Polishing equipment and method

Abstract

The invention relates to the field of wafer processing, in particular to a polishing device and method, and the polishing device comprises a polishing disc which is bonded with a polishing pad; the first mechanism is used for detecting whether bubbles exist between the polishing pad and the polishing disc or not; and the second mechanism corresponds to the first mechanism, and the second mechanism is used for eliminating bubbles between the polishing pad and the polishing disc. The technical effect of reducing the influence of the bubbles on the polishing quality is achieved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing, and in particular to a polishing device and method. Background Art

[0002] In the current semiconductor manufacturing field, chemical mechanical polishing (CMP) technology has become an indispensable part of wafer processing and manufacturing due to its excellent global and local flattening capabilities. The successful implementation of the CMP process is highly dependent on multiple key factors, among which the polishing pad is the core component, and its microstructure, physical properties and surface conditions play a decisive role in achieving ultra-precision polishing effects. However, effective bonding between the polishing pad and the polishing disc is a prerequisite for ensuring the stability and efficiency of the polishing process.

[0003] In the prior art, the bonding process of the polishing pad often faces challenges, especially when the surface of the polishing disc is not thoroughly cleaned or improper bonding technology is used, which can easily lead to the formation of bubbles between the polishing pad and the polishing disc interface; the presence of bubbles not only aggravates the abnormal wear of the polishing pad in the bubble area and shortens its service life, but may also cause the polishing pad to rupture due to uneven local pressure during the polishing process, causing production accidents; not only direct economic losses, but also precious time is spent on repairing the CMP system, which seriously interferes with the continuity and efficiency of the production line.

[0004] Therefore, the technical problem of the prior art is that the bubbles caused by the polishing pad need to be solved urgently. Summary of the invention

[0005] The present application provides a polishing device and method, which achieves the technical effect of reducing the influence of bubbles on polishing quality.

[0006] On the one hand, the present application provides a polishing device, which adopts the following technical solution: A polishing device comprises: a polishing disc, to which a polishing pad is bonded; a first mechanism, which is used to detect whether there are bubbles between the polishing pad and the polishing disc; and a second mechanism, which corresponds to the first mechanism and is used to eliminate bubbles between the polishing pad and the polishing disc.

[0007] Preferably, the first mechanism comprises: a first bracket, which is movable; a distance measuring sensor, wherein a plurality of the distance measuring sensors are connected to the first bracket, and the distance measuring sensor can measure the distance of the polishing pad along a preset direction.

[0008] Preferably, the second mechanism includes: a second bracket, which is movable; a carrier, which has a circumferential side surface that is at least partially circular, and is rotatably connected to the second bracket so that the carrier can roll on the polishing pad to compress and eliminate bubbles between the polishing pad and the polishing disk.

[0009] Preferably, the second mechanism further comprises: a fine needle, wherein a plurality of the fine needles are arranged and evenly connected to the peripheral side surface of the carrier; an end of the fine needle away from the carrier is defined as a first end, and the first end is sharply arranged so that the fine needle rolls with the carrier and penetrates into the bubbles to eliminate the bubbles.

[0010] Preferably, the carrier has a cavity inside, and the cavity is at negative pressure; the fine needle is provided with a flow channel inside, and the flow channel is connected to the cavity, so that when the fine needle pierces the bubble, the bubble can be sucked out by negative pressure.

[0011] Preferably, the end of the fine needle located inside the carrier is defined as the second end; the fine needle is movably connected to the peripheral side surface of the carrier, and the second end is located inside the carrier; so that the fine needle can be extended and retracted compared to the peripheral side surface of the carrier; the carrier comprises: a limiting member, the limiting member is connected to the inside of the carrier, the limiting member is used to limit the fine needle, a limiting space is formed between the limiting member and the inner wall of the carrier, so that the fine needle can be raised and lowered in the limiting space; a blocking member, the blocking member is located inside the carrier, the blocking member is used to cooperate with the second end of the fine needle to block the flow channel or open; and a reset member, which is located inside the carrier, connected between the fine needle and the carrier, and used to extend and reset the fine needle; the fine needle rolls with the carrier to form a first state and a second state: in the first state, the fine needle is extended, and the fine needle is not in contact with the bubble, and the second end of the fine needle is blocked by the blocking member; in the second state, the fine needle penetrates the bubble to cause the fine needle to at least partially retract, and the second end of the fine needle is separated from the blocking member to open the flow channel, so that the negative pressure in the cavity absorbs the bubble through the flow channel.

