Pressing head for PIN-to-PIN crimping, alignment method and crimping device

Abstract

The invention provides a pressure head for PIN-to-PIN crimping, an alignment method and a crimping device, the pressure head comprises a first mounting plate, a probe template and a second mounting plate which are mounted in sequence, the probe template is mounted on the upper surface of the second mounting plate, and the first mounting plate is mounted on the upper surface of the probe template; a first circuit board is arranged on the upper surface of the first mounting plate, the surface of the first circuit board comprises a crimping area provided with golden fingers, and the golden fingers on the lower side of the crimping area are in corresponding contact with probes in the probe template; and an alignment structure is also arranged, and is used for determining whether the golden finger on the upper side of the crimping area is aligned with the golden finger at the crimping end of the to-be-tested product. In the crimping process, the golden finger at the crimping end of the to-be-tested product is directly contacted with the golden finger of the first circuit board and does not need to be directly contacted with the probe, so that the loss speed of the probe is effectively reduced. The alignment structure can confirm whether the golden fingers at the crimping end of the to-be-tested product are aligned with the golden fingers on the first circuit board, so as to avoid the problem of crimping failure caused by dislocation.

Description

Technical Field

[0001] The invention relates to the technical field of automatic crimping of vehicle panels, and in particular to a crimping head, an alignment method and a crimping device for PIN-to-PIN crimping. Background Art

[0002] In the existing press head device, the probe inside the press head is designed to accurately correspond to the gold finger of the crimping end of the product to be tested and perform the crimping operation. However, this traditional design has significant limitations. Specifically, each time the crimping task is performed, the probe needs to perform a telescopic action. This frequent mechanical movement not only accelerates the wear process of the probe, but also greatly increases the risk of probe damage. As a key component in the crimping process, the loss of the probe directly affects the success rate and stability of the crimping. Once the probe is worn or damaged, it will directly lead to crimping failure, which in turn affects the overall quality and production efficiency of the product. In addition, due to the easy-to-wear characteristics of the probe, the existing press head device generally has a low crimping yield after long-term operation, which not only increases the production cost, but also reduces the market competitiveness of the product. Although the industry has tried to alleviate this problem by optimizing the probe material and improving the crimping process, the effect is not significant. Therefore, how to design a press head device that can reduce probe loss and improve the crimping success rate and yield has become a technical problem that needs to be solved urgently. Summary of the invention

[0003] In order to solve all or part of the problems of the above-mentioned prior art, the present invention provides a PIN-to-PIN crimping head, an alignment method and a crimping device. By optimizing the structural design of the crimping head, the telescopic movement of the probe during the crimping process is effectively reduced, thereby significantly reducing the wear rate and damage risk of the probe.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A PIN-to-PIN crimping head comprises a first mounting plate, a probe template and a second mounting plate which are installed in sequence, the probe template being mounted on the upper surface of the second mounting plate, and the first mounting plate being mounted on the upper surface of the probe template; a first circuit board is arranged on the upper surface of the first mounting plate, the surface of the first circuit board comprises a crimping area provided with gold fingers, the gold fingers on the lower side of the crimping area are in corresponding contact with the probes in the probe template; an alignment structure is also arranged, the alignment structure is used to confirm whether the gold fingers on the upper side of the crimping area are aligned with the gold fingers at the crimping end of the product to be tested.

[0006] The alignment structure includes a light-transmitting window opened on the surface of the first mounting board, and a light source arranged on the second mounting board corresponding to the light-transmitting window, and the light emitted by the light source passes through the light-transmitting window; a diffusion plate is installed on the light-transmitting window, and the side of the first circuit board is adjacent to the diffusion plate.

[0007] The alignment structure further includes alignment marks symmetrically arranged on both sides of the first circuit board, and the alignment marks include a first mark, which is an alignment gold finger arranged in parallel with the gold finger on the first circuit board.

[0008] The alignment structure also includes alignment marks symmetrically arranged on both sides of the first circuit board, the alignment marks include a second mark, an extension area is symmetrically arranged on the first circuit board, and the second mark is arranged on the extension area; the second mark is at least one light-transmitting hole opened on the extension area, and a through hole corresponding to the light-transmitting hole is opened on the product to be tested.

