Film pressing device and film pressing method
By introducing clamping parts and guiding mechanisms into the film pressing device, the problem of flexural sagging that may occur in the film pressing operation of the thin substrate is solved, and the stability of the substrate after the film adsorption is restored is achieved, and the reliability of the film pressing operation is improved.
Patent Information
- Application Number
- CN202311329017.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-13
- Publication Date
- 2025-04-15
AI Technical Summary
When the thin and light substrate is transported to the film pressing roller, it may cause flexion and sagging, resulting in the inability to perform the film pressing operation smoothly.
A film pressing device is designed, including a clamping member and a guide mechanism. The clamping member is used to clamp the substrate and move relative to the film pressing roller, pulling the substrate to the film pressing working area to prevent the substrate from flexing and sagging after the film adsorption member is returned to position.
By clamping the substrate, the substrate can be ensured to be able to carry out the film pressing operation stably after the film adsorption member is restored to the position, avoiding the phenomenon of flexion and sagging, and improving the reliability of the film pressing operation.
Smart Images
Figure CN119835880A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a laminating device and a laminating method for laminating a film material onto a substrate. Background Art
[0002] As electronic devices become smaller and more high-performance, electronic circuit substrates carried by electronic devices widely use multilayered circuit substrates, i.e., so-called multilayer boards (Multilayer PCBs). Multilayer boards are formed by alternately stacking multiple layers, with circuits with concave and convex shapes printed on the surfaces of some layers, and some other layers are insulating resin films. For example, in order to manufacture a multilayer board with a multilayer structure, the following steps must be repeated: a step of forming a circuit pattern on a substrate, a step of stacking a resin film on the substrate, and a step of hardening the resin film.
[0003] The accumulation of multiple layers can be accomplished by a lamination device. For an existing lamination device that uses a lamination roller to press the film material onto a substrate, as the substrate tends to become thinner and lighter, when the substrate is transported close to the lamination roller, the front end of the substrate may bend and sag, making it impossible to smoothly perform the lamination operation. Summary of the invention
[0004] In view of the above problems, the present invention provides a lamination device, which helps to solve the problem that the front end of the thin substrate is bent and drooped, making it difficult to perform the lamination operation smoothly. The present invention also provides a lamination method.
[0005] The film pressing device disclosed in the present invention comprises a film material supply mechanism, a film pressing roller, a substrate carrying platform and a clamping member. The film material supply mechanism is used to supply film material. The film pressing roller is arranged corresponding to the film material supply mechanism, and the film pressing roller is used to press the film material onto the substrate. The substrate carrying platform is arranged corresponding to the film material supply mechanism, and the substrate carrying platform is used to carry the substrate. The clamping member is arranged corresponding to the substrate carrying platform. The clamping member is used to clamp the substrate and can move relative to the film pressing roller to pull the substrate from the substrate carrying platform to the film pressing working area around the film pressing roller.
[0006] The lamination method disclosed in the present invention comprises: absorbing the film material by a film material absorbing member and moving the film material close to a substrate to pre-attach the film material to the substrate; stopping the film material absorbing member from absorbing the film material; clamping the substrate by a clamping member; pulling the substrate to a lamination working area around a lamination roller by the clamping member; and laminating the film material to the substrate by the lamination roller.
[0007] The present invention also discloses a laminating device comprising a laminating roller, a clamping member and a guiding mechanism. The laminating roller is used to press the film material onto the substrate. The clamping member is used to clamp the substrate and can move relative to the laminating roller to pull the substrate to the laminating working area around the laminating roller. The guiding mechanism and the clamping member are fixedly arranged. The guiding mechanism is used to guide the movement of the substrate, and the clamping member and the guiding mechanism can rotate relative to the laminating roller together.
[0008] According to the lamination device and lamination method disclosed in the present invention, the lamination device includes a clamping member for clamping the substrate and pulling it to the lamination working area. In the lamination method disclosed in the present invention, the film material adsorbing member can provide support to the substrate when pre-attaching the film material to the substrate, but the support will be lost after the film material adsorbing member is returned to its position. Therefore, the lamination device disclosed in the present invention clamps the substrate with the clamping member, so that the substrate can still be prevented from bending and sagging after the film material adsorbing member is returned to its position.
