Embedded element circuit board and preparation method thereof

Abstract

The invention provides an embedded component circuit board and a preparation method thereof. The cooling medium is arranged on the back surface (in the first hole and the surface, deviating from the element, of the substrate) of the element, so that heat dissipated by the element can be absorbed by the cooling medium, and the purpose of dissipating heat of the element is achieved. According to the invention, the element is arranged in the through groove of the outer-layer circuit board, that is, the element is arranged in an embedded mode, so that the size of the circuit board can be reduced. According to the invention, the protection film is arranged and a porous design is formed on the protection film, so that dust and water can be prevented, the element and the circuit layer can be protected, a heat dissipation effect can be achieved, and the heat dissipation efficiency is further improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board with embedded components and a preparation method thereof. Background Art

[0002] In recent years, circuit boards have been developing in the direction of being shorter, smaller, lighter, and thinner, and the density of components installed on circuit boards has also increased. In addition to useful work, most of the electrical energy consumed by components during operation will be converted into heat. As the density of component installation increases, the effective heat dissipation area of ​​the circuit board is getting smaller and smaller, affecting the heat dissipation of components, and even affecting the reliability of components and the service life of electronic equipment. Summary of the invention

[0003] In view of this, the present application proposes a method for preparing a circuit board with embedded components to improve the heat dissipation efficiency of the components and reduce the size of the circuit board.

[0004] In addition, it is also necessary to provide a circuit board with embedded components prepared by the above preparation method.

[0005] An embodiment of the present application provides a method for preparing a circuit board with embedded components, which comprises the following steps:

[0006] A copper-clad laminate is laminated on at least one side of a substrate, wherein the substrate comprises a first substrate layer and a first circuit layer formed on at least one surface of the first substrate layer, the substrate has a first region, and the first region is provided with a plurality of first holes penetrating the substrate in a thickness direction; the copper-clad laminate comprises a second substrate layer and a copper foil layer, the second substrate layer is located between the first circuit layer and the copper foil layer, the copper-clad laminate is provided with a through groove penetrating the copper-clad laminate in a thickness direction, and the first region is exposed from the through groove;

[0007] The copper foil layer is manufactured into a second circuit layer, wherein the second circuit layer is electrically connected to the first circuit layer;

[0008] Arranging a component in the through groove, wherein the component is electrically connected to the first circuit layer;

[0009] Disposing a cooling medium in the first hole and on the surface of the substrate facing away from the element, wherein the orthographic projection of the cooling medium on the substrate covers the element;

[0010] A protective film is provided on the surface of the second circuit layer facing away from the second substrate layer to obtain the embedded component circuit board; wherein the protective film has a second area, the second area is provided with a plurality of second holes penetrating the protective film along the thickness direction, and the second area is provided corresponding to the through groove and covers the component.

[0011] In one embodiment, the diameter of the first holes is 10 μm to 100 μm, and the distance between two adjacent first holes is 20 μm to 200 μm.

[0012] In one embodiment, the diameter of the second hole is 5 μm to 30 μm, and the distance between two adjacent second holes is 10 μm to 60 μm.

[0013] In one embodiment, in the step of laminating the copper clad laminate on at least one side of the substrate, a first adhesive layer is provided between the substrate and the copper clad laminate. The first adhesive layer is located between the first circuit layer and the second base material layer, and the first adhesive layer is provided with a first through hole penetrating the first adhesive layer along the thickness direction. The first through hole is connected to the through groove, and the first area is exposed from the first through hole and the through groove.

[0014] In one embodiment, in the step of providing a protective film on the side of the second circuit layer facing away from the second substrate layer, a second adhesive layer is provided between the protective film and the second circuit layer. The second adhesive layer is provided with a second through hole penetrating the second adhesive layer in a thickness direction, and the second through hole is provided corresponding to the component.

