Laser drilling positioning control method and device for rigid-flex board

Abstract

The embodiment of the invention provides a laser drilling positioning control method and device for a rigid-flex board, and the method comprises the steps: obtaining an initial target position, making a target image at the initial target position of a PCB substrate through control equipment, and then carrying out the pressing of a surface layer; the control device removes the surface layer, exposes the target image, and obtains a plurality of target image positions through the image obtaining device; generating a plurality of auxiliary layer target circles according to the target image position; determining a tangent outer region of the plurality of auxiliary layer target circles as an adjacent feature region; determining a circle center reference coordinate of the adjacent feature region; determining the position of a positioning blind hole by taking the circle center reference coordinate as a positioning reference, and controlling equipment to manufacture the blind hole; and making a corresponding line by using the circle center reference coordinate as a positioning reference control device, establishing a virtual point (circle center reference coordinate) according to a preset positioning point (target image position), and calibrating a blind hole point or a through hole point of an actual drilled hole through the virtual point, thereby improving the positioning precision.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a laser drilling positioning control method for a rigid-flexible board, a laser drilling positioning control device for a rigid-flexible board, a computer device and a storage medium. Background Art

[0002] As the technology of rigid-flex boards develops towards multi-layer and multi-tiered development, the production of HDI products is difficult and the yield rate is low, and the requirements for the precision of HDI blind holes are getting higher and higher; how to improve the precision of laser blind holes has become one of the important research topics for the breakthrough of rigid-flex boards. At present, laser positioning uses target hole positioning, and the machine precision and inter-layer alignment cumulative precision are poor, which can easily cause the laser blind hole to deviate. Summary of the invention

[0003] In view of the above problems, the present embodiment is proposed to provide a laser drilling positioning control device for a rigid-flexible board, a computer device and a storage medium that overcome the above problems or at least partially solve the above problems.

[0004] In order to solve the above problems, this embodiment discloses a laser drilling positioning control method for a rigid-flexible board, wherein the rigid-flexible board includes a PCB substrate; including: After obtaining the initial target position, the control device produces a target image at the initial target position of the PCB substrate and then presses the surface layer; The control device removes the surface layer to expose the target image, and the image acquisition device acquires a plurality of target image positions; Generating a plurality of auxiliary layer target circles according to the target image position; The tangent outer areas of the target circles of the multiple auxiliary layers are determined as adjacent feature areas; Determine the center reference coordinates of the adjacent feature area; The position of the blind hole is determined by taking the circle center reference coordinate as the positioning reference, and the device is controlled to make the blind hole; and the corresponding circuit is controlled by taking the circle center reference coordinate as the positioning reference.

[0005] Preferably, the method further comprises: The position of the through hole is determined by taking the position of the positioning blind hole as a positioning reference, and the control device is used to manufacture the through hole.

[0006] Preferably, the step of determining the position of the blind hole by taking the circle center reference coordinate as the positioning reference and controlling the device to make the blind hole comprises: The through hole position is acquired by an image acquisition device, and the through hole offset is calculated according to the through hole position and a preset through hole position; The position of the positioning blind hole is determined by taking the circle center reference coordinate as the positioning reference, the position of the positioning blind hole is calibrated according to the through hole offset to obtain the calibration blind hole position, and the blind hole is manufactured according to the control device of the calibration blind hole position.

[0007] Preferably, generating a plurality of auxiliary layer target circles according to the target image position comprises: Calculating a target offset between the target image position and a preset target image position; The preset target image position is calibrated according to the target offset to generate a calibrated target image position, and a plurality of auxiliary layer target circles are generated with the calibrated target image position as the center of the circle.

[0008] Preferably, the tangent outer regions passing through the plurality of auxiliary layer target circles are determined as adjacent feature regions, including: The regions corresponding to the multiple auxiliary layer target circles are converted into multiple circular order features, and the region surrounded by the edge feature set of the circular order feature is converted into an adjacent feature region.

[0009] Preferably, the determining of the center reference coordinates of the adjacent feature area comprises: According to the center point of the vertical and horizontal coordinates of the adjacent feature area, the center point of the vertical and horizontal coordinates is determined as the circle center reference coordinate.

