Packaging method of high-power resistor based on ceramic slurry

Abstract

The embodiment of the invention provides a packaging method of a high-power resistor based on ceramic slurry, and relates to the technical field of resistor preparation, and the method comprises the following steps: putting the high-power resistor into an accommodating cavity of a ceramic shell; according to the first injection amount, ceramic slurry is injected into the containing cavity through a slurry injector; controlling the vibration motor to vibrate so as to drive the ceramic shell to continuously vibrate for a first preset time period; according to the second injection amount and a preset grouting rate control algorithm, ceramic slurry is injected into the containing cavity through the grouting device; wherein the sum of the first injection amount and the second injection amount is smaller than the volume of the containing cavity and larger than a preset value, and the grouting rate control algorithm is determined according to the temperature of the ceramic slurry and the pressure of the ceramic slurry; and controlling the vibration motor to vibrate so as to drive the ceramic shell to continuously vibrate for a second preset time period. According to the method, the packaged resistor has better heat dissipation and heat resistance and can bear higher power.

Description

Technical Field

[0001] The invention relates to the technical field of resistor preparation, and in particular to a packaging method for a high-power resistor based on ceramic slurry. Background Art

[0002] High-power resistors are a type of resistor element with high performance requirements. They can be divided into three categories according to the different materials used: alloy type (winding), thin film type (carbon film, metal film), and synthetic type (synthetic solid core, synthetic film, glass glaze). High-power resistors have certain safety hazards when used. Excessive power will cause a large current impact, which will not only cause the high-power resistor itself to explode or burn, but may also cause damage to adjacent components. The current packaging process design of resistors is simple, which to a certain extent affects the final performance of high-power resistors, making the quality of the high-power resistors produced unsatisfactory, and the heat dissipation and heat resistance of the products do not meet the application requirements. In order to improve the stability and reliability of the power and resistance value of high-power resistors, it is particularly important to improve the packaging process design. Summary of the invention

[0003] In view of this, the purpose of the present invention is to provide a packaging method for high-power resistors based on ceramic slurry, by first injecting part of the ceramic slurry into the ceramic shell, then placing the high-power resistor and injecting the remaining part of the ceramic slurry into the ceramic shell according to the injection rate control algorithm, and finally vibrating the ceramic shell, so that the packaged resistor has better heat dissipation and heat resistance, and can carry more power.

[0004] In order to achieve the above purpose, the technical solution adopted by the embodiment of the present invention is as follows:

[0005] In a first aspect, the present invention provides a packaging method for a high-power resistor based on ceramic slurry, the method is applied to a resistor packaging system, the resistor packaging system comprises: a grouting machine, a workbench, a temperature sensor, a pressure sensor, and a vibration motor, the workbench is used to place a ceramic shell, the opening of the accommodating cavity of the ceramic shell faces the grouting port of the grouting machine, the temperature sensor is used to detect the temperature of the ceramic slurry in the grouting machine, the pressure sensor is used to detect the pressure of the ceramic slurry in the grouting machine, and the vibration motor is arranged inside the workbench; wherein the packaging method for a high-power resistor based on ceramic slurry comprises the following steps: placing a high-power The resistor is installed in the receiving cavity of the ceramic shell; the ceramic slurry is injected into the receiving cavity by the grouting device according to a first injection amount; the vibration motor is controlled to vibrate to drive the ceramic shell to vibrate continuously for a first preset time period; the ceramic slurry is injected into the receiving cavity by the grouting device according to a second injection amount and a preset grouting rate control algorithm; wherein the sum of the first injection amount and the second injection amount is less than the volume of the receiving cavity and greater than a preset value, and the grouting rate control algorithm is determined according to the temperature of the ceramic slurry and the pressure of the ceramic slurry; and the vibration motor is controlled to vibrate to drive the ceramic shell to vibrate continuously for a second preset time period.

[0006] In an optional embodiment, the ceramic slurry includes the following components: resin, alcohol, quartz powder, quartz sand, and talcum powder; wherein the mass fraction of the resin is 12, the mass fraction of the alcohol is 15, the mass fraction of the quartz powder is 22, the mass fraction of the quartz sand is 35, and the mass fraction of the talcum powder is 16; wherein the preparation process of the ceramic slurry includes the following steps: pouring the alcohol and the resin into a stirring container according to a ratio; pouring the quartz powder, the quartz sand, and the talcum powder into the stirring container according to a ratio; and continuously stirring the stirring container for a preset time.

[0007] In an optional embodiment, the quartz sand includes the following components: 80% of quartz sand with a mesh size of 70 to 120 and 20% of quartz sand with a mesh size of 40 to 70.

[0008] In an optional embodiment, after controlling the vibration motor to vibrate so as to drive the ceramic shell to vibrate continuously for a second preset time period, the method further includes: placing the grouted ceramic shell on a shade drying rack, and placing the shade drying rack in a naturally ventilated environment for shade drying; wherein the duration of the shade drying is greater than 5 hours.

[0009] In an optional embodiment, the method further includes: placing the shade-dried ceramic shell into an oven and baking it in multiple stages; wherein the multiple-stage baking process includes: baking at room temperature -60°C for 30 minutes, baking at 60°C-80°C for 30 minutes, baking at 80°C-100°C for 30 minutes, and baking at 100°C-150°C for 60 minutes.

