A method for fabricating micro / nano-scale platinum resistance temperature sensors

Abstract

This invention discloses a method for fabricating a micro / nano-scale platinum resistance temperature sensor. The method includes: Step 1: Using MCED technology on a substrate, a pulsed voltage signal is applied to the platinum electrode within the probe via a fuzzy PID control algorithm. The substrate is connected to a power supply via wires. Under the action of the pulsed voltage, platinum metal is deposited in the contact area between the substrate and the probe tip; Step 2: Based on the predetermined shape of the platinum resistance, a control program is written using G-code to plan the probe's movement path and control its movement, depositing a platinum resistance of the desired shape and size on the substrate; Step 3: The deposited platinum resistance is wired to complete the fabrication of the platinum resistance temperature sensor. This invention provides a method for fabricating a micro / nano-scale platinum resistance temperature sensor. Based on the MCED method, it uses fuzzy PID control and G-code to fabricate a platinum metal resistance temperature sensor, significantly reducing costs while enabling mass production.

Description

Technical Field

[0001] This invention relates to the field of temperature detection. More specifically, this invention relates to a method for fabricating micro / nano-scale platinum resistance temperature sensors. Background Technology

[0002] A resistance temperature detector (RTD) sensor is a device that measures temperature based on the characteristic that the resistance of a conductor changes with temperature. RTD sensors are widely used in many fields due to their high accuracy, high stability, and good linearity. In industrial automation, RTD sensors are used to measure the temperature of mechanical equipment; in aerospace, they are used to monitor the temperature of aircraft, rockets, and other spacecraft, ensuring their normal operation in extreme temperature environments; in environmental monitoring, they can be used to measure the temperature of the atmosphere, water bodies, and soil, providing data support for environmental protection and climate change research; in addition, RTD sensors are also widely used in chemical, medical, and other fields. While current temperature sensors have advantages such as high accuracy and high stability, certain limitations still exist. In the electronics and semiconductor industry, the relatively slow response speed of RTD sensors makes it impossible to monitor the temperature on the production line in real time, failing to ensure the stability of the production environment and thus affecting product quality and production efficiency; in medical equipment and precision machinery manufacturing, measurement errors in RTD sensors can cause medical drugs to malfunction and precision machinery to fail to operate normally.

[0003] Temperature sensors play a vital role in modern society. From automated process control in industrial production to intelligent adjustment of home appliances and precise monitoring in the automotive industry, temperature sensors are indispensable. Therefore, it is essential to develop a low-cost, widely applicable platinum metal resistance temperature sensor.

[0004] In the field of micro-nano manufacturing, commonly used fabrication methods for resistance temperature sensors include electron beam lithography and focused ion imprinting. However, these techniques are relatively complex, especially when fabricating at the micro- and nanoscale, involving multi-layer deposition and lithography steps. Furthermore, the aforementioned methods for fabricating temperature sensors are costly and cannot achieve mass production.

[0005] Since its introduction by Hu et al. in 2010, meniscus-confined electrochemical deposition (MCED) has seen rapid development. Currently, glass probe-based MCED methods for depositing metallic copper offer excellent geometric freedom and stable deposition rates. Furthermore, studies have demonstrated that Pt metal can be prepared from chloroplatinic acid via electrochemical deposition, thus making the use of MCED for Pt metal preparation feasible. Platinum metal is widely used in temperature sensors, electrode contacts, catalysts, and other fields. Summary of the Invention

[0006] One object of the present invention is to solve at least the above-mentioned problems and / or defects, and to provide at least the advantages described below.

[0007] To achieve these objectives and other advantages of the present invention, a method for fabricating a micro / nano-scale platinum resistance temperature sensor is provided, the method comprising:

[0008] Step 1: The substrate is based on MCED technology. A pulse voltage signal is applied to the platinum electrode in the probe through a fuzzy PID control algorithm. The substrate is connected to the power supply through wires. Under the action of the pulse voltage, platinum metal is deposited in the contact area between the substrate and the probe tip.