[0010] This embodiment discloses a laser drilling positioning control device for a rigid-flexible board, wherein the rigid-flexible board includes a PCB substrate; including: The first acquisition module is used to acquire the initial target position, control the device to produce a target image at the initial target position of the PCB substrate and then press the surface layer; A target image position module is used to control the device to remove the surface layer, expose the target image, and obtain multiple target image positions through the image acquisition device; A generating module, used for generating a plurality of auxiliary layer target circles according to the target image position; A determination module, used for determining the adjacent characteristic area through the tangent outer areas of the target circles of the multiple auxiliary layers; A circle center reference coordinate module, used to determine the circle center reference coordinate of the adjacent feature area; The control module is used to determine the position of the blind hole by taking the circle center reference coordinate as the positioning reference, and control the equipment to make the blind hole; and control the equipment to make the corresponding line by taking the circle center reference coordinate as the positioning reference.

[0011] Preferably, the device further comprises: The through hole making module is used to determine the position of the through hole by taking the position of the positioning blind hole as a positioning reference, and control the equipment to make the through hole.

[0012] This embodiment further discloses a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of laser drilling positioning control of the above-mentioned rigid-flex board when executing the computer program.

[0013] This embodiment further discloses a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of laser drilling positioning control of the above-mentioned rigid-flex board are implemented.

[0014] This embodiment includes the following advantages: In an embodiment of the present invention, the laser drilling positioning control method of the soft-hard combination board includes: obtaining an initial target position, controlling a device to produce a target image at the initial target position of the PCB substrate and then pressing a surface layer; controlling a device to remove the surface layer to expose the target image, and obtaining multiple target image positions through an image acquisition device; generating multiple auxiliary layer target circles according to the target image positions; determining the adjacent feature areas through the tangent outer areas of the multiple auxiliary layer target circles; determining the center reference coordinates of the adjacent feature areas; determining the position of the positioning blind hole with the center reference coordinates as the positioning reference, and controlling a device to produce the blind hole; and controlling a device to produce a corresponding circuit with the center reference coordinates as the positioning reference, establishing a virtual point (center reference coordinate) according to a preset positioning point (target image position), calibrating the actual blind hole point or through hole point of the drilling through the virtual point, and improving the positioning accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solution in this embodiment, the drawings required for use in the description of the embodiment will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 This is a flowchart of the steps of an embodiment of a laser drilling positioning control method for a rigid-flexible board of this embodiment; Figure 2 is a schematic diagram of an auxiliary layer target image in an embodiment of the present invention; Figure 3 is a schematic diagram of a target image position in an embodiment of the present invention; Figure 4 is a schematic diagram of generating an auxiliary layer target circle in this embodiment; Figure 5 is a schematic diagram of dividing a neighboring feature area in this embodiment; Figure 6This is a structural block diagram of an embodiment of a laser drilling positioning control device for a rigid-flexible board of this embodiment; Figure 7 The diagram is a diagram of the internal structure of a computer device according to an embodiment. DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical solutions and beneficial effects solved by this embodiment more clearly understood, this embodiment is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0018] In a core concept of an embodiment of the present invention, a virtual point (circle center reference coordinate) is established based on a preset positioning point (target image position), and the actual blind hole point or through hole point of the drilling is calibrated through the virtual point to improve the positioning accuracy. Specifically, the positioning blind position is determined based on four initial positioning targets, and then the drilling operation is performed based on the positioning blind position to reduce four errors to one error, thereby improving the positioning accuracy of the device. The positioning accuracy can be further improved by dividing the order of the neighborhood feature method, that is, the inverse of the n-order field.

[0019] The laser drilling positioning control method for a rigid-flexible board provided in this embodiment can be applied to an application environment including a terminal and a server. The terminal communicates with the server via a network. The terminal can be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, and portable wearable devices. The server can be implemented as an independent server or a server cluster composed of multiple servers. The terminal is connected to a variety of semiconductor devices, and the embodiment of the present invention does not impose too many restrictions on this.