[0010] In an optional embodiment, before the alcohol and the resin are poured into the stirring container according to the ratio, the method further includes the following steps: obtaining the current ambient temperature and the current ambient humidity; adjusting the mass fraction corresponding to the talcum powder according to the current ambient temperature, the current ambient humidity and a preset viscosity temperature and humidity feedback ratio adjustment algorithm; wherein the viscosity temperature and humidity feedback ratio adjustment algorithm includes the following formula:

[0011] A` i =A i ×[1+Kt×(T-Tref1)+Kh×(H-Href1))]

[0012] Among them, A` i A represents the mass fraction of the talcum powder after adjustment. i represents the mass fraction corresponding to the talcum powder before adjustment, T represents the current ambient temperature, Tref1 represents the reference temperature, H represents the current ambient humidity, Href1 represents the reference humidity, Kh represents the preset temperature adjustment coefficient, and Kt represents the preset humidity adjustment coefficient; the mass fraction of the quartz powder is adjusted according to the mass fraction corresponding to the talcum powder after adjustment to balance the mass fraction ratio of each component of the ceramic slurry.

[0013] In an optional embodiment, the step of injecting ceramic slurry into the accommodating cavity using the grouting device according to the second injection amount and the preset grouting rate control algorithm comprises the following steps: injecting ceramic slurry into the accommodating cavity using the grouting device in three grouting stages according to the second injection amount and the grouting rate control algorithm; wherein the three grouting stages include a first grouting stage, a second grouting stage and a third grouting stage in chronological order; wherein the grouting rate control algorithm comprises the following formula:

[0014]

[0015] Among them, Rinj represents the actual grouting rate, Rmax represents the maximum grouting rate of the grouting device, T represents the temperature of the ceramic slurry, Tref2 represents the reference temperature, P represents the pressure of the ceramic slurry, Pref2 represents the reference pressure, N(s) represents the adjustment factor corresponding to one of the three grouting stages, Dt represents the preset temperature coefficient, and Dp represents the preset pressure coefficient.

[0016] In an optional embodiment, the N(s) comprises the following formula:

[0017]

[0018] Among them, the ranges of N1, N2 and N3 are all greater than 0 and less than 1, N1 is less than N2, N3 is less than N2, s=1 corresponds to the first grouting stage, s=2 corresponds to the second grouting stage, and s=3 corresponds to the third grouting stage.

[0019] In an optional embodiment, the method described in the first aspect also includes: judging whether all parameters of the grouting machine are unified according to a full-parameter identity determination algorithm; when all parameters of the grouting machine are not unified, outputting an alarm prompt to prompt the user to adjust the temperature, humidity and pressure in the production environment.

[0020] In an optional embodiment, the all-parameters identical determination algorithm includes the following formula:

[0021]

[0022] Among them, U represents the comprehensive indicator corresponding to whether all parameters of the grouting device are unified, T represents the temperature of the current environment, Tref3 represents the reference temperature, Ttol represents the temperature tolerance, H represents the humidity of the current environment, Href3 represents the reference humidity, Htol represents the humidity tolerance, P represents the pressure of the current environment, Pref3 represents the reference pressure, and Ptol represents the pressure tolerance; among them, when U is less than or equal to the preset threshold value, it means that all parameters of the grouting device are unified, and when U is greater than the preset threshold value, it means that all parameters of the grouting device are not unified.

[0023] In an optional embodiment, the ceramic slurry is filled in a glue bottle of the grout injector, and the pressure sensor is used to detect the pressure of the ceramic slurry at the outlet of the glue bottle.

[0024] In a second aspect, the present invention provides a packaging system for a high-power resistor based on ceramic slurry, wherein the packaging system for a high-power resistor based on ceramic slurry is used to execute the packaging method for a high-power resistor based on ceramic slurry as described in any embodiment of the first aspect during operation.

[0025] According to the embodiments provided in the above-mentioned various aspects, in the packaging method of high-power resistor based on ceramic slurry provided in the first aspect: by first injecting part of the ceramic slurry into the ceramic shell, then putting the high-power resistor and injecting the remaining part of the ceramic slurry into the ceramic shell according to the slurry injection rate control algorithm, and vibrating the ceramic shell after filling to make the ceramic slurry uniform and tight, to ensure the density of the packaging slurry so that the resistor after completion of packaging has better heat dissipation and heat resistance, and can carry more power.

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the embodiments of the present invention are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 A module block diagram of a packaging system for a high-power resistor based on ceramic slurry provided by an embodiment of the present invention;

[0029] Figure 2 A schematic flow chart of a packaging method for a high-power resistor based on ceramic slurry provided in an embodiment of the present invention is shown;

[0030] Figure 3 A performance comparison chart of a resistor made of new and old ceramic slurries provided by an embodiment of the present invention is shown;

[0031] Figure 4 A functional module diagram of a packaging device for a high-power resistor based on ceramic slurry provided by an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0035] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0036] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0037] In order to solve the problem existing in the above-mentioned prior art that "the current packaging process design of resistors is simple, which affects the final performance of high-power resistors to a certain extent, making the quality of the produced high-power resistors fail to meet the requirements in terms of heat dissipation and heat resistance". The embodiment of the present invention proposes a technical solution, including a packaging method for high-power resistors based on ceramic slurry. The embodiment of the present invention injects part of the ceramic slurry into the ceramic shell first, then puts the high-power resistor in, and injects the remaining part of the ceramic slurry into the ceramic shell according to the slurry injection rate control algorithm, and finally vibrates the ceramic shell, so that the resistor after packaging has better heat dissipation and heat resistance, and can carry more power.

[0038] First, the packaging system of a high-power resistor based on ceramic slurry (also referred to as a resistor packaging system) provided by an embodiment of the present invention is described in conjunction with the accompanying drawings. Figure 1 , Figure 1 A block diagram of a resistor packaging system provided by an embodiment of the present invention. The resistor packaging system 100 may include: a grouting machine 110, a workbench 120, a temperature sensor, a pressure sensor, and a vibration motor. The temperature sensor, the pressure sensor, and the vibration motor are not shown in FIG. Figure 1 Shown in.