[0015] An embodiment of the present application provides a circuit board with embedded components, which includes a substrate, an outer circuit board, a component, a cooling medium and a protective film. The substrate includes a first substrate layer and a first circuit layer formed on at least one surface of the first substrate layer. The substrate has a first region, and the first region is provided with a plurality of first holes penetrating the substrate in the thickness direction. The outer circuit board is arranged on at least one surface of the substrate, and the outer circuit board includes a second substrate layer and a second circuit layer formed on the surface of the second substrate layer, and the second substrate layer is located between the first circuit layer and the second circuit layer. The outer circuit board is provided with a through groove penetrating the outer circuit board in the thickness direction, and the through groove corresponds to the first region. The component is arranged in the through groove and electrically connected to the first circuit layer. The cooling medium is arranged in the first hole and on the surface of the substrate away from the component, and the orthographic projection of the cooling medium on the substrate covers the component. The protective film is arranged on the surface of the second circuit layer away from the second substrate layer. The protective film has a second region, and the second region is provided with a plurality of second holes penetrating the protective film in the thickness direction, and the second region is arranged corresponding to the through groove and covers the component.

[0016] In one embodiment, the diameter of the first hole is 10 μm to 100 μm, and the distance between two adjacent first holes is 20 μm to 200 μm. The diameter of the second hole is 5 μm to 30 μm, and the distance between two adjacent second holes is 10 μm to 60 μm.

[0017] In one embodiment, the embedded component circuit board further comprises a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located between the first circuit layer and the second substrate layer, and the second adhesive layer is located between the protective film and the second circuit layer.

[0018] In one embodiment, the first adhesive layer is provided with a first through hole penetrating the first adhesive layer along the thickness direction, and the first through hole is arranged corresponding to the through groove. The second adhesive layer is provided with a second through hole penetrating the second adhesive layer along the thickness direction, and the second through hole is arranged corresponding to the element.

[0019] In one embodiment, the embedded component circuit board further includes a conductive structure, and the conductive structure electrically connects the first circuit layer and the second circuit layer.

[0020] The present application sets a cooling medium on the back of the component (inside the first hole and the surface of the substrate facing away from the component), and the heat emitted by the component can be absorbed by the cooling medium, thereby achieving the purpose of heat dissipation of the component. The present application sets the component in the through groove of the outer circuit board, that is, sets the component in an embedded manner, thereby reducing the size of the circuit board. The present application sets a protective film and forms a porous design on the protective film, which can not only prevent dust and water, protect the components and circuit layers, but also play a role in heat dissipation, further improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A cross-sectional view of a substrate provided in accordance with one embodiment of the present application.

[0022] Figure 2 For Figure 1 A cross-sectional view of a substrate with copper clad laminates stacked on both sides is shown.

[0023] Figure 3 For the general Figure 2 A cross-sectional view of the structure after pressing is shown.

[0024] Figure 4 For the general Figure 3 The copper foil layer of the structure shown is a cross-sectional view of the second circuit layer.

[0025] Figure 5 For Figure 4 A cross-sectional view of components arranged within the structure shown.

[0026] Figure 6 For Figure 5 A cross-sectional view of a structure in which a cooling medium is disposed is shown.

[0027] Figure 7 For Figure 6 A cross-sectional view of a circuit board with embedded components obtained after protective films are provided on both sides of the structure shown.

[0028] Main component symbols

[0029] Embedded component circuit board 100

[0030] Substrate 10

[0031] Copper clad laminate 20

[0032] Element 30

[0033] Cooling medium 40

[0034] Protective film 50, 54

[0035] Outer circuit board 60

[0036] First base material layer 11

[0037] First circuit layer 12

[0038] Conductive structure 13, 25

[0039] First Area 14

[0040] First hole 101

[0041] Second base material layer 21

[0042] Copper foil layer 22

[0043] First adhesive layer 23

[0044] The second circuit layer 24

[0045] Through groove 201

[0046] First through hole 230

[0047] Second area 51

[0048] Second adhesive layer 52

[0049] The third adhesive layer 53

[0050] Third Area 55

[0051] The second hole 501

[0052] Second through hole 520

[0053] The third hole 550

[0054] The following specific implementation manner will further illustrate the embodiments of the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the technical field of the present application. The terms used herein are only for the purpose of describing specific implementation methods and are not intended to limit the present application embodiments.

[0056] It will be understood that when a layer is referred to as being “on” another layer, it can be directly on the other layer or intervening layers may be present therebetween. In contrast, when a layer is referred to as being “directly on” another layer, there are no intervening layers present.