[0020] Reference Figure 1 , shows a flowchart of a method for controlling the positioning of laser drilling of a rigid-flexible board according to an embodiment of the present invention, wherein the rigid-flexible board includes a PCB substrate; specifically, the following steps may be included: Step 101, after obtaining the initial target position, the control device produces a target image at the initial target position of the PCB substrate and then presses the surface layer; In an embodiment of the present invention, the rigid-flex board includes a PCB substrate, and the PCB substrate may include a COER board and a pressed surface layer pressed on the upper and lower surfaces of the COER board. Specifically, the pressed surface layer may include a copper single-substance layer. The embodiment of the present invention does not impose too many restrictions on the type of the pressed surface layer. In the embodiment of the present invention, first, the design data of the rigid-flex board can be obtained. The design data refers to the direction of the metal line, the length and width of the metal line, the line spacing, the hole diameter, the hole type, the hole position, the minimum distance from the grinding hole to the line, the size and spacing of the pad, the minimum width and font size of the wire, etc. Of course, the design data can also include the design drawing of the rigid-flex board, and the embodiment of the present invention does not impose too many restrictions on this; In the embodiment of the present invention, the terminal can control the laser drilling device to perform inner layer image operation on the PCB substrate at the initial target position in the design data, that is, to produce the auxiliary layer target. Figure 2 As shown, after the auxiliary layer target image is made, the laminating device is controlled to make a target image at the initial target position of the PCB substrate and then laminar the surface layer, that is, the copper surface layer is laminar after the target image is made according to the initial target position.

[0021] The PCB substrate may refer to a PCB substrate that has undergone multiple pre-semiconductor steps. For example, the PCB substrate may have undergone steps such as cutting and baking, and the embodiments of the present invention do not impose excessive restrictions on this.

[0022] Step 102, the control device removes the surface layer to expose the target image, and acquires multiple target image positions through the image acquisition device; Further applied to the embodiment of the present invention, after the operation of pressing the copper surface layer is completed, the device can be controlled to remove the surface layer to expose the target image, and multiple target image positions can be acquired by the image acquisition device. For example, the image of the PCB substrate can be acquired by CCD, and multiple target image positions can be identified from the image of the PCB substrate, such as Figure 3 As shown; Step 103, generating a plurality of auxiliary layer target circles according to the target image position; In the embodiment of the present invention, after obtaining a plurality of target image positions, calibration can be performed according to the target image positions to obtain the calibrated target image positions, and a plurality of tangent auxiliary layer target circles are generated with the calibrated target image positions as the centers of the circles; Specifically implemented in the embodiments of the present invention, Figure 4 As shown, generating multiple auxiliary layer target circles according to the target image position includes: calculating the target offset between the target image position and the preset target image position; calibrating the preset target image position according to the target offset to generate a calibrated target image position, and generating multiple auxiliary layer target circles with the calibrated target image position as the center of the circle.

[0023] The target image position refers to the coordinate position of the target image acquired by the CCD after calibration by the target offset; and the auxiliary layer target circle refers to a plurality of auxiliary layer circles generated with the calibrated coordinate position as the center.

[0024] Step 104, determining the adjacent feature areas through the tangent outer areas of the target circles of the multiple auxiliary layers; In actual application in the embodiment of the present invention, after obtaining multiple auxiliary layer target circles, images of the multiple auxiliary layer target circles are acquired, and the tangent outer areas formed by the edges of the auxiliary layer target circles are identified by image processing; specifically, the tangent outer areas formed by the multiple auxiliary layer target circles are determined as adjacent feature areas, including: converting the areas corresponding to the multiple auxiliary layer target circles into multiple circular order features, and converting the areas surrounded by the edge feature sets of the circular order features into adjacent feature areas. The circular order features may include -1 order pixel features, -2 order pixel features, -3 order pixel features, etc., and the embodiment of the present invention does not impose excessive restrictions on this.

[0025] In a specific implementation method, the area surrounded by the edge feature set is obtained by reverse neighborhood feature positioning and least square function fitting, that is, the neighboring feature area is obtained; In the embodiment of the present invention, the loss function C of the least squares function is set as follows: ; Among them, Ui represents the opposite number of the neighborhood feature order, yi and xi represent the vertical and horizontal coordinates of the image pixels in the area surrounded by the edge feature set, n represents the data of the edge feature set, i=1, 2, 2 / 3······n; The above loss function is minimized by gradient descent, and it is continuously updated iteratively until the function converges, converting the area surrounded by the edge feature set into the adjacent feature area. Refers to any least squares function, which is a fitting function that can be used for edge detection and other tasks. By fitting the pixel value distribution of the image, the features of the image are extracted.

