A device and method for continuously cutting light-transmitting hard and brittle material wafers with time-delayed synchronization

Abstract

This invention discloses a time-differential synchronous continuous cutting device and method for translucent hard and brittle material wafers, belonging to the field of translucent hard and brittle material crystal cutting technology. The cutting device includes: a granite base, a bearing rotation mechanism, a two-degree-of-freedom laser cutting mechanism, a two-degree-of-freedom diamond wire saw cutting mechanism, and an automated control system. It employs a time-differential synchronous action of laser and diamond wire saw on the bottom of the translucent hard and brittle material crystal, cutting the crystal from bottom to top. This method rationally utilizes the advantages of laser cutting and wire saw cutting, forming a composite motion spiral processing trajectory. It also rationally arranges the modified layer, guiding the direction of the crack zone. The diamond wire saw's cutting direction is opposite to the rotation direction of the translucent hard and brittle material crystal, and the processing proceeds from the outside to the inside, ensuring point contact between the cutting line and the cutting position of the translucent hard and brittle material crystal. This high-efficiency cutting of the translucent hard and brittle material crystal improves the surface quality of the translucent hard and brittle material wafer.

Description

Technical Field

[0001] This invention belongs to the field of laser processing and heating cutting technology, specifically relating to a time-differential synchronous continuous cutting device and method for translucent hard and brittle material wafers. Background Technology

[0002] Transparent, hard, and brittle crystal materials are widely used in semiconductors, electronic components, and other fields. Third-generation wide-bandgap semiconductor materials, represented by silicon carbide, are core materials for developing high-power, high-frequency, high-temperature, and high-radiation-resistant blue lasers and ultraviolet detectors. Due to their advantages such as wide bandgap, high thermal conductivity, high electron saturation drift velocity, high critical breakdown electric field, low dielectric constant, and good chemical stability, they have broad application prospects in communications, automobiles, aviation, aerospace, oil extraction, and national defense.

[0003] The first step in silicon carbide wafer fabrication is dicing, and the industry is currently shifting towards thinner wafers, smaller feature sizes, and larger dimensions. Dicing translucent, hard, and brittle material wafers has evolved into a key process step that can increase the yield of silicon carbide devices. Existing technologies for separating translucent, hard, and brittle material wafers use diamond wire sawing or laser cutting. Diamond wire sawing has a low cutting speed, and the wear of the diamond wire saw and the loss of the translucent, hard, and brittle material crystals are high, resulting in higher costs. Diamond wire sawing can also cause chipping and delamination at the chip edges.

[0004] As the size of translucent, hard, and brittle material wafers increases, the cumulative runway length gradually increases, exceeding the capability of a standard wire saw to complete the entire cut. During laser cutting, the laser beam is focused on the target area. The translucent, hard, and brittle material crystal absorbs the laser pulse energy to the point of reaching the damage threshold, causing internal modification. This results in significant heat-affected zones and microcracks. The blue film may also be affected by heat, impacting subsequent packaging processes. Furthermore, the ablation rate is very low, requiring multiple passes to separate the chip. Therefore, how to efficiently cut translucent, hard, and brittle material crystals to obtain high-precision planar translucent, hard, and brittle material wafers is a pressing problem to be solved. Summary of the Invention

[0005] The purpose of this invention is to solve the above-mentioned technical problems by providing a time-differential synchronous continuous cutting apparatus and method for translucent hard and brittle material wafers.

[0006] A time-differential synchronous continuous dicing method for translucent, hard, and brittle material wafers includes:

[0007] A laser beam is focused on the transparent, hard, and brittle material crystal to be processed, and a modified part is formed after a time S.

[0008] Diamond wire saw cutting of modified section;

[0009] The laser beam and the diamond wire saw move along the same trajectory, with a time difference of S.

[0010] The modified part is formed when the pulse energy after laser focusing reaches the damage threshold of the transparent hard and brittle material crystal;

[0011] The transparent, hard, and brittle material crystal to be processed rotates, and the laser beam and diamond wire saw cut spirally from the outside in.

[0012] The laser beam is focused from above the light-transmitting, hard, and brittle material crystal to be processed and shines downwards; the diamond wire saw cuts layer by layer from bottom to top, cutting the light-transmitting, hard, and brittle material crystal into multiple sheet-like crystals.

[0013] Another object of the present invention is to provide a dedicated device for implementing the method.

[0014] A time-differential synchronous continuous cutting device for translucent hard and brittle material wafers includes: a base, a bearing rotation mechanism, a two-degree-of-freedom laser cutting mechanism, a two-degree-of-freedom diamond wire saw cutting mechanism, and a controller;

[0015] The bearing rotation mechanism is fixed on the base, and the bearing rotation mechanism clamps and drives the light-transmitting hard and brittle material crystal column to be processed to rotate.

[0016] The two-degree-of-freedom laser cutting mechanism includes a laser assembly and a laser slide.