[0009] In addition, the laminating device may further include a guiding mechanism, which is fixedly arranged with the clamping member so that the positions of the clamping member and the guiding mechanism can be interchanged to share a space, thereby facilitating the realization of a small size of the laminating device.
[0010] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention and to provide further explanation of the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 FIG. 4 is a schematic diagram of a lamination device according to an embodiment of the present invention.
[0012] Figures 2 to 9 FIG. 4 is a schematic diagram of a lamination method according to an embodiment of the present invention. DETAILED DESCRIPTION
[0013] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and any person skilled in the art can easily understand the present invention according to the contents, claims and drawings disclosed in this specification. The following examples further illustrate the viewpoints of the present invention in detail, but are not intended to limit the scope of the present invention in any viewpoint.
[0014] Please refer to Figure 1 , is a schematic diagram of a lamination device according to an embodiment of the present invention. In this embodiment, the lamination device 1 includes a film material supply mechanism 10, a substrate support platform 20, a lamination roller 30, a clamping member 40, and a guiding mechanism 50. The lamination device 1 of this embodiment includes two film material supply mechanisms 10 and two lamination rollers 30 to implement double-sided lamination of a substrate (not shown), but the present invention is not limited thereto. In some other embodiments, the lamination device 1 may include one film material supply mechanism 10 and one lamination roller 30 to implement single-sided lamination of a substrate.
[0015] The film material supply mechanism 10 includes a film material conveying roller 110 , a first film material adsorbing component 120 , a cutter 130 , a second film material adsorbing component 140 and a film material leveling component 150 .
[0016] The film material conveying roller 110 is used to supply film material (not shown). Specifically, the film material conveying roller 110 may be a roller provided with a film material roll, or a roller that conveys the film material to the first film material adsorbing member 120 in a predetermined feeding direction.
[0017] The first film material adsorbing member 120 is, for example but not limited to, a suction cup plate with negative pressure holes, which is disposed corresponding to the film material conveying roller 110. The first film material adsorbing member 120 is used to adsorb the film material provided from the film material conveying roller 110.
[0018] The cutter 130 is, for example but not limited to, a wire cutter or a rolling cutter, which is disposed corresponding to the first film material adsorbing component 120 , and is used to cut the film material.
[0019] The second film material adsorbing member 140 is, for example but not limited to, a suction nozzle with a negative pressure hole, which is disposed corresponding to the cutter 130. The second film material adsorbing member 140 is used to adsorb the film material cut by the cutter 130.
[0020] The film material leveling member 150 is, for example but not limited to, a plate member having an arc-shaped surface, and is disposed corresponding to the first film material adsorbing member 120. The film material leveling member 150 is used to adjust the feeding direction of the film material.
[0021] The substrate carrier 20 is disposed corresponding to the film material supply mechanism 10, and is used to carry the substrate. The substrate carrier 20 may include a plurality of rollers 210 capable of carrying and conveying the substrate. The first film material adsorbing member 120 may move relative to the substrate carrier 20 to drive the film material to approach the substrate disposed on the substrate carrier 20.
[0022] The laminating roller 30 is, for example but not limited to, a roller having a soft material outer layer or an inflatable outer layer, and is disposed corresponding to the film material supply mechanism 10. The laminating roller 30 is used to press the film material onto the substrate.
[0023] The clamping member 40 is, for example but not limited to, a clamping claw, which is disposed corresponding to the substrate carrier 20. The clamping member 40 is used to clamp the substrate and can move relative to the lamination roller 30 to pull the substrate from the substrate carrier 20 to the lamination working area 310 around the lamination roller 30.
[0024] The guide mechanism 50 and the clamping member 40 are fixedly arranged. Specifically, the guide mechanism 50 may include a plurality of rollers 510 for guiding the movement of the substrate, and the guide mechanism 50 and the clamping member 40 may be locked to a rotatable base 60 adjacent to the lamination roller 30. The guide mechanism 50 is used to guide the movement of the substrate, and the clamping member 40 and the guide mechanism 50 may rotate relative to the lamination roller 30 together through the rotatable base 60.