[0009] A groove area matching the extension area is formed on the side of the diffusion plate adjacent to the first circuit board, and the groove area is located in the light-transmitting window; when the product to be tested is aligned and placed on the first mounting plate, part of the light emitted by the light source on the second mounting plate passes through the light-transmitting window, is evenly scattered by the diffusion plate, and irradiates the side edge of the product to be tested, and part of the light is emitted through the light-transmitting hole in the extension area of ​​the first circuit board and the through hole of the product to be tested.

[0010] The upper surface of the first mounting plate also includes a guide area located in front of the light-transmitting window, and the guide area is configured to be sloped for guiding the crimping end of the product to be tested.

[0011] The upper surface of the second mounting plate is provided with a first step and a second step, the second step is higher than the first step, the probe template is installed on the first step, the surface of the second step is provided with the light source, and the position of the light source corresponds to the light-transmitting window.

[0012] The probe template comprises a probe board, a second circuit board and a transfer board which are installed in sequence. A plurality of probes are installed on the probe board. The probes on the probe board are contacted and connected with gold fingers on the second circuit board in a one-to-one correspondence.

[0013] The present invention also provides a PIN-to-PIN alignment method, which is implemented by using the above-mentioned indenter. After the crimping end of the product to be tested is placed on the first mounting plate, if no light passes through the through hole of the product to be tested, the alignment method is executed, which specifically includes the following steps:

[0014] S1. Calling the distance information between the first mark and the first gold finger on the first circuit board, and the distance information between the second mark and the first gold finger;

[0015] S2. Adjust the distance between the first gold finger of the crimping end of the product to be tested and the first mark, or adjust the distance between the first gold finger of the crimping end of the product to be tested and the second mark, so that the gold finger of the product to be tested is aligned with the gold finger of the first circuit board;

[0016] S3. If light passes through the through hole of the product to be tested, the gold fingers of the product to be tested and the first circuit board are aligned; if no light passes through, repeat step S2.

[0017] The present invention also provides a PIN-to-PIN crimping device, which uses the above-mentioned pressing head, and the pressing head is divided into a left-station configuration and a right-station configuration; in the left-station configuration, the first circuit board is arranged in the right area of ​​the first mounting plate, and the layout of the pressing head is arranged according to this configuration; in the right-station configuration, the first circuit board is arranged in the left area of ​​the first mounting plate, and the layout of the pressing head is arranged according to this configuration.

[0018] The present invention has at least the following beneficial effects:

[0019] 1) The probe template is fixedly mounted on the second mounting plate, and the first circuit board gold fingers corresponding to the probes are arranged on the first mounting plate. During the crimping process, the gold fingers at the crimping end of the product to be tested directly contact the gold fingers of the first circuit board without direct contact with the probes. This design completely changes the mode in which the probes in the traditional crimping head device need to be frequently extended and retracted for crimping, and reduces the mechanical movement of the probes. The crimping head of the present invention is also provided with an alignment structure, including symmetrically arranged alignment marks and light-transmitting windows, etc. These structures are used to determine that the gold fingers at the crimping end of the product to be tested are aligned with the gold fingers on the first circuit board before crimping, thereby avoiding the problem of crimping failure due to misalignment and improving the success rate and yield of crimping.

[0020] 2) The matching alignment method realizes fast and accurate alignment adjustment by calling preset distance information and combining it with real-time light transmission detection technology. Specifically, through the ingenious design of alignment marks and light transmission holes, combined with the auxiliary role of light source and diffuser, intuitive and clear alignment instructions are provided to operators. Operators only need to simply call the preset distance information and make fine adjustments based on the results of real-time light transmission detection to easily and quickly complete the alignment process. This method not only significantly shortens the time of the crimping process, but also improves production efficiency and reduces production costs.

[0021] 3) The PIN-to-PIN crimping device provided by the present invention realizes efficient switching between the left and right stations by adopting the above-mentioned pressure head design. In the left station configuration, the first circuit board is arranged on the right side of the first mounting plate, and the pressure head layout is adjusted accordingly to ensure the accuracy of the crimping operation; in the right station configuration, the first circuit board is located on the left side, and the pressure head layout also changes accordingly to adapt to the new crimping requirements. This innovative pressure head configuration design not only significantly enhances the applicability and flexibility of the crimping device, enabling it to easily cope with the crimping operations of electronic components of different models and layouts, but also greatly improves the accuracy and reliability of the crimping process, bringing a more efficient and reliable crimping solution to the electronics manufacturing industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of the structure of a pressing head for PIN-to-PIN crimping in Example 1 of the present invention.