[0017] The two-degree-of-freedom diamond wire saw cutting mechanism includes a wire cutting assembly and a wire saw cutting slide.

[0018] The laser slide and the wire saw cutting slide are installed on the outer periphery of the transparent hard and brittle material crystal to be processed and fixed on the base. Under the control of the controller, the two slides slide inward, outward, up and down relative to the transparent hard and brittle material crystal.

[0019] The laser assembly is mounted on the laser slide, and the laser cutting head is positioned above the transparent, hard, and brittle material crystal.

[0020] The wire EDM assembly is mounted on the wire saw cutting slide, and the diamond wire saw makes point contact with the crystal of the light-transmitting, hard, and brittle material.

[0021] The load-bearing rotation mechanism includes: a load-bearing support frame, a first load-bearing roller, a second load-bearing roller, a first drive assembly, and a second drive assembly;

[0022] The bottom end of the bearing support frame is fixed to the base, and the first bearing roller and the second bearing roller are connected to the bearing support frame on their upper and lower shafts. The two are driven by the first driving component and the second driving component fixed to the lower side of the bearing support frame.

[0023] Both the first drive assembly and the second drive assembly include a DC servo motor and a coupling, and are connected to the controller;

[0024] The axial distance between the first and second bearing rollers is smaller than the diameter of the transparent, hard, and brittle crystal column.

[0025] The light-transmitting, hard, and brittle material crystal column is held and driven to rotate on one side by two bearing rollers, and on the other side by two driven rollers of the retractable driven rotating component in the two-degree-of-freedom diamond wire saw cutting mechanism.

[0026] The two-degree-of-freedom diamond wire saw cutting mechanism and the two-degree-of-freedom laser cutting mechanism are installed at an angle of 90°.

[0027] The two-degree-of-freedom diamond wire saw cutting mechanism includes: a wire cutting assembly, a retractable driven rotation assembly, a wire cutting Z-axis moving assembly, and a wire cutting Y-axis moving assembly;

[0028] The wire cutting assembly includes: a fifth drive assembly, a wire drive wheel, a wire driven wheel, a diamond wire saw, a tension wheel, and a telescopic rod;

[0029] The wire drive wheel, the wire driven wheel, and the tension wheel are axled to the wire cutting Z-axis moving platform of the wire cutting Z-axis moving assembly, and the three are connected by a diamond wire saw transmission.

[0030] The wire drive wheel is driven by the fifth drive assembly, which drives the diamond wire saw to rotate in the opposite direction to the crystal of the light-transmitting hard and brittle material, and the position where it cuts the columnar crystal is in point contact; the fifth drive assembly is connected to the controller.

[0031] The tensioning wheel is axially connected to the telescopic rod, and the telescopic rod is adjusted relative to the Z-axis moving platform of the wire cutting machine along the Y-axis position to adjust the tension of the diamond wire saw.

[0032] The wire cutting Z-axis moving platform is equipped with a retractable driven rotating assembly at its front end, and a wire cutting assembly is located at the lower part of the retractable driven rotating assembly. The retractable driven rotating assembly includes a driven roller, a driven roller support frame, and a compression spring. The driven roller support frame can slide forward and backward relative to the wire cutting Z-axis moving platform, and a compression spring is provided between the two. The driven roller is axially connected to the front end of the driven roller support frame and contacts the columnar outer wall of the light-transmitting hard and brittle material crystal, providing support.

[0033] The wire cutting Z-axis moving assembly includes a wire cutting Z-axis moving platform, a sixth drive assembly, and a third ball screw; the wire cutting Z-axis moving platform moves along the third ball screw in the Z-axis on the wire cutting Y-axis moving base under the drive of the sixth drive assembly.

[0034] The wire cutting Y-axis moving assembly includes a wire cutting Y-axis moving base, a seventh drive assembly, a fourth ball screw, and a wire cutting base; the wire cutting Y-axis moving base moves in the Y-axis along the fourth ball screw under the drive of the seventh drive assembly; the sixth drive assembly and the seventh drive assembly are both composed of a DC servo motor and a coupling.

[0035] The two-degree-of-freedom laser cutting mechanism includes a laser assembly, a laser Z-axis movement assembly, and a laser X-axis movement assembly. The laser assembly includes a laser cutting head, a laser generator, a laser power line, and a laser power supply. The laser cutting head is fixed to the laser generator and is used to focus the laser beam onto the target position at the bottom of the crystal. The laser generator is connected to the laser power supply via the laser power line to emit the laser beam and is fixed to the laser Z-axis movement platform.

[0036] The laser Z-axis movement assembly includes a laser Z-axis movement platform, a third drive assembly, and a first ball screw. The third drive assembly drives the laser Z-axis movement platform to move along the first ball screw in the Z-axis on the laser X-axis movement base. The third drive assembly includes a DC servo motor and a coupling.

