Surface mounting method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention provides a mounting method and device, electronic equipment and a storage medium. The method comprises the steps that eccentricity adjustment is conducted on a first camera in the mounting equipment; according to the first center point of the packaging piece and the second center point of the adjusted first camera, the mounting position of a suction nozzle in a suction nozzle mechanism of the mounting equipment is determined; and mounting the suction nozzle according to the mounting position, and sucking the packaging piece based on the mounted suction nozzle so as to mount the packaging piece sucked by the suction nozzle to a target position. Therefore, according to the scheme, the mounting accuracy can be improved, and the mounting quality is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of intelligent assembly technology, and in particular to a mounting method, device, electronic device and storage medium. Background Art

[0002] In the smart cockpit project, the standard size and weight of the chip packaged and integrated in the SIP (System in Package) module are different from those of the standard chip mounted by SMT (Surface Mounted Technology). As a result, when SMT absorbs the chip of SIP, the absorption center of SMT does not coincide with the absorption center of SIP chip, and the weight of SIP exceeds the standard. This is a great challenge for SMT. If it is directly based on SMT absorption, a large number of mounting quality problems will occur. For example, unstable mounting leads to offset, scrap after passing the furnace, etc., which affects the production efficiency of SMT and increases production costs. The mounting defect rate will increase significantly. Summary of the invention

[0003] In view of this, embodiments of the present application provide a mounting method, device, electronic device and storage medium to at least partially solve the above-mentioned problems.

[0004] According to a first aspect of an embodiment of the present application, a mounting method is provided, comprising: eccentrically adjusting a first camera in a mounting device, the first camera being used to obtain an image of a package to be mounted; determining an installation position of a nozzle in a nozzle mechanism of the mounting device according to a first center point of the package and a second center point of the adjusted first camera; installing the nozzle according to the installation position, and sucking the package based on the installed nozzle, so as to mount the package sucked by the nozzle to a target position.

[0005] According to a second aspect of an embodiment of the present application, a mounting device is provided, comprising: an adjustment module for eccentrically adjusting a first camera in the mounting equipment, the first camera being used to acquire an image of a package to be mounted; a determination module for determining an installation position of a nozzle in a nozzle mechanism of the mounting equipment based on a first center point of the package and a second center point of the adjusted first camera; and a mounting module for installing the nozzle according to the installation position, and sucking the package based on the installed nozzle, so as to mount the package sucked by the nozzle to a target position.

[0006] According to a third aspect of an embodiment of the present application, a mounting device is provided, comprising a first camera, a nozzle mechanism and a processing unit; the first camera is used to obtain an actual captured image of a package to be mounted; the nozzle mechanism comprises a nozzle and a nozzle seat, the nozzle offset from the axis of the nozzle seat is a target eccentric distance, and a rubber sleeve is installed on the outer side of the nozzle; the processing unit is used to perform eccentricity adjustment on the first camera, determine the installation position of the nozzle in the nozzle mechanism of the mounting device according to the first center point of the package and the second center point of the adjusted first camera, and suck the package by the nozzle installed according to the installation position, so as to mount the package sucked by the nozzle to the target position.

[0007] According to the fourth aspect of the embodiments of the present application, there is provided an electronic device, comprising: a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other through the communication bus; the memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform an operation corresponding to any one of the above-mentioned mounting methods.

[0008] According to a fifth aspect of an embodiment of the present application, a computer storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, any of the above-mentioned mounting methods is implemented.

[0009] According to the mounting method provided in each embodiment of the present application, the first camera in the mounting device is eccentrically adjusted; the installation position of the nozzle in the nozzle mechanism of the mounting device is determined according to the first center point of the package and the second center point of the first camera after adjustment; the nozzle is installed according to the installation position, and the package is sucked based on the installed nozzle, so as to mount the package sucked by the nozzle to the target position. By eccentrically adjusting the first camera, the accuracy of the image of the package captured by the first camera is ensured, thereby improving the subsequent mounting accuracy; by determining the physical installation position of the nozzle based on the first center point and the second center point, it can be ensured that the nozzle can accurately suck the package, improve the success rate and efficiency of mounting, and improve the mounting quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0011] Figure 1 is a flow chart of a mounting method according to an embodiment of the present application;

[0012] Figure 2 is a schematic diagram of a mounting device according to an embodiment of the present application;

[0013] Figure 3 is a schematic diagram of a nozzle mechanism of a placement device according to an embodiment of the present application;

[0014] Figure 4 It is a schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0015] Mounting method

[0016] The embodiment of the present application provides a mounting method, through which a mounting device can accurately mount packages of different sizes and shapes, thereby improving the mounting quality.

