Air injection structure and plasma etching machine

Abstract

The invention discloses an air injection structure and a plasma etching machine. The air injection structure comprises a fixed pipe sleeve which can be communicated with an air source; the air injection part is arranged on the fixed pipe sleeve, an installation space is formed after the air injection part and the fixed pipe sleeve are connected, and air injection holes are formed in the air injection part; and the proportion adjusting part is movably arranged in the mounting space, the proportion adjusting part is provided with a proportion adjusting hole, the proportion adjusting hole can communicate with the air spraying hole, and the communicating section area of the proportion adjusting hole and the air spraying hole can be adjusted based on movement of the proportion adjusting part. After the fixed pipeline is communicated with the air source, air flow can flow into the installation space and is sprayed out through the air spraying hole in the air spraying part, the proportion adjusting part is movably arranged in the installation space, and the communication section area of the proportion adjusting hole and the air spraying hole can be adjusted based on the movement of the proportion adjusting part, that is, the air spraying flow of the air spraying hole can be adjusted; the air inlet flow can be conveniently adjusted in the plasma etching process, and the plasma etching uniformity is improved.

Description

Technical Field

[0001] The invention relates to the technical field of jet structures, in particular to a jet structure and a plasma etcher. Background Art

[0002] Plasma etcher, also called plasma plane etcher, plasma etcher or plasma surface treatment instrument, is used in the semiconductor industry. Inductively coupled plasma etching is the result of the interaction of chemical and physical processes. The basic principle is that under vacuum and low pressure, the radio frequency generated by the ICP radio frequency power supply (ICP is the abbreviation of Inductively Coupled Plasma, representing inductively coupled plasma) is output to the annular coupling coil, and a certain proportion of mixed etching gas is coupled to glow discharge to generate high-density plasma. Under the action of the RF radio frequency (RF is the abbreviation of Radio Frequency, indicating the electromagnetic frequency that can be radiated into space) of the lower electrode, these plasmas bombard the surface of the substrate, and the chemical bonds of the semiconductor in the substrate pattern area are broken, generating volatile substances with the etching gas, which are separated from the substrate in the form of gas and are drawn out from the vacuum pipeline.

[0003] The gas flow rate sprayed by the gas injection structure used in the existing plasma etcher is fixed, and the gas flow rate cannot be adjusted during the plasma etching process, resulting in the plasma etching uniformity being affected.

[0004] Therefore, how to improve the uniformity of plasma etching is a technical problem that technicians in this field currently need to solve. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a gas injection structure to improve plasma etching uniformity.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A jet structure, comprising:

[0008] The fixed pipe sleeve can be connected with the gas source;

[0009] An injection member is arranged on the fixed pipe sleeve, the injection member and the fixed pipe sleeve are connected to form an installation space, and an injection hole is arranged on the injection member;

[0010] A proportional adjustment member is movably arranged in the installation space, and the proportional adjustment member is provided with a proportional adjustment hole, the proportional adjustment hole can be connected with the injection hole, and based on the movement of the proportional adjustment member, the conductive cross-sectional area of ​​the proportional adjustment hole and the injection hole can be adjusted.

[0011] Optionally, in the above-mentioned jet structure, the proportional adjustment member is rotatably disposed in the installation space.

[0012] Optionally, in the above-mentioned jet structure, the proportion adjustment member includes an adjustment shaft and a proportion adjustment block arranged on the adjustment shaft, and the proportion adjustment hole is located on the proportion adjustment block.

[0013] Optionally, in the above-mentioned air injection structure, a lateral air inlet groove and an edge air inlet channel are provided on the fixed pipe sleeve, the lateral air inlet groove can be communicated with an air source, and the edge air inlet channel is communicated with the lateral air inlet groove;

[0014] Wherein, the injection member is provided with a lateral gas injection hole, the injection direction of the lateral gas injection hole is perpendicular to the vertical direction and away from the center of the injection member, and the edge air inlet channel is aligned with and connected to the lateral gas injection hole.

[0015] Optionally, in the above-mentioned jet structure, the fixed pipe sleeve is provided with an edge air inlet pipeline that can be connected to the air source, the edge air inlet pipeline is connected to the lateral air inlet groove, and the edge air inlet pipeline is provided with a flow control valve for controlling the gas flow in the lateral air inlet groove.

[0016] Optionally, in the above-mentioned jet structure, a central air intake pipeline capable of communicating with an air source is provided on the fixed pipe sleeve, and the central air intake pipeline is in communication with the installation space.

[0017] Optionally, in the above-mentioned jet structure, the jet structure further comprises a rotary driving member for driving the proportional adjustment member to rotate, and a rotary output shaft of the rotary driving member is connected to the proportional adjustment member via a coupling.

