A method for controlling ink thickness uniformity of high-precision impedance circuit boards

Abstract

A method for controlling the thickness uniformity of ink on a high-precision impedance circuit board relates to the field of circuit board processing, comprising the following steps: pre-solder mask treatment: cleaning the circuit board and roughening the copper surface; applying liquid photosensitive ink to the circuit board by extrusion roller coating with an extrusion force of 2.5±0.2kg / cm 2 The process involves pre-curing and drying the ink at a speed of 1.2±0.2m / min. Pre-baking involves pre-curing and drying the ink. Pressure leveling involves applying pressure to the circuit board to level the ink surface at a pressure of 2±0.2kg / cm² and a temperature of 82±3°C. Exposure involves light-curing the ink to protect areas requiring solder mask coverage. Development removes unexposed ink, exposing electrical connections requiring surface treatment. Post-baking involves further high-temperature curing of the ink to form a solder mask layer. This method utilizes an extrusion roller coating method to minimize ink variations and applies vertically to improve uniformity, ensuring the required circuit board performance and demonstrating strong practicality.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to a method for controlling ink thickness uniformity of a high-precision impedance circuit board. Background Art

[0002] With the continuous development of fields such as AI and autonomous driving, the demand for computing power is increasing. The bandwidth of traditional 100G / 400G optical modules is no longer able to meet development needs. 800G optical modules, however, offer a single port transmission speed of 800Gbps, significantly reducing data transmission latency and supporting large-scale parallel processing. They are currently widely used in data centers and computing centers. 800G optical modules have higher technical requirements than 100G / 400G optical modules, such as lower dielectric constant and dielectric loss. Furthermore, ultra-high transmission speeds require more precise impedance control, which is affected by multiple factors, such as extremely different ink thicknesses.

[0003] Currently, in the production and processing of circuit boards, screen printing is usually used to adhere ink to the surface of the circuit board. However, the extremely poor thickness of the ink on the circuit boards processed by this method is usually greater than 15um, which is difficult to meet the extremely poor ink thickness requirements of high-precision impedance circuit boards, resulting in unsatisfactory product performance. Summary of the Invention

[0004] In response to the shortcomings of the above-mentioned related existing technologies, the present application provides a method for controlling the uniformity of ink thickness for high-precision impedance circuit boards. The method reduces the extreme difference of ink by extrusion roller coating, and vertically coats it to improve uniformity, thereby ensuring the performance requirements of the circuit board and having strong practicality.

[0005] In order to achieve the above object, the present invention adopts the following technologies:

[0006] A method for controlling ink thickness uniformity of a high-precision impedance circuit board comprises the following steps:

[0007] S1. Pre-treatment of solder mask: Clean the circuit board and roughen the copper surface;

[0008] S2, covering the liquid photosensitive ink on the circuit board by extrusion roller coating;

[0009] S3, pre-baking: pre-curing and drying the ink;

[0010] S4, pressure leveling: applying pressure to the circuit board to level the ink on its surface;

[0011] S5, exposure: light curing will be required to protect the ink where solder mask is required to be covered;

[0012] S6, development: remove unexposed ink to expose electrical connection points that require surface treatment;

[0013] S7, post-bake: further high-temperature curing of the ink to form a solder mask layer.

[0014] Furthermore, the extrusion pressure of S2 roller coating is 2.5±0.2kg / cm 2 , speed is 1.2±0.2m / min.

[0015] Furthermore, the pressure applied by S4 is 2±0.2 kg / cm2 and the temperature is 82±3°C.

[0016] Furthermore, in S2, a circuit board ink roller coating device is used to process the circuit board, and the circuit board ink roller coating device includes: a base, a turning mechanism, and a limiting mechanism;

[0017] The base is provided at the conveying end of the conveyor belt, and two rollers arranged side by side and moving toward each other are provided above it. The axis of the roller is perpendicular to the conveying direction of the conveyor belt, and the surface is evenly covered with ink. When in use, the circuit board passes between the rollers; the turning mechanism includes a carrying plate rotatably mounted on the base at one end, and the rotating end is located at the end of the base close to the conveyor belt. The top surface of the carrying plate is provided with a baffle and a push plate respectively located at both ends thereof. The baffle is arranged to move along its thickness direction for abutting against the circuit board, and the push plate is arranged to move along the length direction and thickness direction of the carrying plate for pushing the circuit board. Both sides of the carrying plate are provided with splints that move synchronously along its width direction and thickness direction for limiting both sides of the circuit board; the limiting mechanism includes a vertical plate arranged vertically between the turning mechanism and the conveyor belt, and the side of the vertical plate facing the carrying plate is provided with a limiting wheel that moves along its thickness direction for applying pressure to the surface of the circuit board.

