Power supply device

Abstract

The invention provides a power supply device. The power supply device includes a housing, a plurality of heat-generating components, and an insulating heat-dissipating resin material. The housing is a box-shaped member which has heat conductivity and is formed in a box shape. The plurality of heating components are accommodated in the housing. The insulating heat-dissipating resin material is filled in the housing.

Description

Technical Field

[0001] The present disclosure relates to a power supply device. Background Art

[0002] In a power supply device used in an inverter mounted on an electric vehicle or the like, as the output of electronic components such as semiconductors mounted on a circuit board increases, the power loss of the electronic components increases. As the power loss increases, the electronic components tend to generate heat, and therefore a structure for efficiently dissipating heat from the electronic components is known.

[0003] For example, Japanese Patent Application Laid-Open No. 2017-108007 discloses a power supply device that dissipates heat from electronic components by arranging a box-shaped aluminum block in a heat dissipation housing. Specifically, a structure is disclosed in which electronic components such as FETs (Field Effect Transistors) are arranged on the outer wall of an aluminum block in contact with the outer wall of the aluminum block, and electronic components such as reactors are arranged in the aluminum block. Summary of the invention

[0004] Problem that the invention aims to solve

[0005] However, in the structure described in Japanese Patent Application Laid-Open No. 2017-108007, since it is necessary to fix the electronic components to the outer wall of the aluminum block and ensure the insulation between the electronic components and the surroundings, the structure near the integrated power module is restricted, and from the perspective of miniaturization of the entire device, it becomes a structure with certain limitations. That is, in the prior art, it is difficult to ensure the heat dissipation of the heat-generating components and miniaturize the entire device.

[0006] The problem to be solved by the present disclosure is to provide a power supply device that can ensure the heat dissipation of heat-generating components and achieve miniaturization of the entire device.

[0007] Solutions for solving problems

[0008] The power supply device of the present disclosure includes: a casing having heat conductivity and formed in a box shape; a plurality of heat generating components accommodated in the casing; and an insulating and heat dissipating resin material filled in the casing. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a perspective view of an example of a power supply device according to the embodiment.

[0010] Figure 2 This is a perspective view of an example of a power conversion device.

[0011] Figure 3 This is a perspective view of an example of a power conversion device.

[0012] Figure 4 This is a cross-sectional view of an example of a power conversion device. DETAILED DESCRIPTION

[0013] Hereinafter, embodiments of the power supply device according to the present embodiment will be described with reference to the drawings.

[0014] Figure 1 It is a perspective view of an example of the power supply device 1 according to the present embodiment.

[0015] The power supply device 1 is a device for supplying electric power and is used in, for example, a vehicle charger or inverter mounted on an electric vehicle or the like.

[0016] The power supply device 1 includes a heat dissipation case 10 , a cover 14 , and a power conversion device 2 .

[0017] The heat dissipation housing 10 is formed into a rectangular parallelepiped shape consisting of a bottom wall and four side walls, and is formed into a box shape that is open upward. The heat dissipation housing 10 is formed of a member with excellent heat conductivity, and is used to dissipate heat from the power conversion device 2 accommodated inside. The heat dissipation housing 10 is formed of a member with excellent heat conductivity. Examples of members with excellent heat conductivity include aluminum, iron, copper, and magnesium.

[0018] A heat sink 12 is formed on the bottom wall of the heat sink housing 10. The cover 14 is a member that covers the opening of the heat sink housing 10. Figure 1 2 shows a cross-sectional view of the heat dissipation case 10 in a rectangular parallelepiped shape cut along a direction perpendicular to the bottom surface of the heat dissipation case 10 on which the heat dissipation fins 12 are provided.

[0019] The power conversion device 2 is accommodated in the heat dissipation casing 10 .

[0020] The power conversion device 2 includes a housing 20 and a circuit board 26. A heat generating component 22 described later and an insulating heat dissipating resin material 24 (described in detail later) described later are housed in the housing 20. The bottom surface of the outer wall of the housing 20 is arranged on the bottom surface of the inner wall side of the heat dissipating housing 10 in a manner in contact with the bottom surface of the inner wall side of the heat dissipating housing 10.

