Moisture-proof device, LED system device assembly and moisture-proof method

Abstract

The invention provides a moisture-proof device of an LED packaging structure. The moisture-proof device comprises a heating moisture-removing layer, a room temperature sensor used for sensing the room temperature of a space where the moisture-proof device is located, a device temperature sensor used for sensing the temperature of a device in the LED packaging structure and a temperature measuring and controlling circuit. The device temperature sensor and the heating moisture-removing layer are arranged in the LED packaging structure, and the room temperature sensor is arranged outside the LED packaging structure; and the heating moisture-removing layer, the room temperature sensor and the device temperature sensor are respectively connected with the temperature measuring and controlling circuit. The invention further provides a moisture-proof LED system device assembly and a moisture-proof method. The moisture-proof protection can be carried out on the KSF fluorescent powder.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging structures, and in particular to a moisture-proof device, an LED system device assembly and a moisture-proof method. Background Art

[0002] Because KSF phosphors are easily affected by moisture and hydrolyzed, the packages containing KSF phosphors are exposed to moisture in the environment during service, causing KSF substances to hydrolyze, turn black, turn white, etc., resulting in device failure. LED device packages containing KSF phosphors usually must take certain protective measures or be specially designed to make KSF phosphors relatively less likely to come into contact with water vapor and moisture, delaying their hydrolysis process due to moisture and extending their service life.

[0003] At present, the following methods are generally used to protect KSF phosphors:

[0004] 1. Inorganic coating of KSF phosphor;

[0005] 2. Encapsulate the KSF phosphor at the core of the LED device, making it as far away from the outer edge of the package as possible;

[0006] 3. Use one or more layers of material to isolate the KSF phosphor in a "sandwich" manner. These materials are usually spot-coated or spray-coated silicone, spot-coated or spray-coated moisture-proof film, etc.

[0007] 4. The KSF phosphor is placed in a specially designed spatial position in the package to conform to certain physical principles and avoid being affected by external electric fields and other factors.

[0008] However, the above methods still have limitations and disadvantages, as follows:

[0009] 1. The size of the package is mostly small, and its scale is mostly at the millimeter level. Some modules are packaged at the centimeter level. This determines that no matter how they apply the above-mentioned protection measures, the protection effect can only "delay" failure, but it is impossible to prevent water vapor intrusion.

[0010] 2. At the current level of technological progress, the packaging materials used have a paradoxical effect in terms of waterproof and moisture-proof performance and mechanical protection performance. That is, packaging materials with good waterproof and moisture-proof performance (usually high-refractive index hard silicone) sacrifice mechanical bonding and protection performance (easy to separate from the packaging shell under cold and hot shocks), and vice versa;

[0011] 3. During the service life of the device, the output light and heat, as well as the impact of hot and cold changes in the environment, corrosive substances, natural light and other factors will cause the device to age slowly and naturally, and the protection measures for KSF phosphor will gradually become ineffective.

[0012] Therefore, the problem that needs to be solved at present is to find an effective way to protect KSF phosphor from moisture. Summary of the invention

[0013] In order to solve the problems existing in the prior art, the present invention aims to provide an LED packaging structure including a moisture-proof device, which can effectively dehumidify the interior of the LED packaging structure;

[0014] A second object of the present invention is to provide a moisture-proof LED system device assembly;

[0015] The third object of the present invention is to provide a moisture-proof method.

[0016] To achieve the above object, the present invention adopts the following technical solutions:

[0017] A moisture-proof device for an LED packaging structure comprises a heat-generating moisture-repelling layer, a room temperature sensor for sensing the room temperature of a space, a device temperature sensor for sensing the temperature of a device in the LED packaging structure, and a temperature measurement and control circuit; the device temperature sensor and the heat-generating moisture-repelling layer are arranged in the LED packaging structure, and the room temperature sensor is arranged outside the LED packaging structure; the heat-generating moisture-repelling layer, the room temperature sensor, and the device temperature sensor are respectively connected to the temperature measurement and control circuit.