[0009] Step 2: Based on the predetermined shape of the platinum resistance thermometer, a control program is written using G-code to plan the probe movement path, control the probe movement, and deposit the platinum resistance thermometer of the required shape and size on the substrate.

[0010] Step 3: Connect the deposited platinum resistance wires to complete the fabrication of the platinum resistance temperature sensor.

[0011] Preferably, a platinum metal deposition simulation analysis model is established based on the meniscus-constrained electrochemical deposition principle to simulate pulse voltage signals, conduct electrochemical reactions, and obtain the optimal deposition parameters for platinum metal deposition.

[0012] The optimal deposition parameters include, in step 1: the pulse voltage applied to the platinum electrode, the electrolyte solution concentration within the probe, and the opening diameter of the probe tip.

[0013] Preferably, the pulse voltage is a pulse square wave signal, whose main parameters are: high level 1.5V, low level -1.5V, frequency 1Hz, period 1s, and duty cycle 50%.

[0014] The electrolyte solution is a chloroplatinic acid solution with a concentration of 50 mM.

[0015] Preferably, the platinum metal deposition simulation analysis model includes: chloroplatinic acid electrolyte, gold substrate, platinum metal wire, and probe region;

[0016] The platinum metal deposition simulation analysis model is a two-dimensional planar model, with the anode being a linear region, the cathode substrate being a rectangular region, and the probe region being filled with electrolyte solution.

[0017] Preferably, in step 1, the fuzzy PID control method adjusts k′. p 、k′ i 、k′ d The parameters are input to the PID controller to control the pulse voltage signal in real time.

[0018] Where k′p =k″ p +Δk p , k′ i =k″ i +Δk i , k′ d =k″ d +Δk d The Δk p Δk i and Δk d The outputs from the fuzzy controller are the proportional coefficients k. p Integral coefficient k i and differential coefficient k d The increment; k″ p 、k″ i and k″ d These are the input parameters for the PID controller in the previous operation.

[0019] Preferably, the fuzzy PID control method includes:

[0020] S1. Input Fuzzification: The acquired ion current is converted into a voltage signal via an A / D converter and sent to the fuzzy controller. This signal is compared with the target value to obtain the deviation E and the deviation change EC. Then, E and EC are fuzzified to establish a fuzzy subset.

[0021] S2. Determine the membership function: Based on the growth shape and size of the deposits during the platinum metal deposition process, as well as the sensitivity requirements for control, select the triangular membership function, and determine the membership degree of E and EC on the fuzzy subset through the triangular membership function;

[0022] S3. Establish fuzzy control rules: The established fuzzy rule table is used to adjust the proportional coefficient, integral coefficient, and derivative coefficient. Based on the established fuzzy inference rules, the output parameter formula of the fuzzy controller is obtained as follows:

[0023]

[0024] in, For k p The minimum value, For k p The maximum value, For k i The minimum value, For k i The maximum value, For k d The minimum value, For k d The maximum value;

[0025] S4. Defuzzification: Defuzzification is performed using the centroid method;

[0026] S5. Defining the output parameters of the fuzzy controller based on membership degrees to obtain k′ p 、k′ i and k′ d The voltage is fed into the PID controller, which outputs the high-level voltage of the calculated pulse voltage. By continuously adjusting the high-level voltage of the pulse voltage, the ion current can be kept stable at any time.

[0027] The present invention has at least the following beneficial effects: Based on the MCED method, by introducing a pulse voltage signal, the occurrence of the electrochemical reaction is ensured, and platinum ions have sufficient time to replenish the cathode substrate, thus realizing platinum metal deposition; by using fuzzy PID control and G-code to plan and control the pulse voltage signal applied to the control microprobe and the trajectory of the microprobe, the problem of current fluctuation during platinum metal deposition is effectively solved, constant current control is achieved, and a platinum metal resistance temperature sensor is prepared, which can significantly reduce costs and achieve mass production.