[0037] The laser X-axis moving assembly includes a laser X-axis moving base, a fourth driving assembly, a second ball screw, and a laser cutting base. The laser X-axis moving base moves along the second ball screw on the laser cutting base in the X-axis direction under the drive of the fourth driving assembly. The fourth driving assembly includes a DC servo motor and a coupling.

[0038] The outer periphery of the light-transmitting hard and brittle material crystal column is provided with an arc-shaped slide on the base, which is concentric with the light-transmitting hard and brittle material crystal. It is slidably connected to the laser slide table and the wire saw cutting slide table. Under the control of the controller, the two slide freely in the arc-shaped slide table to adjust the included angle between the laser slide table and the wire saw cutting slide table.

[0039] A turntable is provided between the laser assembly and the laser slide.

[0040] A method of using a time-differential synchronous continuous cutting device for translucent, hard, and brittle material wafers includes:

[0041] 1) Set the same cutting trajectory for the laser cutting head and the diamond wire saw on the controller;

[0042] 2) Calculate the time S required for the laser beam of the laser cutting head to focus and form the modified part of the transparent hard and brittle material crystal to be processed;

[0043] 3) Start the bearing rotation mechanism, and the two bearing rollers on it rotate in the same direction, driving the light-transmitting hard and brittle material crystal to rotate in a circular motion; the controller starts the laser slide, and the laser cutting head runs in a straight line from the outside to the inside according to the set trajectory. The circular motion and the linear motion combine to form a spiral trajectory. The laser beam of the laser cutting head is focused from top to bottom to the lower end of the light-transmitting hard and brittle material crystal at the processing height.

[0044] 4) After time S, the edges of the translucent hard and brittle material crystals form modified parts, accompanied by the formation of crack zones. The load-bearing rotation mechanism is started, the controller starts the wire saw cutting slide, and the diamond wire saw moves in a straight line from the outside to the inside according to the set cutting trajectory, cutting point by point, and forming a spiral line cutting trajectory.

[0045] The modified part is formed by the pulse energy after laser focusing reaching the damage threshold of the transparent hard and brittle material crystal.

[0046] The diamond wire saw cuts layer by layer from bottom to top, cutting the translucent, hard, and brittle material crystal into multiple sheet-like crystals.

[0047] The rotation direction of the diamond wire saw is opposite to that of the translucent, hard, and brittle crystal to be processed;

[0048] The laser generator has a laser wavelength of 500-600nm, a power of 4-5kw, and a laser cutting head travel speed of 100-200nm / s. The modified part and the crack zone are both in the micron range.

[0049] The cutting speed of the diamond wire saw is 1000-1400 m / min, and the rotation speed of the transparent hard and brittle material crystal 300 is 300-600 m / min;

[0050] The thickness of the stripped transparent hard and brittle material wafer is <500μm, the kerf width is <20μm, the average processing loss per wafer is <30μm, the cutting time per wafer is <35 minutes, the crystal surface roughness is <5μm, the curvature is less than 30μm, the total thickness deviation is <20μm, the damage layer depth is <20μm, and the ratio of the maximum surface crack depth to the damage layer depth is <80%.

[0051] This invention provides a time-differential synchronous continuous cutting device and method for translucent hard and brittle material wafers, belonging to the field of translucent hard and brittle material crystal cutting technology. The cutting device includes: a granite base, a bearing rotation mechanism, a two-degree-of-freedom laser cutting mechanism, a two-degree-of-freedom diamond wire saw cutting mechanism, and an automated control system. It employs a method where the laser and diamond wire saw act synchronously and differentially on the bottom of the translucent hard and brittle material crystal, cutting the crystal from bottom to top. This method rationally utilizes the advantages of laser cutting and wire saw cutting, forming a spiral processing trajectory with composite motion. The modified part is rationally arranged to guide the direction of the crack zone. The diamond wire saw's cutting direction is opposite to the rotation direction of the translucent hard and brittle material crystal, and the processing is done step-by-step from the outside to the inside, ensuring point contact between the cutting line and the cutting position of the translucent hard and brittle material crystal. This high-efficiency cutting of the translucent hard and brittle material crystal improves the surface quality of the translucent hard and brittle material wafer.

[0052] This invention employs simultaneous laser and diamond wire saw cutting to cut transparent, hard, and brittle material crystals from bottom to top. The laser cutting focus points are all processed along a spiral trajectory, with a rationally arranged modified part that guides the direction of the crack zone. The diamond wire saw operates in the opposite direction to the crystal's rotation, and the processing proceeds from the outside in, ensuring point contact between the cutting line and the cutting position of the transparent, hard, and brittle material crystal. This improves cutting accuracy, reduces processing losses, and enhances the surface quality of the transparent, hard, and brittle material wafer.