[0018] Furthermore, in S2, an ink roller coating operation is performed, comprising the steps of:

[0019] S01. Convey the circuit board onto the carrier plate. At this time, the upper end of the baffle plate is higher than the top surface of the carrier plate, and the upper end of the push plate is lower than the top surface of the carrier plate, so that the circuit board abuts against the baffle plate and is located between the baffle plate and the push plate;

[0020] S02, the two clamping plates move synchronously toward each other to adjust the posture of the circuit board and limit its two sides;

[0021] S03. Rotate the carrier plate 90 degrees so that the circuit board is in a vertical position and located between the carrier plate and the vertical plate. During the rotation of the carrier plate, the baffle automatically moves downward, and the push plate automatically passes through the surface of the carrier plate, and one side of the circuit board contacts the limiting wheel;

[0022] S04, moving the push plate along the length direction of the carrier plate, thereby pushing the circuit board upward and allowing it to enter between the two rollers;

[0023] S05, driving the two rollers to move toward each other synchronously to clamp the circuit board, and at the same time the two rollers rotate in opposite directions to drive the circuit board to move upward;

[0024] S06. Clamp the upper end of the circuit board with a fixture, and move the fixture upward, driving the circuit board to move upward synchronously;

[0025] S07: The two rollers are synchronously moved away from each other, and the carrying plate is rotated in the opposite direction, and the baffle and the push plate are reset.

[0026] The beneficial effects of the present invention are as follows: the ink is covered on the surface of the circuit board by extrusion roller coating, which can reduce the ink range compared to screen printing and ensure the performance requirements of the circuit board; and the vertical coating method can make the ink flow direction consistent with gravity, which is conducive to making the ink distribution on the circuit board more uniform, further reducing the ink range and improving the performance of the circuit board; and the push plate of this solution can be moved, and through the cooperation of the clamping plate and the limiting wheel, it can adapt to circuit boards of different sizes, thereby improving the versatility of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0028] Figure 1 This is a flow chart of the ink uniformity control method according to an embodiment of the present application.

[0029] Figure 2 This is a three-dimensional schematic diagram of a circuit board ink roller coating device according to an embodiment of the present application.

[0030] Figure 3 This is a three-dimensional schematic diagram of the flip mechanism of an embodiment of the present application.

[0031] Figure 4 This is a three-dimensional schematic diagram of the splint installation structure of an embodiment of the present application.

[0032] Figure 5 This is a schematic diagram of the baffle installation according to an embodiment of the present application.

[0033] Figure 6 This is a schematic diagram of the push plate installation embodiment of the present application.

[0034] Figure 7 This is a side view of the push plate installed on the supporting plate according to an embodiment of the present application.

[0035] Figure 8 This is a three-dimensional schematic diagram of the limiting mechanism of an embodiment of the present application.

[0036] Figure 9This is a three-dimensional schematic diagram of the limiting mechanism from another angle of the embodiment of the present application.

[0037] Explanation of reference numerals: 100 - base, 200 - flip mechanism, 300 - limit mechanism, 101 - roller, 102 - stopper, 201 - load-bearing plate, 202 - stopper, 203 - push plate, 204 - clamping plate, 205 - conveying wheel, 206 - guide rod, 207 - side frame, 208 - vertical rod, 209 - stop ring, 210 - first spring, 211 - convex plate, 212 - pull rod, 213 - U-shaped frame, 214 - stop ring, 215 - second spring, 216 - slide groove, 217 - bottom plate, 218 - top Rod, 219-cross bar, 220-support rod, 221-side plate, 222-third spring, 223-connecting block, 224-connecting rod, 225-moving block, 226-through rod, 227-connecting plate, 228-convex rod, 229-fourth spring, 230-positioning rod, 231-slider, 301-vertical plate, 302-limiting wheel, 303-recess, 304-moving plate, 305-long hole, 306-support frame, 307-cross plate, 308-support rod, 309-end plate, 310-fifth spring. DETAILED DESCRIPTION

