Connector terminal, connector, and connector terminal manufacturing method

Abstract

The invention discloses a connector terminal, a connector and a connector terminal manufacturing method. The connector terminal includes: a terminal body; and an electroplated part. The electroplated part comprises a base material layer and an electroplated layer. The base material layer has a first surface and a second surface opposite to each other in a thickness direction thereof, and the first surface of the base material layer is attached to a portion of the terminal body. And the electroplated layer is formed on the second surface of the base material layer and is used for being electrically contacted with a matching terminal. According to the invention, the electroplated layer for electric contact is formed on the electroplated part separated from the terminal body, so that the terminal body does not need to be electroplated, the manufacturing efficiency is improved, and the manufacturing cost is reduced.

Description

Technical Field

[0001] The present invention relates to a connector terminal, a method for manufacturing the connector terminal and a connector including the connector terminal. Background Art

[0002] In the prior art, in order to improve the electrical contact performance of the connector terminal, it is usually necessary to form an electroplating layer on the entire surface or a partial surface of the connector terminal, and the electroplating layer may be a copper plating layer, a silver plating layer or a gold plating layer. When the connector terminal is in electrical contact with the mating connector terminal, the electroplating layer on the connector terminal is in electrical contact with the electroplating layer on the mating connector terminal, thereby improving the electrical contact performance between the connector terminal and the mating connector terminal. In the prior art, since the electroplating layer is directly formed on the connector terminal, each connector terminal needs to be electroplated separately, which greatly reduces manufacturing efficiency and greatly increases manufacturing costs. Summary of the invention

[0003] The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0004] According to one aspect of the present invention, a connector terminal is provided. The connector terminal comprises: a terminal body and an electroplating part. The electroplating part comprises: a substrate layer having a first surface and a second surface opposite to each other in the thickness direction thereof, and the first surface of the substrate layer is attached to a part of the terminal body; and an electroplating layer formed on the second surface of the substrate layer for electrical contact with a mating terminal.

[0005] According to an exemplary embodiment of the present invention, the conductivity of the electroplating layer of the electroplating part is better than the conductivity of the base material layer of the electroplating part and the terminal body.

[0006] According to another exemplary embodiment of the present invention, the base material layer of the electroplated part and the terminal body are made of aluminum, and the electroplated layer of the electroplated part is a copper plating layer, a silver plating layer or a gold plating layer.

[0007] According to another exemplary embodiment of the present invention, the base material layer of the electroplating member is welded, riveted or crimped to a portion of the terminal body.

[0008] According to another exemplary embodiment of the present invention, the terminal body is flat and has a pair of surfaces facing each other in a thickness direction thereof, and the plating member is sheet-shaped and attached to the surface of the terminal body.

[0009] According to another exemplary embodiment of the present invention, the terminal body is cylindrical, the electroplating part is hollow cylindrical and is mounted on the terminal body; the inner peripheral surface of the substrate layer of the electroplating part is attached to the outer peripheral surface of the terminal body, and the electroplating layer is formed on the outer peripheral surface of the substrate layer of the electroplating part.

[0010] According to another exemplary embodiment of the present invention, the terminal body is in the shape of a hollow cylinder, the electroplating part is in the shape of a circular ring and is inserted into the inner cavity of the terminal body; the outer peripheral surface of the substrate layer of the electroplating part is attached to the inner peripheral surface of the terminal body, and the electroplating layer is formed on the inner peripheral surface of the substrate layer of the electroplating part.

[0011] According to another exemplary embodiment of the present invention, the terminal body is flat, including a pair of surfaces opposite to each other in its thickness direction and two ends opposite to each other in its longitudinal direction; the base layer of the electroplating part is U-shaped, including a pair of flat portions and a bent portion connected between the pair of flat portions, and the electroplating layer is formed on the outer side of the base layer of the electroplating part; one end of the terminal body is inserted into the electroplating part, the inner side surfaces of the pair of flat portions of the electroplating part are respectively attached to a pair of surfaces of the terminal body, and the inner side surface of the bent portion of the electroplating part is attached to one end surface of the terminal body.

[0012] According to another exemplary embodiment of the present invention, the terminal body is flat, including a pair of surfaces opposite to each other in its thickness direction and two sides opposite to each other in its transverse direction; the base layer of the electroplating part is U-shaped, including a pair of flat plate portions and a bent portion connected between the pair of flat plate portions, and the electroplating layer is formed on the outer side of the base layer of the electroplating part; the terminal body is inserted into the electroplating part along its transverse direction, the inner side surfaces of the pair of flat plate portions of the electroplating part are respectively attached to a pair of surfaces of the terminal body, and the inner side surface of the bent portion of the electroplating part is attached to one side of the terminal body.

