A cable moisture removing semiconductor drying and heating gas treatment device

Abstract

The application discloses a kind of cable dehumidification with semiconductor drying heating gas processing device, for cable air dehumidification technical field.This device includes: shell, shell is equipped with air inlet, air outlet and water outlet;Shell has at least two groups of cold and hot cavities;From air inlet to the gas flow direction of air outlet, air inlet, at least two groups of cold and hot cavities and air outlet are sequentially communicated, and each group of cold and hot cavities includes sequentially communicated cold cavity with water outlet and hot cavity;At least two semiconductor refrigerators, the hot end of semiconductor refrigerator is located in hot cavity, and the cold end of semiconductor refrigerator is located in cold cavity;Detection component, detection component is used to detect the temperature and water content of gas in each cavity;Control component, control component is electrically connected with detection component and semiconductor refrigerator, and control component is used to receive temperature and water content data of detection component, and adjusts the refrigerating capacity and heating capacity of semiconductor refrigerator according to temperature and water content data.This device is small in size and has good dehumidification effect.

Description

Technical Field

[0001] The present invention relates to the technical field of cable air dehumidification, in particular to a semiconductor drying and heating gas processing device for cable dehumidification. Background Art

[0002] Cable dehumidification is an important part of cable safety. This part usually involves injecting qualified gas into the damp cable to dehumidify it. The qualified air needs to meet two requirements, namely, the moisture content and temperature must be precisely up to standard. Otherwise, excessive temperature will reduce the resistance of the cable's insulation material and increase dielectric loss, seriously affecting the cable's service life. Excessive moisture content will lead to incomplete cable dehumidification.

[0003] Existing technologies often use nitrogen, but its use is limited by many technical and safety factors. First, the damp cables that need to be treated are mostly at construction sites or emergency repair sites, where the on-site environment is complex and the space is small. Nitrogen cylinders are large and heavy, and a single nitrogen cylinder often weighs dozens of kilograms, making it difficult to transport and not suitable for deployment on site. In addition, some technologies use refrigeration equipment and heating equipment to dry and heat the gas once to achieve moisture removal. However, these technologies only perform a single drying and heating process, and the temperature and moisture content of the gas are not accurately controlled, resulting in poor moisture removal effect. Summary of the Invention

[0004] The present invention provides a semiconductor drying and heating gas processing device for cable dehumidification, aiming to solve the problems that the existing air devices for cable dehumidification are large in size and have poor dehumidification effect.

[0005] The present invention provides a semiconductor drying and heating gas processing device for cable moisture removal, comprising:

[0006] a housing, the housing being provided with an air inlet, an air outlet, and a water outlet; the housing comprising at least two groups of hot and cold chambers; in a direction of gas flow from the air inlet to the air outlet, the air inlet, the at least two groups of hot and cold chambers, and the air outlet being sequentially connected, and each group of hot and cold chambers comprising a cold chamber and a hot chamber connected in sequence with the water outlet;

[0007] At least two semiconductor refrigerators, wherein the hot end of the semiconductor refrigerator is arranged in the hot cavity, and the cold end of the semiconductor refrigerator is arranged in the cold cavity;

[0008] A detection component, the detection component is used to detect the temperature and water content of the gas in each cavity;

[0009] A control component is electrically connected to the detection component and the semiconductor refrigerator, and is used to receive temperature and water content data from the detection component and adjust the cooling capacity and heating capacity of the semiconductor refrigerator according to the temperature and water content data.

[0010] In one of the embodiments, the cold cavity is provided with a condensing assembly, and the hot cavity is provided with a heat dissipating assembly.

[0011] The condensing assembly is connected with the cold end of the semiconductor refrigerator, and the heat dissipating assembly is connected with the hot end of the semiconductor refrigerator.

[0012] In one of the embodiments, the condensing assembly comprises a plurality of condensing pieces, and the plurality of condensing pieces are regularly arranged.

[0013] In one of the embodiments, the condensing piece is an L-shaped condensing piece.

