Detection and identification equipment for wafer cassette accessories

Abstract

The invention relates to detection and identification equipment for wafer box accessories, which comprises an equipment shell, and a detection operation cavity is formed in the equipment shell; the detection platform deck is arranged in the detection operation cavity, and the detection platform deck is used for bearing a wafer box to be detected; the first detection module is arranged on the inner wall of the detection operation cavity and is used for detecting whether a first accessory, a second accessory and a third accessory on the wafer box are missing or not; the second detection module is arranged on the detection carrying table and is used for detecting whether a fourth accessory on the wafer box is missing or not; and the identification detection device is arranged on the detection carrying platform and is used for detecting whether the identification chip of the wafer box is missing or not. The detected wafer box can be normally transferred to a semiconductor wafer manufacturing factory, so that the normal production and rhythm of the factory are ensured, and the influence on the production efficiency is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a detection and identification device for wafer box accessories. Background Art

[0002] Wafer boxes are mainly used to place and transport wafers (i.e. single crystal silicon wafers) in semiconductor production. In order to simplify transportation and minimize the risk of contamination, chip manufacturers use wafer boxes to carry and store wafers. There are symmetrical grooves inside the wafer box, and the size is strictly uniform to support both sides of the wafer. Usually, one wafer box can hold 25 wafers. Wafer boxes are generally made of heat-resistant, wear-resistant, and anti-static translucent plastic materials. Additives of different colors are used to distinguish the metal process sections in semiconductor production. Due to the small critical size and dense pattern of semiconductors, the particle size requirements in production are very strict. The wafer box must ensure a clean environment to connect to the micro-environment box reaction chamber of different production machines.

[0003] Typically, a wafer box includes multiple accessories such as a mushroom head and a handle, and the multiple accessories are detachably installed on different sides of the box body. When the wafer box is transferred between different processes, the accessories are very likely to fall and be lost, causing the wafer box to be unusable due to missing accessories when it is transferred to a semiconductor wafer manufacturing factory, affecting the normal production of the factory and reducing production efficiency and rhythm. Summary of the invention

[0004] Based on this, it is necessary to provide a detection and identification device for wafer box accessories to address the problem that accessories are missing and cannot be used, affecting normal production.

[0005] The present application proposes a detection and identification device for wafer box accessories, which includes:

[0006] An equipment housing, wherein a detection operation chamber is formed inside the equipment housing;

[0007] An inspection platform, the inspection platform is arranged inside the inspection working chamber, and the inspection platform is used to carry a wafer box to be inspected;

[0008] A first inspection module, which is arranged on the inner wall of the inspection chamber and is used to detect whether the first accessory, the second accessory and the third accessory on the wafer box are missing;

[0009] a second inspection module, the second inspection module being arranged on the inspection stage and being used for inspecting whether a fourth accessory on the wafer box is missing; and

[0010] An identification detection device is installed on the detection platform and is used to detect whether the identification chip of the wafer box is missing.

[0011] The detection and identification equipment of the present scheme is used in the occasion of detecting and identifying whether there are any missing accessories of the wafer box. Specifically, during operation, the wafer box to be detected is sent to the detection carrier in the detection working chamber, and then the first detection module, the second detection module and the identification detection device are started. At this time, the first detection module can automatically detect whether the first accessory, the second accessory and the third accessory on the wafer box are missing, and the second detection module can automatically detect whether the fourth accessory on the wafer box is missing. At the same time, the identification detection device can automatically detect whether the identification chip on the wafer box is missing. When the detection result shows that all accessories and the identification chip are intact, it indicates that the wafer box meets the production requirements, so that the wafer box after the inspection can be normally transferred to the semiconductor wafer manufacturing factory, ensuring the normal production and rhythm of the factory and avoiding affecting the production efficiency.

[0012] The technical solution of this application is further described below:

[0013] In one embodiment, the detection working chamber includes a first side wall and a second side wall spaced apart and arranged opposite to each other along a first direction of the device housing, the first detection module includes a first infrared sensor and a second infrared sensor, the first infrared sensor is arranged on the first side wall, and the second infrared sensor is arranged on the second side wall and opposite to the first infrared sensor;

[0014] The first infrared sensor cooperates with the second infrared sensor to detect whether the first accessory is missing.