[0018] Preferably, it also includes a humidity sensing device for sensing the humidity of the space where the device is located, and the humidity sensing device is connected to the temperature measurement and control circuit; the humidity of the space where the device is located is obtained through the humidity sensing device; if the humidity is higher than the preset humidity, the preset temperature difference value is increased; if the humidity is not higher than the preset humidity, the preset temperature difference value is reduced.

[0019] Preferably, it also includes a time delay control circuit for controlling the delayed temperature rise of the heat-generating and moisture-removing layer, and the time delay control circuit is connected to the temperature measurement and control circuit.

[0020] Preferably, the heat-generating and moisture-repelling layer is a film printed with a resistor paste; or the heat-generating and moisture-repelling layer is an uninterrupted linear heat-generating film layer that is roughly concentrically surrounded.

[0021] Preferably, the room temperature sensor and / or the device temperature sensor is a thin film resistor type thermistor device or a device made by printing resistor paste.

[0022] Preferably, the device temperature sensor is arranged near the Tc temperature measurement point of the LED packaging structure or at an equivalent position.

[0023] A moisture-proof LED system device assembly comprises a packaging structure body, an LED driving circuit and a light-emitting component, wherein the light-emitting component is arranged in the packaging structure body; the LED driving circuit is connected to the light-emitting component; and the moisture-proof device is also included.

[0024] Preferably, it also includes a power outage monitoring circuit, which is connected to the temperature measurement and control circuit and the LED drive circuit; when the power outage monitoring circuit detects that a power outage has occurred, the LED drive circuit is automatically disconnected, and after the power is restored and the heat-generating dehumidification layer generates heat to dehumidify, the power outage monitoring circuit sends a signal again to start the LED drive circuit.

[0025] Preferably, the packaging structure body comprises a substrate layer, an adhesive layer, a circuit bearing layer and a protective layer stacked in sequence; the LED driving circuit is arranged between the circuit bearing layer and the protective layer, and the heat-generating and moisture-removing layer and the device temperature sensor are arranged between the circuit bearing layer and the adhesive layer;

[0026] The adhesive layer, the heat-generating and moisture-removing layer, the circuit-bearing layer, and the LED driving circuit are each provided with concentric through holes in the middle thereof, and the light-emitting component is provided in the concentric through holes;

[0027] The light-emitting component includes a dam, a KSF fluorescent conversion substance, leads, a conventional fluorescent conversion substance and an LED chip; the LED chip is arranged on a substrate layer, and the KSF fluorescent conversion substance is arranged on the LED chip; the dam surrounds all LED chips to form a circle and is arranged in a concentric circular through hole of the packaging structure body, and contains the conventional fluorescent conversion substance; the LED chips are connected to each other through leads, and one or more LED chips are connected to an LED driving circuit through leads.

[0028] Preferably, the heat-generating and moisture-repelling layer is a metal part in the LED packaging structure; the heat-generating and moisture-repelling layer is connected in series with a pulse output current and voltage circuit to be connected to a temperature measurement and control circuit.

[0029] A moisture-proof method for a moisture-proof LED system device assembly comprises the following steps:

[0030] S1, obtaining indoor temperature and device temperature through room temperature sensor and device temperature sensor respectively;

[0031] S2. If the device temperature is lower than the indoor temperature, the heat-generating moisture-removing layer starts to generate heat, so that the device temperature rises to a temperature difference with the indoor temperature that is greater than a preset temperature difference value;

[0032] S3. If the device temperature is higher than the indoor temperature, but the temperature difference is not greater than the preset temperature difference value, the heat-generating moisture-removing layer generates heat, so that the device temperature rises to a temperature difference greater than the preset temperature difference value compared with the indoor temperature;

[0033] S4. If the device temperature is higher than the indoor temperature and the temperature difference is greater than the preset temperature difference value, the heat-generating moisture-removing layer will not work;

[0034] S5. The above steps S2, S3 and S4 are kept running in a loop.