[0012] Preferably, the blocking member has a contact surface, the contact surface is used to block the flow path of the fine needle, and the contact surface and the second end are both arranged at an inclination to guide the second end to detach from or return to the contact surface.

[0013] On the other hand, the present application provides a polishing method, which adopts the following technical solution: A polishing method comprises: bonding a polishing pad to a polishing plate; and pressing the peripheral side surface of the carrier onto the polishing pad and rolling it.

[0014] Preferably, the method comprises: bonding the polishing pad to the polishing plate; applying pressure to the polishing pad and rolling the carrier so that the fine needle penetrates into the air bubble to eliminate the air bubble.

[0015] Preferably, the method comprises: adhering the polishing pad to the polishing disk; causing the carrier to apply pressure to the polishing pad and roll; causing the cavity to be under negative pressure; the fine needle forms a first state and a second state as the carrier rolls: in the first state, the fine needle extends out and does not contact the bubble, and the second end of the fine needle is blocked by the blocking member; in the second state, the fine needle penetrates the bubble so that the fine needle at least partially retracts, and the second end of the fine needle detaches from the blocking member to open the flow channel, so that the negative pressure in the cavity absorbs the bubble through the flow channel.

[0016] In summary, the present application includes at least one of the following beneficial technical effects: By detecting the bubbles between the polishing pad and the polishing disc through the first mechanism, the bubble problem can be discovered in time, providing an accurate basis for subsequent bubble elimination, thereby achieving the technical effect of reducing the influence of bubbles on the polishing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the polishing equipment described in the present application; Figure 2 is a schematic diagram of a first mechanism of the polishing device described in the present application; Figure 3 is a schematic diagram of a second mechanism of the polishing device described in the present application; Figure 4 is a schematic diagram of an embodiment of the second mechanism of the polishing device described in the present application; Figure 5 is a partial cross-sectional view of the second mechanism of the polishing device described in the present application; Figure 6 is a state schematic diagram of an embodiment of the second mechanism of the polishing device described in the present application; Figure 7 It is a state schematic diagram of another embodiment of the second mechanism of the polishing device described in the present application.

[0018] Explanation of the reference numerals: 100, polishing disc; 110, polishing pad; 120, bubble; 200, first mechanism; 210, first bracket; 220, ranging sensor; 300, second mechanism; 310, second bracket; 320, carrier; 321, cavity; 322, limit member; 3221, limit space; 323, reset member; 324, blocking member; 3241, contact surface; 330, fine needle; 331, flow channel; 332, first end; 333, second end; 334, sealing ring; 335, limit portion. DETAILED DESCRIPTION

[0019] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0020] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0021] The embodiments of the present application provide a polishing device and method, which achieve the technical effect of reducing the influence of bubbles 120 on the polishing quality.

[0022] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0023] The present application proposes a polishing device, such as Figure 1 As shown, it includes a polishing disk 100, a first mechanism 200 and a second mechanism 300. A polishing pad 110 is arranged on the polishing disk 100; the first mechanism 200 is used to detect the formation of bubbles 120 between the polishing pad 110 and the polishing disk 100; the second mechanism 300 is used to eliminate the bubbles 120 formed between the polishing pad 110 and the polishing disk 100.

[0024] like Figure 1As shown, the polishing disc 100 is used as a basic platform for polishing. The polishing disc 100 is used to carry the wafer. A polishing pad 110 is laid on the polishing disc 100. The wafer is placed on the polishing pad 110 for polishing. The thickness of the wafer is removed by rotating the polishing disc 100 and the wafer relative to each other, thereby completing the polishing of the wafer. It should be noted that the polishing pad 110 is bonded to the polishing disc 100 by glue. Since the surface of the polishing disc 100 and the polishing pad 110 are large in area, and the polishing pad 110 is soft in texture, when the polishing pad 110 is laid on the polishing disc 100, it is impossible to ensure that the polishing pad 110 and the polishing disc 100 are fully in contact, thereby causing bubbles 120 to form between the polishing disc 100 and the polishing pad 110. Once the glue solidifies, the bubbles 120 are difficult to remove. Therefore, when laying, it is necessary to promptly detect the laying of the polishing pad 110 and eliminate the bubbles 120 to avoid affecting the wafer polishing.

