Intelligent semiconductor processing chamber

Abstract

The invention belongs to the technical field of semiconductors, and discloses an intelligent semiconductor processing chamber which comprises a processing chamber body, one side of the outer surface of the processing chamber body is connected with a driving shell in a communicating mode, a conveying opening is formed in one side of the outer surface of the processing chamber body, and supporting rods are annularly arranged on the lower end face of the processing chamber body at equal angles; a conveying mechanism is arranged in the conveying opening; a lifting mechanism is arranged at the bottom in the processing cavity; through the arrangement of the placing groove, the semiconductor can be taken and placed more conveniently, the phenomenon that the semiconductor is turned over outwards in the taking process is avoided, and it can be guaranteed that the infrared receiver in the middle of the bearing circular plate can normally receive signals of the infrared transmitter.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor technology, and in particular relates to an intelligent semiconductor processing chamber. Background Art

[0002] A plasma processing chamber is a sealed chamber used for plasma processing. Plasma processing is used in many fields, such as semiconductor manufacturing, material surface treatment, etc. In a plasma chamber, plasma is generated by various means to interact with the workpiece or substrate in the chamber to achieve specific processing purposes, such as etching, deposition, cleaning, etc.

[0003] Before working in the plasma processing chamber, the semiconductor is first placed in the plasma processing chamber, but it is not convenient to place it, and it is not convenient to take it out. In particular, after opening the top cover, the gas generated by the processing will be mixed with the environment of the studio. By opening the top cover many times, the environment of the studio will gradually be polluted, causing increased harm to the human body, reducing practicality and protection.

[0004] Therefore, an intelligent semiconductor processing chamber is proposed to address the above problems. Summary of the invention

[0005] In order to solve the problem of lack of work and related technologies with safety for body transport of pregnant women raised in the above background technology, the present invention provides an intelligent semiconductor processing chamber.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] An intelligent semiconductor processing chamber comprises a processing chamber, wherein one side of the outer surface of the processing chamber is connected to a drive shell, and one side of the outer surface of the processing chamber is provided with a conveying port, and the lower end surface of the processing chamber is provided with support rods in an equiangular ring shape, and a conveying mechanism is provided inside the conveying port; and a lifting mechanism is provided at the bottom of the processing chamber.

[0008] Preferably, the conveying mechanism includes a support plate fixedly connected to one side of the upper end surface of the driving shell, a motor is fixed to one side of the support plate, a rotating shaft is connected to the output end of the motor, a first pulley is sleeved on one end of the rotating shaft, the first pulley is matched with a second pulley through a transmission belt, a screw is sleeved inside the second pulley, one end of the screw is inserted into a rotating opening opened on a side surface of the driving shell, and one end of the screw is meshed with a spiral groove opened inside the movable plate.

[0009] Preferably, both sides of the lower end surface of the movable plate are fixedly connected with sliding plates, and the sliding plates are slidably fitted in sliding grooves provided at the bottom of the driving housing.

[0010] Preferably, a transmission plate is connected to one side of the movable plate, and a through opening is provided inside the transmission plate.

[0011] Preferably, a placement plate is fixedly connected to one side of the transmission plate, a placement circular groove is provided on the upper surface of the placement plate, a through hole is provided in the middle of the placement circular groove, and an overlapping arc plate is fixedly connected to one side of the placement plate, and the two sides of the overlapping arc plate are closed and fitted in the inner two side walls of the conveying port, and one side of the placement plate is closed and fitted in a sliding port provided on the inner side wall of the drive shell, and the sliding port is connected to the interior of the processing chamber.

[0012] Preferably, a receiving circular plate is placed inside the placement groove, an infrared receiver is arranged in the middle of the lower end surface of the receiving circular plate, semiconductors are placed on the upper end surface of the receiving circular plate at equal distances along the length direction, and a gas delivery pipe head is arranged on the upper end surface of the processing chamber.

[0013] Preferably, the lifting mechanism includes an electric pusher, which is connected to the inner bottom of the processing chamber through a fixed plate, and the output end of the electric pusher is connected to a pushing rod, the upper ends of the pushing plates are slidably matched with the first partition and the second partition, a vacuum pump is provided on one side of the first partition, and the inner periphery of the second partition is provided with air guide holes in an equiangular ring shape, the upper end face of the pushing rod is fixedly connected to a top plate, and an infrared ray emitter is provided in the middle of the upper end face of the top plate, and a processing cavity is formed by the upper end face of the second partition and the upper part of the processing chamber.