[0028] Other advantages, objectives and features of the present invention will become apparent in part from the following description, and in part from those skilled in the art through study and practice of the invention. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the electrochemical deposition experimental platform device involved in the present invention;

[0030] Figure 2 This is a block diagram of the fuzzy PID control structure involved in this invention;

[0031] Figure 3 This is a schematic diagram of the fabrication process of the temperature sensing structure in this invention;

[0032] Figure 4 This is a schematic diagram of the external calibration and testing circuit of the platinum-based resistive temperature sensor prepared in this invention.

[0033] Figure 5 The preparation process flow chart for this invention;

[0034] Figure 6 The flowchart for implementing the G-code of this invention.

[0035] The markings in the diagram are: 1. Micro motor, 2. Piezoelectric ceramic, 3. X-axis coarse adjustment motor, 4. Y-axis coarse adjustment motor, 5. Z-axis coarse adjustment motor, 6. Probe fixture, 7. Optical camera, 8. Camera X-axis lead screw slide, 9. Camera Y-axis lead screw slide, 10. Camera Z-axis lead screw slide, 11. Ideal power supply, 12. Voltmeter. Detailed Implementation

[0036] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description.

[0037] Example

[0038] The preparation process of this invention is as follows: Figure 5 As shown, a special substrate is prepared by masking the middle area of ​​the non-conductive glass surface with tape and then sputtering gold. Using the meniscus-confined electrochemical deposition (MCED) method, a microstructure of a platinum-based resistance temperature sensor is deposited and grown on the special substrate. The deposited platinum resistance is then wired to complete the fabrication of the platinum resistance temperature sensor.

[0039] The technical solution is as follows: First, a platinum metal deposition simulation analysis model is established to analyze the key parameters affecting the quality and stability of platinum metal deposition. The deposition effect of platinum metal under different deposition parameters is studied to obtain the optimal parameters for platinum metal deposition and achieve platinum metal deposition growth (using the meniscus-constrained electrochemical deposition method to achieve platinum metal deposition). Second, considering that chloroplatinic acid exists in solution as hydrogen ions and chloroplatinate ions, electromigration is not conducive to platinate ions gaining electrons at the cathode, thus hindering platinum metal deposition. Therefore, this patent introduces a pulse voltage signal, which ensures both the occurrence of the electrochemical reaction and sufficient time for platinate ions to replenish the cathode substrate (when the pulse voltage signal is negative, the substrate, previously serving as the cathode, becomes the anode; under the action of the negative pulse, platinate ions replenish the substrate through electromigration). This invention introduces a fuzzy PID control method, formulates a fuzzy control table matching the existing electrochemical deposition system, and adjusts the duty cycle of the applied pulse voltage to maintain the stability of the deposition current during the deposition process, while accelerating the platinum metal deposition efficiency. Then, by introducing G-code, the path of the deposition structure is planned to automate the growth sensor structure. Finally, by combining fuzzy control algorithms and G-code, a stable fabrication of a platinum-based resistive temperature sensor structure was achieved.

[0040] Combining MCED technology to fabricate platinum-based comb-shaped resistance temperature sensors has unique advantages, significantly reducing costs while enabling mass production.

[0041] The simulation model mainly consists of a chloroplatinic acid (H2PtCl6) electrolyte, a gold substrate (cathode), a metal anode (platinum wire), and an insulating glass probe region. To better represent the electrochemical process, this model simplifies the complex three-dimensional model into a simpler two-dimensional planar model. The anode is simplified to a linear region, the cathode substrate is simplified to a rectangular region, and the glass probe region is filled with electrolyte solution.