[0053] The advantages and benefits of the time-differential synchronous continuous cutting device and method for translucent hard and brittle material wafers of the present invention compared with the prior art are as follows:

[0054] 1. The present invention provides a time-differential synchronous continuous cutting device for translucent hard and brittle material wafers. The laser cutting focus points are all processed along a spiral trajectory. The modified part is reasonably arranged to guide the direction of the crack zone. The diamond wire saw operates in the opposite direction to the rotation direction of the translucent hard and brittle material crystal. The processing is carried out from the outside to the inside to ensure that the cutting line and the cutting position of the translucent hard and brittle material crystal are in point contact, reducing the contact overlap area and the cutting span. This method can cut translucent hard and brittle material crystals with high efficiency, improve cutting accuracy, and reduce processing losses.

[0055] 2. The differential synchronous continuous cutting device for light-transmitting hard and brittle material wafers of the present invention can perform multiple continuous processing with only one clamping and positioning, reducing the time for preparation work such as polishing and clamping, and meeting the current market demand for high-precision light-transmitting hard and brittle material wafers.

[0056] 3. The present invention provides a time-synchronous continuous cutting method for translucent hard and brittle material wafers. This method uses a laser and a diamond wire saw to act synchronously on the bottom of the translucent hard and brittle material crystal, cutting the crystal from bottom to top. It makes reasonable use of the advantages of laser cutting and wire saw cutting, achieving a perfect combination of the two. It avoids the problems of repeated polishing and re-processing that exist in the traditional top-down cutting method, and improves the efficiency of cutting translucent hard and brittle material wafers and the surface quality of the finished product. Attached Figure Description

[0057] Figure 1 This is a three-dimensional structural schematic diagram of a time-differential synchronous continuous cutting device for a translucent hard and brittle material wafer according to the present invention;

[0058] Figure 2 This is a front view of a time-differential synchronous continuous cutting device for a translucent hard and brittle material wafer according to the present invention;

[0059] Figure 3 This is a top view of a time-differential synchronous continuous cutting device for a translucent hard and brittle material wafer according to the present invention;

[0060] Figure 4 This is a three-dimensional structural diagram of the bearing rotation mechanism of the time-differential synchronous continuous cutting device for light-transmitting hard and brittle material wafers according to the present invention;

[0061] Figure 5 This is a three-dimensional structural diagram of a two-degree-of-freedom laser cutting mechanism for a time-differential synchronous continuous cutting device for light-transmitting hard and brittle material wafers according to the present invention.

[0062] Figure 6 This is a three-dimensional structural diagram of a two-degree-of-freedom diamond wire saw cutting mechanism for a time-differential synchronous continuous cutting device for light-transmitting hard and brittle material wafers according to the present invention.

[0063] Figure 7 This is a schematic diagram of the laser spiral trajectory processing path of the time-differential synchronous continuous cutting device for light-transmitting hard and brittle material wafers according to the present invention;

[0064] Figure 8 This is a schematic diagram of a time-differential synchronous continuous cutting device for light-transmitting hard and brittle material wafers according to the present invention, which is used for the time-differential synchronous processing of light-transmitting hard and brittle material crystals.

[0065] In the attached diagram:

[0066] 100. Granite base;

[0067] 200. Bearing rotation mechanism; 210. Bearing support frame; 220. First bearing roller; 230. Second bearing roller; 240. First drive assembly; 250. Second drive assembly; 300. Transparent hard and brittle material crystal;

[0068] 400. Two-degree-of-freedom laser cutting mechanism; 410. Laser assembly; 411. Laser cutting head; 412. Laser generator; 413. Laser power cord; 414. Laser power supply;

[0069] 420. Laser Z-axis moving assembly; 421. Laser Z-axis moving platform; 422. Third drive assembly; 423. First ball screw; 424. First guide post;

[0070] 430. Laser X-axis moving assembly; 431. Laser X-axis moving base; 432. Fourth drive assembly; 433. Second lead screw; 434. Laser cutting base; 435. Second guide post;

[0071] 500. Two-degree-of-freedom diamond wire saw cutting mechanism; 510. Wire cutting assembly; 511. Fifth drive assembly; 512. Wire drive wheel; 513. Wire driven wheel; 514. Diamond wire saw; 515. Tensioning wheel; 516. Telescopic rod; 520. Telescopic driven rotating assembly; 521. Driven roller; 522. Driven roller support frame; 523. Compression spring; 530. Wire cutting Z-axis movement assembly; 531. Wire cutting Z-axis movement platform; 532. Sixth drive assembly; 533. Third ball screw; 534. Third guide column; 540. Wire cutting Y-axis movement assembly; 541. Wire cutting Y-axis movement base; 542. Seventh drive assembly; 543. Fourth ball screw; 544. Wire cutting base; 545. Fourth guide column;

[0072] 600. Spiral trajectory; 610. Modified part; 620. Transparent, hard, and brittle material wafer. Detailed Implementation

[0073] Example 1:

[0074] See appendix Figure 1-8 A time-synchronous continuous cutting device for translucent hard and brittle material wafers includes: a base 100, a bearing rotation mechanism 200, a two-degree-of-freedom laser cutting mechanism 400, a two-degree-of-freedom diamond wire saw cutting mechanism 500, and an automation controller.

