Integrated circuit temperature adjusting method and integrated circuit

Abstract

The invention relates to an integrated circuit temperature adjusting method and an integrated circuit. The integrated circuit temperature adjustment method comprises the following steps: dividing temperature measurement points of a circuit to be subjected to temperature measurement, and monitoring the temperature of each temperature measurement point through a temperature sensor; if the temperature of the temperature measuring point exceeds a preset threshold value, frequency-power derivation is carried out based on a frequency-power-temperature three-dimensional model, and the corresponding frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value is determined; the frequency-power-temperature three-dimensional model comprises an incidence relation among the frequency, the power and the temperature; based on the corresponding frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the circuit to be subjected to temperature measurement is carried out, so that the temperature of the temperature measurement point is reduced, and the safety of the integrated circuit during working is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of integrated circuits, and in particular to an integrated circuit temperature adjustment method and an integrated circuit. Background Art

[0002] Integrated circuits are widely used in various fields, such as environmental monitoring, medical equipment, industrial automation, and household appliances. Integrated circuits generate heat during operation, which causes the temperature of the integrated circuit to rise. Excessive temperature of the integrated circuit will affect the performance of the integrated circuit or even burn it. Therefore, temperature detection is essential to ensure stable operation of the circuit. Summary of the invention

[0003] In view of this, the embodiments of the present disclosure are intended to provide an integrated circuit temperature adjustment method and an integrated circuit.

[0004] The technical solution of the present disclosure is achieved as follows:

[0005] In a first aspect, the present disclosure provides a method for adjusting temperature of an integrated circuit.

[0006] The integrated circuit temperature adjustment method provided by the embodiment of the present disclosure includes:

[0007] The temperature measurement points of the temperature measurement circuit to be measured are divided, and the temperature of each temperature measurement point is monitored by a temperature sensor; if the temperature of the temperature measurement point exceeds a predetermined threshold, the frequency-power derivation is performed based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value; wherein the frequency-power-temperature three-dimensional model contains the correlation relationship between frequency, power and temperature;

[0008] Based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the circuit to be measured is performed to reduce the temperature of the temperature measurement point.

[0009] In some embodiments, the frequency-power-temperature three-dimensional model is:

[0010] T(P, F)=(CL*Vdd 2 *Ptran*F+ttran*P*F)*Rjc; where

[0011] P is the power of the temperature-measured circuit; T is the surface temperature of the chip package; CL is the load capacitance; Vdd is the power supply voltage in the temperature-measured circuit; Ptran is the signal flip probability;

[0012] ttran is the signal switching time; Ipeak is the peak current; Rjc is the thermal resistance between the heat source node of the chip and the package shell; F is the clock frequency.

[0013] In some embodiments, the frequency-power derivation based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value includes:

[0014] Frequency-Power-Temperature 3D Model

[0015] T(P, F)=(CL*Vdd 2 *Ptran*F+ttran*P*F)*Rjc calculates the quadratic partial derivatives of power and frequency, and determines that the minimum value of the quadratic partial derivative of power is the power corresponding to when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, and the minimum value of the quadratic partial derivative of frequency is the frequency corresponding to when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value.

[0016] In some embodiments, the frequency-power adjustment of the device in the temperature-measured circuit based on the frequency-power corresponding to the temperature adjustment to the minimum value to reduce the temperature of the temperature measurement point includes:

[0017] Obtain the current frequency-power of the device in the circuit to be measured;

[0018] Determine the frequency-power variation based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value and the current frequency-power of the device in the circuit to be measured;

[0019] Based on the frequency-power variation as an adjustment parameter, the frequency-power of the device in the temperature measurement circuit is adjusted.

[0020] In some embodiments, including:

[0021] If the temperature at the temperature measuring point is not lowered to the safe operating temperature of the device when the frequency-power adjustment of the device in the circuit to be measured is performed based on the frequency-power corresponding to the frequency-power when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, then task migration is initiated and the task of the regional circuit whose temperature at the temperature measuring point exceeds the predetermined threshold is allocated to the regional circuit whose temperature at the temperature measuring point is lower than the predetermined threshold.