[0014] Preferably, the upper end of the infrared transmitter is opposite to the lower end of the infrared receiver, and when the top plate is in operation, the upper end surface of the top plate is pressed against the lower end surface of the supporting circular plate, and the top plate passes through the interior of the through hole.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The present invention allows both sides of the receiving circular plate to leak outwards by setting the placement groove, which effectively makes the work of taking and placing more convenient, and does not cause the semiconductor 27 to tip over outwards during taking, and also ensures that the infrared receiver in the middle of the receiving circular plate can receive signals normally.

[0017] The overlapping arc plate of the present invention is closed inside the conveying port, and one side of the placement plate is closed inside the sliding port. The conveying port and the sliding port are provided with sealing strips to avoid failure to reach a vacuum state and leakage of processed gas, thereby improving safety.

[0018] After the bearing circular plate is gradually separated from the placement groove by force, the relative position distance between the bearing circular plate and the gas delivery pipe head is relatively close, so that the semiconductor can be better etched and the height of the bearing circular plate can be automatically adjusted to avoid reducing the effect of gas etching on the semiconductor.

[0019] The present invention can automatically realize the processing state and the placement state through the sliding cooperation between the placement plate and the conveying port, and reduce the amount of process gas discharged into the working chamber, effectively reducing the damage to the artificial body, improving practicality and strengthening protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the placement state of the placement plate of the present invention;

[0022] Figure 3 is a full cross-sectional view of the processing chamber of the present invention;

[0023] Figure 4 This is a schematic diagram of the screw structure of the present invention;

[0024] Figure 5 It is a structural schematic diagram of the movable plate of the present invention;

[0025] Figure 6 It is a structural schematic diagram of the transmission plate of the present invention;

[0026] Figure 7 This is a schematic diagram of the structure of the placement plate of the present invention;

[0027] Figure 8 It is a schematic diagram of the structure of the bearing circular plate of the present invention.

[0028] In the figure: 1, processing chamber; 11, driving shell; 111, rotating port; 112, sliding groove; 113, sliding port; 12, conveying port; 13, support rod; 14, processing chamber; 2, conveying mechanism; 21, support plate; 22, motor; 221, rotating shaft; 222, first pulley; 223, transmission belt; 224, second pulley; 225, screw; 23, moving plate; 231, sliding plate; 24, transmission plate; 241. Through opening; 25. Placement plate; 251. Placement groove; 252. Through hole; 253. Overlapping arc plate; 26. Supporting circular plate; 261. Infrared receiver; 27. Semiconductor; 28. Gas delivery pipe head; 3. Lifting mechanism; 31. Electric pusher; 32. Push rod; 33. First partition; 331. Vacuum pump; 34. Second partition; 341. Air guide hole; 35. Top plate; 36. Infrared emitter. DETAILED DESCRIPTION

[0029] The following will be used in conjunction with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figure 1 , Figure 3 As shown, the present invention provides an intelligent semiconductor processing chamber, including a processing chamber 1, wherein one side of the outer surface of the processing chamber 1 is connected to a driving shell 11, and one side of the outer surface of the processing chamber 1 is provided with a conveying port 12, and the lower end surface of the processing chamber 1 is provided with support rods 13 in an equiangular ring shape, and a conveying mechanism 2 is provided inside the conveying port 12; and a lifting mechanism 3 is provided at the bottom of the processing chamber 1.

[0031] like Figure 4 As shown, the conveying mechanism 2 includes a support plate 21 fixedly connected to one side of the upper end surface of the driving shell 11, a motor 22 is fixed to one side of the support plate 21, and the output end of the motor 22 is connected to a rotating shaft 221, one end of the rotating shaft 221 is sleeved with a first pulley 222, and the first pulley 222 is driven by a transmission belt 223 and is matched with a second pulley 224, and a screw 225 is sleeved inside the second pulley 224, one end of the screw 225 is inserted into a rotating port 111 opened on one side of the driving shell 11, and one end of the screw 225 is meshed with a spiral groove 231 opened inside the movable plate 23.