[0075] The base 100 is made of granite;

[0076] The bearing rotation mechanism 200 is fixed to the base 100 by bolts. The bearing rotation mechanism 200 clamps and drives the column of the light-transmitting hard and brittle material crystal 300 to be processed to rotate.

[0077] The two-degree-of-freedom laser cutting mechanism 400 includes a laser assembly 410 and a two-degree-of-freedom laser slide.

[0078] The two-degree-of-freedom diamond wire saw cutting mechanism 500 includes a wire cutting assembly 510 and a two-degree-of-freedom wire saw cutting slide.

[0079] The two-degree-of-freedom laser slide and the two-degree-of-freedom wire saw cutting slide are installed on the outer periphery of the light-transmitting hard and brittle material crystal 300 and fixed on the base 100. Under the control of the automatic controller, the two-degree-of-freedom laser slide and the two-degree-of-freedom wire saw cutting slide relative to the light-transmitting hard and brittle material crystal 300 inward, outward, upward and downward.

[0080] The laser assembly 410 is mounted on a two-degree-of-freedom laser slide, and the laser cutting head 411 is positioned above the transparent hard and brittle material crystal 300.

[0081] The wire cutting assembly 510 is mounted on a two-degree-of-freedom wire saw cutting slide, and the diamond wire saw 514 makes point contact with the lower side of the translucent hard and brittle material crystal 300.

[0082] See appendix Figure 1 and attached Figure 4 The bearing rotation mechanism 200 includes: a bearing support frame 210, a first bearing roller 220, a second bearing roller 230, a first drive assembly 240, and a second drive assembly 250;

[0083] The bearing support frame 210 is U-shaped and its bottom end is fixedly connected to the base 100. The first bearing roller 220 and the second bearing roller 230 are connected to the bearing support frame 210 on the upper and lower shafts, and are driven by the first driving component 240 and the second driving component 250, which are fixedly connected to the base 100 on the lower side of the bearing support frame 210.

[0084] The first drive assembly 240 and the second drive assembly 250 both include a DC servo motor and a coupling, and are connected to an automation controller;

[0085] The axial distance between the first bearing roller 220 and the second bearing roller 230 is smaller than the diameter of the light-transmitting hard and brittle material crystal 30 column, that is, it is located on one side of the light-transmitting hard and brittle material crystal 30 column, leaving enough processing space for the two-degree-of-freedom diamond wire saw cutting mechanism 500.

[0086] The light-transmitting hard and brittle material crystal 300 column is held and driven to rotate on one side by the first bearing roller 220 and the second bearing roller 230, and on the other side by the two driven rollers 521 of the telescopic driven rotating component 520 in the two-degree-of-freedom diamond wire saw cutting mechanism 500.

[0087] When the first bearing roller 220 and the second bearing roller 230 are working, they rotate in the same direction, causing the column of the light-transmitting hard and brittle material crystal 300 to rotate in the opposite direction.

[0088] The two-degree-of-freedom diamond wire saw cutting mechanism 500 and the two-degree-of-freedom laser cutting mechanism 400 are installed at a 90° angle relative to the light-transmitting hard and brittle material crystal 300;

[0089] The two-degree-of-freedom diamond wire saw cutting mechanism 500 includes: a wire cutting assembly 510, a telescopic driven rotation assembly 520, a wire cutting Z-axis moving assembly 530, and a wire cutting Y-axis moving assembly 540;

[0090] The wire cutting assembly 510 includes: a fifth drive assembly 511, a wire drive wheel 512, a wire driven wheel 513, a diamond wire saw 514, a tension wheel 515, and a telescopic rod 516;

[0091] The fifth drive assembly 511 includes a DC servo motor and a coupling, and the fifth drive assembly 511 is connected to the automation controller.

[0092] The wire drive wheel 512 and the wire driven wheel 513 are shafted to the front ends of the wire cutting Z-axis moving platform 531 of the wire cutting Z-axis moving assembly 530, and the rear shaft is connected to the tension wheel 515. The three are connected by a diamond wire saw 514.

[0093] The wire drive wheel 512 is driven by the fifth drive assembly 511, which drives the diamond wire saw 514 to rotate along the direction opposite to the rotation direction of the light-transmitting hard and brittle material crystal 300 via the wire driven wheel 513 and the tension wheel 515, and the cutting position of the light-transmitting hard and brittle material crystal 300 is in point contact.

[0094] The tensioning wheel 515 is axially connected to the telescopic rod 516. The telescopic rod 516 can be adjusted relative to the Z-axis moving platform 531 along the Y-axis, i.e., fixed after adjustment. The tensioning wheel 515 can be adjusted to adjust the tension of the diamond wire saw 514. The diamond wire saw 514 can be a GHN series diamond wire saw.

[0095] The wire cutting Z-axis moving platform 531 is provided with a retractable driven rotating assembly 520 at the upper front end, and a wire cutting assembly 510 is provided at the lower part of the retractable driven rotating assembly 520.