[0018] Optionally, in the above-mentioned jet structure, a controller electrically connected to the rotary drive member is also included to control the operation of the rotary drive member through the controller.

[0019] Optionally, in the above-mentioned jet structure, the number of the jet holes and the ratio adjustment holes are both multiple groups, each group of the jet holes can be connected to its corresponding ratio adjustment hole, and the airflow jetting direction of each group of the jet holes is different.

[0020] Optionally, in the above-mentioned jet structure, the jet holes include a first group of gas jet holes and a second group of gas jet holes, the proportional adjustment holes include a first group of proportional adjustment holes and a second group of proportional adjustment holes, the first group of gas jet holes is connected to the first group of proportional adjustment holes, and the second group of gas jet holes is connected to the second group of proportional adjustment holes;

[0021] Wherein, based on the movement of the proportional adjustment member, the conductive cross-sectional areas of the first group of gas injection holes and the first group of proportional adjustment holes, and the conductive cross-sectional areas of the second group of gas injection holes and the second group of proportional adjustment holes all change.

[0022] Optionally, in the above-mentioned injection structure, the first group of gas injection holes includes a plurality of downward gas injection holes, the injection ports of the downward gas injection holes are arranged vertically downward, and the second group of gas injection holes includes a plurality of oblique downward gas injection holes, the injection ports of the oblique downward gas injection holes are arranged inclined to the vertical direction.

[0023] Optionally, in the above-mentioned jet structure, the first group of proportional adjustment holes includes a plurality of downward ventilation slots, and the second group of proportional adjustment holes includes a plurality of downward venting slots, and both the downward ventilation slots and the downward venting slots are arc-shaped slots extending along the circumferential direction of the proportional adjustment member.

[0024] Optionally, in the above-mentioned jet structure, the directly downward gas jet hole is located on a side of the oblique downward gas jet hole close to the center of the jet component, the directly downward ventilation slot hole is located on a side of the oblique downward ventilation slot hole close to the center of the ratio adjustment component, and the plurality of directly downward gas jet holes and the plurality of oblique downward gas jet holes are uniformly distributed along the circumferential direction of the jet component;

[0025] The center of each downward gas injection hole and the center line of its corresponding downward oblique gas injection hole are aligned in the radial direction of the injection member, and the downward ventilation slot and its corresponding downward oblique ventilation slot are offset in the radial direction of the ratio adjustment member.

[0026] Optionally, in the above-mentioned jet structure, the projection of the oblique downward ventilation slot on the circumferential surface where the center line of the directly downward ventilation slot is located deviates from the directly downward ventilation slot.

[0027] Optionally, in the above-mentioned jet structure, a projection of the oblique downward ventilation slot on the circumferential surface where the center line of the downward ventilation slot is located overlaps with the downward ventilation slot.

[0028] Optionally, in the above-mentioned jet structure, a first sink hole is provided on a side of the downward gas jet hole close to the proportional adjustment member, and a second sink hole is provided on a side of the downward oblique gas jet hole close to the proportional adjustment member.

[0029] Optionally, in the above-mentioned jet structure, a magnetic fluid seal or a sealing ring seal is used between the proportion adjustment member and the fixed sleeve.

[0030] A plasma etcher comprises the above-mentioned gas injection structure.

[0031] Optionally, the above-mentioned plasma etcher further includes a plasma reaction chamber, a support member and a shielding cover, wherein the support member is arranged in the plasma reaction chamber, the jet structure is arranged on the support member, and the shielding member is arranged on the outside of the plasma reaction chamber.

[0032] Optionally, in the above plasma etcher, a magnetic fluid seal or a sealing ring seal is used between the jet structure and the support member.

[0033] Optionally, in the above plasma etcher, it further comprises a ceramic dielectric window, a vacuum pump, a pressure control valve, an excitation radio frequency power supply, a plasma coupling coil, a bias radio frequency power supply and a bias electrode, and the support member reuses the ceramic dielectric window;

[0034] The vacuum pump is connected to the plasma reaction chamber, the pressure control valve is arranged on the connecting pipeline between the plasma reaction chamber and the vacuum pump, the plasma coupling coil is electrically connected to the excitation RF power supply, the bias RF power supply is electrically connected to the bias electrode, and the plasma coupling coil and the bias electrode are located in the plasma reaction chamber.