[0032] The above scheme is adopted: the starting motor 22 drives the rotating shaft 221 to rotate clockwise, and the rotating shaft 221 drives the first pulley 222 to rotate clockwise. The first pulley 222 is subjected to force and transmitted to the second pulley 224 through the transmission belt 223. The second pulley 224 is subjected to force and drives the screw 225 clockwise. The screw 225 is subjected to force and rotates clockwise inside the rotating mouth 111. At the same time, the screw 225 is engaged clockwise with the inside of the spiral groove 231 on the movable plate 23, so that the movable plate 23 moves to one side, which is conducive to allowing the placement plate 25 to automatically realize the processing state and the placement state. Moreover, the amount of process gas discharged into the working chamber is reduced, which effectively reduces the damage to the artificial body, improves practicality, and strengthens protection.

[0033] like Figure 5 As shown, both sides of the lower end surface of the movable plate 23 are fixedly connected with sliding plates 231 , and the sliding plates 231 are slidably fitted in the sliding grooves 112 opened at the bottom of the driving shell 11 .

[0034] By adopting the above scheme, the sliding plate 231 on the movable plate 23 slides to one side inside the sliding groove 112, and at the same time, the movable plate 23 drives the transmission plate 24 to move to one side, and the transmission plate 24 is forced to slide to one side inside the sliding opening 113, which is conducive to ensuring that the movable plate 23 moves stably to one side.

[0035] like Figure 6 As shown, a side surface of the movable plate 23 is connected to a transmission plate 24 , and a through opening 241 is formed inside the transmission plate 24 .

[0036] The above solution is adopted to ensure that the moving plate 23 stably drives the placement plate 25 to one side.

[0037] like Figure 6 , Figure 7 As shown, a placement plate 25 is fixedly connected to one side of the transmission plate 24, a placement circular groove 251 is opened on the upper surface of the placement plate 25, a through hole 252 is opened in the middle of the placement circular groove 251, and a overlap arc plate 253 is fixedly connected to one side of the placement plate 25, and the overlap arc plate 253 is closed and fit in the inner two side walls of the conveying port 12 at both sides, and the placement plate 25 is closed and fit in the sliding port 113 opened on the inner wall of the driving shell 11 at one side, and the sliding port 113 is connected to the interior of the processing chamber 1.

[0038] The above solution is adopted: the overlapping arc plate 253 is closed inside the conveying port 12, and one side of the placement plate 25 is closed inside the sliding port 113. The conveying port 12 and the sliding port are provided with sealing strips to avoid the failure to reach a vacuum state and the leakage of processed gas, thereby improving safety.

[0039] like Figure 3 , Figure 7 , Figure 8 As shown, a receiving circular plate 26 is placed inside the placement groove 251, an infrared receiver 261 is arranged in the middle of the lower end surface of the receiving circular plate 26, semiconductors 27 are placed on the upper end surface of the receiving circular plate 26 at equal distances along the length direction, and a gas delivery pipe head 28 is arranged on the upper end surface of the processing chamber 1.

[0040] The above solution is adopted: the placing plate 25 is forced to slide on the outside inside the delivery port 12 until the placing plate 25 moves outward to the position as shown in FIG. Figure 2 As shown, stop the motor 22, then place the receiving circular plate 26 inside the placement groove 252. Through the setting of the placement groove 251, the two sides of the receiving circular plate 26 are exposed outward, which effectively makes the work of taking and placing more convenient, and does not appear that the semiconductor 27 is turned outward during taking. It also ensures that the infrared receiver 261 in the middle of the receiving circular plate 26 can receive the signal normally.

[0041] like Figure 3 As shown, the lifting mechanism 3 includes an electric pusher 31, which is connected to the inner bottom of the processing chamber 1 through a fixed plate, and the output end of the electric pusher 31 is connected to a push rod 32, the upper ends of the push plate 32 are slidably matched with a first partition 33 and a second partition 34, a vacuum pump 331 is provided on one side of the first partition 33, and the second partition 34 has air guide holes 341 in an equiangular ring shape on the inner periphery, the upper end face of the push rod 32 is fixedly connected to a top plate 35, and an infrared ray emitter 36 is provided in the middle of the upper end face of the top plate 35, and the upper end face of the second partition 34 and the upper inner part of the processing chamber 1 form a processing cavity 14.