[0096] The retractable driven rotating assembly 520 includes two driven rollers 521, a driven roller support frame 522, and a compression spring 523; the driven roller support frame 522 can slide forward and backward relative to the wire cutting Z-axis moving platform 531, and a compression spring 523 is provided between the two.

[0097] The driven roller support frame 522 is provided with two sliding rods on the rear side, which are slidably connected to the sliding holes on both sides of the wire cutting Z-axis moving platform 531, and the compression spring 523 is sleeved on the sliding rods;

[0098] The driven roller support frame 522 has two driven rollers 521 symmetrically connected to its front end, which are in contact with the columnar outer wall of the light-transmitting hard and brittle material crystal 300 to achieve clamping support.

[0099] The wire cutting Z-axis moving assembly 530 includes: a wire cutting Z-axis moving platform 531, a sixth drive assembly 532, a third ball screw 533, and a third guide post 534;

[0100] The wire cutting Y-axis moving base 541 is U-shaped, with its two side connecting plates having a central shaft connected to a third ball screw 533. The third ball screw 533 is connected to a sixth drive assembly 532. The sixth drive assembly 532 is fixedly connected to the upper end of the wire cutting Y-axis moving base 541. Two axially identical third guide posts 534 are provided on both sides of the third ball screw 533, and both ends of the third guide posts 534 are fixedly connected to the wire cutting Y-axis moving base 541. The base of the wire cutting Z-axis moving platform 531 passes through the third ball screw 533 and the third guide posts 534 in sequence. Driven by the sixth drive assembly 532, the wire cutting Z-axis moving platform 531 moves along the third ball screw 533 in the Z-axis. The sixth drive assembly 532 includes a DC servo motor and a coupling, and is connected to an automation controller.

[0101] The wire cutting Y-axis moving assembly 540 includes: a wire cutting Y-axis moving base 541, a seventh drive assembly 542, a fourth ball screw 543, a wire cutting base 544, and a fourth guide post 545;

[0102] The wire cutting base 544 is U-shaped, with the central shaft of the connecting plates on both sides connected to the fourth ball screw 543. The fourth ball screw 543 is connected to the seventh drive assembly 542. The seventh drive assembly 542 is fixedly connected to one end of the wire cutting base 544. Two fourth guide posts 545 with the same axial direction are provided on both sides of the fourth ball screw 543. The two ends of the fourth guide posts 545 are fixedly connected to the wire cutting base 544. The base of the wire cutting Y-axis moving base 541 passes through the fourth guide posts 545 and the fourth ball screw 543. Under the drive of the seventh drive assembly 542, the wire cutting Y-axis moving base 541 moves along the fourth ball screw 543 in the Y direction. The seventh drive assembly 542 includes a DC servo motor and a coupling. The seventh drive assembly 542 is connected to an automation controller.

[0103] The two-degree-of-freedom laser cutting mechanism 400 includes: a laser assembly 410, a laser Z-axis moving assembly 420, and a laser X-axis moving assembly 430;

[0104] The laser assembly 410 includes: a laser cutting head 411, a laser generator 412, a laser power cord 413, and a laser power supply 414.

[0105] A laser cutting head 411 is fixed on the laser generator 412. The laser cutting head 411 is used to focus the laser beam emitted by the laser generator 412 onto the target position at the bottom of the transparent hard and brittle material crystal 300. The laser generator 412 emits a laser beam by being electrically connected to the laser power supply 414 through the laser power supply line 413. The laser generator 412 is fixedly connected to the laser Z-axis moving platform 421 of the laser Z-axis moving assembly 420.

[0106] The laser Z-axis moving component 420 includes: a laser Z-axis moving platform 421, a third driving component 422, a first ball screw 423, and a first guide post 424;

[0107] The laser X-axis moving assembly 430 includes: a laser X-axis moving base 431, a fourth driving assembly 432, a second ball screw 433, a laser cutting base 434, and a second guide post 435.

[0108] The laser X-axis moving base 431 is U-shaped, with a first ball screw 423 connected to the central axis of the connecting plates on both sides. The first ball screw 423 is connected to the third drive assembly 422, which is fixedly connected to the laser X-axis moving base 431. First guide columns 424 with the same axial direction are fixedly connected to both sides of the first ball screw 423. The base of the laser Z-axis moving platform 421 passes through the first guide columns 424 and the first ball screw 423. The third drive assembly 422 drives the first ball screw 423 to rotate, causing the laser Z-axis moving platform 421 to move. The laser Z-axis moving platform 421 moves along the Z-axis together with the laser generator 412 and the laser cutting head 411. The third drive assembly 422 includes a DC servo motor and a coupling, and is electrically connected to an automation controller.