[0057] Here, the embodiments of the present application are described with reference to the cross-sectional views, which are schematic diagrams of the idealized embodiments (and intermediate configurations) of the present application. Thus, it is foreseeable that the shapes of the diagrams are different due to manufacturing processes and / or tolerances. Therefore, the embodiments of the present application should not be interpreted as being limited to the specific shapes of the regions illustrated here, but should include deviations in shapes such as those produced due to manufacturing. The regions shown in the figures are themselves only schematic, and their shapes are not intended to illustrate the actual shapes of the devices, and are not intended to limit the scope of the present application.

[0058] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0059] See also Figures 1 to 7 In a first aspect, the present application provides a method for preparing a circuit board 100 with embedded components, which includes steps S10 to S50. It is understandable that the numbering of the steps is intended to clearly describe the specific preparation method, and is not intended to limit the order of the steps.

[0060] See also Figures 1 to 3 , step S10, a copper clad laminate 20 is pressed on at least one side of the substrate 10. In this embodiment, a copper clad laminate 20 is pressed on both sides of the substrate 10 in the thickness direction. In other embodiments, a copper clad laminate 20 may be pressed on only one side of the substrate 10 in the thickness direction (for example, the upper side or the lower side of the substrate 10).

[0061] like Figure 1 As shown, the substrate 10 includes a first substrate layer 11 and a first circuit layer 12 formed on at least one surface of the first substrate layer 11. In this embodiment, the first circuit layer 12 is formed on both the upper and lower surfaces of the first substrate layer 11, and the two first circuit layers 12 can be electrically connected through a conductive structure 13. In other embodiments, the substrate 10 can also be a single-layer board, that is, the first circuit layer 12 is formed on one surface of the first substrate layer 11.

[0062] like Figure 1As shown, the substrate 10 has a first region 14, and the first region 14 is provided with a plurality of first holes 101 penetrating the substrate 10 along the thickness direction. It can be understood that when the substrate 10 has two first circuit layers 12, the first holes 101 penetrate the two first circuit layers 12 and the first substrate layer 11 therebetween along the thickness direction; when the substrate 10 has only one first circuit layer 12, the first holes 101 penetrate the first circuit layer 12 and the first substrate layer 11 along the thickness direction. The plurality of first holes 101 may be arranged in a matrix along the length direction and the width direction of the substrate 10, and the first holes 101 may be circular holes. The first holes 101 may be formed by, but not limited to, mechanical drilling, laser drilling, or chemical etching.

[0063] In some embodiments, the aperture of the first hole 101 is 10 μm to 100 μm, and the spacing between two adjacent first holes 101 is 20 μm to 200 μm. The spacing between two adjacent first holes 101 refers to the distance between the centers of the two adjacent first holes 101. The first hole 101 can be used as a heat dissipation hole to provide a heat dissipation channel for the component, and multiple first holes 101 can form a heat dissipation network to improve the heat dissipation efficiency.

[0064] In some embodiments, the material of the first substrate layer 11 may be, but is not limited to, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate diformic acid glycol ester (PEN), polydimethylsiloxane (PDMS) and liquid crystal polymer (LCP). In this embodiment, the material of the first substrate layer 11 is LCP.

[0065] like Figure 2 As shown, a copper clad laminate 20 is stacked on at least one side of the substrate 10 along the thickness direction of the substrate 10. In this embodiment, there are two copper clad laminates 20, which are stacked on the upper and lower sides of the substrate 10 respectively. In other embodiments, the copper clad laminate 20 can also be stacked only on the upper side or the lower side of the substrate 10. The copper clad laminate 20 includes a second substrate layer 21 and a copper foil layer 22. Compared with the copper foil layer 22, the second substrate layer 21 is closer to the substrate 10. The copper clad laminate 20 is provided with a through groove 201 that penetrates the copper clad laminate 20 along the thickness direction, and the through groove 201 is arranged corresponding to the first area 14. The orthographic projection area of ​​the through groove 201 on the substrate 10 may be larger than the area of ​​the first area 14.

[0066] like Figure 2As shown, in some embodiments, a first adhesive layer 23 may be stacked between the copper clad laminate 20 and the substrate 10. In other embodiments, the first adhesive layer 23 may also be omitted. The first adhesive layer 23 is located between the first circuit layer 12 and the second substrate layer 21. The first adhesive layer 23 is provided with a first through hole 230 that penetrates the first adhesive layer 23 along the thickness direction, and the first through hole 230 is connected to the through groove 201. The first adhesive layer 23 may be, but is not limited to, epoxy-based pure glue (Bonding Sheet, BS). The first adhesive layer 23 can improve the connection stability between the copper clad laminate 20 and the substrate 10.