[0025] Therefore, during the laying process of the polishing pad 110, pores, that is, bubbles 120, are often formed between the polishing pad 110 and the polishing disk 100, thereby causing part of the polishing pad 110 to bulge. Generally, the surface of the polishing disk 100 is planar, and the polishing pad 110 laid and bonded on the polishing disk 100 is also planar. Based on the process requirements, the surface of the polishing disk 100 can also be adjusted. For example, the polishing disk 100 is concave or convex. In this way, when the polishing pad 110 is laid and bonded on the polishing disk 100, the polishing pad 110 also takes the shape of the polishing disk 100, that is, concave or convex.

[0026] like Figure 1 , 2 As shown, the first mechanism 200 is used to detect the bonding condition between the polishing disc 100 and the polishing pad 110, that is, to detect whether there are bubbles 120 between the polishing disc 100 and the polishing pad 110. The first mechanism 200 is arranged above the polishing disc 100, and is used to detect the polishing disc 100 downward after the bonding polishing pad 110 is laid. In other words, the first mechanism 200 detects the polishing pad 110 to determine whether there are bubbles 120 between the polishing pad 110 and the polishing disc 100; specifically, the first mechanism 200 includes a first bracket 210 and a distance sensor 220, and the first bracket 210 is arranged to be movable so that the position can be flexibly adjusted during the detection process, or the polishing pad 110 can be detected at different positions; a plurality of distance sensors 220 are arranged, and the plurality of distance sensors 220 are fixedly connected to the first bracket 210, and the plurality of distance sensors 220 can perform distance detection on the polishing pad 110 along a preset direction, for example, the distance detection of the polishing pad 110 is performed in a direction perpendicular to the surface of the polishing disc 100.

[0027] During the detection process, the first bracket 210 drives the distance sensor 220 to move to the top of the polishing pad 110, so that the distance sensor 220 is located at a preset height, and the distance sensor 220 starts to work: the distance sensor 220 detects the distance of the polishing pad 110, and compares the measured value with the preset value, wherein the preset value refers to the height from the distance sensor 220 to the idealized topography of the polishing pad 110 after laying (in the absence of bubbles 120); thus, if the measured value is equal to or substantially equal to the preset value, it is determined that there are no bubbles 120 between the polishing pad 110 and the polishing plate 100; if the measured value is less than the preset value, it is determined that there are bubbles 120 causing the polishing pad 110 to bulge. In order to improve the comprehensiveness of the detection of the polishing pad 110, the polishing plate 100 can be rotated, and the above detection is performed on the polishing pad 110 at different positions.

[0028] like Figure 3 As shown, the second mechanism 300 is used to eliminate the bubbles 120 between the polishing pad 110 and the polishing disk 100. The second mechanism 300 corresponds to the first mechanism 200. In other words, when the first mechanism 200 detects that there are bubbles 120 between the polishing pad 110 and the polishing disk 100, the second mechanism 300 correspondingly performs the elimination of the bubbles 120. The second mechanism 300 includes a second support 310 and a carrier 320. The second support 310 is configured to be movable so as to eliminate the bubbles 120 at different positions on the polishing pad 110. The carrier 320 has at least a peripheral side surface of a partial arc. The carrier 320 is rotatably connected to the second support 310. When the second support 310 moves, the carrier 320 can roll on the polishing pad 110. In this way, when the carrier 320 rolls, the peripheral side surface of the arc is pressed on the polishing pad 110, and the bubbles 120 between the polishing pad 110 and the polishing disk 100 are eliminated by the rolling effect.

[0029] In one embodiment, Figure 3 As shown, the carrier 320 is configured as a pressure roller, which is horizontally arranged; after the polishing pad 110 is laid on the polishing disk 100, the pressure roller is placed on the polishing pad 110, and the second bracket 310 drives the pressure roller to rotate, so that the pressure roller rolls on the polishing pad 110, and the polishing pad 110 is crushed to eliminate bubbles 120.

