Semiconductor packaging substrate cleaning device and method

Abstract

The invention relates to the technical field of semiconductor packaging equipment, and provides a semiconductor packaging substrate cleaning device and method.A driving unit drives a clamping unit to clamp a substrate and drive a substrate platform to lift and shake, and a carrier table and the substrate platform which are arranged in a stacked mode are guided by a guide rod connected to the carrier table; the jacking plate connected with the driving unit drives the base plate platform to do lifting motion in the direction of the guide rods, the guide rods are distributed at the corners of the carrying table, the flanges connected to the oppositely-arranged guide rods are arranged in a staggered mode, the flanges are located on the upper middle portions of the guide rods, and the contraction springs are further connected between the carrying table and the base plate platform. In the chip bonding process, the substrate platform abuts against the flange on the guide rod through continuous jacking of the driving air cylinder, the substrate slightly shakes in cooperation with the contraction spring so as to help the bubbles to escape, and the bubbles can be helped to move upwards and leave the welding flux by means of gravity when the substrate is shaken.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging equipment, and in particular to a semiconductor packaging substrate cleaning device and method. Background Art

[0002] In the field of semiconductor packaging, the substrate is a carrier that supports the chip and connects to the external circuit. During the entire semiconductor packaging process, a large amount of material and wear particles of the substrate adhere to the substrate through processes such as die bonding and wire bonding. A contact cleaning method will be used, which will cause the substrate to be pressed down and deformed, resulting in line connection problems between the chip and the substrate. During the chip bonding process, a fluid solder is used to fix the chip. The solder is applied to the pads on the substrate or the pins of the chip. The chip is placed on the substrate and the solder is melted by heating to fix the chip in the correct position. The solder solidifies after cooling to form a strong mechanical and electrical connection. Since the adhesive used is fluid, air will be drawn into it during the solder application process, and it will melt and form a liquid in the subsequent heating process. The air trapped in the solder will form bubbles, which will not only affect its adhesion, but also cause the circuit to be open or high resistance due to the bubbles formed, affecting the performance of the semiconductor device, and it is also inconvenient to clean up later. For this reason, we propose a semiconductor packaging substrate cleaning device and method. Summary of the invention

[0003] 1. Technical issues to be solved

[0004] In view of the deficiencies of the prior art, the present invention provides a semiconductor packaging substrate cleaning device and method, which overcomes the deficiencies of the prior art, has a reasonable design and a compact structure, and solves the problems raised in the background technology.

[0005] (II) Technical solution

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0007] A semiconductor packaging substrate cleaning device comprises a base, a carrier, a substrate platform, a driving unit and a clamping unit, wherein the driving unit drives the clamping unit to clamp the substrate and drives the lifting and shaking of the substrate platform, the stacked carrier and the substrate platform are guided in their directions by guide rods connected to the carrier, and the lifting plate connected to the driving unit drives the substrate platform to move up and down in the direction of the guide rods, wherein the guide rods are distributed at the corners of the carrier, and several flanges connected to the relatively arranged guide rods are staggered, and the flanges are located in the middle and upper parts of the guide rods, and a contraction spring is also connected between the carrier and the substrate platform, and also comprises a cleaning head with ultrasonic oscillation that slides in the direction of the substrate to ensure the cleanliness of the substrate.

[0008] Preferably, the clamping unit includes a plurality of grippers mounted on a rotating shaft, and the grippers are connected to a same baffle plate, which surrounds the substrate to prevent the solder from flowing out of the substrate.

[0009] Preferably, the clamping unit further comprises a first linkage rod and a second linkage rod connected to the rotating shaft, and the first linkage rod and the second linkage rod are hinged.

[0010] Preferably, the driving unit comprises a driving cylinder, the output end of the driving cylinder is provided with a driving rod, a pair of transmission rods are hinged on the driving rod, and the side end of the transmission rod away from the driving rod is connected to a connecting block connected to the rotating shaft.

[0011] Preferably, a platform transverse groove is provided on the substrate platform for the first linkage rod and the second linkage rod to pass through, and a platform cutting groove is provided on the platform for connection and cooperation with the driving unit.

[0012] Preferably, a movable cylinder is also provided on the base, and the movable cylinder drives the cleaning head to slide through a slide rail slider, and the cleaning head is also connected to a vacuum tube.

[0013] Preferably, the cleaning head includes an interior divided into three air inlet channels on both sides and a middle vacuum exhaust channel by a partition, an ultrasonic oscillator is installed at the air inlet channel, and a conical adsorption channel is arranged at the vacuum exhaust channel.

