Semiconductor processing equipment and multi-zone heating plate and multi-zone temperature control driving method thereof

Abstract

According to the semiconductor processing equipment and the multi-zone heating plate and the multi-zone temperature control driving method thereof, current limiting elements are arranged to be communicated with heating pieces located in different heating zones in the multi-zone heating plate of the semiconductor processing equipment, and each heating piece is subjected to active heating operation and passive heating operation; active heating power is applied once and passive heating power is applied at least once on each heating sheet, and the proportion of the active heating power and the proportion of the passive heating power on the heating sheets are controlled; the sum of the active heating power applied to the same heating sheet and all the passive heating power is equal to the preset heating power of the heating sheet, finally independent temperature control over each heating sheet is achieved, the maximum instantaneous heating current is greatly reduced, the instantaneous heating power and current of each heating sheet are reduced, and the heating efficiency is improved. The heating sheet is not easy to crack due to frequent and rapid heating and cooling, and the power and the current level of a corresponding switch are also reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a semiconductor processing device and a multi-zone heating plate and a multi-zone temperature control driving method thereof. Background Art

[0002] Multi-zone temperature control technology is widely used in various technical fields, such as chemical, biological, pharmaceutical and integrated circuit fields. Especially in the field of integrated circuit manufacturing, as the critical dimensions of semiconductor workpieces, such as substrate processing, continue to decrease, and the size of substrates continues to increase, the temperature control accuracy and regional control requirements in the substrate processing process are getting higher and higher.

[0003] In a plasma reaction chamber filled with radio frequency radiation, a large number of (more than 100) heating plates buried in an insulating heating plate need to be independently temperature controlled, and the least control drive line needs to be used to drive the largest number of heating plates to reduce the volume and power loss of the filter below. The most common way is to arrange the heating plates in a matrix, with each row and column of heating plates connected to a drive switch or a power output terminal, so that m×n heating plates can be independently driven with m drive lines and n ground lines. However, there is a problem with this structure. When the number m is large (such as greater than 12), after the current drive line drives the heating plate in the current row to heat, it is necessary to wait for the heating plates in 11 other rows to be heated in sequence before the heating plate in the current row can be heated again. This pulsed heating power requires that each drive switch (MOSFET or diode) through which the heating current flows can withstand extremely high instantaneous current or voltage and withstand high temperature. Semiconductor devices that can meet such stringent requirements are either large in size or not resistant to high temperatures, so it is difficult to find a suitable drive switch, and even if there is one, a corresponding heat dissipation system needs to be specially designed.

[0004] In summary, in order to independently drive more heaters with fewer drive lines, it is necessary to time-share multiplex the drive lines, which will cause most drive switches to work in pulse mode. Switches that need to withstand extremely instantaneous high voltage and current are suitable for plasma processors, which are difficult to manufacture and costly. The demand for drive switches can only be reduced by adding additional drive control lines, but this will increase the design requirements of the filter, and the two cannot be improved at the same time.

[0005] The statements herein merely provide background art related to the present invention and do not necessarily constitute prior art. Summary of the invention

[0006] The object of the present invention is to provide a semiconductor processing device and a multi-zone heating plate and a multi-zone temperature control driving method thereof. When the heating plate in the heating plate is independently temperature controlled, the maximum instantaneous heating current can be greatly reduced, and the instantaneous heating power and current of each heating plate can be reduced. The heating plate is not prone to material cracking due to frequent and rapid heating and cooling, and the power and current level of the corresponding switch are also reduced.

[0007] In order to achieve the above-mentioned object, the present invention provides a multi-zone heating plate, comprising: a substrate made of an insulating material, wherein the substrate comprises a plurality of heating zones and a plurality of current limiting elements;

[0008] Each of the heating zones comprises a plurality of heating plates, and the heating plates are used to heat different areas of the substrate;

[0009] The first ends of all the heating plates in each heating zone are connected to the same ground line, the second ends of each heating plate in each heating zone are connected to different power lines, and the heating plates connected to each power line are located in different heating zones;

[0010] Each current limiting element is connected between the two grounding wires or the two power lines, and a plurality of current limiting elements are connected in series to form a closed loop;

[0011] When the current limiting element is connected between two grounding wires, the current limiting element allows a first current to flow through a plurality of heating plates in a first heating zone, and a second current to flow through a plurality of heating plates in a second heating zone adjacent to the first heating zone, wherein the second current is smaller than the first current;

[0012] When the current limiting element is connected between two power lines, the current limiting element allows a first current to flow through multiple heating plates connected to the first power line, while a second current flows through multiple heating plates connected to a second power line adjacent to the first power line, wherein the second current is smaller than the first current.

[0013] Optionally, the current limiting element includes: a current limiting resistor.

[0014] Optionally, the current limiting element includes: a current limiting resistor and a unidirectional conductive element, the current limiting resistor is connected in series with the unidirectional conductive element, and the unidirectional conductive element causes the current direction in the closed loop to be in a clockwise direction or a counterclockwise direction.

[0015] The resistance value of the current-limiting resistor is greater than or equal to one eighth of the resistance value of the heating plate, and the resistance value of the current-limiting resistor is less than or equal to one half of the resistance value of the heating plate.

[0016] Optionally, the ground line is led out to the outside of the substrate through a first port arranged at the bottom of the substrate, and the power line is led out to the outside of the substrate through a second port arranged at the bottom of the substrate;

[0017] When the current limiting element is connected between two grounding wires, the current limiting resistor is arranged at the first port;

[0018] When the current limiting element is connected between two power lines, the current limiting resistor is arranged at the second port.

[0019] Optionally, the current limiting resistor is a heating resistance wire, and the heating resistance wire is evenly coiled in the substrate.

[0020] The heating zone includes a first sub-heating zone and a second sub-heating zone, the first ends of all heating plates in the first sub-heating zone are connected to the ground line through a first unidirectional conductive element, the first ends of all heating plates in the second sub-heating zone are connected to the ground line through a second unidirectional conductive element, and the connection directions of the first unidirectional conductive element and the second unidirectional conductive element are opposite.

[0021] The present invention also provides a semiconductor processing device, comprising:

[0022] Reaction chamber;

[0023] A base disposed in the reaction chamber, wherein the base has a cooling liquid channel and a plurality of through holes extending vertically therethrough;

[0024] The multi-zone heating plate is arranged on the base, and the power line and the ground line led out from the multi-zone heating plate pass through the through hole on the base;

[0025] An electrostatic chuck disposed on the multi-zone heating plate for carrying a substrate;

[0026] A driving device is arranged under the base, and the driving device includes a driving power supply, a ground terminal, multiple power switches and multiple ground switches, one end of each power switch is connected to a power line passing through the base, and the other end is connected to the driving power supply, one end of each ground switch is connected to a ground line passing through the base, and the other end is connected to the ground terminal.

[0027] Each of the heating zones in the multi-zone heating plate comprises a first sub-heating zone and a second sub-heating zone, the first ends of all the heating plates in the first sub-heating zone are connected to the ground line via a first unidirectional conductive element, the first ends of all the heating plates in the second sub-heating zone are connected to the ground line via a second unidirectional conductive element, and the connection directions of the first unidirectional conductive element and the second unidirectional conductive element are opposite;

[0028] The driving power supply adopts a pulse heating power supply, and the heating voltage output by the pulse heating power supply varies between a positive heating voltage and a negative heating voltage. The heating voltage is applied to each heating plate in the first sub-heating zone and the second sub-heating zone through the power switch and the power line.