[0013] According to another exemplary embodiment of the present invention, the terminal body is block-shaped and is formed with a slot allowing a mating terminal to be inserted, and the plating piece is sheet-shaped and attached to an inner side surface of the slot of the terminal body.

[0014] According to another exemplary embodiment of the present invention, the connector terminal includes two electroplating parts, which are respectively attached to two inner side surfaces of the slot of the terminal body to respectively make electrical contact with two sides of the mating terminal inserted into the slot.

[0015] According to another exemplary embodiment of the present invention, a recessed portion suitable for cooperating with the electroplating component is formed on the terminal body, and the electroplating component is embedded in the recessed portion of the terminal body.

[0016] According to another aspect of the present invention, a connector is provided, comprising: a housing; and the aforementioned connector terminal, which is arranged in the housing.

[0017] According to another aspect of the present invention, a method for manufacturing a connector terminal is provided. The method for manufacturing a connector terminal comprises the following steps:

[0018] S100: manufacture terminal body and plating parts separately; and

[0019] S200: Attaching the electroplating member to a portion of the terminal body.

[0020] According to an exemplary embodiment of the present invention, manufacturing the electroplated part includes the following steps:

[0021] S110: providing a substrate plate;

[0022] S120: forming an electroplating layer on one surface of the substrate plate; and

[0023] S130: Punching the substrate plate on which the electroplating layer has been formed to obtain one or more electroplated parts.

[0024] In the aforementioned various exemplary embodiments according to the present invention, the plating layer for electrical contact is formed on a plating member separated from the terminal body, so there is no need to electroplate the terminal body, thereby improving manufacturing efficiency and reducing manufacturing costs.

[0025] Other objects and advantages of the present invention will become apparent from the following description of the present invention with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A perspective schematic diagram showing a connector terminal according to a first embodiment of the present invention;

[0027] Figure 2 An exploded schematic diagram showing a connector terminal according to a first embodiment of the present invention;

[0028] Figure 3 A schematic diagram showing electrical contact between a connector terminal and a mating terminal according to a first embodiment of the present invention;

[0029] Figure 4 A perspective schematic diagram showing a connector terminal according to a second embodiment of the present invention;

[0030] Figure 5 An exploded schematic diagram showing a connector terminal according to a second embodiment of the present invention;

[0031] Figure 6 A longitudinal sectional view showing a connector terminal according to a second embodiment of the present invention;

[0032] Figure 7 A perspective schematic diagram showing a connector terminal according to a third embodiment of the present invention;

[0033] Figure 8 An exploded schematic diagram showing a connector terminal according to a third embodiment of the present invention;

[0034] Fig. 9 A perspective schematic diagram showing a connector terminal according to a fourth embodiment of the present invention;

[0035] Fig.10 An exploded schematic diagram showing a connector terminal according to a fourth embodiment of the present invention;

[0036] Fig.11 A perspective schematic diagram showing a connector terminal according to a fifth embodiment of the present invention;

[0037] Fig.12 An exploded schematic diagram showing a connector terminal according to a fifth embodiment of the present invention;

[0038] Fig.13 A perspective schematic diagram showing a connector terminal according to a sixth embodiment of the present invention;

[0039] Fig.14 An exploded schematic diagram showing a connector terminal according to a sixth embodiment of the present invention. DETAILED DESCRIPTION

[0040] The technical solution of the present invention is further specifically described below by examples and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation of the present invention.

[0041] In addition, in the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments may be implemented without these specific details. In other cases, known structures and devices are embodied in a schematic manner to simplify the accompanying drawings.

[0042] According to an overall technical concept of the present invention, a connector terminal is provided. The connector terminal comprises: a terminal body; and an electroplating part. The electroplating part comprises: a substrate layer and an electroplating layer. The substrate layer has a first surface and a second surface opposite to each other in the thickness direction thereof, and the first surface of the substrate layer is attached to a part of the terminal body. The electroplating layer is formed on the second surface of the substrate layer for electrical contact with a mating terminal.

[0043] According to another general technical concept of the present invention, a connector is provided, comprising: a housing; and the aforementioned connector terminal, which is arranged in the housing.

[0044] According to another general technical concept of the present invention, there is provided a connector terminal manufacturing method, comprising the steps of: separately manufacturing a terminal body and a plating member; and attaching the plating member to a portion of the terminal body.