[0014] Preferably, the method comprises the following steps:

[0015] S1. Chip placement: First, the operator or automated equipment places the chip precisely at the predetermined position on the substrate, ensuring that it is aligned accurately.

[0016] S2. Substrate Fixing: Next, a gripper or clamp securely holds the substrate in place to prevent movement in subsequent steps.

[0017] S3, substrate movement: Then, the substrate is controlled to approach the chip through a precise driving system and placed on the chip to ensure that the relative position between the two is accurate.

[0018] S4. Solder application: Apply solder between the chip and the substrate, which is usually done by solder paste printing or pre-setting solder balls to ensure uniform distribution of solder.

[0019] S5. Heating: Heat the substrate and chip to make the solder reach the melting point and melt into liquid state to form a good solder joint.

[0020] S6. Slight shaking: When the solder is in liquid state, the cylinder 31 is driven to continue lifting so that the substrate platform 4 and the flange 51 on the guide rod 5 are pressed against each other, and the contraction spring is used to make the substrate 6 shake slightly. This is to help bubbles escape from the solder and ensure good contact between the chip and the substrate.

[0021] S7, Cooling and solidification: After the bubbles escape, stop shaking the substrate and allow the solder to cool and solidify. The solidified solder forms a solid solder joint that firmly fixes the chip to the substrate.

[0022] S8, substrate cleaning: Finally, the cleaning head makes a reciprocating motion through the cylinder, generating ultrasonic vibrations at the same time to separate the tiny particles on the substrate. The vacuum pump generates a vacuum to remove the separated particles, ensuring that the substrate surface is clean and pollution-free.

[0023] (III) Beneficial effects

[0024] The embodiment of the present invention provides a semiconductor package substrate cleaning device and method, which has the following beneficial effects:

[0025] 1. The traditional cleaning device is a contact type to remove tiny particles. However, the contact type will cause the substrate to be pressed down and deformed. The use of ultrasonic vibration to absorb the particles on the substrate can avoid the above problem.

[0026] 2. Reduce chip handling: Chips are usually much smaller and more fragile than substrates. By moving the substrate while keeping the chip fixed, the mechanical stress on the chip can be reduced, reducing the risk of chip damage.

[0027] 3. Adapt to different chip sizes: During the production process, it is necessary to handle chips of different sizes or shapes. Keeping the chip fixed and moving the substrate makes it easier to adapt to such changes.

[0028] 4. Easy to automate: In an automated system, it is easier to design a robotic arm or conveying system to move the substrate, especially when the chip is placed on a fixed tray or carrier.

[0029] 5. Solder bubble treatment: During the chip bonding process, the cylinder is driven to continue to lift the substrate platform and the flange on the guide rod to abut against each other, and the contraction spring is used to make the substrate shake slightly to help the bubbles escape. Shaking the substrate can break the surface tension of the bubbles, making it easier to escape. At the same time, shaking the substrate can use gravity to help the bubbles move upward and leave the solder. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the structure of the present invention;

[0031] Figure 2 It is a partial schematic diagram of the present invention;

[0032] Figure 3 For the present invention Figure 2 Bottom stereoscopic diagram of ;

[0033] Figure 4 For the present invention Figure 2 A three-dimensional schematic diagram of one side;

[0034] Figure 5 is a schematic diagram of a drive unit of the present invention;

[0035] Figure 6 It is a schematic diagram of the carrier and substrate platform of the present invention;

[0036] Figure 7 It is a schematic diagram of the guide rod of the present invention;

[0037] Figure 8 It is a schematic diagram of the cleaning head of the present invention.