[0042] The MCED deposition experimental platform device is as follows: Figure 1As shown, the device mainly consists of XYZ three-axis lead screws, micro motors 1, piezoelectric ceramics 2, and an optical camera 7. The XYZ three-axis lead screws are driven by X-axis coarse adjustment motors 3, Y-axis coarse adjustment motors 4, and Z-axis coarse adjustment motors 5, respectively. The left side of the device contains the three-axis lead screws for moving the optical camera, including: camera X-axis lead screw slides 8, camera Y-axis lead screw slides 9, and camera Z-axis lead screw slides 10, which are placed vertically in pairs to control the displacement in the XYZ directions. The coarse adjustment motors and micro motors 1 are placed on the lead screw platform, and the piezoelectric ceramics 2 are located at the bottom of the deposition plane. The right side contains the optical camera device structure, mainly consisting of the optical camera and three manual lead screw slides used to adjust the movement of the camera in the XYZ directions. The glass probe is clamped to the probe holder 6 above the piezoelectric ceramics on the left side by an M6 screw. The probe holder 6 has a 1.5mm diameter through hole for placing the probe. The conductive substrate is fixed to the piezoelectric ceramics by the dedicated probe holder 6. Optical camera 7 is focused on the tip of a glass probe to observe the deposition process. The glass probe is filled with electrolyte, and two wires are led out from the power supply. One wire is connected to a platinum wire and inserted into the glass probe, while the other wire is connected to a conductive substrate. Throughout the experiment, the movement of three motors on the left side is controlled by corresponding host computer software, which in turn moves the glass probe to achieve the fabrication of the corresponding structure.

[0043] The electrodeposited platinum-based resistance temperature sensor structure was prepared using the MCED method. Platinum was extracted from a chloroplatinic acid solution, and a 1μm aperture glass microprobe was fabricated using an existing probe pulling device. A specific deposition voltage was applied to deposit the platinum-based resistance temperature sensor structure. During the experiment, a 50mM chloroplatinic acid (H₂PtCl₆) solution (pH=1) was used. The metal anode (platinum wire) was inserted into the glass probe. Based on the electrochemical characteristics of the chloroplatinic acid solution, a pulsed voltage was applied, and trajectory planning was performed using G-code. As the probe was pulled, a corresponding comb-like structure was formed. The aforementioned pulsed voltage was specifically a square wave signal with the following main parameters: high level 1.5V, low level -1.5V, frequency 1Hz, period 1s, and duty cycle 50%.

[0044] The control method for the constant electrochemical deposition current is based on a closed-loop control algorithm for constant current using fuzzy PID control, as shown in the attached figure. Figure 2 As shown. Fuzzy PID is a control method that combines fuzzy logic with a PID controller. Through fuzzification, fuzzy PID can more flexibly adapt to the nonlinear characteristics of the system and external disturbances, improving the robustness and adaptability of the controller. Therefore, by introducing the fuzzy PID feedback control method to adjust the high-level voltage value of the pulse voltage signal applied during the deposition process, the problem of current fluctuation during platinum metal deposition can be effectively solved, achieving constant current control.

[0045] To further improve response or execution speed, an improved fuzzy controller is employed. The original fuzzy controller controlled k... p k i and k d These are three parameters, and currently, k is being controlled. p k i and k d The increment is Δk p Δk i and Δk d The changes in these three increments are relatively small, requiring less computation than k. p k i and k d A significant reduction. Following the fuzzy controller is a retainer that retains the previous k. p k i and k d The value is k″ p 、k″ i and k″ d Then add the output value Δk of the fuzzy controller. p Δk i and Δk d Then, it is applied to the controlled object. The initial value of the retainer can be set empirically. The membership functions for each fuzzy state include triangular membership functions, trapezoidal membership functions, normal membership functions, and Gaussian membership functions. The result of fuzzy inference, i.e., the output variable of the fuzzy controller, is generally a fuzzy set and cannot be directly used to control the controlled object. It needs to be first converted into precise quantities that the actuator can execute for defuzzification. After processing, three self-tuning parameters k are obtained. p k i and k d The value of .