[0017] Step 101: eccentrically adjust the first camera in the mounting device.

[0018] In one embodiment, the mounting device includes a first camera, the chip packaged in the SIP can be represented as a package, and the first camera is used to obtain an image of the package to be mounted. A standard captured image corresponding to the package can be obtained, and an actual captured image of the package by the first camera can be obtained. According to the difference between the actual captured image and the standard captured image, the offset distance of the optical center point in the first camera is determined, and the position of the first camera is adjusted according to the offset distance to obtain a calibrated first camera. After the position of the first camera is adjusted, the calibrated first camera can provide more accurate image data for the mounting device, avoiding the inability to obtain accurate image data when the center of gravity or center of the package deviates from the range or critical value of the first camera, which helps to improve the mounting quality.

[0019] Step 102: Determine the installation position of the suction nozzle in the suction nozzle mechanism of the placement device according to the first center point of the package and the second center point of the calibrated first camera.

[0020] In one embodiment, the center of gravity of the package to be mounted can be obtained, and the position of the center of gravity is determined as the first center point. The position of the optical center point of the first camera after adjustment can be obtained, and the position of the optical center point is determined as the second center point. The second installation position of the nozzle holder in the nozzle mechanism can be determined based on the first center point and the second center point. Among them, the first installation position of the nozzle holder can be determined based on the existing technology, and the first position here is used to indicate the position of the center point of the axis of the nozzle holder.

[0021] In one embodiment, at least one piece of package information of the package to be mounted may be obtained: supplier information, batch information, and size information.

[0022] In one embodiment, a first correspondence can be obtained, and the first correspondence can be used to indicate the correspondence between the target eccentric distance of the suction nozzle relative to the axis of the suction nozzle seat in the suction nozzle mechanism and the package information. The first correspondence can be used to indicate the correspondence between the target eccentric distance of the suction nozzle relative to the axis of the suction nozzle seat in the suction nozzle mechanism and the package information; from the first correspondence, find the second eccentric distance corresponding to the package information, determine the target eccentric distance based on the second eccentric distance, and determine the installation position of the suction nozzle on the suction nozzle seat based on the target eccentric distance. The installation position of the suction nozzle can be determined based on the position offset by the target eccentric distance from the second position of the suction nozzle seat.

[0023] In one embodiment, the first correspondence may be determined in the following manner: packages may be sampled, and the sampled packages may be classified so that the package information in each category is the same. For each package of the same category, after the first camera is calibrated, the first position of the nozzle holder in the nozzle mechanism may be determined based on the second center point of the calibrated first camera and the first center point of the package, and according to the first center point and the second center point, the first eccentric distance of the nozzle relative to the axis of the nozzle holder in the nozzle mechanism when the nozzle can accurately suck the package is obtained, and the second eccentric distance corresponding to the category is determined for the first eccentric distance corresponding to each package in the same category. The second eccentric distance corresponding to each category may be matched one-to-one with the package information to determine the first correspondence. The package information may include supplier information, batch information, and size information of the package. As an example, the normal distribution of the first eccentric distances corresponding to all packages in the same category can be obtained, and the mean and standard deviation of the first eccentric distances of all packages can be determined based on the results of the normal distribution. The second eccentric distance can be determined based on the size of the package and the mean and standard deviation of the normal distribution results. For example, the second eccentric distance can be determined within the size range of the package based on the value of a multiple of the first threshold within the range of the mean ± standard deviation. If the size of the package is 30 mm and the first threshold is 5 mm, if only 10 mm is included in the range of the mean ± standard deviation, 10 mm can be determined as the second eccentric distance.