[0042] The above scheme is adopted: after the infrared receiver 261 receives the signal, the controller receives the signal, stops the motor 22, starts the electric pusher 31 to drive the push rod 32 to rise, and the push rod 32 drives the top plate 35 to move upward. During the gradual upward movement, it first penetrates into the interior of the through hole 252, and then presses against the bottom end surface of the supporting circular plate 26, so that the supporting circular plate 26 is gradually separated from the interior of the placement groove 251 by the force, until the supporting circular plate 26 is transported to the upper part of the processing chamber 14 by the top plate 35. At this time, the relative position distance between the supporting circular plate 26 and the gas delivery pipe head 28 is relatively close, so that the semiconductor can be better etched, and the height of the supporting circular plate 26 can be automatically adjusted to avoid reducing the effect of gas on semiconductor etching.

[0043] like Figure 8 As shown, the upper end of the infrared transmitter 36 is opposite to the lower end of the infrared receiver 261 . When the top plate 35 is in operation, the upper end surface of the top plate 35 is pressed against the lower end surface of the supporting circular plate 26 , and the top plate 35 passes through the interior of the through hole 252 .

[0044] The above solution is adopted to automatically achieve the effect of raising the bearing circular plate 26 .

[0045] The working principle and use process of the present invention:

[0046] First, after placing the semiconductor on the receiving circular plate 26, the receiving circular plate 26 is placed inside the placement groove 251. Prior to this, the motor 22 is started to drive the rotating shaft 221 to rotate clockwise (the original position of the placement plate 25 is as shown in FIG. Figure 8As shown), the rotating shaft 221 drives the first pulley 222 to rotate clockwise, and the first pulley 222 is subjected to force and transmitted to the second pulley 224 through the transmission belt 223. The second pulley 224 is subjected to force and driven by the screw 225 clockwise, and the screw 225 is subjected to force and rotates clockwise inside the rotating port 111. At the same time, the screw 225 is engaged clockwise with the inside of the spiral groove 231 on the movable plate 23, so that the movable plate 23 moves to one side, wherein the sliding plate 231 on the movable plate 23 slides to one side inside the sliding groove 112. At the same time, the movable plate 23 drives the transmission plate 24 to move to one side, and the transmission plate 24 is subjected to force to slide to one side inside the sliding port 113, and the transmission plate 24 drives the placement plate 25 to slide to one side, and the placement plate 25 is subjected to force to slide outside inside the conveying port 12 until the placement plate 25 moves outward as shown in FIG. Figure 2 As shown, the motor 22 is stopped, and then the receiving circular plate 26 is placed inside the placement groove 252.

[0047] After the receiving circular plate 26 is placed in the placement groove 251, the motor 22 is started to drive the rotating shaft 221, the first pulley 222, the transmission belt 223, the second pulley 224, and the screw 225 to rotate counterclockwise, and the screw 225 drives the moving plate 23 to move toward the original position counterclockwise, so that the transmission plate 24 drives the placement plate 25, the receiving circular plate 26, and the semiconductor 27 to move toward the inside of the processing chamber 14 until the placement plate 25 moves to the position as shown in the figure. Figure 8 As shown, the overlapped arc plate 253 is closed inside the conveying port 12, and one side of the placement plate 25 is closed inside the sliding port 113. The conveying port 12 and the sliding port are provided with sealing strips to achieve a sealing effect.

[0048] When the bearing circular plate 26 is located in the middle of the processing chamber 14, the infrared transmitter 36 transmits to the infrared receiver 261. After the infrared receiver 261 receives the signal, the signal is transmitted to the controller. After receiving the signal, the controller stops the motor 22 and starts the electric pusher 31 to drive the push rod 32 to rise upward (the height of the top plate 35 is set in advance). The push rod 32 drives the top plate 35 to move upward. During the gradual upward movement, it first penetrates into the inside of the through hole 252, and then presses against the bottom end surface of the bearing circular plate 26, so that the bearing circular plate 26 is gradually separated from the inside of the placement groove 251 by the force, until the bearing circular plate 26 is transported to the upper part of the processing chamber 14 by the top plate 35. At this time, the relative position distance between the bearing circular plate 26 and the gas conveying pipe head 28 is relatively close.