[0022] In some embodiments, including:

[0023] If the temperature at the measuring point exceeds the preset threshold, a temperature alarm will be issued;

[0024] When the temperature at the temperature measuring point is lower than the preset threshold, the temperature alarm at the temperature measuring point is released.

[0025] In some embodiments, based on the frequency-power-temperature three-dimensional model, frequency-power derivation is performed to determine the frequency-power before the frequency-power corresponding to the volume of the frequency-power-temperature three-dimensional model when the volume is adjusted to the minimum value, the method includes:

[0026] The collected temperature of the temperature measuring point is stored in the temperature database;

[0027] When determining whether the temperature of a temperature measuring point exceeds a predetermined threshold, the temperature of a target temperature measuring point is read in an area corresponding to the target temperature measuring point in the temperature database; wherein the temperatures of temperature measuring points at different positions are stored in different areas of the temperature database.

[0028] In a second aspect, the present disclosure provides an integrated circuit, comprising:

[0029] A temperature sensing circuit is used to collect the temperature of the temperature measuring point and transmit the temperature data to the adaptive adjustment algorithm module;

[0030] An adaptive adjustment algorithm module is connected to the temperature sensing circuit, and is used to collect the frequency, power and temperature data of the device in the circuit to be measured, and to perform frequency-power derivation based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value; wherein the frequency-power-temperature three-dimensional model includes the correlation between frequency, power and temperature; and

[0031] Based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the circuit to be measured is performed to reduce the temperature of the temperature measurement point.

[0032] In some embodiments, including:

[0033] A power monitoring circuit is connected to the adaptive adjustment algorithm module and is used to monitor the voltage and current changes of the components in the temperature measurement circuit in real time and transmit the power data to the adaptive adjustment algorithm module;

[0034] The frequency monitoring circuit is connected to the adaptive adjustment algorithm module and is used to monitor the frequency change in real time and transmit the frequency data to the adaptive adjustment algorithm module.

[0035] In some embodiments, including:

[0036] A task scheduling circuit is connected to the adaptive adjustment algorithm module, and is used to start task migration if the temperature of the temperature measuring point is not reduced to the safe working temperature of the device when the frequency-power corresponding to the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, and the task of the regional circuit whose temperature of the temperature measuring point exceeds the predetermined threshold is allocated to the regional circuit whose temperature of the temperature measuring point is lower than the predetermined threshold when the frequency-power of the device in the circuit to be measured is adjusted.

[0037] A voltage generating circuit, connected to the adaptive adjustment algorithm module, for outputting a corresponding voltage according to input parameters;

[0038] A frequency adjustment circuit, connected to the adaptive adjustment algorithm module, is used to generate a corresponding PLL frequency division coefficient according to the target frequency and send it to the frequency generation circuit;

[0039] A frequency generating circuit, connected to the frequency adjusting circuit, for generating a target frequency according to a frequency division coefficient of the PLL;

[0040] The power regulation circuit is connected to the adaptive regulation algorithm module and is used to generate a regulation voltage or a voltage for shutting down a part of the circuit according to a minimum power parameter.

[0041] According to the integrated circuit temperature adjustment method of the embodiment of the present disclosure, the method includes: dividing the temperature measurement points of the temperature measurement circuit to be measured, and monitoring the temperature of each temperature measurement point by a temperature sensor; if the temperature of the temperature measurement point exceeds a predetermined threshold value, based on the frequency-power-temperature three-dimensional model, performing frequency-power derivation to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value; wherein the frequency-power-temperature three-dimensional model includes the correlation between frequency, power and temperature; based on the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the temperature measurement circuit is performed to reduce the temperature of the temperature measurement point. In the present application, when adjusting the temperature of the integrated circuit, the frequency-power derivative is performed based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value; based on the frequency-power corresponding to the frequency-power when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the temperature-measured circuit is performed to reduce the temperature of the temperature measurement point. Among them, the product of the three quantities of frequency-power-temperature can be used to represent the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model. When the frequency-power-temperature corresponds to the frequency-power when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the heat generated by the integrated circuit under the frequency-power is relatively low, which is most beneficial for cooling the temperature-measured circuit, thereby improving the safety of the integrated circuit during operation.