[0035] When the jet structure provided by the present invention is used, since the jet component is arranged on the fixed pipe sleeve, the jet component and the fixed pipe sleeve are connected to form an installation space, the proportional adjustment component is movably arranged in the installation space, and the proportional adjustment component is provided with a proportional adjustment hole, and the proportional adjustment hole can be connected with the jet hole. Therefore, after the fixed pipeline is connected with the gas source, the airflow can flow into the installation space, and the airflow is ejected from the jet hole on the jet component. Since the proportional adjustment component is movably arranged in the installation space, based on the movement of the proportional adjustment component, the conductive cross-sectional area of ​​the proportional adjustment hole and the jet hole can be adjusted, that is, the jet flow rate of the jet hole can be adjusted, which is convenient for adjusting the intake flow rate during the plasma etching process and improving the uniformity of plasma etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A schematic diagram of the structure of an air jet structure provided by an embodiment of the present invention when the air jet is directly downward;

[0038] Figure 2 A schematic diagram of the structure of an air jet structure provided by an embodiment of the present invention when the air jet is jetted obliquely downward;

[0039] Figure 3 A schematic diagram of a structure of an air jet structure provided by an embodiment of the present invention that jets air in both a downward direction and an oblique downward direction at the same time;

[0040] Figure 4 A schematic diagram of the structure of a proportional adjustment member provided by an embodiment of the present invention;

[0041] Figure 5 A schematic diagram of a top view of a jetting component provided by an embodiment of the present invention;

[0042] Figure 6 A schematic cross-sectional structure diagram of a jetting component provided by an embodiment of the present invention;

[0043] Figure 7 A schematic cross-sectional structure diagram of another jetting component provided by an embodiment of the present invention;

[0044] Figure 8 A schematic diagram of a structure in which the conductive cross-sectional area of ​​the first group of gas injection holes and the first group of proportional adjustment holes provided in an embodiment of the present invention is equal to the conductive cross-sectional area of ​​the second group of gas injection holes and the second group of proportional adjustment holes;

[0045] Fig. 9 A schematic diagram of a structure in which the conductive cross-sectional area of ​​the first group of gas injection holes and the first group of proportional adjustment holes provided by an embodiment of the present invention is larger than the conductive cross-sectional area of ​​the second group of gas injection holes and the second group of proportional adjustment holes;

[0046] Fig.10 A schematic diagram of a structure in which the conductive cross-sectional area of ​​the first group of gas injection holes and the first group of proportional adjustment holes provided by an embodiment of the present invention is smaller than the conductive cross-sectional area of ​​the second group of gas injection holes and the second group of proportional adjustment holes;

[0047] Fig.11 A schematic diagram of a periodic pulse jet flow rate in which a straight downward jet and an oblique downward jet are switched in sequence provided by an embodiment of the present invention;

[0048] Fig.12 A schematic diagram of a periodic pulse jet flow rate in which a straight downward jet, an oblique downward jet and a lateral jet are switched in sequence provided in an embodiment of the present invention;

[0049] Fig.13 A schematic diagram of proportional adjustment of jet flow rates in the downward and oblique directions provided by an embodiment of the present invention;

[0050] Fig.14 A schematic diagram of a working process of an injection structure provided by an embodiment of the present invention;

[0051] Fig.15A schematic structural diagram of an air jet structure provided in an embodiment of the present invention applied to a plasma etcher.

[0052] Among them, 100 is a fixed sleeve, 101 is a lateral air inlet groove, 102 is an edge air inlet channel, 103 is a first sealing ring, 104 is an edge air inlet pipeline, 105 is a central air inlet pipeline, 200 is an injection member, 201 is a lateral gas injection hole, 202 is a first group of gas injection holes, 203 is a second group of gas injection holes, 204 is a first sink hole, 205 is a second sink hole, 300 is a ratio adjustment member, 301 is an adjustment shaft, 302 is a ratio For example, the adjustment block, 3021 is the first group of proportional adjustment holes, 3022 is the second group of proportional adjustment holes, 400 is the rotary drive member, 401 is the coupling, 500 is the plasma reaction chamber, 501 is the plasma coupling coil, 502 is the bias electrode, 503 is the ceramic dielectric window, 5031 is the second sealing ring, 504 is the shielding cover, 600 is the vacuum pump, 700 is the pressure control valve, 800 is the excitation RF power supply, and 900 is the bias RF power supply. DETAILED DESCRIPTION

[0053] In view of this, the core of the present invention is to provide a gas injection structure to improve the uniformity of plasma etching.

[0054] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] like Figures 1 to 15 As shown, an embodiment of the present invention discloses an injection structure, including a fixed sleeve 100 , an injection member 200 and a ratio adjustment member 300 .