[0039] The workbench 120 is used to place the ceramic shell 130, the opening of the accommodating cavity of the ceramic shell 130 faces the grouting port of the grouting device 110, the temperature sensor is used to detect the temperature of the ceramic slurry in the grouting device 110, the pressure sensor is used to detect the pressure of the ceramic slurry in the grouting device 110, and the vibration motor is arranged inside the workbench 120.

[0040] The grouting device 110 is used to inject the ceramic slurry into the receiving cavity of the ceramic shell 130. The grouting device can be a pressure grouting device or a vacuum grouting device, etc. Its main function is to inject the prepared ceramic slurry into the ceramic shell at a certain pressure and speed to ensure that the slurry can evenly fill the receiving cavity of the shell.

[0041] The workbench 120 is used to support and fix the ceramic shell 130 for grouting operation. The workbench should be designed to be stable and adjustable so as to adapt to ceramic shells of different sizes and shapes. A vibration motor is provided inside the workbench, which can be started during or after the grouting process to improve the filling effect and tightness of the ceramic slurry in the ceramic shell.

[0042] The temperature sensor is used to monitor the temperature of the ceramic slurry in the slurry injector 110 in real time.

[0043] The pressure sensor is used to monitor the pressure of the ceramic slurry in the slurry injector 110 in real time.

[0044] Alternatively, the vibration motor may be a linear motor.

[0045] Optionally, the ceramic slurry is filled in a glue bottle of the slurry injector 110, and the pressure sensor is used to detect the pressure of the ceramic slurry at the outlet of the glue bottle.

[0046] In an alternative embodiment, the ceramic slurry-based high-power resistor packaging method provided in this embodiment may be executed by a controller of the slurry injector 110 in the resistor packaging system 100 .

[0047] It is understood that the resistor packaging system 100 provided in the embodiment of the present invention may also include more devices and structures (which may be increased or decreased according to actual needs) to implement the packaging method process of a high-power resistor based on ceramic slurry. For the sake of brevity, it will not be repeated here.

[0048] A packaging method for high-power resistors based on ceramic slurry is given below. Figure 2 , Figure 2 A schematic flow chart of a packaging method for a high-power resistor based on ceramic slurry provided by an embodiment of the present invention is shown. The packaging method for a high-power resistor based on ceramic slurry can be applied to the controller of the grouting device 110 in the above-mentioned system 100, so as to first inject part of the ceramic slurry into the ceramic shell, then put the high-power resistor, and inject the remaining part of the ceramic slurry into the ceramic shell according to the grouting rate control algorithm, and vibrate the ceramic shell after filling to make the ceramic slurry uniform and compact, so that the resistor after packaging has better heat dissipation and heat resistance, and can carry more power.

[0049] Specifically, the packaging method of the high-power resistor based on ceramic slurry may include the following steps S210 to S260, which are described in sequence below.

[0050] S210 , installing the high-power resistor into the accommodating cavity of the ceramic housing 130 .

[0051] Optionally, the above-mentioned high-power resistor may refer to a resistor that can withstand a relatively large power, that is, a high-power resistor refers to a resistor that can withstand a power exceeding a preset power (the preset power can be set to, for example, 1W, 10W, 100W, etc.). The preset power can be designed according to the commonly used settings in the technical field, and this application does not limit this.

[0052] Alternatively, the high power resistor may be a thermistor.

[0053] The shape design of the accommodating cavity can be designed according to the shape design of the high-power resistor, wherein a clamping structure can be designed to clamp the high-power resistor in the accommodating cavity through two pins of the high-power resistor.

[0054] Specifically, the processed high-power resistor can be placed into the ceramic shell from the bottom of the ceramic shell 130, and the product leads are inserted into the holes on both sides of the ceramic shell for positioning; then the ceramic slurry prepared in a specific proportion is poured into the ceramic shell 130, and then the production of the explosion-proof high-power resistor product is completed according to the processing technology (the following steps).

[0055] S220 , injecting ceramic slurry into the accommodating cavity using the slurry injector 110 according to a first injection amount.

[0056] The first injection amount refers to the amount of ceramic slurry injected into the accommodating cavity of the ceramic housing 110 for the first time during the packaging process. This step can form a layer of ceramic slurry foundation at the bottom of the ceramic housing 110, and facilitate the fixation of the high-power resistor and the injection of the remaining ceramic slurry.

[0057] S230, controlling the vibration motor to vibrate, so as to drive the ceramic housing 130 to vibrate continuously for a first preset time period.

[0058] The first preset time period may be set to 1.5 seconds, for example.

[0059] S240: Inject ceramic slurry into the accommodating cavity using the slurry injector 110 according to the second injection amount and a preset slurry injection rate control algorithm.

[0060] The sum of the first injection amount and the second injection amount is less than the volume of the accommodating cavity and greater than a preset value, and the slurry injection rate control algorithm is determined according to the temperature and pressure of the ceramic slurry.

[0061] The second injection amount refers to the amount of ceramic slurry injected into the ceramic housing again after the high-power resistor is placed. This step can cover and fix the high-power resistor and ensure that the accommodating cavity of the ceramic housing 110 is fully filled to achieve a good packaging effect.

[0062] In one example, the first injection volume is 2 ml, the total volume of the accommodating cavity is 10 ml, and the remaining space is 8 ml. The second injection volume can be set to part or all of the 8 ml, depending on the slurry injection rate control algorithm and the actual production process requirements. For example, the second injection volume can be set to 6 ml, leaving 2 ml of space for the natural flow and compactness of the ceramic slurry.