[0026] In an embodiment of the present invention, a positioning blind position is determined based on four or more initial positioning targets, and a subsequent drilling operation is performed based on the positioning blind position to reduce four errors to one error, thereby improving the positioning accuracy of the device. The positioning accuracy is further improved through the order division of the neighborhood feature method, that is, the inverse calculation of the n-order field, and the positioning accuracy of the blind holes and through holes is improved through image recognition.

[0027] Step 105, determining the center reference coordinates of the adjacent feature area; In an embodiment of the present invention, after determining the adjacent feature area, the center reference coordinates of the adjacent feature area can be obtained; the determination of the center reference coordinates of the adjacent feature area includes: according to the center point of the vertical and horizontal coordinates of the adjacent feature area, determining the center point of the vertical and horizontal coordinates as the center reference coordinates.

[0028] Specifically applied to the embodiment of the present invention, the adjacent feature region can be represented in the form of vertical and horizontal coordinates, that is, the adjacent feature region refers to the region surrounded by the edge feature set represented by more accurate coordinate data; Specifically, first, the adjacent feature area is divided into multiple triangles or polygons, the areas of the multiple triangles or polygons are calculated, and the weighted average of the areas of the triangles or polygons is calculated to obtain the sum of the areas and the centroid coordinates of the adjacent feature areas; the centroid coordinates are determined as the center of circle reference coordinates. In terms of specific implementation, the areas of multiple triangles or polygons can be calculated according to the coordinate data through the calculate_area function, and then the sum of the areas of multiple triangles or polygons and the geometric center coordinates can be calculated through the calculate_centroid function to obtain the center of circle reference coordinates.

[0029] Specifically in the embodiment of the present invention, the center point of the vertical and horizontal coordinates of the adjacent feature area may also be calculated in other ways, and the embodiment of the present invention does not impose too many restrictions on this.

[0030] Step 106, determining the position of the blind hole by using the circle center reference coordinate as the positioning reference, and controlling the device to make the blind hole; and controlling the device to make the corresponding line by using the circle center reference coordinate as the positioning reference.

[0031] After obtaining the circle center reference coordinate, the circle center reference coordinate is set as the positioning reference of the laser drilling equipment. Under the condition of the positioning reference, the laser drilling equipment is controlled to make blind holes and corresponding circuits, which improves the production accuracy of holes and circuits, reduces the production error of PCB boards, does not require hardware modification, and reduces costs.

[0032] In a preferred embodiment of the embodiment of the present invention, the method further includes: determining the position of the through hole by taking the position of the positioning blind hole as the positioning reference, and controlling the device to make the through hole; that is, in the embodiment of the present invention, the position of the blind hole can also be used as the positioning reference to determine the position of the through hole so as to make the through hole, and the actual hole position can be further calibrated with each other to improve the convenience of through hole production and further improve the positioning accuracy; in the embodiment of the present invention, a virtual point (center reference coordinate) is established according to the preset positioning point (target image position), and the actual blind hole point or through hole point of the drilling is calibrated by the virtual point to improve the positioning accuracy.

[0033] In another specific description, the position of the blind hole is determined by taking the circle center reference coordinate as the positioning reference, and the device is controlled to make the blind hole, including: acquiring the through hole position through an image acquisition device, and calculating the through hole offset according to the through hole position and the preset through hole position; determining the position of the blind hole by taking the circle center reference coordinate as the positioning reference, calibrating the position of the blind hole according to the through hole offset to obtain the calibrated blind hole position, and controlling the device to make the blind hole according to the calibrated blind hole position; in the embodiment of the present invention, the position of the blind hole on the laser drilling device can be further calibrated by the through hole offset, and the actual hole position can be further calibrated with each other to improve the convenience of blind hole production and further improve the positioning accuracy.

[0034] It should be noted that, in the embodiment of the present invention, the above-mentioned semiconductor equipment may include material pre-baking equipment, inner layer imaging equipment, drilling equipment, electroplating equipment, browning equipment, lamination and lamination equipment, dry film sticking equipment, UV laser equipment, exposure equipment, developing equipment, etching equipment, etc., and the embodiment of the present invention does not impose too many restrictions on this.

[0035] Correspondingly, after the above-mentioned drilling operation, the equipment can also be controlled to perform electroplating operation, outer layer image etching operation, solder mask operation, gold deposition operation, thermosetting text operation, molding operation, cover opening operation, soft board UV molding operation, electrical measurement operation, etc. The embodiments of the present invention do not impose too many restrictions on this.