[0021] The circuit substrate 26 is electrically connected to the heat generating component 22 in the housing 20. A predetermined wiring pattern is formed on the circuit substrate 26, and predetermined circuit elements are installed. The circuit substrate 26 is used as a printed circuit board constituting a power conversion circuit by being electrically connected to the heat generating component 22. The power conversion circuit is, for example, a circuit of an on-board charger, an inverter, etc., which is composed of a power factor improvement circuit and a DC / DC converter. Specifically, the circuit substrate 26 of the present embodiment is, for example, a power conversion circuit that corresponds to a high-voltage battery for driving mounted on an electric vehicle, etc. and is capable of high output. The circuit substrate 26 is fixed to a protrusion (not shown) protruding upward from the bottom surface of the inner side of the bottom wall of the heat dissipation housing 10 and the four corners of the upper end of the housing 20 by screw members not shown.

[0022] Figure 2 FIG. 2 is a perspective view of a power conversion device 2 included in the power supply device 1. Figure 2 In FIG. 1 , a portion of the housing 20 is schematically and transparently shown. Figure 3 It is from Figure 2 Observe from different directions Figure 2 A perspective view of the power conversion device 2 is shown. Figure 4 is to move in a certain direction Figure 2 The power conversion device 2 shown is a cross-sectional view obtained by cutting.

[0023] The housing 20 is a box-shaped member having heat conductivity and formed in a box shape. For example, the housing 20 is formed by die casting or the like into a rectangular parallelepiped shape that is open upward and consists of a quadrilateral bottom wall and four side walls that are vertically erected relative to the bottom wall along four sides of the bottom surface outer frame constituting the bottom wall.

[0024] The housing 20 may be made of a material having heat conductivity. For example, the housing 20 may be made of a metal such as aluminum, a resin having heat conductivity, or the like.

[0025] The housing 20 is disposed on the inner wall of the heat dissipation housing 10 in such a manner as to be in contact with the inner wall of the heat dissipation housing 10. Specifically, the bottom surface of the outer wall of the housing 20 is disposed on the bottom surface of the inner wall of the box-shaped heat dissipation housing 10 in such a manner as to be in contact with the bottom surface of the inner wall of the box-shaped heat dissipation housing 10 directly or via a member having heat conductivity.

[0026] An insulating and heat-dissipating resin material 24 and various heat-generating components 22 are accommodated in the housing 20 .

[0027] The heat generating component 22 may be any component that generates heat. The heat generating component 22 is an electronic component that generates heat by supplying power. The heat generating component 22 is, for example, a reactor, a capacitor, a resistor, a relay, a transformer, a diode, and a semiconductor element. The semiconductor element is, for example, a FET (Field Effect Transistor), a thyristor, a bidirectional thyristor, and an IGBT (Insulated Gate Bipolar Transistor).

[0028] The volumes of at least some of the various heat-generating components 22 housed in the housing 20 are different from each other. That is, the "various" means that at least one of the volume of the heat-generating component 22 and the function of the heat-generating component 22 is different. At least one of the various heat-generating components 22 housed in the housing 20 is arranged on the inner wall surface of the housing 20 in a manner of thermally contacting the inner wall surface of the housing 20.

[0029] In this embodiment, the heat generating component 22 is disposed on the inner wall surface in thermal contact with the inner wall surface, which means that the heat generating component 22 is disposed on the inner wall surface in thermal contact with the inner wall surface directly or via a heat conductive member or a heat conductive layer. A heat conductive member is a member having heat conductivity, and a heat conductive layer is a layer having heat conductivity.

[0030] Having heat conductivity means having a property of causing the generated heat energy to move. Specifically, in this embodiment, having heat conductivity means having a thermal conductivity capable of dissipating the heat generated by the heat generating component 22 by transferring the heat generated by the heat generating component 22 to other members or the like.

[0031] In this embodiment, as an example, a mode in which the first heat generating component 22A and the second heat generating component 22B are accommodated in the housing 20 is described. The first heat generating component 22A and the second heat generating component 22B are different types of heat generating components 22 and have different volumes.

[0032] The first heat generating component 22A is a heat generating component 22 having a larger volume than the second heat generating component 22B.

