Method for monitoring chip production process

Abstract

The invention provides a method for monitoring a chip production process. The method comprises the following steps: carrying out multi-test-station test, basic function test, appearance inspection and characteristic inspection on a chip; all detection results tested by the multiple test stations are summarized and sent to the distributed control system; the distributed control system is connected with the MES system; one virtual site of the MES system is a data station; the data station interactively communicates with the distributed control system, and the data station asks whether the chip is qualified or not; the distributed control system judges whether the chip is qualified or not and feeds back a judgment result to the data station; and after receiving the feedback that the chip is finally qualified, the data station notifies the MES system to flow the chip into a packaging link. According to the invention, multi-test-station analysis is carried out on test data, and possible quality problems in a production process are detected. According to the invention, the system replaces a manual inspection test process, so that the inspection efficiency and reliability can be improved. And through communication with the MES system, checking results of multiple test stations are checked, so that complete-process monitoring of MES systematization is realized.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit manufacturing, and in particular relates to a method for monitoring a chip production process. Background Art

[0002] As a core component of modern electronic devices, semiconductor chips are particularly important for quality management. Reliable semiconductor chip quality can not only ensure the performance and stability of the equipment, but also help protect the interests of users. Automotive chips have more stringent quality requirements. Each automotive chip has unique identity information. Any problem in any link of the chip will affect the user experience. Before the improvement, the process quality control of automotive chips was mainly manual inspection and confirmation, which was inefficient, error-prone, and had low reliability. Summary of the invention

[0003] The purpose of the present invention is to provide a method for monitoring the chip production process, perform multi-test station analysis on the test data, and detect quality problems that may occur in the production process. By replacing the manual inspection test process with the system, the efficiency and reliability of the inspection can be improved; and by communicating the inspection results of multiple test stations with the MES system, the full process monitoring of the MES system can be realized.

[0004] The present invention provides a method for monitoring a chip production process, comprising:

[0005] The chip is subjected to a multi-test station test, wherein the multi-test station test includes: basic function test, appearance inspection and characteristic inspection;

[0006] The test results of the multiple test stations are all collected and sent to a distributed control system, the distributed control system is connected to the MES system; a virtual station of the MES system is a data station;

[0007] The data station communicates interactively with the distributed control system, and the data station makes an inquiry request whether the chip is qualified; the distributed control system determines whether the chip is qualified and feeds back the judgment result to the data station; when each of the test results of the multi-test station test is qualified, the distributed control system determines that the chip is finally qualified; if any one of the test results of the multi-test station test is unqualified, the chip is determined to be finally unqualified;

[0008] After receiving the feedback that the chip is finally qualified, the data station notifies the MES system to flow the chip into the packaging link.

[0009] Furthermore, the basic function test includes an electrical performance test and an image test. The electrical performance test includes an open circuit and short circuit test of the chip; the image test includes testing whether the image of the chip is displayed normally and whether there are any abnormal points in the image.

[0010] Furthermore, the basic function test is performed at different temperatures. If the tested chip exhibits a preset ideal performance at a preset temperature, the test is qualified; if the tested chip exhibits a preset ideal performance at a non-preset temperature, or exhibits undesirable performance at a preset temperature, the test is unqualified.

[0011] Furthermore, the method for monitoring the chip production process also includes: uploading the appearance inspection data to the server of the distributed control system, and performing a chip identity information check to check whether the value in the chip register is written incorrectly during the test process. The identity information is also called a chip characteristic value.

[0012] Furthermore, the distributed control system includes the server and several computers connected to the server, and the server is connected to the MES system for interactive communication.

[0013] Furthermore, after the chip is tested at multiple test stations, the chip is placed at a preset high temperature for a preset time for baking to remove moisture from the chip; within the preset time of baking, the distributed control system confirms the test results of the multiple test station test;

[0014] The preset high temperature range is: 200°C to 250°C; the preset time range is: 18h to 30h.

[0015] Furthermore, the characteristic check includes: multi-test station cross-validation to check whether quality events such as defective products or untested products mixed with good products occur during the test process; working voltage detection to check whether the machine supply voltage is abnormal; hardware link confirmation to check whether the machine interface is connected normally.

[0016] Furthermore, the initial values ​​of the test results of the basic function test, the appearance inspection and the characteristic inspection in the distributed control system are all defaulted to -1. After judgment by the distributed control system, a qualified test result of each item is assigned a value of 1, and an unqualified test result of each item is assigned a value of 0.

