Packaging structure and radio frequency front-end module

Abstract

A packaging structure and a radio frequency front end module, the packaging structure comprises a substrate, a solder mask and a component, a first surface of the substrate is provided with a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are arranged at an interval to form a spacer region. The solder mask layer is arranged on the first surface, the solder mask layer is provided with a window to expose the first bonding pad, the second bonding pad and the spacer region, the window comprises a first side face and a second side face, the first side face and the second side face are arranged in a spaced mode in the first direction, and the first direction is perpendicular to the arrangement direction of the first bonding pad and the second bonding pad. The first end of the component is welded with the first bonding pad, and the second end of the component is welded with the second bonding pad. In the spacer region, the solder mask layer is provided with convex parts on the first side surface and the second side surface, the convex part connected with the first side surface extends from the first side surface to the second side surface, and the convex part connected with the second side surface extends from the second side surface to the first side surface. The projection contour of the component on the first surface is at least partially overlapped with the projection contour of the convex part on the first surface.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a packaging structure and a radio frequency front-end module. Background Art

[0002] In the prior art, the solder mask layer at the bottom of some surface mount devices with special functions needs to be provided with a window to increase the spatial height of the bottom of the surface mount device. However, the setting of the window is prone to the surface mount device being flattened during the subsequent plastic packaging filling process, resulting in failure of the surface mount device. Summary of the invention

[0003] In view of this, the present invention proposes a packaging structure and a radio frequency front-end module.

[0004] The packaging structure provided in the first aspect of the present invention comprises:

[0005] A substrate having a first surface, wherein a first pad and a second pad are disposed on the first surface, wherein the first pad and the second pad are spaced apart to form a spacing area;

[0006] A solder resist layer is disposed on the first surface, the solder resist layer is provided with a window to expose the first pad, the second pad and the spacer, the window includes a first side surface and a second side surface, the first side surface and the second side surface are spaced apart in a first direction, and the first direction is perpendicular to an arrangement direction of the first pad and the second pad;

[0007] A component, comprising a first end and a second end, wherein the first end of the component is welded to the first pad, and the second end of the component is welded to the second pad;

[0008] Among them, in the spacing area, the solder resist layer is provided with protrusions on the first side surface and the second side surface, the protrusion connected to the first side surface extends from the first side surface toward the second side surface, and the protrusion connected to the second side surface extends from the second side surface toward the first side surface, and the projection outline of the component on the first surface at least partially overlaps with the projection outline of the protrusion on the first surface.

[0009] The packaging structure provided in the second aspect of the present invention includes:

[0010] A substrate having a first surface, wherein a first pad and a second pad are disposed on the first surface, wherein the first pad and the second pad are spaced apart to form a spacing area;

[0011] A solder resist layer is disposed on the first surface, the solder resist layer is provided with a window to expose the first pad, the second pad and the spacer, the window includes a first side surface and a second side surface, the first side surface and the second side surface are spaced apart in a first direction, and the first direction is perpendicular to an arrangement direction of the first pad and the second pad;

[0012] A component, comprising a first end and a second end, wherein the first end of the component is welded to the first pad, and the second end of the component is welded to the second pad;

[0013] The component includes a first side wall and a second side wall in the first direction, and the first side wall and the second side wall meet one of the following conditions:

[0014] The first side wall and the first side surface are arranged opposite to each other in a direction perpendicular to the first surface, and the second side wall and the second side surface are arranged opposite to each other in a direction perpendicular to the first surface;

[0015] The projection outlines of the first side wall and the second side wall on the first surface are located between the first side surface and the second side surface, the projection outline of the first side wall on the first surface is spaced apart from the projection outline of the first side surface on the first surface by a first preset distance, and the projection outline of the second side wall on the first surface is spaced apart from the projection outline of the second side surface on the first surface by a second preset distance.

[0016] The radio frequency front-end module proposed in the first aspect of the present invention includes the above-mentioned packaging structure.

[0017] It can be seen from the above technical scheme that the packaging structure proposed in the first aspect of the present invention is provided with a convex portion on the first side and the second side by setting the solder resist layer, and the projection contour of the component on the first surface overlaps with the projection contour of the convex portion on the first surface at least partially, that is, the convex portion at least partially extends to the bottom of the component, so that the convex portion can support the component, and in the subsequent plastic packaging filling process, the component is not easy to be flattened, which can improve the yield rate of the product. Moreover, by setting the solder resist layer as the supporting structure of the component, it is not necessary to add other supporting structures, which can reduce the use of materials and reduce the manufacturing difficulty. In addition, by setting the convex portion of the solder resist layer to at least partially extend to the bottom of the component, the convex portion can block the white film. In the subsequent plastic packaging filling process, due to the blocking effect of the convex portion, the problem of the white film being broken can be improved to a certain extent, thereby effectively improving the yield rate of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained like these accompanying drawings without paying any creative work.