[0024] By accurately determining the first center point of the package and the second center point of the first camera after adjustment, the installation position of the nozzle seat in the nozzle mechanism can be determined; by sampling the package, classifying the categories corresponding to different package information, and establishing the corresponding relationship between the eccentric distance and the package information, the target eccentric distance of the nozzle can be quickly found and determined, and the installation position of the nozzle can be accurately determined, which improves the accuracy of subsequent suction and placement. This enables the placement equipment to better adapt to packages of different sizes and shapes, including components with deviated centers of gravity or geometric centers, which can significantly improve the packaging accuracy of packages and reduce placement deviations.

[0025] Step 103 , installing the suction nozzle according to the installation position, and sucking the package based on the installed suction nozzle to mount the package sucked by the suction nozzle to the target position.

[0026] In one embodiment, after the installation position is determined, the suction nozzle in the suction nozzle mechanism can be reinstalled based on the installation position so that the distance between the installed suction nozzle and the axis of the suction nozzle seat in the suction nozzle mechanism is the target eccentric distance.

[0027] In one embodiment, the mounting parameters of the mounting process can be determined, and the mounting parameters include at least one of the suction speed, suction position, suction downward displacement, package transmission speed, mounting speed, mounting displacement, mounting downward pressure, and outer diameter size of the rubber sleeve of the suction nozzle. The package to be mounted is mounted according to the mounting parameters and the reinstalled suction nozzle. Among them, a large-sized suction nozzle, such as a suction nozzle with an outer diameter of 10mm-15mm, can be selected for installation. At the same time, the rubber sleeve on the outside of the suction nozzle can be made of a wear-resistant, well-sealed and elastic material. The mounting parameters can obtain the parameters of the sampled package, and the mounting process is modeled and simulated using dedicated simulation software for mounting equipment, and is obtained through actual verification. Among them, the mounting parameters can be as follows: suction speed 25%; suction position: the value of the X-axis direction is: -94.5mm±5mm, the value of the Y-axis direction is: 42.5mm±5mm; suction (Z-axis) downward displacement: -5mm±1mm; package transmission speed: 55%, mounting speed 30%; mounting displacement (Z-axis): -0.4mm; mounting downward pressure: 0.2N; the outer diameter of the rubber sleeve of the suction nozzle is 15mm. The target eccentric distance can be 10mm. Through experimental verification, the target eccentric distance can be a multiple of 5mm, which can be determined in practice. By determining these mounting parameters, the efficiency and quality of mounting can be further improved. By reinstalling the nozzle and offsetting it to a certain extent, the mounting equipment can handle non-standard packages more efficiently and accurately, and realize the automation of the mounting process, reduce human errors and improve production efficiency. Choosing a large-sized nozzle can improve the suction force, and using a wear-resistant, well-sealed and elastic rubber sleeve material can reduce nozzle wear, improve the durability of the nozzle and improve the stability of mounting.

[0028] The embodiment of the present application ensures the accuracy of the first camera during the mounting process by performing eccentric adjustment on the first camera, determines the installation position of the nozzle holder in the nozzle mechanism by the second center point of the first camera and the first center point of the package, and establishes a first corresponding relationship between different package information and the eccentric distance to achieve the determination of the target eccentric distance of the nozzle, thereby ensuring that the installed nozzle can accurately pick up the package and improve the accuracy of mounting; by determining the mounting parameters, the mounting process can be accurately managed and controlled to improve the efficiency and quality of mounting.

[0029] Mounting device

[0030] Corresponding to the above mounting method embodiment, Figure 2 A schematic diagram of a mounting device according to an embodiment of the present application is shown. Figure 2 As shown, the mounting device 200 includes:

[0031] An adjustment module 201 is used to perform eccentric adjustment on a first camera in a placement device, where the first camera is used to obtain an image of a package to be placed;

[0032] A determination module 202, for determining an installation position of a nozzle in a nozzle mechanism of a placement device according to a first center point of the package and a second center point of the calibrated first camera;

[0033] The mounting module 203 is used to install the suction nozzle according to the mounting position, and to suck the package based on the installed suction nozzle, so as to mount the package sucked by the suction nozzle to the target position.

[0034] It should be noted that the mounting device of this embodiment is used to implement the corresponding mounting method in the aforementioned method embodiment and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0035] Mounting equipment

[0036] Corresponding to the above mounting method embodiment, Figure 3 A schematic diagram of a nozzle mechanism in a placement device is shown. Figure 3 The units shown in are millimeters (mm).