[0029] The semiconductor processing equipment further comprises: a controller for controlling the plurality of power switches and the plurality of ground switches to perform on-off operations;

[0030] The controller controls the plurality of grounding switches to be opened in sequence;

[0031] The controller controls the plurality of power switches to operate in a pulse width modulation mode and adjusts a turn-on duty cycle of each power switch.

[0032] The present invention also provides a multi-zone temperature control driving method for adjusting the temperature of the multi-zone heating plate in the semiconductor processing equipment, the multi-zone temperature control driving method comprising:

[0033] When the current limiting element is connected between two grounding wires, the controller controls multiple grounding switches to be opened in sequence: the heating zone directly connected to the currently opened grounding switch is used as the active heating zone, and the heating plate in the active heating zone is applied with active heating power; the heating zone connected to the currently opened grounding switch through the current limiting element is used as the passive heating zone, and the heating plate in the passive heating zone is applied with passive heating power; in the process of opening the grounding switches in sequence, each of the heating zones is used as an active heating zone and at least one passive heating zone, and each heating plate is applied with active heating power once and passive heating power at least once;

[0034] The controller controls multiple power switches to operate in pulse width modulation mode. The controller adjusts the ratio of active heating power and passive heating power applied to the heating plate connected to the power switch by adjusting the on-duty cycle of each power switch, so that the sum of the active heating power and all passive heating powers applied to the same heating plate is equal to the predetermined heating power of the heating plate.

[0035] The passive heating zone includes multiple passive heating zones: a heating zone connected to the currently turned-on grounding switch through a current limiting element is used as a first-stage passive heating zone, and a first-stage passive heating power is applied to the heating plate in the first-stage passive heating zone; a heating zone connected to the currently turned-on grounding switch through two current limiting elements is used as a second-stage passive heating zone, and a second-stage passive heating power is applied to the heating plate in the second-stage passive heating zone;

[0036] Due to the voltage dividing effect of the current limiting element, the active heating power is greater than the passive heating power, and the upper level passive heating power is greater than the lower level passive heating power.

[0037] The present invention also provides a multi-zone temperature control driving method for adjusting the temperature of the multi-zone heating plate in the semiconductor processing equipment, the multi-zone temperature control driving method comprising:

[0038] When the current limiting element is connected between two power lines, the controller controls multiple grounding switches to be turned on simultaneously, and the controller controls multiple power switches to be turned on in sequence: multiple heating plates directly connected to the currently turned-on power switch are used as active heating plates, and active heating power is applied to the active heating plates; multiple heating plates connected to the currently turned-on power switch through the current limiting element are used as passive heating plates, and passive heating power is applied to the passive heating plates; in the process of turning on the power switches in sequence, each of the heating plates is used as an active heating plate once and a passive heating plate at least once, and each heating plate is applied with active heating power once and passive heating power at least once;

[0039] The controller controls multiple power switches to operate in pulse width modulation mode. The controller adjusts the ratio of active heating power and passive heating power applied to the heating plate connected to the power switch by adjusting the on-duty cycle of each power switch, so that the sum of the active heating power and all passive heating powers applied to the same heating plate is equal to the predetermined heating power of the heating plate.

[0040] The passive heating sheet comprises a plurality of passive heating sheets: a heating sheet connected to a currently turned-on power switch via a current limiting element is used as a first-stage passive heating sheet, and a first-stage passive heating power is applied to the first passive heating sheet; a heating sheet connected to a currently turned-on power switch via two current limiting elements is used as a second-stage passive heating sheet, and a second-stage passive heating power is applied to the second passive heating sheet;

[0041] Due to the voltage dividing effect of the current limiting element, the active heating power is greater than the passive heating power, and the upper level passive heating power is greater than the lower level passive heating power.

[0042] The present invention connects the heating plates in different heating zones by setting a current limiting element. Each heating plate will undergo active heating operation and passive heating operation. Each heating plate will be applied with active heating power once and passive heating power at least once. By controlling the ratio of active heating power and passive heating power on the heating plate, the sum of active heating power and all passive heating powers applied to the same heating plate is equal to the predetermined heating power of the heating plate, and finally the independent temperature control of each heating plate is realized. The heating plate is gradually heated multiple times by active heating operation and passive heating operation, which can greatly reduce the maximum instantaneous heating current, reduce the instantaneous heating power and current of each heating plate, and the heating plate is not easy to cause material cracking due to frequent and rapid heating and cooling, and also reduce the power and current level of the corresponding switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a structural schematic diagram of a semiconductor processing device provided by the present invention.

[0044] Figure 2 is a schematic diagram of a multi-zone heating plate in one embodiment of the present invention.

[0045] Figure 3 yes Figure 2 The connection diagram of the current limiting element using a current limiting resistor.

[0046] Figure 4 It is a schematic diagram of the connection between the current limiting element, the heating zone and the grounding switch.

[0047] Figure 5 It is a connection diagram of a current limiting element using a current limiting resistor and a unidirectional conductive element in another embodiment of the present invention.

[0048] Figure 6 Yes Figure 5 Schematic diagram of multi-zone temperature control drive of a multi-zone heating plate.

[0049] Figure 7 yes Figure 6 Heating zone power distribution diagram.

[0050] Figure 8 It is a schematic diagram of a pulse heating power supply driving a multi-zone heating plate in other embodiments of the present invention.

[0051] Fig. 9 is a schematic diagram of a multi-zone heating plate in another embodiment of the present invention. DETAILED DESCRIPTION

[0052] The following is based on Figures 1 to 9 , specifically describe the preferred embodiments of the present invention.

[0053] The present invention provides a semiconductor processing device, such as Figure 1 As shown, it comprises a reaction chamber 1, wherein a pedestal 2 is arranged in the reaction chamber 1, a multi-zone heating plate 3 is arranged on the pedestal 2, an electrostatic chuck 4 is arranged on the multi-zone heating plate 3, and a substrate W is carried on the electrostatic chuck 4. A cooling liquid channel 21 and a plurality of through holes 22 extending from top to bottom are arranged in the pedestal 2. The multi-zone heating plate 3 comprises a substrate 31 made of insulating material, a plurality of heating plates 32 are arranged in the substrate 31, and the heating plates 32 are used to heat different areas of the substrate 31, one end of each heating plate 32 is connected to a power line 33, and the other end is connected to a ground line 34, the ground line 34 is led out to the outside of the substrate 31 through a first port 311 arranged at the bottom of the substrate 31, the power line 33 is led out to the outside of the substrate 31 through a second port 312 arranged at the bottom of the substrate 31, and the power line 33 and the ground line 34 led out from the multi-zone heating plate 3 pass through the through hole 22 on the pedestal 2. A driving device 5 is provided outside the reaction chamber 1, and the driving device 5 includes a driving power supply 51, a ground terminal 52, a plurality of power switches 53, and a plurality of ground switches 54. One end of each of the power switches 53 is connected to a power line 33 passing through the base 31, and the other end is connected to the driving power supply 51. One end of each of the ground switches 54 is connected to a ground line 34 passing through the base 31, and the other end is connected to the ground terminal 52. The semiconductor processing equipment further includes a controller 6, and the controller 6 is used to control the plurality of power switches 53 and the plurality of ground switches 54.