[0045] First embodiment

[0046] Figures 1 to 3 A connector terminal 1 according to a first embodiment of the present invention is shown. Figure 1 A three-dimensional schematic diagram showing a connector terminal 1 according to a first embodiment of the present invention;

[0047] Figure 2 An exploded schematic diagram showing a connector terminal 1 according to a first embodiment of the present invention; Figure 3 A schematic diagram showing electrical contact between a connector terminal 1 and a mating terminal 2 according to a first embodiment of the present invention.

[0048] like Figures 1 to 3 As shown, in an exemplary embodiment of the present invention, a connector terminal 1 is disclosed. The connector terminal 1 includes: a terminal body 10 and a plating part 11. The plating part 11 includes a substrate layer 110 and a plating layer 11a. The substrate layer 110 has a first surface and a second surface opposite to each other in a thickness direction thereof, and the first surface of the substrate layer 110 is attached to a part of the terminal body 10. The plating layer 11a is formed on the second surface of the substrate layer 110 for electrical contact with the mating terminal 2.

[0049] like Figures 1 to 3 As shown, in the illustrated embodiment, the conductive property of the electroplating layer 11 a of the electroplating member 11 is better than the conductive property of the base material layer 110 of the electroplating member 11 and the terminal body 10 .

[0050] like Figures 1 to 3As shown, in an exemplary embodiment of the present invention, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can be made of the same or different materials. For example, in order to reduce manufacturing costs, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can both be made of aluminum, and the electroplating layer 11a of the electroplating member 11 can be a copper plating layer, a silver plating layer or a gold plating layer.

[0051] like Figures 1 to 3 As shown, in the illustrated embodiment, the base material layer 110 of the electroplating member 11 can be welded, riveted or pressed onto a portion of the terminal body 10. For example, the base material layer 110 of the electroplating member 11 can be welded onto a portion of the terminal body 10 by ultrasonic welding.

[0052] like Figures 1 to 3 As shown, in the illustrated embodiment, the terminal body 10 is flat and has a pair of surfaces opposing each other in the thickness direction thereof, and the plating member 11 is sheet-shaped and attached to the surface of the terminal body 10 .

[0053] Although not shown in the figure, in the illustrated embodiment, a recessed portion suitable for cooperating with the electroplating member 11 may be formed on the terminal body 10 , and the electroplating member 11 is embedded in the recessed portion of the terminal body 10 .

[0054] like Figures 1 to 3 As shown, in another exemplary embodiment of the present invention, a connector is also disclosed. The connector comprises: a housing (not shown) and a connector terminal 1. The connector terminal 1 is arranged in the housing.

[0055] like Figures 1 to 3 As shown, in another exemplary embodiment of the present invention, a method for manufacturing a connector terminal is also disclosed. The method mainly includes the following steps:

[0056] S100: manufacturing the terminal body 10 and the electroplating part 11 respectively; and

[0057] S200 : attaching the plating member 11 to a portion of the terminal body 10 .

[0058] like Figures 1 to 3 As shown, in the illustrated embodiment, manufacturing the electroplated part 11 includes the following steps:

[0059] S110: providing a substrate plate;

[0060] S120: forming a plating layer 11a on one surface of the base plate; and

[0061] S130 : Punching the base plate on which the electroplating layer 11 a has been formed to obtain one or more electroplated parts 11 .

[0062] Second embodiment

[0063] Figures 4 to 6 A connector terminal according to a second embodiment of the present invention is shown. Figure 4 A perspective schematic diagram showing a connector terminal according to a second embodiment of the present invention; Figure 5 An exploded schematic diagram showing a connector terminal according to a second embodiment of the present invention; Figure 6 A longitudinal sectional view showing a connector terminal according to a second embodiment of the present invention.

[0064] like Figures 4 to 6 As shown, in an exemplary embodiment of the present invention, a connector terminal 1 is disclosed. The connector terminal 1 includes: a terminal body 10 and a plating member 11. The plating member 11 includes a substrate layer 110 and a plating layer 11a. The substrate layer 110 has a first surface and a second surface opposite to each other in a thickness direction thereof, and the first surface of the substrate layer 110 is attached to a portion of the terminal body 10. The plating layer 11a is formed on the second surface of the substrate layer 110 for electrical contact with a mating terminal (not shown).