[0017] Furthermore, the chip includes an on-board chip, and unique identity information is stored in the on-board chip.

[0018] Furthermore, after receiving the feedback that the chip is finally unqualified, the data station notifies the MES system to rework.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention provides a method for monitoring chip production process, including: S1, multi-test station test of the chip, the multi-test station test includes: basic function test, appearance inspection and characteristic inspection; S2, all the test results of the multi-test station test are summarized and sent to a distributed control system, the distributed control system is connected to the MES system; a virtual site of the MES system is a data station; S3, the data station interacts with the distributed control system, the data station asks whether the chip is qualified; the distributed control system judges whether the chip is qualified, and feeds back the judgment result to the data station; when each of the test results of the multi-test station test is qualified, the distributed control system judges that the chip is finally qualified; if any one of the test results of the multi-test station test is unqualified, the chip is judged to be finally unqualified; S4, after the data station receives the feedback that the chip is finally qualified, it notifies the MES system to flow the chip into the packaging link. The present invention performs multi-test station analysis on the test data to detect quality problems that may occur in the production process. Before the improvement, it is manual inspection and confirmation. The present invention replaces the manual inspection test process by the system, which can improve the efficiency and reliability of the inspection. And by communicating the inspection results of multiple test stations with the MES system, MES systematic full-process monitoring can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The present invention is a flowchart of a method for monitoring a chip production process according to an embodiment of the present invention.

[0022] Figure 2 A schematic diagram of a system used in a method for monitoring a chip production process according to an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are in a very simplified form and use an inaccurate scale, which is only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0024] For ease of description, some embodiments of the present application may use spatially relative terms such as "above", "below", "top", "below", etc. to describe the relationship between one element or component and another (or other) elements or components as shown in the various figures of the embodiments. It should be understood that in addition to the test stations described in the drawings, the spatially relative terms are also intended to include different test stations of the device in use or operation. For example, if the device in the drawings is turned over, the elements or components described as being "below" or "beneath" other elements or components will subsequently be positioned as being "above" or "above" other elements or components. The terms "first", "second", etc. hereinafter are used to distinguish between similar elements and are not necessarily used to describe a specific order or time sequence. It is to be understood that these terms used in this way are interchangeable where appropriate.

[0025] The embodiment of the present invention provides a method for monitoring a chip production process, such as Figure 1 As shown, including:

[0026] S1. The chip is tested at multiple test stations, including basic function test, appearance inspection and characteristic inspection;

[0027] S2. All the test results of multiple test stations are collected and sent to the distributed control system, which is connected to the MES system; a virtual station of the MES system is a data station;

[0028] S3, the data station communicates with the distributed control system, and the data station asks whether the chip is qualified; the distributed control system determines whether the chip is qualified and feeds back the judgment result to the data station; when each of the test results of the multi-test station test is qualified, the distributed control system determines that the chip is finally qualified; if any of the test results of the multi-test station test is unqualified, the chip is finally determined to be unqualified;

[0029] S4. After receiving the feedback that the chip is finally qualified, the data station notifies the MES system to flow the chip into the packaging stage.

[0030] The following describes in detail the steps of the method for monitoring chip production process according to an embodiment of the present invention.

[0031] like Figure 2 As shown, in the method for monitoring the chip production process of the embodiment of the present invention, an on-board chip quality control system is used, and the on-board chip quality control system includes a distributed control system and an MES system, and the MES system is connected to the distributed control system. The distributed control system includes a server and several computers connected to the server, and the server is connected to the MES system for interactive communication.

[0032] A distributed control system is a system used to monitor and control various process flows and equipment in an industrial environment. It adopts the basic design concept of decentralized control and centralized operation and management, and realizes centralized management and decentralized control through a multi-layer hierarchical, cooperative and autonomous structure. A distributed control system distributes control functions to multiple sites, each of which is responsible for controlling a specific part. These sites are connected through a communication network to achieve data interaction and collaborative work. Although the control functions are decentralized, the operation and management are concentrated in the central control room to achieve centralized management of the entire system.