[0038] In the figure: 1. base; 11. cleaning head; 12. vacuum tube; 13. moving cylinder; 2. carrier; 21. carrier groove; 3. driving unit; 31. driving cylinder; 32. driving rod; 33. transmission rod; 34. connecting block; 35. lifting plate; 4. substrate platform; 41. rotating shaft; 42. gripper; 43. first linkage rod; 44. second linkage rod; 45. platform horizontal groove; 5. guide rod; 51. flange; 6. substrate. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] See attached Figure 1-8A semiconductor packaging substrate cleaning device includes a base 1, a carrier 2, a substrate platform 4, a driving unit 3 and a clamping unit, the clamping unit includes a plurality of grippers 42 mounted on a rotating shaft 41, and the grippers 42 are also connected to a baffle, the baffle surrounds a substrate 6 to prevent solder from flowing out of the substrate 6, and also includes a first linkage rod 43 and a second linkage rod 44 connected to the rotating shaft 41, the first linkage rod 43 and the second linkage rod 44 are hinged, the driving unit 3 drives the clamping unit to clamp the substrate 6 and drives the lifting and shaking of the substrate platform 4, the stacked carrier 2 and the substrate platform 4 are guided in their directions by a guide rod 5 connected to the carrier 2, and the top connected to the driving unit 3 The lifting plate 35 drives the substrate platform 4 to move up and down in the direction of the guide rod 5. The driving unit 3 includes a driving cylinder 31. A driving rod 32 is provided at the output end of the driving cylinder 31. A pair of transmission rods 33 are hinged on the driving rod 32. The side ends of the transmission rods 33 away from the driving rods 32 are connected to connection blocks 34 connected to the rotating shaft 41. The guide rods 5 are distributed at the corners of the carrier 2. Several flanges 51 connected to the relatively arranged guide rods 5 are staggered, and the flanges 51 are located in the middle and upper part of the guide rods 5. A contraction spring is also connected between the carrier 2 and the substrate platform 4. It also includes a cleaning head 11 with ultrasonic oscillation that slides in the direction of the substrate 6 to ensure the cleanliness of the substrate.

[0041] Specific reference Figure 2 and attached Figure 5 , the driving cylinder 31 lifts and pushes the driving rod 32 and the transmission rod 33. At this time, the transmission rod 33 is hinged and continues to lift the transmission rod 33 to drive the shaft 41 to rotate. Since the first linkage rod 43 and the second linkage rod 44 are both sleeved on the shaft 41 and synchronously drive them to rotate, the gripper 42 on the shaft 41 can synchronously clamp the substrate 6 and continue to lift. At this time, the lifting plate 35 on the driving cylinder 31 is against the bottom of the substrate platform 4 to lift it, which corresponds to the fixture for fixing the chip. After the fixture is released, the chip is placed on the substrate and the solder is placed for heating, and the lifting is continued. At this time, the substrate platform 4 is against the flange 51 on the guide rod 5 and cooperates with the contraction spring between the carrier 2 and the substrate platform 4 to form a regular shake to discharge the air, and finally the cleaning head 11 is adsorbed.

[0042] The substrate platform 4 is provided with a platform transverse groove 45 for the first linkage rod 43 and the second linkage rod 44 to pass through, and the platform cut groove 21 provided on the platform 2 is provided for the driving unit 3 to connect and cooperate with.

[0043] The base 1 is also provided with a moving cylinder 13 , which drives the cleaning head 11 to slide via a slide rail and a slider, and the cleaning head 11 is also connected with a vacuum tube 12 .

[0044] The cleaning head 11 includes an interior divided into three air inlet channels on both sides and a vacuum exhaust channel in the middle by a partition. An ultrasonic oscillator is installed at the air inlet channel, and a conical adsorption channel is installed at the vacuum exhaust channel.

[0045] A cleaning method based on a semiconductor packaging substrate cleaning device comprises the following steps:

[0046] S1. Chip placement: First, the operator or automated equipment places the chip precisely at the predetermined position on the substrate, ensuring that it is aligned accurately.

[0047] S2. Substrate Fixing: Next, a gripper or clamp securely holds the substrate in place to prevent movement in subsequent steps.

[0048] S3, substrate movement: Then, the substrate is controlled to approach the chip through a precise driving system and placed on the chip to ensure that the relative position between the two is accurate.

[0049] S4. Solder application: Apply solder between the chip and the substrate, which is usually done by solder paste printing or pre-setting solder balls to ensure uniform distribution of solder.

[0050] S5. Heating: Heat the substrate and chip to make the solder reach the melting point and melt into liquid state to form a good solder joint.

[0051] S6. Slight shaking: When the solder is in liquid state, the cylinder 31 is driven to continue lifting so that the substrate platform 4 and the flange 51 on the guide rod 5 are pressed against each other, and the contraction spring is used to make the substrate 6 shake slightly. This is to help bubbles escape from the solder and ensure good contact between the chip and the substrate.

[0052] S7, Cooling and solidification: After the bubbles escape, stop shaking the substrate and allow the solder to cool and solidify. The solidified solder forms a solid solder joint that firmly fixes the chip to the substrate.

[0053] S8, substrate cleaning: Finally, the cleaning head makes a reciprocating motion through the cylinder, generating ultrasonic vibrations at the same time to separate the tiny particles on the substrate. The vacuum pump generates a vacuum to remove the separated particles, ensuring that the substrate surface is clean and pollution-free.