[0038] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0039] like Figure 1 As shown, one aspect of the embodiments of the present application provides a method for controlling ink thickness uniformity of a high-precision impedance circuit board, comprising the following steps:

[0040] S1. Pre-treatment of solder mask: Clean the circuit board and roughen the copper surface;

[0041] S2, covering the liquid photosensitive ink on the circuit board by extrusion roller coating;

[0042] S3, pre-baking: pre-curing and drying the ink;

[0043] S4, pressure leveling: applying pressure to the circuit board to level the ink on its surface;

[0044] S5, exposure: light curing will be required to protect the ink where solder mask is required to be covered;

[0045] S6, development: remove unexposed ink to expose electrical connection points that require surface treatment;

[0046] S7, post-bake: further high-temperature curing of the ink to form a solder mask layer.

[0047] Specifically, the extrusion pressure of S2 roller coating is 2.5±0.2kg / cm 2 , speed is 1.2±0.2m / min.

[0048] Specifically, the pressure applied by S4 is 2±0.2 kg / cm2 and the temperature is 82±3°C.

[0049] This method can control the extreme difference in ink thickness to within 5 μm, reducing the impact on the high-precision impedance of the circuit board.

[0050] Another aspect of the embodiment of the present application provides a circuit board ink roller coating device, wherein the circuit board is processed by using the circuit board ink roller coating device in S2, such as Figure 2-Figure 9 As shown, the circuit board ink roller coating device includes: a base 100, a turning mechanism 200, a limiting mechanism 300, etc.

[0051] The base 100 is provided at the conveying end of the conveyor belt, and two rollers 101 arranged side by side and moving toward each other are provided on the top. The axis of the roller 101 is perpendicular to the conveying direction of the conveyor belt, and the surface is evenly covered with ink. When the ink is rolled, the circuit board passes between the rollers 101; the turning mechanism 200 includes a carrying plate 201 rotatably mounted on the base 100 at one end, and the rotating end is located at the end of the base 100 close to the conveyor belt. The top surface of the carrying plate 201 is provided with a baffle 202 and a push plate 203 respectively located at both ends thereof. When the circuit board is located on the carrying plate 201, the carrying plate 201 can be rotated to make the circuit board change from a horizontal state to a vertical state. The baffle 202 is arranged to move along its thickness direction for contacting the circuit board. The road plate prevents the circuit board from being pushed away from the carrier plate 201. The push plate 203 is arranged to move along the length and thickness directions of the carrier plate 201. When the carrier plate 201 is in a vertical state, it is used to push the circuit board upward. The clamping plates 204 on both sides of the carrier plate 201 are synchronously moved along its width and thickness directions to adjust the posture of the circuit board and limit its two sides; the limiting mechanism 300 includes a vertical plate 301 arranged between the flipping mechanism 200 and the conveyor belt and arranged vertically. The vertical plate 301 is provided with a limiting wheel 302 that is movable along its thickness direction on the side facing the carrier plate 201. When the carrier plate 201 is in a vertical state, it is used to apply pressure to the surface of the circuit board to ensure the stability of the circuit board in the upward movement.

[0052] Specifically, in S2, an ink roller coating operation is performed, including the steps of:

[0053] S01. Transport the circuit board to the carrier plate 201. At this time, the upper end of the baffle 202 is higher than the top surface of the carrier plate 201, and the upper end of the push plate 203 is lower than the top surface of the carrier plate 201, so that the circuit board abuts against the baffle 202, and the circuit board is located between the baffle 202 and the push plate 203.

[0054] Specifically, if Figure 2-Figure 4 As shown, a plurality of conveying wheels 205 are provided on both sides of the carrier plate 201 along its length, and the clamping plates 204 are tooth-shaped. The tooth-shaped portions of the clamping plates 204 are staggered between two adjacent conveying wheels 205. Thus, when the circuit board is placed on the carrier plate 201, the conveying wheels 205 can convey the circuit board so that it can be placed between the baffle plate 202 and the push plate 203.

[0055] S01 also includes the following steps: driving the conveying wheel 205 to rotate, and when the circuit board is completely located on the carrying plate 201 , the circuit board is pushed until it abuts against the baffle 202 .

[0056] S02. The two clamping plates 204 move toward each other synchronously to adjust the posture of the circuit board and limit the positions of both sides thereof.