[0063] In another example, the first injection amount is 1 / 3 of the total volume of the accommodating cavity, and the setting principle of the second injection amount is, for example: the second injection amount is set based on the planar slurry surface not exceeding the end face of the ceramic shell, the cement slurry not exceeding 0.5mm from the end face of the ceramic shell (MPR shall not exceed the end face of the ceramic shell), the cement slurry not less than 1mm (the chip shall not be visible in the MPR), and it is required to be flat, and the paint on the lead shall not exceed twice the lead wire diameter.

[0064] Optionally, S240, according to the second injection volume and the preset grouting rate control algorithm, using the grouting device 110 to inject ceramic slurry into the accommodating cavity, including the steps of: according to the second injection volume and the grouting rate control algorithm, using the grouting device 110 to inject ceramic slurry into the accommodating cavity in three grouting stages.

[0065] Among them, the three grouting stages include the first grouting stage, the second grouting stage and the third grouting stage in chronological order.

[0066] The first grouting stage is the beginning stage of the grouting process. In this stage, the grouting rate can be set relatively low to ensure that the ceramic slurry can smoothly enter the accommodating cavity and preliminarily fill the cavity.

[0067] After the first grouting stage is completed, the second grouting stage is entered. This stage can be set to gradually increase the grouting rate to ensure that the ceramic slurry can fill the accommodating cavity more quickly.

[0068] The third grouting stage is the final stage of the grouting process. In this stage, the grouting rate can be adjusted as needed to ensure that the accommodating cavity is completely and evenly filled.

[0069] Among them, the grouting rate control algorithm includes the following formula:

[0070] Rinj=Rmax×(1+Dt×((T / Tref2)-1))+Dp×log((P / Pref2)))×N(s)

[0071] Wherein, Rinj represents the actual grouting rate, Rmax represents the maximum grouting rate of the grouting device 110, T represents the temperature of the ceramic slurry, Tref2 represents the reference temperature, P represents the pressure of the ceramic slurry, Pref2 represents the reference pressure, N(s) represents the adjustment factor corresponding to one of the three grouting stages, Dt represents the preset temperature coefficient, and Dp represents the preset pressure coefficient. N(s) is a function related to the grouting stage s, and is used to adjust the grouting rate of different grouting stages.

[0072] In the above grouting rate control algorithm, each grouting stage corresponds to an adjustment factor N(s), which will be adjusted according to the specific grouting stage to achieve the grouting rate control requirements of different stages.

[0073] It should be understood that when the ceramic slurry is injected into the accommodating cavity for the second time, the temperature and pressure of the environment are taken into account in the slurry injection rate control algorithm. When the temperature is higher and / or the pressure is higher, the ceramic slurry is easier to mix evenly. At this time, by appropriately increasing the slurry injection rate, the production efficiency is improved while ensuring that the ceramic slurry can be evenly mixed into the ceramic shell 130.

[0074] Optionally, N(s) includes the following formula:

[0075]

[0076] Among them, the ranges of N1, N2 and N3 are all greater than 0 and less than 1, N1 is less than N2, N3 is less than N2, s=1 corresponds to the first grouting stage, s=2 corresponds to the second grouting stage, and s=3 corresponds to the third grouting stage. N1, N2 and N3 can be: 0.8, 1, 0.8 respectively.

[0077] It should be understood that in the above three grouting stages, the design of a fast second grouting stage and slow first and third grouting stages can avoid bubbles caused by uneven mixing due to excessively rapid injection of slurry in the early stage and overflow caused by excessively rapid injection of slurry in the later stage.

[0078] For example, assume that the maximum slurry injection rate (Rmax) of the slurry injector 110 is 100 ml / min. The temperature (T) of the ceramic slurry is 30 degrees Celsius, and the reference temperature (Tref2) is 25 degrees Celsius. The pressure (P) of the ceramic slurry is 1.5 atmospheres, and the reference pressure (Pref2) is 1 atmosphere. The preset temperature coefficient (Dt) is 0.05, and the preset pressure coefficient (Dp) is 0.1. N1 = 0.8, N2 = 1.0, N3 = 0.8. Then,

[0079] In the first grouting stage, Rinj = Rmax × (1 + 0.05 × ((30 / 25) - 1)) × (1 + 0.1 × log ((1.5 / 1))) × N (s) ≈ 83.62 ml / min;

[0080] In the second grouting stage, Rinj ≈ 104.54 ml / min, and the same is true for the third grouting stage.

[0081] S250, controlling the vibration motor to vibrate, so as to drive the ceramic housing 130 to vibrate continuously for a second preset time period.

[0082] The second preset time period may be set to 3 seconds, for example.

[0083] Optionally, the ceramic slurry includes the following components: resin, alcohol, quartz powder, quartz sand, talcum powder. The alcohol can be industrial alcohol.

[0084] Among them, one formula of the ceramic slurry can be: 12 parts by mass of resin, 15 parts by mass of alcohol, 22 parts by mass of quartz powder, 35 parts by mass of quartz sand, and 16 parts by mass of talcum powder.

[0085] For example, if you need to make 5 kg of ceramic slurry, you will need 0.6 kg of resin, 0.75 kg of alcohol, 1.1 kg of quartz powder, 1.75 kg of quartz sand and 0.8 kg of talcum powder.

[0086] If you need to make 10kg of ceramic slurry, you will need 1.2kg of resin, 1.5kg of alcohol, 2.2kg of quartz powder, 3.5kg of quartz sand and 1.6kg of talcum powder.