[0054] like Figure 2 As shown, in one embodiment of the present invention, the substrate 31 of the multi-zone heating plate 3 includes multiple heating zones, each of which includes multiple heating plates 32, the first ends of all the heating plates 32 in each heating zone are connected to the same ground wire 34, the second ends of each heating plate 32 in each heating zone are connected to different power lines 33, and the heating plates 32 connected to each power line 33 are located in different heating zones. Figure 2In the multi-zone heating plate 3, 16 heating plates 32 are arranged in a 4×4 matrix. The first column of heating plates R11-R41 constitutes the first heating zone S1, the first ends of the first column of heating plates R11-R41 are connected to the first ground line 34-1, and are grounded through the first ground switch G1, the second end of the heating plate R11 is connected to the first power line 33-1, and is connected to the driving power supply 51 through the first power switch K1, the second end of the heating plate R12 is connected to the second power line 33-2, and is connected to the driving power supply 51 through the second power switch K2, the second end of the heating plate R13 is connected to the third power line 33-3, and is connected to the driving power supply 51 through the third power switch K3, and the second end of the heating plate R14 is connected to the fourth power line 33-4, and is connected to the driving power supply 51 through the fourth power switch K4. Similarly, the second column of heating plates R12-R42 constitutes the second heating zone S2, the first ends of the second column of heating plates R12-R42 are all connected to the second grounding line 34-2, and are grounded through the second grounding switch G2, and the second ends of the second column of heating plates R12-R42 are respectively connected to different power lines. The third column of heating plates R13-R43 constitutes the third heating zone S3, the first ends of the third column of heating plates R13-R43 are all connected to the third grounding line 34-3, and are grounded through the third grounding switch G3, and the second ends of the third column of heating plates R13-R43 are respectively connected to different power lines. The fourth column of heating plates R14-R44 constitutes the fourth heating zone S4, the first ends of the fourth column of heating plates R14-R44 are all connected to the fourth grounding line 34-4, and are grounded through the fourth grounding switch G4, and the second ends of the fourth column of heating plates R14-R44 are respectively connected to different power lines.

[0055] In this embodiment, a current limiting element E is connected between the two grounding wires, and the number of the current limiting elements E is consistent with the number of the grounding wires. Figure 2 As shown, a first current limiting element E1 is connected in series between the first grounding wire 34-1 and the second grounding wire 34-2, a second current limiting element E2 is connected in series between the second grounding wire 34-2 and the third grounding wire 34-3, a third current limiting element E3 is connected in series between the third grounding wire 34-3 and the fourth grounding wire 34-4, and a fourth current limiting element E4 is connected in series between the fourth grounding wire 34-4 and the first grounding wire 34-1. The first current limiting element E1, the second current limiting element E2, the third current limiting element E3 and the fourth current limiting element E4 are connected in series to form a closed loop.

[0056] The current limiting element E is usually a current limiting resistor R, such as Figure 3As shown, the first current limiting resistor R1 is connected in series between the first grounding wire 34-1 and the second grounding wire 34-2, the second current limiting resistor R2 is connected in series between the second grounding wire 34-2 and the third grounding wire 34-3, the third current limiting resistor R3 is connected in series between the third grounding wire 34-3 and the fourth grounding wire 34-4, and the fourth current limiting resistor R4 is connected in series between the fourth grounding wire 34-4 and the first grounding wire 34-1.

[0057] like Figure 2 and Figure 3As shown, the controller 6 controls the first grounding switch G1, the second grounding switch G2, the third grounding switch G3 and the fourth grounding switch G4 in the grounding switch G to be turned on in sequence, and controls the first power switch K1, the second power switch K2, the third power switch K3 and the fourth power switch K4 in the power switch K to work in pulse width modulation mode. When the first grounding switch G1 is turned on, the remaining grounding switches are turned off. At this time, the first current flows through the heating plates R11-R41 in the first heating zone S1, and active heating power is generated on each heating plate R11-R41 in the first heating zone S1. The first heating zone S1 is an active heating zone. At the same time, the heating plates R12-R42 in the second heating zone S2 are connected to the first grounding switch G1 through the first current limiting resistor R1, and the second current flows through the heating plates R12-R42 in the second heating zone S2. Due to the shunting effect of the first current limiting resistor R1, the second current is smaller than the first current. Similarly, the heating plates R14-R44 in the fourth heating zone S4 are connected to the first grounding switch G1 through the fourth current limiting resistor R4, and a third current flows through the heating plates R14-R44 in the fourth heating zone S4. Due to the shunting effect of the fourth current limiting resistor R4, the third current is less than the first current. Further, the heating plates R13-R43 in the third heating zone S3 are connected to the first grounding switch G1 through the first current limiting resistor R1 and the second current limiting resistor R2. At the same time, the heating plates R13-R43 in the third heating zone S3 are also connected to the first grounding switch G1 through the fourth current limiting resistor R4 and the third current limiting resistor R3. A fourth current flows through the heating plates R13-R43 in the third heating zone S3. Due to the shunting effect of the first current limiting resistor R1 and the second current limiting resistor R2 (the fourth current limiting resistor R4 and the third current limiting resistor R3), the fourth current is less than the first current, and the fourth current is less than the second current, and the fourth current is less than the third current. Because the heating plates R12~R42 in the second heating zone S2, the heating plates R13~R43 in the third heating zone S3, and the heating plates R14~R44 in the fourth heating zone S4 are passively opened, passive heating power is generated on these heating plates (R12~R42, R13~R43 and R14~R44), and the second heating zone S2, the third heating zone S3 and the fourth heating zone S4 are passive heating zones, which can play a role of preheating.

[0058] The resistance value of the current limiting resistor R needs to be reasonably set. The resistance value of the current limiting resistor R cannot be too large, so as to avoid the current value applied to the heating plate in the passive heating zone being too small to be ignored and not achieving the preheating effect. The resistance value of the current limiting resistor R cannot be too small, so as to avoid the current value applied to the heating plate in the passive heating zone being equal to the current value applied to the heating plate in the active heating zone, thereby losing the control effect of turning on the grounding switches in sequence. Preferably, the resistance value of the current limiting resistor R can be greater than or equal to one eighth of the resistance value of the heating plate 32, and the resistance value of the current limiting resistor R can be less than or equal to one half of the resistance value of the heating plate 32.

[0059] In this embodiment, by setting a current limiting resistor between the grounding switches, when any grounding switch (serial number is x) is turned on, in addition to the heating plate in the xth heating zone directly connected to the xth grounding switch being connected to the driving power supply 51 to generate active heating power, the heating plates in the heating zones connected to the adjacent grounding switches (x-1, x+1) can also be connected to the currently turned on xth grounding switch through the current limiting resistor, thereby being connected to the driving power supply 51 to generate passive heating power. However, the heating power of these passively turned on heating plates is relatively small, usually only about 30% of the active heating power generated by the heating plate in the xth heating zone directly connected to the xth grounding switch, so they can be used for preheating purposes. In the process of cyclically opening each grounding switch, in addition to the active heating power P1 generated on each heating plate in the xth heating zone directly connected to it when the x-1th grounding switch (or the x+1th grounding switch) is opened, the passive heating power generated by the heating plate in the xth heating zone directly connected to the xth grounding switch will also affect the temperature of each heating plate in the xth heating zone. Therefore, the entire heating process has changed from only one high-power heating step to a passive preheating step and an active heating step that are carried out successively. Since the heating time has been extended, the maximum instantaneous heating current can be greatly reduced while the required total heating energy remains unchanged. For example, the preheating step generates 40% of the required heating power, and the active heating step generates 100%. The final maximum power can be reduced to 1 / 1.4=71% of the original value, and correspondingly, the current can be reduced to 84% of the original value. By changing the resistance value of the current limiting resistor, the ratio of the heating power in the preheating step to the heating power in the active heating step can be further increased to 0.6:1, and the maximum power in the active heating step is reduced to 65% of the original, and the corresponding maximum current flowing through each heating plate is 80% of the original value.