[0067] like Figure 3 As shown, a fast press machine (not shown) can be used to press the copper clad laminate 20 and the substrate 10. The first adhesive layer 23 can flow and fill the gap of the first circuit layer 12, covering the surface of the first substrate layer 11 exposed from the first circuit layer 12. The first area 14 is exposed from the first through hole 230 and the through groove 201. It can be understood that when the first adhesive layer 23 is omitted, the first area 14 can be directly exposed from the through groove 201.

[0068] See also Figure 4 , step S20, the copper foil layer 22 is formed into a second circuit layer 24. The second circuit layer 24 can be formed by an image transfer process and an etching process. It can be understood that when the second circuit layer 24 is formed, a conductive structure 25 can also be formed at the same time, and the second circuit layer 24 can be electrically connected to the first circuit layer 12 through the conductive structure 25. The number of the conductive structures 25 can be multiple, and this application does not limit it.

[0069] See also Figure 5 , step S30, a component 30 is arranged in the through groove 201, and the component 30 is electrically connected to the first circuit layer 12. The component 30 can be electrically connected to the first circuit layer 12 by, but not limited to, welding. It can be understood that when there is a first adhesive layer 23, the component 30 is arranged in the through groove 201 and the first through hole 230 of the first adhesive layer 23. When two copper clad boards 20 are pressed together in step S10, the component 30 is arranged in the through groove 201 on any one of the copper clad boards 20. The component 30 can completely cover the first area 14.

[0070] Component 30 may be a high power consumption component or a common component, which is not limited in this application. Component 30 may be an active component (also called an active device, such as a tube, a transistor, an integrated circuit, etc.) or a passive component (also called a passive device, such as a resistor, an inductor, a capacitor, etc.), which is not limited in this application. Component 30 may also be a 3D assembly part packaged by POP (package-on-package), SIP (System In a Package), etc.

[0071] See also Figure 6 , step S40, disposing a cooling medium 40 in the first hole 101 and on the surface of the substrate 10 away from the component 30. The cooling medium 40 in the first hole 101 contacts the cooling medium 40 on the surface of the substrate 10. The cooling medium 40 formed on the surface of the substrate 10 away from the component 30 covers the component 30 in the orthographic projection along the thickness direction on the substrate 10. The cooling medium 40 in the first hole 101 is adjacent to the component 30, and the heat dissipated by the component 30 can be directly transferred to the cooling medium 40 in the first hole 101, and transferred to the cooling medium 40 on the surface of the substrate 10, thereby improving the heat dissipation efficiency.

[0072] It can be understood that when two copper clad laminates 20 are pressed together in step S10, the cooling medium arranged on the surface of the substrate 10 facing away from the component 30 is arranged in the through groove 201 of the other copper clad laminate 20 (the copper clad laminate 20 without the component 30) (if there is a first adhesive layer 23, it is arranged in the through groove 201 and the first through hole 230).

[0073] In some embodiments, the cooling medium 40 may be a material with high thermal conductivity and high specific heat capacity, such as a fluorine-containing compound.

[0074] See also Figure 7 , step S50, a protective film 50 is provided on the surface of the second circuit layer 24 away from the second substrate layer 21 to obtain a circuit board 100 with embedded components. The protective film 50 has a second region 51, and the second region 51 is provided with a plurality of second holes 501 penetrating the protective film 50 along the thickness direction. The second region 51 is provided corresponding to the through groove 201 and covers the component 30. The protective film 50 can prevent dust, conductive foreign matter, water, etc. from damaging the component 30, and the protective film 50 has a certain flexibility, and can protect the component 30 when the circuit board falls. In addition, the porous design of the second region 51 can enhance the heat dissipation effect of the component 30.

[0075] In some embodiments, the second hole 501 is a circular hole. The plurality of second holes 501 may be arranged in a matrix along the length and width directions of the protective film 50. The aperture of the second hole 501 is 5 μm to 30 μm, and the spacing between two adjacent second holes 501 is 10 μm to 60 μm. The spacing between two adjacent second holes 501 refers to the distance between the centers of the two adjacent second holes 501. The plurality of second holes 501 form a heat dissipation network structure, which improves the heat dissipation efficiency of the component 30.