[0030] Further, such as Figure 4As shown, a fine needle 330 is arranged on the peripheral side surface of the carrier 320, and the fine needle 330 has a first end 332 and a second end 333, and the second end 333 is fixedly connected to the peripheral side surface of the carrier 320, and the first end 332 faces the outside of the carrier 320 and is set to be sharp; a plurality of fine needles 330 are arranged, and are evenly connected to the peripheral side surface of the carrier 320; the second bracket 310 drives the carrier 320 to roll, and during the rolling process, the fine needles 330 on the carrier 320 roll synchronously, and at the position where the bubble 120 exists on the polishing pad 110, the first part of the fine needle 330 contacts the raised polishing pad 110, and the fine needle 330 is inserted into the bubble 120, and due to the sharpness of the fine needle 330 and the pressure of the carrier 320 on the fine needle 330, the pressure inside the bubble 120 is released, thereby eliminating the bubble 120; after eliminating one bubble 120, the fine needle 330 moves to the next position as the carrier 320 continues to roll until all the bubbles 120 on the polishing pad 110 are eliminated.

[0031] The fine needle 330 pierces the bubble 120 so that the bubble 120 is automatically released. However, in some cases, due to insufficient pressure inside the bubble 120, it is very likely that the bubble 120 is not completely eliminated, and the polishing pad 110 is still partially bulged. Based on this, the present application proposes a further technical solution: Figure 5 As shown, a cavity 321 is provided inside the carrier 320, and the carrier 320 is connected to an external negative pressure source through the end rotating shaft position to keep the cavity 321 in a negative pressure state; and a flow channel 331 is provided inside the fine needle 330, and each flow channel 331 is connected to the cavity 321; in this way, when the fine needle 330 pierces the bubble 120, the negative pressure in the cavity 321 can actively absorb the bubble 120 through the flow channel 331, thereby further improving the elimination effect of the bubble 120.

[0032] On the basis of negative pressure absorption of the bubbles 120, it is further proposed that the extension and contraction of the fine needle 330 cooperate with the blocking of the flow channel 331. Figure 6 , 7As shown, the end of the fine needle 330 located inside the carrier 320 is defined as the second end 333; the fine needle 330 is movably connected to the peripheral side surface of the carrier 320, and the second end 333 is located inside the carrier 320; so that the fine needle 330 can be extended and retracted compared to the peripheral side surface of the carrier 320; the carrier 320 includes: a limiting member 322, the limiting member 322 is connected to the inside of the carrier 320, the limiting member 322 is used to limit the fine needle 330, and a limiting space 3221 is formed between the limiting member 322 and the inner wall of the carrier 320, so that the fine needle 330 can be raised and lowered in the limiting space 3221; a blocking member 324, the blocking member 324 is located inside the carrier 320, and the blocking member 324 is used to cooperate with the second end 333 of the fine needle 330 to seal the flow channel 331 Blocked or opened; and a reset member 323, the reset member 323 is located inside the carrier 320, the reset member 323 is connected between the fine needle 330 and the carrier 320, and the reset member 323 is used to extend and reset the fine needle 330; the fine needle 330 rolls with the carrier 320 to form a first state and a second state: in the first state, the fine needle 330 is extended, and the fine needle 330 is not in contact with the bubble 120, and the second end 333 of the fine needle 330 is blocked by the blocking member 324; in the second state, the fine needle 330 penetrates into the bubble 120 so that the fine needle 330 at least partially retracts, and the second end 333 of the fine needle 330 is separated from the blocking member 324 to open the flow channel 331, so that the negative pressure in the cavity 321 absorbs the bubble 120 through the flow channel 331.

[0033] Specifically, Figure 6 , 7 As shown, the fine needle 330 is movably connected to the peripheral side of the carrier 320. In other words, the fine needle 330 is retractable relative to the peripheral side of the carrier 320. The first end 332 of the fine needle 330 is located on the outside of the carrier 320, and the second end 333 of the fine needle 330 is located on the inside of the carrier 320. The fine needle 330 and the carrier 320 are hermetically sealed by an elastic sealing ring 334. Due to the presence of the sealing ring 334, the fine needle 330 can be extended and retracted and can be swung obliquely at a certain angle.