[0033] MES (Manufacturing Execution System) is a production information management system for the workshop execution layer of manufacturing enterprises. MES can provide enterprises with management modules including manufacturing data management, planning and scheduling management, production scheduling management, inventory management and quality management, and build a solid, reliable, comprehensive and feasible manufacturing collaborative management platform for enterprises. The MES system has functions such as process management, unit management, production tracking, performance analysis, document management, process management, quality management and data collection. It provides operators and managers with information on the execution and tracking of plans and the current status of all resources.

[0034] Step S1, the chip is subjected to multi-test station testing, which includes: basic function test, appearance inspection and characteristic inspection. The basic function test includes electrical performance test and image test. The electrical performance test includes open circuit and short circuit test of the chip; the image test includes testing whether the image of the chip is displayed normally and whether there are abnormal points in the image, such as black spots, spots and other abnormal images.

[0035] Perform basic functional tests at different temperatures, such as testing electrical performance at 10°C and 20°C; if the tested chip exhibits the preset ideal performance at the preset temperature, the test is qualified; if the tested chip exhibits the preset ideal performance at a non-preset temperature, or exhibits undesirable performance at the preset temperature, the test is unqualified.

[0036] The appearance inspection data is uploaded to the server of the distributed control system, and the chip identity information is checked to check whether the value in the chip register is written by mistake during the test. The identity information is also called the chip characteristic value. If the value in the chip register is written by mistake, the customer will not be able to use it. The chip includes the vehicle chip, which stores the unique identity information.

[0037] Feature checks include: multi-test station cross-validation to check whether quality incidents such as defective products or untested products being mixed with good products occur during the test process; working voltage detection to check whether the machine supply voltage is abnormal; and hardware link confirmation to check whether the machine interface is connected normally.

[0038] S2. All the test results of multiple test stations are summarized and sent to the distributed control system, which is connected to the MES system; a virtual station of the MES system is a data station.

[0039] S3. The data station communicates with the distributed control system, and the data station asks whether the chip is qualified; the distributed control system determines whether the chip is qualified and feeds back the judgment result to the data station; when each test result of the multi-test station test is qualified, the distributed control system determines that the chip is finally qualified; if any one of the test results of the multi-test station test is unqualified, the chip is finally determined to be unqualified; the initial values ​​of the test results of the basic function test, appearance inspection and characteristic inspection in the distributed control system are all defaulted to -1. After judgment by the distributed control system, each test result is assigned a value of 1 if it is qualified, and a value of 0 if it is unqualified.

[0040] After the chip is tested at multiple test stations, it is placed at a preset high temperature for a preset time to be baked to remove moisture from the chip; during the preset baking time, the distributed control system confirms the test results of the multiple test stations and ultimately determines whether the chip is qualified; the preset high temperature range is: 200℃~250℃; the preset time range is: 18h~30h. The chip is placed at a high temperature for a preset time to remove moisture from the chip and prepare for packaging, in order to prevent moisture from affecting chip performance during transportation; packaging is performed after moisture is removed.

[0041] S4. After receiving the feedback that the chip is finally qualified, the data station notifies the MES system to flow the chip into the packaging link. After receiving the feedback that the chip is finally unqualified, the data station notifies the MES system to rework.

[0042] After uploading the data generated by the site to be tested to the server, the present invention performs multi-test station analysis and transmits the inspection results to the distributed control system; and checks the results at the data station to perform material control. The multi-test station analysis function developed based on manual inspection logic performs multi-test station analysis on the test data. The test results of multiple test stations are summarized at the data station, and the status of the material is returned upon receiving the MES request. Material status judgment is performed in the MES system to achieve MES systematic full-process monitoring. The vehicle-mounted chip quality control method of the present invention can be used to detect specific quality problems that occur during the vehicle-mounted chip testing process, prevent specific types of customer complaints, improve test process control, and improve product reliability.

[0043] The chip storage information confirmation of the present invention can check whether the value in the chip register is written by mistake during the test process. Multi-test station cross-validation can check whether quality events such as defective products or untested products mixed with good products occur during the test process. Working voltage detection can check whether the machine supply voltage is abnormal. Hardware link confirmation can check whether the machine interface is connected normally. The distributed control system performs a multi-faceted analysis of the test data, and synchronously realizes the full-process monitoring of the MES system through chip storage identity information confirmation, multi-test station cross-validation, working voltage detection and hardware link confirmation, and finally achieves the quality control requirements of the electrical and image performance of the shipped on-board chips.