[0087] The preparation process of the ceramic slurry includes the following steps 1.1-1.3:

[0088] Step 1.1, pour alcohol and resin into a mixing container according to the ratio.

[0089] Specifically, separate the alcohol and resin according to the ratio, measure them with a measuring cup, and pour them into the container to be mixed.

[0090] Step 1.2, pour quartz powder, quartz sand and talcum powder into a mixing container according to the proportion.

[0091] Step 1.3, continuously stirring the stirring container for a preset time, wherein the preset time is, for example, at least 5 minutes.

[0092] Specifically, talcum powder (aluminum oxide), quartz powder (aluminum oxide), and quartz sand are measured separately according to the proportions using plastic. Then, talcum powder, quartz powder (aluminum oxide), and quartz sand are mixed and stirred evenly. Finally, the evenly mixed talcum powder, quartz powder (aluminum oxide), and quartz sand are poured into the mixing container, mixed with alcohol and resin, and mixed and stirred for more than 10 minutes until uniform.

[0093] The ceramic slurry that has been stirred evenly is poured into the plastic bottle for use, and the plastic bottle needs to be shaken frequently to prevent precipitation. The formula slurry used in the stirring process is also stirred continuously to prevent precipitation.

[0094] Optionally, the quartz sand includes the following components: 80% of 70-120 mesh quartz sand and 20% of 40-70 mesh quartz sand. The ratio of 70-120 mesh quartz sand to 40-70 mesh quartz sand can be adjusted within a range of 5% according to climate change and different specifications.

[0095] The main reason for using aluminum oxide in the new formula is to increase heat dissipation and heat resistance. Increased heat dissipation and heat resistance are equivalent to increased power, and the power of products of the same volume can be increased. Specifically, the performance comparison between the high-power resistors made of ceramic slurry produced according to the above formula and the high-power resistors made of ceramic slurry produced by the existing technology can be referred to as follows Figure 2 As shown in the table. It can be seen that under the same test conditions, the temperature rise experiment shows that the new formula (the above formula) is obviously lower than the old formula by nearly 40 degrees, which is nearly 30%-40% lower. The power of the product is significantly increased by 30%-40%. It can be seen that the high-power resistor produced by this formula has better heat dissipation and heat resistance.

[0096] In an optional embodiment, S250, after controlling the vibration motor to vibrate to drive the ceramic housing 130 to vibrate continuously for a second preset period of time, Figure 2 The method further comprises the steps of placing the ceramic shell 130 after grouting on a shade drying rack, and placing the shade drying rack in a naturally ventilated environment for shade drying, wherein the duration of the shade drying is greater than 5 hours.

[0097] Specifically, 1. Store the semi-finished products after grouting separately under ventilated air. 2. The drying time of products below 10kg should be no less than 8 hours, 12 hours in winter; the drying time of products above 10kg should be no less than 20 hours.

[0098] In an alternative embodiment, Figure 2The method further comprises the steps of placing the air-dried ceramic shell 130 into an oven and baking it in multiple stages, wherein the multiple stage baking process comprises: baking at room temperature - 60°C for 30 minutes, baking at 60°C - 80°C for 30 minutes, baking at 80°C - 100°C for 30 minutes, and baking at 100°C - 150°C for 60 minutes.

[0099] Specifically, 1. Turn on the oven power switch, set the temperature and baking time. 2. Put products of different specifications and resistance values ​​into the oven. 3. Set the temperature to 130℃±20℃ and the time to 2.5 hours (it can also be baked in stages, 80℃ for 30 minutes, 100℃ for 60 minutes, and 130℃ for 60 minutes). 4. Half an hour after the start of heating, when the temperature reaches a stable 130℃±20℃, record the oven temperature and record it in the baking record sheet for inspection. Products that stick together after baking need to be patted, disassembled and shaped.

[0100] It can be understood that the shade drying process and baking process with this parameter configuration can make the produced high-power resistor have better heat dissipation, heat resistance and voltage resistance.

[0101] Optionally, before pouring the alcohol and the resin into the stirring container according to the proportion, the above method embodiment further includes the following steps 2.1-2.3:

[0102] Step 2.1, obtain the current ambient temperature and humidity;

[0103] Step 2.2, adjusting the mass fraction of talcum powder according to the current ambient temperature, the current ambient humidity and the preset viscosity temperature and humidity feedback ratio adjustment algorithm.

[0104] Among them, the viscosity temperature and humidity feedback ratio adjustment algorithm includes the following formula:

[0105] Aˋi=Ai×[1+Kt×(T-Tref1)+Kh×(H-Href1)]

[0106] Among them, A` i Indicates the mass fraction of talcum powder after adjustment, A i represents the mass fraction of talcum powder before adjustment, T represents the current ambient temperature, Tref1 represents the reference temperature, H represents the current ambient humidity, Href1 represents the reference humidity, Kh represents the preset temperature adjustment coefficient, and Kt represents the preset humidity adjustment coefficient.

[0107] Step 2.3, adjusting the mass fraction of quartz powder according to the mass fraction corresponding to the adjusted talcum powder, so as to balance the mass fraction ratio of each component of the ceramic slurry.

[0108] For example, assuming that the current ambient temperature T is 30 degrees Celsius, the reference temperature Tref1 is 25 degrees Celsius, the current ambient humidity is 60%, and the reference humidity Href1 is 50%. The mass fraction of talcum powder before adjustment is 16, the preset temperature adjustment coefficient Kt is 0.001, and the humidity adjustment coefficient Kh is 0.002.