[0065] like Figures 4 to 6 As shown, in the illustrated embodiment, the conductive property of the electroplating layer 11 a of the electroplating member 11 is better than the conductive property of the base material layer 110 of the electroplating member 11 and the terminal body 10 .

[0066] like Figures 4 to 6 As shown, in an exemplary embodiment of the present invention, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can be made of the same or different materials. For example, in order to reduce manufacturing costs, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can both be made of aluminum, and the electroplating layer 11a of the electroplating member 11 can be a copper plating layer, a silver plating layer or a gold plating layer.

[0067] like Figures 4 to 6 As shown, in the illustrated embodiment, the base material layer 110 of the electroplating member 11 can be welded, riveted or pressed onto a portion of the terminal body 10. For example, the base material layer 110 of the electroplating member 11 can be welded onto a portion of the terminal body 10 by ultrasonic welding.

[0068] like Figures 4 to 6 As shown, in the illustrated embodiment, the terminal body 10 is cylindrical, and the electroplating part 11 is hollow cylindrical and is mounted on the terminal body 10. The inner peripheral surface of the base material layer 110 of the electroplating part 11 is attached to the outer peripheral surface of the terminal body 10, and the electroplating layer 11a is formed on the outer peripheral surface of the base material layer 110 of the electroplating part 11.

[0069] like Figures 4 to 6As shown, in the illustrated embodiment, a recessed portion 101 suitable for cooperating with the electroplating member 11 is formed on the outer circumferential surface of the terminal body 10 , and the electroplating member 11 is embedded in the recessed portion 101 of the terminal body 10 .

[0070] like Figures 4 to 6 As shown, in another exemplary embodiment of the present invention, a connector is also disclosed. The connector comprises: a housing (not shown) and a connector terminal 1. The connector terminal 1 is arranged in the housing.

[0071] like Figures 4 to 6 As shown, in another exemplary embodiment of the present invention, a method for manufacturing a connector terminal is also disclosed. The method mainly includes the following steps:

[0072] S100: manufacturing the terminal body 10 and the electroplating part 11 respectively; and

[0073] S200 : attaching the plating member 11 to a portion of the terminal body 10 .

[0074] like Figures 4 to 6 As shown, in the illustrated embodiment, manufacturing the electroplated part 11 includes the following steps:

[0075] S110: providing a substrate plate;

[0076] S120: forming a plating layer 11a on one surface of the base plate; and

[0077] S130 : Punching the base plate on which the electroplating layer 11 a has been formed to obtain one or more electroplated parts 11 .

[0078] Third embodiment

[0079] Figure 7 and Figure 8 A connector terminal according to a third embodiment of the present invention is shown. Figure 7 A perspective schematic diagram showing a connector terminal according to a third embodiment of the present invention; Figure 8 An exploded schematic diagram showing a connector terminal according to a third embodiment of the present invention.

[0080] like Figure 7 and Figure 8 As shown, in an exemplary embodiment of the present invention, a connector terminal 1 is disclosed. The connector terminal 1 includes: a terminal body 10 and a plating member 11. The plating member 11 includes a substrate layer 110 and a plating layer 11a. The substrate layer 110 has a first surface and a second surface opposite to each other in a thickness direction thereof, and the first surface of the substrate layer 110 is attached to a portion of the terminal body 10. The plating layer 11a is formed on the second surface of the substrate layer 110 for electrical contact with a mating terminal (not shown).

[0081] like Figure 7 and Figure 8 As shown, in the illustrated embodiment, the conductive property of the electroplating layer 11 a of the electroplating member 11 is better than the conductive property of the base material layer 110 of the electroplating member 11 and the terminal body 10 .

[0082] like Figure 7 and Figure 8 As shown, in an exemplary embodiment of the present invention, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can be made of the same or different materials. For example, in order to reduce manufacturing costs, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can both be made of aluminum, and the electroplating layer 11a of the electroplating member 11 can be a copper plating layer, a silver plating layer or a gold plating layer.

[0083] like Figure 7 and Figure 8 As shown, in the illustrated embodiment, the base material layer 110 of the electroplating member 11 can be welded, riveted or pressed onto a portion of the terminal body 10. For example, the base material layer 110 of the electroplating member 11 can be welded onto a portion of the terminal body 10 by ultrasonic welding.