[0044] In summary, the present invention provides a method for monitoring a chip production process, including: S1, performing a multi-test station test on the chip, the multi-test station test includes: basic function test, appearance inspection and characteristic inspection; S2, summarizing all the test results of the multi-test station test and sending them to a distributed control system, the distributed control system is connected to the MES system; a virtual site of the MES system is a data station; S3, the data station interacts with the distributed control system, the data station asks whether the chip is qualified; the distributed control system determines whether the chip is qualified, and feeds back the judgment result to the data station; when each of the test results of the multi-test station test is qualified, the distributed control system determines that the chip is finally qualified; if any one of the test results of the multi-test station test is unqualified, the chip is determined to be finally unqualified;

[0045] S4. After receiving the feedback that the chip is finally qualified, the data station notifies the MES system to flow the chip into the packaging link. The present invention performs multi-test station analysis on the test data to detect quality problems that may occur in the production process. Before the improvement, it was manual inspection and confirmation. The present invention replaces the manual inspection test process with a system to improve the efficiency and reliability of the inspection. And by communicating the inspection results of multiple test stations with the MES system, the full process monitoring of the MES system is realized.

[0046] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the method disclosed in the embodiment, since it corresponds to the device disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0047] The above description is only a description of the preferred embodiment of the present invention, and is not any limitation on the scope of rights of the present invention. Any technical personnel in this field can make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A method for monitoring a chip production process, characterized in that: include: The chip is subjected to a multi-test station test, wherein the multi-test station test includes: basic function test, appearance inspection and characteristic inspection; The test results of the multiple test stations are all collected and sent to a distributed control system, the distributed control system is connected to the MES system; a virtual station of the MES system is a data station; The data station communicates interactively with the distributed control system, and the data station makes an inquiry request whether the chip is qualified; the distributed control system determines whether the chip is qualified and feeds back the judgment result to the data station; when each of the test results of the multi-test station test is qualified, the distributed control system determines that the chip is finally qualified; if any one of the test results of the multi-test station test is unqualified, the chip is determined to be finally unqualified; After receiving the feedback that the chip is finally qualified, the data station notifies the MES system to flow the chip into the packaging link.

2. The method for monitoring chip production process according to claim 1, characterized in that: The basic function test includes an electrical performance test and an image test. The electrical performance test includes an open circuit and short circuit test of the chip; the image test includes testing whether the image of the chip is displayed normally and whether there are any abnormal points in the image.

3. The method for monitoring chip production process according to claim 2, characterized in that: The basic functional test is performed at different temperatures. If the tested chip exhibits the preset ideal performance at the preset temperature, the test is qualified; If the tested chip exhibits the preset ideal performance at a non-preset temperature, or exhibits undesirable performance at the preset temperature, the test fails.

4. The method for monitoring chip production process according to claim 1, characterized in that: Also includes: The appearance inspection data is uploaded to the server of the distributed control system, and the chip identity information is checked to check whether the value in the chip register is written incorrectly during the test process. The identity information is also called the chip characteristic value.

5. The method for monitoring chip production process according to claim 4, characterized in that: The distributed control system includes the server and several computers connected to the server, and the server is connected to the MES system for interactive communication.

6. The method for monitoring chip production process according to claim 1, characterized in that: After the chip is tested at multiple test stations, the chip is placed at a preset high temperature for a preset time for baking to remove moisture from the chip; within the preset time of baking, the distributed control system confirms the test results of the multiple test station tests; The preset high temperature range is: 200°C to 250°C; the preset time range is: 18h to 30h.

7. The method for monitoring chip production process according to claim 1, characterized in that: The characteristic inspection includes: multi-test station cross-validation to check whether quality incidents of defective products or untested products mixed with good products occur during the test process; working voltage detection to check whether the machine supply voltage is abnormal; hardware link confirmation to check whether the machine interface is connected normally.

8. The method for monitoring chip production process according to claim 1, characterized in that: The initial values ​​of the test results of the basic function test, the appearance inspection and the characteristic inspection are all defaulted to -1 in the distributed control system. After judgment by the distributed control system, a qualified test result of each item is assigned a value of 1, and an unqualified test result of each item is assigned a value of 0.

9. The method for monitoring chip production process according to claim 1, characterized in that: The chip includes an on-board chip, and unique identity information is stored in the on-board chip.

10. The method for monitoring chip production process according to claim 1, characterized in that: After receiving the feedback that the chip is finally unqualified, the data station notifies the MES system to rework.

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