[0060] like Figure 1As shown, in one embodiment, the current limiting resistor R is arranged at the first port 311. The grounding wire 34 is led out to the outside of the substrate 31 through the first port 311 arranged at the bottom of the substrate 31, and then continues to pass through the through hole 22 on the base 2 to connect with the grounding switch 54. Since the temperature of the base 2 is lower than the temperature of the multi-zone heating plate 3, the position of the first port 311 will become a cold spot where the base 2 absorbs heat downward from the multi-zone heating plate 3. The current limiting resistor R is arranged at the first port 311, and the heating power generated by the current limiting resistor R can just offset the heat loss caused by heat absorption.

[0061] In other embodiments, the current limiting resistor R can also be a heating resistance wire, so that the heating resistance wire can be evenly coiled in the substrate 31, so that the heating power is evenly distributed in each heating zone in the entire multi-zone heating plate 3, to assist in completing the preheating task.

[0062] like Figure 2 As shown, in this embodiment, a multi-zone temperature control driving method using the multi-zone heating plate is provided, comprising:

[0063] The controller 6 controls the multiple grounding switches G to be opened in sequence: the heating zone directly connected to the currently opened grounding switch G is used as the active heating zone, and the heating plate 32 in the active heating zone is applied with active heating power; the heating zone connected to the currently opened grounding switch G through the current limiting element E is used as the passive heating zone, and the heating plate 32 in the passive heating zone is applied with passive heating power; in the process of opening the grounding switches G in sequence, each of the heating zones is used as an active heating zone and at least one passive heating zone, and each heating plate 32 is applied with active heating power once and passive heating power at least once;

[0064] The controller 6 controls multiple power switches K to operate in a pulse width modulation mode. The controller 6 adjusts the ratio of active heating power and passive heating power applied to the heating plate 32 connected to the power switch K by adjusting the on-duty cycle of each power switch K, so that the sum of the active heating power and all passive heating powers applied to the same heating plate 32 is equal to the predetermined heating power of the heating plate.

[0065] The passive heating zone includes multiple passive heating zones: a heating zone connected to the currently turned-on grounding switch G through a current limiting element E is used as a first-stage passive heating zone, and the heating plate 32 in the first-stage passive heating zone is applied with a first-stage passive heating power; a heating zone connected to the currently turned-on grounding switch G through two current limiting elements E is used as a second-stage passive heating zone, and the heating plate 32 in the second-stage passive heating zone is applied with a second-stage passive heating power;

[0066] Due to the voltage-dividing effect of the current-limiting element E, the active heating power is greater than the passive heating power, and the upper-level passive heating power is greater than the lower-level passive heating power.

[0067] The ratio between each level of passive heating power and active heating power is used as the heating coefficient of each level of passive heating zone, and the controller 6 calculates each level of passive heating power according to the heating coefficient.

[0068] like Figure 4 As shown, the multi-zone heating plate 3 includes n heating zones and n current limiting resistors, where n is a natural number. When any grounding switch is turned on, any heating zone connected to the currently turned on grounding switch through the current limiting resistor is used as a passive heating zone.

[0069] The multi-zone temperature control driving method specifically comprises the following steps:

[0070] The controller controls the first grounding switch G1 to be closed, and controls other grounding switches to be opened: the first heating zone S1 connected to the first grounding switch G1 through the first grounding line 34-1 is used as an active heating zone, and the heating plate in the active heating zone S1 is applied with active heating power; the second heating zone S2 connected to the first grounding switch G1 through the current limiting resistor R1 is used as a first-level passive heating zone, and the nth heating zone Sn connected to the first grounding switch G1 through the current limiting resistor Rn is used as a first-level passive heating zone, and the heating plate in the first-level passive heating zone is applied with first-level passive heating power; the third heating zone S3 connected to the first grounding switch G1 through the current limiting resistor R1 and the current limiting resistor R2 in sequence is used as a second-level passive heating zone, and the n-1th heating zone Sn-1 connected to the first grounding switch G1 through the current limiting resistor Rn and the current limiting resistor Rn-1 in sequence is used as a second-level passive heating zone, and the heating plate in the second-level passive heating zone is applied with second-level passive heating power; and so on;

[0071] The controller controls the second grounding switch G2 to be closed, and controls other grounding switches to be opened: the second heating zone S2 connected to the second grounding switch G2 through the second grounding line 34-2 is used as an active heating zone, and the heating plate in the active heating zone S2 is applied with active heating power; the third heating zone S3 connected to the second grounding switch G2 through the current limiting resistor R2 is used as a first-level passive heating zone, and the first heating zone S1 connected to the second grounding switch G2 through the current limiting resistor R1 is used as a first-level passive heating zone, and the heating plate in the first-level passive heating zone is applied with first-level passive heating power; the fourth heating zone S4 connected to the second grounding switch G2 through the current limiting resistor R2 and the current limiting resistor R3 in sequence is used as a second-level passive heating zone, and the nth heating zone Sn connected to the second grounding switch G2 through the current limiting resistor Rn and the current limiting resistor R1 in sequence is used as a second-level passive heating zone, and the heating plate in the second-level passive heating zone is applied with second-level passive heating power; and so on;

[0072] The controller controls the third grounding switch G3 to be closed, and controls other grounding switches to be opened: the third heating zone S3 connected to the third grounding switch G3 through the third grounding line 34-3 is used as an active heating zone, and the heating plate in the active heating zone S3 is applied with active heating power; the fourth heating zone S4 connected to the third grounding switch G3 through the current limiting resistor R3 is used as a first-level passive heating zone, and the second heating zone S2 connected to the third grounding switch G3 through the current limiting resistor R2 is used as a first-level passive heating zone, and the heating plate in the first-level passive heating zone is applied with first-level passive heating power; the fifth heating zone S5 connected to the third grounding switch G3 through the current limiting resistor R3 and the current limiting resistor R4 in sequence is used as a second-level passive heating zone, and the first heating zone S1 connected to the third grounding switch G3 through the current limiting resistor R2 and the current limiting resistor R1 in sequence is used as a second-level passive heating zone, and the heating plate in the second-level passive heating zone is applied with second-level passive heating power; and so on;

[0073] The active heating power is greater than the first-level passive heating power, the first-level passive heating power is greater than the second-level passive heating power, and so on.

[0074] The controller adjusts the ratio of active heating power and passive heating power of the heating plate connected to the power switch by adjusting the switching duty cycle of the power switch, so that the sum of the active heating power applied to the heating plate and the multi-stage passive heating power applied to the heating plate is equal to the predetermined heating power of the heating plate.