[0033] The first heat generating component 22A is, for example, at least one of a reactor 22A1, a capacitor 22A2, a transformer 22A3, a resistor, and a relay. In this embodiment, as an example, the reactor 22A1, the capacitor 22A2, and the transformer 22A3 are accommodated in the housing 20 as the first heat generating component 22A.

[0034] The second heat generating component 22B is a heat generating component 22 having a smaller volume than the first heat generating component 22A. The second heat generating component 22B is, for example, at least one semiconductor element selected from the group consisting of a diode, a FET, a thyristor, a bidirectional thyristor, and an IGBT.

[0035] Specifically, the second heat-generating component 22B is arranged in a gap formed by the first heat-generating component 22A in the housing 20. In detail, the second heat-generating component 22B is arranged on the inner wall surface of the housing 20 in a manner of thermally contacting the inner wall surface of the housing 20. From the viewpoint of further ensuring the insulation and heat dissipation of the opposite surface of the second heat-generating component 22B facing the inner wall surface of the housing 20, the second heat-generating component 22B is preferably arranged on the insulating heat-dissipating component 28 on the inner wall surface of the housing 20 in a manner of contacting the inner wall surface of the housing 20, and is arranged in a manner of contacting the insulating heat-dissipating component 28. That is, at least one of the plurality of heat-generating components 22 is preferably arranged on the insulating heat-dissipating component 28 on the inner wall surface of the housing 20 in a manner of contacting the inner wall surface of the housing 20, and is arranged in a manner of contacting the insulating heat-dissipating component 28.

[0036] The insulating heat dissipation member 28 may be a member having both insulating properties and heat dissipation properties. The insulating heat dissipation member 28 may be, for example, a ceramic substrate. The insulating heat dissipation member 28 may be bonded and fixed to the inner wall surface of the housing 20 by an adhesive or the like. In addition, the insulating heat dissipation member 28 may be fixed to the inner wall surface of the housing 20 by filling the insulating heat dissipation resin material 24 in the housing 20 while the insulating heat dissipation member 28 is temporarily fixed or temporarily held on the inner wall surface of the housing 20 during assembly.

[0037] The insulating and heat-dissipating resin material 24 is a resin material filled in the case 20 and has insulating and heat-dissipating properties.

[0038] The insulating and heat-dissipating resin material 24 may be any resin having insulating and heat-dissipating properties, but preferably has curing properties. In this embodiment, as an example, the insulating and heat-dissipating resin material 24 having insulating, heat-dissipating and curing properties is described. The insulating and heat-dissipating resin material 24 is sometimes referred to as a potting encapsulation resin material.

[0039] use Figure 4 to explain. Figure 4 The reactor 22A1, the capacitor 22A2, and the transformer 22A3 placed on the housing 20 are arranged in a direction perpendicular to the direction of arrangement. Figure 1 to Figure 3 The power conversion device 2 shown is a cross-sectional view obtained by cutting.

[0040] The insulating and heat-dissipating resin material 24 is filled in the housing 20. For example, after the first heat-generating component 22A and the second heat-generating component 22B are arranged and accommodated in the housing 20, the insulating and heat-dissipating resin material 24 is filled in the housing 20 and cured.

[0041] Therefore, the insulating heat dissipating resin material 24 is filled so as to cover the gaps of the heat generating components 22 accommodated in the housing 20 without any gaps. Therefore, the surfaces of the various heat generating components 22 accommodated in the housing 20 are covered with the insulating heat dissipating resin material 24.

[0042] Specifically, as described above, the second heat generating component 22B is at least one semiconductor element selected from the group consisting of a diode, a FET, a thyristor, a bidirectional thyristor, and an IGBT. Therefore, the wire constituting the second heat generating component 22B as a semiconductor element directly contacts the insulating heat dissipating resin material 24 and is directly covered by the insulating heat dissipating resin material 24. In addition, the first heat generating component 22A is also similarly covered by the insulating heat dissipating resin material 24 on its surface.

[0043] In the power supply device 1 configured as above, the various heat generating components 22 generate heat due to signal transmission and reception between the circuit substrate 26 and each of the various heat generating components 22 in the housing 20. The heat generated from the various heat generating components 22 reaches the heat dissipation housing 10 via the insulating heat dissipation resin material 24 in contact with the heat generating components 22 and the housing 20, and is dissipated from the heat dissipation housing 10 to the outside.