[0035] The beneficial effects of the present invention are:

[0036] Through the above structure, the LED packaging structure can be effectively protected from moisture and humidity, thereby extending the service life of the packaged device containing KSF: Compared with the existing conventional technology, the technical route adopted in this case can extend the expiration period of KSF phosphor, thereby extending the service life of the LED packaged device. According to conventional empirical data, it is roughly estimated that the service life can be extended by 5000 to 10000 hours;

[0037] In the early stage of accidental moisture exposure (such as power outage, splashing rain, etc.), active heating and re-drying of the components can save the lamp from rapid failure, which is equivalent to extending the service life. Since it has been damp, the effect of extending the service life is uncertain, which is roughly equivalent to extending 1000H to 5000H;

[0038] Since the potential danger of KSF devices getting wet has been solved, the risk of using high-performance KSF phosphors in applications with high reliability requirements has been reduced. The product brightness can be increased by 10-15%, and the product NTSC color gamut value can be increased by 5-15 percentage points; reducing the risk of using KSF phosphors for automotive-grade high color gamut devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0040] Figure 1 An exploded view of the moisture-proof LED system device assembly of the present invention;

[0041] Figure 2 A schematic diagram of the heat-generating moisture-removing layer of the present invention;

[0042] Figure 3 A is a cross-sectional view of the moisture-proof LED system device assembly of the present invention;

[0043] Figure 4 is a cross-sectional view b of the moisture-proof LED system device assembly of the present invention;

[0044] Figure 5 A circuit diagram of the temperature measurement and control circuit of the present invention using an analog circuit mode;

[0045] Figure 6 The temperature measurement and control circuit of the present invention adopts a digital circuit circuit.

[0046] in:

[0047] 101-substrate layer; 102-adhesive layer; 103-heat-generating and moisture-repelling layer; 103a-exposed electrical terminals led out of the heat-generating and moisture-repelling layer; 105-protective layer; 106-LED driving circuit; 107-dam; 108-KSF fluorescent conversion material; 109-lead; 110-conventional fluorescent conversion material; 111-LED chip; 120-device temperature sensor; 120a-exposed wiring terminals led out of the temperature sensor; 130-circuit bearing layer;

[0048] 21-temperature measurement and control circuit; 22-room temperature sensor;

[0049] 31-a first operational amplifier; 32-a second operational amplifier; 33-a first comparator; 34-a second comparator; 35-a bidirectional thyristor or a solid-state relay;

[0050] 41- microprocessor MCU; 42- thermistor; 43- relay

[0051] 5- Fuse;

[0052] 6- Radiator;

[0053] 7-mosFET (metal-oxide semiconductor field-effect transistor);

[0054] 8-Thermal sheet. DETAILED DESCRIPTION

[0055] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention are further described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0056] See also Figure 1 As shown, a moisture-proof device for an LED packaging structure according to the present invention comprises a heat-generating moisture-repelling layer 103, a room temperature sensor 22 for sensing the room temperature of a space, a device temperature sensor 120 for sensing the temperature of a device in the LED packaging structure, and a temperature measurement and control circuit 21; the device temperature sensor 120 and the heat-generating moisture-repelling layer 103 are arranged in the LED packaging structure, and the room temperature sensor 22 is arranged outside the LED packaging structure; the heat-generating moisture-repelling layer 103, the room temperature sensor 22, and the device temperature sensor 120 are respectively connected to the temperature measurement and control circuit 21;

[0057] The indoor temperature and the device temperature are obtained respectively by the room temperature sensor 22 and the device temperature sensor 120; if the device temperature is lower than the indoor temperature, the temperature measurement and control circuit 21 controls the heat-generating and dehumidifying layer 103 to start heating, so that the device temperature rises to a temperature difference of more than the preset temperature difference value compared with the indoor temperature; if the device temperature is higher than the indoor temperature, but the temperature difference is not greater than the preset temperature difference value, the heat-generating and dehumidifying layer 103 heats up, so that the device temperature rises to a temperature difference of more than the preset temperature difference value compared with the indoor temperature; if the device temperature is higher than the room temperature, and the temperature difference is greater than the preset temperature difference value, the heat-generating and dehumidifying layer 103 does not work. Thus, the LED packaging structure can have a suitable temperature, water vapor will not accumulate, and effective dehumidification and moisture-proofing are achieved inside the LED packaging structure.