[0019] Figure 1 is a schematic structural diagram of a packaging structure proposed in one embodiment of the present invention;

[0020] Figure 2 yes Figure 1 An exploded schematic diagram of the package structure shown;

[0021] Figure 3 yes Figure 1 Schematic diagram of the cross section of AA;

[0022] Figure 4 is a schematic diagram of the arrangement of the protrusions proposed in another embodiment of the present invention;

[0023] Figure 5 is a schematic diagram of the arrangement of the protrusions proposed in another embodiment of the present invention;

[0024] Figure 6 is a schematic diagram of the arrangement of the protrusions proposed in another embodiment of the present invention;

[0025] Figure 7 is a schematic diagram of the arrangement of the protrusions proposed in another embodiment of the present invention;

[0026] Figure 8 is a schematic diagram of the arrangement of the protrusions proposed in another embodiment of the present invention;

[0027] Fig. 9 is a schematic diagram of the arrangement of the protrusions proposed in another embodiment of the present invention;

[0028] Fig.10 is a schematic diagram of the positions of the first pad, the second pad, and the protruding portion provided in one embodiment of the present invention;

[0029] Fig.11 It is a structural schematic diagram of an opening of a solder resist layer provided in an embodiment of the present invention;

[0030] Fig.12 is a schematic structural diagram of a packaging structure proposed in another embodiment of the present invention; DETAILED DESCRIPTION

[0031] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0032] It should be understood that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0033] It should also be understood that when an element is referred to as being "fixed" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or it can be indirectly connected to the other element through an intermediate element.

[0034] The terms used in this specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. For example, the descriptions of "first", "second", etc. in the present application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0035] It should be further understood that the term “and / or” used in the specification of the present application refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0036] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the implementation mode of the present application. Obviously, the described implementation mode is only a part of the implementation mode of the present application, not all the implementation modes. Based on the implementation mode in the present application, all other implementation modes obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0037] like Figures 1 to 3As shown, an embodiment of the present invention provides a packaging structure 100, the packaging structure 100 includes a substrate 10, a solder resist layer 20 and a component 30, the substrate 10 has a first surface 11, the first surface 11 is provided with a first pad 12 and a second pad 13, the first pad 12 and the second pad 13 are arranged at intervals to form a spacing area 14. The solder resist layer 20 is arranged on the first surface 11, and the solder resist layer 20 is provided with a window 21 to expose the first pad 12, the second pad 13 and the spacing area 14, the window 21 includes a first side surface 211 and a second side surface 212, the first side surface 211 and the second side surface 212 are arranged at intervals in a first direction X, and the first direction X is perpendicular to the arrangement direction of the first pad 12 and the second pad 13. The component 30 includes a first end 31 and a second end 32, the first end 31 of the component 30 is welded to the first pad 12, and the second end 32 of the component 30 is welded to the second pad 13. Among them, in the spacing area 14, the solder resist layer 20 is provided with a protrusion 22 on the first side 211 and the second side 212, the protrusion 22 connected to the first side 211 extends from the first side 211 toward the second side 212, and the protrusion 22 connected to the second side 212 extends from the second side 212 toward the first side 211, and the projection contour of the component 30 on the first surface 11 at least partially overlaps with the projection contour of the protrusion 22 on the first surface 11.

[0038] The “open window 21 ” refers to a hollow window, where the solder resist layer 20 is not covered, and the first surface 11 of the substrate 10 and the first pad 12 and the second pad 13 arranged on the first surface 11 are directly exposed.

[0039] The "first side 211" refers to the surface formed by one side wall of the window 21, and the "second side 212" refers to the surface formed by the other side wall of the window 21. It can be understood that the solder resist layer 20 has a thickness, and the side wall will naturally be formed after the window is opened. For example, in one embodiment, the window 21 is rectangular, including a first side wall, a second side wall, and a third side wall and a fourth side wall that are relatively arranged. The surface formed by the first side wall is the first side 211, and the surface formed by the second side wall is the second side 212.

[0040] The “convex portion 22” is a part of the solder resist layer 20, and its thickness is consistent with that of the solder resist layer 20. It is named as a convex portion because it is convex relative to the first side 211 and the second side 212. Specifically, the convex portion connected to the first side 211 convexes toward the second side 212 relative to the first side 211, and the convex portion connected to the second side 212 convexes toward the first side 211 relative to the second side 212.

[0041] The packaging structure 100 proposed in the embodiment of the present invention is provided with a convex portion 22 on the first side 211 and the second side 212 of the solder resist layer 20, and the projection contour of the component 30 on the first surface 11 overlaps with the projection contour of the convex portion 22 on the first surface 11 at least partially, that is, the convex portion 22 at least partially extends to the bottom of the component 30, so that the convex portion 22 can support the component 30, and the component 30 is not easily flattened during the subsequent plastic encapsulation filling process, which can improve the product yield. Moreover, by setting the solder resist layer 20 as a support structure for the component 30, there is no need to add other support structures, which can reduce the use of materials and reduce the difficulty of manufacturing.

[0042] There are two situations regarding the supporting effect of the protrusion 22 on the component 30. The first situation is that the thickness of the protrusion 22 is just equal to the distance from the component 30 to the first surface 211, and the bottom of the component 30 abuts the protrusion 22. In the subsequent plastic encapsulation filling process, the protrusion 22 directly forms a supporting force on the component 30. The second situation is that the thickness of the protrusion 22 is less than the distance from the component 30 to the first surface 211, that is, in the thickness direction of the protrusion 22, there is a gap between the protrusion 22 and the component 30. In the subsequent plastic encapsulation filling process, if the pressure is greater than the supporting force of the solder paste at both ends of the component 30, the component 30 moves a short distance toward the protrusion 22 under the action of the pressure and abuts against the protrusion 22, and then the protrusion 22 forms a supporting force on the component 30. Among them, the "thickness of the protrusion 22" refers to the distance from the surface of the protrusion 22 facing away from the substrate 10 to the substrate 10.