[0024] Figure 2 Provided in Example 1 of the present invention Figure 1 Top view of the medium pressure head.

[0025] Figure 3 Provided in Example 1 of the present invention Figure 2 Cross-section of the medium pressure head AA.

[0026] Figure 4 This is a schematic structural diagram of a PIN-to-PIN crimping device in Example 2 of the present invention.

[0027] Figure 5 Provided for Example 2 of the present invention Figure 4 Schematic diagram of the structure of the pressure head configured at the middle left workstation.

[0028] Figure 6 Provided for Example 2 of the present invention Figure 5 Side view of the press head configured at the center left station.

[0029] Figure 7 Provided for Example 2 of the present invention Figure 4 Schematic diagram of the structure of the pressure head configured at the middle right workstation.

[0030] Figure markings: 1-first mounting plate; 101-first circuit board; 102-light-transmitting window; 103-guide area; 2-probe template; 201-probe board; 2011-probe; 202-second circuit board; 203-adapter board; 3-second mounting plate; 301-light source; 4-alignment mark; 401-first mark; 402-second mark; 5-product to be tested; 6-pressing assembly; 7-left station configuration; 8-right station configuration. DETAILED DESCRIPTION

[0031] The technical solutions in the specific embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Example 1

[0033] In the embodiment of the present invention, in combination with reference Figures 1 to 3 As shown, a special pressure head for PIN-to-PIN crimping is provided, and the pressure head is mainly composed of a first mounting plate 1, a probe template 2 and a second mounting plate 3 which are installed in sequence. Specifically, the probe template 2 is installed on the upper surface of the second mounting plate 3, and the first mounting plate 1 is arranged on the probe template 2. A first circuit board 101 is arranged on the upper surface of the first mounting plate 1, and the surface of the first circuit board 101 includes a crimping area provided with gold fingers, and the gold fingers on the lower side of the crimping area are in corresponding contact with the probes 2011 in the probe template 2, ensuring the stable transmission of electrical signals. In order to further improve the crimping accuracy and efficiency, the pressure head is also provided with an alignment structure, which is designed to determine whether the gold fingers at the crimping end of the product 5 to be tested are completely aligned with the gold fingers on the first circuit board 101. The alignment structure not only simplifies the operation process, but also effectively reduces the problem of poor connection caused by misalignment, and significantly improves the accuracy and reliability of the test.

[0034] The alignment structure includes a light-transmitting window 102 provided on the surface of the first mounting plate 1, and a light source 301 provided on the second mounting plate 3 and corresponding to the light-transmitting window 102. The light emitted by the light source 301 can pass through the light-transmitting window 102 smoothly, providing sufficient and uniform lighting conditions for the alignment process. In order to further optimize the light distribution and improve the alignment accuracy, a diffusion plate is also installed on the light-transmitting window 102. This diffusion plate can effectively diffuse the light emitted by the light source 301, so that the light is softer and evenly irradiated on the alignment area of ​​the product to be tested 5, thereby reducing the alignment error caused by excessive concentration or uneven distribution of light. The side of the first circuit board 101 is adjacent to the diffusion plate. Such a layout ensures that the gold finger area can be fully illuminated and observed during the crimping process, further improving the accuracy and reliability of crimping.

[0035] In this embodiment, the alignment structure also includes alignment marks 4 symmetrically arranged on both sides of the first circuit board 101, and these alignment marks 4 play a vital role in ensuring the precise positioning of the product to be tested 5. Specifically, the alignment mark 4 includes a first mark 401 and a second mark 402, and the first mark 401 is an alignment gold finger, which is arranged in parallel with the gold finger on the first circuit board 101. Extension areas are symmetrically arranged on the first circuit board 101, and these extension areas provide space for the setting of the second mark 402, and the second mark 402 is arranged on the extension area. The side of the diffusion plate adjacent to the first circuit board 101 is provided with a groove area matching the extension area, and the groove area is located within the range of the light-transmitting window 102. The second mark 402 is specifically at least one light-transmitting hole. The position, size and number of these light-transmitting holes are carefully designed to ensure that they are completely corresponding to the through holes opened on the product to be tested 5. When the product to be tested 5 is accurately aligned and placed on the first mounting plate 1, the light source 301 configured on the second mounting plate 3 will emit light, part of which will pass through the light-transmitting window 102, and then be evenly irradiated to the side edges of the product to be tested 5 through the fine scattering effect of the diffusion plate, thereby providing additional visual auxiliary information for the correction and alignment operation of the crimping process. At the same time, another part of the light will be directly emitted through the light-transmitting holes in the extended area of ​​the first circuit board 101 and the through holes of the product to be tested 5, forming a more intuitive alignment indication to ensure the precise alignment between the gold fingers at the crimping end of the product to be tested 5 and the gold fingers on the first circuit board 101. It is worth noting that the alignment structure of the present invention is not limited to the above-mentioned specific embodiments, and its design concept has a wide range of adaptability and can be flexibly adjusted according to actual needs, such as using other forms of visual markings or mechanical positioning structures to further expand its versatility and practicality in different application scenarios.