[0109] The laser cutting base 434 is U-shaped, with a second ball screw 433 connected to the central axis of the connecting plates on both sides. The second ball screw 433 is connected to the fourth drive assembly 432. The fourth drive assembly 432 is fixedly connected to one end of the laser cutting base 434. Second guide columns 435 with the same axial direction are fixed on both sides of the second ball screw 433. The base of the laser X-axis moving base 431 passes through the second guide column 435 and the second ball screw 433. Under the drive of the fourth drive assembly 432, the laser X-axis moving base 431 drives the laser generator 412, the laser cutting head 411, and the laser Z-axis moving assembly 420 to move along the second ball screw 433 in the X-direction. The fourth drive assembly 432 includes a DC servo motor and a coupling. The fourth drive assembly 432 is electrically connected to an automation controller.

[0110] Example 2:

[0111] In some embodiments, the retractable driven rotating component 520 may not be provided on the two-degree-of-freedom diamond wire saw cutting mechanism 500. The retractable driven rotating component 520 is essentially only a support and clamping mechanism on one side of the transparent hard and brittle material crystal 300 column. A separate support and clamping mechanism with a transitional function can be provided on the opposite side of the bearing rotating mechanism 200. Then, on the outer periphery of the transparent hard and brittle material crystal 300, an arc-shaped slide rail concentric with the transparent hard and brittle material crystal 300 to be processed is provided on the base 100. It is slidably connected to the laser slide table and the wire saw cutting slide table. Under the control of the controller, they slide freely on the arc-shaped slide rail to adjust the angle between the laser slide table and the wire saw cutting slide table. A turntable is provided between the laser component 410 and the laser slide table. When the pulse energy of the laser is sufficient, in-situ time-synchronous continuous transparent hard and brittle wafer cutting can also be realized.

[0112] The automated controller system used in the time-differential synchronous continuous cutting device for light-transmitting hard and brittle material wafers of the present invention is a mature existing electronic control technology.

[0113] The method and principle of using a time-differential synchronous continuous cutting device for translucent, hard, and brittle material wafers according to the present invention are as follows:

[0114] A method for synchronous and continuous laser and diamond wire saw cutting of light-transmitting hard and brittle wafers is provided. This method uses the time-difference synchronous and continuous cutting device for light-transmitting hard and brittle material wafers described above, and includes the following steps:

[0115] 1) The first bearing roller 220 and the second bearing roller 230 of the fixed bearing rotation mechanism 200 cooperate with the driven roller 521 of the two-degree-of-freedom diamond wire saw cutting mechanism 500 to position and clamp the light-transmitting hard and brittle material crystal 300.

[0116] 2) Set the cutting trajectory of the laser cutting head 411 and the diamond wire saw 514 in the automated controller system, and calculate the time S required for the laser beam of the laser cutting head 411 to be focused on the light-transmitting hard and brittle material crystal 300 to form the modified part 610.

[0117] Wherein: the modified part 610 refers to the pulse energy after laser focusing reaching the damage threshold of the light-transmitting hard and brittle material crystal 300, causing internal modification and the generation of crack zones;

[0118] 3) The bearing rotation mechanism 200 is activated, and its two bearing rollers rotate in the same direction, driving the light-transmitting hard and brittle material crystal 300 column to rotate; subsequently, the automatic controller controls the third drive component 422 and the fourth drive component 432, and the laser Z-axis moving platform 421 moves linearly from the outside to the inside to the center of the light-transmitting hard and brittle material crystal 300 column according to the cutting trajectory. See Appendix for the trajectory. Figure 7 The spiral trajectory 600 is composed of the rotational motion of the transparent hard and brittle material crystal 300 and the linear motion of the laser, wherein the linear travel speed of the laser is 100-200 nm / s.

[0119] The laser generator 412 emits a laser beam with a wavelength of 500-600nm and a power of 4-5kw. The laser beam is focused from top to bottom by the laser cutting head 411 onto the lower end of the transparent hard and brittle material crystal 300 at the processing height.

[0120] 4) After time S, a modified part 610 is formed at the edge of the light-transmitting hard and brittle material crystal 300, accompanied by a crack area. The first drive component 240 and the second drive component 250 in the bearing rotation mechanism 200 are started, so that the light-transmitting hard and brittle material crystal 300 to be processed starts to rotate at a speed of 300 to 600 m / min.

[0121] The automation controller controls the fifth drive component 511, the sixth drive component 532, and the seventh drive component 542. The diamond wire saw 514 moves in the opposite direction to the light-transmitting hard and brittle material crystal 300. The diamond wire saw 514 moves linearly from the outside to the inside according to the set cutting trajectory, cutting point by point, and forming a spiral cutting trajectory. The cutting speed of the diamond wire saw 514 is 1000~1400m / min.

[0122] The light-transparent hard and brittle material wafer 620 is peeled off layer by layer from the light-transparent hard and brittle material crystal 300 until it falls off. The thickness of the light-transparent hard and brittle material wafer 620 is <500μm, the kerf width is <20μm, the average processing loss per wafer is <30μm, the cutting time per wafer is <35 minutes, the crystal surface roughness is <5μm, the curvature is less than 30μm, the total thickness deviation is <20μm, the damage layer depth is <20μm, and the ratio of the maximum surface crack depth to the damage layer depth is <80%.