[0076] In some embodiments, the material of the protective film 50 may be, but is not limited to, PET, polytetrafluoroethylene (PTFE), polyethylene (PE), etc. The above materials have a certain toughness and can protect the component 30 when the circuit board falls.

[0077] In some embodiments, such as Figure 7 As shown, when the protective film 50 is pressed, a second adhesive layer 52 may be provided between the protective film 50 and the second circuit layer 24. The second adhesive layer 52 is provided with a second through hole 520 penetrating the second adhesive layer 52 along the thickness direction. The second through hole 520 is provided corresponding to the component 30 and communicates with the through groove 201. The second adhesive layer 52 may be, but is not limited to, epoxy-based pure glue.

[0078] In some embodiments, such as Figure 7 As shown, a third adhesive layer 53 and a protective film 54 may also be provided on the surface of the cooling medium 40 away from the substrate 10. The protective film 54 is located on the surface of the third adhesive layer 53 away from the cooling medium 40. In addition to bonding the cooling medium 40, the third adhesive layer 53 may also bond the surface of the second circuit layer 24 away from the second substrate layer 21, and the orthographic projection of the protective film 54 may also cover the surface of the second circuit layer 24 away from the second substrate layer 21. The protective film 54 is dustproof and waterproof, and has a protective effect on the internal circuit layer and components. The third adhesive layer 53 may be, but is not limited to, epoxy-based pure glue. The material of the protective film 54 may be, but is not limited to, PET, PTFE, and PE.

[0079] In some embodiments, such as Figure 7 As shown, the third adhesive layer 53 and the protective film 54 have a third region 55, and the third region 55 is arranged corresponding to the cooling medium 40. The third region 55 is provided with a plurality of third holes 550, and the third holes 550 penetrate the third adhesive layer 53 and the protective film 54 along the thickness direction.

[0080] In some embodiments, the third hole 550 is a circular hole. Multiple third holes 550 may be arranged in a matrix along the length and width directions of the protective film 55. The aperture of the third hole 550 may be the same as or different from the aperture of the second hole 501, and the aperture of the third hole 550 may be 5μm to 30μm, and the spacing between two adjacent third holes 550 is 10μm to 60μm. The spacing between two adjacent third holes 550 refers to the distance between the centers of the two adjacent third holes 550. Multiple third holes 550 form a heat dissipation network structure, which helps to dissipate the heat absorbed by the cooling medium 40.

[0081] See also Figure 7 In a second aspect, the present application provides a circuit board 100 with embedded components, which is prepared by the above-mentioned preparation method. The circuit board 100 with embedded components includes a substrate 10, a component 30, a cooling medium 40, a protective film 50 and an outer circuit board 60.

[0082] like Figure 7As shown, the substrate 10 includes a first substrate layer 11 and a first circuit layer 12 formed on at least one surface of the first substrate layer 11. In this embodiment, the first circuit layer 12 is formed on both the upper and lower surfaces of the first substrate layer 11, and the two first circuit layers 12 can be electrically connected through the conductive structure 13. In other embodiments, the substrate 10 can also be a single-layer board, that is, the first circuit layer 12 is formed on one surface of the first substrate layer 11. The substrate 10 has a first area 14, and the first area 14 is provided with a plurality of first holes 101 that penetrate the substrate 10 along the thickness direction. The plurality of first holes 101 can be arranged in a matrix along the length direction and the width direction of the substrate 10, and the first holes 101 can be circular holes. The first holes 101 can be formed by, but not limited to, mechanical drilling, laser drilling, and chemical etching.

[0083] In some embodiments, the aperture of the first hole 101 is 10 μm to 100 μm, and the spacing between two adjacent first holes 101 is 20 μm to 200 μm. The spacing between two adjacent first holes 101 refers to the distance between the centers of the two adjacent first holes 101. The first hole 101 can be used as a heat dissipation hole to provide a heat dissipation channel for the component 30, and multiple first holes 101 can form a heat dissipation network to improve the heat dissipation efficiency.