[0036] The upper surface of the second mounting plate 3 is designed to have two step structures of different heights: a first step and a second step, wherein the second step is at a higher position than the first step. This design cleverly utilizes the height difference of the space to achieve effective layout and installation of different components. Specifically, the probe template 2 is mounted on the first step, and a light source 301 component is arranged on the surface of the second step, and its position is accurately calculated to ensure that a corresponding layout relationship is formed with the light-transmitting window 102 on the first mounting plate 1. This design enables the light emitted by the light source 301 to accurately penetrate the light-transmitting window 102, providing a clear and intuitive optical indication for the alignment process. The probe template 2 is formed by stacking and installing the probe plate 201, the second circuit board 202, and the adapter plate 203 in sequence. A plurality of probes 2011 are installed on the probe plate 201, and these probes 2011 and the gold fingers on the second circuit board 202 achieve precise one-to-one contact connection, ensuring the stable transmission of signals and the accuracy of data. At the same time, the adapter plate 203 is arranged below the second circuit board 202, and its lower surface is in contact with the first step of the second mounting plate 3. The lower surface of the first mounting plate 1 is designed to include a third step and a fourth step, and the upper surface of the probe plate 201 is in contact with the third step of the first mounting plate 1. The second step of the second mounting plate 3 is designed to be in contact with the fourth step of the first mounting plate 1, so that the light source 301 on the second mounting plate 3 corresponds to the light-transmitting window 102 on the first mounting plate 1, and the connection strength between the two is strengthened. After the pressure head is assembled, the height between the third step and the first step is equal to the height of the probe template 2. In addition, a guide area 103 is also provided on the upper surface of the first mounting plate 1. The guide area 103 is set to a slope shape and is located in front of the light-transmitting window 102. The sloped guide surface can guide the crimping end of the product to be tested 5 to move smoothly along the horizontal path to the crimping area, thereby improving the accuracy and efficiency of the alignment process, thereby effectively reducing the deviation that may occur in the crimping process of the product to be tested 5.

[0037] The present invention also provides a PIN-to-PIN alignment method, which is implemented using the above-mentioned pressure head, aiming to ensure that the crimping end of the product to be tested 5 can be accurately aligned with the gold finger on the first circuit board 101. When the crimping end of the product to be tested 5 is placed on the first mounting plate 1, if no light is observed to be transmitted through the through hole of the product to be tested 5, the alignment method is started. The specific implementation steps of the method are as follows:

[0038] S1. Calling the distance information between the first identifier 401 and the first gold finger on the first circuit board 101, and the distance information between the second identifier 402 and the first gold finger;

[0039] S2. Adjust the distance between the first gold finger of the crimped end of the tested product 5 and the first mark 401, or adjust the distance between the first gold finger of the crimped end of the tested product 5 and the second mark 402, so that the gold finger of the tested product 5 is aligned with the gold finger of the first circuit board 101;

[0040] S3. If light passes through the through hole of the product to be tested 5, the gold fingers of the product to be tested 5 and the first circuit board 101 are aligned. If no light passes through, repeat step S2.