[0042] Additional aspects and advantages of the present disclosure will be given in part in the following description and in part will be obvious from the following description or learned through practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 is a flow chart of a method for adjusting temperature of an integrated circuit according to an exemplary embodiment;

[0044] Figure 2 is a schematic diagram of a circuit structure of a temperature sensing module according to an exemplary embodiment;

[0045] Figure 3 is a flow chart of integrated circuit temperature adjustment according to an exemplary embodiment;

[0046] Figure 4 is a schematic diagram of an integrated circuit structure according to an exemplary embodiment. DETAILED DESCRIPTION

[0047] Embodiments of the present disclosure are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, and should not be construed as limiting the present disclosure.

[0048] Integrated circuits are widely used in various fields, such as environmental monitoring, medical equipment, industrial automation, and household appliances. Integrated circuits generate heat during operation, which causes the temperature of the integrated circuit to rise. Excessive temperature of the integrated circuit will affect the performance of the integrated circuit or even burn it. Therefore, temperature detection is essential to ensure stable operation of the circuit.

[0049] In view of the above situation, the present disclosure provides a temperature adjustment method for an integrated circuit. Figure 1 FIG. 1 is a flow chart of a method for adjusting temperature of an integrated circuit according to an exemplary embodiment. Figure 1 As shown, the integrated circuit temperature adjustment method includes:

[0050] Step 10, dividing the temperature measurement points of the temperature measurement circuit to be measured, and monitoring the temperature of each temperature measurement point through a temperature sensor; if the temperature of the temperature measurement point exceeds a predetermined threshold, then based on the frequency-power-temperature three-dimensional model, performing frequency-power derivation, and determining the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value; wherein the frequency-power-temperature three-dimensional model contains the correlation relationship between frequency, power and temperature;

[0051] Step 11: Based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power of the device in the circuit to be measured is adjusted to reduce the temperature of the temperature measurement point.

[0052] In this exemplary embodiment, when dividing the temperature measurement points of the temperature measurement circuit, a three-dimensional spatial division can be performed according to the hierarchical layout of the temperature measurement circuit. Figure 2 The figure is a schematic diagram of a circuit structure of a temperature sensing module according to an exemplary embodiment.

[0053] like Figure 2As shown, temperature measuring points and temperature measuring circuits with i rows and j columns are placed on each metal layer of the chip. For example, the temperature measuring point of the M1th layer is recorded as M1(i,j), and the temperature measuring point of the M2th layer is recorded as M2(i,j). By analogy, the temperature measuring point of the Mnth layer is recorded as Mn(i,j). In this way, the chip designed with n metal layers is divided into n*i*j temperature points, and then the monitored temperature of each temperature point is collected into the temperature database according to the data with T(n,i,j) as the ID, and then read and write control and temperature analysis are performed. When the set temperature is exceeded, the temperature alarm module will automatically alarm and output it to the upper processing module. In this application, temperature measurement and monitoring can be performed on all temperature measuring points of the temperature measuring circuit to be measured at the same time. Among them, T(n,i,j) represents the temperature of the temperature measuring point at the temperature measuring point Mn(i,j) of the nth metal layer.

[0054] In this exemplary embodiment, the frequency-power-temperature three-dimensional model can be established in advance according to the circuit characteristics of the integrated circuit. The frequency-power-temperature three-dimensional model may include the correlation relationship between the frequency-power-temperature and the mutual influence of the three. When the frequency-power-temperature corresponds to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the heat generated by the integrated circuit under the frequency-power is relatively low, which is most beneficial for cooling the circuit to be measured. Therefore, in this application, based on the frequency-power-temperature three-dimensional model, the frequency-power can be derived to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value. Then, based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the circuit to be measured is performed to reduce the temperature of the temperature measurement point. Since the volume of frequency-power-temperature in the frequency-power-temperature three-dimensional model is the smallest, the temperature of the integrated circuit is also reduced to the lowest under the condition that the integrated circuit works normally, so the frequency-power when the temperature of the integrated circuit is reduced to the lowest is determined; then the frequency-power adjustment of the device in the circuit to be measured is performed to reduce the temperature of the temperature measurement point, which is conducive to improving the safety of the integrated circuit during operation. Among them, the product of the three quantities of frequency-power-temperature can be used to represent the volume of frequency-power-temperature in the frequency-power-temperature three-dimensional model.