[0037] Figure 3 (2) is a top view of a nozzle mechanism in a standard placement device. In existing standard placement devices, the nozzle in the nozzle mechanism is located at the axis of the nozzle seat in the nozzle mechanism.

[0038] Figure 3 (1) is a schematic diagram of the structure of an eccentric suction nozzle corresponding to the above-mentioned mounting method in an embodiment of the present application.

[0039] The mounting equipment includes a first camera, a nozzle mechanism and a processing unit. The first camera is used to obtain an actual photographic image of the package to be mounted; the nozzle mechanism includes a nozzle and a nozzle seat, the distance that the nozzle deviates from the axis of the nozzle seat is the target eccentricity distance, and a rubber sleeve is installed on the outside of the nozzle. Figure 3 (1) The diameter of the rubber sleeve shown is 10 mm, and the outer side of the rubber sleeve is 0.2 mm away from the nozzle. Figure 3 (1) also includes a connecting piece, which is connected to the suction nozzle and can provide a certain air pressure for the suction nozzle under the action of external force, thereby providing power for the suction nozzle to suck the package.

[0040] The processing unit is used to perform eccentric adjustment on the first camera, determine the installation position of the suction nozzle in the suction nozzle mechanism of the mounting equipment according to the first center point of the package and the second center point of the adjusted first camera, and suck the package by the suction nozzle installed according to the installation position to mount the package sucked by the suction nozzle to the target position.

[0041] It should be noted that the mounting device of this embodiment is used to implement the corresponding mounting method in the aforementioned method embodiment and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0042] Electronic devices

[0043] Figure 4 A schematic diagram of the structure of an electronic device according to an embodiment of the present application is shown. The specific embodiment of the present application does not limit the specific implementation of the electronic device.

[0044] like Figure 4 As shown, the electronic device may include: a processor (processor) 402 , a communication interface (Communications Interface) 404 , a memory (memory) 406 , and a communication bus 408 .

[0045] in:

[0046] The processor 402 , the communication interface 404 , and the memory 406 communicate with each other via a communication bus 408 .

[0047] The communication interface 404 is used to communicate with other electronic devices or servers.

[0048] The processor 402 is used to execute the program 410, and specifically can execute the relevant steps in the above-mentioned mounting method embodiment.

[0049] Specifically, the program 410 may include program codes, which include computer operation instructions.

[0050] The processor 402 may be a central processing unit (CPU), or an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application. The one or more processors included in the smart device may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs.

[0051] The memory 406 is used to store the program 410. The memory 406 may include a high-speed RAM memory, and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0052] The program 410 may be specifically configured to enable the processor 402 to perform the following operations:

[0053] In an optional implementation, the program 410 is also used to enable the processor 402 to implement each step in the program 410. The specific implementation can refer to the corresponding steps and the corresponding description of the device in the above-mentioned mounting method embodiment, which will not be repeated here. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described device and module can refer to the corresponding process description in the above-mentioned method embodiment, which will not be repeated here.

[0054] Computer program product

[0055] An embodiment of the present application also provides a computer program product, including computer instructions, which instruct a computing device to execute operations corresponding to any mounting method in the above-mentioned multiple method embodiments.

[0056] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0057] Computer readable storage medium

[0058] The present application embodiment also provides a computer-readable storage medium, and the above-mentioned method according to the embodiment of the present application can be implemented in hardware, firmware, or implemented as software or computer code that can be stored in a recording medium (such as a CD ROM, RAM, floppy disk, hard disk or magneto-optical disk), or implemented as a computer code originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded through a network and stored in a local recording medium, so that the method described herein can be stored in such software processing on a recording medium using a general-purpose computer, a special-purpose processor or programmable or special-purpose hardware (such as an ASIC or FPGA). It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component (e.g., RAM, ROM, flash memory, etc.) that can store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, a processor or hardware, the mounting method described herein is implemented. In addition, when a general-purpose computer accesses the code for implementing the mounting method shown here, the execution of the code converts the general-purpose computer into a special-purpose computer for executing the mounting method shown here.