[0044] In detail, the heat generated from the first heat-generating component 22A housed in the housing 20 is transferred to the heat-dissipating housing 10 via the insulating heat-dissipating resin material 24 filled around and the housing 20. The heat dissipation of the first heat-generating component 22A is achieved by the flow of this heat transfer. In addition, the heat generated from the second heat-generating component 22B, which is arranged on the inner wall surface of the housing 20 in thermal contact with the inner wall surface of the housing 20, is transferred to the heat-dissipating housing 10 via the contact area between the second heat-generating component 22B and the insulating heat-dissipating resin material 24, the insulating heat-dissipating resin material 24, and the housing 20. In addition, the heat generated from the second heat-generating component 22B is transferred to the heat-dissipating housing 10 via the insulating heat-dissipating member 28 and the housing 20. The heat dissipation of the second heat-generating component 22B is achieved by the flow of this heat transfer.

[0045] In addition, in the power supply device 1 of the present embodiment, a plurality of heat generating components 22 are accommodated in the housing 20 rather than being accommodated outside the housing 20, and the heat generating components 22 are not arranged on the outer wall of the housing 20. Moreover, in the power supply device 1 of the present embodiment, the insulating heat dissipating resin material 24 is filled in the housing 20. Therefore, in the power supply device 1 of the present embodiment, it is not necessary to package the heat generating components 22 such as semiconductor elements, so that the power conversion device 2 and the power supply device 1 can be greatly miniaturized.

[0046] As described above, the power supply device 1 of this embodiment includes a housing 20, a plurality of heat generating components 22, and an insulating heat dissipating resin material 24. The housing 20 is a box-shaped member having heat conductivity and formed in a box shape. The plurality of heat generating components 22 are accommodated in the housing 20. The insulating heat dissipating resin material 24 is filled in the housing 20.

[0047] Therefore, in the power supply device 1 of the present embodiment, the heat generated from the various heat generating components 22 reaches the heat dissipation housing 10 via the insulating heat dissipation resin material 24 and the housing 20 in contact with the heat generating components 22, and is dissipated by the heat dissipation housing 10. In addition, in the power supply device 1 of the present embodiment, the various heat generating components 22 are accommodated in the housing 20, and the heat generating components 22 are not arranged on the outer wall of the housing 20. In addition, the surface of the heat generating component 22 is covered by the insulating heat dissipation resin material 24 filled in the housing 20. Therefore, it is not necessary to encapsulate the heat generating components 22 such as semiconductor elements, so that the power conversion device 2 and the power supply device 1 can be greatly miniaturized.

[0048] Therefore, the power supply device 1 of the present embodiment can achieve both ensuring the heat dissipation performance of the heat generating component 22 and miniaturization of the entire device.

[0049] In addition, at least one of the plurality of heat generating components 22 is a semiconductor element, and the wire constituting the semiconductor element directly contacts the insulating heat dissipating resin material 24. That is, the surface of the semiconductor element is protected by the insulating heat dissipating resin material 24, and heat is dissipated by the insulating heat dissipating resin material 24. Therefore, by the insulating heat dissipating resin material 24 filled in the housing 20, it is not necessary to resin mold (cover) the surface of the semiconductor element with insulating resin as in the prior art, and the power supply device 1 can be safely and miniaturized.

[0050] According to the power supply device of this embodiment, it is possible to ensure the heat dissipation performance of the heat generating components and to achieve miniaturization of the entire device.

[0051] In addition, the embodiments of the present invention are described above, but the embodiments are presented as examples and are not intended to limit the scope of the invention. The new embodiments and modifications can be implemented in various other ways, and various omissions, substitutions and changes can be made without departing from the scope of the invention. The embodiments, modifications and these modifications are included in the scope and purpose of the invention, and are included in the invention described in the patent claims and the scope equivalent thereto.

[0052] Furthermore, the present technology can also take the following structures.

[0053] (1) A power supply device comprising:

[0054] a housing having heat conductivity and formed in a box shape;

[0055] a plurality of heat generating components, wherein the plurality of heat generating components are accommodated in the housing; and

[0056] The housing is filled with an insulating and heat-dissipating resin material.