[0055] In some embodiments, the frequency-power-temperature three-dimensional model is:

[0056] T(P, F)=(CL*Vdd 2 *Ptran*F+ttran*P*F)*Rjc; where

[0057] P is the power of the temperature circuit to be measured; Tc is the surface temperature of the chip package; CL is the load capacitance; Vdd is the power supply voltage in the temperature circuit to be measured; Ptran is the signal flip probability;

[0058] ttran is the signal switching time; Ipeak is the peak current; Rjc is the thermal resistance between the heat source node of the chip and the package shell; F is the clock frequency.

[0059] In this exemplary embodiment, the temperature of the circuit to be measured is determined by the formula Tj=Tc+P*Rjc; wherein P=CL*Vdd 2 *Ptran*F+ttran*Vdd*Ipeak*F; P is the power of the temperature-measured circuit; Tj is the silicon core temperature of the chip, that is, the temperature of the temperature-measured point of the core temperature-measured circuit inside the chip, which is the sum of the chip surface ambient temperature Tc and the chip circuit real temperature T; Tc is the chip package surface temperature, that is, the chip package surface temperature, which is equal to the ambient temperature when the chip is not working; Rjc is the thermal resistance between the heat source node of the chip and the package shell;

[0060]

[0061] make

[0062] Because the initial temperature of the chip package surface temperature Tc is the ambient temperature and is a constant when the ambient conditions remain unchanged, the main variable in the above formula is T, which changes with power P and frequency F, that is, T(P, F). First observe T(P, F) = (CL*Vdd 2 *Ptran*F+ttran*P*F)*Rjc function has the properties of continuity and differentiability. If the function is continuous and differentiable, the extreme point can be found by differentiation to determine the frequency-power-temperature corresponding to the minimum value when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value.

[0063] In some embodiments, the frequency-power derivation based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value includes:

[0064] Frequency-Power-Temperature 3D Model

[0065] T(P, F)=(CL*Vdd 2*Ptran*F+ttran*P*F)*Rjc calculate the quadratic partial derivative of power and frequency, and determine that the minimum value of the quadratic partial derivative of power is the power corresponding to when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, and the minimum value of the quadratic partial derivative of frequency is the frequency corresponding to when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value; where CL is the load capacitance; Vdd is the power supply voltage in the temperature measurement circuit; Ptran is the signal flip probability; ttran is the signal flip time; Ipeak is the peak current; Rjc is the thermal resistance between the heat source node of the chip and the package shell; F is the clock frequency.

[0066] In this exemplary embodiment, the partial derivatives of T with respect to power P and frequency F are calculated respectively. and make and Solve for possible extreme points. Then use the second-order partial derivatives to determine whether these extreme points are maxima or minima. Calculate the second-order partial derivatives and mixed second-order partial derivatives According to the discriminant To judge; if D>0 and or Then the power or frequency is the minimum point;

[0067] If D>0 and or Then the power or frequency is a maximum point; if D<0, then the power or frequency is a saddle point.

[0068] Then compare the function values ​​at all minimum points and the function values ​​at the boundary points to determine the minimum power and minimum frequency.

[0069] In some embodiments, the frequency-power adjustment of the device in the temperature-measured circuit based on the frequency-power corresponding to the temperature adjustment to the minimum value to reduce the temperature of the temperature measurement point includes:

[0070] Obtain the current frequency-power of the device in the circuit to be measured;

[0071] Determine the frequency-power variation based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value and the current frequency-power of the device in the circuit to be measured;

[0072] Based on the frequency-power variation as an adjustment parameter, the frequency-power of the device in the temperature measurement circuit is adjusted.