[0014] In one of the embodiments, the height of the L-shaped condensing piece gradually decreases along the gas flow direction, and the bottom of the L-shaped condensing piece is inclined.

[0015] In one of the embodiments, the heat dissipating assembly comprises a plurality of heat dissipating pieces, and the plurality of heat dissipating pieces are regularly arranged.

[0016] In one of the embodiments, the heat dissipating piece is an L-shaped heat dissipating piece.

[0017] The L-shaped heat dissipating piece comprises a first piece body and a second piece body.

[0018] The first piece body is located above the communication port of the cold cavity and the hot cavity, and the second piece body is aligned with the communication port.

[0019] In one of the embodiments, the air inlet and the air outlet are arranged on the same shell wall side of the shell, and the two groups of cold and hot cavities are arranged in a central symmetry.

[0020] In one of the embodiments, the inner wall of the shell is fixed with a first vertical partition plate and a plurality of second vertical partition plates.

[0021] The first vertical partition plate separates the inner part of the shell into at least two cold and hot cavities, and the top of the first vertical partition plate is provided with a first flow communication hole for communicating different cold and hot cavities.

[0022] The second vertical partition plate is arranged in the cold and hot cavities, and the second vertical partition plate separates the cold and hot cavities into the cold cavity and the hot cavity. The second vertical partition plate is provided with a second flow communication hole, and the second vertical partition plate is installed with the semiconductor refrigerator.

[0023] In one of the embodiments, the height of the air inlet, the air outlet and the first flow communication hole is higher than the height of the second flow communication hole.

[0024] In one of the embodiments, the cold cavity and the hot cavity are both wrapped with a heat insulation material.

[0025] The water outlet is communicated with a bend pipe, the water inlet end of the bend pipe is arranged on the inner bottom surface of the cold cavity, the height of the water inlet end of the bend pipe is higher than the height of the water outlet, and the height of the water inlet end of the bend pipe is lower than the height of the circumferential edge of the inner bottom surface of the cold cavity.

[0026] From the above technical solutions, the present application has the following advantages:

[0027] The cable dehumidification semiconductor drying and heating gas treatment device provided by the embodiment has the advantages that: the semiconductor refrigerator is small in size, and can realize refrigeration and heating in the compact space of the embodiment, thereby reducing the size and weight of the whole machine; and since the air inlet, the at least two groups of cold and hot cavities and the air outlet are sequentially communicated, and each group of cold and hot cavities comprises the cold cavity and the hot cavity with the water outlet sequentially communicated, after the air enters, the air is first subjected to preliminary drying and temperature rising treatment in the first group of cold and hot cavities, that is, the air is first condensed and dried in the cold cavity, and then heated and raised in temperature in the hot gas, in the first treatment, the semiconductor refrigerator cooperates with the detection assembly and the controller to reduce the temperature and the water content of the air to a preset intermediate range, and then the air subjected to the preliminary drying and temperature rising treatment is subjected to secondary drying and temperature rising treatment in the second group of cold and hot cavities, the heating gas can increase the temperature difference in the second cooling process, thereby accelerating the condensation of water, in the second treatment, the semiconductor refrigerator cooperates with the detection assembly and the controller to reduce the humidity of the air to the range required by the cable dehumidification, thereby realizing accurate control of the temperature and the water content of the air; and the problems of large size and poor dehumidification effect of the existing air device for cable dehumidification are solved. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative labor.

[0029] Figure 1 A horizontal sectional view of the cable dehumidification semiconductor drying and heating gas treatment device provided by the embodiment of the present application;

[0030] Figure 2 A vertical sectional view of the first cold cavity and the first hot cavity provided by the embodiment of the present application;

[0031] Figure 3 A vertical sectional view of the first hot cavity and the second cold cavity provided by the embodiment of the present application;

[0032] Figure 4 A vertical sectional view of the second cold cavity and the second hot cavity provided by the embodiment of the present application.