[0056] Among them, the fixed sleeve 100 can be connected to the air source; the jet component 200 is arranged on the fixed sleeve 100, and the jet component 200 is connected with the fixed sleeve 100 to form an installation space, and the jet component 200 is provided with an jet hole; the proportional adjustment component 300 is movably arranged in the installation space, and the proportional adjustment component 300 is provided with a proportional adjustment hole, and the proportional adjustment hole can be connected to the jet hole, and based on the movement of the proportional adjustment component 300, the conductive cross-sectional area of ​​the proportional adjustment hole and the jet hole can be adjusted.

[0057] When the jet structure provided by the present invention is used, since the jet component 200 is arranged on the fixed pipe sleeve 100, the jet component 200 is connected to the fixed pipe sleeve 100 to form an installation space, and the proportional adjustment component 300 is movably arranged in the installation space. The proportional adjustment component 300 is provided with a proportional adjustment hole, and the proportional adjustment hole can be connected with the jet hole. Therefore, after the fixed pipeline is connected with the gas source, the airflow can flow into the installation space, and the airflow is ejected from the jet hole on the jet component 200. Since the proportional adjustment component 300 is movably arranged in the installation space, based on the movement of the proportional adjustment component 300, the conductive cross-sectional area of ​​the proportional adjustment hole and the jet hole can be adjusted, that is, the jet flow rate of the jet hole can be adjusted, which is convenient for adjusting the intake flow rate during the plasma etching process and improving the uniformity of plasma etching.

[0058] It should be noted that the above-mentioned proportional adjustment member 300 can adjust the conduction cross-sectional area of ​​the proportional adjustment hole and the jet hole through reciprocating linear motion or rotation and other types of motion. As long as the type of motion can meet the use requirements, it belongs to the protection scope of the present invention; optionally, in a specific embodiment of the present invention, the proportional adjustment member 300 is rotatably arranged in the installation space, so that the proportional adjustment member 300 can adjust the jet flow rate of the jet hole through rotation.

[0059] Specifically, the proportional adjustment member 300 includes an adjustment shaft 301 and a proportional adjustment block 302. The proportional adjustment block 302 is arranged on the adjustment shaft 301, and the proportional adjustment hole is located on the proportional adjustment block 302, so that the proportional adjustment block 302 rotates with the adjustment shaft 301. Based on the rotation of the proportional adjustment block 302, the proportional adjustment hole on the proportional adjustment block 302 also responds to the rotation, so that the conductive cross-sectional area of ​​the proportional adjustment hole and the jet hole is adjusted, thereby adjusting the jet flow of the jet hole.

[0060] like Figures 1 to 3 As shown, the fixed sleeve 100 is provided with a lateral air inlet groove 101 and an edge air inlet channel 102, the lateral air inlet groove 101 can be communicated with the air source, and the edge air inlet channel 102 is communicated with the lateral air inlet groove 101; wherein, the jetting member 200 is provided with a lateral gas injection hole 201, the injection direction of the lateral gas injection hole 201 is perpendicular to the vertical direction and away from the center of the jetting member 200, and the edge air inlet channel 102 is aligned with and communicated with the lateral gas injection hole 201, so as to facilitate the lateral The air inlet groove 101, the edge air inlet channel 102 and the lateral gas injection hole 201 form a lateral airflow channel. After the lateral air inlet groove 101 and the air source are connected, the airflow flows through the edge air inlet channel 102, and the airflow perpendicular to the vertical direction is ejected from the lateral gas injection hole 201. Based on the fixed setting of the lateral air inlet groove 101 and the edge air inlet channel 102, the lateral airflow channel will not change with the movement of the proportional adjustment member 300. Therefore, the lateral airflow channel of the jet structure can be controlled individually.

[0061] For example, in a specific embodiment of the present invention, an edge air inlet pipeline 104 that can communicate with an air source is provided on the fixed sleeve 100, the edge air inlet pipeline 104 is connected to the lateral air inlet groove 101, and a flow control valve is provided on the edge air inlet pipeline 104, which is used to control the gas flow in the lateral air inlet groove 101 through a flow control method, thereby realizing separate control of the lateral airflow channel, so that the jet structure can independently control the lateral jet.

[0062] The fixed pipe sleeve 100 is provided with a central air inlet pipe 105 which can communicate with the air source, and the central air inlet pipe 105 is connected with the installation space so that the air source is introduced into the installation space through the central air inlet pipe 105, so that the air source flows through the installation space and the proportional adjustment hole on the proportional adjustment component 300 in turn, and then the air flow is ejected from the injection hole on the injection component 200.

[0063] In addition, the jet structure further comprises a rotary drive member 400 , a rotary output shaft of the rotary drive member 400 is connected to the adjustment shaft 301 of the proportional adjustment member 300 via a coupling 401 , so as to drive the rotation of the adjustment shaft 301 via the rotary drive member 400 .