Claims

1. A time-differential synchronous continuous cutting method for translucent, hard, and brittle material wafers, characterized in that: Includes the following steps: Step 1: The laser beam is focused on the transparent hard and brittle material crystal to be processed (300), and after a time of S, a modified part (610) is formed. Step 2: Use a diamond wire saw (514) to cut the modified part (610); Step 3: The laser beam and the diamond wire saw (514) move along the same trajectory, with a time difference of S between them; The modified part (610) refers to the part where the pulse energy after laser focusing reaches the damage threshold of the transparent hard and brittle material crystal (300), causing internal modification and the generation of crack zones. The light-transmitting hard and brittle material crystal (300) to be processed rotates, and the laser beam and diamond wire saw (514) spiral cut from the outside to the inside; The laser beam is focused from above the light-transmitting hard and brittle material crystal (300) to be processed and shines downwards; the diamond wire saw (514) cuts layer by layer from bottom to top, cutting the light-transmitting hard and brittle material crystal (300) into multiple sheet-like crystals; The laser cutting focal points are all processed along a spiral trajectory, and the modified part is reasonably laid out to guide the direction of the crack zone. The diamond wire saw operates in the opposite direction to the crystal's rotation, and the process proceeds from the outside in, ensuring that the cutting line makes point contact with the crystal of the translucent, hard, and brittle material.

2. A time-differential synchronous continuous cutting device for translucent, hard, and brittle material wafers, characterized in that: Includes a base (100), a load-bearing rotation mechanism (200), a two-degree-of-freedom laser cutting mechanism (400), a two-degree-of-freedom diamond wire saw cutting mechanism (500), and a controller; The cutting method described in claim 1 is used; The bearing rotation mechanism (200) is fixed on the base (100). The bearing rotation mechanism (200) clamps and drives the light-transmitting hard and brittle material crystal (300) column to be processed to rotate. The two-degree-of-freedom laser cutting mechanism (400) includes a laser assembly (410) and a laser slide; The two-degree-of-freedom diamond wire saw cutting mechanism (500) includes a wire cutting assembly (510) and a wire saw cutting slide. The laser slide and the wire saw cutting slide are installed on the outer periphery of the light-transmitting hard and brittle material crystal (300) to be processed and fixed on the base (100). Under the control of the controller, the two slides slide inward, outward, upward and downward relative to the light-transmitting hard and brittle material crystal (300). The laser assembly (410) is mounted on the laser slide, and the laser cutting head (411) is positioned above the transparent hard and brittle material crystal (300); The wire cutting assembly (510) is mounted on the wire saw cutting slide, and the diamond wire saw (514) makes point contact with the light-transmitting hard and brittle material crystal (300); The outer periphery of the light-transmitting hard and brittle material crystal (300) column is provided with an arc-shaped slide on the base (100) concentric with the light-transmitting hard and brittle material crystal (300), which is slidably connected to the laser slide table and the wire saw cutting slide table. Under the control of the controller, the two slide freely in the arc-shaped slide table to adjust the included angle between the laser slide table and the wire saw cutting slide table.

3. The time-differential synchronous continuous cutting device for translucent hard and brittle material wafers according to claim 2, characterized in that: The load-bearing rotation mechanism (200) includes: a load-bearing support frame (210), a first load-bearing roller (220), a second load-bearing roller (230), a first drive assembly (240), and a second drive assembly (250); The bottom end of the bearing support frame (210) is fixed to the base (100), and the first bearing roller (220) and the second bearing roller (230) are connected to the bearing support frame (210) on the upper and lower shafts. The two are driven by the first drive assembly (240) and the second drive assembly (250) fixed to the lower side of the bearing support frame (210). Both the first drive assembly (240) and the second drive assembly (250) include a DC servo motor and a coupling, and are connected to the controller; The axial distance between the first bearing roller (220) and the second bearing roller (230) is smaller than the diameter of the transparent hard and brittle material crystal (300) column; One side of the light-transmitting hard and brittle material crystal (300) column is held and driven to rotate by two bearing rollers; The two-degree-of-freedom diamond wire saw cutting mechanism (500) also includes a retractable driven rotating assembly (520), wherein the two driven rollers (521) of the retractable driven rotating assembly (520) are located on the other side of the transparent hard and brittle material crystal (300) column, clamping and supporting it.

4. A time-differential synchronous continuous cutting device for translucent hard and brittle material wafers according to claim 2 or 3, characterized in that: The two-degree-of-freedom diamond wire saw cutting mechanism (500) and the two-degree-of-freedom laser cutting mechanism (400) are installed at an angle of 90°.

5. The time-differential synchronous continuous cutting device for translucent hard and brittle material wafers according to claim 4, characterized in that: A turntable is provided between the laser assembly (410) and the laser slide.

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