[0043] It should also be noted that in some packaging structures 100 with special performance requirements, it is necessary to form a closed cavity between the component 30 and the substrate 10. Therefore, before the plastic encapsulation filling, it is necessary to implement a white film coating process around the component 30 and the solder mask layer 20. In the subsequent plastic encapsulation filling process, the white film can prevent the plastic encapsulation material from entering the component 30 and the substrate 10, thereby forming a closed cavity between the component 30 and the substrate 10. However, in the design of the window 21 of the traditional solder mask layer 20, a large gap is left between the first side 211 and the second side 212 of the window 21 and the component 30. In the subsequent plastic encapsulation filling process, under the action of pressure, the plastic encapsulation material may break through the white film and enter between the component 30 and the substrate 10, resulting in defective products. In this embodiment, by setting the protrusion 22 of the solder mask layer 20 to at least partially extend to the bottom of the component 30, the protrusion 22 can block the white film. In the subsequent plastic packaging filling process, due to the blocking effect of the protrusion 22, the problem of the white film being broken can be improved to a certain extent, thereby effectively improving the yield rate of the product.

[0044] In some embodiments, the substrate 10 is a resin substrate, for example, the substrate 10 is a PP (polypropylene) substrate. Of course, the substrate 10 is not limited to a resin substrate, for example, in some other embodiments, the substrate 10 may also be a ceramic substrate, a glass substrate or other types of substrates, which may be determined according to actual design requirements.

[0045] In some embodiments, the first pad 12 and the second pad 13 are disposed on the first surface 11 of the substrate 10, and the first pad 12 and the second pad 13 may be disposed on the first surface 11 of the substrate 10, that is, the first pad 12 and the second pad 13 are disposed protruding from the first surface 11. The first pad 12 and the second pad 13 may also be embedded in the first surface 11, and preferably, the exposed surfaces of the first pad 12 and the second pad 13 are flush with the first surface 11, and of course, the exposed surfaces of the first pad 12 and the second pad 13 may also be concave relative to the first surface 11, which may be determined according to actual design requirements.

[0046] In some embodiments, the welding process of the first end 31 of the component 30 and the first pad 12 is as follows: print the solder paste on the first pad 12, use the placement machine to accurately place the first end 31 of the component 30 on the first pad 12, and heat the substrate 10 in a reflow oven to melt the solder paste and wet the first end 31 of the component 30 and the first pad 12 to form a reliable electrical and mechanical connection. The welding process of the second end 32 of the component 30 and the second pad 13 refers to the welding process of the first end 31 of the component 30 and the first pad 12, and will not be repeated here.

[0047] In some embodiments, the solder mask 20 can be made of resin, solder resist green paint or dry film, etc., which is not limited in this embodiment. In some embodiments, the thickness of the solder mask 20 is 10 microns to 30 microns. For example, the thickness of the solder mask 20 is 10 microns, 11 microns, 12 microns, 13 microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 19 microns, 20 microns, 21 microns, 22 microns, 23 microns, 24 microns, 25 microns, 26 microns, 27 microns, 28 microns, 29 microns, 30 microns, any one or any value between two adjacent ones. In some embodiments, preferably, the thickness of the solder mask 20 is 15 microns to 20 microns.

[0048] In some embodiments, the component 30 is a surface mounted device (SMD), including but not limited to a capacitor, a resistor, an inductor or an electrostatic discharge (ESD) component.

[0049] In some embodiments, the shape of the protrusion 22 is rectangular, which is convenient for processing. Of course, the shape of the protrusion 22 is not limited to a rectangle. For example, in some other embodiments, the protrusion 22 can also be a circle, an ellipse, a triangle, a polygon or other irregular shapes, as long as the protrusion 22 can support the component 30.

[0050] In some embodiments, the first end 31 of the component 30 is welded to the first pad 12, and the second end 32 of the component 30 is welded to the second pad 13. The first end 31 of the component 30 may be provided with a first pin, the first pin is welded to the first pad 12, and the second end 32 of the component 30 may be provided with a second pin, the second pin is welded to the second pad 13. Alternatively, the component 30 may not be provided with a pin, and the plastic package of the component 30 may be provided with a metal part at the first end 31 and the second end 32, the metal part of the first end 31 is welded to the first pad 12, and the metal part of the second end 32 is welded to the second pad 13, which may be determined according to actual design requirements.

[0051] like Figure 2 and Figure 3 As shown, in some embodiments, the protrusion 22 includes a first end 221 and a second end 222 opposite to the first end 221 in the second direction Y, the second direction Y is the arrangement direction of the first solder pad 12 and the second solder pad 13, the first end 221 of the protrusion 22 is spaced apart from the first solder pad 12, and the second end 222 of the protrusion 22 is spaced apart from the second solder pad 13.

[0052] like Figure 2 As shown, optionally, in some embodiments, the first end 221 of the convex portion 22 is an end face, and the projection profile of the first end 221 on the first surface 11 is a line segment. The second end 222 of the convex portion 22 is also an end face, and the projection profile of the second end 222 on the first surface 11 is a line segment. In some embodiments, the projection profile of the first end 221 on the first surface 11 and the projection profile of the second end 222 on the first surface 11 are parallel to each other. In some embodiments, the projection profile of the first end 221 on the first surface 11 and the projection profile of the second end 222 on the first surface 11 extend along the first direction X.

[0053] It should be noted that the projection contour of the first end 221 of the convex portion 22 on the first surface 11 is not limited to a line segment. For example, in some other embodiments, the projection contour of the first end 221 of the convex portion 22 on the first surface 11 is a point, that is, the first end 221 of the convex portion 22 is not an end face, but is set as a tip. Similarly, the projection contour of the second end 222 of the convex portion 22 on the first surface 11 is not limited to a line segment. For example, in some other embodiments, the projection contour of the second end 222 of the convex portion 22 on the first surface 11 is a point, that is, the second end 222 of the convex portion 22 is not an end face, but is set as a tip. The specific configuration can be determined according to actual design needs.