[0058] The device temperature sensor is arranged near the Tc temperature measurement point of the LED packaging structure or at an equivalent position. A position close to the KSF fluorescent substance is better than a position far away from the KSF fluorescent substance.

[0059] It also includes a humidity sensing device for sensing the humidity of the space where the device is located, and the humidity sensing device is connected to the temperature measurement and control circuit 21; the humidity of the space where the device is located is obtained through the humidity sensing device; if the humidity is higher than the preset humidity (when the air is humid), the preset temperature difference value is increased to ensure the moisture-proof effect; if the humidity is not higher than the preset humidity (when the air is dry), the preset temperature difference value is reduced to reduce energy consumption.

[0060] The preset humidity may be set according to the actual humidity requirement for the space where the device is located, or may be appropriately set according to the air humidity parameters corresponding to the wet / dry division according to meteorological data.

[0061] It also includes a time delay control circuit for controlling the delayed temperature rise of the heat-generating and moisture-discharging layer 103, and the time delay control circuit is connected to the temperature measurement and temperature control circuit 21. This allows the temperature difference between the device temperature and the room temperature to fluctuate within a certain range outside the preset temperature difference value, so as to avoid the device from falling into critical jitter in the cycle of heating-stop heating-cooling-reheating (that is, when the temperature cools down a little bit, it will immediately trigger reheating, and the heating will stop soon, and then cool down and heat quickly again, and the cycle is too short, resulting in frequent response of the action device, affecting the stability of the system.

[0062] For example, when the room temperature is 20℃ and the temperature difference is set to 5℃, the temperature for judging whether to heat is 25℃; when there is no delay, heating will start as long as the temperature is detected to be lower than 25℃, and the heating will stop immediately as soon as the temperature exceeds 25℃. When the temperature drops slightly, heating will start again immediately... This is an over-fast cycle. When there is delay control, when the temperature is detected to be lower or higher than 25℃, heating or not heating will not start immediately, but after a delay time, which will cause the temperature to fluctuate within a small range, for example, it can drop to 23℃, can be heated to 26℃, and so on.

[0063] The time delay circuit allows the temperature to drop slightly more, but not below room temperature, before entering the heating cycle again. ).

[0064] As an embodiment, the room temperature sensor 22 and / or the device temperature sensor 120 is a thin film resistor type thermistor device or a device made by printing resistor paste.

[0065] As an embodiment, the heat-generating and moisture-removing layer 103 is a thin film printed with a resistor paste, and at this time, it is led out to the upper surface of the product through a through-hole process; as another embodiment, refer to Figure 2 As shown, the heat-generating moisture-removing layer 103 is an uninterrupted linear heat-generating film layer that is roughly concentrically surrounded.

[0066] Through the above-mentioned moisture-proof structure, the LED packaging structure can be effectively dehumidified and moisture-proofed, effectively protecting the service life of the KSF phosphor.

[0067] See also Figures 1 to 4 As shown, a moisture-proof LED system device assembly described in the present invention includes a packaging structure body, an LED driving circuit 106 and a light-emitting component, and the light-emitting component is arranged in the packaging structure body; the LED driving circuit 106 is connected to the light-emitting component, and also includes the moisture-proof device described in the present invention, the device temperature sensor 120 and the heat-generating moisture-removing layer 103 are arranged in the packaging structure body, and the room temperature sensor 22 is arranged outside the packaging structure body.

[0068] As an embodiment, the heat-generating moisture-removing layer 103 is connected to the temperature measuring and controlling circuit 21 through the metal portion of the packaging structure body to reduce the complexity and cost of the system.