[0109] Substitute the known values ​​into the formula to calculate:

[0110] Aˋi=16×[1+0.01×(30-25)+0.02×(60-50)]=16×[1+0.01×5+0.02×10]=20

[0111] Therefore, under the current ambient temperature and humidity conditions, according to the viscosity temperature and humidity feedback ratio adjustment algorithm, the mass fraction of talcum powder should be adjusted from 16 to 16.4.

[0112] After the mass fraction of talc powder is increased to 16.4, in order to maintain the balance of the ratio, the mass fraction of quartz powder can be reduced from 22 to 21.6. In this way, the total mass fraction of the ceramic slurry remains unchanged and the ratio between the components is also balanced.

[0113] Considering that talcum powder is most affected by temperature and humidity, steps 2.1-2.3 adjust the ratio of talcum powder by introducing real-time monitoring of environmental factors and dynamic proportioning, so that the ceramic slurry preparation can be adaptively adjusted according to the actual environmental conditions and can be maintained at a better ratio under different environmental conditions.

[0114] Optionally, the above method further comprises the following steps 3.1-3.2:

[0115] Step 3.1, judging whether all parameters of the grouting device 110 are uniform according to the uniformity judgment algorithm of all parameters.

[0116] Step 3.2: When all parameters of the grouting machine 110 are not uniform, an alarm prompt is output to prompt the user to adjust the temperature, humidity and pressure in the production environment.

[0117] Optionally, the all-parameters identical determination algorithm includes the following formula:

[0118] U=√(((T-Tref3) / Ttol) 2 +((H-Href) / Htol) 2 +((P-Pref) / Ptol) 2 )

[0119] Among them, U represents the comprehensive index corresponding to whether all parameters of the grouting device 110 are unified, T represents the temperature of the current environment, Tref3 represents the reference temperature, Ttol represents the temperature tolerance, H represents the humidity of the current environment, Href3 represents the reference humidity, Htol represents the humidity tolerance, P represents the pressure of the current environment, Pref3 represents the reference pressure, and Ptol represents the pressure tolerance. Among them, when U is less than or equal to the preset threshold value, it means that all parameters of the grouting device 110 are unified, and when U is greater than the preset threshold value, it means that all parameters of the grouting device 110 are not unified.

[0120] For example, assume that the temperature T of the current environment is 28 degrees Celsius, the reference temperature Tref3 is 25 degrees Celsius, and the temperature tolerance Ttol is 2 degrees Celsius; the humidity of the current environment is 55%, the reference humidity Href3 is 50%, and the humidity tolerance Htol is 5%; the pressure of the current environment is 1.02 atmospheres, the reference pressure Pref3 is 1 atmosphere, and the pressure tolerance Ptol is 0.02 atmospheres. The preset threshold is set to 2. Substituting the known values ​​for calculation, U = √(((28-25) / 2)^2+((55-50) / 5)^2+((1.02-1) / 0.02)^2) = 2.06. Since the calculated U value is greater than the preset threshold 2, it is determined according to the algorithm that all parameters of the grouting device 110 are not uniform.

[0121] It should be understood that by calculating U, it can be determined whether the current environmental parameters deviate from the ideal reference range, thereby promptly discovering environmental problems that may affect the performance of the ceramic slurry in the grouting machine, helping to promptly discover and adjust these conditions, making the control of the production process more precise and predictable.

[0122] In the above Figure 2 In the method embodiment shown, by adopting a two-stage grouting process, the method improves the packaging quality and performance of high-power resistors. First, a portion of ceramic slurry is injected into the ceramic housing 130 to provide a stable base for the resistor. Subsequently, the high-power resistor is placed on the slurry to ensure its accurate and stable position. Next, the grouting rate control algorithm is used to adjust the injection amount of subsequent ceramic slurry according to the real-time temperature and pressure data of the ceramic slurry to ensure the uniformity and tightness of the filling. In addition, by introducing the continuous vibration of the vibration motor during the grouting process, not only can the ceramic slurry fill the ceramic housing 130 more evenly, but also effectively eliminates the internal bubbles and gaps, further enhancing the overall stability and heat conduction efficiency of the packaging structure. This packaging method makes the heat dissipation, heat resistance and power carrying capacity of the resistor stronger, ensuring the stability and reliability of the resistor under long-term high-load operation.

[0123] In order to perform the corresponding steps in the above embodiments and various possible methods, a method for implementing a packaging device of a high-power resistor based on ceramic slurry is also provided below. Figure 3 , Figure 3 The functional module diagram of a packaging device of a high-power resistor based on ceramic slurry provided by an embodiment of the present invention is shown. The packaging device 300 of a high-power resistor based on ceramic slurry can be applied to the above Figure 1 The system 100 shown can be used to perform each step in the above method embodiment. It should be noted that the basic principle and technical effect of the packaging device 300 of a high-power resistor based on ceramic slurry provided in this embodiment are the same as those in the above embodiment. For the sake of brief description, the parts not mentioned in this embodiment can refer to the corresponding contents in the above embodiment. The packaging device 300 of a high-power resistor based on ceramic slurry can include: a transceiver module 310 and a processing module 320.

[0124] Among them, the processing module 320 is used to load the high-power resistor into the accommodation cavity of the ceramic shell; the processing module 320 is used to inject ceramic slurry into the accommodation cavity according to a first injection volume by using the grouting device; the processing module 320 is used to control the vibration of the vibration motor to drive the ceramic shell to vibrate continuously for a first preset time period; the processing module 320 is used to inject ceramic slurry into the accommodation cavity by using the grouting device according to a second injection volume and a preset grouting rate control algorithm; wherein the sum of the first injection volume and the second injection volume is less than the volume of the accommodation cavity and greater than a preset value, and the grouting rate control algorithm is determined according to the temperature of the ceramic slurry and the pressure of the ceramic slurry; and the processing module 320 is used to control the vibration of the vibration motor to drive the ceramic shell to vibrate continuously for a second preset time period.