[0025] In this embodiment, the film material flattening member 150 of the film material supply mechanism 10 is rotatably arranged and has a standby state and a working state. Figures 2 to 5 The film material flattening member 150 in working state can refer to Figures 6 to 9 As shown. In the standby state, the film material leveling member 150 provides a first space that allows the clamping member 40 to be accommodated. In the working state, the film material leveling member 150 reduces the first space to a second space, and the second space allows the film material and the substrate to be accommodated.
[0026] In this embodiment, the laminating roller 30 is arranged to be liftable and has a standby state and a working state. The laminating roller 30 in the standby state can refer to Figures 2 to 6 The film material flattening member 150 in working state can refer to Figures 7 to 9 As shown. In the standby state, the lamination roller 30 provides a first space that allows the clamping member 40 to be accommodated. In the working state, the lamination roller 30 reduces the first space to a second space, and the second space allows the substrate with the film material laminated thereon to be accommodated.
[0027] The following describes a lamination method performed using the lamination apparatus. Figures 2 to 9 The figure is a schematic diagram of a lamination method according to an embodiment of the present invention. The figure shows lamination of film materials on the upper and lower surfaces of a substrate, but in order to simplify the content and facilitate understanding, the following process only describes lamination of film materials on one surface of the substrate, and the description of lamination of film materials on the other surface is omitted.
[0028] like Figure 2 and Figure 3 As shown, the first film material adsorbing member 120 of the film material supply mechanism 10 adsorbs the film material 101, and moves the film material 101 close to the substrate 100 to pre-attach the film material 101 to the substrate 100. Further, the substrate 100 is, for example but not limited to, a circuit board, a silicon wafer or a glass plate, and the film material 101 is, for example but not limited to, an ABF film, a dry film or a metal foil. Figure 3 As shown, the film material 101 is provided to the first film material adsorbing member 120 by the film material conveying roller 110. The first film material adsorbing member 120 adsorbs the film material 101 and descends close to the substrate 100 carried on the substrate carrying platform 20, so as to pre-attach the end of the film material 101 to the surface of the substrate 100. Figure 3 In the embodiment, the first film material adsorbing member 120 at the bottom can provide a certain degree of support to the substrate 100, so that the substrate 100 will not bend or sag.
[0029] like Figure 4As shown, the substrate 100 is clamped by the clamping member 40. Specifically, the film material leveling member 150 in the standby state provides a space S151 (a first space of the film material leveling member 150) between the upper and lower film material leveling members 150. In addition, the laminating roller 30 in the standby state provides a space S31 (a first space of the laminating roller 30) between the upper and lower laminating rollers 30. The spaces S151 and S31 allow the clamping member 40 to be accommodated, that is, the gap between the two film material leveling members 150 and the gap between the two laminating rollers 30 are large enough, so that the clamping member 40 can pass through the spaces S151 and S31 and then move around the substrate 100. The clamping member 40 can be extended through the spaces S151 and S31 by a power source (not shown) such as a hydraulic cylinder or a stepping motor.
[0030] In this embodiment, the substrate 100 is clamped by the clamping member 40 before the first film material adsorbing member 120 stops adsorbing the film material 101. Figure 4 In the embodiment, when the clamping member 40 clamps the substrate 100 , the first film material adsorbing member 120 still keeps adsorbing the film material 101 , which can prevent the substrate 100 from bending and sagging due to the fact that the clamping member 40 fails to clamp the substrate 100 in time.
[0031] like Figure 5 As shown, the first film material adsorbing member 120 stops adsorbing the film material 101. Further, the first film material adsorbing member 120 stops adsorbing the film material 101 and returns to the state as shown. Figure 2 As the first film material adsorbing member 120 returns to its original position, the substrate 100 loses the support provided by the first film material adsorbing member 120 below, but because the clamping member 40 clamps the substrate 100, the substrate 100 can still be prevented from bending and sagging.