[0069] It also includes a power outage monitoring circuit, which is connected to the temperature measurement and control circuit 21 and the LED drive circuit 106; when the power outage monitoring circuit detects that a power outage has occurred, the LED drive circuit 106 is automatically disconnected. After the power is restored, the heat-generating moisture-removing layer 103 generates heat to remove the moisture absorbed during the power outage (because the temperature difference cannot be maintained), and then the power outage monitoring circuit sends a signal again to close the LED drive circuit 106 to allow the LED to work.

[0070] As an embodiment, the heat-generating moisture-removing layer 103 is the metal part in the LED packaging structure; when connected to the temperature measurement and control circuit 21, a pulse output current and voltage circuit is added in series at the output end of the control device to avoid the metal body resistance being too small and the current being too large and out of control and burning in the constant current mode.

[0071] As an example, see Figures 1 to 4 As shown, the packaging structure body includes a substrate layer 101, an adhesive layer 102, a circuit bearing layer 130 and a protective layer 105 (i.e., a surface solder resist bearing layer) stacked in sequence; the LED driving circuit 106 is arranged between the circuit bearing layer 130 and the protective layer 105, and the heat-generating and moisture-removing layer 103 and the device temperature sensor 120 are arranged between the circuit bearing layer 130 and the adhesive layer 102; the substrate layer 101 is a metal substrate layer.

[0072] The adhesive layer 102, the heat-generating and moisture-removing layer 103, the circuit-bearing layer 130, and the protective layer 105 are each provided with concentric through holes in the middle thereof, and the light-emitting components are placed in the concentric through holes and are arranged on the exposed space of the substrate layer 101;

[0073] The light-emitting component includes a dam 107, a KSF fluorescent conversion substance 108 (containing silicone), a lead 109, a conventional fluorescent conversion substance 110 (containing silicone) and an LED chip 111; the LED chip 111 is fixed on the substrate layer 101, and the KSF fluorescent conversion substance 108 is arranged on the LED chip 111; the dam 107 surrounds all the LED chips 111 and is arranged in a circle and is mounted in the concentric circular through holes of the packaging structure body, and contains the conventional fluorescent conversion substance 110; the LED chips 111 are connected to each other through the lead 109, and one or more LED chips 111 are connected to the LED driving circuit 106 through the lead 109.

[0074] The exposed power terminal 103a led out from the heat-generating and moisture-removing layer 103 passes through the circuit-bearing layer 130 and the protective layer 105; the exposed terminal 120a led out from the device temperature sensor passes through the circuit-bearing layer 130 and the protective layer 105, and is connected to the temperature measurement and control circuit 21 through the exposed terminals led out respectively.

[0075] The specific embodiment of the temperature measurement and control circuit 21 in the moisture-proof device of the LED packaging structure of the present invention using an analog circuit method can be found in Figure 5 Among them, power supply, room temperature thermistor, and device thermistor represent two sensors for sensing the temperature of the LED package device and the indoor temperature of the space where the device is located, namely, the room temperature sensor 22 and the device temperature sensor 120.

[0076] The two temperature signals enter two operational amplifiers respectively: the room temperature signal is amplified and input into the first comparator 33, the positive input terminal of the first comparator 33 is connected to the high potential end of an adjustable resistor, and the reference voltage V-ref is provided by adjusting the adjustable resistor, so as to indirectly adjust the temperature difference; the output terminal of the first comparator 33 is connected to the negative input terminal of the second comparator 34, and is compared with the amplified signal from the device temperature signal. When the device signal level is lower than the comparator output terminal signal, the output terminal of the second comparator 34 is high potential, driving the bidirectional thyristor or solid-state relay 35 to conduct, and the heat plate 8 (i.e., the temperature rise layer 103) is powered on to generate heat. As the device temperature gradually increases, the two input terminals of the second comparator 34 gradually level off, the output terminal level of the second comparator 34 drops back, the bidirectional thyristor or solid-state relay 35 is turned off, and the device stops heating. In this way, the cycle repeats.

[0077] The temperature control function realized by this circuit is: room temperature + set temperature difference = device temperature.