[0054] It should be noted that the projection contour of the first end 221 on the first surface 11 and the projection contour of the second end 222 on the first surface 11 are not limited to being set to be parallel to each other. For example, in some other embodiments, the projection contour of the first end 221 on the first surface 11 and the projection contour of the second end 222 on the first surface 11 can also be set to be at an angle, which can be determined according to actual design needs.

[0055] It should be noted that the projection contour of the first end 221 on the first surface 11 and the projection contour of the second end 222 on the first surface 11 are not limited to being set to extend along the first direction X. For example, in some other embodiments, the projection contour of the first end 221 on the first surface 11 and the projection contour of the second end 222 on the first surface 11 can also be set to be at an angle to the first direction X, which can be determined according to actual design requirements.

[0056] It should also be noted that the first end 221 of the protrusion 22 is spaced from the first pad 12, and there is a gap between the first end 221 of the protrusion 22 and the first pad 12, and there is no other filler. During the reflow process, the solder paste 101 located on the first pad 12 can enter the gap during the expansion process. Similarly, the second end 222 of the protrusion 22 is spaced from the second pad 13, and there is a gap between the second end 222 of the protrusion 22 and the second pad 13, and there is no other filler. During the reflow process, the solder paste 101 located on the second pad 13 can enter the gap during the expansion process.

[0057] In the actual manufacturing process, the components 30 need to undergo a reflow process after being mounted, so that the solder paste 101 (see Figure 3) is melted and bonded to the substrate 10. During the reflow process, the solder paste 101 will expand and shrink. The solder paste 101 located on the first pad 12 and the solder paste 101 located on the second pad 13 may enter the spacing area 14 during the expansion process. The two parts of the solder paste 101 may contact each other in the spacing area 14, causing the first pad 12 and the second pad 13 to be bridged, resulting in failure of the component 30. In the present embodiment, by setting the first end 221 of the protrusion 22 to be spaced apart from the first solder pad 12 and setting the second end 222 of the protrusion 22 to be spaced apart from the second solder pad 13, the path for the solder paste 101 located at the first solder pad 12 to flow along the first side surface 211 and the second side surface 212 toward the second solder pad 13 is lengthened. Similarly, the path for the solder paste 101 located at the second solder pad 13 to flow along the first side surface 211 and the second side surface 212 toward the first solder pad 12 is lengthened. In this way, it is possible to avoid, to a certain extent, the mutual contact between the two parts of the solder paste 101, reduce the problem of bridging between the first solder pad 12 and the second solder pad 13, and improve the yield rate of the product.

[0058] It should be noted that the convex portion 22 is not limited to being arranged such that the first end 221 is spaced apart from the first pad 12, and the second end 222 is spaced apart from the second pad 13. For example, in some other embodiments, such as Figure 4 As shown, the first end 221 of the protrusion 22 is spaced apart from the first pad 12, and the second end 222 of the protrusion 22 is connected to the second pad 13. Alternatively, in some other embodiments, such as Figure 5 As shown, the first end 221 of the protrusion 22 is connected to the first pad 12, and the second end 222 of the protrusion 22 is spaced apart from the second pad 13. Alternatively, in some other embodiments, such as Figure 6 As shown, the convex portion 22 connected to the first side surface 211 is the first convex portion 22a, the convex portion 22 connected to the second side surface 212 is the second convex portion 22b, the first end 221 of the first convex portion 22a is spaced apart from the first pad 12, the second end 222 of the first convex portion 22a is connected to the second pad 13, the first end 221 of the second convex portion 22b is connected to the first pad 12, and the second end 222 of the second convex portion 22b is spaced apart from the second pad 13. Alternatively, in some other embodiments, such as Figure 7 As shown, the first end 221 of the first protrusion 22a is connected to the first pad 12, the second end 222 of the first protrusion 22a is spaced apart from the second pad 13, the first end 221 of the second protrusion 22b is spaced apart from the first pad 12, and the second end 222 of the second protrusion 22b is connected to the second pad 13.

[0059] like Figure 2As shown, in some embodiments, the first convex portion 22a and the second convex portion 22b are spaced apart, and there is a gap between the first convex portion 22a and the second convex portion 22b without any filler. In this embodiment, a large space can be reserved at the spacing area 14, and a large buffer space is reserved for the expansion of the solder paste 101 during the reflow soldering process, so that the solder paste 101 located on the first pad 12 and the solder paste 101 located on the second pad 13 are not likely to contact each other when entering the gap, reducing the bridge problem between the first pad 12 and the second pad 13, and improving the product yield.

[0060] It should be noted that the first convex portion 22a and the second convex portion 22b are not limited to being arranged at intervals. For example, in some other embodiments, such as Figure 8 As shown, the first convex portion 22a and the second convex portion 22b can also be arranged to be connected to each other, which can be determined according to actual design requirements. In this embodiment, preferably, the first end 221 of the first convex portion 22a is spaced apart from the first pad 12, the second end 222 of the first convex portion 22a is spaced apart from the second pad 13, the first end 221 of the second convex portion 22b is spaced apart from the first pad 12, and the second end 222 of the second convex portion 22b is spaced apart from the second pad 13.

[0061] like Figure 2 As shown, in some embodiments, the protrusion 22 is located in the middle of the first pad 12 and the second pad 13. That is, the distance between the protrusion 22 and the first pad 12 is consistent with the distance between the protrusion 22 and the second pad 13. Of course, the protrusion 22 is not limited to being arranged in the middle of the first pad 12 and the second pad 13. For example, in some other embodiments, the distance between the protrusion 22 and the first pad 12 is greater than the distance between the protrusion 22 and the second pad 13. Alternatively, in some other embodiments, the distance between the protrusion 22 and the first pad 12 is less than the distance between the protrusion 22 and the second pad 13. It can be determined according to actual design requirements.