[0033] Reference signs:

[0034] 1, housing; 10, air inlet; 11, air outlet; 12, water outlet; 13, cold and hot cavity; 13a, first cold and hot cavity; 13b, second cold and hot cavity; 130, cold cavity; 130a, first cold cavity; 130b, second cold cavity; 131, hot cavity; 131a, first hot cavity; 131b, second hot cavity; 14, first vertical partition; 140, first flow-through hole; 15, second vertical partition; 150, second flow-through hole; 16, elbow; 2, semiconductor refrigerator; 20, DC power supply; 200, DC power supply charging port; 3, detection assembly; 4, control assembly; 5, condensation assembly; 50, condensation fin; 6, heat dissipation assembly; 60, heat dissipation fin. DETAILED DESCRIPTION

[0035] The embodiment of the present application provides a cable moisture-removing semiconductor drying and heating gas treatment device, which is used for solving the technical problems of large volume and poor moisture-removing effect of the existing air device for cable moisture removal.

[0036] In order to make the invention purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the following described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0037] Please refer to Figures 1 to 4 The present application provides a cable moisture-removing semiconductor drying and heating gas treatment device, which comprises:

[0038] A housing is provided with an air inlet, an air outlet and a water outlet; the housing has at least two groups of cold and hot cavities 13; from the air inlet 10 to the air outlet 11, the air inlet 10, the at least two groups of cold and hot cavities 13 and the air outlet 11 are sequentially communicated, and each group of cold and hot cavities 13 comprises a cold cavity 130 and a hot cavity 131 with a water outlet 12 which are sequentially communicated;

[0039] At least two semiconductor refrigerators 2 are provided, the hot end of the semiconductor refrigerator 2 is arranged in the hot cavity 131, and the cold end of the semiconductor refrigerator 2 is arranged in the cold cavity 130;

[0040] A detection assembly 3 is arranged, which is used for detecting the temperature and water content of the gas in each cavity;

[0041] The control component 4 is electrically connected to the detection component 3 and the semiconductor refrigerator 2. The control component 4 is used to receive the temperature and water content data of the detection component 3 and adjust the cooling capacity and heating capacity of the semiconductor refrigerator 2 according to the temperature and water content data.

[0042] During the working process of this embodiment, the air outlet 11 of the semiconductor drying and heating gas treatment device for cable dehumidification is connected to the cable, and then the air or the gas to be treated is pumped into the semiconductor drying and heating gas treatment device for cable dehumidification through the air inlet 10. The air enters the cold chamber 130 (hereinafter referred to as the first cold chamber 130a) of the first cold and hot chamber 13a for condensation and drying to remove water. Then, the air enters the hot chamber 131 (hereinafter referred to as the first hot chamber 131a) of the first cold and hot chamber 13a for the first temperature increase, so that the temperature and moisture content of the air reach the first gradient range. Then the air will enter the cold chamber 130 (hereinafter referred to as the second cold chamber 130b) of the second cold and hot chamber 13 for condensation, drying and dehumidification. Finally, the air will enter the hot chamber 131 (hereinafter referred to as the second hot chamber 131b) of the second cold and hot chamber 13b for a second temperature increase, and finally pass into the cable for dehumidification. When the air enters each cavity, the detection component 3 will detect and record the temperature and moisture content of the air, and feed back to the detection component 3 to control the cooling capacity or heating capacity of the semiconductor refrigerator 2 in each chamber, so that the temperature and moisture content of the air reach the preset standards of the chamber.

[0043] As can be seen from the above process, the moisture content and temperature of the air will be recorded when it enters the first cold chamber 130a. The detection component 3 will then transmit the moisture content and temperature to the control component 4. The control component 4 will make a judgment based on the moisture content and temperature and the preset threshold value to determine whether it is necessary to adjust the cooling capacity of the current cold chamber 130 so that the moisture content and temperature of the air are adjusted to within the preset range. Then, when the air enters the first hot chamber 131a and other chambers, the moisture content and temperature will also be recorded. The steps are similar to those of the first cold chamber 130. The entire dehumidification process of the air is carried out under the signal detection of the detection component 3 and the control component 4.