[0034] like Figure 6 , 7As shown, the limiting member 322 is used to limit the fine needle 330, so that the fine needle 330 can only be extended and retracted inside the limiting space 3221, so that when the fine needle 330 encounters the bubble 120, the fine needle 330 can overcome the elastic potential energy of the resetting member 323 and retract a certain length to the inside of the cavity 321, and due to the limitation of the limiting member 322, the fine needle 330 cannot be completely retracted, and then the bubble 120 can be successfully penetrated by the reaction force of the limiting member 322; before the bubble 120 penetrates the bubble 120, the fine needle 330 has not yet retracted, and the second end 333 of the fine needle 330 is blocked by the blocking member 324, so that the flow channel 331 is blocked, and the negative pressure cannot absorb the bubble 120 through the flow channel 331; when the fine needle 330 retracts and rises to a certain length, the fine needle 330 deflects a certain angle to make the second end 333 disengage from the blocking member 324, so that the flow channel 331 is exposed, and the flow channel 331 and the cavity 331 are connected. 21 is connected, at this time, the negative pressure can absorb the bubble 120 through the flow channel 331; as the carrier 320 rotates, the downward pressure of the fine needle 330 on the bubble 120 disappears, and the fine needle 330 is reset by the reset member 323, and extends from the original retracted state. At this time, the second end 333 is blocked by the blocking member 324 again; due to the blocking of the flow channel 331 of the fine needle 330 by the blocking member 324 in the carrier 320, the fine needle 330 originally has no absorption ability. Only when encountering the bubble 120, the bubble 120 makes the fine needle 330 push up, thereby triggering the blocking member 324 to cancel the blocking of the flow channel 331 in the fine needle 330, and the fine needle 330 has an absorption effect on the bubble 120, instead of making multiple fine needles 330 always connected to the negative pressure; if each fine needle 330 is always connected to the negative pressure, multiple fine needles 330 share the negative pressure, and the absorption effect on the bubble 120 is not good.

[0035] Based on the above, if Figure 7 As shown, when the fine needle 330 rolls with the carrier 320 and encounters the bubble 120, the pressure of the bubble 120 causes the fine needle 330 to overcome the elastic potential energy of the reset member 323 and retract a certain length to the inside of the cavity 321. In one embodiment, the reset member 323 is a spring, and a limiting portion 335 is provided on the fine needle 330. The spring is in a stretched state and is connected between the limiting portion 335 of the fine needle 330 and the inner wall of the carrier 320 to reset the fine needle 330. At this time, the second end 333 of the fine needle 330 is separated from the blocking member 324, so that the flow channel 331 is opened, and the negative pressure is sucked through the flow channel 331 to absorb the bubble 120. As the carrier 320 continues to roll, the downward pressure of the fine needle 330 on the bubble 120 disappears, and the fine needle 330 is extended and reset by the reset member 323, and the second end 333 is blocked by the blocking member 324 again.

[0036] Among them, Figure 6 , 7As shown, the blocking member 324 has a contact surface 3241, and the contact surface 3241 is used to block the flow channel 331 of the fine needle 330. The contact surface 3241 and the second end 333 are both inclined to guide the second end 333 to separate from or return to the contact surface 3241; the contact surface 3241 is in an inclined state, so that the contact surface 3241 can more smoothly guide the second end 333 of the fine needle 330 to separate from the contact surface 3241 when needed, so that the flow channel 331 is opened; when the fine needle 330 penetrates the bubble 120 and retracts due to the pressure of the bubble 120, the inclined contact surface 3241 can provide a gradually decreasing resistance, so that the second end 333 can be more The second end 333 of the fine needle 330 can be smoothly separated from the contact surface 3241, ensuring that the negative pressure can quickly absorb the bubble 120 through the flow channel 331; the inclined contact surface 3241 can also more stably guide the second end 333 of the fine needle 330 to return to the contact surface 3241 when not needed, so that the flow channel 331 is re-blocked; when the fine needle 330 completes the task of absorbing the bubble 120 and is extended and reset by the action of the reset member 323, the inclined contact surface 3241 can provide a gradually increasing guiding force to help the second end 333 return to the contact surface 3241 more accurately, ensuring that the flow channel 331 is in a blocked state again, and preparing for the next task of eliminating the bubble 120. The stability and reliability of the extension and retraction movement of the fine needle 330 are improved, and the entire process of eliminating the bubble 120 is made smoother and more efficient; through the design of the inclined contact surface 3241, the polishing device can more accurately control the extension and retraction of the fine needle 330 and the opening and blocking of the flow channel 331, thereby achieving effective elimination of the bubble 120 and improving the polishing quality and efficiency.