[0084] like Figure 7 and Figure 8 As shown, in the illustrated embodiment, the terminal body 10 is flat, including a pair of surfaces opposite to each other in the thickness direction thereof and two ends opposite to each other in the longitudinal direction thereof. The base material layer 110 of the electroplating part 11 is U-shaped, including a pair of flat plate portions 111 and a bent portion 112 connected between the pair of flat plate portions 111. The electroplating layer 11a is formed on the outer side surface of the base material layer 110 of the electroplating part 11. One end of the terminal body 10 is inserted into the electroplating part 11, the inner side surfaces of the pair of flat plate portions 111 of the electroplating part 11 are respectively attached to a pair of surfaces of the terminal body 10, and the inner side surface of the bent portion 112 of the electroplating part 11 is attached to one end surface of the terminal body 10.

[0085] Although not shown in the figure, in the illustrated embodiment, a recessed portion suitable for cooperating with the electroplating member 11 may be formed on the terminal body 10 , and the electroplating member 11 is embedded in the recessed portion of the terminal body 10 .

[0086] like Figure 7 and Figure 8 As shown, in another exemplary embodiment of the present invention, a connector is also disclosed. The connector comprises: a housing (not shown) and a connector terminal 1. The connector terminal 1 is arranged in the housing.

[0087] like Figure 7 and Figure 8 As shown, in another exemplary embodiment of the present invention, a method for manufacturing a connector terminal is also disclosed. The method mainly includes the following steps:

[0088] S100: manufacturing the terminal body 10 and the electroplating part 11 respectively; and

[0089] S200 : attaching the plating member 11 to a portion of the terminal body 10 .

[0090] like Figure 7 and Figure 8 As shown, in the illustrated embodiment, manufacturing the electroplated part 11 includes the following steps:

[0091] S110: providing a substrate plate;

[0092] S120: forming a plating layer 11a on one surface of the base plate; and

[0093] S130 : Punching the base plate on which the electroplating layer 11 a has been formed to obtain one or more electroplated parts 11 .

[0094] Fourth embodiment

[0095] Fig. 9 and Fig.10 A connector terminal according to a fourth embodiment of the present invention is shown. Fig. 9 A perspective schematic diagram showing a connector terminal according to a fourth embodiment of the present invention; Fig.10 An exploded schematic diagram showing a connector terminal according to a fourth embodiment of the present invention.

[0096] like Fig. 9 and Fig.10 As shown, in an exemplary embodiment of the present invention, a connector terminal 1 is disclosed. The connector terminal 1 includes: a terminal body 10 and a plating member 11. The plating member 11 includes a substrate layer 110 and a plating layer 11a. The substrate layer 110 has a first surface and a second surface opposite to each other in a thickness direction thereof, and the first surface of the substrate layer 110 is attached to a portion of the terminal body 10. The plating layer 11a is formed on the second surface of the substrate layer 110 for electrical contact with a mating terminal (not shown).

[0097] like Fig. 9 and Fig.10 As shown, in the illustrated embodiment, the conductive property of the electroplating layer 11 a of the electroplating member 11 is better than the conductive property of the base material layer 110 of the electroplating member 11 and the terminal body 10 .

[0098] like Fig. 9 and Fig.10As shown, in an exemplary embodiment of the present invention, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can be made of the same or different materials. For example, in order to reduce manufacturing costs, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can both be made of aluminum, and the electroplating layer 11a of the electroplating member 11 can be a copper plating layer, a silver plating layer or a gold plating layer.

[0099] like Fig. 9 and Fig.10 As shown, in the illustrated embodiment, the base material layer 110 of the electroplating member 11 can be welded, riveted or pressed onto a portion of the terminal body 10. For example, the base material layer 110 of the electroplating member 11 can be welded onto a portion of the terminal body 10 by ultrasonic welding.

[0100] like Fig. 9 and Fig.10 As shown, in the illustrated embodiment, the terminal body 10 is block-shaped and is formed with a slot 102 allowing a mating terminal (not shown) to be inserted, and the plating member 11 is sheet-shaped and attached to the inner side of the slot 102 of the terminal body 10 .

[0101] like Fig. 9 and Fig.10 As shown, in the illustrated embodiment, the connector terminal 1 includes two electroplating parts 11, which are respectively attached to the two inner sides of the slot 102 of the terminal body 10 to respectively make electrical contact with the two sides of the mating terminal (not shown) inserted into the slot 102.

[0102] Although not shown in the figure, in the illustrated embodiment, a recessed portion suitable for cooperating with the electroplating member 11 may be formed on the terminal body 10 , and the electroplating member 11 is embedded in the recessed portion of the terminal body 10 .

[0103] like Fig. 9 and Fig.10 As shown, in another exemplary embodiment of the present invention, a connector is also disclosed. The connector comprises: a housing (not shown) and a connector terminal 1. The connector terminal 1 is arranged in the housing.