[0044] Compared with the prior art, the advantages of this embodiment are:

[0045] First, it is small in size and highly portable. In this embodiment, both cooling and heating are achieved through the semiconductor refrigerator 2. Compared with the prior art, which uses nitrogen bottles, desiccants, water-cooled and air-cooled dehumidifiers, etc., the semiconductor refrigerator 2 in this embodiment is small in size and light in weight. The entire device can be carried to various complex environments and narrow spaces for application without explosion hazard, making it more suitable for on-site working environments.

[0046] Secondly, the control of temperature and humidity is more precise. On the one hand, the air is first dried and heated in the first hot and cold chamber 13a, and the temperature and moisture content of the air are reduced from the external environment temperature and moisture content to the temperature and moisture content of the preset first gradient. Then, the air is dried and heated in the second hot and cold chamber 13b for the second time, and the temperature and moisture content of the air are reduced from the preset first gradient to the second gradient. The gradient heating and dehumidification are carried out, and the temperature difference and moisture content difference of each heating and dehumidification are small, avoiding the one-time heating and dehumidification in the prior art, which has large temperature difference and moisture content difference, and also large error, making it impossible to accurately control the temperature and moisture content of the air. On the other hand, when the air is processed in each chamber, there are detection components 3 and control components 4 to perform detection and control, so the temperature and moisture content of the air are more accurately controlled.

[0047] Third, the processing time is short. Compared with the prior art which only adopts one-time heating and dehumidification, the time required from detecting that the cable needs to be dehumidified to outputting suitable air is relatively long. The dehumidified air of this embodiment is adjusted multiple times and quickly in the two sets of hot and cold chambers 13, so that the temperature and moisture content of the air quickly reach the required standards, which will not delay the dehumidification treatment of the cable, reduce the risk of the cable being damaged by moisture, and better carry out emergency repair work.

[0048] In a specific embodiment, Figure 1 As shown, a feasible structure of the housing 1 is further provided, wherein the air inlet 10 and the air outlet 11 are arranged on the same side of the housing wall 1, and the two groups of cold and hot cavities 13 are arranged symmetrically, that is, as shown in FIG. Figure 1 The internal space of the entire shell 1 forms a "田"-shaped structure. When it is implemented, the air flows from Figure 1 The air enters from the left air inlet 10, and is processed in the first cold chamber 130a, the first hot chamber 131a, the second cold chamber 130b, and the second hot chamber 131b in sequence. The air forms a "C"-shaped arc flow trajectory inside the housing 1, and finally flows out from the first cold chamber 130a, the first hot chamber 131a, the second cold chamber 130b, and the second hot chamber 131b. Figure 1 When the air outlet 11 leaves on the left side, the arc-shaped flow will cause a certain degree of disturbance and eddy current in the air, which helps to break the air boundary layer, make the air more fully contact with the surface of the dehumidification equipment or the dehumidification medium, and improve the dehumidification efficiency; moreover, after the "田"-shaped structure is formed inside the shell 1, the spatial layout is more compact, and the volume of the entire device is smaller, and it can be carried to small spaces such as cable trenches, cable shafts, and cable tunnels for application.

[0049] In one embodiment, the internal structure of the housing 1 is further provided, such as Figure 1As shown, the inner wall of the shell 1 is fixed with a first vertical partition plate 14 and a plurality of second vertical partition plates 15; the first vertical partition plate 14 separates the inner part of the shell into two cold and hot cavities 13, the top of the first vertical partition plate 14 is provided with a first flow communication hole 140 for communicating different cold and hot cavities 13, the first flow communication hole 140 communicates the first hot cavity 131a with the second cold cavity 130b; the second vertical partition plate 15 is arranged in the cold and hot cavity 13, and the second vertical partition plate 15 separates the cold and hot cavity 13 into a cold cavity 130 and a hot cavity 131, and the second vertical partition plate 15 is provided with a second flow communication hole 150, and the second vertical partition plate 15 is installed with a semiconductor refrigerator 2; in specific implementation, the first vertical partition plate 14 can separate two cold and hot cavities 13, and the second vertical partition plate 15 can separate the cold cavity 130 and the hot cavity 131, so as to realize the air flow.