[0084] like Figure 7 As shown, the outer circuit board 60 is disposed on at least one surface of the substrate 10. The outer circuit board 60 includes a second substrate layer 21 and a second circuit layer 24 formed on the surface of the second substrate layer 21, and the second substrate layer 21 is located between the first circuit layer 12 and the second circuit layer 24. The outer circuit board 60 is provided with a through groove 201 that penetrates the outer circuit board 60 in the thickness direction, and the through groove 201 corresponds to the first area 14.

[0085] In some embodiments, such as Figure 7 As shown, a first adhesive layer 23 may be further provided between the substrate 10 and the outer circuit board 60. In other embodiments, the first adhesive layer 23 may also be omitted. The first adhesive layer 23 is located between the first circuit layer 12 and the second substrate layer 21, and the first adhesive layer 23 is provided with a first through hole 230 penetrating the first adhesive layer 23 in the thickness direction, and the first through hole 230 is connected to the through groove 201.

[0086] like Figure 7 As shown, the element 30 is disposed in the through groove 201 and is electrically connected to the first circuit layer 12. It is understood that when the first adhesive layer 23 is present, the element 30 is disposed in the through groove 201 and the first through hole 230 of the first adhesive layer 23. The element 30 can completely cover the first area 14.

[0087] like Figure 7As shown, the cooling medium 40 is disposed in the first hole 101 and on the surface of the substrate 10 away from the component 30, and the orthographic projection of the cooling medium 40 on the substrate 10 covers the component 30. The cooling medium 40 in the first hole 101 contacts the cooling medium 40 on the surface of the substrate 10. The cooling medium 40 formed on the surface of the substrate 10 away from the component 30 can completely cover the component 30 with its orthographic projection on the substrate 10.

[0088] like Figure 7 As shown, the protective film 50 is disposed on the surface of the second circuit layer 24 away from the second substrate layer 21. The protective film 50 has a second region 51, and the second region 51 is provided with a plurality of second holes 501 penetrating the protective film 50 along the thickness direction. The second region 51 is arranged corresponding to the through groove 201 and covers the component 30. The protective film 50 can prevent dust, conductive foreign matter, water, etc. from damaging the component 30, and the protective film 50 has a certain degree of flexibility, and can protect the component 30 when the circuit board falls. In addition, the porous design of the second region 51 can enhance the heat dissipation effect of the component 30.

[0089] In some embodiments, the second hole 501 is a circular hole. The plurality of second holes 501 may be arranged in a matrix along the length and width directions of the protective film 50. The aperture of the second hole 501 is 5 μm to 30 μm, and the spacing between two adjacent second holes 501 is 10 μm to 60 μm. The spacing between two adjacent second holes 501 refers to the distance between the centers of the two adjacent second holes 501. The plurality of second holes 501 form a heat dissipation network structure, which improves the heat dissipation efficiency of the component 30.

[0090] In some embodiments, such as Figure 7 As shown, a second adhesive layer 52 is provided between the protective film 50 and the second circuit layer 24. The second adhesive layer 52 is provided with a second through hole 520 penetrating the second adhesive layer 52 along the thickness direction. The second through hole 520 is provided corresponding to the component 30 and communicates with the through groove 201. The second adhesive layer 52 can be, but is not limited to, epoxy-based pure glue.

[0091] In some embodiments, such as Figure 7 As shown, the embedded component circuit board 100 further includes conductive structures 13 and 25. The conductive structure 13 electrically connects the two first circuit layers 12 on the substrate 10. The conductive structure 25 electrically connects the second circuit layer 24 and the first circuit layer 12.

[0092] The present application sets a cooling medium 40 on the back of the component 30 (inside the first hole 101 and the surface of the substrate 10 facing away from the component 30), and the heat emitted by the component 30 can be absorbed by the cooling medium, thereby achieving the purpose of heat dissipation of the component 30. The present application sets the component 30 in the through groove 201 of the outer circuit board 60, that is, sets the component 30 in an embedded manner, thereby reducing the size of the circuit board. The present application sets protective films 50 and 54 and forms a porous design on the protective films 50 and 54, which can not only prevent dust and water, protect the component 30 and the circuit layer, but also play a role in heat dissipation, further improving the heat dissipation efficiency.