[0075] The present invention connects the heating plates in different heating zones by setting a current limiting element. Each heating plate will undergo active heating operation and passive heating operation. Each heating plate will be applied with active heating power once and passive heating power at least once. By controlling the ratio of active heating power and passive heating power on the heating plate, the sum of active heating power and all passive heating powers applied to the same heating plate is equal to the predetermined heating power of the heating plate, and finally the independent temperature control of each heating plate is realized. The heating plate is gradually heated multiple times by active heating operation and passive heating operation, which can greatly reduce the maximum instantaneous heating current, reduce the instantaneous heating power and current of each heating plate, and the heating plate is not easy to cause material cracking due to frequent and rapid heating and cooling, and also reduce the power and current level of the corresponding switch.

[0076] In another embodiment of the present invention, Figure 5 As shown, in Figure 4 On the basis of, the current limiting element also includes a unidirectional conductive element, the unidirectional conductive element adopts a diode, the current limiting resistor is connected in series with the diode, and the diode makes the current direction in the closed loop along the clockwise direction or the counterclockwise direction. When any grounding switch is turned on, only the heating zone located downstream of the current direction in the closed loop and connected to the currently turned on grounding switch through the current limiting resistor and the diode is used as a passive heating zone, that is, only the heating zone downstream in the clockwise direction or the counterclockwise direction will be turned on as a passive heating zone, and the upstream heating zone will not be turned on due to the obstruction of the diode and cannot become a passive heating zone. Using a unidirectional conductive element to control the current direction in the closed loop can reduce the number of passive heating zones, facilitate the calculation of the passive heating power of the heating plate, and reduce the control difficulty of the temperature control drive.

[0077] The controller controls the first grounding switch G1 to close and controls other grounding switches to open: the first heating zone S1 connected to the first grounding switch G1 through the first grounding line 34-1 is used as an active heating zone, and the heating plate in the active heating zone S1 is applied with active heating power; the second heating zone S2 connected to the first grounding switch G1 through the current limiting resistor R1 is used as a first-level passive heating zone, and the heating plate in the first-level passive heating zone is applied with first-level passive heating power; the third heating zone S3 connected to the first grounding switch G1 through the current limiting resistor R1 and the current limiting resistor R2 in sequence is used as a second-level passive heating zone, and the heating plate in the second-level passive heating zone is applied with second-level passive heating power; and so on.

[0078] The controller controls the second grounding switch G2 to close and controls other grounding switches to open: the second heating zone S2 connected to the second grounding switch G2 through the second grounding line 34-2 is used as an active heating zone, and the heating plate in the active heating zone S2 is applied with active heating power; the third heating zone S3 connected to the second grounding switch G2 through the current limiting resistor R2 is used as a first-level passive heating zone, and the heating plate in the first-level passive heating zone is applied with first-level passive heating power; the fourth heating zone S4 connected to the second grounding switch G2 through the current limiting resistor R2 and the current limiting resistor R3 in sequence is used as a second-level passive heating zone, and the heating plate in the second-level passive heating zone is applied with second-level passive heating power; and so on.

[0079] The controller controls the third grounding switch G3 to close, and controls other grounding switches to open: the third heating zone S3 connected to the third grounding switch G3 through the third grounding line 34-3 is used as an active heating zone, and the heating plate in the active heating zone S3 is applied with active heating power; the fourth heating zone S4 connected to the third grounding switch G3 through the current limiting resistor R3 is used as a first-level passive heating zone, and the heating plate in the first-level passive heating zone is applied with first-level passive heating power; the fifth heating zone S5 connected to the third grounding switch G3 through the current limiting resistor R3 and the current limiting resistor R4 in sequence is used as a second-level passive heating zone, and the heating plate in the second-level passive heating zone is applied with second-level passive heating power; and so on.

[0080] like Figure 6 As shown, in this embodiment, each heating zone includes 9 heating plates 32, and the second end of each heating plate 32 is connected to a power switch, and each power switch is used to drive a heating plate 32. Taking the first heating zone S1 as an example, it includes 9 heating plates 32, and the first ends of the 9 heating plates 32 in the first heating zone S1 are all connected to the first grounding switch G1, the second end of the first heating plate is connected to the first power switch K1, the second end of the second heating plate is connected to the second power switch K2, and the second end of the third heating plate is connected to the third power switch K3, and so on. The power switches all use pulse width modulation switches (PWM switches), and the proportion of active heating power and passive heating power of the heating plates connected to the power switches is adjusted by adjusting the switch duty cycle of the power switches, so that the sum of the active heating power applied to the heating plates and the multi-stage passive heating power applied to the heating plates is equal to the predetermined heating power of the heating plates. In this embodiment, the average duty cycle of the PWM signal is 40%-50%, and the conduction time of each different power switch K1-K9 is staggered as much as possible, and only 4 or 5 power switches are turned on at the same time.

[0081] The first grounding switch G1 is closed, and the first heating zone S1 directly connected to the first grounding switch G1 is used as an active heating zone. The power value of the active heating power applied to the heating plate 32 in the first heating zone S1 is P, and the current value flowing through the heating plate 32 is I. The second heating zone S2 connected to the first grounding switch G1 through the first diode D1 and the first current limiting resistor R1 is used as a first-level passive heating zone, and the third heating zone S3 is used as a second-level passive heating zone. When the resistance value of the first current limiting resistor R1 is equal to the resistance value of the heating plate 32, the current value flowing through the heating plate 32 in the second heating zone S2 is The first level passive heating power applied to the heating plate 32 in the second heating zone S2 is 0.04P, and the heating power of the first current limiting resistor R1 is 0.64P. When the resistance value of the first current limiting resistor R1 is equal to half of the resistance value of the heating plate 32, the current value flowing through the heating plate 32 in the second heating zone S2 is The first level passive heating power applied to the heating plate 32 in the second heating zone S2 is 0.11P, and the heating power of the first current limiting resistor R1 is 0.89P. When the resistance value of the first current limiting resistor R1 is equal to one quarter of the resistance value of the heating plate 32, the current value flowing through the heating plate 32 in the second heating zone S2 is The first-level passive heating power applied to the heating plate 32 in the second heating zone S2 is 0.25P, and the heating power of the first current limiting resistor R1 is P. The second-level passive heating power applied to the heating plate 32 in the third heating zone S3 is 0.11P, and the heating power of the second current limiting resistor R2 is 0.4P.

[0082] The active heating power and the passive heating power have a correlation relationship:

[0083] P=a1×P1

[0084] P=a2×P2

[0085] Among them, P is the active heating power, a1 is the first heating coefficient, P1 is the first level passive heating power, a2 is the second heating coefficient, and P2 is the second level passive heating power.

[0086] When the resistance value of the current limiting resistor is different, the heating coefficient between the active heating power generated by the active heating area and the passive heating power generated by the passive heating area is also different. For example, when the resistance value of the first current limiting resistor R1 is equal to one-fourth of the resistance value of the heating plate 32, at this time, the active heating power on the heating plate 32 in the active heating area S1 is P, the heating coefficient of the first-level passive heating area S2 downstream of the active heating area S1 is 0.25, the heating coefficient of the second-level passive heating area S3 is 0.11, and the power of the downstream heating area S4 is too low and can be ignored.

[0087] like Figure 7 As shown, multi-zone temperature control driving is performed through three steps to reduce the driving power of active heating.