[0050] Among them, the first vertical partition plate 14 and the second vertical partition plate 15 are hollow inside, the hollow space of the first vertical partition plate 14 is provided with the power supply, the wire and the control assembly 4 of the semiconductor refrigerator 2, the two second vertical partition plates 15 are each provided with a mounting position of the semiconductor refrigerator 2, the semiconductor refrigerator 2 is mounted on the second vertical partition plate 15, the cold end of the semiconductor refrigerator 2 is arranged towards the cold cavity 130, and the hot end of the semiconductor refrigerator 2 is arranged towards the hot cavity 131.

[0051] Based on the above embodiment, in order to increase the flow trajectory and flow time of the gas, as shown in the figure, Figures 2 to 4 As shown, the height of the air inlet, the air outlet and the first flow communication hole 140 is higher than the height of the second flow communication hole 150, wherein the first flow communication hole 140 is a communication hole between adjacent cold and hot cavities 13, that is, the first flow communication hole 140 is a communication hole between the first hot cavity 131a and the second cold cavity 130b; the second flow communication hole 150 is a communication hole between the cold cavity 130 and the hot cavity 131 of the same cold and hot cavity 13, that is, the second flow communication hole 150 is a communication hole between the first cold cavity 130a and the first hot cavity 131a, or a communication hole between the second cold cavity 130b and the second hot cavity 131b; in specific implementation, the air enters from the air inlet, then contacts the cold end of the semiconductor refrigerator 2 or the condensing assembly 5, and the air is cooled and sinks until it contacts the second flow communication hole 150, so that the air can enter the hot cavity 131; when the air entering the hot cavity 131 contacts the hot end of the semiconductor refrigerator 2 or the heat dissipation assembly 6, the air is heated and floats up until it contacts the first flow communication hole 140 to enter the cold cavity 130 of the next group of cold and hot cavities 13, and then the flow trajectory of the air is the same as that in the first cold and hot cavity 13, thereby effectively prolonging the flow trajectory of the gas.

[0052] Based on the above embodiment, in order to improve the heat preservation performance of the shell 1, as shown in the figure, Figure 1As shown, the hot cavity 131 and the cold cavity 130 are both wrapped with insulation material, that is, the shell 1 is composed of a plurality of hollow walls, the hollow inner wall of the shell 1 is filled with insulation material, and the inside of the first vertical partition 14 and the plurality of second vertical partitions 15 are also paved with insulation material in addition to the power supply, wires and control components 4. In a specific implementation, after the hot cavity 131 and the cold cavity 130 are both wrapped with insulation material, heat loss can be avoided when air flows inside the device, and temperature control is better.

[0053] The heat-insulating material may be heat-insulating cotton, the filling thickness of which is at least 1 cm, or the heat-insulating material may be heat-insulating foam, or the heat-insulating material may be a heat-insulating material composited with silica gel, core material, and getter.

[0054] Based on the above embodiment, in order to improve the sealing performance of the housing 1, as shown in FIG. Figure 2 and Figure 4 As shown, the water outlet 12 is connected to the elbow 16 through a pipeline. The water inlet end of the elbow 16 is arranged on the inner bottom surface of the cold chamber 130. The height of the water inlet end of the elbow 16 is higher than the height of the water outlet 12, and the height of the water inlet end of the elbow 16 is lower than the height of the peripheral edge of the inner bottom surface of the cold chamber 130. That is, the inner bottom surface of the cold chamber 130 is inclined, and is inclined from the peripheral edge of the cold chamber 130 to the water inlet end of the elbow 16. After the moisture in the air condenses and drips, it will flow from the inclined surface to the elbow 16. The setting of the U-shaped elbow 16 with unequal heights at both ends plays a sealing role. The improvement of the sealing performance helps to control the moisture content of the air. A horizontal pipe is connected to the U-shaped elbow 16 to discharge the condensed water out of the chamber from the water outlet 12. In specific implementation, the condensed water in the first cold chamber 130a and the second cold chamber 130b can be discharged from the elbow 16 to the water outlet 12.