[0093] The above descriptions are some specific implementations of the present application, but they are not limited to these implementations in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A method for preparing a circuit board with embedded components, characterized in that: The preparation method comprises the following steps: A copper-clad laminate is laminated on at least one side of a substrate, wherein the substrate comprises a first substrate layer and a first circuit layer formed on at least one surface of the first substrate layer, the substrate has a first region, and the first region is provided with a plurality of first holes penetrating the substrate in a thickness direction; the copper-clad laminate comprises a second substrate layer and a copper foil layer, the second substrate layer is located between the first circuit layer and the copper foil layer, the copper-clad laminate is provided with a through groove penetrating the copper-clad laminate in a thickness direction, and the first region is exposed from the through groove; The copper foil layer is manufactured into a second circuit layer, wherein the second circuit layer is electrically connected to the first circuit layer; Arranging a component in the through groove, wherein the component is electrically connected to the first circuit layer; Disposing a cooling medium in the first hole and on the surface of the substrate facing away from the element, wherein the orthographic projection of the cooling medium on the substrate covers the element; A protective film is provided on the surface of the second circuit layer facing away from the second substrate layer to obtain the embedded component circuit board; wherein the protective film has a second area, the second area is provided with a plurality of second holes penetrating the protective film along the thickness direction, and the second area is provided corresponding to the through groove and covers the component.

2. The preparation method according to claim 1, characterized in that The aperture of the first hole is 10 μm to 100 μm, and the distance between two adjacent first holes is 20 μm to 200 μm.

3. The preparation method according to claim 1, characterized in that: The diameter of the second hole is 5 μm to 30 μm, and the distance between two adjacent second holes is 10 μm to 60 μm.

4. The preparation method according to claim 1, characterized in that: In the step of laminating the copper clad laminate on at least one side of the substrate, a first adhesive layer is provided between the substrate and the copper clad laminate, the first adhesive layer is located between the first circuit layer and the second base material layer, the first adhesive layer is provided with a first through hole penetrating the first adhesive layer along the thickness direction, the first through hole is connected to the through groove, and the first area is exposed from the first through hole and the through groove.

5. The preparation method according to claim 1, characterized in that: In the step of setting a protective film on the side of the second circuit layer away from the second substrate layer, a second adhesive layer is provided between the protective film and the second circuit layer, and the second adhesive layer is provided with a second through hole penetrating the second adhesive layer along the thickness direction, and the second through hole is provided corresponding to the component.

6. A circuit board with embedded components, characterized in that: include: A substrate, comprising a first substrate layer and a first circuit layer formed on at least one surface of the first substrate layer, wherein the substrate has a first region, and the first region is provided with a plurality of first holes penetrating the substrate in a thickness direction; an outer layer circuit board, arranged on at least one surface of the substrate, the outer layer circuit board comprising a second base material layer and a second circuit layer formed on the surface of the second base material layer, the second base material layer being located between the first circuit layer and the second circuit layer, the outer layer circuit board being provided with a through groove penetrating the outer layer circuit board in a thickness direction, the through groove corresponding to the first region; An element, disposed in the through groove and electrically connected to the first circuit layer; A cooling medium is disposed in the first hole and on a surface of the substrate facing away from the element, wherein an orthographic projection of the cooling medium on the substrate covers the element; and A protective film is arranged on the surface of the second circuit layer away from the second substrate layer. The protective film has a second area. The second area is provided with a plurality of second holes penetrating the protective film along the thickness direction. The second area is arranged corresponding to the through groove and covers the component.

7. The embedded component circuit board according to claim 6, characterized in that: The diameter of the first hole is 10 μm to 100 μm, and the distance between two adjacent first holes is 20 μm to 200 μm; the diameter of the second hole is 5 μm to 30 μm, and the distance between two adjacent second holes is 10 μm to 60 μm.

8. The embedded component circuit board according to claim 6, characterized in that: The embedded component circuit board further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located between the first circuit layer and the second substrate layer, and the second adhesive layer is located between the protective film and the second circuit layer.

9. The embedded component circuit board according to claim 8, characterized in that: The first adhesive layer is provided with a first through hole penetrating the first adhesive layer along the thickness direction, and the first through hole is arranged corresponding to the through groove; the second adhesive layer is provided with a second through hole penetrating the second adhesive layer along the thickness direction, and the second through hole is arranged corresponding to the element.

10. The embedded component circuit board according to claim 6, characterized in that: The embedded component circuit board also includes a conductive structure, and the conductive structure electrically connects the first circuit layer and the second circuit layer.

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