[0073] In this exemplary embodiment, after obtaining the frequency-power corresponding to the frequency-power-temperature when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value based on the above method, the frequency-power change is determined based on the frequency-power corresponding to the frequency-power-temperature when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value and the current frequency-power of the device in the circuit to be measured. That is, the frequency-power corresponding to the frequency-power-temperature when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value is subtracted from the current frequency-power of the device in the circuit to be measured to obtain the difference, and the difference is used as the frequency-power change. Then, based on the frequency-power change as an adjustment parameter, the frequency-power of the device in the circuit to be measured is adjusted, thereby reducing the temperature of the temperature measurement point, which is beneficial to improving the safety of the integrated circuit during operation.

[0074] This application monitors the temperature of each point of the chip at a microscopic level (the degree of microscopic level depends on the number of Mn(i,j) temperature measurement points). When a multi-core processor is co-processing tasks, the temperature change of each area can be known, so that an adaptive adjustment algorithm can be used to find the most suitable or optimal balance point between frequency, power and temperature, so that performance and power consumption can reach the optimal state and balance state, greatly reducing clock consumption and improving the overall performance of the multi-core processor.

[0075] In some embodiments, including:

[0076] If the temperature at the temperature measuring point is not lowered to the safe operating temperature of the device when the frequency-power adjustment of the device in the circuit to be measured is performed based on the frequency-power corresponding to the frequency-power when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, then task migration is initiated and the task of the regional circuit whose temperature at the temperature measuring point exceeds the predetermined threshold is allocated to the regional circuit whose temperature at the temperature measuring point is lower than the predetermined threshold.

[0077] In this exemplary embodiment, when the temperature exceeds a certain set value, the adaptive adjustment algorithm is started to calculate the most appropriate frequency and power parameters; then the frequency and power are adjusted and iterations continue. If the temperature cannot be lowered, the task migration method can also be used to adjust the tasks in the high temperature area to the low temperature area for execution.

[0078] In some embodiments, including:

[0079] If the temperature at the measuring point exceeds the preset threshold, a temperature alarm will be issued;

[0080] When the temperature at the temperature measuring point is lower than the preset threshold, the temperature alarm at the temperature measuring point is released.

[0081] In this exemplary embodiment, for the safety of integrated circuit operation, when the temperature of a measuring point exceeds a predetermined threshold, a temperature alarm may be issued to indicate which measuring point has too high a temperature and may damage the chip, so as to quickly cool the temperature and improve the safety of integrated circuit operation.

[0082] In some embodiments, based on the frequency-power-temperature three-dimensional model, frequency-power derivation is performed to determine the frequency-power before the frequency-power corresponding to the volume of the frequency-power-temperature three-dimensional model when the volume is adjusted to the minimum value, the method includes:

[0083] The collected temperature of the temperature measuring point is stored in the temperature database;

[0084] When determining whether the temperature of a temperature measuring point exceeds a predetermined threshold, the temperature of a target temperature measuring point is read in an area corresponding to the target temperature measuring point in the temperature database; wherein the temperatures of temperature measuring points at different positions are stored in different areas of the temperature database.

[0085] In this exemplary embodiment, the collected temperatures of the temperature measuring points can be stored in a temperature database to facilitate subsequent temperature analysis and regulation of each temperature measuring point, thereby facilitating the convenience of temperature regulation of each temperature measuring point.

[0086] Figure 3 FIG. 1 is a flow chart of integrated circuit temperature adjustment according to an exemplary embodiment. Figure 3 As shown, the integrated circuit temperature adjustment process includes:

[0087] Step 30: Perform frequency monitoring, temperature monitoring and power monitoring;

[0088] Step 31, performing temperature analysis;

[0089] Step 32: If the temperature at the temperature measuring point exceeds the preset threshold, a temperature alarm is issued; if the temperature at the temperature measuring point does not exceed the preset threshold, temperature analysis is continued;

[0090] Step 33: When the temperature alarm is triggered, the adaptive adjustment algorithm is started;

[0091] Step 34, output adjustment parameters △F, △P;

[0092] Step 35, adjusting the frequency through △F, adjusting the power through △P, and then continuously monitoring the power and frequency;

[0093] Step 36, determining whether the temperature alarm is released;

[0094] Step 37: If the temperature alarm is not released, read the temperature database;

[0095] Step 38, analyzing the chip temperature area;

[0096] Step 39, start task migration by analyzing the chip temperature area, and execute step 31;

[0097] Step 40: If the temperature alarm is cleared, the algorithm ends.