[0104] like Fig. 9 and Fig.10 As shown, in another exemplary embodiment of the present invention, a method for manufacturing a connector terminal is also disclosed. The method mainly includes the following steps:

[0105] S100: manufacturing the terminal body 10 and the electroplating part 11 respectively; and

[0106] S200 : attaching the plating member 11 to a portion of the terminal body 10 .

[0107] like Fig. 9 and Fig.10As shown, in the illustrated embodiment, manufacturing the electroplated part 11 includes the following steps:

[0108] S110: providing a substrate plate;

[0109] S120: forming a plating layer 11a on one surface of the base plate; and

[0110] S130 : Punching the base plate on which the electroplating layer 11 a has been formed to obtain one or more electroplated parts 11 .

[0111] Fifth embodiment

[0112] Fig.11 and Fig.12 A connector terminal according to a fifth embodiment of the present invention is shown. Fig.11 A perspective schematic diagram showing a connector terminal according to a fifth embodiment of the present invention; Fig.12 An exploded schematic diagram showing a connector terminal according to a fifth embodiment of the present invention.

[0113] like Fig.11 and Fig.12 As shown, in an exemplary embodiment of the present invention, a connector terminal 1 is disclosed. The connector terminal 1 includes: a terminal body 10 and a plating member 11. The plating member 11 includes a substrate layer 110 and a plating layer 11a. The substrate layer 110 has a first surface and a second surface opposite to each other in a thickness direction thereof, and the first surface of the substrate layer 110 is attached to a portion of the terminal body 10. The plating layer 11a is formed on the second surface of the substrate layer 110 for electrical contact with a mating terminal (not shown).

[0114] like Fig.11 and Fig.12 As shown, in the illustrated embodiment, the conductive property of the electroplating layer 11 a of the electroplating member 11 is better than the conductive property of the base material layer 110 of the electroplating member 11 and the terminal body 10 .

[0115] like Fig.11 and Fig.12 As shown, in an exemplary embodiment of the present invention, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can be made of the same or different materials. For example, in order to reduce manufacturing costs, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can both be made of aluminum, and the electroplating layer 11a of the electroplating member 11 can be a copper plating layer, a silver plating layer or a gold plating layer.

[0116] like Fig.11 and Fig.12As shown, in the illustrated embodiment, the base material layer 110 of the electroplating member 11 can be welded, riveted or pressed onto a portion of the terminal body 10. For example, the base material layer 110 of the electroplating member 11 can be welded onto a portion of the terminal body 10 by ultrasonic welding.

[0117] like Fig.11 and Fig.12 As shown, in the illustrated embodiment, the terminal body 10 is flat, including a pair of surfaces opposite to each other in the thickness direction and two sides opposite to each other in the lateral direction. The base layer 110 of the electroplating part 11 is U-shaped, including a pair of flat plate portions 111 and a bent portion 112 connected between the pair of flat plate portions 111. The electroplating layer 11a is formed on the outer side of the base layer 110 of the electroplating part 11. The terminal body 10 is inserted into the electroplating part 11 in its lateral direction, and the inner side surfaces of the pair of flat plate portions 111 of the electroplating part 11 are respectively attached to a pair of surfaces of the terminal body 10, and the inner side surface of the bent portion 112 of the electroplating part 11 is attached to one side of the terminal body 10.

[0118] Although not shown in the figure, in the illustrated embodiment, a recessed portion suitable for cooperating with the electroplating member 11 may be formed on the terminal body 10 , and the electroplating member 11 is embedded in the recessed portion of the terminal body 10 .

[0119] like Fig.11 and Fig.12 As shown, in another exemplary embodiment of the present invention, a connector is also disclosed. The connector comprises: a housing (not shown) and a connector terminal 1. The connector terminal 1 is arranged in the housing.

[0120] like Fig.11 and Fig.12 As shown, in another exemplary embodiment of the present invention, a method for manufacturing a connector terminal is also disclosed. The method mainly includes the following steps:

[0121] S100: manufacturing the terminal body 10 and the electroplating part 11 respectively; and

[0122] S200 : attaching the plating member 11 to a portion of the terminal body 10 .

[0123] like Fig.11 and Fig.12 As shown, in the illustrated embodiment, manufacturing the electroplated part 11 includes the following steps:

[0124] S110: providing a substrate plate;

[0125] S120: forming a plating layer 11a on one surface of the base plate; and

[0126] S130 : Punching the base plate on which the electroplating layer 11 a has been formed to obtain one or more electroplated parts 11 .