[0064] In addition, the above-mentioned jet structure also includes a controller electrically connected to the rotating drive member 400. The controller can pre-receive and store the correspondence between the rotation angle and the airflow injection direction, so as to control the operation of the rotating drive member 400 through the controller. After the rotating drive member 400 rotates to a preset position and stops, the jet structure injects airflow according to the predetermined airflow injection direction.

[0065] The number of the jet holes and the proportional adjustment holes provided by the present invention are both multiple groups, each group of jet holes can be connected to its corresponding proportional adjustment hole, and the airflow injection direction of each group of jet holes is different, so as to realize the switching of multiple gas injection directions and broaden the function of the jet structure.

[0066] It should be understood that the present invention does not specifically limit the number and arrangement of the above-mentioned air injection holes and ratio adjustment holes. As long as the number and arrangement can meet the use requirements, they belong to the protection scope of the present invention.

[0067] Optionally, in a specific embodiment of the present invention, the jet holes include a first group of gas jet holes 202 and a second group of gas jet holes 203, the proportional adjustment holes include a first group of proportional adjustment holes 3021 and a second group of proportional adjustment holes 3022, the first group of gas jet holes 202 and the first group of proportional adjustment holes 3021 are connected, and the second group of gas jet holes 203 and the second group of proportional adjustment holes 3022 are connected; wherein, based on the movement of the proportional adjustment member 300, the conductive cross-sectional area of ​​the first group of gas jet holes 202 and the first group of proportional adjustment holes 3021, and the conductive cross-sectional area of ​​the second group of gas jet holes 203 and the second group of proportional adjustment holes 3022 all change, so that the jet flow rate of the first group of gas jet holes 202 and the jet flow rate of the second group of gas jet holes 203 are adjusted.

[0068] The specific injection directions of the first group of gas injection holes 202 and the second group of gas injection holes 203 are not limited, and any injection direction that can meet the use requirements belongs to the protection scope of the present invention; optionally, in a specific embodiment of the present invention, the first group of gas injection holes 202 includes a plurality of downward gas injection holes, and the injection ports of the downward gas injection holes are vertically arranged downward, and the second group of gas injection holes 203 includes a plurality of oblique downward gas injection holes, and the injection ports of the oblique downward gas injection holes are arranged obliquely to the vertical direction, so as to realize injection in both the downward and oblique directions through the injection structure.

[0069] like Figure 4 As shown, the first group of proportional adjustment holes 3021 includes a plurality of downward ventilation slots, and the second group of proportional adjustment holes 3022 includes a plurality of downward venting slots, and both the downward ventilation slots and the downward venting slots are arc-shaped slots extending along the circumferential direction of the proportional adjustment member 300, so as to facilitate the adjustment of the conduction cross-sectional area of ​​the first group of proportional adjustment holes 3021 and the first group of gas injection holes 202, as well as the conduction cross-sectional area of ​​the second group of proportional adjustment holes 3022 and the second group of gas injection holes 203 based on the rotation of the proportional adjustment member 300.

[0070] It should be noted that the above-mentioned downward ventilation slots and oblique downward ventilation slots are but not limited to arc-shaped slots, and can also be elliptical holes or polygonal holes and other types of structures. As long as the shape can meet the use requirements, it belongs to the protection scope of the present invention.

[0071] like Figures 8 to 10 As shown, the gas injection hole directly below is located on the side of the oblique gas injection hole close to the center of the injection member 200, and the ventilation slot directly below is located on the side of the oblique ventilation slot close to the center of the ratio adjustment member 300, that is, the gas injection hole directly below is located on the inner side of the oblique gas injection hole, and the ventilation slot directly below is located on the inner side of the oblique ventilation slot. Figures 8 to 10The outer black shadow in the figure represents the cross-sectional area of ​​the oblique gas injection hole and the oblique ventilation slot hole, and the inner black shadow represents the cross-sectional area of ​​the gas injection hole and the ventilation slot hole directly below. Figure 8 In the figure, the outer circle black shaded area is the same as the inner circle black shaded area, indicating that the conductive cross-sectional area of ​​the first group of gas injection holes 202 and the first group of proportional adjustment holes 3021 is equal to the conductive cross-sectional area of ​​the second group of gas injection holes 203 and the second group of proportional adjustment holes 3022, that is, the airflow ratio in the downward direction and the oblique downward direction is equal; Fig. 9 In the figure, the inner circle black shaded area is larger than the outer circle black shaded area, indicating that the conductive cross-sectional area of ​​the first group of gas injection holes 202 and the first group of proportional adjustment holes 3021 is larger than the conductive cross-sectional area of ​​the second group of gas injection holes 203 and the second group of proportional adjustment holes 3022, that is, the airflow ratio in the downward direction is larger than the airflow ratio in the oblique downward direction; Fig.10 In the figure, the black shaded area of ​​the inner circle is smaller than the black shaded area of ​​the outer circle, indicating that the conductive cross-sectional area of ​​the first group of gas injection holes 202 and the first group of proportional adjustment holes 3021 is smaller than the conductive cross-sectional area of ​​the second group of gas injection holes 203 and the second group of proportional adjustment holes 3022, that is, the airflow ratio in the downward direction is smaller than the airflow ratio in the oblique downward direction.