[0062] like Fig. 9As shown, in some embodiments, the protrusion 22 includes a first end 221 and a second end 222 opposite to the first end 221 in the second direction Y, and the second direction Y is the arrangement direction of the first pad 12 and the second pad 13. The first end 221 of the protrusion 22 is connected to the first pad 12, and the second end 222 of the protrusion 22 is connected to the second pad 13. The protrusion 22 connected to the first side surface 211 is defined as the first protrusion 22a, and the protrusion 22 connected to the second side surface 212 is defined as the second protrusion 22b. In this embodiment, the first protrusion 22a and the second protrusion 22b are arranged at intervals, and the first protrusion 22a, the substrate 10, the second protrusion 22b and the component 30 are surrounded to form a cavity. During the reflow process, the solder paste 101 located on the first pad 12 and the solder paste 101 located on the second pad 13 can enter the cavity during the expansion process.

[0063] like Fig.10 As shown, in some embodiments, the spacing between the first pad 12 and the second pad 13 is M1, the width of the protrusion 22 in the second direction Y is M2, and the second direction Y is the arrangement direction of the first pad 12 and the second pad 13, wherein M1 / 2≤M2≤M1. Preferably, M2=M1 / 2. In this embodiment, by setting the above numerical relationship, the protrusion 22 can not only form a good support effect for the component 30, but also form a good blocking effect for the white film, and in the subsequent plastic encapsulation filling process, the problem of the white film being broken can be reduced.

[0064] In some embodiments, the distance between the first pad 12 and the second pad 13 is 160 micrometers±16 micrometers, and the width of the protrusion 22 in the second direction Y is 80 micrometers±8 micrometers.

[0065] like Fig.10 As shown, in some embodiments, the spacing between the first side surface 211 and the second side surface 212 is W1, and the width of the protrusion 22 in the first direction X is W2, wherein W1 / 6≤W2≤W1 / 2. Preferably, W2=W1 / 6. In this embodiment, by setting the above numerical relationship, the protrusion 22 can provide a better support effect for the component 30 while also retaining a larger buffer space for the spacing area 14, so that the solder paste 101 located on the first pad 12 and the solder paste 101 located on the second pad 13 are not likely to contact each other during the reflow process, thereby reducing the problem of bridging between the first pad 12 and the second pad 13.

[0066] In some embodiments, the distance between the first side surface 211 and the second side surface 212 is 180 micrometers±18 micrometers, and the width of the protrusion 22 in the first direction X is 30 micrometers±3 micrometers.

[0067] like Fig.11As shown, in some embodiments, the window 21 includes a first region 213, a second region 214 and a third region 215, the first region 213 is arranged opposite to the first pad 12 in a direction perpendicular to the first surface 11, the second region 214 is arranged opposite to the second pad 13 in a direction perpendicular to the first surface 11, and the third region 215 is arranged opposite to the spacer 14 in a direction perpendicular to the first surface 11, the projection area of ​​the window 21 on the first surface 11 is S1, and the projection area of ​​the third region 215 on the first surface 11 is S2, wherein S2 ≥ 20% S1.

[0068] The “first region 213 is disposed opposite to the first pad 12 in a direction perpendicular to the first surface 11” may mean that the projection contour of the first region 213 on the first surface 11 coincides with the projection contour of the first pad 12 on the first surface 11, or the projection contour of the first region 213 on the first surface 11 is slightly misaligned with the projection contour of the first pad 12 on the first surface 11. The “second region 214 is disposed opposite to the second pad 13 in a direction perpendicular to the first surface 11” may mean that the projection contour of the second region 214 on the first surface 11 coincides with the projection contour of the second pad 13 on the first surface 11, or the projection contour of the second region 214 on the first surface 11 is slightly misaligned with the projection contour of the second pad 13 on the first surface 11. The “third region 215 is arranged opposite to the spacer region 14 in a direction perpendicular to the first surface 11” may mean that the projection contour of the third region 215 on the first surface 11 coincides with the projection contour of the spacer region 14 on the first surface 11, or that the projection contour of the third region 215 on the first surface 11 is slightly misaligned with the projection contour of the spacer region 14 on the first surface 11.

[0069] In this embodiment, by setting the third area 215 to the above value, a sufficiently large buffer space can be reserved for the third area 215 to prevent the solder paste 101 located on the first pad 12 and the solder paste 101 located on the second pad 13 from contacting each other in the spacing area 14 during the subsequent reflow process, causing the first pad 12 and the second pad 13 to be bridged and causing the component 30 to fail.

[0070] like Figure 1 and Figure 2 As shown, in some embodiments, the component 30 includes a first side wall 33 and a second side wall 34 in the first direction X, the first side wall 33 and the first side surface 211 are arranged opposite to each other in a direction perpendicular to the first surface 11, and the second side wall 34 and the second side surface 212 are arranged opposite to each other in a direction perpendicular to the first surface 11.

[0071] Among them, the statement “the first side wall 33 and the first side surface 211 are arranged opposite to each other in a direction perpendicular to the first surface 11, and the second side wall 34 and the second side surface 212 are arranged opposite to each other in a direction perpendicular to the first surface 11” means that the projection contour of the first side wall 33 on the first surface 11 coincides with the projection contour of the first side surface 211 on the first surface 11, and the projection contour of the second side wall 34 on the first surface 11 coincides with the projection contour of the second side surface 212 on the first surface 11.