[0127] Sixth embodiment

[0128] Fig.13 and Fig.14 A connector terminal according to a sixth embodiment of the present invention is shown. Fig.13 A perspective schematic diagram showing a connector terminal according to a sixth embodiment of the present invention; Fig.14 An exploded schematic diagram showing a connector terminal according to a sixth embodiment of the present invention.

[0129] like Fig.13 and Fig.14 As shown, in an exemplary embodiment of the present invention, a connector terminal 1 is disclosed. The connector terminal 1 includes: a terminal body 10 and a plating member 11. The plating member 11 includes a substrate layer 110 and a plating layer 11a. The substrate layer 110 has a first surface and a second surface opposite to each other in a thickness direction thereof, and the first surface of the substrate layer 110 is attached to a portion of the terminal body 10. The plating layer 11a is formed on the second surface of the substrate layer 110 for electrical contact with a mating terminal (not shown).

[0130] like Fig.13 and Fig.14 As shown, in the illustrated embodiment, the conductive property of the electroplating layer 11 a of the electroplating member 11 is better than the conductive property of the base material layer 110 of the electroplating member 11 and the terminal body 10 .

[0131] like Fig.13 and Fig.14 As shown, in an exemplary embodiment of the present invention, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can be made of the same or different materials. For example, in order to reduce manufacturing costs, the substrate layer 110 of the electroplating member 11 and the terminal body 10 can both be made of aluminum, and the electroplating layer 11a of the electroplating member 11 can be a copper plating layer, a silver plating layer or a gold plating layer.

[0132] like Fig.13 and Fig.14 As shown, in the illustrated embodiment, the base material layer 110 of the electroplating member 11 can be welded, riveted or pressed onto a portion of the terminal body 10. For example, the base material layer 110 of the electroplating member 11 can be welded onto a portion of the terminal body 10 by ultrasonic welding.

[0133] like Fig.13 and Fig.14 As shown, in the illustrated embodiment, the terminal body 10 is in the shape of a hollow cylinder, and the electroplating part 11 is in the shape of a circular ring and is inserted into the inner cavity 103 of the terminal body 10. The outer peripheral surface of the base material layer 110 of the electroplating part 11 is attached to the inner peripheral surface of the terminal body 10, and the electroplating layer 11a is formed on the inner peripheral surface of the base material layer 110 of the electroplating part 11.

[0134] Although not shown in the drawings, a recessed portion adapted to be matched with the plating member 11 may be formed on the inner circumferential surface of the terminal body 10 , and the plating member 11 is embedded in the recessed portion of the terminal body 10 .

[0135] like Fig.13 and Fig.14 As shown, in another exemplary embodiment of the present invention, a connector is also disclosed. The connector comprises: a housing (not shown) and a connector terminal 1. The connector terminal 1 is arranged in the housing.

[0136] like Fig.13 and Fig.14 As shown, in another exemplary embodiment of the present invention, a method for manufacturing a connector terminal is also disclosed. The method mainly includes the following steps:

[0137] S100: manufacturing the terminal body 10 and the electroplating part 11 respectively; and

[0138] S200 : attaching the plating member 11 to a portion of the terminal body 10 .

[0139] like Fig.13 and Fig.14 As shown, in the illustrated embodiment, manufacturing the electroplated part 11 includes the following steps:

[0140] S110: providing a substrate plate;

[0141] S120: forming a plating layer 11a on one surface of the base plate; and

[0142] S130 : Punching the base plate on which the electroplating layer 11 a has been formed to obtain one or more electroplated parts 11 .

[0143] Those skilled in the art will appreciate that the embodiments described above are exemplary and may be improved upon by those skilled in the art. The structures described in the various embodiments may be freely combined without causing any conflicts in structure or principle, and these changes should fall within the scope of protection of the present invention.

[0144] Although the present invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the accompanying drawings are intended to exemplify the preferred implementations of the present invention and should not be construed as limiting the present invention.

[0145] Although some embodiments of the general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined by the claims and their equivalents.

[0146] It should be noted that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. In addition, any element reference signs in the claims shall not be construed as limiting the scope of the present invention.

Claims

1. A connector terminal, characterized in that: include: Terminal body(10); and Electroplating parts (11), including: A base material layer (110) having a first surface and a second surface opposite to each other in a thickness direction thereof, wherein the first surface of the base material layer (110) is attached to a portion of the terminal body (10); and The electroplating layer (11a) is formed on the second surface of the substrate layer (110) and is used for electrically contacting the mating terminal (2).