[0015] In one embodiment, the first detection module further includes a third infrared sensor and a fourth infrared sensor, and the third infrared sensor and the fourth infrared sensor are arranged side by side and spaced apart on the first side wall along the second direction of the device housing;

[0016] The third infrared sensor cooperates with the fourth infrared sensor to detect whether the second accessory is missing.

[0017] In one embodiment, the first detection module further includes a fifth infrared sensor and a sixth infrared sensor, and the fifth infrared sensor and the sixth infrared sensor are arranged side by side and spaced apart on the second side wall along the second direction of the device housing;

[0018] The fifth infrared sensor cooperates with the sixth infrared sensor to detect whether the third accessory is missing.

[0019] In one embodiment, the second detection module includes a first pressure sensor, and the first pressure sensor is used to align with the first plug hole on the fourth accessory to detect whether the first plug hole is missing.

[0020] In one embodiment, the second detection module also includes a second pressure sensor, which is staggered with the first pressure sensor along the third direction of the device housing, and the second pressure sensor is used to align with the second plug hole on the fourth accessory to detect whether the second plug hole is missing.

[0021] In one embodiment, the second detection module also includes a third pressure sensor, and the third pressure sensor and the second pressure sensor are arranged side by side along the third direction of the device housing, and the third pressure sensor is used to align with the third plug hole on the fourth accessory to detect whether the third plug hole is missing.

[0022] In one embodiment, the second detection module also includes a fourth pressure sensor, and the fourth pressure sensor is arranged offset from the third pressure sensor along the third direction of the device housing, and the fourth pressure sensor is used to align with the fourth plug hole on the fourth accessory to detect whether the fourth plug hole is missing.

[0023] In one embodiment, the detection platform has a carrying surface, and four positioning convex strips arranged in a rectangular shape are arranged on the carrying surface, and the four positioning convex strips cooperate to form a positioning cavity, and the positioning cavity is used to accommodate a wafer box to be detected;

[0024] The identification detection device is installed on any one of the positioning convex strips.

[0025] In one embodiment, the shell wall of the device housing is provided with an entrance and an exit, a first automatic door is installed at the entrance, and a second automatic door is installed at the exit;

[0026] A transfer mechanism is installed inside the inspection working chamber, and the transfer mechanism is used to transfer the wafer box between the entrance, the inspection stage and the delivery outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1This is a schematic diagram of the structure of a detection and identification device described in one embodiment of the present application.

[0030] Figure 2 It is a structural schematic diagram of the second detection module and the identification detection device installed on the detection carrier.

[0031] Description of reference numerals:

[0032] 100. Detection and identification equipment; 10. Equipment housing; 11. Detection working chamber; 20. Detection platform; 30. First detection module; 31. First infrared sensor; 32. Second infrared sensor; 33. Third infrared sensor; 34. Fourth infrared sensor; 35. Fifth infrared sensor; 36. Sixth infrared sensor; 40. Second detection module; 41. First pressure sensor; 42. Second pressure sensor; 43. Third pressure sensor; 44. Fourth pressure sensor; 50. Identification and detection device; 60. Positioning convex strip; 200. Wafer box; 210. First accessory; 220. Second accessory; 230. Third accessory. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0035] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0037] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0039] See also Figure 1 and Figure 2 , which is a detection and identification device 100 for wafer box 200 accessories shown in one embodiment of the present application, includes a device housing 10, a detection platform 20, a first detection module 30, a second detection module 40 and an identification detection device 50.

[0040] The device housing 10 is, for example, a cubic structure, and is made of any one of stainless steel, acrylic, aluminum alloy, or a combination of at least two or more materials, and has a simple structure and is strong and durable.

[0041] The device housing 10 is installed vertically, that is, the length direction of the device housing 10 is located in the height direction.

[0042] In addition, rollers with foot brakes can be installed at the bottom of the equipment housing 10. The rollers enable the detection and identification equipment 100 to be maneuverable, making it convenient to change the work site. When the detection and identification equipment 100 arrives at the designated work site, operating the foot brake can enable the detection and identification equipment 100 to be reliably positioned in the work site, thereby improving safety and reliability of use.

[0043] An inspection chamber 11 is formed inside the equipment housing 10; an inspection platform 20 is arranged inside the inspection chamber 11, and the inspection platform 20 is used to carry the wafer box 200 to be inspected; a first inspection module 30 is installed on the inner wall of the inspection chamber 11, and is used to detect whether the first accessory 210, the second accessory 220 and the third accessory 230 on the wafer box 200 are missing; a second inspection module 40 is installed on the inspection platform 20, and is used to detect whether the fourth accessory on the wafer box 200 is missing; an identification detection device 50 is installed on the inspection platform 20, and is used to detect whether the identification chip of the wafer box 200 is missing.