[0072] In this embodiment, there is no gap or a small gap between the solder resist layer 20 and the component 30 (whether there is a gap between the solder resist layer 20 and the component 30 is determined by the distance from the component 30 to the first surface 11 and the thickness of the solder resist layer 20. When the distance from the component 30 to the first surface 11 is consistent with the thickness of the solder resist layer 20, there is no gap between the solder resist layer 20 and the component 30. When the distance from the component 30 to the first surface 11 is greater than the thickness of the solder resist layer 20, there is a gap between the solder resist layer 20 and the component 30). The solder resist layer 20 and the component 30 can form a good barrier to the white film, and can effectively avoid the problem of the white film being broken during the subsequent plastic encapsulation filling process.

[0073] It should be noted that the first side wall 33 and the second side wall 34 are not limited to being arranged such that the first side wall 33 and the first side surface 211 are arranged opposite to each other in a direction perpendicular to the first surface 11, and the second side wall 34 and the second side surface 212 are arranged opposite to each other in a direction perpendicular to the first surface 11. For example, in some other embodiments, such as Fig.12 As shown, the projection profiles of the first side wall 33 and the second side wall 34 on the first surface 11 are located between the first side surface 211 and the second side surface 212, the projection profiles of the first side wall 33 on the first surface 11 and the projection profiles of the first side surface 211 on the first surface 11 are spaced apart by a first preset distance L1, and the projection profiles of the second side wall 34 on the first surface 11 and the projection profiles of the second side surface 212 on the first surface 11 are spaced apart by a second preset distance L2. In this embodiment, by reasonably setting the values ​​of the first preset distance L1 and the second preset distance L2, even if there is a gap between the solder resist layer 20 and the component 30, the solder resist layer 20 and the component 30 can form a good barrier effect on the white film, and the white film can be prevented from being broken during the subsequent plastic encapsulation filling process.

[0074] In some embodiments, 0 micrometers < L1 ≤ 50 micrometers. For example, the first preset distance L1 is 1 micrometer, 2 micrometers, 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, 15 micrometers, 16 micrometers, 17 micrometers, 18 micrometers, 19 micrometers, 20 micrometers, 21 micrometers, 22 micrometers, 23 micrometers, 24 micrometers, 25 micrometers, 26 micrometers, 27 micrometers, 28 micrometers, 29 micrometers, 30 micrometers, 31 micrometers, 32 micrometers, 33 micrometers, 34 micrometers, 35 micrometers, 36 micrometers, 37 micrometers, 38 micrometers, 39 micrometers, 40 micrometers, 41 micrometers, 42 micrometers, 43 micrometers, 44 micrometers, 45 micrometers, 46 micrometers, 47 micrometers, 48 ​​micrometers, 49 micrometers, 50 micrometers, or any value between two adjacent ones. In some embodiments, preferably, 5 micrometers < L1 ≤ 50 micrometers.

[0075] In some embodiments, 0 micrometers < L2 ≤ 50 micrometers. For example, the second preset distance L2 is 1 micrometer, 2 micrometers, 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, 15 micrometers, 16 micrometers, 17 micrometers, 18 micrometers, 19 micrometers, 20 micrometers, 21 micrometers, 22 micrometers, 23 micrometers, 24 micrometers, 25 micrometers, 26 micrometers, 27 micrometers, 28 micrometers, 29 micrometers, 30 micrometers, 31 micrometers, 32 micrometers, 33 micrometers, 34 micrometers, 35 micrometers, 36 micrometers, 37 micrometers, 38 micrometers, 39 micrometers, 40 micrometers, 41 micrometers, 42 micrometers, 43 micrometers, 44 micrometers, 45 micrometers, 46 micrometers, 47 micrometers, 48 ​​micrometers, 49 micrometers, 50 micrometers, or any value between two adjacent ones. In some embodiments, preferably, 5 micrometers < L2 ≤ 50 micrometers.

[0076] Experiments have shown that by setting the first preset distance L1 and the second preset distance L2 to the above-mentioned values, even if there is a gap between the solder resist layer 20 and the component 30, the solder resist layer 20 and the component 30 can form a good barrier effect on the white film, and the white film can be prevented from being broken during the subsequent plastic packaging filling process.

[0077] like Figure 3As shown, in some embodiments, in the thickness direction of the protrusion 22 , the protrusion 22 and the component 30 are spaced apart, and the distance between the protrusion 22 and the component 30 is L3, 0 micrometers<L3≤50 micrometers. For example, the spacing between the protrusion 22 and the component 30 is 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, 13 microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 19 microns, 20 microns, 21 microns, 22 microns, 23 microns, 24 microns, 25 microns, 26 microns, 27 microns, 28 microns, 29 microns, 30 microns, 31 microns, 32 microns, 33 microns, 34 microns, 35 microns, 36 microns, 37 microns, 38 microns, 39 microns, 40 microns, 41 microns, 42 microns, 43 microns, 44 microns, 45 microns, 46 microns, 47 microns, 48 ​​microns, 49 microns, 50 microns, or any value between two adjacent ones. In some embodiments, preferably, 5 microns < L3 ≤ 50 microns.

[0078] In some embodiments, in the thickness direction of the protrusion, the protrusion is spaced apart from the component, and the distance between the protrusion and the component is L3, 5 microns<L3≤30 microns.

[0079] like Figure 3 As shown, in some embodiments, the package structure 100 further includes a plastic package body 40 , and the plastic package body 40 covers the solder resist layer 20 and the component 30 .