[0125] Optionally, before pouring the alcohol and the resin into the stirring container in a proportion, the processing module 320 is used to obtain the current ambient temperature and the current ambient humidity; the processing module 320 is used to adjust the mass fraction corresponding to the talcum powder according to the current ambient temperature, the current ambient humidity and a preset viscosity temperature and humidity feedback ratio adjustment algorithm; the processing module 320 is used to adjust the mass fraction of the quartz powder according to the adjusted mass fraction corresponding to the talcum powder, so as to balance the mass fraction ratio of each component of the ceramic slurry.

[0126] Optionally, the processing module 320 is used to inject ceramic slurry into the accommodating cavity using the grouting device in three grouting stages according to the second injection volume and the grouting rate control algorithm; wherein the three grouting stages include a first grouting stage, a second grouting stage and a third grouting stage in chronological order.

[0127] Optionally, the ceramic slurry is filled in a glue bottle of the grout injector, and the pressure sensor is used to detect the pressure of the ceramic slurry at the outlet of the glue bottle.

[0128] Optionally, the processing module 320 is used to determine whether all parameters of the grouting machine 110 are unified according to a full-parameter identity determination algorithm; the processing module 320 is used to output an alarm prompt to prompt the user to adjust the temperature, humidity and pressure in the production environment when all parameters of the grouting machine 110 are not unified.

[0129] Optionally, the all-parameters identical determination algorithm includes the following formula:

[0130] U=√(((T-Tref3) / Ttol) 2 +((H-Href) / Htol) 2 +((P-Pref) / Ptol) 2 )

[0131] Among them, U represents the comprehensive index corresponding to whether all parameters of the grouting device 110 are unified, T represents the temperature of the current environment, Tref3 represents the reference temperature, Ttol represents the temperature tolerance, H represents the humidity of the current environment, Href3 represents the reference humidity, Htol represents the humidity tolerance, P represents the pressure of the current environment, Pref3 represents the reference pressure, and Ptol represents the pressure tolerance. Among them, when U is less than or equal to the preset threshold value, it means that all parameters of the grouting device 110 are unified, and when U is greater than the preset threshold value, it means that all parameters of the grouting device 110 are not unified.

[0132] Among them, the viscosity temperature and humidity feedback ratio adjustment algorithm includes the following formula:

[0133] Aˋi=Ai×[1+Kt×(T-Tref1)+Kh×(H-Href1)]

[0134] Among them, A` i Indicates the mass fraction of talcum powder after adjustment, A i represents the mass fraction of talcum powder before adjustment, T represents the current ambient temperature, Tref1 represents the reference temperature, H represents the current ambient humidity, Href1 represents the reference humidity, Kh represents the preset temperature adjustment coefficient, and Kt represents the preset humidity adjustment coefficient.

[0135] Among them, the grouting rate control algorithm includes the following formula:

[0136] Rinj=Rmax×(1+Dt×((T / Tref2)-1))+Dp×log((P / Pref2)))×N(s)

[0137] Wherein, Rinj represents the actual grouting rate, Rmax represents the maximum grouting rate of the grouting device 110, T represents the temperature of the ceramic slurry, Tref2 represents the reference temperature, P represents the pressure of the ceramic slurry, Pref2 represents the reference pressure, N(s) represents the adjustment factor corresponding to one of the three grouting stages, Dt represents the preset temperature coefficient, and Dp represents the preset pressure coefficient. N(s) is a function related to the grouting stage s, and is used to adjust the grouting rate of different grouting stages.

[0138] Optionally, the above modules can be stored in the memory in the form of software or firmware or fixed in the memory provided by the present invention. Figure 1 The operating system (OS) of the controller of the grouting machine 110 shown in FIG. Figure 1 The controller of the grouting machine 110 shown in the figure executes. Meanwhile, the data, program codes, etc. required to execute the above modules can be stored in the memory.

[0139] It is understandable that the transceiver module 310 and the processing module 320 can be used to support Figure 1 The controller of the grouting device 110 of the system 100 shown in the figure performs the relevant steps in the above method embodiment, and / or other processes used in the technology described herein, such as the above Figure 2 The method embodiments shown and the various method embodiments described above are not limited to this.

[0140] Based on the above embodiments, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, each step in the above method is executed.

[0141] Specifically, the storage medium can be a general storage medium, such as a mobile disk, a hard disk, etc. When the computer program on the storage medium is run, the method in the above embodiment can be executed, by first injecting part of the ceramic slurry into the ceramic shell, then putting in a high-power resistor and injecting the remaining part of the ceramic slurry into the ceramic shell according to the slurry injection rate control algorithm, and finally vibrating the ceramic shell, so that the resistor after packaging has better heat dissipation and heat resistance, and can carry more power. Thus, the problem existing in the prior art that "the current packaging process design of the resistor is simple, which to a certain extent affects the final performance of the resistor, making the quality of the produced resistor unsatisfactory" is solved.