[0088] Step 1: Turn off other grounding switches, turn on the first grounding switch G1, and use the first heating zone S1 as the active heating zone. The duty cycle corresponding to the base temperature of the heating plate that does not need temperature adjustment is 40, that is, 40% of the maximum heating power. The duty cycle corresponding to one of the high-temperature zones that requires additional heating is 60, and the duty cycle corresponding to the other low-temperature zone with a reduced temperature is 20. Simultaneously, the heating powers of the heating plates at the corresponding positions in the downstream first-level passive heating zone S2 are 10%, 15%, and 5% of the maximum heating power, respectively, and the heating powers of the heating plates at the corresponding positions in the second-level passive heating zone S3 are 4.4%, 6.6%, and 2.2%, respectively.

[0089] Step 2: Close the first grounding switch G1, open the second grounding switch G2, and start actively heating the second heating zone S2. Set the heating duty cycle of the original temperature-maintaining area to 30%, and maintain the heating power at 40% together with the 10% that has been preheated in step 1. For the heating plate corresponding to the high temperature zone in the first heating zone S1, set its duty cycle to 25%, and maintain the heating power at 40% together with the 15% applied during preheating in step 1. For the heating plate corresponding to the low temperature zone in the first heating zone S1, set its duty cycle to 35%, and maintain the heating power of the heating plate at 40% together with the 5% in the preheating stage in step 1. In addition, a high temperature zone appears in the second heating zone S2, and the duty cycle needs to be set to 50%. These duty cycle parameters generated in the second heating zone S2 will generate a corresponding proportion of heating power in the passive heating zone S3 downstream of the second heating zone S2.

[0090] Step 3, close the second grounding switch G2, open the third grounding switch G3, and start actively heating the third heating zone S3. According to the superposition results of the heating power parameters in the third heating zone S3 in the first two steps, the power parameters to be heated are selected, so that the total heating power received by each heating plate in the third heating zone S3 in step 3 is 40% of the maximum power.

[0091] The above-mentioned partition driving method can realize active heating of an active heating zone while preheating the two passive heating zones downstream. When setting the heating power ratio of the active heating zone, the power of the previous preheating is calculated, and finally the temperature of each heating plate in each heating zone is independently controlled. Since 36% of the heating power has been completed in the preheating stage, only the remaining 64% of the heating power needs to be applied in the active heating stage. Multiple heating powers are gradually applied to the heating plate in multiple heating steps, thereby reducing the instantaneous heating power and current of each heating plate. The heating plate is not prone to material cracking due to frequent and rapid heating and cooling, and the power and current levels of the corresponding switches are also reduced.

[0092] In other embodiments, for example Figure 3 and Figure 4 , the current limiting element only includes a current limiting resistor but not a diode, then all four second-level passive heating zones on both sides of the active heating zone will be connected to generate passive heating power, so each corresponding second-level passive heating zone has generated 36×2=72% of heating power in the passive heating stage, and only needs to continue to heat 28% of the remaining power in the active heating stage, so the maximum current can be further reduced. This structure needs to store and calculate the heating power distribution parameters of the previous four preheating stages during the driving process in order to obtain the heating power parameters that need to be actively adjusted in the active heating stage. As long as the active heating power applied in the final active heating stage can compensate for the power difference generated in the current heating zone during the passive heating stage, independent temperature control of all heating zones can be achieved. As long as the total heating power generated during the preheating process is less than 100%, that is, the preheating power is not greater than the active heating power, effective compensation in the final active heating stage can be guaranteed to achieve independent temperature control.

[0093] In other embodiments of the present invention, each heating zone of the multi-zone heating plate includes a first sub-heating zone and a second sub-heating zone, the first ends of all heating plates in the first sub-heating zone are connected to the ground switch through a first diode, the first ends of all heating plates in the second sub-heating zone are connected to the ground switch through a second diode, and the connection directions of the first diode and the second diode are opposite. The driving power supply adopts a pulse heating power supply 51-1, and the heating voltage output by the pulse heating power supply 51-1 changes between a positive heating voltage and a negative heating voltage, and the heating voltage is applied to each heating plate in the first sub-heating zone and the second sub-heating zone through the power switch.

[0094] like Figure 8As shown, in this embodiment, each heating zone includes 6 heating plates. A current limiting resistor R1 is connected between the first heating zone S1 and the second heating zone S2, or a current limiting resistor R1 and a diode can also be connected. The first heating zone S1 includes a first sub-heating zone S1a and a second sub-heating zone S1b. The first ends of the three heating plates in the first sub-heating zone S1a are connected to the first grounding switch G1 through a diode D10a, and the second ends of the three heating plates are connected to the pulse heating power supply 51-1 through a first power switch K1, a second power switch K2 and a third power switch K3, respectively. The first ends of the three heating plates in the second sub-heating zone S1b are connected to the first grounding switch G1 through a diode D10b, and the second ends of the three heating plates are connected to the pulse heating power supply 51-1 through a first power switch K1, a second power switch K2 and a third power switch K3, respectively. The second heating zone S2 includes a first sub-heating zone S2a and a second sub-heating zone S2b. The first ends of the three heating plates in the first sub-heating zone S2a are connected to the second grounding switch G2 through a diode D20a, and the second ends of the three heating plates are connected to the pulse heating power supply 51-1 through the first power switch K1, the second power switch K2 and the third power switch K3, respectively. The first ends of the three heating plates in the second sub-heating zone S2b are connected to the second grounding switch G2 through a diode D20b, and the second ends of the three heating plates are connected to the pulse heating power supply 51-1 through the first power switch K1, the second power switch K2 and the third power switch K3, respectively.

[0095] Only Figure 8 The first heating zone S1 and the second heating zone S2 in the example are explained. When the pulse heating power supply 51-1 outputs a positive heating voltage, the first grounding switch G1 is turned on, and the second sub-heating zone S1b of the first heating zone S1 is used as an active heating zone, and the heating plate in the second sub-heating zone S1b is applied with active heating power. The second sub-heating zone S2b of the second heating zone S2 connected to the first grounding switch G1 through a current limiting resistor R1 is used as a passive heating zone, and the heating plate in the second sub-heating zone S2b is applied with passive heating power. When the pulse heating power supply 51-1 outputs a negative heating voltage, the first grounding switch G1 is turned on, and the first sub-heating zone S1a of the first heating zone S1 is used as an active heating zone, and the heating plate in the first sub-heating zone S1a is applied with active heating power. The first sub-heating zone S2a of the second heating zone S2 connected to the first grounding switch G1 through a current limiting resistor R1 is used as a passive heating zone, and the heating plate in the first sub-heating zone S2a is applied with passive heating power. The method for adjusting the active heating power and the passive heating power of the heating plates in different sub-heating zones is similar to the above description and will not be repeated here.

[0096] By varying between positive and negative heating voltages, the pulse heating power supply achieves more precise temperature control, reduces overheating risks and thermal stress, promotes uniform heating, improves thermal efficiency and equipment life, while adapting to the characteristics of different materials, reducing electromagnetic interference, and enabling complex temperature control curves, providing greater flexibility and safety.