[0032] In addition, in this embodiment, the clamping member 40 clamps the substrate 100 but does not clamp the film material 101 located on the upper and lower surfaces of the substrate 100, but the present invention is not limited thereto. In some other embodiments, if the end of the film material 101 located on the lower surface of the substrate 100 is prone to droop due to its own weight and peel off the lower surface of the substrate 100 after the first film material adsorbing member 120 stops adsorbing, the clamping member 40 can clamp the substrate 100 and the end of the film material 101 at the same time.
[0033] like Figure 6 As shown, the substrate 100 is pulled to the lamination working area 310 around the lamination roller 30 by the clamping member 40. Further, the clamping member 40 is driven to return to its original position by the power source, thereby pulling the substrate 100 from the substrate carrying platform 20 to between the two film material leveling members 150 and between the two lamination rollers 30. Figure 5 and Figure 6As shown, after the clamping member 40 leaves the space S151, the two film material leveling members 150 rotate and move closer to each other and change from the standby state to the working state. The space S151 is reduced to a space S152 (a second space of the film material leveling member 150) because the two film material leveling members 150 in the working state move closer to each other. The space S152, which is narrower than the space S151, cannot accommodate the clamping member 40 but allows the film material 101 and the substrate 100 to be accommodated. The film material 101 is pressed onto the surface of the substrate 100 by the film pressing roller 30 in the film pressing working area 310. The film material leveling member 150 in the working state helps to make the film material 101 that has not yet been attached to the surface of the substrate 100 closer to the substrate 100, which is beneficial to the subsequent pressing operation.
[0034] like Figure 7 As shown, the film material 101 is pressed onto the substrate 100 by the lamination roller 30. Specifically, after the clamping member 40 leaves the space S31, the two lamination rollers 30 are driven to move closer to each other by the power source, thereby changing from the standby state to the working state. The space S31 is reduced to a space S32 (a second space of the lamination roller 30) because the two lamination rollers 30 in the working state move closer to each other. The space S32, which is narrower than the space S31, facilitates the lamination of the film material 101 onto the surface of the substrate 100. When the lamination roller 30 is in the working state to perform the pressing operation, the clamping member 40 can be as shown in FIG. Figure 7 The substrate 100 is shown to be released, or the substrate 100 is kept clamped.
[0035] like Figure 7 and Figure 8 As shown, the clamping member 40 releases the substrate 100, and the clamping member 40 and the guide mechanism 50 rotate together to allow the guide mechanism 50 to adjust the moving direction of the substrate 100. Further, the rotatable base 60 rotates to move the guide mechanism 50 to the position where the clamping member 40 was previously located, and the guide mechanism 50 corresponds to the substrate 100.
[0036] Changing the positions of the clamping member 40 and the guiding mechanism 50 by the rotatable base 60 is merely exemplary. In some other embodiments, the positions of the clamping member and the guiding mechanism may also be changed by other moving means such as a linear lifting platform or a linear translation platform.
[0037] like Fig. 9 As shown, after the lamination roller 30 completes the lamination operation, the cutter 130 cuts off the film material 101, and the second film material adsorbing member 140 can adsorb the end of the film material 101 adsorbed by the first film material adsorbing member 120 to prevent the film material 101 from shaking. After another substrate is placed on the substrate carrying platform 20, the lamination operation for the other substrate can be performed.
[0038] In summary, according to the lamination device and lamination method disclosed in the present invention, the lamination device includes a clamping member for clamping the substrate and pulling it to the lamination working area. In the lamination method disclosed in the present invention, the film material adsorbing member (such as the first film material adsorbing member in each embodiment) can provide support to the substrate when the film material is pre-attached to the substrate, but the support will be lost after the film material adsorbing member is returned to its position. Therefore, the lamination device disclosed in the present invention clamps the substrate with a clamping member, so that the substrate can still be prevented from bending and sagging after the film material adsorbing member is returned to its position.
[0039] In addition, the laminating device may further include a guiding mechanism, which is fixedly arranged with the clamping member so that the positions of the clamping member and the guiding mechanism can be interchanged to share a space, thereby facilitating the realization of a small size of the laminating device.