[0057] S03. Rotate the carrier plate 201 90 degrees so that the circuit board is in a vertical state and is located between the carrier plate 201 and the vertical plate 301. During the rotation of the carrier plate 201, the baffle 202 automatically moves downward, and the push plate 203 automatically passes through the surface of the carrier plate 201, and one side of the circuit board contacts the limiting wheel 302.

[0058] Specifically, if Figure 2-Figure 4 As shown, the bottom of the clamping plate 204 is sleeved on the guide rod 206, both ends of the guide rod 206 are mounted on the side frame 207, the side frame 207 is sleeved on the vertical rod 208, the vertical rod 208 is mounted on the bearing plate 201, two retaining rings 209 are provided on the vertical rod 208, the side frame 207 is located between the two retaining rings 209, and a first spring 210 is sleeved on the vertical rod 208, the two ends of the first spring 210 respectively abut against the side frame 207 and the retaining ring 209 located below, and are always in a compressed state;

[0059] In the process of rotating the supporting plate 201 from a horizontal state to a vertical state in S03, the top of the clamping plate 204 abuts against the side of the vertical plate 301, and the clamping plate 204 moves along the thickness direction of the supporting plate 201, and the first spring 210 is further compressed until the supporting plate 201 is completely in a vertical state, and then the clamping plate 204 stops moving. In this way, while the clamping plate 204 is used to ensure the limitation of both sides of the circuit board, it also avoids interference with the vertical plate 301 and can adapt to circuit boards of different sizes.

[0060] S04 , moving the push plate 203 along the length direction of the carrying plate 201 , thereby pushing the circuit board upwards and passing between the two rollers 101 .

[0061] S05. Drive the two rollers 101 to move toward each other synchronously to clamp the circuit board. At the same time, the two rollers 101 rotate in opposite directions to drive the circuit board to move upward to start roller coating.

[0062] Specifically, tooth-shaped grooves are uniformly distributed on the surface of the roller 101 to facilitate the adhesion of ink to the surface of the circuit board.

[0063] S06. Clamp the upper end of the circuit board with a fixture, and move the fixture upward to drive the circuit board to move upward synchronously.

[0064] S07 , the two rollers 101 are synchronously moved away from each other, and the carrying plate 201 is rotated 90 degrees in the opposite direction, and the baffle 202 and the push plate 203 are reset.

[0065] Specifically, if Figure 2-Figure 4 As shown, a positioning rod 230 is provided on the inner side of the splint 204. The positioning rod 230 is arranged vertically and is penetrated by a slider 231. The slider 231 is connected to the moving end of the bidirectional linear mechanism. The bidirectional linear mechanism is installed on the bottom surface of the carrier plate 201. When the circuit board is located on the carrier plate 201, the two splint sliders 231 are driven to move synchronously toward each other through the bidirectional linear mechanism, thereby driving the two splints 204 to move synchronously to achieve adjustment of the circuit board posture, and when the splint 204 moves along the thickness direction of the carrier plate 201, relative sliding occurs between the slider 231 and the positioning rod 230, and the splint 204 can move relative to each other to avoid interference.

[0066] Specifically, if Figure 3 、 Figure 5 As shown, a convex plate 211 is provided at the lower end of the baffle 202, and a pull rod 212 is provided at the bottom of the convex plate 211. The pull rod 212 is inserted into a U-shaped frame 213, and the U-shaped frame 213 is mounted on the carrier plate 201. A retaining ring 214 is provided at the lower end of the pull rod 212, and a second spring 215 is sleeved on the pull rod 212. The two ends of the second spring 215 respectively abut against the U-shaped frame 213 and the retaining ring 214 and are always in a compressed state. Under the action of the second spring 215, the baffle 202 always has a tendency to move downward to below the top surface of the carrier plate 201, thereby facilitating the upward pushing of the circuit board when the carrier plate 201 is in a vertical state.

[0067] Then, in S07, when the supporting plate 201 is transformed from the vertical state to the horizontal state, the retaining ring 214 abuts against the base 100, thereby forcing the retaining plate 202 to pass upward out of the supporting plate 201. At this time, the second spring 215 is further compressed to block the circuit board.

[0068] In S03, when the supporting plate 201 changes from a horizontal state to a vertical state, the baffle 202 moves downward under the action of the second spring 215 until its top surface is no higher than the top surface of the supporting plate 201, and then the circuit board can be pushed upward.