[0098] The present disclosure provides an integrated circuit. Figure 4 FIG. 1 is a schematic diagram of an integrated circuit structure according to an exemplary embodiment. Figure 4 As shown, the integrated circuit comprises:

[0099] The temperature sensing circuit 44 is used to collect the temperature of the temperature measuring point and transmit the temperature data to the adaptive adjustment algorithm module;

[0100] The adaptive adjustment algorithm module 45 is connected to the temperature sensing circuit, and is used to collect the frequency, power and temperature data of the device in the circuit to be measured, and perform frequency-power derivation based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value; wherein the frequency-power-temperature three-dimensional model includes the correlation between frequency, power and temperature; and

[0101] Based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the circuit to be measured is performed to reduce the temperature of the temperature measurement point.

[0102] In this exemplary embodiment, Figure 2 As shown, the temperature sensing circuit may include a temperature sensing circuit and a temperature monitoring circuit; wherein the temperature sensing circuit collects temperature at each temperature measuring point of the integrated circuit; the temperature monitoring circuit includes a multi-channel temperature acquisition circuit, a circuit corresponding to the temperature data read-write control, a temperature database, a circuit corresponding to the temperature data analysis, and a temperature alarm module. Among them, the multi-channel temperature acquisition circuit is used to read the temperature acquisition data from the temperature sensing circuit, the circuit corresponding to the temperature data read-write control is used to store the temperature acquisition data read by the multi-channel temperature acquisition circuit into the temperature database, the circuit corresponding to the temperature data analysis is used to perform data analysis on the temperature acquisition data, and the temperature alarm module is used to issue a temperature alarm when the temperature of the temperature measuring point is too high. The temperature sensing circuit can realize the temperature acquisition and monitoring of each temperature measuring point of the integrated circuit.

[0103] Then, the temperature data is transmitted to the adaptive adjustment algorithm module through the temperature sensing circuit, and the adaptive adjustment algorithm module 45 collects the frequency, power and temperature data of the device in the circuit to be measured, and performs frequency-power derivation based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value; wherein the frequency-power-temperature three-dimensional model includes the correlation between frequency, power and temperature; and based on the frequency-power corresponding to the frequency-power-temperature when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the circuit to be measured is performed to reduce the temperature of the temperature measurement point, thereby facilitating improving the safety of the integrated circuit during operation.

[0104] In some embodiments, including:

[0105] A power monitoring circuit is connected to the adaptive adjustment algorithm module and is used to monitor the voltage and current changes of the components in the temperature measurement circuit in real time and transmit the power data to the adaptive adjustment algorithm module;

[0106] The frequency monitoring circuit 41 is connected to the adaptive adjustment algorithm module 45 and is used to monitor the frequency change in real time and transmit the frequency data to the adaptive adjustment algorithm module.

[0107] In this exemplary embodiment, the power monitoring circuit can be replaced by a voltage monitoring circuit 43, which monitors the voltage of each temperature measurement point of the temperature measurement circuit to be measured, and then calculates the corresponding power through the voltage and current.

[0108] In some embodiments, including:

[0109] The task scheduling circuit 48 is connected to the adaptive adjustment algorithm module and is used to start task migration if the temperature of the temperature measuring point is not reduced to the safe working temperature of the device when the frequency-power corresponding to the frequency-power corresponding to the minimum value of the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the frequency-power of the device in the circuit to be measured, and the task of the regional circuit whose temperature of the temperature measuring point exceeds the predetermined threshold is allocated to the regional circuit whose temperature of the temperature measuring point is lower than the predetermined threshold.