[0055] In a specific embodiment, Figure 1 As shown, a feasible structure of the detection component 3 is further provided. The detection component 3 includes multiple groups of temperature sensors and humidity sensors. One group of temperature sensors and humidity sensors is arranged at the air inlet 10 of the shell 1, for detecting the temperature and moisture content of the air entering the shell 1; one group of temperature sensors and humidity sensors is arranged at the second through hole, for detecting the temperature and moisture content of the air when entering the hot chamber 131 from the cold chamber 130; and one group of temperature sensors and humidity sensors is arranged at the first through hole, for detecting the temperature and moisture content of the air when entering the cold chamber 130 from the hot chamber 131.

[0056] In a specific embodiment, Figure 1As shown, further provided is an implementable structure of the control component 4, which is electrically connected with the detection component 3, i.e. the control component 4 is connected with the plurality of temperature sensors and humidity sensors. In actual implementation, when the air enters the air inlet 10, the temperature and water content data of the air are synchronously transmitted to the control component 4, which compares the received data with the first threshold range to determine whether the current entering air is within the first threshold range. If the current air is within the first threshold range, the cold end of the semiconductor refrigeration sheet is controlled to be refrigerated at a regular temperature. If the current air is not within the first threshold range, the cold end of the semiconductor refrigeration sheet is controlled to be refrigerated at a temperature higher or lower than the regular temperature to make the air in the cold cavity 130 be first condensed and dried, so that the temperature of the air treated by the cold cavity 130 is within the first temperature range and the water content of the air is within the first water content range. When the air enters the second flow-through hole 150, the temperature and water content data of the air are synchronously transmitted to the control component 4, which compares the received data with the second threshold range to determine whether the current entering air is within the second threshold range. If yes, the hot end of the semiconductor refrigeration sheet is controlled to be radiated at a regular temperature. If the current air is not within the second threshold range, the hot end of the semiconductor refrigeration sheet is controlled to be heated at a temperature higher or lower than the regular temperature to make the air in the hot cavity 131 be first warmed up, so that the temperature of the air treated by the cold cavity 130 is within the second temperature range and the water content of the air is within the second water content range. Subsequently, the air enters the first flow-through hole 140, and the principle and processing process of comparison with the third threshold are the same as when the air enters the air inlet 10. Then, the air enters the second flow-through hole 150 of the different cold and hot cavities 13, and the principle and processing process of comparison with the fourth threshold are the same as when the air enters the second flow-through hole 150, which will not be described herein.

[0057] In a specific application scenario, it is assumed that the temperature of the external environment air is 30℃ and the water content is 80%, the target dehumidified air temperature is 40℃ and the water content is 30%, the set first threshold range is temperature 15-25℃ and water content 75-85%, the second threshold range is temperature 15-25℃ and water content 55-65%, the third threshold range is temperature 30-40℃ and water content 55-65%, the fourth threshold range is temperature 20-30℃ and water content 28-32%, and the fifth threshold range is temperature 39-41℃ and water content 29-31%. When the air enters the air inlet 10, it is detected that the temperature and water content of the air are within the first threshold range, then the cold end of the semiconductor refrigeration sheet is controlled to be refrigerated at a regular temperature, then the air enters different cavities in turn, and the temperature and water content of the air are detected and determined. If normal, the normal operation of the semiconductor refrigeration sheet is maintained. If the temperature and water content of the air in a certain cavity exceed the set threshold, the refrigeration or heating capacity of the semiconductor refrigeration sheet of the next chamber is adjusted to make the final air fall within the fifth threshold range to achieve the target dehumidified air temperature and water content.