[0037] The present application also proposes a polishing method, comprising: The polishing pad 110 is bonded to the polishing disk 100; the peripheral side of the carrier 320 is pressed on the polishing pad 110 and rolled, and the bubbles 120 between the polishing pad 110 and the polishing disk 100 are eliminated by pressure. Specifically, after the polishing pad 110 is bonded, the carrier 320 (such as a pressure roller) is used to roll the polishing pad 110; the peripheral side of the carrier 320 should be evenly pressed on the polishing pad 110 and rolled along the rotation direction of the polishing disk 100; most of the bubbles 120 between the polishing pad 110 and the polishing disk 100 can be eliminated by the pressure and rolling action of the carrier 320.

[0038] Further, on the basis of the above, when the carrier 320 is pressed on the polishing pad 110 and rolled, the fine needles 330 will roll with the carrier 320 and penetrate into the bubbles 120 to eliminate the bubbles 120. Specifically, the fine needles 330 are evenly installed on the peripheral side of the carrier 320 to ensure that the fine needles 330 are sharp and evenly distributed; the number and length of the fine needles 330 should be adjusted according to the material and thickness of the polishing pad 110; the carrier 320 is used to roll the polishing pad 110, and the fine needles 330 roll with the carrier 320; when the fine needles 330 encounter the bubbles 120, they will penetrate into the bubbles 120, release the pressure inside the bubbles 120, and thus eliminate the bubbles 120; the rolling and penetrating actions of the fine needles 330 should be even and continuous to ensure that the bubbles 120 are completely eliminated.

[0039] Furthermore, before the carrier 320 rolls, the cavity 321 is in a negative pressure state. Then, the carrier 320 is pressed on the polishing pad 110 and rolled. During the rolling process, the fine needle 330 rolls with the carrier 320 to form a first state and a second state. In the first state, the fine needle 330 extends and does not contact the bubble 120, and the second end 333 of the fine needle 330 is blocked by the blocking member 324; in the second state, the fine needle 330 penetrates the bubble 120 so that the fine needle 330 at least partially retracts, and the second end 333 of the fine needle 330 is separated from the blocking member 324 to open the flow channel 331, and the negative pressure absorbs the bubble 120 through the flow channel 331. Specifically, A cavity 321 is provided inside the carrier 320, and is connected to an external negative pressure source through the end rotating shaft position; fine needles 330 are evenly installed on the peripheral side of the carrier 320, and it is ensured that a flow channel 331 is provided inside the fine needles 330 and communicates with the cavity 321; before the carrier 320 rolls, the external negative pressure source is first turned on to make the cavity 321 in a negative pressure state; the carrier 320 is used to roll the polishing pad 110, and the fine needles 330 roll with the carrier 320; when the fine needles 330 encounter the bubbles 120, they will penetrate into the bubbles 120; at this time, since the cavity 321 is in a negative pressure state, the fine needles 330 ... In the pressure state, negative pressure absorbs the bubble 120 through the flow channel 331; the extension and retraction of the fine needle 330 cooperates with the blocking of the flow channel 331: in the first state, the fine needle 330 extends and does not contact the bubble 120; in the second state, the fine needle 330 pierces the bubble 120 and retracts, so that the flow channel 331 is opened, and the negative pressure absorbs the bubble 120 through the flow channel 331; as the carrier 320 continues to roll, the downward pressure of the fine needle 330 on the bubble 120 disappears, the fine needle 330 is extended and reset by the reset member 323, and the flow channel 331 is blocked again.

[0040] It should be noted that the present application focuses on solving the problem of eliminating larger bubbles 120 during the polishing process. Since tiny bubbles 120 cannot be effectively eliminated by puncturing with a fine needle 330 and have little effect on the final polishing effect, the method of the present application focuses on eliminating larger bubbles 120.

[0041] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0042] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A polishing device, characterized in that: include: A polishing disc (100), wherein a polishing pad (110) is bonded to the polishing disc (100); A first mechanism (200), the first mechanism (200) being used to detect whether bubbles (120) exist between the polishing pad (110) and the polishing plate (100); as well as A second mechanism (300), the second mechanism (300) corresponds to the first mechanism (200), and the second mechanism (300) is used to eliminate bubbles (120) between the polishing pad (110) and the polishing disk (100).

2. A polishing device according to claim 1, characterized in that: The first mechanism (200) comprises: A first bracket (210), wherein the first bracket (210) is movable; A distance measuring sensor (220), wherein the distance measuring sensors (220) are multiple, and the multiple distance measuring sensors (220) are connected to the first bracket (210), and the distance measuring sensors (220) can measure the distance of the polishing pad (110) along a preset direction.