[0069] Specifically, if Figure 2、 Figure 6-Figure 7 As shown, the top surface of the carrying plate 201 is provided with a sliding groove 216 running through it from top to bottom along its length direction, the push plate 203 is inserted into the sliding groove 216, and a bottom plate 217 is provided at the lower end. A top rod 218 is provided on the bottom surface of the bottom plate 217, and the top rod 218 is inserted into the cross bar 219. A fourth spring 229 is sleeved on the top rod 218, and the two ends of the fourth spring 229 are respectively abutted against the bottom plate 217 and the cross bar 219, and are always in a compressed state. Under the action of the fourth spring 229, the push plate 203 always has a tendency to pass through the sliding groove 216, so that in the process of the carrying plate 201 being transformed from a horizontal state to a vertical state, the circuit board can be supported to prevent it from sliding down freely, thereby ensuring In order to ensure the smooth progress of the ink roller coating operation, both ends of the cross bar 219 are sleeved on the support bar 220, and both ends of the support bar 220 are installed on the side plates 221, and the side plates 221 are installed on the bottom of the carrier plate 201. A third spring 222 is sleeved on the support bar 220, and both ends of the third spring 222 are respectively abutted against the cross bar 219 and the side plate 221 away from the rotating end of the carrier plate 201, and are always in a compressed state. Under the action of the third spring 222, the cross bar 219 always has a tendency to move toward the rotating end of the carrier plate 201, so that after the circuit board on the carrier plate 201 is pushed away, the push plate 203 can automatically reset under the action of gravity and the elastic force of the third spring 222;

[0070] A connecting block 223 is provided at the lower end of the top rod 218, and both sides of the connecting block 223 are rotatably connected to one end of the connecting rod 224, and the other end of the connecting rod 224 is rotatably connected to the moving block 225. A through rod 226 is provided at the outer end of the moving block 225, and the through rod 226 is passed through the connecting plate 227. The connecting plate 227 is installed on the cross bar 219. A protruding rod 228 is provided on the side of the moving block 225, and a stop block 102 is provided on the base 100. Both ends of the stop block 102 are provided with upward inclined surfaces for abutting against the protruding rod 228.

[0071] In S07, when the supporting plate 201 is transformed from the vertical state to the horizontal state, the protruding rod 228 contacts the inclined surface of the stopper 102, forcing the two protruding rods 228 to move away from each other, and driving the connecting block 223 to move away from the supporting plate 201. The fourth spring 229 is further compressed, so that the top surface of the push plate 203 is no higher than the top surface of the supporting plate 201.

[0072] In S03 , when the supporting plate 201 is transformed from a horizontal state to a vertical state, the upper end of the push plate 203 passes through the supporting plate 201 under the action of the fourth spring 229 , and the two moving blocks 225 approach each other to support the circuit board.

[0073] Specifically, if Figure 2 、 Figure 8-Figure 9When the support plate 201 is in the vertical position, at least a part of the push plate 203 is located in the recess 303. At this time, the movable plate 304 can be driven upward by the vertical lifting mechanism, and the movable plate 304 will contact the push plate 203 and push the push plate 203 to move upward synchronously. At this time, the third spring 222 is further compressed, thereby pushing the circuit board upward and passing through the two rollers 101. After the clamp above the roller 101 clamps the circuit board, the movable plate 304 is driven to move back, and the push plate 203 will also be reset under the action of the third spring 222. Then the support plate 201 can be rotated in the opposite direction to be reset.

[0074] Specifically, if Figure 2 、 Figure 8-Figure 9 When the support plate 301 is in the vertical position, the circuit board 301 will be in the vertical position, and the circuit board 301 will be in the vertical position. When the support plate 301 is in the vertical position, the circuit board 301 will be in the vertical position, and the circuit board 301 will be in the vertical position. When the support plate 301 is in the vertical position, the circuit board 301 will be in the vertical position, and the circuit board 301 will be in the vertical position. When the support plate 301 is in the vertical position, the circuit board 301 will be in the vertical position, and the circuit board 301 will be in the vertical position.