[0078] Preferably, a delay control circuit can be connected in series to the output end of the second comparator 34, whose function is that when the level of the output end of the second comparator 34 becomes low (at this time, the last heating of the device has just ended and the device begins to cool naturally), the timer starts timing for a certain length of time, and the timing length is greater than the time for the output end level of the second comparator 34 to normally rise, so as to delay the timing of starting the next heating.

[0079] For a specific embodiment of the temperature measurement and control circuit 21 of the moisture-proof device of the LED packaging structure of the present invention using a digital circuit, please refer to Figure 6 shown.

[0080] The temperature detection and control is realized by a digital circuit control system, and the temperature signals on the room temperature sensor 22 and the device temperature sensor 120 are read by a microprocessor MCU41, and the temperature comparison and the driving of the relay 43 are realized by digital-to-analog conversion using C language or other programming languages ​​suitable for embedded control systems, thereby realizing the control of the temperature rising layer 103. The specific technical details belong to universal technology and can be used directly, and will not be repeated here.

[0081] It is particularly pointed out that in the above two embodiments, both analog circuits and digital circuits contain circuits or components that are not drawn or mentioned but are necessary according to common knowledge, including but not limited to: overheat protection components, overcurrent protection components, positive and negative feedback circuits of operational amplifiers, MCU peripheral clocks, reset, program burning and other servo circuits, power supply circuits, indicator lights, etc.

[0082] The two circuit diagrams only show the most basic components for realizing the functions, and do not limit the parameters, packaging, layout, etc. of the components used. Those skilled in the art should be able to infer more expanded, detailed, and slightly adjusted schematic diagrams from the above schematic diagrams, and can also easily add or delete certain components while keeping the functions declared in this patent unchanged.

[0083] One of the manufacturing methods of the moisture-proof LED system device assembly when the temperature measurement and control circuit 21 adopts an analog circuit is as follows:

[0084] The first stage: making LED package substrate or bracket, which is divided into the following steps:

[0085] 1. Use BT double-sided copper-clad laminate as the circuit bearing layer 130, on which the central position is hollowed out to accommodate the LED chip 111 and other components. The LED driving circuit 106 is made on the front side by using printed circuit board technology; the resistor paste is printed on the back side and dried / sintered to serve as the heating layer (i.e., the heat-generating and moisture-removing layer 103). Drill holes and metallize to lead the back heating layer 103 to the reserved electrode on the front side.

[0086] 2. Print thermistor paste (to form device temperature sensor 120) at a reserved position on the back (eg, a corner), and similarly, lead it out to the reserved electrode on the front through a metallized through hole.

[0087] 3. On the metal substrate, from bottom to top, the adhesive layer 102, the circuit bearing layer 130 (the bottom surface of which is the temperature rising layer 103 and the device temperature sensor 120, and the front surface is the LED driving circuit 106), and the printed surface solder resist protective layer 105 are sequentially attached to complete the production of the package substrate. (See Figure 1 )

[0088] The second stage: making LED packaging devices

[0089] 1. On the packaging substrate, an LED light emitting diode chip is fixed on the exposed light emitting surface in the center of the metal substrate;

[0090] 2. Bonding the LED chips to achieve the preset series-parallel connection and connect them to the LED driving circuit 106;

[0091] 3. Making a dam 107 of a preset diameter around the edge of the light-emitting surface;

[0092] 4. Coat the mixture of KSF phosphor and encapsulation glue on the upper surface of the LED light-emitting diode and heat cure it as the first fluorescent conversion layer;

[0093] 5. Coat a mixture of conventional fluorescent material and packaging glue inside the dam 107 and heat cure it to form the second fluorescent conversion layer, thus completing the production of the LED packaging device. (See Figure 3 , Figure 4 )

[0094] Phase 3: System Integration

[0095] 1. Connect the prepared LED package device to a control system, wherein the temperature rising layer 103 is connected to the output end of the bidirectional thyristor or solid-state relay 35 and the negative electrode of the DC power supply;

[0096] 2. The device temperature sensor 120 is connected to the circuit position of the "device thermistor" resistor of the control device;

[0097] 3. Debug the reference potentiometer, and use a thermocouple to detect the device temperature and room temperature, record the resistance value and temperature value when the system responds, and obtain a series of corresponding references of the reference potentiometer resistance value and the temperature difference value; optionally, a scale sticker can be made and attached to the potentiometer accessories;

[0098] 4. Debugging and running: Adjust to a set of known resistance values ​​obtained in the previous step, monitor the operation of the system and complete the final debugging.