[0058] In a specific embodiment, Figures 1 to 4 As shown, in order to improve the cooling and heat dissipation efficiency, a condensing component 5 is provided in the cold chamber 130, and a heat dissipation component 6 is provided in the hot chamber 131; the condensing component 5 is connected to the cold end of the semiconductor refrigerator 2, and the heat dissipation component 6 is connected to the hot end of the semiconductor refrigerator 2. In specific implementation, after the air enters the cold chamber 130, the air will come into contact with the condensing component 5, and the water vapor in the air will drip along the condensing component 5 and enter the water inlet end of the elbow 16, and finally be discharged from the drain port; after the air enters the hot chamber 131, the air will fully contact the heat dissipation component 6 for heat exchange, thereby improving the heat exchange efficiency of the air in the cold chamber 130 and the hot chamber 131.

[0059] In one embodiment, a feasible structure of the condensation component 5 is further provided, such as Figure 1 As shown, the condensation component 5 includes a plurality of condensation sheets 50, which are arranged regularly. In specific implementation, after the air enters, the air will penetrate into the gaps between the condensation sheets 50 and fully contact the condensation sheets 50. After the moisture in the air contacts the condensation sheets 50, it will condense and separate from the air.

[0060] There are various ways to regularly arrange the multiple condensing sheets 50. The multiple condensing sheets 50 can be evenly arranged at preset intervals, or they can be arranged on opposite sides of an axis.

[0061] In this embodiment, if Figure 1 As shown, the condensing sheet 50 is specifically an L-shaped condensing sheet 50; a plurality of L-shaped condensing sheets 50 are arranged on opposite sides of the second connecting hole to form an air flow channel, and the L-shaped condensing sheets 50 on the same side are arranged at intervals to form a multi-layer condensing sheet 50 structure that is nested in sequence, that is, the space of the cold cavity 130 is covered as much as possible in the horizontal direction; along the gas flow direction, the height of the L-shaped condensing sheet 50 gradually becomes smaller, and the bottom of the L-shaped condensing sheet 50 is inclined, that is, the space of the cold cavity 130 is covered as much as possible in the vertical direction, so that the L-shaped condensing sheet 50 covers the space of the cold cavity 130 as much as possible in both the horizontal and vertical directions, and the air entering the cold cavity 130 can contact and condense with the plurality of L-shaped condensing sheets 50 to the greatest extent.

[0062] In one embodiment, a feasible structure of the heat dissipation component 6 is further provided, such as Figure 1 As shown, the heat dissipation assembly 6 includes a plurality of heat sinks 60, which are arranged regularly. In specific implementation, after the air enters, the air will penetrate into the gaps between the heat sinks 60 and fully contact the heat sinks 60. The air will fully abut against the heat sinks 60 for heat exchange, and the temperature of the air will rise.

[0063] In this embodiment, if Figure 1As shown, the heat dissipation fins 60 are L-shaped heat dissipation fins 60, and a plurality of L-shaped heat dissipation fins 60 are arranged on opposite sides of the second communication hole to form an air flow channel, and the L-shaped heat dissipation fins 60 on the same side are arranged at intervals to form a plurality of layers of heat dissipation fins 60 in turn, that is, to cover the space of the hot cavity 131 as much as possible from the horizontal direction; the L-shaped heat dissipation fin 60 comprises a first fin body and a second fin body; the first fin body is located above the communication port of the cold cavity 130 and the hot cavity 131, and the second fin body is aligned with the communication port, that is, along the direction of gas flow, when the air flows out of the second flow-through hole 150, the air will first contact heat exchange at the bottom of the first fin body, and as the air flows, the air will contact heat exchange with the second fin body in front, and a plurality of L-shaped heat dissipation fins 60 cover the vertical space of the entire hot cavity 131, so that the air entering the hot cavity 131 can be in contact with the plurality of L-shaped heat dissipation fins 60 to the greatest extent and heat exchange.