[0110] In this exemplary embodiment, it includes:

[0111] A voltage generating circuit 42, connected to the adaptive adjustment algorithm module, for outputting a corresponding voltage according to input parameters;

[0112] The frequency adjustment circuit 46 is connected to the adaptive adjustment algorithm module and is used to generate a corresponding PLL frequency division coefficient according to the target frequency and send it to the frequency generation circuit;

[0113] The frequency generating circuit 40 is connected to the frequency adjusting circuit and is used to generate a target frequency according to the frequency division coefficient of the PLL;

[0114] The power regulation circuit is connected to the adaptive regulation algorithm module and is used to generate a regulation voltage or a voltage for shutting down a part of the circuit according to a minimum power parameter.

[0115] In this exemplary embodiment, the voltage generating circuit 42 can be connected to the voltage monitoring circuit 43, and the voltage generating circuit 42 can output a corresponding output voltage according to the input parameters. The power regulating circuit can be replaced by a voltage regulating circuit 47, and the voltage regulating circuit can be used to regulate the voltage to achieve the function of power regulation. Through the combined action of the various circuits in the above integrated circuit, the temperature monitoring of each temperature measuring point of the integrated circuit is achieved.

[0116] It should be noted that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute instructions), or in combination with these instruction execution systems, devices or apparatuses. For the purposes of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in combination with these instruction execution systems, devices or apparatuses. More specific examples of computer-readable media (a non-exhaustive list) include the following: an electrical connection portion with one or more wirings (electronic device), a portable computer disk box (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or otherwise processing in a suitable manner if necessary, and then stored in a computer memory.

[0117] It should be understood that the various parts of the present disclosure can be implemented in hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0118] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0119] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0120] In addition, the terms "first", "second", etc. used in the embodiments of the present disclosure are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features defined by the terms "first", "second", etc. in the embodiments of the present disclosure may explicitly or implicitly indicate that at least one of the features is included in the embodiment. In the description of the present disclosure, the word "multiple" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.

[0121] In the present disclosure, unless otherwise clearly specified or limited in the embodiments, the terms "installed", "connected", "connected" and "fixed" etc. appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or an integrated connection. It can be understood that it can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements, or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific implementation situation.

[0122] In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0123] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A method for adjusting the temperature of an integrated circuit, characterized in that: include: Divide the temperature measurement points of the temperature measurement circuit, and monitor the temperature of each temperature measurement point through a temperature sensor; If the temperature at the temperature measurement point exceeds a predetermined threshold, the frequency-power derivation is performed based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value; wherein the frequency-power-temperature three-dimensional model includes the correlation relationship between frequency, power and temperature; Based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the circuit to be measured is performed to reduce the temperature of the temperature measurement point.

2. The integrated circuit temperature adjustment method according to claim 1, characterized in that: The frequency-power-temperature three-dimensional model is: T(P, F)=(CL*Vdd 2 *Ptran*F+ttran*P*F)*Rjc; where P is the power of the temperature-measured circuit; T is the surface temperature of the chip package; CL is the load capacitance; Vdd is the power supply voltage in the temperature-measured circuit; Ptran is the signal flip probability; ttran is the signal switching time; Ipeak is the peak current; Rjc is the thermal resistance between the heat source node of the chip and the package shell; F is the clock frequency.

3. The integrated circuit temperature adjustment method according to claim 2, characterized in that: The method of performing frequency-power derivation based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value includes: Frequency-Power-Temperature 3D Model T(P, F)=(CL*Vdd 2 *Ptran*F+ttran*P*F)*Rjc calculates the quadratic partial derivatives of power and frequency, and determines that the minimum value of the quadratic partial derivative of power is the power corresponding to when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, and the minimum value of the quadratic partial derivative of frequency is the frequency corresponding to when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value.

4. The integrated circuit temperature adjustment method according to claim 1, characterized in that: The frequency-power adjustment of the device in the temperature-measured circuit based on the frequency-power corresponding to the temperature adjustment to the minimum value to reduce the temperature of the temperature measurement point includes: Obtain the current frequency-power of the device in the circuit to be measured; Determine the frequency-power variation based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value and the current frequency-power of the device in the circuit to be measured; Based on the frequency-power variation as an adjustment parameter, the frequency-power of the device in the temperature measurement circuit is adjusted.

