhanced heat exchange device under vibration according to claim 9, characterized in that: The arrangement direction of the two vibration plates (310) intersects with the flow direction of the working medium in the first microchannel (110).