[0080] like Figure 1 As shown, in some embodiments, the packaging structure 100 also includes a first packaging silk screen line 50 and a second packaging silk screen line 60, the first packaging silk screen line 50 and the second packaging silk screen line 60 are both U-shaped, the openings of the first packaging silk screen line 50 and the second packaging silk screen line 60 are arranged facing each other, the first solder pad 12 is located in the first packaging silk screen line 50, and the second solder pad 13 is located in the second packaging silk screen line 60.

[0081] like Figures 1 to 12As shown, an embodiment of the present invention further provides a packaging structure 100, the packaging structure 100 includes a substrate 10, a solder resist layer 20 and a component 30, the substrate 10 has a first surface 11, the first surface 11 is provided with a first pad 12 and a second pad 13, the first pad 12 and the second pad 13 are arranged at intervals to form a spacing area 14. The solder resist layer 20 is arranged on the first surface 11, and the solder resist layer 20 is provided with a window 21 to expose the first pad 12, the second pad 13 and the spacing area 14, the window 21 includes a first side surface 211 and a second side surface 212, the first side surface 211 and the second side surface 212 are arranged at intervals in a first direction X, and the first direction X is perpendicular to the arrangement direction of the first pad 12 and the second pad 13. The component 30 includes a first end 31 and a second end 32, the first end 31 of the component 30 is welded to the first pad 12, and the second end 32 of the component 30 is welded to the second pad 13. The component 30 includes a first side wall 33 and a second side wall 34 in the first direction X. The first side wall 33 and the second side wall 34 satisfy one of the following conditions:

[0082] First, the first side wall 33 and the first side surface 211 are arranged opposite to each other in a direction perpendicular to the first surface 11 , and the second side wall 34 and the second side surface 212 are arranged opposite to each other in a direction perpendicular to the first surface 11 ;

[0083] Second: the projection contours of the first side wall 33 and the second side wall 34 on the first surface 11 are located between the first side surface 211 and the second side surface 212, the projection contour of the first side wall 33 on the first surface 11 and the projection contour of the first side surface 211 on the first surface 11 are spaced apart by a first preset distance L1, and the projection contour of the second side wall 34 on the first surface 11 and the projection contour of the second side surface 212 on the first surface 11 are spaced apart by a second preset distance L2.

[0084] Among them, the statement “the first side wall 33 and the first side surface 211 are arranged opposite to each other in a direction perpendicular to the first surface 11, and the second side wall 34 and the second side surface 212 are arranged opposite to each other in a direction perpendicular to the first surface 11” means that the projection contour of the first side wall 33 on the first surface 11 coincides with the projection contour of the first side surface 211 on the first surface 11, and the projection contour of the second side wall 34 on the first surface 11 coincides with the projection contour of the second side surface 212 on the first surface 11.

[0085] The packaging structure 100 proposed in this embodiment, for the first case, there is no gap or a small gap between the solder resist layer 20 and the component 30, the solder resist layer 20 and the component 30 can form a good barrier effect on the white film, and in the subsequent plastic encapsulation filling process, the white film can be effectively prevented from being broken. For the second case, by reasonably setting the values ​​of the first preset distance L1 and the second preset distance L2, even if there is a gap between the solder resist layer 20 and the component 30, the solder resist layer 20 and the component 30 can also form a good barrier effect on the white film, and in the subsequent plastic encapsulation filling process, the white film can also be prevented from being broken.

[0086] In some embodiments, 0 micrometers < L1 ≤ 50 micrometers. In some embodiments, 0 micrometers < L2 ≤ 50 micrometers. Experiments show that by setting the first preset distance L1 and the second preset distance L2 to the above values, even if there is a gap between the solder resist layer 20 and the component 30, the solder resist layer 20 and the component 30 can form a good barrier effect on the white film, and the white film can be prevented from being broken during the subsequent plastic packaging filling process.

[0087] The structures, connection relationships, parameter characteristics and beneficial effects of other components of the packaging structure 100 proposed in this embodiment can be referred to the above embodiments and will not be elaborated here.

[0088] The embodiment of the present invention further provides a radio frequency front-end module, which includes the packaging structure 100 described above. The radio frequency front-end module provided in the embodiment of the present invention includes the packaging structure 100 described above, and thus has the advantages that the components 30 are not easily crushed during the subsequent plastic packaging filling process, the yield rate of the product can be improved, and no other supporting structures need to be added, the use of materials can be reduced, the manufacturing difficulty can be reduced, and the white film can be effectively prevented from being broken.

[0089] The structure, connection relationship, parameter characteristics and beneficial effects of the packaging structure 100 of the RF front-end module proposed in this embodiment can be referred to the above embodiments and will not be described in detail here.

[0090] In this application, unless otherwise clearly specified or limited, the terms "installation", "connection" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be internal communication between two elements, it can be only surface contact, or it can be connected through surface contact through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0091] In addition, the terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as specific or special structures. The descriptions of the terms "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0092] The above implementation modes are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various implementation modes of the present application, and should all be included in the protection scope of the present application.

Claims

1. A packaging structure, characterized in that: include: A substrate having a first surface, wherein a first pad and a second pad are disposed on the first surface, wherein the first pad and the second pad are spaced apart to form a spacing area; A solder resist layer is disposed on the first surface, the solder resist layer is provided with a window to expose the first pad, the second pad and the spacer, the window includes a first side surface and a second side surface, the first side surface and the second side surface are spaced apart in a first direction, and the first direction is perpendicular to an arrangement direction of the first pad and the second pad; A component, comprising a first end and a second end, wherein the first end of the component is welded to the first pad, and the second end of the component is welded to the second pad; Among them, in the spacing area, the solder resist layer is provided with a protrusion on the first side and the second side, the protrusion connected to the first side extends from the first side toward the second side, and the protrusion connected to the second side extends from the second side toward the first side, and the projection outline of the component on the first surface at least partially overlaps with the projection outline of the protrusion on the first surface.