[0036] In an embodiment of the present invention, the laser drilling positioning control method of the soft-hard combination board includes: obtaining an initial target position, controlling a device to produce a target image at the initial target position of the PCB substrate and then pressing a surface layer; controlling a device to remove the surface layer to expose the target image, and obtaining multiple target image positions through an image acquisition device; generating multiple auxiliary layer target circles according to the target image positions; determining the adjacent feature areas through the tangent outer areas of the multiple auxiliary layer target circles; determining the center reference coordinates of the adjacent feature areas; determining the position of the positioning blind hole with the center reference coordinates as the positioning reference, and controlling a device to produce the blind hole; and controlling a device to produce a corresponding circuit with the center reference coordinates as the positioning reference, establishing a virtual point (center reference coordinate) according to a preset positioning point (target image position), calibrating the actual blind hole point or through hole point of the drilling through the virtual point, and improving the positioning accuracy.

[0037] It should be noted that, for the method embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that this embodiment is not limited by the order of the actions described, because according to this embodiment, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by this embodiment.

[0038] Reference Figure 6 , shows a structural block diagram of an embodiment of a laser drilling positioning control device for a rigid-flexible board of this embodiment, which may specifically include the following modules: The first acquisition module 301 is used to acquire the initial target position, control the device to produce a target image at the initial target position of the PCB substrate and then press the surface layer; The target image position module 302 is used to control the device to remove the surface layer, expose the target image, and obtain multiple target image positions through the image acquisition device; A generating module 303, used for generating a plurality of auxiliary layer target circles according to the target image position; A determination module 304 is used to determine the adjacent feature area through the tangent outer areas of the target circles of the multiple auxiliary layers; A circle center reference coordinate module 305 is used to determine the circle center reference coordinate of the adjacent feature area; The control module 306 is used to determine the position of the blind hole by taking the circle center reference coordinate as the positioning reference, and control the equipment to make the blind hole; and control the equipment to make the corresponding line by taking the circle center reference coordinate as the positioning reference.

[0039] Preferably, the device further comprises: The through hole making module is used to determine the position of the through hole by taking the position of the positioning blind hole as a positioning reference, and control the equipment to make the through hole.

[0040] Preferably, the control module comprises: A through-hole offset calculation module is used to obtain the through-hole position through an image acquisition device, and calculate the through-hole offset according to the through-hole position and a preset through-hole position; The blind hole making submodule is used to determine the position of the positioning blind hole with the circle center reference coordinate as the positioning reference, calibrate the position of the positioning blind hole according to the through hole offset, obtain the calibration blind hole position, and control the device to make the blind hole according to the calibration blind hole position.

[0041] Preferably, the generating module comprises: A calculation submodule, used to calculate a target offset between the target image position and a preset target image position; The generating submodule is used to calibrate the preset target image position according to the target offset, generate a calibrated target image position, and generate a plurality of auxiliary layer target circles with the calibrated target image position as the center of the circle.

[0042] Preferably, the determining module includes: The conversion submodule is used to convert the areas corresponding to the multiple auxiliary layer target circles into multiple circular order features, and convert the area surrounded by the edge feature set of the circular order feature into an adjacent feature area.

[0043] Preferably, the circle center reference coordinate module comprises: The center point submodule is used to determine the center point of the vertical and horizontal coordinates as the circle center reference coordinate according to the center point of the vertical and horizontal coordinates of the adjacent feature area.

[0044] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0045] The specific definition of the laser drilling positioning control device for a rigid-flexible board can be found in the definition of the laser drilling positioning control method for a rigid-flexible board mentioned above, which will not be repeated here. Each module in the above-mentioned laser drilling positioning control device for a rigid-flexible board can be implemented in whole or in part by software, hardware, and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0046] The laser drilling positioning control device for a rigid-flexible board provided above can be used to execute the laser drilling positioning control method for a rigid-flexible board provided in any of the above embodiments, and has corresponding functions and beneficial effects.

[0047] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Figure 7 As shown. The computer device includes a processor, a memory, a network interface, a display screen and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for simulating daylighting is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device housing, or an external keyboard, touchpad or mouse, etc.