[0049] After the receiving circular plate 26 moves upward, vacuum, discharge, gas and other operations are performed, wherein the gas is transported to the gas delivery pipe head 28 through the natural gas pipe, and then transported to the etching chamber by the gas pipe head 28. The gas is induced by the discharge area, so that the plasma etches the semiconductor, and then the process gas generated in the etching semiconductor is extracted by the vacuum pump 331, and then the etching work is completed. After completion, the electric pusher 31 is started to drive the top plate 35 back to the original position, wherein the receiving circular plate 26 is placed in the placement groove 251, the electric pusher 31 is stopped, and the motor 22 is started to move the placement plate 25 outward clockwise, and the placement plate 25 moves to the position as shown in the figure. Figure 8 As shown, stop the motor.

[0050] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An intelligent semiconductor processing chamber, comprising a processing chamber (1), characterized in that: One side of the outer surface of the processing chamber (1) is connected to a driving shell (11), and one side of the outer surface of the processing chamber (1) is provided with a conveying port (12), and the lower end surface of the processing chamber (1) is provided with support rods (13) in an equiangular ring shape, and a conveying mechanism (2) is provided inside the conveying port (12); and a lifting mechanism (3) is provided at the bottom of the processing chamber (1).

2. An intelligent semiconductor processing chamber as claimed in claim 1, characterized in that: The conveying mechanism (2) comprises a support plate (21) fixedly connected to one side of the upper end surface of the driving shell (11); a motor (22) is fixed to one side of the support plate (21); an output end of the motor (22) is connected to a rotating shaft (221); one end of the rotating shaft (221) is sleeved with a first pulley (222); the first pulley (222) is coupled with a second pulley (224) through a transmission belt (223); a screw rod (225) is sleeved inside the second pulley (224); one end of the screw rod (225) is inserted into a rotating opening (111) provided on one side of the driving shell (11); and one end of the screw rod (225) is meshed with a spiral groove (231) provided inside the moving plate (23).

3. An intelligent semiconductor processing chamber as claimed in claim 2, characterized in that: Both sides of the lower end surface of the movable plate (23) are fixedly connected with sliding plates (231), and the sliding plates (231) are slidably fitted in sliding grooves (112) provided at the bottom of the driving housing (11).

4. The intelligent semiconductor processing chamber according to claim 2, characterized in that: A transmission plate (24) is connected to one side of the movable plate (23), and a through opening (241) is provided inside the transmission plate (24).

5. The intelligent semiconductor processing chamber according to claim 4, characterized in that: A placement plate (25) is fixedly connected to one side of the transmission plate (24), a placement circular groove (251) is provided on the upper surface of the placement plate (25), a through hole (252) is provided in the middle of the placement circular groove (251), a overlap arc plate (253) is fixedly connected to one side of the placement plate (25), the overlap arc plate (253) is closed and fitted on both sides of the inner side walls of the conveying port (12), and one side of the placement plate (25) is closed and fitted in a sliding port (113) provided on the inner side wall of the driving shell (11), and the sliding port (113) is connected to the interior of the processing chamber (1).

6. An intelligent semiconductor processing chamber as claimed in claim 5, characterized in that: A receiving circular plate (26) is placed inside the placement groove (251), an infrared receiver (261) is arranged in the middle of the lower end surface of the receiving circular plate (26), semiconductors (27) are arranged equidistantly along the length direction on the upper end surface of the receiving circular plate (26), and a gas delivery pipe head (28) is arranged on the upper end surface of the processing chamber (1).

7. The intelligent semiconductor processing chamber according to claim 1, characterized in that: The lifting mechanism (3) comprises an electric pusher (31), which is connected to the inner bottom of the processing chamber (1) through a fixed plate, and the output end of the electric pusher (31) is connected to a push rod (32), the upper end of the push plate (32) is slidably matched with a first partition (33) and a second partition (34), one side of the first partition (33) is provided with an air pump (331), and the inner periphery of the second partition (34) is provided with air guide holes (341) in an equiangular annular shape, the upper end surface of the push rod (32) is fixedly connected to a top plate (35), and an infrared ray emitter (36) is provided in the middle of the upper end surface of the top plate (35), and the upper end surface of the second partition (34) and the upper inner part of the processing chamber (1) form a processing cavity (14).

8. An intelligent semiconductor processing chamber according to claim 7 or 6, characterized in that: The upper end of the infrared transmitter (36) is opposite to the lower end of the infrared receiver (261). When the top plate (35) is in operation, the upper end surface of the top plate (35) is pressed against the lower end surface of the supporting circular plate (26), and the top plate (35) passes through the interior of the through hole (252).

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