[0041] In view of the technical difficulties such as the wear and damage caused by the frequent extension and retraction of the probe 2011 in the existing pressure head device and the decrease in the crimping yield rate, the present invention proposes a special pressure head for PIN-to-PIN crimping and a matching alignment method. By optimizing the structural design of the pressure head device, the extension and retraction action of the probe 2011 during the crimping process is significantly reduced, thereby effectively reducing the wear rate and damage risk of the probe 2011. This improvement not only prolongs the service life of the probe 2011, but also improves the stability and reliability of the crimping process, ensuring that each crimping can achieve the expected connection effect. By introducing a high-precision alignment structure and an optical auxiliary system, the precise alignment between the gold finger of the crimping end of the product to be tested 5 and the gold finger of the first circuit board 101 is achieved. The implementation of this alignment method not only simplifies the operating process, but also significantly improves the success rate and yield rate of crimping, reduces the problem of poor connection caused by misalignment, and further improves the overall quality and production efficiency of the product. These improvements enable the pressure head device to maintain good crimping performance after long-term operation, reduce production costs, and improve the market competitiveness of the product.

[0042] In summary, the present invention successfully solves the technical problems of large loss of probe 2011 and low crimping success rate and yield in the existing crimping head device through innovative structural design and alignment method, and provides an efficient, reliable and economical solution for the PIN-to-PIN crimping field.

[0043] Example 2

[0044] In the embodiment of the present invention, in combination with reference Figures 4 to 7As shown, a PIN-to-PIN crimping device is provided, which particularly adopts the pressure head described in Example 1, and is intended to perform efficient and reliable crimping tests on display panels. This crimping device is equipped with a pressing component 6 that is compatible with the pressure head. The pressing contact end of the pressing component 6 adopts advanced rubber coating processing technology. This unique design not only significantly improves the friction coefficient between the pressing component 6 and the contact surface to be tested, but also effectively prevents sliding or position displacement that may occur during the crimping operation; moreover, the excellent cushioning performance of the rubber coating material also provides thoughtful protection for the pressed display panel surface, avoiding scratches or damage that may be caused by direct hard contact. Furthermore, in order to fully meet the diverse crimping end design requirements that are widely present on display panel products, the pressure head of the present invention incorporates a high degree of flexibility in its design, allowing the user to perform left-station configuration 7 and right-station configuration 8 on the crimping device.

[0045] Specifically, in the left station configuration 7, the pressure head uses the alignment mark 4 on the right side as the reference point, the first circuit board 101 is set in the right area of ​​the first mounting plate 1, and closely cooperates with it are the light source 301, the light-transmitting window 102, the probe template 2 and the second mounting plate 3, and these components are set accordingly according to this layout. When performing a crimping test, the gold finger at the crimping end of the product 5 to be tested needs to be accurately aligned with the first gold finger from right to left. Correspondingly, in the right station configuration 8, an alignment strategy opposite to that of the left station is adopted, and the pressure head is positioned according to the alignment mark 4 on its left side. The first circuit board 101 is set in the left area of ​​the first mounting plate 1, and the light source 301, the light-transmitting window 102, the probe template 2 and the second mounting plate 3 are all set accordingly according to this layout. When performing a crimping test, the gold finger at the crimping end of the product 5 to be tested needs to be accurately aligned with the first gold finger from left to right. Regardless of the left or right station configuration 8, the pressure head of the present invention exhibits excellent matching and adaptability, and can flexibly cope with the crimping test requirements of display panels of different models and layouts.

[0046] The application scope of the crimping device of the present invention and the pressure head design adopted therein is not limited to the crimping operation of the display panel. In fact, the pressure head also shows wide applicability to other electronic components and assemblies that require high-precision PIN-to-PIN crimping. These components include but are not limited to semiconductor chips, integrated circuit boards, connectors, and other types of precision electronic interfaces. Through its precise alignment mechanism, excellent matching and strong crimping ability, the crimping device and pressure head of the present invention can ensure a high degree of accuracy and reliability in the crimping process of various electronic components and assemblies, providing an innovative and efficient solution to the precision crimping needs of the electronics manufacturing industry.

[0047] It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made to the present invention without departing from the principles of the present invention. These improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A PIN-to-PIN crimping head, characterized in that: The invention comprises a first mounting plate (1), a probe template (2) and a second mounting plate (3) which are installed in sequence, wherein the probe template (2) is installed on the upper surface of the second mounting plate (3), and the first mounting plate (1) is installed on the upper surface of the probe template (2); a first circuit board (101) is arranged on the upper surface of the first mounting plate (1), and the surface of the first circuit board (101) comprises a crimping area provided with gold fingers, and the gold fingers on the lower side of the crimping area are in corresponding contact with the probes (2011) in the probe template (2); and an alignment structure is also arranged, and the alignment structure is used to confirm whether the gold fingers on the upper side of the crimping area are aligned with the gold fingers at the crimping end of the product to be tested (5).