[0046] The entire electrochemical deposition control process mainly includes the following steps:

[0047] (1) Input fuzzification: The collected ion current is converted into a voltage signal via an A / D converter and sent to the fuzzy controller. The signal is compared with the target value to obtain the deviation E and the deviation change EC. Then, E and EC are fuzzified to establish a fuzzy subset. This paper divides the interval into eight parts, with the seven linguistic variables within each part being NB, NM, NS, ZO, PS, PM, and PB, respectively.

[0048] (2) Determining the membership function: Since the growth of the deposit during platinum metal deposition takes approximately 3-5 minutes, the sensitivity requirement for control is not very high. Furthermore, because the shape of the triangular membership function depends only on the slope of its straight line, the calculation is relatively simple and requires little memory. Therefore, it is well-suited for fuzzy control with online adjustment of membership functions. Thus, the triangular membership function is chosen to determine the membership degrees of E and EC on the fuzzy subset.

[0049] (3) Establish fuzzy control rules: The established fuzzy rule table is applied to k p k i and k d Adjustments were made.

[0050] k p k i and k d The fuzzy rule tables are Table 1, Table 2 and Table 3, respectively.

[0051] Table 1

[0052] ΔKp NB NM NS ZO PS PM PB NB PB PB PM PM PS ZO ZO NM PB PB PM PS PS ZO NS NS PM PM PM PS ZO NS NS ZO PM PM PS ZO NS NM NM PS PS PS ZO NS NS NM NM PM PS ZO NS NM NM NM NB PB ZO ZO NM NM NM NB NB

[0053] Table 2

[0054]

[0055]

[0056] Table 3

[0057] ΔKd NB NM NS ZO PS PM PB NB PS NS NB NB NB ZO PS NM PS NS NB NM NM ZO ZO NS ZO NS NM NM NS PS ZO ZO ZO NS NS NS NS PM ZO PS ZO ZO ZO ZO ZO PM ZO PM PB NS PS PS PS PB PB PB PB PM PM PM PS PB PB

[0058] In the control system, k p The choice of k depends on the system's response speed. A relatively large value should be chosen for the initial adjustment phase. p To improve response speed, k is used in the mid-term adjustment. p Then, a smaller value is chosen to ensure the system has a small overshoot while maintaining a certain response speed; and then k is adjusted later in the adjustment process. p The value is adjusted to a larger value to reduce steady-state error and improve control accuracy. i Control is primarily used to eliminate steady-state deviations in the system. In the initial stage of the adjustment process, its integral action is relatively small to prevent integral saturation; in the middle stage, its integral action is moderate to avoid affecting stability; finally, in the later stage, the integral action is enhanced to reduce the steady-state error. d The adjustments are primarily introduced for processes with large inertia. In the initial stage of adjustment, the differential action should be increased to achieve a smaller or even avoided overshoot; however, in the middle stage, due to the influence of adjustment characteristics on k... d The value is quite sensitive to changes, therefore, k d The value should be appropriately small and should remain constant; then, in the later stages of adjustment, kd The value should be reduced to decrease the braking effect on the controlled process, thereby compensating for the initial stage of the adjustment process due to k. d The larger the value, the longer the adjustment process time. Based on the above description, the corresponding fuzzy rule table defined in this paper is used. According to the established fuzzy inference rules, the output parameters of the PID controller are expressed by the following formulas:

[0059]

[0060]

[0061] in, For k p The minimum value, For k p The maximum value, For k i The minimum value, For k i The maximum value, For k d The minimum value, For k d The maximum value.

[0062] (4) Defuzzification: Commonly used defuzzification methods include the maximum membership method, the centroid method, and the weighted average method. Although the centroid method is computationally more difficult, it produces a smoother output that is consistent with the goal of fuzzy control. Therefore, this invention uses the centroid method for defuzzification. The formula for the centroid method is expressed as follows:

[0063] The center of the region covered by the membership function a of fuzzy set C, i.e.