[0044] In summary, the implementation of the technical solution of this embodiment will achieve the following beneficial effects: the detection and identification device 100 of this solution is used in situations where it is necessary to detect and identify whether there are any missing accessories of the wafer box 200. Specifically, during operation, the wafer box 200 to be detected is sent to the detection carrier 20 in the detection working chamber 11, and then the first detection module 30, the second detection module 40 and the identification detection device 50 are started. At this time, the first detection module 30 can detect whether the first accessory 210, the second accessory 220 and the third accessory 230 on the wafer box 200 are missing, and the second detection module 40 can detect whether the fourth accessory on the wafer box 200 is missing. At the same time, the identification detection device 50 can detect whether the identification chip on the wafer box 200 is missing. When the detection result shows that all accessories and identification chips are intact, it indicates that the wafer box 200 meets the production requirements, so that the wafer box 200 after the detection can be normally transferred to the semiconductor wafer manufacturing factory, ensuring the normal production and rhythm of the factory and avoiding affecting the production efficiency.

[0045] On the basis of the above-mentioned embodiment, the shell wall of the equipment shell 10 is provided with an entrance and an exit, a first automatic door is installed at the entrance, and a second automatic door is installed at the exit.

[0046] A transfer mechanism is installed inside the inspection working chamber 11 , and the transfer mechanism is used to transfer the wafer box 200 between the entrance, the inspection stage 20 and the delivery outlet.

[0047] In actual use, the detection and identification device 100 cooperates with the feed conveyor line and the discharge conveyor line. The feed conveyor line is installed at the entrance and is used to transport the wafer boxes 200 to the entrance one by one in an orderly manner. The transfer mechanism can grab the wafer boxes 200 one by one and transfer them to the detection platform 20 so that the wafer boxes 200 can be tested. After the inspection of the wafer box 200 is completed, the transfer mechanism grabs the wafer box 200 and transfers it to the discharge conveyor line connected to the delivery port, and the discharge conveyor line transfers the wafer box 200 to the next station. In this way, the automatic inspection of the wafer box 200 can be realized, the inspection efficiency can be improved, and the labor cost can be reduced.

[0048] It is easy to understand that when the first automatic door and the second automatic door are opened, it is convenient for the wafer box to enter and be sent out of the detection working chamber 11. After the first automatic door and the second automatic door are closed, a relatively closed environment is formed in the detection working chamber 11 to prevent light in the external environment from interfering with the detection results.

[0049] Please continue reading Figure 1 and Figure 2 In order to facilitate the understanding of the technical solution, the first accessory 210 mentioned in the present application is specifically the mushroom head of the wafer box 200; the second accessory 220 is specifically the left handle of the wafer box 200; the third accessory 230 is specifically the right handle of the wafer box 200; the fourth accessory is specifically the base of the wafer box 200, and a plurality of plug holes are provided on the base; the identification chip is specifically the RFID chip of the wafer box 200.

[0050] In one embodiment, the detection working chamber 11 includes a first side wall and a second side wall spaced apart and arranged opposite to each other along a first direction of the device housing 10, and the first detection module 30 includes a first infrared sensor 31 and a second infrared sensor 32, wherein the first infrared sensor 31 is arranged on the first side wall, and the second infrared sensor 32 is arranged on the second side wall and opposite to the first infrared sensor 31;

[0051] The first infrared sensor 31 and the second infrared sensor 32 cooperate to detect whether the first accessory 210 is missing.

[0052] The first direction is Figure 1 The X-axis direction.

[0053] It is easy to understand that when the first accessory 210 exists and is not missing, the infrared light emitted between the first infrared sensor 31 and the second infrared sensor 32 will be blocked by the first accessory 210, so that the first infrared sensor 31 and the second infrared sensor 32 cannot form a normal infrared light emission and reception relationship, so that it can be determined that the first accessory 210 is not missing. On the contrary, when the infrared light emitted by the first infrared sensor 31 can be received by the second infrared sensor 32, the infrared light is not blocked by the first accessory 210, so it can be determined that the first accessory 210 is missing.