[0054] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0055] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor packaging substrate cleaning device, comprising a base (1), a carrier (2), and a substrate platform (4), characterized in that: It comprises a driving unit (3) and a clamping unit, wherein the driving unit (3) drives the clamping unit to clamp the substrate (6) and drives the substrate platform (4) to be lifted and shaken; The stacked carrier (2) and substrate platform (4) are guided in their directions by a guide rod (5) connected to the carrier (2), and a lifting plate (35) connected to the drive unit (3) drives the substrate platform (4) to move in a lifting manner along the direction of the guide rod (5); The guide rods (5) are distributed at the corners of the carrier (2), and a plurality of flanges (51) connected to the relatively arranged guide rods (5) are arranged in a staggered manner, and the flanges (51) are located at the middle and upper parts of the guide rods (5), and a contraction spring is also connected between the carrier (2) and the substrate platform (4); It also comprises a cleaning head (11) with ultrasonic vibrations that slides along the direction of the substrate (6) to ensure the cleanliness of the substrate.

2. A semiconductor package substrate cleaning device as claimed in claim 1, characterized in that: The clamping unit comprises a plurality of grippers (42) mounted on a rotating shaft (41), and a baffle is connected between the grippers (42), the baffle surrounds the substrate (6) to prevent solder from flowing out of the substrate (6).

3. A semiconductor package substrate cleaning device as claimed in claim 1, characterized in that: The clamping unit further comprises a first linkage rod (43) and a second linkage rod (44) connected to the rotating shaft (41); the first linkage rod (43) and the second linkage rod (44) are hinged.

4. A semiconductor package substrate cleaning device as claimed in any one of claims 2 to 3, characterized in that: The driving unit (3) comprises a driving cylinder (31), the output end of the driving cylinder (31) is provided with a driving rod (32), a pair of transmission rods (33) are hingedly connected to the driving rod (32), and a connecting block (34) connected to the rotating shaft (41) is connected to the side end of the transmission rod (33) away from the driving rod (32).

5. A semiconductor package substrate cleaning device as claimed in claim 1, characterized in that: The substrate platform (4) is provided with a platform transverse groove (45) for the first linkage rod (43) and the second linkage rod (44) to pass through, and the platform cutting groove (21) provided on the platform (2) is used for connection and cooperation with the driving unit (3).

6. A semiconductor package substrate cleaning device as claimed in claim 1, characterized in that: The base (1) is also provided with a movable cylinder (13), and the movable cylinder (13) drives the cleaning head (11) to slide via a slide rail and a slider, and the cleaning head (11) is also connected to a vacuum tube (12).

7. A semiconductor package substrate cleaning device as claimed in claim 1, characterized in that: The cleaning head (11) comprises an interior which is divided into three air inlet channels on both sides and a vacuum exhaust channel in the middle by a partition, an ultrasonic oscillator is arranged at the air inlet channel, and a conical adsorption channel is arranged at the vacuum exhaust channel.

8. A cleaning method based on a semiconductor packaging substrate cleaning device: characterized in that, The following steps are involved: S1. Chip placement: First, the operator or automated equipment places the chip precisely at the predetermined position on the substrate, ensuring that it is aligned accurately. S2. Substrate Fixing: Next, a gripper or clamp securely holds the substrate in place to prevent movement in subsequent steps. S3, substrate movement: Then, the substrate is controlled to approach the chip through a precise driving system and placed on the chip to ensure that the relative position between the two is accurate. S4. Solder application: Apply solder between the chip and the substrate, which is usually done by solder paste printing or pre-setting solder balls to ensure uniform distribution of solder. S5. Heating: Heat the substrate and chip to make the solder reach the melting point and melt into liquid state to form a good solder joint. S6. Slight shaking: When the solder is in liquid state, the cylinder is driven to continue lifting so that the substrate platform and the flange on the guide rod are against each other, and the contraction spring is used to make the substrate shake slightly. This is to help bubbles escape from the solder and ensure good contact between the chip and the substrate. S7, Cooling and solidification: After the bubbles escape, stop shaking the substrate and allow the solder to cool and solidify. The solidified solder forms a solid solder joint that firmly fixes the chip to the substrate. S8, substrate cleaning: Finally, the cleaning head makes a reciprocating motion through the cylinder, generating ultrasonic vibrations at the same time to separate the tiny particles on the substrate. The vacuum pump generates a vacuum to remove the separated particles, ensuring that the substrate surface is clean and pollution-free.

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