[0099] The moisture-proof method of a moisture-proof LED system device assembly described in the present invention specifically comprises the following steps:

[0100] S1, obtaining the indoor temperature and the device temperature respectively through the room temperature sensor 22 and the device temperature sensor 120;

[0101] S2. If the device temperature is lower than the indoor temperature, the heat-generating moisture-removing layer 103 starts to generate heat, so that the device temperature rises to a temperature difference between the device temperature and the indoor temperature that is greater than a preset temperature difference value;

[0102] S3. If the device temperature is higher than the indoor temperature, but the temperature difference is not greater than the preset temperature difference value, the heat-generating moisture-removing layer 103 generates heat, so that the device temperature rises to a temperature difference greater than the preset temperature difference value compared with the indoor temperature.

[0103] S4. If the device temperature is higher than the indoor temperature and the temperature difference is greater than the preset temperature difference value, the heat-generating moisture-removing layer 103 does not work;

[0104] S5. The above steps S2, S3 and S4 are kept running in a cycle to ensure that the devices in the LED packaging structure are always higher than the ambient temperature, so as to protect the KSF phosphor in the LED packaging structure from being hydrolyzed.

[0105] The present invention extends the service life of the packaged device containing KSF through the above structure: compared with the existing conventional technology, the technical route adopted in this case can extend the expiration date of KSF phosphor, thereby extending the service life of LED packaged devices. According to conventional empirical data, it is roughly estimated that the service life can be extended by 5000 to 10000 hours (the service life of conventional packaged devices containing KSF phosphor is about 40000 to 45000 hours, and the service life of packaged devices without KSF phosphor is about 50000 hours. KSF will not be hydrolyzed by the technical route of this case, so it is roughly equivalent to the service life of packaged devices without KSF phosphor. This method is for reference only and no guarantee is made.)

[0106] In the early stage of accidental moisture exposure (such as power outage, splashing rain, etc.), active heating and re-drying of the components can save the lamp from rapid failure, which is equivalent to extending the service life. Since it has been damp, the effect of extending the service life is uncertain, which is roughly equivalent to extending 1000H to 5000H;

[0107] Since the potential danger of KSF devices getting wet has been solved, the risk of using high-performance KSF phosphors in applications with high reliability requirements has been reduced. The product brightness can be increased by 10-15%, and the product NTSC color gamut value can be increased by 5-15 percentage points; reducing the risk of using KSF phosphors for automotive-grade high color gamut devices.

[0108] In the description herein, the reference terms "an embodiment", "example", etc., mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0109] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0110] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A moisture-proof device for an LED packaging structure, characterized in that: It includes a heat-generating moisture-repelling layer, a room temperature sensor for sensing the room temperature of the space, a device temperature sensor for sensing the temperature of the device in the LED packaging structure, and a temperature measurement and control circuit; the device temperature sensor and the heat-generating moisture-repelling layer are arranged in the LED packaging structure, and the room temperature sensor is arranged outside the LED packaging structure; the heat-generating moisture-repelling layer, the room temperature sensor, and the device temperature sensor are respectively connected to the temperature measurement and control circuit.

2. The moisture-proof device for LED packaging structure according to claim 1, characterized in that: It also includes a humidity sensing device for sensing the humidity of the space where the device is located, and the humidity sensing device is connected to the temperature measurement and control circuit; the humidity of the space where the device is located is obtained through the humidity sensing device; if the humidity is higher than the preset humidity, the preset temperature difference value is increased; if the humidity is not higher than the preset humidity, the preset temperature difference value is reduced.