[0054] The first accessory 210 is a mushroom head, which is convenient for an overhead crane in a semiconductor wafer manufacturing factory to grab the wafer box 200 .

[0055] In yet another embodiment, the first detection module 30 further includes a third infrared sensor 33 and a fourth infrared sensor 34, and the third infrared sensor 33 and the fourth infrared sensor 34 are arranged side by side and spaced apart on the first side wall along the second direction of the device housing 10;

[0056] The third infrared sensor 33 and the fourth infrared sensor 34 cooperate to detect whether the second accessory 220 is missing.

[0057] The second accessory 220 is a left handle, which is installed to extend vertically on the left side of the wafer box 200, that is, along the second direction (i.e., Figure 1 At this time, the third infrared sensor 33 and the fourth infrared sensor 34 correspond to the two ends of the length direction of the left handle respectively. When the left handle exists or is missing, the reciprocating time of the infrared light emitted by the third infrared sensor 33 and the fourth sensor is different, so that it can be accurately determined whether the left handle is missing.

[0058] In one embodiment, the first detection module 30 further includes a fifth infrared sensor 35 and a sixth infrared sensor 36, and the fifth infrared sensor 35 and the sixth infrared sensor 36 are arranged side by side and spaced apart on the second side wall along the second direction of the device housing 10;

[0059] The fifth infrared sensor 35 and the sixth infrared sensor 36 cooperate to detect whether the third accessory 230 is missing.

[0060] The third accessory 230 is a right handle, which is installed to extend vertically on the right side of the wafer box 200, that is, to extend along the second direction (i.e., the height direction) of the device housing 10. At this time, the fifth infrared sensor 35 and the sixth infrared sensor 36 correspond to the two ends of the length direction of the right handle respectively. When the right handle exists or is missing, the reciprocating time of the infrared light emitted by the fifth infrared sensor 35 and the sixth infrared sensor 36 is different, so that it can be accurately determined whether the right handle is missing.

[0061] It should be noted that a left handle and a right handle are respectively installed on the left and right sides of the wafer box 200 , in order to facilitate the staff to manually hold the wafer box 200 .

[0062] In addition, based on any of the above embodiments, the second detection module 40 includes a first pressure sensor 41, and the first pressure sensor 41 is used to align with the first plug hole on the fourth accessory to detect whether the first plug hole is missing.

[0063] Furthermore, the second detection module 40 also includes a second pressure sensor 42, which is staggered with the first pressure sensor 41 along the third direction of the device housing 10. The second pressure sensor 42 is used to align with the second plug hole on the fourth accessory to detect whether the second plug hole is missing.

[0064] Furthermore, the second detection module 40 also includes a third pressure sensor 43, which is arranged side by side with the second pressure sensor 42 along the third direction of the device housing 10, and the third pressure sensor 43 is used to align with the third plug hole on the fourth accessory to detect whether the third plug hole is missing.

[0065] Furthermore, the second detection module 40 also includes a fourth pressure sensor 44, which is staggered with the third pressure sensor 43 along the third direction of the device housing 10. The fourth pressure sensor 44 is used to align with the fourth plug hole on the fourth accessory to detect whether the fourth plug hole is missing.

[0066] When the first plug hole, the second plug hole, the third plug hole and the fourth plug hole are missing, the pressure detection values ​​of the first pressure sensor 41, the second pressure sensor 42, the third pressure sensor 43 and the fourth pressure sensor 44 cannot reach the preset pressure value level. At this time, it can be determined that the first to the fourth plug holes are missing, so that the abnormality of the current wafer box 200 can be identified in time to avoid the wafer box 200 being transferred to the manufacturing plant and unable to be used.

[0067] For example, derivatives (which may be but are not limited to metal plating, etc.) are formed in the first plug hole, the second plug hole, the third plug hole and the fourth plug hole. When the derivatives exist, they will abut against the detection parts of each pressure sensor to increase the pressure detection value of each pressure sensor; on the contrary, when the derivatives are missing, the pressure detection value of each pressure sensor will be significantly reduced.

[0068] Please continue reading Figure 2 In addition, in another embodiment, the detection stage 20 has a bearing surface, and four positioning convex strips 60 arranged in a rectangular shape are arranged on the bearing surface. The four positioning convex strips cooperate to form a positioning cavity, and the positioning cavity is used to accommodate the wafer box 200 to be detected. In this way, the stability of the wafer box 200 placed on the detection stage 20 can be effectively improved.