[0064] In a specific embodiment, as shown in Figures 1 to 4 Further, the semiconductor refrigerator 2 is an equipment that forms one end refrigeration and one end heating through Peltier effect, and the semiconductor refrigerator 2 is electrically connected to the control assembly 4, and the direct current power supply 20 of the semiconductor refrigerator 2 is arranged in the hollow part through the first vertical partition 14, and the direct current power supply charging port 20 is arranged on the shell 1 for charging.

[0065] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

[0066] Finally, it should be noted that in this paper, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations.

Claims

1. A semiconductor drying and heating gas treatment device for cable dehumidification, characterized in that: include: A housing, wherein the housing is provided with an air inlet, an air outlet, and a water outlet; and the housing has at least two sets of hot and cold chambers; In the gas flow direction from the air inlet to the air outlet, the air inlet, at least two groups of the cold and hot chambers and the air outlet are connected in sequence, and each group of the cold and hot chambers includes a cold chamber and a hot chamber with the water outlet connected in sequence; At least two semiconductor refrigerators, wherein the hot end of the semiconductor refrigerator is arranged in the hot cavity, and the cold end of the semiconductor refrigerator is arranged in the cold cavity; A detection component, the detection component is used to detect the temperature and water content of the gas in each cavity; a control component, the control component being electrically connected to the detection component and the semiconductor refrigerator, the control component being used to receive temperature and water content data of the detection component and to adjust the cooling capacity and heating capacity of the semiconductor refrigerator according to the temperature and water content data; A condensing component is provided in the cold chamber, and a heat dissipation component is provided in the hot chamber; the condensing component is connected to the cold end of the semiconductor refrigerator, and the heat dissipation component is connected to the hot end of the semiconductor refrigerator; The condensing assembly includes a plurality of condensing sheets, and the plurality of condensing sheets are regularly arranged; The condensing sheet is an L-shaped condensing sheet; along the gas flow direction, the height of the L-shaped condensing sheet gradually decreases, and the bottom of the L-shaped condensing sheet is inclined; The heat dissipation assembly includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are regularly arranged; The heat sink is an L-shaped heat sink; the L-shaped heat sink includes a first plate and a second plate; the first plate is located above the communication port between the cold cavity and the hot cavity, and the second plate is aligned with the communication port.

2. The semiconductor drying and heating gas treatment device for cable moisture removal according to claim 1, characterized in that: The air inlet and the air outlet are arranged on the same shell wall side of the shell, and the two groups of cold and hot cavities are centrally symmetrically arranged.

3. The semiconductor drying and heating gas treatment device for cable moisture removal according to claim 2, characterized in that: A first vertical partition and a plurality of second vertical partitions are fixed to the inner wall of the shell; The first vertical partition separates the interior of the shell into at least two cold and hot chambers, and a first flow hole for connecting different cold and hot chambers is provided on the top of the first vertical partition; The second vertical partition is arranged in the cold and hot chamber, and the second vertical partition divides the cold and hot chamber into the cold chamber and the hot chamber. The second vertical partition is provided with a second flow hole, and the semiconductor refrigerator is installed on the second vertical partition.

4. The semiconductor drying and heating gas treatment device for cable moisture removal according to claim 3, characterized in that: The heights of the air inlet, the air outlet, and the first flow hole are all higher than the height of the second flow hole.

5. The semiconductor drying and heating gas treatment device for cable moisture removal according to claim 1, characterized in that: The hot cavity and the cold cavity are both wrapped with heat insulation materials; The water outlet is connected to a bend pipe through a pipeline, and the water inlet end of the bend pipe is arranged on the inner bottom surface of the cold chamber. The height of the water inlet end of the bend pipe is higher than the height of the water outlet, and the height of the water inlet end of the bend pipe is lower than the height of the peripheral edge of the inner bottom surface of the cold chamber.

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