[0072] Furthermore, the directly downward gas injection hole is located on the side of the oblique downward gas injection hole close to the center of the injection member 200, the directly downward ventilation slot is located on the side of the oblique downward ventilation slot close to the center of the proportional adjustment member 300, and the multiple directly downward gas injection holes and the multiple oblique downward gas injection holes are evenly distributed along the circumferential direction of the injection member 200; wherein, the center of each directly downward gas injection hole and the center connecting line of its corresponding oblique downward gas injection hole are aligned in the radial direction of the injection member 200, and the directly downward ventilation slot and its corresponding oblique downward ventilation slot are offset in the radial direction of the proportional adjustment member 300, so as to realize the switching of the directly downward injection and the oblique downward injection, and the adjustment of the directly downward direction airflow ratio and the oblique downward direction airflow ratio based on the rotation of the proportional adjustment member 300.

[0073] On the circumferential surface where the center line of the ventilation slot directly below is located, the projection of the ventilation slot directly below deviates from the ventilation slot directly below, so that when the proportional adjustment member 300 is rotated to the first preset position, only the first group of gas injection holes 202 and the first group of proportional adjustment holes 3021 are connected, and the second group of gas injection holes 203 and the second group of proportional adjustment holes 3022 are cut off, and the jet structure only realizes jetting in the directly downward direction; when the proportional adjustment member 300 is rotated to the second preset position, only the second group of gas injection holes 203 and the second group of proportional adjustment holes 3022 are connected, and the first group of gas injection holes 202 and the first group of proportional adjustment holes 3021 are cut off, and the jet structure only realizes jetting in the oblique downward direction, realizing the periodic switching of jetting in the directly downward direction and jetting in the oblique downward direction; within the time interval of switching between jetting in the directly downward direction and jetting in the oblique downward direction, that is, when the proportional adjustment member 300 has not yet been rotated to the first preset position and has not yet been rotated to the second preset position, the central air intake pipeline 105 controls the gas source to be cut off and no jet is performed, and at this time, the following is formed. Fig.11 The periodic pulse jet shown is a periodic pulse jet in which the downward jet and the oblique downward jet are switched in sequence.

[0074] If the length of the oblique downward ventilation slot is longer, the projection of the oblique downward ventilation slot overlaps with the directly downward ventilation slot on the circumferential surface where the center line of the directly downward ventilation slot is located. Then, based on the rotation of the proportional adjustment member 300, the directly downward jet and the oblique downward jet of the jet structure are switched in sequence, and the following is formed: Fig.13 As shown, the air flow ratio of the downward jet and the oblique downward jet changes periodically, and the total air flow of the downward jet and the oblique downward jet is maintained at 100%.

[0075] It should be understood that in the above Fig.11 In the periodic pulse jet in which the downward jet and the oblique downward jet are switched in sequence, the side jet can be controlled separately based on the jet structure. Therefore, by controlling the start and stop time interval of the rotary drive member 400, the side jet, the downward jet and the oblique downward jet can be switched in sequence to form a Fig.12 The periodic pulse jet shown.

[0076] like Figures 5 to 7 As shown, a first countersunk hole 204 is provided on the side of the downward gas injection hole close to the proportional adjustment member 300, and a second countersunk hole 205 is provided on the side of the oblique gas injection hole close to the proportional adjustment member 300, so as to reduce the poor alignment between the downward gas injection hole and the downward ventilation slot hole caused by manufacturing errors through the first countersunk hole 204, and reduce the poor alignment between the oblique gas injection hole and the oblique ventilation slot hole caused by manufacturing errors through the second countersunk hole 205, thereby improving the injection effect.

[0077] The above-mentioned proportional adjustment member 300 and the fixed pipe sleeve 100 are sealed by magnetic fluid sealing or sealing ring sealing. As long as the sealing method can meet the sealing requirements, it belongs to the protection scope of the present invention; optionally, a first sealing ring 103 is provided between the proportional adjustment member 300 and the fixed pipe sleeve 100 provided in the embodiment of the present invention for sealing.

[0078] In addition, the present invention also discloses a plasma etcher, including the jet structure as described above, and thus has all the technical effects of the jet structure as described above, which will not be described in detail herein.