2. The pressure head according to claim 1, characterized in that The alignment structure comprises a light-transmitting window (102) provided on the surface of the first mounting plate (1), and a light source (301) arranged on the second mounting plate (3) and corresponding to the light-transmitting window (102), wherein light emitted by the light source (301) passes through the light-transmitting window (102); a diffusion plate is installed on the light-transmitting window (102), and the side edge of the first circuit board (101) is adjacent to the diffusion plate.

3. The pressure head according to claim 2, characterized in that: The alignment structure further comprises alignment marks (4) symmetrically arranged on both sides of the first circuit board (101), the alignment marks (4) comprising a first mark (401), the first mark (401) being an alignment gold finger arranged parallel to a gold finger on the first circuit board (101).

4. The pressure head according to claim 2, characterized in that: The alignment structure further comprises an alignment mark (4) symmetrically arranged on both sides of the first circuit board (101), the alignment mark (4) comprising a second mark (402), an extension area symmetrically arranged on the first circuit board (101), the second mark (402) being arranged on the extension area; the second mark (402) being at least one light-transmitting hole provided on the extension area, and a through hole corresponding to the light-transmitting hole being provided on the product to be tested (5).

5. The pressure head according to claim 4, characterized in that: A groove area matching the extension area is formed on the side of the diffusion plate adjacent to the first circuit board (101), and the groove area is located in the light-transmitting window (102); when the product to be tested (5) is aligned and placed on the first mounting plate (1), part of the light emitted by the light source (301) on the second mounting plate (3) passes through the light-transmitting window (102), is evenly scattered by the diffusion plate, and irradiates the side edge of the product to be tested (5), and part of the light is emitted through the light-transmitting hole in the extension area of ​​the first circuit board (101) and the through hole of the product to be tested (5).

6. The pressure head according to claim 2, characterized in that: The upper surface of the first mounting plate (1) further comprises a guide area (103) located in front of the light-transmitting window (102); the guide area (103) is arranged in a slope shape for guiding the crimping end of the product to be tested (5).

7. The pressure head according to claim 2, characterized in that: The upper surface of the second mounting plate (3) is provided with a first step and a second step, the second step is higher than the first step, the probe template (2) is mounted on the first step, the surface of the second step is provided with the light source (301), and the position of the light source (301) corresponds to the light-transmitting window (102).

8. The pressure head according to claim 1, characterized in that The probe template (2) comprises a probe board (201), a second circuit board (202) and an adapter board (203) which are installed in sequence, a plurality of probes (2011) are installed on the probe board (201), and the probes (2011) on the probe board (201) are contact-connected with gold fingers on the second circuit board (202) in a one-to-one correspondence.

9. A PIN to PIN alignment method, characterized in that: The method is implemented by using the pressure head described in any one of claims 1 to 8; after the crimping end of the product to be tested (5) is placed on the first mounting plate (1), if no light passes through the through hole of the product to be tested (5), the alignment method is performed, specifically comprising the following steps: S1. Calling the distance information between the first mark (401) and the first gold finger on the first circuit board (101), and the distance information between the second mark (402) and the first gold finger; S2. adjusting the distance between the first gold finger of the crimping end of the product to be tested (5) and the first mark (401), or adjusting the distance between the first gold finger of the crimping end of the product to be tested (5) and the second mark (402), so that the gold finger of the product to be tested (5) is aligned with the gold finger of the first circuit board (101); S3. If light passes through the through hole of the product to be tested (5), the gold fingers of the product to be tested (5) and the first circuit board (101) are aligned; if no light passes through, repeat step S2.

10. A PIN to PIN crimping device, characterized in that: Using the press head described in any one of claims 1 to 8, the press head is divided into a left station configuration (7) and a right station configuration (8); in the left station configuration (7), the first circuit board (101) is arranged in the right area of ​​the first mounting plate (1), and the layout of the press head is arranged according to this configuration; in the right station configuration (8), the first circuit board (101) is arranged in the left area of ​​the first mounting plate (1), and the layout of the press head is arranged according to this configuration.

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