[0064]

[0065] Where, x * It is the center of the membership function, C is a fuzzy set, y c (x) is the membership function, and [a,b] is the range of the universe of discourse.

[0066] Finally, the output value is clarified according to the membership degree to obtain k′. p 、k′ i and k′ d The voltage is fed into the PID controller, which outputs the high-level voltage of the calculated pulse voltage. By continuously adjusting the high-level voltage of the pulse voltage, the ion current can be kept stable at any time.

[0067] The G-code mentioned above is a widely used CNC programming language, generally referred to as G-instructions in CNC programs. The basic structure of G-code consists of control commands and numerical parameters. Control commands typically begin with the letter "G," followed by a two-digit (or more) integer; for example, 0 is used for rapid positioning, and 1 is used for linear interpolation, etc. The G-code implementation flow of this method is as follows: Figure 6 .

[0068] This invention can be used to fabricate a temperature measurement device for the micro- and nanoscale fields, specifically a resistance temperature sensor based on a platinum metal microstructure. The invention employs the MCED method, utilizing the meniscus-confined electrochemical deposition property to control the diffusion range of chloroplatinate ions, confining the diffusion as much as possible within the meniscus. This ensures sufficient platinum ion accumulation at the contact area between the probe tip and the substrate, thereby guaranteeing platinum metal deposition. (See attached diagram) Figure 1 The diagram shown is a structural schematic of the meniscus-confined electrochemical deposition experimental platform device involved in this invention. (See attached diagram.) Figure 3 As shown, the complex structure deposition process required by this invention is as follows: First, a deposition origin is selected, experimental parameters are given, and platinum metal deposition is achieved. Then, a vertical growth of 20 μm is performed at the initial position, and the current height is recorded. Platinum pillars of the same height are deposited and grown every 15 μm. Figure 3 ①, ②, ③, and ④ in the diagram; then, on a plane with a height of 20 μm, horizontally connect the first and second platinum pillars, i.e. Figure 3 ⑤; The second and third platinum pillars are horizontally connected on the substrate, i.e. Figure 3 ⑥ in the middle; and so on, thereby realizing the printing of sensor microstructure; depositing a complete comb-shaped thermistor temperature sensor structure.

[0069] There are three wiring methods for resistance temperature detectors (RTDs): two-wire, three-wire, and four-wire. The four-wire method involves connecting two wires to each end of the RTD. Two of these wires are soldered to an ideal power supply 11 to provide a constant current I to the RTD. The other two wires are soldered directly to the platinum resistance thermometer 12 across the RTD. (See attached diagram.) Figure 4 As shown, this invention uses a four-wire wiring method. The required platinum resistance value is equal to the quotient of the voltmeter 12 reading and the ammeter reading, and the influence of lead resistance can be completely eliminated, improving measurement accuracy. When the external temperature changes, the readings of the ammeter and voltmeter 12 are recorded, the data is processed, and the relationship between the platinum resistance and temperature change is obtained.

[0070] The working principle of this invention is as follows: When the miniature temperature sensor of the resistance temperature detector (RTD) comes into contact with the object being measured, heat is conducted from the object to the thermistor, causing a change in its temperature. Since there is a linear relationship between the resistance of the thermistor and temperature, the resistance value changes accordingly. The temperature measuring device calculates the change in resistance by applying a certain current to the thermistor and measuring the voltage generated across it, thereby determining the change in temperature. In this way, the sensor can indirectly obtain the temperature information of the object being measured. This invention uses platinum as the RTD material because platinum metal has excellent chemical stability, high purity, excellent resistance-temperature linearity, and good heat resistance and corrosion resistance. These properties enable platinum metal to provide accurate and reliable temperature measurements under various environmental conditions. This ensures that this patent has significant applications in the field of temperature sensors. Furthermore, the research results of this patent can also contribute to the development of novel temperature sensors based on platinum thin films and other materials.