[0097] In another embodiment of the present invention, Figure 2 Based on the above, the current limiting element in the multi-zone heating plate is changed from being set between the grounding switches to being set between the power switches, each current limiting element is connected between two power lines, and multiple current limiting elements are connected in series to form a closed loop, which can also achieve the purpose of the present invention. Fig. 9 As shown, a first current limiting element E1 is connected in series between the first power line 33-1 and the second power line 33-2, a second current limiting element E2 is connected in series between the second power line 33-2 and the third power line 33-3, a third current limiting element E3 is connected in series between the third power line 33-3 and the fourth power line 33-4, and a fourth current limiting element E4 is connected in series between the fourth power line 33-4 and the first power line 33-1. The first current limiting element E1, the second current limiting element E2, the third current limiting element E3 and the fourth current limiting element E4 are connected in series to form a closed loop.

[0098] The current limiting element E may also be a current limiting resistor R, or a current limiting resistor R connected in series with a diode. Figure 1 As shown, the current limiting resistor R is set at the second port 312. The power line 33 is led out to the outside of the substrate 31 through the second port 312 set at the bottom of the substrate 31, and then continues to pass through the through hole 22 on the base 2 to connect with the power switch 53. Since the temperature of the base 2 is lower than the temperature of the multi-zone heating plate 3, the position of the second port 312 will become a cold spot where the base 2 absorbs heat downward from the multi-zone heating plate 3. The current limiting resistor R is set at the second port 312, and the heating power generated by the current limiting resistor R can just offset the heat loss caused by heat absorption.

[0099] Likewise, each heating zone of the multi-zone heating plate may also be Figure 8 Like the embodiment shown, it includes a first sub-heating zone and a second sub-heating zone, and the driving power supply 51 adopts a pulse heating power supply, which can achieve the purpose of the present invention. The working principle is similar to the above and will not be repeated here.

[0100] like Fig. 9As shown, the controller 6 controls the first grounding switch G1, the second grounding switch G2, the third grounding switch G3 and the fourth grounding switch G4 in the grounding switch G to be turned on simultaneously, and the controller 6 controls the first power switch K1, the second power switch K2, the third power switch K3 and the fourth power switch K4 in the power switch K to work in a pulse width modulation mode, and the controller 6 controls the first power switch K1, the second power switch K2, the third power switch K3 and the fourth power switch K4 to be turned on in sequence. When the first power switch K1 is turned on, the remaining power switches are turned off. At this time, the first current flows through the heating plates R11 to R14 in the first row connected to the first power switch K1, and active heating power is generated on the heating plates R11 to R14, and the heating plates R11 to R14 serve as active heating plates. At the same time, the heating plates R21-R24 in the second row are connected to the first power switch K1 through the first current limiting element E1, and a second current flows through the heating plates R21-R24. Due to the voltage dividing effect of the current limiting element E1, the second current is less than the first current, and passive heating power is generated on the heating plates R21-R24, and the heating plates R21-R24 serve as first-stage passive heating plates. Similarly, the heating plates R41-R44 in the fourth row are connected to the first power switch K1 through the fourth current limiting element E4, and a third current flows through the heating plates R41-R44. Due to the voltage dividing effect of the fourth current limiting element E4, the third current is less than the first current, and passive heating power is generated on the heating plates R41-R44, and the heating plates R41-R44 serve as first-stage passive heating plates. Further, the heating plates R31~R34 in the third row are connected to the first power switch K1 through the first current limiting element E1 and the second current limiting element E2. At the same time, the heating plates R31~R34 in the third row are also connected to the first power switch K1 through the third current limiting element E3 and the fourth current limiting element E4. A fourth current flows through the heating plates R31~R34. Due to the shunting effect of the first current limiting element E1 and the second current limiting element E2 (the fourth current limiting element E4 and the third current limiting element E3), the fourth current is smaller than the first current, and the fourth current is smaller than the second current, and the fourth current is smaller than the third current. Passive heating power is generated on the heating plates R31~R34, and the heating plates R31~R34 serve as second-stage passive heating plates.

[0101] In this embodiment, a multi-zone temperature control driving method using the multi-zone heating plate is provided, comprising:

[0102] The controller 6 controls multiple grounding switches G to be turned on simultaneously, and the controller 6 controls multiple power switches K to be turned on in sequence: multiple heating plates 32 directly connected to the currently turned-on power switch K act as active heating plates, and active heating power is applied to the active heating plates; multiple heating plates 32 connected to the currently turned-on power switch K through the current limiting element E act as passive heating plates, and passive heating power is applied to the passive heating plates; in the process of turning on the power switches K in sequence, each of the heating plates 32 acts as an active heating plate once and a passive heating plate at least once, and each heating plate 32 is applied with active heating power once and passive heating power at least once.

[0103] The passive heating plate includes multiple passive heating plates: a heating plate 32 connected to the currently turned-on power switch K through a current limiting element E serves as a first-stage passive heating plate, and the first passive heating plate is applied with a first-stage passive heating power; a heating plate connected to the currently turned-on power switch K through two current limiting elements E serves as a second-stage passive heating plate, and the second passive heating plate is applied with a second-stage passive heating power. Due to the voltage dividing effect of the current limiting element E, the active heating power is greater than the passive heating power, and the previous-stage passive heating power is greater than the next-stage passive heating power.

[0104] The ratio between each level of passive heating power and active heating power is used as the heating coefficient of each level of passive heating plate, and the controller 6 calculates each level of passive heating power according to the heating coefficient.

[0105] The controller 6 controls multiple power switches K to operate in a pulse width modulation mode. The controller 6 adjusts the ratio of active heating power and passive heating power applied to the heating plate 32 connected to the power switch K by adjusting the on-duty cycle of each power switch K, so that the sum of the active heating power and all passive heating powers applied to the same heating plate 32 is equal to the predetermined heating power of the heating plate 32.

[0106] The present invention connects the heating plates in different heating zones by setting a current limiting element. Each heating plate will undergo active heating operation and passive heating operation. Each heating plate will be applied with active heating power once and passive heating power at least once. By controlling the ratio of active heating power and passive heating power on the heating plate, the sum of active heating power and all passive heating powers applied to the same heating plate is equal to the predetermined heating power of the heating plate, and finally the independent temperature control of each heating plate is realized. The heating plate is gradually heated multiple times by active heating operation and passive heating operation, which can greatly reduce the maximum instantaneous heating current, reduce the instantaneous heating power and current of each heating plate, and the heating plate is not easy to cause material cracking due to frequent and rapid heating and cooling, and also reduce the power and current level of the corresponding switch.

[0107] It should be noted that, in the embodiments of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0108] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0109] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0110] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0111] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0112] As used in this specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0113] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as limiting the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention. After reading the above content, it will be obvious for those skilled in the art to make various modifications and substitutions to the present invention. Therefore, the scope of protection of the present invention should be defined by the attached claims.

Claims

1. A multi-zone heating plate, characterized in that: It comprises: a substrate made of insulating material, wherein the substrate comprises a plurality of heating zones and a plurality of current limiting elements; Each of the heating zones comprises a plurality of heating plates, and the heating plates are used to heat different areas of the substrate; The first ends of all the heating plates in each heating zone are connected to the same ground line, the second ends of each heating plate in each heating zone are connected to different power lines, and the heating plates connected to each power line are located in different heating zones; Each current limiting element is connected between the two grounding wires or the two power lines, and a plurality of current limiting elements are connected in series to form a closed loop; When the current limiting element is connected between two grounding wires, the current limiting element allows a first current to flow through a plurality of heating plates in a first heating zone, and a second current to flow through a plurality of heating plates in a second heating zone adjacent to the first heating zone, wherein the second current is smaller than the first current; When the current limiting element is connected between two power lines, the current limiting element allows a first current to flow through multiple heating plates connected to the first power line, while a second current flows through multiple heating plates connected to a second power line adjacent to the first power line, wherein the second current is smaller than the first current.