2. The packaging structure according to claim 1, characterized in that: The convex portion includes a first end and a second end opposite to the first end in a second direction, the second direction is an arrangement direction of the first pad and the second pad, and the convex portion satisfies at least one of the following conditions: The first end of the protrusion is spaced apart from the first pad; The second end of the protrusion is spaced apart from the second pad.

3. The packaging structure according to claim 1, characterized in that: The convex portion connected to the first side surface is a first convex portion, and the convex portion connected to the second side surface is a second convex portion; The first convex portion and the second convex portion are arranged at intervals or connected to each other.

4. The packaging structure according to claim 1, characterized in that: The protrusion is located between the first pad and the second pad.

5. The packaging structure according to claim 1, characterized in that: The convex portion includes a first end and a second end opposite to the first end in a second direction, and the second direction is an arrangement direction of the first pad and the second pad; The first end of the protrusion is connected to the first pad, and the second end of the protrusion is connected to the second pad.

6. The packaging structure according to any one of claims 1 to 5, characterized in that: The distance between the first pad and the second pad is M1, the width of the protrusion in the second direction is M2, and the second direction is the arrangement direction of the first pad and the second pad; Among them, M1 / 2≤M2≤M1.

7. The packaging structure according to any one of claims 1 to 5, characterized in that: The distance between the first side surface and the second side surface is W1, and the width of the convex portion in the first direction is W2; Among them, W1 / 6≤W2≤W1 / 2.

8. The packaging structure according to any one of claims 1 to 5, characterized in that: The window comprises a first region, a second region and a third region, the first region is arranged opposite to the first pad in a direction perpendicular to the first surface, the second region is arranged opposite to the second pad in a direction perpendicular to the first surface, the third region is arranged opposite to the spacer in a direction perpendicular to the first surface, the projection area of ​​the window on the first surface is S1, and the projection area of ​​the third region on the first surface is S2; Among them, S2 ≥ 20% S1.

9. The packaging structure according to any one of claims 1 to 5, characterized in that: The component includes a first side wall and a second side wall in the first direction, and the first side wall and the second side wall meet one of the following conditions: The first side wall and the first side surface are arranged opposite to each other in a direction perpendicular to the first surface, and the second side wall and the second side surface are arranged opposite to each other in a direction perpendicular to the first surface; The projection contours of the first side wall and the second side wall on the first surface are located between the first side surface and the second side surface, the projection contour of the first side wall on the first surface is spaced apart from the projection contour of the first side surface on the first surface by a first preset distance, and the projection contour of the second side wall on the first surface is spaced apart from the projection contour of the second side surface on the first surface by a second preset distance.

10. The packaging structure according to claim 9, characterized in that: The first preset distance is L1, 0 micrometers<L1≤50 micrometers; and / or the second preset distance is L2, 0 micrometers<L2≤50 micrometers.

11. The packaging structure according to any one of claims 1 to 5, characterized in that: The packaging structure further includes a plastic package body, which covers the solder resist layer and the components.

12. The packaging structure according to any one of claims 1 to 5, characterized in that: The packaging structure also includes a first packaging silk screen line and a second packaging silk screen line, the first packaging silk screen line and the second packaging silk screen line are both U-shaped, the openings of the first packaging silk screen line and the second packaging silk screen line are arranged facing each other, the first solder pad is located in the first packaging silk screen line, and the second solder pad is located in the second packaging silk screen line.

13. The packaging structure according to any one of claims 1 to 5, characterized in that: The components are surface mounted devices.

14. The packaging structure according to any one of claims 1 to 5, characterized in that: The thickness of the solder resist layer is 10 micrometers to 30 micrometers.

15. The packaging structure according to any one of claims 1 to 5, characterized in that: In the thickness direction of the convex portion, the convex portion and the component are spaced apart, and the distance between the convex portion and the component is L3, 0 micrometers<L3≤50 micrometers.

16. A packaging structure, characterized in that: include: A substrate having a first surface, wherein a first pad and a second pad are disposed on the first surface, wherein the first pad and the second pad are spaced apart to form a spacing area; A solder resist layer is disposed on the first surface, the solder resist layer is provided with a window to expose the first pad, the second pad and the spacer, the window includes a first side surface and a second side surface, the first side surface and the second side surface are spaced apart in a first direction, and the first direction is perpendicular to an arrangement direction of the first pad and the second pad; A component, comprising a first end and a second end, wherein the first end of the component is welded to the first pad, and the second end of the component is welded to the second pad; The component includes a first side wall and a second side wall in the first direction, and the first side wall and the second side wall meet one of the following conditions: The first side wall and the first side surface are arranged opposite to each other in a direction perpendicular to the first surface, and the second side wall and the second side surface are arranged opposite to each other in a direction perpendicular to the first surface; The projection outlines of the first side wall and the second side wall on the first surface are located between the first side surface and the second side surface, the projection outline of the first side wall on the first surface is spaced apart from the projection outline of the first side surface on the first surface by a first preset distance, and the projection outline of the second side wall on the first surface is spaced apart from the projection outline of the second side surface on the first surface by a second preset distance.

17. The packaging structure according to claim 16, characterized in that: The first preset distance is L1, 0 micrometers<L1≤50 micrometers; and / or the second preset distance is L2, 0 micrometers<L2≤50 micrometers.

18. A radio frequency front-end module, characterized in that: A packaging structure comprising any one of claims 1 to 17.

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