[0040]
Explanation of symbols
[0041] 1: Film pressing device
[0042] 10: Film material supply mechanism
[0043] 110: Film material conveying roller
[0044] 120: First film material adsorption part
[0045] 130: Cutter
[0046] 140: Second film material adsorption part
[0047] 150: Film leveling parts
[0048] 20: Substrate carrier
[0049] 210:Roller
[0050] 30: Lamination roller
[0051] 310: Lamination work area
[0052] 40: Clamping piece
[0053] 50: Guidance Agency
[0054] 510:Roller
[0055] 60: Rotatable base
[0056] 100:Substrate
[0057] 101: Film material
[0058] S151, S152, S31, S32: space.
Claims
1. A lamination device, characterized in that: Include: A film material supply mechanism, used for supplying film material; A film pressing roller is provided corresponding to the film material supply mechanism, and is used for pressing the film material onto the substrate; A substrate carrying platform is provided corresponding to the film material supply mechanism, and the substrate carrying platform is used to carry the substrate; as well as The clamping member is arranged corresponding to the substrate carrying platform, and is used for clamping the substrate and can move relative to the lamination roller to pull the substrate from the substrate carrying platform to the lamination working area around the lamination roller.
2. The laminating device according to claim 1, wherein the film material supply mechanism comprises: Film material conveying roller; a first film material adsorbing member, arranged corresponding to the film material conveying roller, and used for adsorbing the film material provided from the film material conveying roller, and the first film material adsorbing member can move relative to the substrate carrying platform to drive the film material to approach the substrate; and The film material leveling component is arranged corresponding to the first film material adsorbing component.
3. The laminating device according to claim 2, wherein the film material supply mechanism further comprises: a cutter, disposed corresponding to the first film material adsorbing member, and used for cutting the film material; and The second film material adsorbing component is arranged corresponding to the cutter, and is used for adsorbing the film material cut by the cutter.
4. The laminating device according to claim 2, wherein the film material flattening member is rotatably arranged to have a standby state and a working state, In the standby state, the film flattening member provides a first space allowing the clamping member to be accommodated, and In the working state, the film material leveling member reduces the first space into a second space, and the second space is capable of accommodating the film material and the substrate.
5. The lamination device according to claim 1, wherein: The invention also comprises a guiding mechanism fixedly arranged with the clamping member, the guiding mechanism is used for guiding the movement of the substrate, and the clamping member and the guiding mechanism can rotate together relative to the film pressing roller.
6. The lamination device according to claim 1, wherein the lamination roller is arranged to be raised and lowered and has a standby state and a working state. In the standby state, the lamination roller provides a first space allowing the clamping member to be accommodated, and In the working state, the lamination roller reduces the first space into a second space, and the second space allows the substrate laminated with the film material to be accommodated.
7. A film pressing method, characterized in that: Include: Adsorbing the film material by the film material adsorbing member and moving the film material close to the substrate, so as to pre-attach the film material to the substrate; causing the film material adsorbing member to stop adsorbing the film material; clamping the substrate by a clamping member; Pulling the substrate to a lamination working area around the lamination roller through the clamping member; and The film material is pressed onto the substrate by the lamination roller. 8 . The lamination method according to claim 7 , wherein the substrate is clamped by the clamping member before the film material adsorbing member stops adsorbing the film material.
9. The lamination method according to claim 7, wherein the clamping member is fixedly disposed on the guide mechanism, and the lamination method further comprises: causing the clamp to release the substrate; and The clamping member is rotated together with the guiding mechanism to allow the guiding mechanism to adjust the moving direction of the substrate.
10. A film pressing device, characterized in that: Include: A film pressing roller, used to press the film material onto the substrate; A clamping member, used for clamping the substrate and movable relative to the lamination roller, so as to pull the substrate to a lamination working area around the lamination roller; as well as The guiding mechanism is fixedly arranged with the clamping member, and is used for guiding the movement of the substrate, and the clamping member and the guiding mechanism can rotate together relative to the laminating roller.