[0069] Of course, in other optional embodiments, magnetic components, adhesive components, etc. may be provided on the carrying surface for detecting and positioning the wafer box 200, which are also within the protection scope of the present application and will not be described in detail here.

[0070] The identification detection device 50 is mounted on any one of the positioning convex strips 60, so that the identification detection component can be close to and aligned with the identification chip on the wafer box 200, so as to facilitate effective detection of whether the identification chip is missing.

[0071] For example, the identification and detection device 50 can be directly mounted on the surface of the positioning convex strip 60, or can be embedded in a groove on the positioning convex strip 60, and so on.

[0072] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A detection and identification device for wafer box accessories, characterized in that: include: An equipment housing, wherein a detection operation chamber is formed inside the equipment housing; An inspection platform, the inspection platform is arranged inside the inspection working chamber, and the inspection platform is used to carry a wafer box to be inspected; A first inspection module, which is arranged on the inner wall of the inspection working chamber and is used to detect whether the first accessory, the second accessory and the third accessory on the wafer box are missing; A second inspection module, the second inspection module is arranged on the inspection stage, and is used to detect whether the fourth accessory on the wafer box is missing; as well as An identification detection device is installed on the detection platform and is used to detect whether the identification chip of the wafer box is missing.

2. The detection and identification device for wafer box accessories according to claim 1, characterized in that: The detection working chamber comprises a first side wall and a second side wall which are arranged opposite to each other along a first direction of the device housing, the first detection module comprises a first infrared sensor and a second infrared sensor, the first infrared sensor is arranged on the first side wall, and the second infrared sensor is arranged on the second side wall and opposite to the first infrared sensor; The first infrared sensor cooperates with the second infrared sensor to detect whether the first accessory is missing.

3. The detection and identification device for wafer box accessories according to claim 2, characterized in that: The first detection module further includes a third infrared sensor and a fourth infrared sensor, and the third infrared sensor and the fourth infrared sensor are arranged side by side and spaced apart on the first side wall along the second direction of the device housing; The third infrared sensor cooperates with the fourth infrared sensor to detect whether the second accessory is missing.

4. The detection and identification device for wafer box accessories according to claim 3 is characterized in that: The first detection module further includes a fifth infrared sensor and a sixth infrared sensor, wherein the fifth infrared sensor and the sixth infrared sensor are arranged side by side and spaced apart on the second side wall along the second direction of the device housing; The fifth infrared sensor cooperates with the sixth infrared sensor to detect whether the third accessory is missing.

5. The detection and identification device for wafer box accessories according to claim 1, characterized in that: The second detection module includes a first pressure sensor, and the first pressure sensor is used to align with the first plug hole on the fourth accessory to detect whether the first plug hole is missing.

6. The detection and identification device for wafer box accessories according to claim 5, characterized in that: The second detection module also includes a second pressure sensor, which is staggered with the first pressure sensor along the third direction of the device housing. The second pressure sensor is used to align with the second plug hole on the fourth accessory to detect whether the second plug hole is missing.

7. The detection and identification device for wafer box accessories according to claim 6, characterized in that: The second detection module also includes a third pressure sensor, which is arranged side by side with the second pressure sensor along the third direction of the device housing, and the third pressure sensor is used to align with the third plug hole on the fourth accessory to detect whether the third plug hole is missing.

8. The detection and identification device for wafer box accessories according to claim 7, characterized in that: The second detection module also includes a fourth pressure sensor, which is staggered with the third pressure sensor along the third direction of the device housing, and is used to align with the fourth plug hole on the fourth accessory to detect whether the fourth plug hole is missing.

9. The detection and identification device for wafer box accessories according to claim 1, characterized in that: The detection platform has a carrying surface, and four positioning convex strips arranged in a rectangular shape are arranged on the carrying surface. The four positioning convex strips cooperate to form a positioning cavity, and the positioning cavity is used to accommodate a wafer box to be detected; The identification detection device is installed on any one of the positioning convex strips.

10. The detection and identification device for wafer box accessories according to claim 1, characterized in that: The shell wall of the equipment housing is provided with an entrance and an exit, the entrance is provided with a first automatic door, and the exit is provided with a second automatic door; A transfer mechanism is installed inside the inspection working chamber, and the transfer mechanism is used to transfer the wafer box between the entrance, the inspection stage and the delivery outlet.

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