2. The multi-zone heating plate according to claim 1, characterized in that The current limiting element includes: a current limiting resistor.

3. The multi-zone heating plate according to claim 1, characterized in that The current limiting element comprises: a current limiting resistor and a unidirectional conductive element, wherein the current limiting resistor is connected in series with the unidirectional conductive element, and the unidirectional conductive element causes the current direction in the closed loop to be in a clockwise direction or a counterclockwise direction.

4. The multi-zone heating plate according to claim 2 or 3, characterized in that The resistance value of the current-limiting resistor is greater than or equal to one eighth of the resistance value of the heating plate, and the resistance value of the current-limiting resistor is less than or equal to one half of the resistance value of the heating plate.

5. The multi-zone heating plate according to claim 4, characterized in that The ground line is led out to the outside of the substrate through a first port arranged at the bottom of the substrate, and the power line is led out to the outside of the substrate through a second port arranged at the bottom of the substrate; When the current limiting element is connected between two grounding wires, the current limiting resistor is arranged at the first port; When the current limiting element is connected between two power lines, the current limiting resistor is arranged at the second port.

6. The multi-zone heating plate of claim 4, wherein: The current limiting resistor is a heating resistance wire, and the heating resistance wire is evenly coiled in the substrate.

7. The multi-zone heating plate of claim 1, wherein: The heating zone includes a first sub-heating zone and a second sub-heating zone, the first ends of all heating plates in the first sub-heating zone are connected to the ground line through a first unidirectional conductive element, the first ends of all heating plates in the second sub-heating zone are connected to the ground line through a second unidirectional conductive element, and the connection directions of the first unidirectional conductive element and the second unidirectional conductive element are opposite.

8. A semiconductor processing device, characterized in that: Include: Reaction chamber; A base disposed in the reaction chamber, wherein the base has a cooling liquid channel and a plurality of through holes extending vertically therethrough; The multi-zone heating plate according to any one of claims 1 to 6, which is arranged on the base, and the power line and the ground line led out from the multi-zone heating plate pass through the through hole on the base; An electrostatic chuck disposed on the multi-zone heating plate for carrying a substrate; A driving device is arranged under the base, and the driving device includes a driving power supply, a ground terminal, multiple power switches and multiple ground switches, one end of each power switch is connected to a power line passing through the base, and the other end is connected to the driving power supply, one end of each ground switch is connected to a ground line passing through the base, and the other end is connected to the ground terminal.

9. The semiconductor processing equipment according to claim 8, characterized in that Each of the heating zones in the multi-zone heating plate comprises a first sub-heating zone and a second sub-heating zone, the first ends of all the heating plates in the first sub-heating zone are connected to the ground line via a first unidirectional conductive element, the first ends of all the heating plates in the second sub-heating zone are connected to the ground line via a second unidirectional conductive element, and the connection directions of the first unidirectional conductive element and the second unidirectional conductive element are opposite; The driving power supply adopts a pulse heating power supply, and the heating voltage output by the pulse heating power supply varies between a positive heating voltage and a negative heating voltage. The heating voltage is applied to each heating plate in the first sub-heating zone and the second sub-heating zone through the power switch and the power line.

10. The semiconductor processing equipment according to claim 8 or 9, characterized in that: The semiconductor processing equipment further comprises: a controller for controlling the plurality of power switches and the plurality of ground switches to perform on-off operations; The controller controls the plurality of grounding switches to be opened in sequence; The controller controls the plurality of power switches to operate in a pulse width modulation mode and adjusts a turn-on duty cycle of each power switch.

11. A multi-zone temperature control driving method for adjusting the temperature of the multi-zone heating plate in the semiconductor processing equipment according to claim 10, characterized in that: The multi-zone temperature control driving method comprises: When the current limiting element is connected between two grounding wires, the controller controls the multiple grounding switches to be opened in sequence: the heating zone directly connected to the currently opened grounding switch is used as the active heating zone, and the heating plate in the active heating zone is applied with active heating power; The heating zone connected to the currently opened grounding switch through the current limiting element is used as a passive heating zone, and the heating plate in the passive heating zone is applied with passive heating power; in the process of sequentially opening the grounding switches, each of the heating zones is used as an active heating zone and at least one passive heating zone, and each heating plate is applied with active heating power and at least one passive heating power; The controller controls multiple power switches to operate in pulse width modulation mode. The controller adjusts the ratio of active heating power and passive heating power applied to the heating plate connected to the power switch by adjusting the on-duty cycle of each power switch, so that the sum of the active heating power and all passive heating powers applied to the same heating plate is equal to the predetermined heating power of the heating plate.

12. The multi-zone temperature control driving method according to claim 11, characterized in that: The passive heating zone includes multiple passive heating zones: a heating zone connected to the currently turned-on grounding switch through a current limiting element is used as a first-stage passive heating zone, and a first-stage passive heating power is applied to the heating plate in the first-stage passive heating zone; a heating zone connected to the currently turned-on grounding switch through two current limiting elements is used as a second-stage passive heating zone, and a second-stage passive heating power is applied to the heating plate in the second-stage passive heating zone; Due to the voltage dividing effect of the current limiting element, the active heating power is greater than the passive heating power, and the upper level passive heating power is greater than the lower level passive heating power.

13. A multi-zone temperature control driving method for adjusting the temperature of the multi-zone heating plate in the semiconductor processing equipment according to claim 10, characterized in that: The multi-zone temperature control driving method comprises: When the current limiting element is connected between two power lines, the controller controls multiple grounding switches to be turned on simultaneously, and the controller controls multiple power switches to be turned on in sequence: multiple heating plates directly connected to the currently turned-on power switches are used as active heating plates, and active heating power is applied to the active heating plates; A plurality of heating plates connected to the currently turned-on power switch through a current limiting element are used as passive heating plates, and passive heating power is applied to the passive heating plates; in the process of turning on the power switches in sequence, each of the heating plates is used as an active heating plate once and a passive heating plate at least once, and each of the heating plates is applied with active heating power once and passive heating power at least once; The controller controls multiple power switches to operate in pulse width modulation mode. The controller adjusts the ratio of active heating power and passive heating power applied to the heating plate connected to the power switch by adjusting the on-duty cycle of each power switch, so that the sum of the active heating power and all passive heating powers applied to the same heating plate is equal to the predetermined heating power of the heating plate.

14. The multi-zone temperature control driving method according to claim 13, characterized in that: The passive heating sheet comprises a plurality of passive heating sheets: a heating sheet connected to a currently turned-on power switch via a current limiting element is used as a first-stage passive heating sheet, and a first-stage passive heating power is applied to the first passive heating sheet; a heating sheet connected to a currently turned-on power switch via two current limiting elements is used as a second-stage passive heating sheet, and a second-stage passive heating power is applied to the second passive heating sheet; Due to the voltage dividing effect of the current limiting element, the active heating power is greater than the passive heating power, and the upper level passive heating power is greater than the lower level passive heating power.

Images