3. The moisture-proof device for LED packaging structure according to claim 1 or 2, characterized in that: It also includes a time delay control circuit for controlling the delayed temperature rise of the heat-generating and moisture-removing layer, and the time delay control circuit is connected to the temperature measurement and control circuit.

4. The moisture-proof device for LED packaging structure according to claim 1, characterized in that: The heat-generating and moisture-repelling layer is a film printed with a resistor paste; or the heat-generating and moisture-repelling layer is an uninterrupted linear heat-generating film layer that is roughly concentrically surrounded.

5. The moisture-proof device for LED packaging structure according to claim 1, characterized in that: The room temperature sensor and / or the device temperature sensor is a thin film resistor type thermistor device or a device made by printing resistor paste.

6. The moisture-proof device of the LED packaging structure according to claim 1, characterized in that: The device temperature sensor is arranged near the Tc temperature measuring point of the LED packaging structure or at an equivalent position.

7. A moisture-proof LED system device assembly, comprising a packaging structure body, an LED driving circuit and a light-emitting component, wherein the light-emitting component is arranged in the packaging structure body; the LED driving circuit is connected to the light-emitting component; characterized in that: It also includes the moisture-proof device according to any one of claims 1 to 6.

8. The moisture-proof LED system device assembly according to claim 7, characterized in that: It also includes a power outage monitoring circuit, which is connected to the temperature measurement and control circuit and the LED drive circuit; when the power outage monitoring circuit detects that a power outage has occurred, the LED drive circuit is automatically disconnected, and after the power is restored and the heat-generating dehumidification layer generates heat to dehumidify, the power outage monitoring circuit sends a signal again to start the LED drive circuit.

9. The moisture-proof LED system device assembly according to claim 7, characterized in that: The packaging structure body comprises a substrate layer, an adhesive layer, a circuit bearing layer and a protective layer stacked in sequence; the LED driving circuit is arranged between the circuit bearing layer and the protective layer, and the heat-generating and moisture-removing layer and the device temperature sensor are arranged between the circuit bearing layer and the adhesive layer; The adhesive layer, the heat-generating and moisture-removing layer, the circuit-bearing layer, and the LED driving circuit are each provided with concentric through holes in the middle thereof, and the light-emitting component is provided in the concentric through holes; The light-emitting component includes a dam, a KSF fluorescent conversion substance, leads, a conventional fluorescent conversion substance and an LED chip; the LED chip is arranged on a substrate layer, and the KSF fluorescent conversion substance is arranged on the LED chip; the dam surrounds all LED chips to form a circle and is arranged in a concentric circular through hole of the packaging structure body, and contains the conventional fluorescent conversion substance; the LED chips are connected to each other through leads, and one or more LED chips are connected to an LED driving circuit through leads.

10. The moisture-proof LED system device assembly according to claim 7, characterized in that: The heat-generating moisture-repelling layer is the metal part in the LED packaging structure; the heat-generating moisture-repelling layer is connected in series with a pulse output current and voltage circuit to access the temperature measurement and control circuit.

11. A moisture-proof method for a moisture-proof LED system device assembly according to any one of claims 7 to 10, characterized in that: The following steps are involved: S1, obtaining indoor temperature and device temperature through room temperature sensor and device temperature sensor respectively; S2. If the device temperature is lower than the indoor temperature, the heat-generating moisture-removing layer starts to generate heat, so that the device temperature rises to a temperature difference with the indoor temperature that is greater than a preset temperature difference value; S3. If the device temperature is higher than the indoor temperature, but the temperature difference is not greater than the preset temperature difference value, the heat-generating moisture-removing layer generates heat, so that the device temperature rises to a temperature difference greater than the preset temperature difference value compared with the indoor temperature; S4. If the device temperature is higher than the indoor temperature and the temperature difference is greater than the preset temperature difference value, the heat-generating moisture-removing layer will not work; S5. The above steps S2, S3 and S4 are kept running in a loop.

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