[0142] In the embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0143] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0144] Furthermore, the functional modules in the various embodiments of the present invention may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0145] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0146] The above description is only an embodiment of the present invention and is not intended to limit the protection scope of the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging method for a high-power resistor based on ceramic slurry, characterized in that: Applied to a resistor packaging system, the resistor packaging system comprises: a grouting machine, a workbench, a temperature sensor, a pressure sensor, and a vibration motor, the workbench is used to place a ceramic shell, the opening of the accommodating cavity of the ceramic shell faces the grouting port of the grouting machine, the temperature sensor is used to detect the temperature of the ceramic slurry in the grouting machine, the pressure sensor is used to detect the pressure of the ceramic slurry in the grouting machine, and the vibration motor is arranged inside the workbench; The packaging method of the high-power resistor based on ceramic slurry comprises the following steps: Installing a high-power resistor into the accommodating cavity of the ceramic housing; Injecting ceramic slurry into the accommodating cavity using the slurry injector according to a first injection amount; Controlling the vibration motor to vibrate so as to drive the ceramic housing to vibrate continuously for a first preset time period; The grouting device is used to inject ceramic slurry into the accommodating cavity according to a second injection volume and a preset grouting rate control algorithm; wherein the sum of the first injection volume and the second injection volume is less than the volume of the accommodating cavity and greater than a preset value, and the grouting rate control algorithm is determined according to the temperature of the ceramic slurry and the pressure of the ceramic slurry; and the vibration motor is controlled to vibrate so as to drive the ceramic shell to vibrate continuously for a second preset time period.

2. The packaging method of a high-power resistor based on ceramic slurry according to claim 1, characterized in that: The ceramic slurry comprises the following components: resin, alcohol, quartz powder, quartz sand, and talcum powder; The mass fraction of the resin is 12, the mass fraction of the alcohol is 15, the mass fraction of the quartz powder is 22, the mass fraction of the quartz sand is 35, and the mass fraction of the talcum powder is 16; The preparation process of the ceramic slurry comprises the following steps: Pour the alcohol and the resin into a stirring container according to a proportion; Pour the quartz powder, the quartz sand and the talcum powder into the stirring container according to the proportion; The stirring container is continuously stirred for a preset time.

3. The packaging method of a high-power resistor based on ceramic slurry according to claim 2, characterized in that: The quartz sand comprises the following components: 80% of quartz sand with a mesh size of 70 to 120 and 20% of quartz sand with a mesh size of 40 to 70.

4. The packaging method of a high-power resistor based on ceramic slurry according to claim 3, characterized in that: After controlling the vibration motor to vibrate so as to drive the ceramic housing to vibrate continuously for a second preset time period, the method further includes: Placing the ceramic shell after grouting on a shade drying rack, and placing the shade drying rack in a naturally ventilated environment to dry in the shade; Among them, the duration of shade drying is greater than 5 hours.

5. The packaging method of a high-power resistor based on ceramic slurry according to claim 4, characterized in that: The method further comprises: Putting the shade-dried ceramic shell into an oven and baking it in multiple stages; The multi-stage baking process includes: baking at room temperature-60°C for 30 minutes, baking at 60°C-80°C for 30 minutes, baking at 80°C-100°C for 30 minutes, and baking at 100°C-150°C for 60 minutes.

6. The packaging method of a high-power resistor based on ceramic slurry according to claim 3, characterized in that: Before pouring the alcohol and the resin into the stirring container according to the proportion, the method further comprises the following steps: Get the current ambient temperature and humidity; The mass fraction of the talcum powder is adjusted according to the current ambient temperature, the current ambient humidity and a preset viscosity temperature and humidity feedback ratio adjustment algorithm; wherein, The viscosity temperature and humidity feedback ratio adjustment algorithm includes the following formula: A` i =A i ×[1+Kt×(T-Tref1)+Kh×(H-Href1)] Among them, A` i A represents the mass fraction of the talcum powder after adjustment. i represents the mass fraction of the talcum powder before adjustment, T represents the current ambient temperature, Tref1 represents the reference flow rate, H represents the current viscosity, Href1 represents the reference humidity, Kh represents the preset temperature adjustment coefficient, and Kt represents the preset humidity adjustment coefficient; The mass fraction of the quartz powder is adjusted according to the mass fraction corresponding to the adjusted talcum powder, so as to balance the mass fraction ratio of each component of the ceramic slurry.

7. The packaging method of a high-power resistor based on ceramic slurry according to claim 1, characterized in that: The method of injecting ceramic slurry into the accommodating cavity by using the slurry injector according to the second injection amount and a preset slurry injection rate control algorithm comprises the following steps: Injecting ceramic slurry into the accommodating cavity using the grouting device in three grouting stages according to the second injection amount and the grouting rate control algorithm; The three grouting stages include, in chronological order, a first grouting stage, a second grouting stage and a third grouting stage; Wherein, the grouting rate control algorithm includes the following formula: Among them, Rinj represents the actual grouting rate, Rmax represents the maximum grouting rate of the grouting device, T represents the temperature of the ceramic slurry, Tref2 represents the reference temperature, P represents the pressure of the ceramic slurry, Pref2 represents the reference pressure, N(s) represents the adjustment factor corresponding to one of the three grouting stages, Dt represents the preset temperature coefficient, and Dp represents the preset pressure coefficient.

8. The packaging method of a high-power resistor based on ceramic slurry according to claim 5, characterized in that: in, The N(s) includes the following formula: Among them, the ranges of N1, N2 and N3 are all greater than 0 and less than 1, N1 is less than N2, N3 is less than N2, s=1 corresponds to the first grouting stage, s=2 corresponds to the second grouting stage, and s=3 corresponds to the third grouting stage.

9. The packaging method of a high-power resistor based on ceramic slurry according to any one of claims 1 to 8, characterized in that: The ceramic slurry is filled in the glue bottle of the grouting device, and the pressure sensor is used to detect the pressure of the ceramic slurry at the outlet of the glue bottle.

10. A packaging system for high-power resistors based on ceramic slurry, characterized in that: The packaging system for a high-power resistor based on ceramic slurry is used to perform the packaging method for a high-power resistor based on ceramic slurry according to any one of claims 1 to 9 when in operation.

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