[0075] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A method for controlling ink thickness uniformity of a high-precision impedance circuit board, characterized in that: The following steps are involved: S1. Pre-treatment of solder mask: Clean the circuit board and roughen the copper surface; S2. Covering the circuit board with liquid photosensitive ink by extrusion roller coating, including first limiting and clamping the cleaned horizontally transported circuit board on both sides, then flipping the circuit board to a vertical state, moving the circuit board vertically upward and extrusion roller coating starting from the upper end during the movement, and clamping and removing the circuit board after roller coating is completed; S3, pre-baking: pre-curing and drying the ink; S4, pressure leveling: applying pressure to the circuit board to level the ink on its surface; S5, exposure: light curing will be required to protect the ink where solder mask is required to be covered; S6, development: remove unexposed ink to expose electrical connection points that require surface treatment; S7, post-bake: further high-temperature curing of the ink to form a solder mask layer; In S2, a circuit board ink roller coating device is used to process the circuit board, and the circuit board ink roller coating device includes: A base (100) is provided at the conveying end of the conveyor belt, and is provided with two rollers (101) arranged side by side and moving toward each other on the base. The axes of the rollers (101) are perpendicular to the conveying direction of the conveyor belt, and ink is evenly distributed on the surfaces. When in use, the circuit board passes between the rollers (101); The flip mechanism (200) comprises a carrier plate (201) rotatably mounted on the base (100) at one end, and the rotating end is located at an end of the base (100) close to the conveyor belt. The top surface of the carrier plate (201) is provided with a baffle (202) and a push plate (203) respectively located at both ends thereof. The baffle (202) is arranged to move along its thickness direction and is used to abut against the circuit board. The push plate (203) is arranged to move along the length direction and thickness direction of the carrier plate (201) and is used to push the circuit board. Clamps (204) are arranged to move synchronously along its width direction and thickness direction on both sides of the carrier plate (201) and are used to limit the positions of both sides of the circuit board. The limiting mechanism (300) comprises a vertically arranged vertical plate (301) provided between the turning mechanism (200) and the conveyor belt, wherein a limiting wheel (302) is provided on a side of the vertical plate (301) facing the carrier plate (201) and is movable along the thickness direction thereof, for applying pressure to the surface of the circuit board.

2. The method for controlling ink thickness uniformity of a high-precision impedance circuit board according to claim 1, characterized in that: The extrusion pressure of S2 roller coating is 2.5±0.2kg / cm 2 , speed is 1.2±0.2m / min.

3. The method for controlling ink thickness uniformity of a high-precision impedance circuit board according to claim 1, characterized in that: The pressure applied by S4 is 2±0.2kg / cm 2 , the temperature is 82±3℃.

4. The method for controlling ink thickness uniformity of a high-precision impedance circuit board according to claim 1, characterized in that: Ink roller coating operation is performed in S2, including the following steps: S01, conveying the circuit board onto the carrier plate (201), at which time the upper end of the baffle plate (202) is higher than the top surface of the carrier plate (201), and the upper end of the push plate (203) is lower than the top surface of the carrier plate (201), so that the circuit board abuts against the baffle plate (202), and the circuit board is located between the baffle plate (202) and the push plate (203); S02, the two clamping plates (204) move synchronously towards each other to adjust the posture of the circuit board and limit the positions on both sides thereof; S03, rotating the carrier plate (201) 90 degrees so that the circuit board is in a vertical state and is located between the carrier plate (201) and the vertical plate (301). During the rotation of the carrier plate (201), the baffle (202) automatically moves downward, and the push plate (203) automatically passes through the surface of the carrier plate (201), and one side of the circuit board contacts the limiting wheel (302); S04, moving the push plate (203) along the length direction of the carrier plate (201), thereby pushing the circuit board upwards and allowing it to enter between the two rollers (101); S05, driving the two rollers (101) to move synchronously toward each other to clamp the circuit board, and at the same time, the two rollers (101) rotate in opposite directions to drive the circuit board to move upward; S06. Clamp the upper end of the circuit board with a fixture, and move the fixture upward, driving the circuit board to move upward synchronously; S07, the two rollers (101) are synchronously moved away from each other, and the supporting plate (201) is rotated 90 degrees in the opposite direction, and the baffle (202) and the push plate (203) are reset.

5. The method for controlling ink thickness uniformity of a high-precision impedance circuit board according to claim 4, characterized in that: Both sides of the carrier plate (201) are provided with a plurality of spaced-apart conveying wheels (205) along the length direction thereof, the clamping plate (204) is tooth-shaped, and the tooth-shaped portion of the clamping plate (204) is staggered between two adjacent conveying wheels (205); S01 also includes the following steps: driving the conveying wheel (205) to rotate, and when the circuit board is completely located on the carrier plate (201), the circuit board is pushed until it abuts against the baffle (202).