[0057] (2) The power supply device according to (1), wherein:

[0058] At least one of the plurality of heat generating components is a semiconductor element,

[0059] The conductive wire constituting the semiconductor element directly contacts the insulating and heat-dissipating resin material.

[0060] (3) The power supply device according to (1) or (2), wherein:

[0061] At least one of the plurality of types of heat generating components is disposed on the inner wall surface of the housing so as to be in thermal contact with the inner wall surface of the housing.

[0062] (4) The power supply device according to any one of (1) to (3), wherein:

[0063] The volumes of at least some of the plurality of heat-generating components are different from each other.

[0064] (5) The power supply device according to any one of (1) to (4), wherein:

[0065] The various heat generating components include:

[0066] a first heat generating component; and

[0067] The second heat generating component has a volume smaller than that of the first heat generating component,

[0068] Wherein, the first heat generating component is disposed in the housing,

[0069] The second heat generating component is disposed in a gap formed by the first heat generating component in the housing.

[0070] (6) The power supply device according to any one of (1) to (5), wherein:

[0071] At least one of the plurality of heat generating components is disposed on an insulating heat dissipating member disposed on an inner wall surface of the housing so as to be in contact with an inner wall surface of the housing, and is disposed so as to be in contact with the insulating heat dissipating member.

[0072] (7) The power supply device according to any one of (1) to (6), comprising:

[0073] A circuit substrate is electrically connected to the heat generating component.

[0074] (8) The power supply device according to any one of (1) to (7), comprising:

[0075] a heat dissipation housing, wherein the heat dissipation housing accommodates the outer shell,

[0076] The housing is disposed on the inner wall of the heat dissipation housing so as to be in contact with the inner wall of the heat dissipation housing.

[0077] (9) The power supply device according to any one of (5) to (8), wherein:

[0078] The power supply device is used as a power conversion device,

[0079] The first heat generating component is at least one of a reactor, a capacitor, a resistor, a relay and a transformer.

[0080] The second heat generating component is at least one semiconductor element selected from the group consisting of a diode, a FET, a thyristor, a bidirectional thyristor and an IGBT.

Claims

1. A power supply device comprising: a housing having heat conductivity and formed in a box shape; a plurality of heat generating components, wherein the plurality of heat generating components are accommodated in the housing; and The housing is filled with an insulating and heat-dissipating resin material.

2. The power supply device according to claim 1, wherein: At least one of the plurality of heat generating components is a semiconductor element, The conductive wire constituting the semiconductor element directly contacts the insulating and heat-dissipating resin material.

3. The power supply device according to claim 1, wherein: At least one of the plurality of types of heat generating components is disposed on the inner wall surface of the housing so as to be in thermal contact with the inner wall surface of the housing.

4. The power supply device according to claim 1, wherein: The volumes of at least some of the plurality of heat-generating components are different from each other.

5. The power supply device according to claim 1, wherein: The various heat generating components include: a first heat generating component; and The second heat generating component has a volume smaller than that of the first heat generating component, Wherein, the first heat generating component is disposed in the housing, The second heat generating component is disposed in a gap formed by the first heat generating component in the housing.

6. The power supply device according to claim 1, wherein: At least one of the plurality of heat generating components is disposed on an insulating heat dissipating member disposed on the inner wall surface of the housing so as to be in contact with the inner wall surface of the housing, and is disposed so as to be in contact with the insulating heat dissipating member.

7. The power supply device according to claim 1, wherein: A circuit substrate is provided, and the circuit substrate is electrically connected to the heat generating component.

8. The power supply device according to claim 1, wherein: A heat dissipation housing is provided, wherein the heat dissipation housing accommodates the outer shell, The housing is disposed on the inner wall of the heat dissipation housing so as to be in contact with the inner wall of the heat dissipation housing.

9. The power supply device according to claim 5, wherein: The power supply device is used as a power conversion device, The first heat generating component is at least one of a reactor, a capacitor, a resistor, a relay and a transformer. The second heat generating component is at least one semiconductor element selected from the group consisting of a diode, a field effect transistor, a thyristor, a bidirectional thyristor and an insulated gate bipolar transistor.

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