[0071] The above solution is merely an illustration of a preferred example and is not limited thereto. When implementing this invention, appropriate substitutions and / or modifications can be made according to the user's needs.

[0072] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. It can be applied to various fields suitable for the present invention. Other modifications can be readily made by those skilled in the art. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and examples shown and described herein.

Claims

1. A method for fabricating a micro / nano-scale platinum resistance temperature sensor, characterized in that, The method includes: Step 1: The substrate is based on MCED technology. A pulse voltage signal is applied to the platinum electrode in the probe through a fuzzy PID control algorithm. The substrate is connected to the power supply through wires. Under the action of the pulse voltage, platinum metal is deposited in the contact area between the substrate and the probe tip. Step 2: Based on the predetermined shape of the platinum resistance thermometer, a control program is written using G-code to plan the probe movement path, control the probe movement, and deposit the platinum resistance thermometer of the required shape and size on the substrate. Step 3: Connect the deposited platinum resistance wires to complete the fabrication of the platinum resistance temperature sensor; A platinum metal deposition simulation analysis model was established based on the principle of meniscus-constrained electrochemical deposition. The model simulates pulse voltage signals to carry out electrochemical reactions and obtains the optimal deposition parameters for platinum metal deposition. The optimal deposition parameters include, in step 1: the pulse voltage applied to the platinum electrode, the electrolyte solution concentration inside the probe, and the opening diameter of the probe tip; The platinum metal deposition simulation analysis model includes: chloroplatinic acid electrolyte, gold substrate, platinum wire, and probe region; The platinum metal deposition simulation analysis model is a two-dimensional planar model, with the anode being a linear region, the cathode substrate being a rectangular region, and the probe region being filled with electrolyte solution; In step 1, the fuzzy PID control method will adjust the... , , The parameters are input to the PID controller to control the pulse voltage signal in real time. in The , and The outputs from the fuzzy controller are the proportional coefficients. Integral coefficient and differential coefficients The increment; , and These are the input parameters for the PID controller in the previous operation; Fuzzy PID control methods include: S1. Input fuzzification: The collected ion current is converted into a voltage signal by A / D conversion and sent to the fuzzy controller. It is compared with the target value to obtain the deviation E and the deviation change EC. Then, E and EC are fuzzified to establish a fuzzy subset. S2. Determine the membership function: Based on the growth shape and size of the deposits during the platinum metal deposition process, as well as the sensitivity requirements for control, select the triangular membership function, and determine the membership degree of E and EC on the fuzzy subset through the triangular membership function; S3. Establish fuzzy control rules: The established fuzzy rule table is used to adjust the proportional coefficient, integral coefficient, and derivative coefficient. Based on the established fuzzy inference rules, the output parameter formula of the fuzzy controller is obtained as follows: in, for The minimum value, for The maximum value, for The minimum value, for The maximum value, for The minimum value, for The maximum value; S4. Defuzzification: Defuzzification is performed using the centroid method; S5. Definitely refine the output parameters of the fuzzy controller based on membership degrees to obtain... , and The calculated pulse voltage is fed into the PID controller, which outputs a high-level voltage. By continuously adjusting the high-level voltage of the pulse voltage, the ion current can be kept stable at any time. The formula for the centroid method is expressed as follows: The center of the region covered by the membership function a of fuzzy set C, i.e. in, It is the center of the membership function, and C is a fuzzy set. It is the membership function. It is the scope of the domain of discourse.

2. The method for fabricating a micro / nano-scale platinum resistance temperature sensor as described in claim 1, characterized in that, The pulse voltage is a pulse square wave signal, and its main parameters are: high level 1.5V, low level -1.5V, frequency 1Hz, period 1s, and duty cycle 50%. The electrolyte solution is a chloroplatinic acid solution with a concentration of 50 mM.

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