[0079] Furthermore, the above-mentioned plasma etcher also includes a plasma reaction chamber 500, a support member and a shielding cover 504. The support member is arranged in the plasma reaction chamber 500, the jet structure is arranged on the support member, and the shielding member is arranged on the outside of the plasma reaction chamber 500, so as to shield the plasma reaction chamber 500 through the shielding member, and the jet structure is arranged on the support member, and the jet structure is supported by the support member, and the jet is sprayed into the plasma reaction chamber 500 through the jet structure.

[0080] Magnetic fluid sealing or sealing ring sealing can also be used between the above-mentioned jet structure and the support member. As long as the sealing method can meet the use requirements, it belongs to the protection scope of the present invention; optionally, a second sealing ring 5031 is provided between the jet structure and the support member provided in the embodiment of the present invention for sealing.

[0081] It should be understood that the support member provided by the present invention can be a support member additionally arranged in the plasma reaction chamber 500, or it can directly reuse the existing structure of the plasma etcher. As long as the arrangement method can meet the use requirements, it belongs to the protection scope of the present invention; optionally, in one embodiment of the present invention, the support member reuses the ceramic dielectric window 503 of the plasma etcher to reduce the number of parts and reduce costs.

[0082] Specifically, the above-mentioned plasma etcher also includes a ceramic dielectric window 503, a vacuum pump 600, a pressure control valve 700, an excitation RF power supply 800, a plasma coupling coil 501, a bias RF power supply 900 and a bias electrode 502, and the support reuses the ceramic dielectric window 503; wherein the vacuum pump 600 is connected to the plasma reaction chamber 500, the pressure control valve 700 is arranged on the connecting pipeline between the plasma reaction chamber 500 and the vacuum pump 600, the plasma coupling coil 501 is electrically connected to the excitation RF power supply 800, the bias RF power supply 900 is electrically connected to the bias electrode 502, and the plasma coupling coil and the bias The electrode 502 is located in the plasma reaction chamber 500, and the plasma reaction chamber 500 is evacuated by a vacuum pump 600, and process gas is sprayed into the plasma reaction chamber 500 through an injection structure. Under vacuum low pressure, the radio frequency generated by the bias radio frequency power supply 900 is output to the annular plasma coupling coil 501, and plasma is generated under the action of the plasma coupling coil 501. The bias electrode 502 provides a bias to accelerate the plasma to bombard the substrate, so that the chemical bonds of the semiconductor in the graphic area of ​​the substrate are broken, and volatile substances are generated with the etching gas, which are separated from the substrate in the form of gas and are extracted from the vacuum pipeline.

[0083] It should be understood that the jet structure provided by the present invention can be used for but not limited to plasma etcher, and can also be used in flue gas mixing devices or gas water heaters and other fields. Therefore, the present invention does not specifically limit the application field of the jet structure.

[0084] The terms "first" and "second" and the like in the specification and claims of the present invention and the above drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but may include steps or units that are not listed.

[0085] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A jet structure, characterized in that: include: The fixed pipe sleeve can be connected with the gas source; An injection member is arranged on the fixed pipe sleeve, the injection member and the fixed pipe sleeve are connected to form an installation space, and an injection hole is arranged on the injection member; A proportional adjustment member is movably arranged in the installation space, and the proportional adjustment member is provided with a proportional adjustment hole, the proportional adjustment hole can be connected with the injection hole, and based on the movement of the proportional adjustment member, the conductive cross-sectional area of ​​the proportional adjustment hole and the injection hole can be adjusted.

2. The jet structure according to claim 1, characterized in that: The proportional adjustment member is rotatably arranged in the installation space.

3. The jet structure according to claim 2, characterized in that: The proportion adjustment member comprises an adjustment shaft and a proportion adjustment block arranged on the adjustment shaft, and the proportion adjustment hole is located on the proportion adjustment block.

4. The jet structure according to claim 1, characterized in that: The fixed pipe sleeve is provided with a lateral air inlet groove and an edge air inlet channel, the lateral air inlet groove can be communicated with an air source, and the edge air inlet channel is communicated with the lateral air inlet groove; Wherein, the injection member is provided with a lateral gas injection hole, the injection direction of the lateral gas injection hole is perpendicular to the vertical direction and away from the center of the injection member, and the edge air inlet channel is aligned with and connected to the lateral gas injection hole.

5. The jet structure according to claim 4, characterized in that: The fixed pipe sleeve is provided with an edge air inlet pipeline which can be communicated with the air source, the edge air inlet pipeline is connected with the lateral air inlet groove, and the edge air inlet pipeline is provided with a flow control valve for controlling the gas flow in the lateral air inlet groove.