5. The integrated circuit temperature adjustment method according to claim 1, characterized in that: include: If the temperature at the temperature measuring point is not lowered to the safe operating temperature of the device when the frequency-power adjustment of the device in the circuit to be measured is performed based on the frequency-power corresponding to the frequency-power when the volume in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, then task migration is initiated and the task of the regional circuit whose temperature at the temperature measuring point exceeds the predetermined threshold is allocated to the regional circuit whose temperature at the temperature measuring point is lower than the predetermined threshold.

6. The integrated circuit temperature adjustment method according to claim 1, characterized in that: include: If the temperature at the measuring point exceeds the preset threshold, a temperature alarm will be issued; When the temperature at the temperature measuring point is lower than the preset threshold, the temperature alarm at the temperature measuring point is released.

7. The integrated circuit temperature adjustment method according to claim 1, characterized in that: Based on the frequency-power-temperature three-dimensional model, frequency-power derivation is performed to determine the frequency-power before the frequency-power corresponding to the volume of the frequency-power-temperature three-dimensional model when it is adjusted to the minimum value. The method includes: The collected temperature of the temperature measuring point is stored in the temperature database; When determining whether the temperature of a temperature measuring point exceeds a predetermined threshold, the temperature of a target temperature measuring point is read in an area corresponding to the target temperature measuring point in the temperature database; wherein the temperatures of temperature measuring points at different positions are stored in different areas of the temperature database.

8. An integrated circuit, characterized in that: include: A temperature sensing circuit is used to collect the temperature of the temperature measuring point and transmit the temperature data to the adaptive adjustment algorithm module; An adaptive adjustment algorithm module is connected to the temperature sensing circuit, and is used to collect the frequency, power and temperature data of the device in the circuit to be measured, and to perform frequency-power derivation based on the frequency-power-temperature three-dimensional model to determine the frequency-power corresponding to the frequency-power-temperature when the volume of the frequency-power-temperature three-dimensional model is adjusted to the minimum value; wherein the frequency-power-temperature three-dimensional model includes the correlation between frequency, power and temperature; and Based on the frequency-power corresponding to the frequency-power when the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, the frequency-power adjustment of the device in the circuit to be measured is performed to reduce the temperature of the temperature measurement point.

9. The integrated circuit according to claim 8, characterized in that include: A power monitoring circuit is connected to the adaptive adjustment algorithm module and is used to monitor the voltage and current changes of the components in the temperature measurement circuit in real time and transmit the power data to the adaptive adjustment algorithm module; The frequency monitoring circuit is connected to the adaptive adjustment algorithm module and is used to monitor the frequency change in real time and transmit the frequency data to the adaptive adjustment algorithm module.

10. The integrated circuit according to claim 8, characterized in that include: A task scheduling circuit is connected to the adaptive adjustment algorithm module, and is used to start task migration if the temperature of the temperature measuring point is not reduced to the safe working temperature of the device when the frequency-power corresponding to the volume of the frequency-power-temperature in the frequency-power-temperature three-dimensional model is adjusted to the minimum value, and the task of the regional circuit whose temperature of the temperature measuring point exceeds the predetermined threshold is allocated to the regional circuit whose temperature of the temperature measuring point is lower than the predetermined threshold when the frequency-power of the device in the circuit to be measured is adjusted. A voltage generating circuit, connected to the adaptive adjustment algorithm module, for outputting a corresponding voltage according to input parameters; A frequency adjustment circuit, connected to the adaptive adjustment algorithm module, is used to generate a corresponding PLL frequency division coefficient according to the target frequency and send it to the frequency generation circuit; A frequency generating circuit, connected to the frequency adjusting circuit, for generating a target frequency according to a frequency division coefficient of the PLL; The power regulation circuit is connected to the adaptive regulation algorithm module and is used to generate a regulation voltage or a voltage for shutting down a part of the circuit according to a minimum power parameter.

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