[0059] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0060] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A mounting method, characterized in that: The method comprises: Performing eccentric adjustment on a first camera in a placement device, wherein the first camera is used to obtain an image of a package to be placed; Determining the installation position of the nozzle in the nozzle mechanism of the placement device according to the first center point of the package and the second center point of the calibrated first camera; The suction nozzle is installed according to the installation position, and the package is sucked based on the installed suction nozzle, so that the package sucked by the suction nozzle is mounted on the target position.

2. The method according to claim 1, characterized in that: The eccentric adjustment of the first camera in the placement device includes: Acquire a standard photographed image corresponding to the package; Acquire an actual image of the package taken by the first camera; Determining an offset distance of an optical center point of a lens in the first camera according to a difference between the actual captured image and the standard captured image; The position of the first camera is adjusted according to the offset distance to obtain a calibrated first camera.

3. The method according to claim 1, characterized in that The step of determining the installation position of the nozzle in the nozzle mechanism of the placement device according to the first center point of the package and the second center point of the calibrated first camera includes: Determine a first position for installing a nozzle holder in the nozzle mechanism according to the first center point and the second center point; Acquire at least one piece of package information of supplier information, batch information, and size information of the package; Acquire a first corresponding relationship, where the first corresponding relationship is used to indicate a corresponding relationship between a target eccentric distance of the suction nozzle relative to the axis of the suction nozzle seat in the suction nozzle mechanism and the package information; From the first corresponding relationship, a target eccentric distance corresponding to the package information is searched, and the installation position of the suction nozzle on the suction nozzle seat is determined based on the target eccentric distance.

4. The method according to claim 3, characterized in that The obtaining of the first corresponding relationship includes: Classifying the sampled packages so that the package information in each category is the same; wherein the package information includes supplier information, batch information and size information of the packages; For each package of the same category, obtaining a first eccentric distance offset relative to the axis of the nozzle seat in the nozzle mechanism when the nozzle can accurately suck the package; For the first eccentric distance corresponding to each package in the same category, determine the second eccentric distance corresponding to the category; A first corresponding relationship between the second eccentric distance and the package information is determined.

5. The method according to claim 1, characterized in that The step of installing the suction nozzle according to the installation position includes: The suction nozzle is installed based on the installation position so that the distance between the installed suction nozzle and the axis of the suction nozzle seat in the suction nozzle mechanism is the target eccentric distance.

6. The method according to claim 1, characterized in that The step of sucking the package based on the installed suction nozzle to mount the package sucked by the suction nozzle to a target position includes: Determine the placement parameters of the placement process, wherein the placement parameters include at least one of the suction speed, suction position, suction downward displacement of the package, package transmission speed, placement speed, placement displacement, placement downward pressure, and outer diameter size of the rubber sleeve of the suction nozzle; The package to be mounted is subjected to mounting processing according to the mounting parameters and the installed suction nozzle.

7. A mounting device, characterized in that: The device comprises: An adjustment module, used for eccentrically adjusting a first camera in a placement device, wherein the first camera is used for acquiring an image of a package to be placed; A determination module, used to determine the installation position of the nozzle in the nozzle mechanism of the placement device according to the first center point of the package and the second center point of the adjusted first camera; The mounting module is used to install the suction nozzle according to the mounting position, and to suck the package based on the installed suction nozzle, so as to mount the package sucked by the suction nozzle to a target position.

8. A mounting device, characterized in that: The device comprises: a first camera, a nozzle mechanism and a processing unit; The first camera is used to obtain an actual photographic image of the package to be mounted; The nozzle mechanism includes a nozzle and a nozzle seat, the distance that the nozzle is offset from the axis of the nozzle seat is a target eccentric distance, and a rubber sleeve is installed on the outside of the nozzle; The processing unit is used to perform eccentric adjustment on the first camera, determine the installation position of the nozzle in the nozzle mechanism of the mounting device according to the first center point of the package and the second center point of the adjusted first camera, and suck the package by the nozzle installed according to the installation position, so as to mount the package sucked by the nozzle to the target position.

9. An electronic device, comprising: A processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; The memory is used to store at least one executable instruction, and the executable instruction enables the processor to execute an operation corresponding to the mounting method according to any one of claims 1 to 6.

10. A computer storage medium having a computer program stored thereon, wherein the program, when executed by a processor, implements the mounting method according to any one of claims 1 to 6.

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