6. The jet structure according to claim 1, characterized in that: The fixed pipe sleeve is provided with a central air intake pipeline which can be communicated with an air source, and the central air intake pipeline is communicated with the installation space.

7. The jet structure according to claim 6, characterized in that: The jet structure further comprises a rotary drive member for driving the proportional adjustment member to rotate, and a rotary output shaft of the rotary drive member is connected to the proportional adjustment member via a coupling.

8. The jetting structure according to claim 7, characterized in that: A controller electrically connected to the rotary drive member is also included to control the operation of the rotary drive member through the controller.

9. The jet structure according to claim 1, characterized in that: The number of the jet holes and the ratio adjustment holes are both multiple groups, each group of the jet holes can be connected to the corresponding ratio adjustment hole, and the airflow injection direction of each group of the jet holes is different.

10. The jet structure according to claim 1, characterized in that: The gas injection holes include a first group of gas injection holes and a second group of gas injection holes, the proportional adjustment holes include a first group of proportional adjustment holes and a second group of proportional adjustment holes, the first group of gas injection holes is connected to the first group of proportional adjustment holes, and the second group of gas injection holes is connected to the second group of proportional adjustment holes; Wherein, based on the movement of the proportional adjustment member, the conductive cross-sectional areas of the first group of gas injection holes and the first group of proportional adjustment holes, and the conductive cross-sectional areas of the second group of gas injection holes and the second group of proportional adjustment holes all change.

11. The jetting structure according to claim 10, characterized in that: The first group of gas injection holes includes a plurality of directly downward gas injection holes, the injection ports of which are arranged vertically downward, and the second group of gas injection holes includes a plurality of obliquely downward gas injection holes, the injection ports of which are arranged obliquely to the vertical direction.

12. The jetting structure according to claim 11, characterized in that: The first group of proportional adjustment holes includes a plurality of downward ventilation slots, and the second group of proportional adjustment holes includes a plurality of downward venting slots. Both the downward ventilation slots and the downward venting slots are arc-shaped slots extending along the circumferential direction of the proportional adjustment member.

13. The jetting structure according to claim 12, characterized in that: The directly downward gas injection hole is located on one side of the oblique downward gas injection hole close to the center of the injection member, the directly downward ventilation slot is located on one side of the oblique downward ventilation slot close to the center of the ratio adjustment member, and the plurality of directly downward gas injection holes and the plurality of oblique downward gas injection holes are uniformly distributed along the circumferential direction of the injection member; The center of each downward gas injection hole and the center line of its corresponding downward oblique gas injection hole are aligned in the radial direction of the injection member, and the downward ventilation slot and its corresponding downward oblique ventilation slot are offset in the radial direction of the ratio adjustment member.

14. The jetting structure according to claim 13, characterized in that: The projection of the oblique lower ventilation slot on the circumferential surface where the center line of the directly lower ventilation slot is located deviates from the directly lower ventilation slot.

15. The jetting structure according to claim 13, characterized in that: The projection of the obliquely downward ventilation slot on the circumferential surface where the center line of the directly downward ventilation slot is located overlaps with the directly downward ventilation slot.

16. The jetting structure according to claim 11, characterized in that: A first sink hole is provided on one side of the gas injection hole directly below the ratio adjustment member, and a second sink hole is provided on one side of the gas injection hole directly below the ratio adjustment member.

17. The jetting structure according to claim 1, characterized in that: A magnetic fluid seal or a sealing ring seal is used between the ratio adjustment member and the fixed sleeve.

18. A plasma etcher, characterized in that: Comprising the jet structure according to any one of claims 1 to 17.

19. The plasma etcher according to claim 18, characterized in that: It also includes a plasma reaction chamber, a support member and a shielding cover. The support member is arranged in the plasma reaction chamber, the jet structure is arranged on the support member, and the shielding member is arranged outside the plasma reaction chamber.

20. The plasma etcher according to claim 19, characterized in that: A magnetic fluid seal or a sealing ring seal is used between the jet structure and the support member.

21. The plasma etcher according to claim 19, characterized in that: It also includes a ceramic dielectric window, a vacuum pump, a pressure control valve, an excitation radio frequency power supply, a plasma coupling coil, a bias radio frequency power supply and a bias electrode, and the support member reuses the ceramic dielectric window; The vacuum pump is connected to the plasma reaction chamber, the pressure control valve is arranged on the connecting pipeline between the plasma reaction chamber and the vacuum pump, the plasma coupling coil is electrically connected to the excitation RF power supply, the bias RF power supply is electrically connected to the bias electrode, and the plasma coupling coil and the bias electrode are located in the plasma reaction chamber.

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