2. The connector terminal according to claim 1, characterized in that: The base material layer (110) of the electroplated part (11) is welded, riveted or crimped onto a portion of the terminal body (10).

3. The connector terminal according to claim 1, characterized in that: The terminal body (10) is flat and has a pair of surfaces facing each other in the thickness direction thereof, and the plating member (11) is sheet-shaped and attached to the surface of the terminal body (10).

4. The connector terminal according to claim 1, characterized in that: The terminal body (10) is cylindrical, and the electroplating piece (11) is hollow cylindrical and is sleeved on the terminal body (10); The inner peripheral surface of the base material layer (110) of the electroplating member (11) is attached to the outer peripheral surface of the terminal body (10), and the electroplating layer (11a) is formed on the outer peripheral surface of the base material layer (110) of the electroplating member (11).

5. The connector terminal according to claim 1, characterized in that: The terminal body (10) is in the shape of a hollow cylinder, and the electroplating piece (11) is in the shape of a circular ring and is inserted into the inner cavity (103) of the terminal body (10); The outer peripheral surface of the base material layer (110) of the electroplating member (11) is attached to the inner peripheral surface of the terminal body (10), and the electroplating layer (11a) is formed on the inner peripheral surface of the base material layer (110) of the electroplating member (11).

6. The connector terminal according to claim 1, characterized in that: The terminal body (10) is flat and comprises a pair of surfaces opposite to each other in its thickness direction and two ends opposite to each other in its longitudinal direction; The base material layer (110) of the electroplated part (11) is U-shaped, comprising a pair of flat plate portions (111) and a bent portion (112) connected between the pair of flat plate portions (111); the electroplated layer (11a) is formed on the outer side of the base material layer (110) of the electroplated part (11); One end of the terminal body (10) is inserted into the electroplating part (11), the inner side surfaces of a pair of flat plate parts (111) of the electroplating part (11) are respectively attached to a pair of surfaces of the terminal body (10), and the inner side surface of the bent part (112) of the electroplating part (11) is attached to one end face of the terminal body (10).

7. The connector terminal according to claim 1, characterized in that: The terminal body (10) is flat and comprises a pair of surfaces opposite to each other in its thickness direction and two sides opposite to each other in its transverse direction; The base material layer (110) of the electroplated part (11) is U-shaped, comprising a pair of flat plate portions (111) and a bent portion (112) connected between the pair of flat plate portions (111); the electroplated layer (11a) is formed on the outer side of the base material layer (110) of the electroplated part (11); The terminal body (10) is inserted into the electroplating part (11) along its lateral direction, the inner side surfaces of a pair of flat plate parts (111) of the electroplating part (11) are respectively attached to a pair of surfaces of the terminal body (10), and the inner side surface of the bent part (112) of the electroplating part (11) is attached to one side surface of the terminal body (10).

8. The connector terminal according to claim 1, characterized in that: The terminal body (10) is block-shaped and is formed with a slot (102) for allowing a mating terminal to be inserted, and the electroplating piece (11) is sheet-shaped and is attached to the inner side of the slot (102) of the terminal body (10).

9. The connector terminal according to claim 8, characterized in that: The connector terminal (1) comprises two electroplating parts (11), which are respectively attached to the two inner side surfaces of the slot (102) of the terminal body (10) so as to be electrically contacted with the two sides of the mating terminal inserted into the slot (102).

10. The connector terminal according to any one of claims 1 to 9, characterized in that: A recessed portion (101) suitable for cooperating with the electroplating component (11) is formed on the terminal body (10), and the electroplating component (11) is embedded in the recessed portion (101) of the terminal body (10).

11. A connector, characterized in that: include: case; and The connector terminal (1) according to any one of claims 1 to 10 is arranged in the housing.

12. A method for manufacturing a connector terminal, characterized in that: The following steps are involved: S100: manufacturing a terminal body (10) and a plated part (11) respectively; and S200: Attaching the electroplating member (11) to a portion of the terminal body (10).

13. The method for manufacturing a connector terminal according to claim 12, characterized in that: The manufacturing of the electroplated part (11) comprises the following steps: S110: providing a substrate plate; S120: forming an electroplating layer (11a) on one surface of the substrate plate; and S130: Punching the substrate plate on which the electroplating layer (11a) has been formed to obtain one or more electroplated parts (11).

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