6. The method for controlling ink thickness uniformity of a high-precision impedance circuit board according to claim 4, characterized in that: The bottom of the clamping plate (204) is sleeved on the guide rod (206), both ends of the guide rod (206) are mounted on the side frame (207), the side frame (207) is sleeved on the vertical rod (208), the vertical rod (208) is mounted on the bearing plate (201), two retaining rings (209) are provided on the vertical rod (208), the side frame (207) is located between the two retaining rings (209), and a first spring (210) is sleeved on the vertical rod (208), the two ends of the first spring (210) respectively abut against the side frame (207) and the retaining ring (209) located below, and are always in a compressed state; During the process of rotating the supporting plate (201) from a horizontal state to a vertical state in S03, the top of the clamping plate (204) abuts against the side of the vertical plate (301), the clamping plate (204) moves along the thickness direction of the supporting plate (201), and the first spring (210) is further compressed until the supporting plate (201) is completely in a vertical state, and then the clamping plate (204) stops moving.

7. The method for controlling ink thickness uniformity of a high-precision impedance circuit board according to claim 4, characterized in that: A convex plate (211) is provided at the lower end of the baffle (202), a pull rod (212) is provided at the bottom of the convex plate (211), the pull rod (212) is passed through a U-shaped frame (213), the U-shaped frame (213) is mounted on the bearing plate (201), and a retaining ring (214) is provided at the lower end of the pull rod (212), a second spring (215) is sleeved on the pull rod (212), and two ends of the second spring (215) respectively abut against the U-shaped frame (213) and the retaining ring (214), and are always in a compressed state; In S07, when the supporting plate (201) is transformed from a vertical state to a horizontal state, the retaining ring (214) abuts against the base (100), thereby forcing the retaining plate (202) to pass upward out of the supporting plate (201), and at this time, the second spring (215) is further compressed; In S03, during the process of the supporting plate (201) changing from a horizontal state to a vertical state, under the action of the second spring (215), the baffle (202) moves downward until its top surface is no higher than the top surface of the supporting plate (201).

8. The method for controlling ink thickness uniformity of a high-precision impedance circuit board according to claim 4, characterized in that: The top surface of the supporting plate (201) is provided with a sliding groove (216) running through it from top to bottom along its length direction. The push plate (203) is inserted into the sliding groove (216) and provided with a bottom plate (217) at the lower end. The bottom surface of the bottom plate (217) is provided with a push rod (218). The push rod (218) is inserted into the cross bar (219). A fourth spring (229) is sleeved on the push rod (218). The two ends of the fourth spring (229) are respectively abutted against the bottom plate (217) and the cross bar (219). and is always in a compressed state, both ends of the cross bar (219) are sleeved on the support bar (220), both ends of the support bar (220) are mounted on the side plates (221), the side plates (221) are mounted on the bottom of the bearing plate (201), a third spring (222) is sleeved on the support bar (220), both ends of the third spring (222) respectively abut against the cross bar (219) and the side plate (221) away from the rotating end of the bearing plate (201), and is always in a compressed state; The lower end of the top rod (218) is provided with a connecting block (223), and both sides of the connecting block (223) are rotatably connected to one end of the connecting rod (224), and the other end of the connecting rod (224) is rotatably connected to the moving block (225). The outer end of the moving block (225) is provided with a through rod (226), and the through rod (226) is passed through the connecting plate (227). The connecting plate (227) is installed on the cross bar (219). The side of the moving block (225) is provided with a protruding rod (228). The base (100) is provided with a stopper (102), and both ends of the stopper (102) are provided with upward inclined surfaces for abutting against the protruding rod (228). In S07, during the process of the carrier plate (201) being transformed from a vertical state to a horizontal state, the protruding rod (228) contacts the inclined surface of the stopper (102), forcing the two protruding rods (228) to move away from each other, and driving the connecting block (223) to move in a direction away from the carrier plate (201), and the fourth spring (229) is further compressed, so that the top surface of the push plate (203) is not higher than the top surface of the carrier plate (201); In S03, during the process of the carrier plate (201) being transformed from a horizontal state to a vertical state, under the action of the fourth spring (229), the upper end of the push plate (203) passes through the carrier plate (201), and the two moving blocks (225) approach each other to support the circuit board.

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