[0048] Those skilled in the art will understand that Figure 7The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0049] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented: After obtaining the initial target position, the control device produces a target image at the initial target position of the PCB substrate and then presses the surface layer; The control device removes the surface layer to expose the target image, and the image acquisition device acquires a plurality of target image positions; Generating a plurality of auxiliary layer target circles according to the target image position; The tangent outer areas of the target circles of the multiple auxiliary layers are determined as adjacent feature areas; Determine the center reference coordinates of the adjacent feature area; The position of the blind hole is determined by taking the circle center reference coordinate as the positioning reference, and the device is controlled to make the blind hole; and the corresponding circuit is controlled by taking the circle center reference coordinate as the positioning reference.

[0050] Preferably, the method further comprises: The position of the through hole is determined by taking the position of the positioning blind hole as a positioning reference, and the control device is used to manufacture the through hole.

[0051] Preferably, the step of determining the position of the blind hole by taking the circle center reference coordinate as the positioning reference and controlling the device to make the blind hole comprises: The through hole position is acquired by an image acquisition device, and the through hole offset is calculated according to the through hole position and a preset through hole position; The position of the positioning blind hole is determined by taking the circle center reference coordinate as the positioning reference, the position of the positioning blind hole is calibrated according to the through hole offset to obtain the calibration blind hole position, and the blind hole is manufactured according to the control device of the calibration blind hole position.

[0052] Preferably, generating a plurality of auxiliary layer target circles according to the target image position comprises: Calculating a target offset between the target image position and a preset target image position; The preset target image position is calibrated according to the target offset to generate a calibrated target image position, and a plurality of auxiliary layer target circles are generated with the calibrated target image position as the center of the circle.

[0053] Preferably, the tangent outer regions passing through the plurality of auxiliary layer target circles are determined as adjacent feature regions, including: The regions corresponding to the multiple auxiliary layer target circles are converted into multiple circular order features, and the region surrounded by the edge feature set of the circular order feature is converted into an adjacent feature region.

[0054] Preferably, the determining of the center reference coordinates of the adjacent feature area comprises: According to the center point of the vertical and horizontal coordinates of the adjacent feature area, the center point of the vertical and horizontal coordinates is determined as the circle center reference coordinate.

[0055] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: After obtaining the initial target position, the control device produces a target image at the initial target position of the PCB substrate and then presses the surface layer; The control device removes the surface layer to expose the target image, and the image acquisition device acquires a plurality of target image positions; Generating a plurality of auxiliary layer target circles according to the target image position; The tangent outer areas of the target circles of the multiple auxiliary layers are determined as adjacent feature areas; Determine the center reference coordinates of the adjacent feature area; The position of the blind hole is determined by taking the circle center reference coordinate as the positioning reference, and the device is controlled to make the blind hole; and the corresponding circuit is controlled by taking the circle center reference coordinate as the positioning reference.

[0056] Preferably, the method further comprises: The position of the through hole is determined by taking the position of the positioning blind hole as a positioning reference, and the control device is used to manufacture the through hole.

[0057] Preferably, the step of determining the position of the blind hole by taking the circle center reference coordinate as the positioning reference and controlling the device to make the blind hole comprises: The through hole position is acquired by an image acquisition device, and the through hole offset is calculated according to the through hole position and a preset through hole position; The position of the positioning blind hole is determined by taking the circle center reference coordinate as the positioning reference, the position of the positioning blind hole is calibrated according to the through hole offset to obtain the calibration blind hole position, and the blind hole is manufactured according to the control device of the calibration blind hole position.

[0058] Preferably, generating a plurality of auxiliary layer target circles according to the target image position comprises: Calculating a target offset between the target image position and a preset target image position; The preset target image position is calibrated according to the target offset to generate a calibrated target image position, and a plurality of auxiliary layer target circles are generated with the calibrated target image position as the center of the circle.

[0059] Preferably, the tangent outer regions passing through the plurality of auxiliary layer target circles are determined as adjacent feature regions, including: The regions corresponding to the multiple auxiliary layer target circles are converted into multiple circular order features, and the region surrounded by the edge feature set of the circular order feature is converted into an adjacent feature region.

[0060] Preferably, the determining of the center reference coordinates of the adjacent feature area comprises: According to the center point of the vertical and horizontal coordinates of the adjacent feature area, the center point of the vertical and horizontal coordinates is determined as the circle center reference coordinate.