3. A polishing device according to claim 1, characterized in that: The second mechanism (300) comprises: A second bracket (310), wherein the second bracket (310) is movable; A carrier (320), the carrier (320) having at least a partially arcuate circumferential side surface, the carrier (320) being rotatably connected to the second bracket (310), so that the carrier (320) can roll on the polishing pad (110) so that bubbles (120) between the polishing pad (110) and the polishing disk (100) are compressed and eliminated.

4. A polishing device according to claim 3, characterized in that: The second mechanism (300) further comprises: A plurality of fine needles (330) are provided and are evenly connected to the peripheral side surface of the carrier (320); an end of the fine needle (330) away from the carrier (320) is defined as a first end (332), and the first end (332) is sharp, so that the fine needle (330) rolls with the carrier (320) and penetrates into the air bubble (120) to eliminate the air bubble (120).

5. A polishing device according to claim 4, characterized in that: The carrier (320) has a cavity (321) inside, and the cavity (321) is at a negative pressure; A flow channel (331) is provided inside the fine needle (330), and the flow channel (331) is in communication with the cavity (321), so that when the fine needle (330) pierces the bubble (120), the bubble (120) can be sucked out by negative pressure.

6. A polishing device according to claim 5, characterized in that: The end of the fine needle (330) located inside the carrier (320) is defined as the second end (333); the fine needle (330) is movably connected to the peripheral side surface of the carrier (320), and the second end (333) is located inside the carrier (320); so that the fine needle (330) can be extended and retracted compared to the peripheral side surface of the carrier (320); The carrier (320) comprises: a limiting member (322), the limiting member (322) being connected to the inside of the carrier (320), the limiting member (322) being used to limit the position of the fine needle (330), a limiting space (3221) being formed between the limiting member (322) and the inner wall of the carrier (320), so that the fine needle (330) can be raised and lowered in the limiting space (3221); a blocking member (324), the blocking member (324) being located inside the carrier (320), the blocking member (324) being used to cooperate with the second end (333) of the fine needle (330) to block or open the flow channel (331); and a resetting member (323), the resetting member (323) being located inside the carrier (320), the resetting member (323) being connected between the fine needle (330) and the carrier (320), and the resetting member (323) being used to extend and reposition the fine needle (330); The fine needle (330) forms a first state and a second state as the carrier (320) rolls: In a first state, the fine needle (330) is extended, the fine needle (330) is not in contact with the bubble (120), and the second end (333) of the fine needle (330) is blocked by the blocking member (324); In the second state, the fine needle (330) penetrates the bubble (120) so that the fine needle (330) at least partially retracts, and the second end (333) of the fine needle (330) is separated from the blocking member (324) so ​​that the flow channel (331) is opened, so that the negative pressure in the cavity (321) absorbs the bubble (120) through the flow channel (331).

7. A polishing device according to claim 6, characterized in that: The blocking member (324) has a contact surface (3241) for blocking the flow channel (331) of the fine needle (330); the contact surface (3241) and the second end (333) are both arranged at an angle to guide the second end (333) to detach from or return to the contact surface (3241).

8. A polishing method according to claim 3, characterized in that: include: Adhere the polishing pad (110) to the polishing plate (100); The peripheral side surface of the carrier (320) is pressed onto the polishing pad (110) and rolled.

9. A polishing method according to any one of claims 4 to 7, characterized in that: include: Adhere the polishing pad (110) to the polishing plate (100); The carrier (320) is pressed onto the polishing pad (110) and rolled, so that the fine needle (330) penetrates into the air bubble (120) to eliminate the air bubble (120).

10. A polishing method according to claim 6 or 7, characterized in that: include: The polishing pad (110) is bonded to the polishing plate (100); the carrier (320) is pressed onto the polishing pad (110) and rolled; causing the cavity (321) to have a negative pressure; The fine needle (330) rolls with the carrier (320) to form a first state and a second state: In a first state, the fine needle (330) is extended, the fine needle (330) is not in contact with the bubble (120), and the second end (333) of the fine needle (330) is blocked by the blocking member (324); In the second state, the fine needle (330) penetrates the bubble (120) so that the fine needle (330) at least partially retracts, and the second end (333) of the fine needle (330) is separated from the blocking member (324) so ​​that the flow channel (331) is opened, so that the negative pressure in the cavity (321) absorbs the bubble (120) through the flow channel (331).

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