[0061] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0062] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0063] Those skilled in the art will appreciate that the embodiments of the present embodiment may be provided as methods, devices, or computer program products. Therefore, the present embodiment may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present embodiment may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0064] The present embodiment is described with reference to the flowchart and / or block diagram of the apparatus, terminal device (system), and computer program product according to the present embodiment. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0065] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction method, which is implemented in the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0066] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0067] Although the preferred embodiment of the present embodiment has been described, other changes and modifications may be made to these embodiments once those skilled in the art have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiment and all changes and modifications falling within the scope of the present embodiment.

[0068] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, device, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, device, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the existence of other identical elements in the process, device, article or terminal device including the elements.

[0069] The above is a detailed introduction to a laser drilling positioning control method for a rigid-flexible board and a laser drilling positioning control device for a rigid-flexible board, a computer device and a storage medium provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A laser drilling positioning control method for a rigid-flexible board, characterized in that: The rigid-flex board comprises a PCB substrate; comprising: After obtaining the initial target position, the control device produces a target image at the initial target position of the PCB substrate and then presses the surface layer; The control device clears the surface layer to expose the target image, and acquires a plurality of target image positions through the image acquisition device; Generating a plurality of auxiliary layer target circles according to the target image position; The tangent outer areas of the target circles of the multiple auxiliary layers are determined as adjacent feature areas; Determine the reference coordinates of the center of the adjacent feature area; The position of the blind hole is determined by taking the circle center reference coordinate as the positioning reference, and the device is controlled to make the blind hole; and the corresponding circuit is controlled by taking the circle center reference coordinate as the positioning reference.

2. The method according to claim 1, characterized in that: The method further comprises: The position of the through hole is determined by taking the position of the positioning blind hole as a positioning reference, and the control device is used to manufacture the through hole.

3. The method according to claim 1, characterized in that The method of determining the position of the blind hole by taking the circle center reference coordinate as the positioning reference and controlling the device to make the blind hole comprises: The through hole position is acquired by an image acquisition device, and the through hole offset is calculated according to the through hole position and a preset through hole position; The position of the positioning blind hole is determined by taking the circle center reference coordinate as the positioning reference, the position of the positioning blind hole is calibrated according to the through hole offset to obtain the calibration blind hole position, and the blind hole is manufactured according to the control device of the calibration blind hole position.

4. The method according to claim 1, characterized in that: The step of generating a plurality of auxiliary layer target circles according to the target image position comprises: Calculating a target offset between the target image position and a preset target image position; The preset target image position is calibrated according to the target offset to generate a calibrated target image position, and a plurality of auxiliary layer target circles are generated with the calibrated target image position as the center of the circle.

5. The method according to claim 1, characterized in that The tangent outer regions of the target circles of the multiple auxiliary layers are determined as adjacent feature regions, including: The regions corresponding to the multiple auxiliary layer target circles are converted into multiple circular order features, and the region surrounded by the edge feature set of the circular order feature is converted into an adjacent feature region.

6. The method according to claim 1, characterized in that The determining of the center reference coordinates of the adjacent feature area comprises: According to the center point of the vertical and horizontal coordinates of the adjacent feature area, the center point of the vertical and horizontal coordinates is determined as the circle center reference coordinate.

7. A laser drilling positioning control device for a rigid-flexible board, characterized in that: The rigid-flex board comprises a PCB substrate; comprising: The first acquisition module is used to acquire the initial target position, control the device to produce a target image at the initial target position of the PCB substrate and then press the surface layer; A target image position module is used to control the device to remove the surface layer, expose the target image, and obtain multiple target image positions through the image acquisition device; A generating module, used for generating a plurality of auxiliary layer target circles according to the target image position; A determination module, used for determining the adjacent characteristic area through the tangent outer areas of the target circles of the multiple auxiliary layers; A circle center reference coordinate module, used to determine the circle center reference coordinate of the adjacent feature area; The control module is used to determine the position of the blind hole by taking the circle center reference coordinate as the positioning reference, and control the equipment to make the blind hole; and control the equipment to make the corresponding line by taking the circle center reference coordinate as the positioning reference.

8. The device according to claim 7, characterized in that The device also includes: The through hole making module is used to determine the position of the through hole by taking the position of the positioning blind hole as a positioning reference, and control the equipment to make the through hole.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the laser drilling positioning control method for a rigid-flexible board according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the laser drilling positioning control method for a rigid-flexible board according to any one of claims 1 to 6 are implemented.

Images